Identification method and electronic device

Abstract

The present application provides an identification method and electronic device, and relates to the technical field of electronic devices. The method includes: obtaining a voltage signal output after the identification circuit is coupled to the type identification module package of the PCB to be identified, the circuit structure of the type identification module package of different types of PCBs is different, and determining the type of the PCB to be identified based on the voltage signal and classification data information, and the classification data information includes the corresponding relationship between the voltage signal output by the identification circuit and the PCB type. The present application aims to improve the problem that the PCB type cannot be accurately identified due to the mixing of PCBs from different suppliers.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular, to an identification method and electronic device. Background Art

[0002] In the manufacturing process of electronic equipment, there may be multiple suppliers of printed circuit boards (PCBs) used in motherboards, in order to meet requirements such as supply chain stability and cost control.

[0003] There may be differences in the performance of PCBs provided by different suppliers, so mixing PCBs from different suppliers will result in poor consistency in the RF indicators of the produced electronic equipment. Summary of the invention

[0004] The embodiments of the present application provide an identification method and an electronic device for improving the problem that the type of PCB cannot be accurately identified due to mixing PCBs from different suppliers.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In the first aspect, an embodiment of the present application provides an identification method, the method comprising: obtaining a voltage signal output after the identification circuit is coupled to the type identification module package of the PCB to be identified, the circuit structure of the type identification module package of different types of PCBs is different, and determining the type of the PCB to be identified based on the voltage signal and classification data information, the classification data information including the correspondence between the voltage signal output by the identification circuit and the PCB type.

[0007] The identification method provided by the present application can efficiently identify the specific type of the PCB to be identified by analyzing the voltage signal output after the identification circuit is coupled to the PCB type identification module package, and combining it with the matching relationship between the pre-stored classification data information. By comparing the voltage signal obtained in real time with the existing classification data, the most suitable type can be determined. Not only the speed of identification is improved, but also the accuracy is significantly improved, the need for human intervention is reduced, and the production process is optimized.

[0008] In a possible implementation of the first aspect, the PCB includes a first type identification module package, the identification circuit includes a power supply end, multiple voltage divider devices and a first output end, the voltage signal includes a first voltage signal, and the classification data information includes first classification data information. After the first type identification module packages of different types of PCBs are coupled to the identification circuit, the connection relationship between the power supply end, the first output end and the multiple voltage divider devices is different. Acquiring the voltage signal output after the identification circuit is coupled to the type identification module package of the PCB to be identified includes: acquiring the first voltage signal output from the first output end after the identification circuit is coupled to the first type identification module package; determining the type of the PCB to be identified based on the voltage signal and the classification data information, including: determining the type of the PCB to be identified based on the first voltage signal and the first classification data information, the first classification data information including the correspondence between the first voltage signal output by the identification circuit and the PCB type.

[0009] In a possible implementation of the first aspect, the PCB includes a first type identification module package and a second type identification module package, the identification circuit includes a power supply terminal, a plurality of voltage divider devices, a first output terminal and a second output terminal, the voltage signal includes a first voltage signal and a second voltage signal, and the classification data information includes a second classification data information. After the first type identification module packages of different types of PCBs are coupled to the identification circuit, the connection relationship between the power supply terminal, the first output terminal and a plurality of first voltage divider devices in the plurality of voltage divider devices is different. After the second type identification module packages of different types of PCBs are coupled to the identification circuit, the connection relationship between the power supply terminal, the second output terminal and a plurality of second voltage divider devices in the plurality of voltage divider devices is different. Acquiring the voltage signal output after the identification circuit is coupled to the type identification module package of the PCB to be identified includes: acquiring the first voltage signal output from the first output terminal after the identification circuit is coupled to the first type identification module package and the second type identification module package, and the second voltage signal output from the second output terminal. Determining the type of the PCB to be identified according to the voltage signal and the classification data information includes:

[0010] The type of the PCB to be identified is determined according to the first voltage signal, the second voltage signal and the second classification data information, wherein the second classification data information includes the correspondence between the first voltage signal output by the identification circuit, the second voltage signal and the PCB type.

