High-temperature test oven for testing semiconductor photovoltaic diode

Abstract

The invention relates to the technical field of semiconductor testing, in particular to a high-temperature test oven for testing a semiconductor photovoltaic diode, which comprises a test station, an indexing driving assembly, a transfer assembly and a thermal test assembly, a vibrating disk feeder, a visual inspection mechanism, a thermal test assembly and a blanking box are sequentially arranged on the surface of the test station in the rotating direction of the indexing driving assembly, and a test system is arranged in the test station. The thermal test assembly is provided with a plurality of heating areas, each area is provided with a thermocouple heater, the heating power of each area can be independently controlled, and gradual temperature rise of the semiconductor element is achieved. Non-contact heating is carried out through the heat radiation sliding groove, heat radiation is conducted to the surface of the semiconductor element through the high-temperature-resistant material, the element is evenly heated in the testing process, element damage or testing errors caused by direct contact are effectively avoided, and the uniformity and safety of the heating process are ensured.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor testing, in particular to a high-temperature test oven for testing semiconductor photovoltaic diodes. Background Art

[0002] In the production and testing process of semiconductor photovoltaic diodes and other components, ensuring their stable performance and reliability is one of the key links. Traditional semiconductor testing equipment usually relies on manual or semi-automatic operation, and the testing process involves multiple workstations, such as loading, transporting, inspection and heating testing. However, existing semiconductor testing equipment has many defects in structure and workflow, which makes it difficult to meet the needs of efficient and accurate testing.

[0003] First, the heating test of traditional equipment usually adopts contact heating method, which can easily damage the surface of semiconductor components and affect their performance. At the same time, due to the uneven heating power, the components are heated unevenly during the test, which in turn causes test errors and cannot accurately reflect the true performance of the components. In addition, the heating control of traditional equipment is usually a unified heating power adjustment, which makes it difficult to achieve independent control of each area, especially in scenarios where the test requires gradual temperature increase, it is often difficult to ensure uniform heating of the components. In addition, data acquisition often has a lag, and it is impossible to monitor the performance changes of components under different temperature conditions in real time, resulting in insufficient data accuracy and real-time performance, affecting subsequent performance analysis and quality control.

[0004] Traditional semiconductor testing equipment usually relies on manual loading and transportation, with low indexing accuracy, and is prone to component deviation or misalignment during transportation, affecting the testing process of subsequent stations. In addition, due to the low degree of equipment automation, frequent manual intervention, low operating efficiency, and easy to make operating errors, the risk of component damage is increased.

[0005] In view of this, research and improvement are carried out on the existing problems, and a high-temperature test oven for semiconductor photovoltaic diode testing is provided to solve the current problems. The purpose is to solve the problems and improve the practical value through this technology. Summary of the invention

[0006] The present invention aims to solve the technical problems existing in the prior art or related technology.

[0007] To this end, the technical solution adopted by the present invention is: a high-temperature test oven for testing semiconductor photovoltaic diodes, comprising: a test station, a graduation drive assembly, a transfer assembly and a thermal test assembly, the surface of the test station is arranged with a vibrating disk feeder, a visual inspection mechanism, a thermal test assembly and a discharge box in sequence along the rotation direction of the graduation drive assembly, and a test system is provided inside the test station.

[0008] In a preferred example, the present invention can be further configured as follows: the indexing drive assembly includes an indexing electric spindle and an axis disk rack, a plurality of transfer assemblies are fixedly mounted on the surface of the axis disk rack, and the axis disk rack is driven to perform precise indexing rotation, and the indexing electric spindle drives the axis disk rack to rotate along a certain angle to ensure the sequential transfer of semiconductor components between multiple workstations. Through this configuration, the present invention can accurately transfer semiconductor components to each workstation in sequence, avoid deviation or misalignment of components during the transmission process, and ensure the continuity and accuracy of the test process.

[0009] In a preferred example, the present invention can be further configured as follows: the transport component includes a driving rod and a needle aspirator, the needle aspirator grabs the semiconductor component by vacuum adsorption, and under the action of the indexing driving component, transfers the semiconductor component from the vibrating plate feeder to the visual inspection mechanism, thermal test component and other stations. This configuration realizes the automatic transport of semiconductor components, improves the accuracy and safety of transport by vacuum adsorption, reduces manual operation, and improves work efficiency.

