Flower basket structure for placing silicon wafers
By designing a flower basket structure with a moving mechanism and anti-residue function, the problems of electrolyte waste and pollution during silicon wafer electroplating are solved, and efficient and uniform electroplating effect is achieved, improving electroplating accuracy and cost-effectiveness.
Patent Information
- Application Number
- CN202411669507.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2024-12-20
AI Technical Summary
Prior Art During the electroplating of silicon wafers, the conductive flower basket structure is electroplating, resulting in waste and contamination of the electrolyte, and a water droplet-like electroplating layer appears on the surface of the electroplating silicon wafer, reducing the electroplating accuracy.
A flower basket structure including main body plate, moving mechanism, conductive clamping mechanism and anti-residue mechanism is designed. The limiting body movement and electric telescopic rod are driven by a motor to press and fix the silicon wafer to ensure that the silicon wafer enters electrolysis only in the required area. The liquid is electroplating, and the electrolyte residue is removed by using an air pump and an ultrasonic detector to prevent uneven electroplating layer.
It effectively prevents the flower basket structure from contacting the electrolyte, reduces the cost and waste of electroplating, and improves the uniformity and accuracy of electroplating, ensures no residual liquid on the surface of the silicon wafer, and improves the accuracy after electroplating.
Smart Images
Figure CN119162638A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of silicon wafer production, and in particular to a flower basket structure for placing silicon wafers. Background Art
[0002] The sliding shaft conductive clamping basket is a type of basket, a mechanical structure used for high-frequency or microwave signal transmission, usually used in RF connectors or related high-frequency equipment. Its main design purpose is to ensure conductivity and mechanical stability, and to achieve good electrical contact when clamped. Silicon wafer electroplating is an electrochemical process that deposits a metal layer on the surface of a silicon wafer. It is commonly used in semiconductor manufacturing, solar cells, and micro-electromechanical systems (MEMS) and other fields. The main purpose of silicon wafer electroplating is to enhance the conductivity, solderability, and corrosion resistance of silicon wafers. In the prior art, when electroplating silicon wafers, the area in the center of the silicon wafer that does not need to be electroplated is generally fixed by a conductive clamping basket structure, and then the entire device is placed in the electrolyte.
[0003] When electroplating silicon wafers with the prior art, the entire device needs to be placed in an electrolyte, and the surface of the conductive basket structure will also be electroplated, resulting in a large waste of electrolyte. After the prior device completes electroplating of the silicon wafer, the electrolyte will adhere to the surface of the silicon wafer during the process of lifting the silicon wafer, causing a water droplet-shaped electroplating layer to appear on the surface of the electroplated silicon wafer, thereby reducing the precision of the silicon wafer after electroplating. Summary of the invention
[0004] The purpose of the present invention is to solve the shortcomings of the background technology and to propose a flower basket structure for placing silicon wafers.
[0005] To achieve the above purpose, the technical solution adopted by the present invention is: a basket structure for placing silicon wafers, comprising a main body plate, a side of the main body plate is provided with a moving mechanism for clamping the silicon wafer, the moving mechanism comprises a motor fixedly arranged on the side of the main body plate, a third empty slot is opened at the lower end of the main body plate, a plurality of limit bodies are slidably arranged in the third empty slot, a plurality of the lower ends of the limit bodies are provided with a conductive clamping mechanism for conductive clamping and detection, the conductive clamping mechanism comprises a plurality of first electric telescopic rods respectively fixedly arranged at the lower ends of the limit bodies, the telescopic ends of the plurality of the first electric telescopic rods are respectively fixedly connected with the first fixed bodies, and the sides of the plurality of the first fixed bodies are provided with an anti-residue mechanism for blowing away the electrolyte on the surface of the silicon wafer.
[0006] Preferably, the transmission shaft end of the motor is fixedly connected with a rotating rod in the third empty groove, and a plurality of fixing rings corresponding to the position of the limiting body are arranged on the side of the rotating rod, and four circumferentially arranged first placement grooves are respectively opened on the inner sides of a plurality of the fixing rings, and a fourth electric telescopic rod is respectively fixedly connected to a plurality of the first placement grooves, and an anti-slip plate is respectively fixedly connected to the telescopic ends of a plurality of the fourth electric telescopic rods.
[0007] Preferably, the side surfaces of several of the limiting bodies are symmetrically provided with second placement grooves, several of the second placement grooves are respectively fixedly connected with fifth electric telescopic rods, the telescopic ends of several of the fifth electric telescopic rods are respectively fixedly connected with anti-sliding blocks, and the side surfaces of several of the limiting bodies are penetrated with threaded holes, and the threaded holes are arranged in conjunction with the side surfaces of the fixing rings through threads.