[0011] In a possible implementation of the first aspect, after determining the type of the PCB to be identified based on the voltage signal and the classification data information, the method further includes: determining the RF compensation parameters of the PCB to be identified based on the type of the PCB to be identified and the parameter matching data information, the parameter matching data information including the correspondence between the PCB type and the RF compensation parameters, and adjusting the RF parameters of the PCB to be identified based on the RF compensation parameters.

[0012] In the above scheme, based on the identified PCB type, compensation parameters matching the type of PCB can be found, and through the compensation parameters, RF compensation can be performed on the identified PCB to adjust the performance deviation of the electronic device caused by mixing different types of PCBs, so that even when different types of PCBs are mixed, the RF performance of the electronic device can maintain a high consistency.

[0013] In a second aspect, the present application provides an electronic device, which includes a processing circuit and an identification circuit. The processing circuit is coupled to the identification circuit, and the processing circuit is configured to: obtain a voltage signal output after the identification circuit is coupled to a type identification module package of a PCB to be identified, the circuit structure of the type identification module package of different types of PCBs is different, and the type of the PCB to be identified is determined based on the voltage signal and classification data information, the classification data information includes the correspondence between the voltage signal output by the identification circuit and the PCB type, and the radio frequency parameters of the PCB to be identified are adjusted according to the type of the PCB to be identified.

[0014] In a possible implementation of the second aspect, the PCB includes a first type identification module package, the identification circuit includes a power supply end, multiple voltage divider devices and a first output end, the voltage signal includes a first voltage signal, and the classification data information includes first classification data information. After the first type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply end, the first output end and the multiple voltage divider devices is different. The processing circuit is specifically configured to: obtain the first voltage signal output by the first output end after the identification circuit is coupled to the first type identification module package, and determine the type of the PCB to be identified based on the first voltage signal and the first classification data information. The first classification data information includes the correspondence between the first voltage signal output by the identification circuit and the PCB type.

[0015] In a possible implementation of the second aspect, the PCB includes a first type identification module package and a second type identification module package, the identification circuit includes a power supply end, multiple voltage divider devices, a first output end and a second output end, the voltage signal includes a first voltage signal and a second voltage signal, and the classification data information includes second classification data information. After the first type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply end, the first output end and multiple first voltage divider devices among the multiple voltage divider devices is different; after the second type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply end, the second output end and multiple second voltage divider devices among the multiple voltage divider devices is different. The processing circuit is specifically configured to: obtain a first voltage signal output from the first output end after the identification circuit is coupled to the first type identification module package and the second type identification module package, and a second voltage signal output from the second output end; determine the type of the PCB to be identified according to the first voltage signal, the second voltage signal and the second classification data information; the second classification data information includes the correspondence between the first voltage signal, the second voltage signal output by the identification circuit and the PCB type.

[0016] In a possible implementation of the second aspect, the processing circuit is further configured to: determine the RF compensation parameters of the PCB to be identified based on the type of the PCB to be identified and the parameter matching data information, the parameter matching data information including the correspondence between the PCB type and the RF compensation parameters, and adjust the RF parameters of the PCB to be identified based on the RF compensation parameters.

[0017] In a third aspect, the present application provides a computer-readable storage medium, comprising computer instructions; when the computer instructions are executed on an electronic device, the electronic device executes a method in any possible implementation manner of the first aspect described above.

[0018] In a fourth aspect, the present application provides a computer program product. When the computer program product is run on an electronic device, the electronic device executes a method as any possible implementation method of the first aspect.