[0010] In a preferred example, the present invention can be further configured as follows: the surface of the needle aspirator is provided with a sensor switch fixed to the surface of the shaft disc frame, which is used to monitor the action of the driving rod in real time when the driving rod drives the needle aspirator to move up and down, and control the operation of the electric control valve to perform the adsorption and release actions of the semiconductor component, and realize automatic adsorption and release by controlling the on and off of the adsorption vacuum, and the port of the electric control valve is connected to a vacuum pump. This design monitors the adsorption state in real time through the sensor, ensures the accurate grasping and placement of the component, and controls the opening and closing of the vacuum adsorption at the same time, realizes the automatic adsorption and release process, and improves the safety and accuracy of the test.

[0011] In a preferred example, the present invention can be further configured as follows: after the bottom end of the driving rod is engaged with the top connecting hole of the needle tube, the electric control valve automatically opens to realize the negative pressure effect to adsorb the semiconductor, and drives the needle aspirator to move up and down, fit the semiconductor surface, and complete the adsorption action of the component; during the upward movement of the driving rod, once the connector sleeve is separated from the top of the needle tube, the connecting hole flows into the external airflow to release the semiconductor, completing the placement operation. The present invention ensures the safety and accuracy of the components during transportation and placement through the automated design of adsorption and release, reduces operational errors, and improves the reliability of the entire test system.

[0012] In a preferred example, the present invention can be further configured as follows: the heat radiation slide is an arc-shaped structure, and its center is located on the axis of the indexing electric spindle. The inner surface of the heat radiation slide is made of high-temperature resistant material, which is used to conduct heat radiation to the surface of the semiconductor element to achieve contactless heating; the surface of the heat radiation slide is provided with a plurality of heating areas, and the surfaces of the plurality of heating areas are arranged with thermocouple heaters, which can independently control the heating power of each area, so that the element is evenly heated during the gradual heating process. Through contactless heating and independent control of heating power by partition, the semiconductor element can maintain a uniform temperature during the heating process, avoiding damage caused by contact heating, and improving the accuracy of the test.

[0013] In a preferred example, the present invention can be further configured as follows: each heating area is provided with an electrode test seat for measuring the resistivity or other performance parameters of the semiconductor element at different temperatures, and the test data is transmitted to the data acquisition system in real time through the information collector. This configuration can monitor and record the performance parameters of the semiconductor element at different temperatures in real time, ensuring the real-time and accuracy of the data, and providing a reliable basis for subsequent performance analysis.

[0014] In a preferred example, the present invention can be further configured as follows: the needle aspirator is composed of a needle tube, a limit sleeve, and a reset spring. A connecting hole is provided at the top of the needle tube. The needle tube is elastically reset by the reset spring. The limit sleeve is used to limit the range of motion of the needle tube. The electric control valve controls the on and off of the vacuum, thereby achieving the adsorption and release of the semiconductor element. This design ensures the stability and repeatability of the adsorption device when grasping and releasing the element through the cooperation of the limit device and the reset spring, avoids errors caused by improper movement, and further improves the reliability and accuracy of the test system.

[0015] The beneficial effects achieved by the present invention are: 1. In the present invention, the thermal test assembly is equipped with multiple heating areas, each of which is equipped with a thermocouple heater, which can independently control the heating power of each area to achieve gradual heating of the semiconductor element. Non-contact heating is performed through the thermal radiation slide, and the high-temperature resistant material conducts heat radiation to the surface of the semiconductor element, so that the element is evenly heated during the test, effectively avoiding component damage or test errors caused by direct contact, and ensuring the uniformity and safety of the heating process.

[0016] 2. In the present invention, the resistivity or other performance parameters of the semiconductor element are measured under different temperature conditions through the electrode test socket, and the test data are transmitted to the data acquisition system in real time through the information collector, thereby ensuring the real-time and accuracy of the test data and providing a reliable basis for analyzing the performance of the semiconductor element.

