Wafer exhaust system and control method

Abstract

The invention provides a wafer exhaust system and a control method, the wafer exhaust system comprises an air supply pipeline, an exhaust pipeline, a storage device and a cavity, the air supply pipeline is a pipeline for guiding air flow to circulate and comprises a public pipeline and a connecting pipeline, and the public pipeline is a pipeline for guiding the air flow to flow in; the connecting pipeline is connected with the public pipeline; the exhaust pipeline is a pipeline for guiding airflow to flow out; the storage device is connected with the connecting pipeline; a cavity is formed by the public pipeline and the connecting pipeline and located on one side of the storage device; the exhaust pipeline is located on the same side of the air supply pipeline. According to the wafer exhaust system, the problems of how to effectively control airflow in the wafer exhaust system and how to prevent an internal structure from being too complex are solved.

Description

Technical Field

[0001] The present invention relates to the field of exhaust systems, and in particular to a wafer exhaust system and a control method. Background Art

[0002] With the continuous development of science and technology, the requirements for wafer exhaust systems in the semiconductor manufacturing process are constantly increasing. At this stage, it is difficult for the exhaust system to ensure the cleanliness of the wafers in the exhaust system and the precise control of the internal inlet and outlet airflow; and with the increase in wafer detection data, the matching sensors are set in the exhaust system, resulting in the internal pipelines and the exhaust system frame intertwined, affecting the control of the internal airflow direction and flow, which is not conducive to the precise monitoring of the wafers inside the exhaust system. Summary of the invention

[0003] The problem solved by the present invention is how to achieve effective control of the airflow in the wafer exhaust system and prevent the internal structure from being too complicated.

[0004] To solve the above problems, the present invention provides a wafer exhaust system, comprising: an air supply duct, an exhaust duct, a storage device and a cavity, wherein the air supply duct is a pipe for guiding the flow of air, comprising: a common pipe and a connecting pipe, the common pipe is a pipe for guiding the inflow of air; the connecting pipe connects the common pipe; the exhaust duct is a pipe for guiding the outflow of air; the storage device is connected to the connecting pipe; the common pipe and the connecting pipe form a cavity, and the cavity is located on one side of the storage device; wherein the exhaust duct is located on the same side as the supply air duct.

[0005] Compared with the prior art, the technical effects achieved after adopting this technical solution are as follows: the air supply duct and the exhaust duct replace the frame structure of the exhaust system in the prior art, thereby enhancing the mechanical strength and stability of the wafer exhaust system; the exhaust duct and the air supply duct are installed on the same side, which helps to simplify the installation process inside the wafer exhaust system and facilitates maintenance; as part of the frame structure, the duct can help disperse and reduce the vibration generated by the operation of the equipment, thereby reducing the impact on other components.

[0006] Furthermore, the wafer exhaust system also includes: a control component, which is arranged in the air supply duct and / or the exhaust duct, and the control component controls the air flow rate of the air supply duct and / or the exhaust duct.

[0007] Compared with the existing technology, the technical effect achieved after adopting this technical solution is: precise control of the air supply duct and the exhaust duct, which improves the precise control capability of the wafer exhaust system.

[0008] Furthermore, the control component includes: a knob, a partition and a valve blade, the knob is arranged outside the air supply duct and / or the exhaust duct; the partition is arranged on the surface of the air supply duct and / or the exhaust duct; the valve blade is arranged inside the air supply duct and / or the exhaust duct; wherein the knob controls the rotation of the valve blade to control the air flow in the air supply duct and / or the exhaust duct.

[0009] Compared with the existing technology, the technical effect achieved after adopting this technical solution is: by using a knob to control the valve blades, the air flow in the supply air duct and the exhaust air duct can be adjusted more accurately, thereby achieving fine control of the air flow speed and pressure, and improving the stability and efficiency of the system.

[0010] Furthermore, the control component also includes: a first control valve and a second control valve, the first control valve is arranged in the connecting pipe to control the air flow rate entering the storage device; the second control valve is arranged in the exhaust duct to control the air flow rate discharged from the cavity.

