Wafer transportation monitor, transportation box and packaging box

Abstract

The invention relates to the technical field of wafer transportation, and discloses a wafer transportation monitor, a transportation box and a packaging box, the wafer transportation monitor comprises a charging management unit, a battery, a control unit, a wireless communication unit, a temperature and humidity sensor and a motion attitude sensor; in actual use, the wafer transportation monitor detects temperature and humidity information and position state information of wafers through the temperature and humidity sensor and the motion attitude sensor, and the wafer detection information can be sent to a terminal through the wireless communication unit. Therefore, whether dangerous situations such as large-amplitude vibration, bumping and overturning occur in the wafer transportation process or not can be judged, the safety and controllability in the wafer transportation process are improved, and the wafer state of the whole transportation process can be monitored and traced; in addition, due to the fact that the wafer transportation monitor can carry out wireless communication, unified real-time monitoring and management can be carried out on the operation conditions of a plurality of wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer transportation, and in particular to a wafer transportation monitor, a transportation box and a packaging box. Background Art

[0002] As the core technology of the modern electronics industry, semiconductor wafers have a wide range of application scenarios. They not only support the foundation of traditional electronic devices such as microprocessors and controllers, memory, logic chips, analog and power semiconductors, sensors and optoelectronic devices, but also play a key role in emerging technology fields such as quantum computing, flexible electronics and wearable devices, the Internet of Things, and autonomous driving technology.

[0003] With the continuous development of semiconductor wafer technology, the price of single wafers is also increasing, so the requirements for safety, controllability and traceability during wafer transportation are becoming higher and higher. The traditional wafer transport box used in the wafer output process only uses humidity cards to monitor humidity. For example, the wafer transport box and temperature and humidity indicator assembly disclosed in the patent with authorization publication number CN201570494U only uses temperature and humidity indicators to detect temperature and humidity.

[0004] However, during the transportation process, vibrations and bumps caused by road conditions, handling and transmission may cause wafer breakage, and traditional wafer transport boxes cannot avoid, monitor and trace these risks. That is, they cannot monitor whether the wafer transport boxes produce large vibrations, bumps, flipping and other dangerous situations during transportation, nor can they monitor and evaluate the temperature and humidity of the transportation environment in real time. The humidity card alone can only indicate the overall environmental conditions after the transportation is completed. It cannot trace the environmental information and transportation conditions during the transportation process, and cannot uniformly monitor and manage the transportation conditions of multiple wafer transport boxes in real time. Summary of the invention

[0005] In view of the shortcomings of the background technology, the present invention provides a wafer transport monitor, a transport box and a packaging box. The technical problem to be solved is that the traditional wafer transport box only uses a humidity card to monitor the humidity, and cannot avoid, monitor and trace the wafer breakage caused by vibrations and bumps in the road conditions, handling and transmission during the transportation process.

[0006] To solve the above technical problems, in a first aspect, the present invention provides the following technical solutions: a wafer transport monitor, comprising a charging management unit, a battery, a control unit, a wireless communication unit, a temperature and humidity sensor, and a motion posture sensor;

[0007] The charging management unit is electrically connected to the battery, and the battery is electrically connected to the control unit, the wireless communication unit, the temperature and humidity sensor, and the motion posture sensor, respectively, to provide operating voltage for the control unit, the wireless communication unit, the temperature and humidity sensor, and the motion posture sensor;

[0008] The control unit is electrically connected to the wireless communication unit, the temperature and humidity sensor, and the motion posture sensor, respectively, performs temperature and humidity detection through the temperature and humidity sensor, detects position status information through the motion posture sensor, and sends the detected temperature and humidity information and position status information to the terminal through the wireless communication unit.

[0009] In a certain implementation of the first aspect, the terminal is a cloud server, and the cloud server records and processes the temperature and humidity information and the location status information after receiving the temperature and humidity information and the location status information.