[0019] Among them, the technical effects of the second to fourth aspects refer to the technical effects of the first aspect and any of its embodiments, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of communication interaction of an electronic device provided in an embodiment of the present application;

[0021] Figure 2 A schematic diagram of the steps of the identification method provided in the embodiment of the present application;

[0022] Figure 3A schematic diagram of a circuit structure of a type identification module package provided in an embodiment of the present application;

[0023] Figure 4 A schematic diagram of another circuit structure of a type identification module package provided in an embodiment of the present application;

[0024] Figure 5 A schematic diagram of another circuit structure of a type identification module package provided in an embodiment of the present application;

[0025] Figure 6 A schematic diagram of another circuit structure of a type identification module package provided in an embodiment of the present application;

[0026] Figure 7 A circuit diagram of an identification circuit provided in an embodiment of the present application;

[0027] Figure 8 A schematic diagram of coupling between an identification circuit and a type identification module package provided in an embodiment of the present application;

[0028] Fig. 9 A schematic diagram of coupling between another identification circuit and type identification module package provided in an embodiment of the present application;

[0029] Fig.10 A coupling diagram of another identification circuit and type identification module package provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] The terms used in the following embodiments are only for the purpose of describing specific embodiments, and are not intended to be used as limitations to the present application. As used in the specification and appended claims of the present application, the singular expressions "one", "a kind of", "above", "the" and "this" are intended to also include, for example, "one or more" such expressions, unless there is an explicit contrary indication in the context. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" refer to one or more than two (including two). The character " / " generally represents that the front and back associated objects are a kind of "or" relationship.

[0031] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0032] In the following, the terms "first", "second", etc. are used only for convenience of description and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more. For example, a plurality of processing circuits refers to two or more processing circuits.

[0033] In addition, in the embodiments of the present application, "upper", "lower", "left" and "right" are not limited to being defined relative to the orientation of the components schematically placed in the drawings. It should be understood that these directional terms can be relative concepts, which are used for description and clarification relative to the components, and can change accordingly according to the change in the orientation of the components placed in the drawings. In the drawings, for the sake of clarity, the thickness of the layers and regions is exaggerated, and the size ratio relationship between the parts in the drawings does not reflect the actual size ratio relationship.

[0034] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. In addition, the term "electrical connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium.

[0035] In the embodiments of the present application, the term "module" is generally a functional structure divided according to logic, and the "module" can be implemented by pure hardware, or by a combination of software and hardware. In the embodiments of the present application, "and / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, B exists alone, and A and B exist at the same time.

[0036] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0037] Before formally introducing the embodiments of the present application, the electronic device provided by the embodiments of the present application and the problems existing in the technology of the manufacturing process of the existing electronic device are introduced in conjunction with the accompanying drawings, wherein: Figure 1 This is a schematic diagram of the communication interaction of the electronic device of this application. Figure 1 The following illustrates the application scenarios of electronic devices communicating in various embodiments of the present application. Figure 1As shown, the electronic device 110 provided in the present application can communicate with the network device 120. In particular, both the electronic device 110 and the network device 120 support the reception and transmission of millimeter waves, so that the electronic device 110 can communicate with the network device 120 or other electronic devices through millimeter waves. When the electronic device 110 and the network device 120 are communicating with each other through millimeter waves, the communication performed by the network device 120 sending a signal ② to the electronic device 110 is called downlink (DL) communication, and the communication performed by the electronic device 110 sending a signal ① to the network device 120 is called uplink (UL) communication. For example, in the case Figure 1 In the scenario shown, the electronic device 110 may be a mobile phone that supports 5G communication, and the network device 120 may be a 5G base station, so that communication can be performed between the mobile phone and 5G.

[0038] The present application is described below by taking the electronic device 110 as a mobile phone as an example. In order to meet the requirements of supply chain stability and cost control, the PCB materials required for the production of mobile phone motherboards may come from different suppliers. However, even if the suppliers use the same design files in the production process, due to the differences in the materials used, production equipment and other factors, the final PCB produced will still have certain differences in performance. In addition, in the process of producing mobile phones, all PCBs provided by suppliers share the same material code, will not be distinguished, and use the same set of configuration parameters, so the performance differences of PCBs will lead to poor consistency of RF indicators of the produced mobile phones. RF indicators may include transmission power and receiving sensitivity, etc.