[0011] Compared with the prior art, the technical effect achieved after adopting this technical solution is: by adding the first control valve and the second control valve, the air flow entering the storage device and being discharged from the cavity can be more accurately controlled, thereby better maintaining the pressure balance in the cavity and ensuring the stability and reliability of the system operation.

[0012] Furthermore, the storage device includes: a shell and a filter, the shell is provided with a first opening and a second opening, the first opening is connected to the connecting pipe, and the second opening is installed with the filter; the filter is connected to the shell; wherein, the cavity is located on one side of the filter, and the filter provides airflow into the cavity.

[0013] Compared with the prior art, the technical effect achieved after adopting this technical solution is: by adopting a shell design with a filter, the air quality is improved, thereby ensuring the environmental cleanliness during the semiconductor manufacturing process.

[0014] Furthermore, the wafer exhaust system also includes: an electric control device, which is located on one side of the cavity and monitors gas parameters in the cavity.

[0015] Compared with the existing technology, the technical effect achieved after adopting this technical solution is: by setting an electric control device on one side of the cavity to monitor the gas parameters, the air pressure and other key parameters in the cavity can be monitored in real time to ensure that the system operates in the best state and improve the controllability and response speed of the system.

[0016] Furthermore, the electronic control device includes: a detection device and a detection channel, wherein the detection device is located on a side of the electronic control device away from the cavity, and detects the air pressure value of the cavity; the detection channel is located on a side of the electronic control device away from the detection device, and the detection channel is connected to the detection device; wherein the cavity is located on one side of the detection channel, which is convenient for the detection device to perform detection.

[0017] Compared with the existing technology, the technical effect achieved after adopting this technical solution is: by setting up a special detection device and detection channel, the air pressure value in the cavity can be measured more accurately, providing real-time data support for the system and improving the accuracy of monitoring.

[0018] Furthermore, a display frame is provided on the electric control device, and the display frame is connected to the detection device for checking the air pressure value of the cavity.

[0019] Compared with the prior art, the technical effect achieved after adopting this technical solution is: by setting a display frame on the electronic control device, the operator can directly view the air pressure value in the cavity, understand the system status conveniently and quickly, and improve the convenience of operation and the operability of the system.

[0020] Furthermore, an inspection panel is provided between the connecting pipe and the exhaust pipe to facilitate maintenance of the control components.

[0021] Compared with the prior art, the technical effect achieved by adopting this technical solution is as follows: by setting an inspection panel on the connecting pipe and the exhaust duct, the control components can be easily repaired and replaced, thereby improving the availability and maintenance efficiency of the system.

[0022] To solve the above problems, the present invention provides a control method for a wafer exhaust system. The control method is implemented by any wafer exhaust system. The wafer exhaust system includes a control component including: a first control valve, a first knob is provided at one end of the first control valve, and a valve blade is arranged in the air supply duct at the other end; a second control valve, a second knob is provided at one end of the second control valve, and a valve blade is arranged in the exhaust duct at the other end; the control method includes: controlling the first control valve and the second control valve to adjust the exhaust pressure to a set pressure. When the pressure value is lower than the set pressure, the equipment alarms and shuts down.

[0023] Compared with the prior art, the technical effect achieved by adopting this technical solution is as follows: by controlling the first control valve and the second control valve to adjust the exhaust pressure to the set pressure, and alarming and shutting down when the pressure value is lower than the set value, it can ensure that the system operates within a safe range, avoid production accidents caused by abnormal pressure, and improve the safety of the system.