[0017] 3. In the present invention, the automatic loading, transportation, detection and heating test of semiconductor photovoltaic diodes are realized through the coordinated work of the indexing drive component, the transfer component and the thermal test component. The indexing drive component can accurately drive the transfer component to perform indexing rotation, ensure the sequential transfer of semiconductor components between each station, effectively avoid deviation or misalignment of components during the transmission process, reduce manual intervention, and greatly improve the automation and work efficiency of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 A schematic diagram of the structure of an indexing drive assembly according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of an indexing drive assembly and a transfer assembly according to an embodiment of the present invention; Figure 4 A schematic diagram of the surface structure of a test station according to an embodiment of the present invention; Figure 5 A schematic diagram of the structure of a thermal test assembly according to an embodiment of the present invention; Figure 6 A schematic diagram of the exploded structure of a transfer assembly according to an embodiment of the present invention; Figure 7 The figure is a schematic diagram of the structure of a needle aspirator according to an embodiment of the present invention.

[0019] Reference numerals: 100. Testing station; 110. Vibrating plate feeder; 120. Visual inspection mechanism; 130. Testing system; 140. Feeding box; 200, indexing drive assembly; 210, indexing electric spindle; 220, shaft disc frame; 300, transport assembly; 310, driving rod; 320, needle aspirator; 330, sensor switch; 311, electric control valve; 312, connector sleeve; 321, limit sleeve seat; 322, needle tube; 323, reset spring; 324, connecting hole; 400, thermal test assembly; 410, thermal radiation slide; 420, electrode test seat; 411, information collector. DETAILED DESCRIPTION

[0020] To make the purpose, technical solution and advantages of the present invention more clear, the present invention is further described in detail below in combination with specific implementations and with reference to the accompanying drawings. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0021] It is to be understood that these descriptions are exemplary only and are not intended to limit the scope of the invention.

[0022] A high temperature test oven for testing semiconductor photovoltaic diodes provided by some embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0023] Implementation method 1: like Figures 1 to 7 As shown, the high temperature test oven of the present invention comprises a test station 100 , an indexing drive assembly 200 , a transport assembly 300 and a thermal test assembly 400 .

[0024] Test Station 100 The test station 100 is a working platform of the equipment, and a vibration plate feeder 110, a visual inspection mechanism 120, a thermal test assembly 400 and a material box 140 are arranged on its surface in sequence along the rotation direction of the indexing drive assembly 200. The vibration plate feeder 110 is used for automatic material loading, and the visual inspection mechanism 120 is used for pre-inspection of semiconductor components. A test system 130 is provided inside the test station 100 for controlling the operation process of the equipment and collecting test data.

[0025] Indexing drive assembly 200 The indexing drive assembly 200 includes an indexing electric spindle 210 and an axis disk rack 220. A plurality of transfer assemblies 300 are fixedly mounted on the surface of the axis disk rack 220, and the indexing electric spindle 210 drives the axis disk rack 220 to perform indexing rotation to ensure accurate transfer of semiconductor components between various workstations. The indexing electric spindle 210 drives the axis disk rack 220 to rotate along a preset angle to ensure sequential transfer of semiconductor components between various workstations, and to avoid deviation or misalignment of components during the transmission process.

[0026] Transfer Components 300 The transport assembly 300 is composed of a driving rod 310 and a needle aspirator 320. The needle aspirator 320 grabs the semiconductor component by negative pressure adsorption, and under the action of the indexing driving assembly 200, gradually transfers it from the vibrating disk feeder 110 to the visual inspection mechanism 120, the thermal testing assembly 400 and other stations for processing. After the bottom end of the driving rod 310 is engaged with the connecting hole 324 at the top of the needle tube 322, the negative pressure adsorption is started to realize the adsorption action of the component, and the handling and placement operation of the component is completed by up and down movement. The sensor switch 330 is used to monitor the telescopic movement of the driving rod 310 and control the opening and closing action of the electric control valve 311 to realize the adsorption and release process, ensuring accurate adsorption and placement.

