Electrolytic capacitor chip mounting mechanism for detecting Micro LED module

Abstract

The invention belongs to the technical field of electrolytic capacitor chip mounting, and provides an electrolytic capacitor chip mounting mechanism for detecting a Micro LED module, comprising a circuit bearing plate; the electrolytic capacitor assembly is arranged on the circuit bearing plate; the LED assembly is mounted at the bottom of the circuit bearing plate; the circuit bearing plate and the LED assembly are connected together through the mounting assembly; according to the invention, the direction of the gap is judged by detecting the distance between the sensor and the electrolytic capacitor base, so that the difference between the gap and the chamfer on the silk-screen frame is determined after the positive polarity of the capacitor and the polarity of the capacitor are wrongly pasted, and the actual wrong pasting of the polarity of the capacitor is judged according to the comparison of infrared parameters set by the silk-screen frame.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrolytic capacitor patches, and specifically relates to an electrolytic capacitor patch mechanism for detecting a Micro LED module. Background Art

[0002] Electrolytic capacitor is a kind of capacitor. The metal foil is the positive electrode, and the oxide film close to the positive electrode is the dielectric. The cathode is composed of conductive materials, electrolytes and other materials. Because the electrolyte is the main part of the cathode, the electrolytic capacitor is named after it. At the same time, the positive and negative electrodes of the electrolytic capacitor must not be connected incorrectly.

[0003] Existing Micro LED modules use SMD electrolytic capacitors to achieve the purpose of voltage stabilization and filtering. However, the positive and negative poles of the capacitors may be incorrect during patching, which will cause damage to the capacitors or even burn out of the module. Currently, the polarity direction of the SMD patches is generally detected manually, or optical instruments are used to check the polarity of the SMD patches. Manual inspection is prone to errors and is inefficient, while optical instruments are expensive.

[0004] To this end, those skilled in the art have proposed an electrolytic capacitor patch mechanism for detecting Micro LED modules to solve the problems raised by the background technology. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides an electrolytic capacitor patch mechanism for detecting Micro LED modules to solve the problems in the prior art that manual inspection is prone to errors, is inefficient, and has high costs for optical instruments.

[0006] An electrolytic capacitor patch mechanism for detecting a Micro LED module, comprising a circuit carrier board;

[0007] An electrolytic capacitor assembly, wherein the electrolytic capacitor assembly is arranged on a circuit carrier board;

[0008] An LED assembly, wherein the LED assembly is mounted on the bottom of the circuit carrier board;

[0009] The circuit carrier board and the LED assembly are connected together by the mounting assembly.

[0010] Preferably, a silk screen frame is provided on the circuit carrier board, a chamfer is provided on the silk screen frame, a positive pole marking groove is provided on one side of the silk screen frame, and a negative pole marking groove is provided on the other side of the silk screen frame.

[0011] Preferably, the electrolytic capacitor assembly includes an electrolytic capacitor base, a notch is formed on the electrolytic capacitor base, an electrolytic capacitor is fixedly mounted on the top of the electrolytic capacitor base, and two pins are fixedly mounted on the bottom of the electrolytic capacitor.

[0012] Preferably, the LED assembly includes an LED light board, and four U-shaped card boards are fixedly mounted on the upper surface of the LED light board.

[0013] Preferably, the mounting assembly includes a vertical circular column, which is fixedly mounted on the circuit carrier board, and a circular frame is slidably sleeved on the outer side of the vertical circular column. The mounting assembly also includes four evenly distributed U-shaped guide plates, which are fixedly mounted on the circuit carrier board, and a limit plug plate is slidably connected to the inside of the U-shaped guide plate, and the inner end of the limit plug plate is movably connected to the side of the circular frame through a connecting oblique rod, a positioning hole is provided on the circular frame, a horizontal column is fixedly mounted on the inside of the circular frame, a movable slide is slidably sleeved on the outer side of the horizontal column, a return spring is sleeved on the outer surface of the horizontal column and located on the right side of the movable slide, and a positioning column adapted to the positioning hole is fixedly mounted on the movable slide.

[0014] Preferably, the top end of the connecting oblique rod is rotationally matched with the side surface of the circular sleeve frame through a hinge seat, and the bottom end of the connecting oblique rod is rotationally matched with the inner end of the limiting plug plate through another hinge seat.

[0015] Preferably, a through hole matched with the horizontal column is provided on the movable slide plate, the horizontal column passes through the through hole on the movable slide plate, and the horizontal column and the through hole on the movable slide plate are used in coordination.