[0024] In summary, the above-mentioned technical solutions of the present application may have one or more of the following advantages or beneficial effects: i) By using the pipeline as a frame structure, the need for additional support structures can be reduced, space can be saved and the layout of the exhaust system can be simplified. ii) Using existing pipelines as structural supports can reduce the use of materials, thereby reducing costs. iii) Reducing the number of internal structural parts of the wafer exhaust system means that the installation process is simpler and faster, and it also helps to simplify the maintenance process because potential failure points are reduced. iv) Control components are provided on the air supply duct and the exhaust duct to accurately control the airflow entering the cavity. v) The storage device is provided with a filter to facilitate the circulation of airflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of a wafer exhaust system in an embodiment of the present invention; Figure 2 It is a left view of the wafer exhaust system in an embodiment of the present invention; Figure 3 for Figure 2 Top-down cross-sectional view; Figure 4 is a schematic diagram of a control component of a wafer exhaust system in an embodiment of the present invention; Figure 5 It is a schematic diagram of a storage device of a wafer exhaust system in an embodiment of the present invention; Figure 6 It is a front view of the electric control device of the wafer exhaust system in an embodiment of the present invention; Figure 7 It is a rear view of the electric control device of the wafer exhaust system in the embodiment of the present invention.

[0026] Description of reference numerals: 100-wafer exhaust system; 110-air supply duct; 111-common duct; 112-connecting duct; 120-exhaust duct; 130-storage device; 131-shell; 131a-first opening; 131b-second opening; 132-filter; 140-cavity; 150-control component; 151-knob; 152-partition; 153-valve blade; 154-first control valve; 155-second control valve; 160-electric control device; 161-detection device; 162-detection channel; 163-display frame; 170-inspection panel. DETAILED DESCRIPTION

[0027] The object of the present invention is to provide a wafer exhaust system for achieving effective control of the airflow in the wafer exhaust system and preventing the internal structure from being too complicated.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] See also Figure 1 , Figure 2 and Figure 3 The present invention provides a wafer exhaust system 100, comprising: an air supply duct 110, an exhaust duct 120, a storage device 130 and a cavity 140, wherein the air supply duct 110 is a duct for guiding airflow, comprising: a common duct 111 and a connecting duct 112, the common duct 111 is a duct for guiding airflow in; the connecting duct 112 connects the common duct 111; the exhaust duct 120 is a duct for guiding airflow out; the storage device 130 is connected to the connecting duct 112; the common duct 111 and the connecting duct 112 form a cavity 140, and the cavity 140 is located on one side of the storage device 130; wherein the exhaust duct 120 is located on the same side as the air supply duct 110.

[0030] In this embodiment, the air supply duct 110 and the exhaust duct 120 replace the frame structure of the exhaust system in the prior art, thereby enhancing the mechanical strength and stability of the wafer exhaust system 100; the exhaust duct 120 is installed on the same side as the air supply duct 110, which helps to simplify the installation process inside the wafer exhaust system 100 and facilitates maintenance; as part of the frame structure, the duct can help disperse and reduce the vibration generated by the operation of the equipment, thereby reducing the impact on other components.

[0031] Specifically, the external air flow enters the wafer exhaust system 100 from the air supply duct 110, passes through the common duct 111, and enters the connecting duct 112. The connecting duct 112 is connected to the storage device 130. A cavity 140 is connected below the storage device 130. The air flow enters the storage device 130 and then enters the cavity 140. The exhaust duct 120 is connected to the cavity 140 to control the air flow inside the cavity 140 to discharge the wafer exhaust system 100. The common duct 111 and the connecting duct 112 form an internal cavity 140 of the exhaust system to support the internal structure of the wafer exhaust system 100. The air supply duct 110 and the exhaust duct 120 are installed on the same side to simplify the framework of the wafer exhaust system 100.

[0032] Preferably, the air supply duct 110 forms four cavities 140 , and the air exhaust duct 120 is provided with two different lengths, connecting the upper and lower cavities 140 .

[0033] See also Figure 2 , Figure 3 The wafer exhaust system 100 further includes: a control component 150 , which is disposed in the air supply pipeline 110 and / or the exhaust pipeline 120 , and controls the air flow rate of the air supply pipeline 110 and / or the exhaust pipeline 120 .

[0034] In this embodiment, the air supply pipeline 110 and the air exhaust pipeline 120 are precisely controlled, thereby improving the precise control capability of the wafer exhaust system 100 .

[0035] Specifically, a control component 150 is provided on the air supply pipeline 110 and the air exhaust pipeline 120 , and the control component 150 controls the air flow in and out of the wafer exhaust system 100 .