[0010] In a certain embodiment of the first aspect, the charging management unit includes a charging chip U5 of model TP4054, pin 1 of the charging chip U5 is electrically connected to the cathode of the light-emitting diode D5, the anode of the light-emitting diode D5 is electrically connected to one end of the resistor R5, the other end of the resistor R5 is respectively electrically connected to one end of the resistor R7 and one end of the transient suppression diode D1, for inputting a power supply voltage +5V_IN, the other end of the resistor R7 is electrically connected to pin 4 of the charging chip U5, pin 5 of the charging chip U5 is grounded through resistor R6, pin 2 of the charging chip U5 is electrically connected to the other end of the transient suppression diode D1, and is grounded, and pin 3 of the charging chip U5 is used to provide a charging voltage to the battery, and is respectively grounded through capacitors C19 and C20.

[0011] In a certain embodiment of the first aspect, the temperature and humidity sensor includes a detection chip U8 with model SHT_30, pins 1 and 4 of the detection chip U8 are electrically connected to the control unit, pin 2 of the detection chip U8 is grounded, pins 7, 8 and 9 of the detection chip U8 are all electrically connected to one end of capacitor C14 and grounded, and pins 5 and 6 of the detection chip U8 are respectively electrically connected to the other end of capacitor C14 for inputting a working voltage.

[0012] In certain implementation manner of the first aspect, a model of the motion posture sensor is MPU6050.

[0013] In a certain embodiment of the first aspect, the present invention also includes a TYPE_C interface unit, the control unit is electrically connected to the TYPE_C interface unit, and the TYPE_C interface unit A4 pin is electrically connected to the charging management unit for providing a power supply voltage +5V_IN to the charging management unit.

[0014] In certain implementations of the first aspect, the control unit includes a single-chip microcomputer of model ESP32-C3-MINI-1U.

[0015] In a certain implementation manner of the first aspect, the present invention further includes a reset unit and a BOOT unit, and the control unit is electrically connected to the reset unit and the BOOT unit, respectively.

[0016] In a second aspect, the present invention further provides a transport box, including a transport box body, a top of the transport box body is provided with an installation cavity, and the above-mentioned wafer transport monitor is provided in the installation cavity.

[0017] In a third aspect, the present invention further provides a packaging box, comprising a packaging box body, wherein the packaging box body is provided with the above-mentioned transport box, and a buffer layer is provided between a side wall of the transport box and a side wall of the packaging box body.

[0018] Compared with the prior art, the present invention has the following beneficial effects: in actual use, the wafer transport monitor of the present invention detects the temperature and humidity information and position status information of the wafer through the temperature and humidity sensors and the motion posture sensors, and the wafer detection information can be sent to the terminal through the wireless communication unit, so as to judge whether the wafer produces large-scale vibration, bumps, flipping and other dangerous situations during transportation, thereby improving the safety and controllability of the wafer transportation process, and can monitor and trace the wafer status of the entire transportation process; in addition, since the wafer transport monitor can perform wireless communication, the operation status of multiple wafers can be uniformly monitored and managed in real time. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the present invention in an embodiment;

[0020] Figure 2 is a circuit diagram of a control unit in an embodiment;

[0021] Figure 3 is a circuit diagram of a reset unit and a BOOT unit in an embodiment;

[0022] Figure 4 is a circuit diagram of a TYPE_C interface unit in an embodiment;

[0023] Figure 5 is a circuit diagram of a charging management unit in an embodiment;

[0024] Figure 6 is a circuit diagram of a temperature and humidity inspection unit in an embodiment;

[0025] Figure 7 It is a schematic diagram of the structure of the transport box in the packaging box in the embodiment. DETAILED DESCRIPTION

[0026] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0027] Embodiment 1

[0028] like Figure 1 As shown, a wafer transport monitor includes a charging management unit 1, a battery 2, a control unit 3, a wireless communication unit 6, a temperature and humidity sensor 4, and a motion posture sensor 5;

[0029] The charging management unit 1 is electrically connected to the battery 2 to charge the battery 2 and realize the recycling of the battery 2. The battery 2 is electrically connected to the control unit 3, the wireless communication unit 6, the temperature and humidity sensor 4 and the motion posture sensor 5 to provide working voltage for the control unit 3, the wireless communication unit 6, the temperature and humidity sensor 4 and the motion posture sensor 5.