[0016] Preferably, the positioning column is inserted into the corresponding positioning hole, and the positioning column and the positioning hole are used in conjunction with each other, and a pulling plate is fixedly mounted on the movable slide plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present invention is based on an infrared sensor, and determines the direction of the notch by detecting the distance between the sensor and the electrolytic capacitor base, thereby determining the positive polarity of the capacitor. When the polarity of the capacitor is incorrectly pasted, there is a difference between the notch and the chamfer on the silk-screen frame. By comparing the infrared parameters set by the silk-screen frame, it is determined that the actual polarity of the capacitor is incorrectly pasted;

[0019] 2. The present invention pulls the pull plate to the right, and the pull plate will drive the movable slide plate and the positioning column to move to the right. At this time, the positioning column will be disengaged from the inside of the positioning hole, and the reset spring will shrink and shorten. Then the circular frame will be moved upward. Since the inner end of the limit plug plate is movably connected to the side of the circular frame through the connecting oblique rod, when the circular frame moves upward, the four limit plug plates will gather inward at the same time. At this time, the outer end of the limit plug plate will be disengaged from the inside of the U-shaped card plate, and then the LED component can be removed from the circuit carrier board, thereby facilitating the maintenance or replacement of the LED component. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a structural schematic diagram of an electrolytic capacitor patch mechanism for detecting a Micro LED module according to the present invention;

[0021] Figure 2 It is a schematic diagram of the installation structure of the electrolytic capacitor assembly of the present invention;

[0022] Figure 3 It is a structural schematic diagram of the circuit carrier board of the present invention;

[0023] Figure 4 For the present invention Figure 3 A magnified view of part A;

[0024] Figure 5 It is a schematic diagram of the structure of the electrolytic capacitor assembly of the present invention;

[0025] Figure 6 It is a schematic diagram of the structure of the LED assembly of the present invention;

[0026] Figure 7 It is a structural schematic diagram of the installation assembly of the present invention;

[0027] Figure 8 is a cross-sectional view of the installation assembly of the present invention;

[0028] Fig. 9 For the present invention Figure 8 Magnified view of part B.

[0029] In the figure:

[0030] 1. Circuit board; 101. Silk screen frame; 102. Chamfer; 103. Positive pole mark groove; 104. Negative pole mark groove; 2. Electrolytic capacitor assembly; 201. Electrolytic capacitor base; 202. Notch; 203. Electrolytic capacitor; 204. Pin; 3. LED assembly; 301. LED light board; 302. U-shaped card board; 4. Installation assembly; 401. Vertical circular column; 402. Circular sleeve frame; 403. U-shaped guide plate; 404. Limit plug-in plate; 405. Connecting diagonal rod; 406. Positioning hole; 407. Horizontal column; 408. Moving slide plate; 409. Reset spring; 410. Positioning column; 411. Pull plate. DETAILED DESCRIPTION

[0031] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0032] As attached Figure 1 To Attachment Fig. 9 As shown:

[0033] Embodiment 1:

[0034] The present invention provides an electrolytic capacitor patch mechanism for detecting a Micro LED module, comprising:

[0035] Circuit board 1;

[0036] An electrolytic capacitor assembly 2, wherein the electrolytic capacitor assembly 2 is arranged on the circuit carrier board 1;

[0037] The circuit board 1 is provided with a screen printing frame 101, the screen printing frame 101 is provided with a chamfer 102, one side of the screen printing frame 101 is provided with a positive pole mark groove 103, and the other side of the screen printing frame 101 is provided with a negative pole mark groove 104;

[0038] The electrolytic capacitor assembly 2 includes an electrolytic capacitor base 201 , a notch 202 is formed on the electrolytic capacitor base 201 , an electrolytic capacitor 203 is fixedly mounted on the top of the electrolytic capacitor base 201 , and two pins 204 are fixedly mounted on the bottom of the electrolytic capacitor 203 .

[0039] Embodiment 2:

[0040] The present invention provides an electrolytic capacitor patch mechanism for detecting a Micro LED module, comprising:

[0041] Circuit board 1;

[0042] An electrolytic capacitor assembly 2, wherein the electrolytic capacitor assembly 2 is arranged on the circuit carrier board 1;

[0043] An LED assembly 3, wherein the LED assembly 3 is mounted on the bottom of the circuit carrier board 1;

[0044] The circuit board 1 is provided with a screen printing frame 101, the screen printing frame 101 is provided with a chamfer 102, one side of the screen printing frame 101 is provided with a positive pole mark groove 103, and the other side of the screen printing frame 101 is provided with a negative pole mark groove 104;

[0045] The electrolytic capacitor assembly 2 includes an electrolytic capacitor base 201, a notch 202 is formed on the electrolytic capacitor base 201, an electrolytic capacitor 203 is fixedly mounted on the top of the electrolytic capacitor base 201, and two pins 204 are fixedly mounted on the bottom of the electrolytic capacitor 203;

[0046] The LED assembly 3 includes an LED light board 301 , and four U-shaped clamping plates 302 are fixedly mounted on the upper surface of the LED light board 301 .