[0008] Preferably, mounting holes are respectively opened on the sides of several of the first fixed bodies, insulating rings are respectively rotatably connected in several of the mounting holes, first fixing rods are respectively fixedly connected on the inner sides of several of the insulating rings, second limiting grooves are respectively opened on both ends of several of the first fixing rods, second springs are respectively fixedly connected in several of the second limiting grooves, first moving rods are respectively fixedly connected at the ends of several of the second springs, fourth fixed bodies are respectively fixedly connected at the ends of the first moving rods, and a first empty groove is opened on one side of the main plate.
[0009] Preferably, the main body plate is fixedly connected to a second electric telescopic rod at a position close to the first empty slot, the telescopic end of the second electric telescopic rod is fixedly connected to a second fixed body, a first limiting groove is provided on the side of the second fixed body, a first spring is fixedly connected in the first limiting groove, the end of the first spring is fixedly connected to the second moving rod, the end of the second moving rod is fixedly connected to a pressure sensor, the end of the pressure sensor is fixedly connected to a third spring, the end of the third spring is fixedly connected to a first conductor, and the end of the first conductor is fixedly connected to a conductive protrusion.
[0010] Preferably, the main body plate is provided with a second slot on the side away from the first slot, a third electric telescopic rod is fixedly connected in the second slot, the telescopic end of the third electric telescopic rod is fixedly connected to a motor, the transmission shaft end of the motor is fixedly connected to a connecting rod, and the end of the connecting rod is fixedly connected to the end of the first moving rod.
[0011] Preferably, a plurality of ultrasonic detectors are fixedly connected to the side surfaces of a plurality of the first fixed bodies respectively.
[0012] Preferably, several through holes are opened on the upper end surfaces of several of the limiting bodies, several air outlet holes inclined downward are opened on the side surfaces of several of the limiting bodies, several of the air outlet holes are communicated with the through holes, an air pump is fixedly connected to the upper end of the main body plate, a cavity communicated with the through hole is opened inside the upper end surface of the main body plate, and the cavity is communicated with the air pump.
[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The motor drives the rotating rod to rotate, and then the rotating rod cooperates to drive several limiting bodies to move in the same direction. At the same time, the fourth electric telescopic rods squeezed by each other shrink in turn to ensure that after the several limiting bodies move, the distance between the two adjacent first moving rods is the same, so that the device can squeeze and fix several silicon wafers at the same time, thereby improving the electroplating efficiency of the device. Then, the first electric telescopic rod, the second electric telescopic rod and the third electric telescopic rod are extended at the same time, so that the area of the silicon wafer that needs to be electroplated enters the electrolyte, and then the motor is started, and the motor drives the connecting rod to rotate. At the same time, since several first moving rods are tightly squeezed together through the silicon wafer, when the connecting rod drives a first fixed rod to rotate, several first fixed rods rotate at the same time, thereby driving the silicon wafer to rotate, so that the surface of the silicon wafer enters the electrolyte in turn for electroplating, thereby improving the uniformity of electroplating. During electroplating, the device does not contact the electrolyte, which can prevent the device from wasting and polluting the electrolyte, thereby reducing the cost of electroplating; 2. The first electric telescopic rod, the second electric telescopic rod and the third electric telescopic rod are contracted at the same time, driving the silicon wafer to leave the electrolyte. At the same time, the air pump is started, and the air pump drives the gas to move into the cavity. The gas in the cavity is ejected from the air outlet through a number of through holes, and the residual liquid on the surface of the silicon wafer is sprayed away by the gas to prevent the electrolyte from adhering to the surface of the silicon wafer and continuing to electroplate, thereby improving the accuracy of electroplating. At the same time, a number of ultrasonic detectors are started to detect the thickness of the electroplating on the surface of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 The present invention is a sectional view of the whole Figure 1 ; Figure 3 The present invention is a sectional view of the whole Figure 2 ; Figure 4 It is a partial structural schematic diagram of the present invention; Figure 5 For the present invention Figure 2 A magnified image of point A; Figure 6 For the present invention Figure 2 A magnified view of point B; Figure 7 For the present invention Figure 2Enlarged view of point C; Figure 8 For the present invention Figure 3 Enlarged view of point D.