[0027] Thermal Test Assembly 400 The surface of the thermal test assembly 400 is provided with a thermal radiation slide 410 and a plurality of electrode test seats 420. The semiconductor element is sent to the thermal radiation slide 410 for heating treatment through the transfer assembly 300. The thermal radiation slide 410 is an arc-shaped structure, and its inner surface is made of high-temperature resistant material. The thermal radiation is evenly conducted to the surface of the semiconductor element by non-contact heating. During the heating process, each heating area is equipped with an independently controlled thermocouple heater to ensure the uniformity and accuracy of the heating. The electrode test seat 420 is used to measure the resistivity or other performance parameters of the semiconductor element under different temperature conditions. The measurement data is transmitted to the data acquisition system in real time through the information collector 411 for performance analysis.

[0028] Working process The vibrating disk feeder 110 first automatically loads the semiconductor components to the indexing drive assembly 200. The indexing drive assembly 200 drives the needle aspirator 320 in the transfer assembly 300 to vacuum absorb the components and gradually deliver them to each station. The visual inspection mechanism 120 is used to perform preliminary inspections on the components to ensure that the components meet the test conditions. Subsequently, the transfer assembly 300 delivers the components to the thermal test assembly 400 for contactless heating through the thermal radiation slide 410. The temperature and performance parameters during the heating process are measured through the electrode test seat 420 and transmitted to the control system in real time through the information collector 411 for recording and analysis. The entire test process has a high degree of automation to ensure test accuracy and efficiency.

[0029] Implementation method 2: Another embodiment of the present invention optimizes the cooperation efficiency of each component on the basis of the above. By improving the transmission structure between the indexing drive assembly 200 and the transfer assembly 300, the accuracy of the indexing rotation is further improved, ensuring that the transmission of components between each station is more accurate. At the same time, the heating efficiency of the thermal test assembly 400 is optimized, and through a more accurate temperature control algorithm, more detailed temperature zoning control can be achieved, so that the semiconductor components are heated more evenly during the gradual heating process, further improving the accuracy and reliability of the test.

[0030] The working principle and use process of the present invention: When the test starts, the vibrating plate feeder 110 automatically feeds the semiconductor components into the system. The components enter the transmission path controlled by the indexing drive assembly 200, and through precise indexing rotation, the components are sequentially transferred to each test station. The entire loading process does not require manual intervention and is automatically completed by the system.

[0031] The transfer assembly 300 is responsible for transferring semiconductor components from the vibrating disk feeder 110 to each test station. During this process, the drive rod 310 drives the needle aspirator 320 to vacuum the components and move up and down according to the system instructions to deliver the components to each test position. During transportation, the drive rod 310 is in the engaged state with the connecting hole 324 through the bottom joint sleeve 312, and its position and adsorption state are monitored by the sensor switch 330, and after moving to the top of the visual inspection mechanism 120, the electrode test seat 420 and the unloading box 140, it is automatically released by the retreat of the drive rod 310 to ensure the stability and accuracy of the components during transportation.

[0032] After the component is transferred to the visual inspection mechanism 120, the system performs a pre-inspection on it to check whether the component meets the test requirements. If the component meets the conditions, it will continue to be transferred to the next station for heating test; if it does not meet the requirements, the system will send an abnormal signal for processing.

[0033] The component is sent to the thermal testing component 400 through the transfer component 300. At this station, the component is heated in a contactless manner along the heat radiation slide 410. During the heating process, heat is conducted to the surface of the component through the high-temperature material, and each heating area is controlled by an independent heating device to ensure uniform heating. Through zoning control, the heating power can be gradually adjusted according to the test requirements to ensure that the components are heated evenly during the heating process and avoid damage or errors caused by temperature differences. During the heating process, the electrode test seat 420 in different heating areas measures the resistivity or other performance parameters of the component, and the test data is transmitted to the system in real time through the information collector 411 for recording and analysis. The test system can collect the performance data of the component under different temperature conditions, and determine its electrical characteristics at high temperature through analysis, providing reliable performance evaluation.

[0034] After the test is completed, the components are transferred to the unloading box 140 for unloading. The system automatically classifies and stores the tested components, and stores all the test data in the system database for subsequent analysis and optimization.