[0036] See also Figure 2 , Figure 3 and Figure 4 The control component 150 includes: a knob 151, a partition 152 and a valve blade 153, the knob 151 is arranged outside the air supply duct 110 and / or the exhaust duct 120; the partition 152 is arranged on the surface of the air supply duct 110 and / or the exhaust duct 120; the valve blade 153 is arranged in the air supply duct 110 and / or the exhaust duct 120; wherein the knob 151 controls the rotation of the valve blade 153 to control the air flow in the air supply duct 110 and / or the exhaust duct 120.

[0037] In this embodiment, by using the knob 151 to control the valve blade 153, the air flow in the supply air duct 110 and the exhaust air duct 120 can be more accurately adjusted, thereby achieving fine control of the air flow speed and pressure, and improving the stability and efficiency of the system.

[0038] Specifically, the control component 150 is disposed on the air supply duct 110 and / or the exhaust duct 120, and the knob 151 controls the rotation of the valve blade 153 inside the air supply duct 110 and / or the exhaust duct 120 to control the internal air flow rate.

[0039] See also Figure 2 , Figure 3 The control component 150 also includes: a first control valve 154 and a second control valve 155. The first control valve 154 is arranged in the connecting pipe 112 to control the air flow entering the storage device 130; the second control valve 155 is arranged in the exhaust pipe 120 to control the air flow discharged from the cavity 140.

[0040] In this embodiment, by adding the first control valve 154 and the second control valve 155, the air flow rate entering the storage device 130 and discharged from the cavity 140 can be more accurately controlled, thereby better maintaining the pressure balance in the cavity 140 and ensuring the stability and reliability of the system operation.

[0041] Specifically, the first control valve 154 controls the air flow rate entering the wafer exhaust system 100 , and the second control valve 155 limits the air flow rate exiting the wafer exhaust system 100 .

[0042] See also Figure 5 The storage device 130 includes: a shell 131 and a filter 132, the shell 131 is provided with a first opening 131a and a second opening 131b, the first opening 131a is connected to the connecting pipe 112, and the second opening 131b is installed with the filter 132; the filter 132 is connected to the shell 131; wherein, the cavity 140 is located on one side of the filter 132, and the filter 132 provides airflow to flow into the cavity 140.

[0043] In this embodiment, the housing 131 with the filter 132 is used to improve the air quality, thereby ensuring the cleanliness of the environment during the semiconductor manufacturing process.

[0044] Specifically, the connecting pipe 112 is connected to the first opening 131a of the storage device 130, and the gas enters the storage device 130. The storage device 130 has a second opening 131b at the bottom, and the filter 132 is embedded in the second opening 131b. The airflow passes through the filter 132 and enters the cavity 140 below.

[0045] See also Figure 6 The wafer exhaust system 100 further includes: an electric control device 160 , which is located at one side of the cavity 140 and monitors gas parameters in the cavity 140 .

[0046] In this embodiment, by setting an electronic control device 160 on one side of the cavity 140 to monitor gas parameters, the gas pressure and other key parameters in the cavity 140 can be monitored in real time to ensure that the system operates in the best state and improve the controllability and response speed of the system.

[0047] Specifically, an electric control device 160 is installed outside the wafer exhaust system 100 , and the electric control device 160 detects gas parameters inside the cavity 140 for external operation and control of the electric control device 160 .

[0048] See also Figure 6 , Figure 7 The electric control device 160 includes: a detection device 161 and a detection channel 162, wherein the detection device 161 is located on a side of the electric control device 160 away from the cavity 140, and detects the air pressure value of the cavity 140; the detection channel 162 is located on a side of the electric control device 160 away from the detection device 161, and the detection channel 162 is connected to the detection device 161; wherein the cavity 140 is located on one side of the detection channel 162, which is convenient for the detection device 161 to perform detection.

[0049] In this embodiment, by providing a special detection device 161 and a detection channel 162, the air pressure value in the cavity 140 can be measured more accurately, providing real-time data support for the system and improving the accuracy of monitoring.