[0030] The control unit 3 is electrically connected to the wireless communication unit 6, the temperature and humidity sensor 4 and the motion posture sensor 5 respectively, performs temperature and humidity detection through the temperature and humidity sensor 4, detects position status information through the motion posture sensor 5, and sends the detected temperature and humidity information and position status information to the terminal through the wireless communication unit 6.

[0031] In actual use, the wafer transport monitor in this embodiment detects the temperature and humidity information and position status information of the wafer through the temperature and humidity sensor 4 and the motion posture sensor 5, and can send these wafer detection information to the terminal through the wireless communication unit 6, so as to determine whether the wafer produces large-scale vibration, bumps, flipping and other dangerous situations during transportation, thereby improving the safety and controllability of the wafer transportation process, and can monitor and trace the wafer status of the entire transportation process; in addition, since the wafer transport monitor can perform wireless communication, it can uniformly monitor and manage the transportation status of multiple wafers in real time.

[0032] Specifically, in this embodiment, the position state information detected by the motion attitude sensor 5 includes the angle, attitude and acceleration of the current wafer box; wherein the model of the motion attitude sensor 5 is MPU6050, which is a 6-axis attitude sensor (3-axis accelerometer and 3-axis gyroscope sensor), which can measure the acceleration and angle parameters of the chip's own X, Y, and Z axes, and obtain the attitude angle through data fusion. The full-scale range of the accelerometer is selected as: ±2, ±4, ±8, +16 (g), where g represents the acceleration of gravity. The full-scale range of the gyroscope is selected as: ±250, +500, +1000, +2000 (° / sec), which represents how many degrees it rotates per second.

[0033] In some implementations, other types of motion posture sensors 5 may also be selected, as long as the motion posture sensor 5 can detect the angle, posture, and acceleration information of the wafer box.

[0034] Specifically, in this embodiment, the terminal is a cloud server, and the cloud server records and processes the temperature and humidity information and the position status information after receiving the temperature and humidity information and the position status information. In addition, the cloud server can also issue adjustment instructions to the transport personnel based on the received information, so as to timely adjust the position of the wafer during transportation to prevent the wafer from being damaged.

[0035] Specifically, in this embodiment, Figure 2 As shown, the control unit 3 includes a single-chip microcomputer U4 of model ESP32-C3-MINI-1U. The single-chip microcomputer U4 is equipped with a RISC-V 32-bit single-core processor with a clock frequency of up to 160MHz, 22 programmable GPIO pins, built-in 400KB SRAM, and rich communication interfaces. In addition, the single-chip microcomputer U4 also integrates 2.4GHz Wi-Fi, which helps to build IoT devices with wider coverage and stronger RF performance, and can still maintain excellent RF performance at higher operating temperatures.

[0036] In actual use, the single-chip microcomputer U4 can be used to interact and analyze data with the temperature and humidity sensor 4 and the motion posture sensor 5, and upload the data to the cloud server via WiFi. It should also be noted that the single-chip microcomputer U4 selected in this embodiment is integrated with a wireless communication unit 6.

[0037] for Figure 2 In the circuit shown, the GPIO6 and GPIO7 pins of the microcontroller U4 are used for I2C communication. The two pins of the I2C bus can be pulled to a high level when idle through resistors R21 and R22; capacitors C6 and C7 are two filter capacitors of the power port of the microcontroller U4; TVS diodes D2 and TVS diodes D2 are used to protect the microcontroller U4 from ESD static electricity and surges caused by the TYPC-C interface unit 7.

[0038] Specifically, in this embodiment, Figure 1 As shown, the present invention further includes a reset unit 9 and a BOOT unit 8, and the control unit 3 is electrically connected to the reset unit 9 and the BOOT unit 8 respectively. The specific circuits of the reset unit 9 and the BOOT unit 8 are as follows Figure 3 shown.

[0039] Specifically, in this embodiment, Figure 1As shown, the present invention further includes a TYPE_C interface unit 7, the control unit 3 is electrically connected to the TYPE_C interface unit 7, and the A4 pin of the TYPE_C interface unit 7 is electrically connected to the charging management unit 1, for providing a power supply voltage +5V_IN for the charging management unit 1. The circuit of the TYPE_C interface unit 7 is as shown in FIG. Figure 4 shown.