[0039] In order to improve the problem of poor consistency of RF indicators in the production of mobile phones due to the inability to accurately identify the type of PCBs when mixing PCBs from different suppliers, RF calibration can be performed before production to compensate for the deviation caused by PCB differences. The main purpose of RF calibration is to ensure that the performance of RF equipment under actual working conditions meets the design specifications and industry standards, and to avoid problems such as signal distortion, power deviation, and frequency drift.

[0040] However, RF calibration is not applicable in all scenarios. For some scenarios where RF calibration is not required due to cost reasons or insufficient test environment, the problem of poor consistency of RF indicators of mobile phones produced by mixing PCBs from different suppliers can be improved by sacrificing the RF performance of mobile phones with better RF indicators.

[0041] As an example, the production process and configuration parameters of mobile phone A (produced using PCB from supplier A) and mobile phone B (produced using PCB from supplier B) are exactly the same, but the scattering parameters of mobile phone A and mobile phone B are different, so the RF indicators of mobile phone A and mobile phone B are also different. Refer to Table 1, which uses the RF indicator as the transmission power for explanation. Since the scattering parameters of mobile phone A and mobile phone B are different, the transmission power of mobile phone A and mobile phone B on different Wi-Fi channels is also different, and the RF indicator of mobile phone A is better than that of mobile phone B. Therefore, mobile phone B can be used as a design constraint, and production with the configuration parameters of mobile phone B can make the RF performance of mobile phone B reach the optimal value, but the RF performance of mobile phone A cannot be made to reach the optimal value, so the RF performance of mobile phone A will be sacrificed.

[0042] Table 1

[0043]

[0044] It can be seen that in the scenario where RF calibration is not performed, since the type of PCB cannot be accurately identified, the RF indicators of electronic devices with poor RF indicators need to be used as design constraints to ensure that all electronic devices have consistent RF indicators, but the RF performance of electronic devices with better RF indicators needs to be sacrificed.

[0045] To solve the above problems, see Figure 2 , an embodiment of the present application provides an identification method, the identification method comprising:

[0046] S201: Acquire a voltage signal outputted after the identification circuit is packaged and coupled with the type identification module of the PCB to be identified.

[0047] The identification circuit is used to couple with the type identification module package of the PCB to be identified to form a loop. The identification circuit can be set on the robot arm of the production line. After the identification circuit is coupled with the type identification module package of the PCB, a voltage signal is output to the processing circuit. Different types of PCBs form different loops after coupling with the identification circuit, so the voltage signal output by the identification circuit will also be different.

[0048] S202: Determine the type of the PCB to be identified according to the voltage signal and the classification data information.

[0049] The classification data information stores the correspondence between the voltage signal output by the identification circuit and the PCB type. Therefore, after receiving the voltage signal sent by the identification circuit, the processing circuit can use the voltage signal as a search basis to search for the PCB type matching the voltage signal in the classification data information, thereby determining the specific type of the connected PCB to be identified. The classification data information can store the correspondence between the voltage signal and the PCB type.

[0050] The identification method provided in the embodiment of the present application can efficiently identify the specific type of the PCB to be identified by analyzing the voltage signal output after the identification circuit is packaged and coupled with the PCB type identification module to be identified, combined with the matching relationship between the pre-stored classification data information. This not only improves the speed of identification, but also significantly improves the accuracy, reduces the need for human intervention, and optimizes the production process.

[0051] When determining the structure of the type identification module package of the PCB, a flag bit can be assigned to each type, and operations such as punching, cutting or etching can be performed at the flag bit to disconnect the originally conductive circuit, so that the circuit structures of different type identification module packages are different.