[0050] Specifically, the detection device 161 is located outside the wafer exhaust system 100 , and the detection channel 162 is located inside the wafer exhaust system 100 and associated with the cavity 140 , so that the detection device 161 can detect the air pressure value inside the cavity 140 .

[0051] See also Figure 6 The electronic control device 160 is provided with a display frame 163 , which is connected to the detection device 161 and is used to check the air pressure value of the cavity 140 .

[0052] In this embodiment, by providing a display frame 163 on the electronic control device 160 , the operator can directly view the air pressure value in the cavity 140 , and conveniently and quickly understand the system status, thereby improving the convenience of operation and the operability of the system.

[0053] Specifically, a display frame 163 is provided on the surface of the electric control device 160 for the outside to view the internal pressure of the cavity 140 .

[0054] See also Figure 2 An inspection panel 170 is provided between the connecting pipe 112 and the exhaust pipe 120 to facilitate maintenance of the control component 150 .

[0055] In this embodiment, by providing an inspection panel 170 on the connecting pipe 112 and the exhaust pipe 120, the control component 150 can be easily repaired and replaced, thereby improving the availability and maintenance efficiency of the system.

[0056] Specifically, an inspection panel 170 is provided near the pipeline where the control assembly 150 is installed, so as to facilitate maintenance of the first control valve 154 on the air supply pipeline 110 and the second control valve 155 on the exhaust pipeline 120 .

[0057] To solve the above problems, the present invention provides a control method for a wafer exhaust system 100. The control method is implemented by any wafer exhaust system 100. The wafer exhaust system 100 includes a control component 150 including: a first control valve 154, wherein a first knob 151 is provided at one end of the first control valve 154, and a valve blade 153 is provided at the other end in the air supply pipeline 110; a second control valve 155, wherein a second knob 151 is provided at one end of the second control valve 155, and a valve blade 153 is provided at the other end in the exhaust pipeline 120; the control method includes: controlling the first control valve 154 and the second control valve 155 to adjust the exhaust pressure to a set pressure. When the pressure value is lower than the set pressure, the equipment alarms and shuts down.

[0058] In this embodiment, the exhaust pressure is adjusted to a set pressure by controlling the first control valve 154 and the second control valve 155, and an alarm is triggered to shut down the system when the pressure value is lower than the set value. This ensures that the system operates within a safe range, avoids production accidents caused by abnormal pressure, and improves the safety of the system.

[0059] Specifically, the outside can control the first control valve 154 to supply airflow to the inside or exhaust airflow to the outside of the wafer exhaust system 100 according to the set pressure value, so as to control the internal pressure within the set pressure. When the internal pressure is lower than the set pressure, the wafer exhaust system 100 will alarm and shut down.

[0060] The present invention provides a wafer exhaust system 100 and a control method to achieve effective control of airflow in the wafer exhaust system 100 and prevent the problem of an internal structure being too complicated. Specifically, the airflow enters the wafer exhaust system 100 from the air supply duct 110, enters the connecting duct 112 connected to the common duct 111 through the common duct 111, the connecting duct 112 is connected to the first opening 131a of the shell 131, and the airflow enters the storage device 130, passes through the bottom filter 132 and enters the cavity 140, the cavity 140 is connected to the exhaust duct 120, and the gas is discharged; the control component 150 on the air supply duct 110 and the exhaust duct 120 controls the air flow entering the system, and an electronic control device 160 is provided outside the cavity 140 of the wafer exhaust system 100 to detect the gas parameters in the cavity 140, and the first control valve 154 and the second control valve 155 are adjusted according to the pressure value on the display frame 163 to adjust the pressure to the set pressure. When the pressure value is lower than the set pressure, the wafer exhaust system 100 alarms and shuts down.