[0047] Embodiment three:

[0048] The present invention provides an electrolytic capacitor patch mechanism for detecting a Micro LED module, comprising:

[0049] Circuit board 1;

[0050] An electrolytic capacitor assembly 2, wherein the electrolytic capacitor assembly 2 is arranged on the circuit carrier board 1;

[0051] An LED assembly 3, wherein the LED assembly 3 is mounted on the bottom of the circuit carrier board 1;

[0052] An installation component 4, the circuit carrier board 1 and the LED component 3 are connected together through the installation component 4;

[0053] The circuit board 1 is provided with a screen printing frame 101, the screen printing frame 101 is provided with a chamfer 102, one side of the screen printing frame 101 is provided with a positive pole mark groove 103, and the other side of the screen printing frame 101 is provided with a negative pole mark groove 104;

[0054] The electrolytic capacitor assembly 2 includes an electrolytic capacitor base 201, a notch 202 is formed on the electrolytic capacitor base 201, an electrolytic capacitor 203 is fixedly mounted on the top of the electrolytic capacitor base 201, and two pins 204 are fixedly mounted on the bottom of the electrolytic capacitor 203;

[0055] The LED assembly 3 includes an LED light board 301, and four U-shaped card boards 302 are fixedly mounted on the upper surface of the LED light board 301;

[0056] The installation component 4 includes a vertical circular column 401, which is fixedly installed on the circuit carrier board 1. The outer side of the vertical circular column 401 is slidably sleeved with a circular frame 402. The installation component 4 also includes four evenly distributed U-shaped guide plates 403, which are fixedly installed on the circuit carrier board 1. The inside of the U-shaped guide plate 403 is slidably connected with a limit plug plate 404. The inner end of the limit plug plate 404 is movably connected to the side of the circular frame 402 through a connecting oblique rod 405. The top end of the connecting oblique rod 405 is rotatably matched with the side of the circular frame 402 through a hinge seat. The bottom end of the connecting oblique rod 405 is rotatably matched with the inner end of the limit plug plate 404 through another hinge seat. A positioning hole 40 is provided on the circular frame 402. 6. A horizontal column 407 is fixedly installed inside the circular sleeve frame 402, and a movable slide 408 is slidably sleeved on the outer side of the horizontal column 407. A through hole matched with the horizontal column 407 is provided on the movable slide 408. The horizontal column 407 passes through the through hole on the movable slide 408, and the horizontal column 407 is used in conjunction with the through hole on the movable slide 408. A return spring 409 is sleeved on the outer surface of the horizontal column 407 and located on the right side of the movable slide 408. A positioning column 410 matched with the positioning hole 406 is fixedly installed on the movable slide 408. The positioning column 410 is inserted into the corresponding positioning hole 406, and the positioning column 410 is used in conjunction with the positioning hole 406. A pull plate 411 is fixedly installed on the movable slide 408.

[0057] As can be seen from the above, when the LED component 3 needs to be removed from the circuit carrier board 1, the pull plate 411 is pulled to the right, and the pull plate 411 will drive the movable slide plate 408 and the positioning column 410 to move to the right. At this time, the positioning column 410 will be disengaged from the inside of the positioning hole 406, and the reset spring 409 will shrink and shorten. Then, the circular frame 402 is moved upward. Since the inner end of the limit plug plate 404 is movably connected to the side of the circular frame 402 through the connecting diagonal rod 405, when the circular frame 402 moves upward, the four limit plug plates 404 will gather inward at the same time. At this time, the outer end of the limit plug plate 404 will be disengaged from the inside of the U-shaped card plate 302, and then the LED component 3 can be removed from the circuit carrier board 1, thereby facilitating the maintenance or replacement of the LED component 3.