[0040] In actual use, the TYPE_C interface unit 7 can provide the control unit 3 with a program download interface and a program debugging interface.

[0041] Specifically, in this embodiment, the circuit of the charging management unit 1 is as follows: Figure 5 As shown, it includes a charging chip U5 of model TP4054, wherein pin 1 of the charging chip U5 is electrically connected to the cathode of the light emitting diode LED5, the anode of the light emitting diode LED5 is electrically connected to one end of a resistor R5, the other end of the resistor R5 is electrically connected to one end of a resistor R7 and one end of a transient suppression diode D1, respectively, for inputting a power supply voltage +5V_IN, the other end of the resistor R7 is electrically connected to pin 4 of the charging chip U5, pin 5 of the charging chip U5 is grounded through a resistor R6, pin 2 of the charging chip U5 is electrically connected to the other end of the transient suppression diode D1, and is grounded, and pin 3 of the charging chip U5 is used to provide a charging voltage to the battery, and is grounded through capacitors C19 and C20, respectively.

[0042] Specifically, in this embodiment, battery 2 is a lithium battery. Since lithium batteries can be reused, the wafer transport monitor can be reused; for the charging chip U5, the PROG pin is used to set the charging current of the lithium battery, the CHRG pin is used to indicate the current charging state, the BAT pin is used to connect the positive electrode of the lithium battery, and the GND pin is used to connect the negative electrode of the lithium battery; the resistor R7 is a current limiting resistor used to limit the size of the charging current flowing through the VCC pin, the resistor R6 is used to set the charging current, the capacitor C19 and the capacitor C20 are the filter capacitors of the lithium battery, and the light-emitting diode LED5 is used to at least the current charging state, which lights up during charging and goes out after charging is completed. In addition, a battery filter capacitor can be set between the positive and negative electrodes of the lithium battery.

[0043] Specifically, in this embodiment, the circuit of the temperature and humidity sensor is as follows: Figure 6 As shown, it includes a detection chip U8 of model SHT_30, the temperature measurement range of the detection chip U8 is -40°C to +125°C, the temperature measurement accuracy is ±0.3°C, the humidity measurement range is 0 to 100%RH, and the humidity measurement accuracy is ±3%RH;

[0044] Pin 1 and pin 4 of the detection chip U8 are electrically connected to the control unit 3, pin 2 of the detection chip U8 is grounded, pins 7, 8 and 9 of the detection chip U8 are all electrically connected to one end of the capacitor C14 and grounded, and pins 5 and 6 of the detection chip U8 are respectively electrically connected to the other end of the capacitor C14 for inputting the working voltage.

[0045] for Figure 6 Circuit, VDD pin is used to power the detection chip U8, SDA pin and SCL pin are IIC interfaces for communication, used to communicate with the microcontroller U4, and interact with the temperature and humidity information of the detection chip U8 itself. ADDR pin is the address selection pin. When ADDR pin is connected to high level, the 7-bit address of the slave is 0x44, and when ADDR is connected to low level, the 7-bit address of the slave is 0x45. ALERT pin is the alarm pin. When the temperature and humidity exceed the set threshold, the pin will output an alarm signal. nRESET is the reset signal, which is valid at low level. Capacitor C14 is a filter capacitor used to filter the detection chip U8.

[0046] In summary, the control unit 3 in this embodiment can detect whether the wafer produces large-scale vibration, bumps, flipping and other dangerous situations during transportation through the motion posture sensor 5, and can monitor and trace the wafer status of the entire transportation process; the control unit 3 can accurately and real-time monitor and evaluate the temperature and humidity of the transportation environment through the temperature and humidity sensor 4 to ensure that the transportation environment conditions are stable and reliable; the control unit 3 can transmit information to the cloud server through its own WiFi, and through WiFi networking, it can uniformly monitor and manage the transportation status of multiple wafer transport boxes in real time; the charging management unit 1 can better manage and protect the lithium battery, and at the same time can play a good charging and discharging protection function.