[0015] 1. Main body plate; 2. Conductive clamping mechanism; 3. Anti-residue mechanism; 4. Moving mechanism; 21. First electric telescopic rod; 22. First fixed body; 23. Insulating ring; 24. Mounting hole; 25. First fixed rod; 26. Ultrasonic detector; 27. First moving rod; 28. First empty slot; 29. Second electric telescopic rod; 210. Second fixed body; 211. First limiting slot; 212. First spring; 214. Second spring; 215. Second limiting slot; 216. Fourth fixed body; 217. Second moving rod; 218. Pressure sensor; 219, third spring; 220, first conductor; 221, conductive protrusion; 222, second slot; 223, third electric telescopic rod; 224, motor; 225, connecting rod; 31, air pump; 32, cavity; 33, air outlet; 34, through hole; 41, third slot; 42, rotating rod; 43, motor; 44, anti-sliding block; 45, limiting body; 46, threaded hole; 47, fixing ring; 48, first placement slot; 49, fourth electric telescopic rod; 410, anti-sliding plate; 411, second placement slot; 412, fifth electric telescopic rod. DETAILED DESCRIPTION
[0016] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.
[0017] See also Figure 1-Figure 8 A flower basket structure for placing silicon wafers comprises a main body plate 1, and a moving mechanism 4 for clamping the silicon wafers is arranged on the side of the main body plate 1.
[0018] In this embodiment, the moving mechanism 4 includes a motor 43 fixedly arranged on the side of the main plate 1 . A third slot 41 is formed at the lower end of the main plate 1 . A plurality of limiters 45 are slidably arranged in the third slot 41 .
[0019] The transmission shaft end of the motor 43 is fixedly connected with a rotating rod 42 in the third empty groove 41, and a plurality of fixing rings 47 corresponding to the position of the limiting body 45 are arranged on the side of the rotating rod 42, and four circumferentially arranged first placement grooves 48 are respectively opened on the inner sides of the plurality of fixing rings 47, and a fourth electric telescopic rod 49 is fixedly connected in a plurality of the first placement grooves 48, and an anti-slip plate 410 is respectively fixedly connected to the telescopic ends of the plurality of fourth electric telescopic rods 49.
[0020] The sides of several of the limiting bodies 45 are symmetrically provided with second placement grooves 411, and several of the second placement grooves 411 are fixedly connected with fifth electric telescopic rods 412, and the telescopic ends of several of the fifth electric telescopic rods 412 are fixedly connected with anti-sliding blocks 44. The sides of several of the limiting bodies 45 are penetrated with threaded holes 46, and the threaded holes 46 are arranged with the sides of the fixing rings 47 through threaded cooperation.
[0021] Specifically, the motor 43 drives the rotating rod 42 to rotate, and then the rotating rod 42 cooperates to drive the plurality of limit bodies 45 to move in the same direction. At the same time, the fourth electric telescopic rods 49 that are squeezed against each other shrink in sequence, ensuring that after the plurality of limit bodies 45 move, the distance between two adjacent first moving rods 27 is the same, ensuring that the device can squeeze and fix a plurality of silicon wafers at the same time, thereby improving the electroplating efficiency of the device.
[0022] In this embodiment, a conductive clamping mechanism 2 for conductive clamping and detection is provided at the lower end of several of the limit bodies 45, and the conductive clamping mechanism 2 includes several first electric telescopic rods 21 respectively fixedly arranged at the lower end of the limit bodies 45, and the telescopic ends of several of the first electric telescopic rods 21 are respectively fixedly connected to the first fixed body 22.
[0023] Several first fixed bodies 22 are respectively provided with mounting holes 24 on their sides, several insulating rings 23 are rotatably connected in the mounting holes 24, several first fixed rods 25 are respectively fixedly connected on the inner sides of the insulating rings 23, several first fixed rods 25 are respectively provided with second limiting grooves 215 at both ends, several second limiting grooves 215 are respectively fixedly connected with second springs 214, several second springs 214 are respectively fixedly connected with first moving rods 27 at their ends, and fourth fixed bodies 216 are respectively fixedly connected to their ends. A first empty groove 28 is provided on one side of the main body plate 1.
[0024] The main body plate 1 is fixedly connected with a second electric telescopic rod 29 at a position close to the first empty slot 28, the telescopic end of the second electric telescopic rod 29 is fixedly connected with a second fixed body 210, a first limiting groove 211 is provided on the side of the second fixed body 210, a first spring 212 is fixedly connected in the first limiting groove 211, a second moving rod 217 is fixedly connected to the end of the first spring 212, a pressure sensor 218 is fixedly connected to the end of the second moving rod 217, a third spring 219 is fixedly connected to the end of the pressure sensor 218, a first conductor 220 is fixedly connected to the end of the third spring 219, a conductive protrusion 221 is fixedly connected to the end of the first conductor 220.