[0035] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0036] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A high temperature test oven for testing semiconductor photovoltaic diodes, characterized in that: The invention comprises a test station (100), a graduation drive assembly (200), a transfer assembly (300) and a thermal test assembly (400); a vibration plate feeder (110), a visual inspection mechanism (120), a thermal test assembly (400) and a feed box (140) are arranged in sequence on the surface of the test station (100) along the rotation direction of the graduation drive assembly (200); a test system (130) is arranged inside the test station (100); The indexing drive assembly (200) comprises an indexing electric spindle (210) and a shaft disc frame (220); a plurality of transfer assemblies (300) are fixedly mounted on the surface of the shaft disc frame (220) and driven to perform precise indexing rotation; the indexing electric spindle (210) drives the shaft disc frame (220) to index and rotate along a certain angle, thereby ensuring sequential transfer of semiconductor components between multiple workstations; A heat radiation slideway (410) and a plurality of electrode test seats (420) are provided on the surface of the thermal test assembly (400); an output end of the electrode test seat (420) is electrically connected to an information collector (411); the semiconductor element is transported to the heat radiation slideway (410) through the transport assembly (300) and moves along the inside of the heat radiation slideway (410) to be heated by heat radiation.

2. A high temperature test oven for semiconductor photovoltaic diode testing according to claim 1, characterized in that: The testing station (100) is provided with a testing system (130) inside, which is used to control the operation process of the entire device and collect test data.

3. A high temperature test oven for semiconductor photovoltaic diode testing according to claim 1, characterized in that: The transfer assembly (300) comprises a drive rod (310) and a needle aspirator (320); the needle aspirator grasps the semiconductor element by vacuum adsorption and, under the action of the indexing drive assembly (200), transfers the semiconductor element from the vibration plate feeder (110) to the workstations of the visual inspection mechanism (120) and the thermal test assembly (400).

4. A high temperature test oven for semiconductor photovoltaic diode testing according to claim 3, characterized in that: The surface of the needle aspirator (320) is provided with a sensor switch (330) fixed to the surface of the shaft disc frame (220), which is used to monitor the movement of the driving rod (310) in real time when the driving rod (310) drives the needle aspirator (320) to move up and down, and control the operation of the electric control valve (311) to perform adsorption and release actions of the semiconductor element, and realize automatic adsorption and release by controlling the on and off of the adsorption vacuum. The bottom end of the electric control valve (311) is fixedly connected to a joint sleeve (312), and the port of the electric control valve (311) is connected to a vacuum pump.

5. A high temperature test oven for semiconductor photovoltaic diode testing according to claim 4, characterized in that: After the bottom end of the driving rod (310) is engaged with the top connecting hole (324) of the needle tube (322), the electric control valve (311) is automatically opened to realize the negative pressure effect to adsorb the semiconductor, and drive the needle aspirator (320) to move up and down to fit the semiconductor surface to complete the adsorption action of the component; during the upward movement of the driving rod (310), once the joint sleeve (312) is separated from the top of the needle tube (322), the connecting hole (324) flows with external airflow to release the semiconductor, completing the placement operation.

6. A high temperature test oven for semiconductor photovoltaic diode testing according to claim 4, characterized in that: The needle aspirator (320) is composed of a needle tube (322), a limiting sleeve (321), and a reset spring (323); a communicating hole (324) is provided at the top end of the needle tube (322); the needle tube (322) is elastically reset by means of the reset spring (323); the limiting sleeve (321) is used to limit the range of motion of the needle tube (322); and the electric control valve (311) controls the on and off of the vacuum, thereby achieving adsorption and release of the semiconductor element.

7. A high temperature test oven for semiconductor photovoltaic diode testing according to claim 1, characterized in that: The heat radiation slideway (410) is an arc-shaped structure, and its center is located on the axis of the indexing electric spindle (210). The inner surface of the heat radiation slideway (410) is made of high-temperature resistant material and is used to conduct heat radiation to the surface of the semiconductor element to achieve contactless heating. The surface of the heat radiation slideway (410) is provided with a plurality of heating areas, and each heating area is arranged with a thermocouple heater, which can independently control the heating power of each area, so that the element is evenly heated during the gradual heating process.

8. A high temperature test oven for semiconductor photovoltaic diode testing according to claim 7, characterized in that: Each heating area is provided with an electrode test seat (420) for measuring the resistivity or other performance parameters of the semiconductor element at different temperatures, and the test data is transmitted to the data acquisition system in real time via the information collector (411).

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