[0047] Embodiment 2

[0048] like Figure 7 As shown, this embodiment provides a transport box, including a transport box body 10 , a mounting cavity 100 is provided on the top of the transport box body 10 , and the wafer transport monitor in the first embodiment is provided in the mounting cavity 100 .

[0049] Embodiment 3

[0050] like Figure 7 As shown, this embodiment provides a packaging box, including a packaging box body 11 , in which a transport box in the second embodiment is arranged, and a buffer layer 12 is arranged between the side wall of the transport box and the side wall of the packaging box body 11 .

[0051] The above is based on the present invention as an inspiration. Through the above description, relevant staff can make various changes and modifications without departing from the technical idea of ​​this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer transport monitor, It is characterized in that It includes a charging management unit, a battery, a control unit, a wireless communication unit, a temperature and humidity sensor, and a motion posture sensor; The charging management unit is electrically connected to the battery, and the battery is electrically connected to the control unit, the wireless communication unit, the temperature and humidity sensor, and the motion posture sensor, respectively, to provide operating voltage for the control unit, the wireless communication unit, the temperature and humidity sensor, and the motion posture sensor; The control unit is electrically connected to the wireless communication unit, the temperature and humidity sensor, and the motion posture sensor, respectively, performs temperature and humidity detection through the temperature and humidity sensor, detects the position status information of the wafer through the motion posture sensor, and sends the detected temperature and humidity information and position status information to the terminal through the wireless communication unit.

2. A wafer transport monitor according to claim 1, It is characterized in that The terminal is a cloud server, and the cloud server records and processes the temperature and humidity information and the position status information after receiving the temperature and humidity information and the position status information.

3. A wafer transport monitor according to claim 1, It is characterized in that The charging management unit includes a charging chip U5 of model TP4054, wherein pin No. 1 of the charging chip U5 is electrically connected to the cathode of the light-emitting diode D5, the anode of the light-emitting diode D5 is electrically connected to one end of the resistor R5, the other end of the resistor R5 is electrically connected to one end of the resistor R7 and one end of the transient suppression diode D1, respectively, for inputting a power supply voltage +5V_IN, the other end of the resistor R7 is electrically connected to pin No. 4 of the charging chip U5, pin No. 5 of the charging chip U5 is grounded through resistor R6, pin No. 2 of the charging chip U5 is electrically connected to the other end of the transient suppression diode D1, and is grounded, and pin No. 3 of the charging chip U5 is used to provide a charging voltage to the battery, and is grounded through capacitors C19 and C20, respectively.

4. The wafer transport monitor according to claim 1, It is characterized in that The temperature and humidity sensor includes a detection chip U8 of model SHT_30, pins 1 and 4 of the detection chip U8 are electrically connected to the control unit, pin 2 of the detection chip U8 is grounded, pins 7, 8 and 9 of the detection chip U8 are all electrically connected to one end of capacitor C14 and grounded, and pins 5 and 6 of the detection chip U8 are respectively electrically connected to the other end of capacitor C14 for inputting a working voltage.

5. The wafer transport monitor according to claim 1, It is characterized in that The model of the motion posture sensor is MPU6050.

6. The wafer transport monitor according to claim 1, It is characterized in that It also includes a TYPE_C interface unit, the control unit is electrically connected to the TYPE_C interface unit, and the A4 pin of the TYPE_C interface unit is electrically connected to the charging management unit for providing a power supply voltage +5V_IN for the charging management unit.

7. The wafer transport monitor according to claim 1, It is characterized in that The control unit includes a single chip microcomputer of model ESP32-C3-MINI-1U.

8. The wafer transport monitor according to claim 1, It is characterized in that It also includes a reset unit and a BOOT unit, and the control unit is electrically connected to the reset unit and the BOOT unit respectively.

9. A transport box, It is characterized in that It comprises a transport box body, a top of which is provided with an installation cavity, in which the wafer transport monitor according to any one of claims 1-8 is arranged.

10. A packaging box, It is characterized in that It comprises a packaging box body, in which a transport box according to claim 9 is arranged, and a buffer layer is arranged between a side wall of the transport box and a side wall of the packaging box body.

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