[0025] The main body plate 1 is provided with a second slot 222 on the side away from the first slot 28, and a third electric telescopic rod 223 is fixedly connected in the second slot 222, and a telescopic end of the third electric telescopic rod 223 is fixedly connected to a motor 224, and a connecting rod 225 is fixedly connected to the transmission shaft end of the motor 224, and an end of the connecting rod 225 is fixedly connected to the end of the first moving rod 27.
[0026] A plurality of ultrasonic detectors 26 are fixedly connected to the side surfaces of the plurality of first fixing bodies 22 .
[0027] Specifically, the motor 224 drives the connecting rod 225 to rotate. At the same time, since several first movable rods 27 are tightly squeezed together through the silicon wafer, when the connecting rod 225 drives a first fixed rod 25 to rotate, several first fixed rods 25 rotate at the same time, thereby driving the silicon wafer to rotate, so that the surface of the silicon wafer enters the electrolyte in turn for electroplating, thereby improving the uniformity of the electroplating. During the electroplating, the device does not contact the electrolyte, which can prevent the device from being wasted and the electrolyte from being contaminated, thereby reducing the cost of electroplating.
[0028] In this embodiment, a plurality of side surfaces of the first fixing bodies 22 are provided with anti-residue mechanisms 3 for blowing away electrolyte from the surface of the silicon wafer.
[0029] Several through holes 34 are formed on the upper end surfaces of several of the limiting bodies 45, several downwardly inclined air outlet holes 33 are formed on the side surfaces of several of the limiting bodies 45, and several of the air outlet holes 33 are communicated with the through holes 34. An air pump 31 is fixedly connected to the upper end of the main body plate 1, and a cavity 32 communicated with the through hole 34 is formed inside the upper end surface of the main body plate 1, and the cavity 32 is communicated with the air pump 31.
[0030] Specifically, the air pump 31 drives the gas to move into the cavity 32, and the gas in the cavity 32 is ejected from the outlet 33 through a plurality of through holes 34, and the residual liquid on the surface of the silicon wafer is sprayed away by the gas, preventing the electrolyte from adhering to the surface of the silicon wafer and continuing electroplating, thereby improving the accuracy of electroplating.
[0031] When in use, the main body plate 1 is fixedly arranged above the electrolyte in a manner that the third empty slot 41 faces downward, and the silicon wafers are placed between two adjacent first moving rods 27 in sequence. Then, the motor 43 is started, and the motor 43 drives the rotating rod 42 to rotate. Then, the rotating rod 42 cooperates to drive the plurality of limit bodies 45 to move in the same direction. At the same time, the fourth electric telescopic rods 49 squeezed against each other are successively retracted to ensure that after the plurality of limit bodies 45 move, the distance between the two adjacent first moving rods 27 is the same, so that the device can squeeze and fix a plurality of silicon wafers at the same time, thereby improving the electroplating efficiency of the device. Then, the first electric telescopic rods 21 are simultaneously extended. , the second electric telescopic rod 29 and the third electric telescopic rod 223, so that the area of the silicon wafer that needs to be electroplated enters the electrolyte, and then the motor 224 is started, and the motor 224 drives the connecting rod 225 to rotate. At the same time, since the plurality of first movable rods 27 are tightly squeezed together through the silicon wafer, when the connecting rod 225 drives a first fixed rod 25 to rotate, the plurality of first fixed rods 25 rotate at the same time, thereby driving the silicon wafer to rotate, so that the surface of the silicon wafer enters the electrolyte in turn for electroplating, thereby improving the uniformity of electroplating. During electroplating, the device does not contact the electrolyte, which can prevent the device from wasting and polluting the electrolyte, thereby reducing the cost of electroplating.
[0032] When the electroplating is completed, the first electric telescopic rod 21, the second electric telescopic rod 29 and the third electric telescopic rod 223 are simultaneously contracted to drive the silicon wafer to leave the electrolyte. At the same time, the air pump 31 is started to drive the gas to move into the cavity 32. The gas in the cavity 32 is ejected from the air outlet 33 through a plurality of through holes 34. The residual liquid on the surface of the silicon wafer is sprayed away by the gas to prevent the electrolyte from adhering to the surface of the silicon wafer and continuing electroplating, thereby improving the accuracy of the electroplating. At the same time, a plurality of ultrasonic detectors 26 are started to detect the thickness of the electroplating on the surface of the silicon wafer.
[0033] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.