[0061] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A wafer exhaust system (100), characterized in that: include: An air supply pipeline (110), the air supply pipeline (110) being a pipeline for guiding air flow, comprising: A common pipeline (111), the common pipeline (111) being a pipeline used to guide airflow to flow into; A connecting pipeline (112), wherein the connecting pipeline (112) is connected to the common pipeline (111); An exhaust duct (120), the exhaust duct (120) being a pipeline for guiding airflow to flow out; A storage device (130), the storage device (130) being connected to the connecting pipe (112); a cavity (140), the common pipe (111) and the connecting pipe (112) forming the cavity (140), the cavity (140) being located on one side of the storage device (130); Wherein, the exhaust pipe (120) is located on the same side as the air supply pipe (110).

2. The wafer exhaust system (100) according to claim 1, characterized in that: Also includes: A control component (150), wherein the control component (150) is arranged on the air supply pipeline (110) and / or the exhaust pipeline (120), and the control component (150) controls the air flow rate of the air supply pipeline (110) and / or the exhaust pipeline (120).

3. The wafer exhaust system (100) according to claim 2, characterized in that: The control component (150) comprises: a knob (151), a partition (152) and a valve blade (153); the knob (151) is arranged outside the air supply pipeline (110) and / or the exhaust pipeline (120); the partition (152) is arranged on the surface of the air supply pipeline (110) and / or the exhaust pipeline (120); the valve blade (153) is arranged inside the air supply pipeline (110) and / or the exhaust pipeline (120); wherein the knob (151) controls the rotation of the valve blade (153) to control the air flow in the air supply pipeline (110) and / or the exhaust pipeline (120).

4. The wafer exhaust system (100) according to claim 3, characterized in that: The control assembly (150) further comprises: a first control valve (154) and a second control valve (155); the first control valve (154) is arranged on the connecting pipe (112) to control the air flow rate entering the storage device (130); and the second control valve (155) is arranged on the exhaust pipe (120) to control the air flow rate discharged from the cavity (140).

5. The wafer exhaust system (100) according to claim 1, characterized in that: The storage device (130) comprises: A shell (131) and a filter (132), wherein the shell (131) is provided with a first opening (131a) and a second opening (131b), wherein the first opening (131a) is connected to the connecting pipe (112), and the second opening (131b) is provided with the filter (132); the filter (132) is connected to the shell (131); wherein the cavity (140) is located on one side of the filter (132), and the filter (132) allows airflow to flow into the cavity (140).

6. The wafer exhaust system (100) according to claim 1, characterized in that: Also includes: An electric control device (160), the electric control device (160) being located on one side of the cavity (140), and the electric control device (160) monitoring gas parameters in the cavity (140).

7. The wafer exhaust system (100) according to claim 6, characterized in that: The electric control device (160) comprises: a detection device (161), the detection device (161) being located on a side of the electric control device (160) away from the cavity (140) and detecting an air pressure value of the cavity (140); a detection channel (162), the detection channel (162) being located on a side of the electric control device (160) away from the detection device (161), the detection channel (162) being connected to the detection device (161); The cavity (140) is located on one side of the detection channel (162), so as to facilitate detection by the detection device (161).

8. The wafer exhaust system (100) according to claim 7, characterized in that: The electric control device (160) is provided with a display frame (163), and the display frame (163) is connected to the detection device (161) and is used to check the air pressure value of the cavity (140).

9. The wafer exhaust system (100) according to claim 2, characterized in that: The connecting pipe (112) and the exhaust pipe (120) are provided with an inspection plate (170) to facilitate maintenance of the control component (150).

10. A control method for a wafer exhaust system (100), the control method being implemented by the wafer exhaust system (100) according to any one of claims 1 to 9, characterized in that: The wafer exhaust system (100) comprises a control component (150) comprising: a first control valve (154), wherein one end of the first control valve (154) is provided with a first knob (151), and the other end is a valve blade (153) arranged in the air supply pipeline (110); a second control valve (155), wherein one end of the second control valve (155) is provided with a second knob (151), and the other end is a valve blade (153) arranged in the exhaust pipeline (120); The control method comprises: The first control valve (154) and the second control valve (155) are controlled to adjust the exhaust pressure to a set pressure. When the pressure value is lower than the set pressure, the equipment alarms and shuts down.

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