Method for sampling temperature extreme value of multi-channel T / R assembly
By connecting the voltage divider point of the thermistor to the common test point through diodes in a multi-channel T/R component, accurate testing of multi-channel temperature extremes is achieved, solving the inaccurate temperature detection and excessive interconnection lines in traditional technology. The problem reduces cost and space consumption.
Patent Information
- Application Number
- CN202411343778.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2024-12-20
AI Technical Summary
Traditional T/R components lack effective temperature detection measures, especially in multi-channel components. Single-position temperature detection cannot accurately reflect the temperature increase of individual channels, making it difficult to set reasonable overtemperature protection thresholds and increase between modules. interconnect volume and cost.
By setting the thermistor in the multi-channel T/R component and connecting its voltage divider to the common test point through a diode, the voltage sampling of the common test point can be used to achieve the test of the temperature extremes of multiple channels, reducing the number of interconnected lines , only one low-frequency interconnect line is needed to achieve the temperature extreme test.
Accurate testing of the temperature extremes of multi-channel T/R components is achieved, reducing hardware costs and PCB board area occupation, and solving the problem that a single temperature measurement point cannot express all power tube temperatures and multiple temperature measurement points require too many test lines. contradiction.
Smart Images
Figure CN119164511A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of microwave antennas, and in particular relates to a method for sampling temperature extremes of a multi-channel T / R component. Background Art
[0002] The power of T / R components is getting higher and higher, and the reliability requirements are getting higher and higher. Thermal burnout is the main failure mode of power tube damage. In addition to taking measures during the design and manufacturing process, sound health management measures are an important part of ensuring the normal operation of power tubes. Traditional T / R components have no temperature detection measures, or perform temperature detection on a single location of multi-channel components. The main problem is that the temperature increase of individual channels has no obvious effect on the temperature of the test point. Engineering practice shows that setting a temperature detection point for each transmitting channel has a significant effect on protecting the power tube. The commonly used temperature detection circuit is to divide the voltage through a thermistor and then use an ADC to sample the divided voltage signal.
[0003] For T / R components with very large installed capacity, the requirements for volume, weight, and cost are very stringent. Therefore, it is necessary to minimize the interconnection between modules. A temperature detection point is set for each transmitting channel, which increases the low-frequency interconnection between the thermistor and the ADC sampling circuit. Taking an 8-channel high-power polarization switch as an example, 8 channels require at least 8 low-frequency lines, which increases the size and cost of the connector. We previously connected thermistors of different channels in series or in parallel, but this method can only measure the equivalent temperature or average temperature. The temperature increase of a single channel has little effect on the test results. If the temperature of a single channel rises by 8 degrees, in the final test, the temperature may only rise by 1 degree. In this case, it is difficult to set a reasonable threshold to protect a single channel from overheating. Summary of the invention
[0004] In order to reduce the interconnect volume and cost, and avoid the defects of series and parallel connection, the present invention proposes a method for sampling the temperature extremes of multi-channel T / R components, by obtaining the voltage corresponding to the thermistor with the highest temperature, and then sampling this voltage, to achieve the test of the temperature extremes of multiple channels through a low-frequency interconnect line. Specifically, it includes:
[0005] A thermistor is set in each channel of a multi-channel T / R component, and a common test point is set between each channel. The voltage divider point of each channel is connected to the common test point through a diode, and the positive electrode of the diode is connected to the voltage divider point, and the negative electrode is connected to the common test point. Since the higher the temperature, the lower the resistance value, the diode corresponding to the channel with a higher voltage between the two channels is turned on, and the diode corresponding to the channel with a lower voltage is turned off. By measuring the voltage of the common test point, the temperature of the corresponding channel is calculated.
[0006] Furthermore, the diode may be replaced by a transistor.
[0007] The beneficial effects of the present invention are
[0008] The present invention realizes the test of the temperature extreme value of multi-channel T / R components with a single test line, which solves the contradiction that a single temperature measurement point cannot express the temperature of all power tubes and multiple temperature measurement points require too many test lines. The main hardware is a diode, which has low cost and occupies a small area of PCB board, and can be applied to any multi-channel T / R component. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 2 is a circuit structure diagram of two channels in the embodiment.
[0010] Figure 2 It is a three-channel simulation diagram in the embodiment.
[0011] Figure 3 This is a physical circuit diagram. DETAILED DESCRIPTION
[0012] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0013] like Figure 1 As shown, taking two channels as an example, the voltage dividing points A and B of the two channels are connected to point C through diodes. In the figure, R1 and R2 are fixed voltage dividing resistors, and R3 and R4 are thermistors. The higher the temperature, the lower the resistance. When the temperature of R3 is higher than that of R4, the resistance of R3 is less than that of R4, then the voltage at point A is higher than that at point B. At this time, diode D1 is turned on, diode D2 is turned off, and the voltage at point C is approximately equal to that at point A. The temperature of R3 can be calculated from the voltage at point C. When the temperature of R4 is higher than that of R3, the voltage at point C is approximately equal to that at point B, and the temperature of R4 can be calculated from the voltage at point C.
[0014] For multiple channels, the voltage divider points of multiple channels can be connected to a common test point through diodes to achieve the highest temperature sampling. Figure 2 Taking the three channels shown in the figure as an example, the measured data are shown in the following table.
[0015]
[0016] The following results were obtained after simulation at intervals of 10°C in the range of 25°C to 85°C.
[0017]
[0018] like Figure 3As shown, the actual circuit was built for testing and verification, and the test results are shown in the following table.
[0019] 1 port 2 ports 3 ports Measured voltage temperature 26.4℃ 26.4℃ 26.7℃ Voltage 2.48V 2.41V 2.32V 2.25V 1 port 2 ports 3 ports Output voltage temperature 29.4℃ 45℃ 30.6℃ Voltage 2.64V 2.98V 2.72V 2.81V 1 port 2 ports 3 ports Output voltage temperature 32.5℃ 65℃ 31.7℃ Voltage 2.78V 3.62V 2.78V 3.48V 1 port 2 ports 3 ports Output voltage temperature 50℃ 85℃ 56℃ Voltage 3.57V 4.22V 3.82V 4.0V
[0020] It can be seen that the voltage at the common test point is approximately equal to the voltage corresponding to the channel with the highest temperature.
[0021] The present invention is not limited to the above specific implementations, and the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made to the above implementations based on the technical essence of the present invention shall be included in the protection scope of the present invention.
Claims
1. A method for sampling the temperature extremes of multi-channel T / R components, Features: A thermistor is set in each channel of a multi-channel T / R component, and a common test point is set between each channel. The voltage divider point of each channel is connected to the common test point through a diode, and the positive electrode of the diode is connected to the voltage divider point, and the negative electrode is connected to the common test point. Since the higher the temperature, the lower the resistance value, the diode corresponding to the channel with a higher voltage between the two channels is turned on, and the diode corresponding to the channel with a lower voltage is turned off. By measuring the voltage of the common test point, the temperature of the corresponding channel is calculated.
2. A method for sampling temperature extremes of a multi-channel T / R component according to claim 1, Features: The diode can also be replaced by a transistor.