Claims
1. A basket structure for placing silicon wafers, comprising a main plate (1), Features: A moving mechanism (4) for clamping a silicon wafer is arranged on the side of the main plate (1), the moving mechanism (4) comprising a motor (43) fixedly arranged on the side of the main plate (1), a third slot (41) is provided at the lower end of the main plate (1), a plurality of position limiting bodies (45) are slidably arranged in the third slot (41), a conductive clamping mechanism (2) for conductive clamping and detection is arranged at the lower ends of the plurality of position limiting bodies (45), the conductive clamping mechanism (2) comprising a plurality of first electric telescopic rods (21) respectively fixedly arranged at the lower ends of the position limiting bodies (45), the telescopic ends of the plurality of first electric telescopic rods (21) respectively fixedly connected to the first fixed bodies (22), and a plurality of anti-residue mechanisms (3) for blowing away electrolyte from the surface of the silicon wafer are arranged on the side of the plurality of first fixed bodies (22).
2. A basket structure for placing silicon wafers according to claim 1, Features: The transmission shaft end of the motor (43) is fixedly connected to a rotating rod (42) in the third empty groove (41); a plurality of fixing rings (47) corresponding to the position of the limiting body (45) are arranged on the side of the rotating rod (42); four circumferentially arranged first placement grooves (48) are respectively opened on the inner sides of the plurality of fixing rings (47); a fourth electric telescopic rod (49) is fixedly connected to the plurality of first placement grooves (48); and an anti-slip plate (410) is respectively fixedly connected to the telescopic ends of the plurality of fourth electric telescopic rods (49).
3. A basket structure for placing silicon wafers according to claim 2, Features: Second placement grooves (411) are symmetrically provided on the side surfaces of a plurality of the position-limiting bodies (45), fifth electric telescopic rods (412) are fixedly connected in a plurality of the second placement grooves (411), and anti-sliding blocks (44) are fixedly connected at the telescopic ends of a plurality of the fifth electric telescopic rods (412). Threaded holes (46) are provided through the side surfaces of a plurality of the position-limiting bodies (45), and the threaded holes (46) are arranged in threaded cooperation with the side surfaces of the fixing rings (47).
4. A basket structure for placing silicon wafers according to claim 1, Features: Several first fixed bodies (22) are provided with mounting holes (24) on their sides, several insulating rings (23) are rotatably connected in the mounting holes (24), several first fixed rods (25) are fixedly connected on the inner sides of several insulating rings (23), several first fixed rods (25) are provided with second limiting grooves (215) at both ends of several first fixed rods (25), several second limiting grooves (215) are fixedly connected in the second limiting grooves (215), several second springs (214) are fixedly connected at their ends with first moving rods (27), and the ends of the first moving rods (27) are fixedly connected with fourth fixed bodies (216), and one side of the main body plate (1) is provided with a first empty groove (28).
5. A basket structure for placing silicon wafers according to claim 4, Features: The main body plate (1) is fixedly connected to a second electric telescopic rod (29) at a position close to the first empty slot (28); the telescopic end of the second electric telescopic rod (29) is fixedly connected to a second fixed body (210); a first limiting slot (211) is provided on a side of the second fixed body (210); a first spring (212) is fixedly connected in the first limiting slot (211); the end of the first spring (212) is fixedly connected to a second moving rod (217); the end of the second moving rod (217) is fixedly connected to a pressure sensor (218); the end of the pressure sensor (218) is fixedly connected to a third spring (219); the end of the third spring (219) is fixedly connected to a first conductor (220); and the end of the first conductor (220) is fixedly connected to a conductive protrusion (221).
6. A basket structure for placing silicon wafers according to claim 4, Features: The main body plate (1) is provided with a second slot (222) on a side away from the first slot (28); a third electric telescopic rod (223) is fixedly connected in the second slot (222); a telescopic end of the third electric telescopic rod (223) is fixedly connected to a motor (224); a transmission shaft end of the motor (224) is fixedly connected to a connecting rod (225); and an end of the connecting rod (225) is fixedly connected to an end of the first moving rod (27).
7. A basket structure for placing silicon wafers according to claim 4, Features: A plurality of ultrasonic detectors (26) are respectively fixedly connected to the side surfaces of a plurality of the first fixed bodies (22).
8. The basket structure for placing silicon wafers according to claim 1, Features: A plurality of through holes (34) are formed on the upper end surfaces of the plurality of limit bodies (45), a plurality of downwardly inclined air outlet holes (33) are formed on the side surfaces of the plurality of limit bodies (45), and a plurality of the air outlet holes (33) are communicated with the through holes (34). An air pump (31) is fixedly connected to the upper end of the main body plate (1), and a cavity (32) communicated with the through holes (34) is formed inside the upper end surface of the main body plate (1), and the cavity (32) is communicated with the air pump (31).