[0058] Working principle: When it is necessary to detect the electrolytic capacitor patch of the Micro LED module of the present invention, based on the infrared sensor, the distance between the sensor and the electrolytic capacitor base 201 is detected to determine the direction of the notch 202, thereby determining the positive polarity of the capacitor. After the capacitor polarity is incorrectly pasted, there is a difference between the notch 202 and the chamfer 102 on the silk screen frame 101. According to the infrared parameter comparison set by the silk screen frame 101, it is determined that the actual capacitor polarity is incorrectly pasted; in addition, when it is necessary to remove the LED component 3 from the circuit carrier board 1, the pull plate 411 is pulled to the right at this time, and the pull plate 411 will drive the moving slide plate 408 and the positioning column 410 to move to the right. At this time, the positioning column 410 will be disengaged from the inside of the positioning hole 406, and the return spring 409 will shrink and shorten, and then the circular frame 402 will move upward. Since the inner end of the limiting plug plate 404 is movably connected to the side of the circular frame 402 through the connecting diagonal rod 405, when the circular frame 402 moves upward, the four limiting plug plates 404 will gather inward at the same time. At this time, the outer end of the limiting plug plate 404 will be disengaged from the inside of the U-shaped card plate 302, and then the LED component 3 can be removed from the circuit carrier board 1, so as to facilitate the maintenance or replacement of the LED component 3.

[0059] The embodiments of the present invention are provided for the purpose of illustration and description. Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An electrolytic capacitor patch mechanism for detecting Micro LED modules, It is characterized in that include: Circuit board (1); An electrolytic capacitor assembly (2), wherein the electrolytic capacitor assembly (2) is arranged on a circuit carrier board (1); An LED component (3), wherein the LED component (3) is mounted on the bottom of the circuit carrier board (1); A mounting assembly (4), wherein the circuit carrier board (1) and the LED assembly (3) are connected together via the mounting assembly (4).

2. An electrolytic capacitor patch mechanism for detecting a Micro LED module as claimed in claim 1, Features: A silk screen frame (101) is provided on the circuit carrier board (1), a chamfer (102) is provided on the silk screen frame (101), a positive pole marking groove (103) is provided on one side of the silk screen frame (101), and a negative pole marking groove (104) is provided on the other side of the silk screen frame (101).

3. An electrolytic capacitor patch mechanism for detecting a Micro LED module as claimed in claim 2, Features: The electrolytic capacitor assembly (2) comprises an electrolytic capacitor base (201), a notch (202) is provided on the electrolytic capacitor base (201), an electrolytic capacitor (203) is fixedly mounted above the electrolytic capacitor base (201), and two pins (204) are fixedly mounted at the bottom of the electrolytic capacitor (203).

4. An electrolytic capacitor patch mechanism for detecting a Micro LED module as claimed in claim 3, Features: The LED assembly (3) comprises an LED light board (301), and four U-shaped card boards (302) are fixedly mounted on the upper surface of the LED light board (301).

5. An electrolytic capacitor patch mechanism for detecting a Micro LED module as claimed in claim 4, Features: The mounting assembly (4) comprises a vertical circular column (401), the vertical circular column (401) is fixedly mounted on the circuit carrier board (1), a circular sleeve frame (402) is slidably sleeved on the outer side of the vertical circular column (401), and the mounting assembly (4) also comprises four evenly distributed U-shaped guide plates (403), the U-shaped guide plates (403) are fixedly mounted on the circuit carrier board (1), a limit plug plate (404) is slidably connected inside the U-shaped guide plates (403), and the inner end of the limit plug plate (404) is slidably sleeved with the circular sleeve frame. The side of (402) is movably connected by connecting oblique rods (405), a positioning hole (406) is provided on the circular sleeve (402), a horizontal column (407) is fixedly installed inside the circular sleeve (402), a movable slide plate (408) is slidably sleeved on the outer side of the horizontal column (407), a return spring (409) is sleeved on the outer surface of the horizontal column (407) and located on the right side of the movable slide plate (408), and a positioning column (410) adapted to the positioning hole (406) is fixedly installed on the movable slide plate (408).

6. An electrolytic capacitor patch mechanism for detecting a Micro LED module as claimed in claim 5, Features: The top end of the connecting oblique rod (405) is rotatably matched with the side surface of the circular sleeve frame (402) via a hinge seat, and the bottom end of the connecting oblique rod (405) is rotatably matched with the inner end of the limiting plug plate (404) via another hinge seat.

7. An electrolytic capacitor patch mechanism for detecting a Micro LED module as claimed in claim 6, Features: The movable slide plate (408) is provided with a through hole matched with the horizontal column (407), the horizontal column (407) passes through the through hole on the movable slide plate (408), and the horizontal column (407) and the through hole on the movable slide plate (408) are used in conjunction with each other.

8. An electrolytic capacitor patch mechanism for detecting a Micro LED module as claimed in claim 7, Features: The positioning column (410) is inserted into the corresponding positioning hole (406), and the positioning column (410) and the positioning hole (406) are used in conjunction with each other. A pulling plate (411) is fixedly mounted on the movable slide plate (408).

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