[0052] By way of example, PCB types include Type A, Type B, Type C, and Type D. Figure 3 The schematic diagram of the circuit structure of the type identification module package shown in FIG. 1 shows that type A punches a hole at the mark position a. After punching, the circuit where the mark position a is located is in a disconnected state. The schematic diagram of the circuit structure after punching is as shown in FIG. Figure 4 Type B punches a hole at the flag bit b. After punching, the line where the flag bit b is located is in a disconnected state. The schematic diagram of the line structure after punching is as follows Figure 5 Type C punches a hole in the flag position c. After punching, the line where the flag position c is located is in a disconnected state. The schematic diagram of the line structure after punching is as follows Figure 6 Type D punches a hole at the flag position d. After punching, the line where the flag position d is located is in a disconnected state. Since there is no line in the area where the flag position d is located, the schematic diagram after punching is still as shown in FIG. Figure 3 shown.

[0053] According to the number of PCB types, the identification circuit can be implemented in multiple ways. In one possible implementation, the identification circuit may include a power supply terminal, multiple voltage divider devices and a first output terminal. After the first modules of different types of PCBs are coupled to the identification circuit, the connection relationships between the power supply terminal, the first output terminal and the multiple voltage divider devices are different. At this time, the voltage signal output by the identification circuit is one.

[0054] For example, see Figure 7 The identification circuit shown in the figure, the voltage divider device can be a resistor, and the identification circuit includes a power supply terminal V io , resistor R1, resistor R2 and output terminal V out , see Figure 8 The coupling diagram of the identification circuit and the type identification module package of the PCB to be identified is shown in FIG. After the voltage is obtained at the power supply end, the output end V outOutput the corresponding first voltage signal. After receiving the first voltage signal, the processing circuit searches the first classification data information for the PCB type that matches the first voltage signal according to the first voltage signal, thereby determining the type corresponding to the connected PCB to be identified.

[0055] As an example, the PCB types include type A, type B, type C, and type D. When the first voltage signal is GND, according to the correspondence between the first voltage signal and the PCB type, it can be determined that the PCB to be identified is type A. When the first voltage signal is suspended, according to the correspondence between the first voltage signal and the PCB type, it can be determined that the PCB to be identified is type B. When the first voltage signal is V io When the first voltage signal is 0.5V, the PCB to be identified can be determined to be type C according to the correspondence between the first voltage signal and the PCB type. io When the PCB to be identified is of type D, it can be determined according to the correspondence between the first voltage signal and the PCB type.

[0056] When the voltage signal output by the identification circuit is a first voltage signal, the number of voltage divider devices and the punching positions in the identification circuit can be adjusted to match the number of PCB types, that is, by increasing the number of voltage divider devices in the identification circuit, a larger number of PCB types can be matched.

[0057] For example, see Fig. 9 The identification circuit shown in the figure is coupled to the PCB type identification module package, and the identification circuit includes a power supply terminal V io , resistor R1, resistor R2, resistor R3, resistor R4 and output terminal V out , after obtaining the voltage at the power supply end, the output end V out Output the corresponding first voltage signal to the processing circuit. After receiving the first voltage signal, the processing circuit searches the first classification data information for the PCB type that matches the first voltage signal according to the first voltage signal, thereby determining the type corresponding to the connected PCB to be identified.

[0058] As an example, the PCB types include type A, type B, type C, type D, type E and type F, and the type identification module package includes six punching positions a, b, c, d, e, and f. Different types of PCBs correspond to different punching positions. When the first voltage signal is (1 / 3)V io When the first voltage signal is GND, according to the correspondence between the first voltage signal and the PCB type, it can be determined that the PCB to be identified is type A. When the first voltage signal is GND, according to the correspondence between the first voltage signal and the PCB type, it can be determined that the PCB to be identified is type B. When the first voltage signal is 0.5V ioWhen the first voltage signal is suspended, according to the correspondence between the first voltage signal and the PCB type, it can be determined that the PCB to be identified is type C. When the first voltage signal is suspended, according to the correspondence between the first voltage signal and the PCB type, it can be determined that the PCB to be identified is type D. When the first voltage signal is (2 / 3)V io When the first voltage signal is V io When the PCB to be identified is of type F, it can be determined according to the correspondence between the first voltage signal and the PCB type.

[0059] The above embodiment is to adjust the number of voltage dividers in the identification circuit to match the number of PCB types. Another implementation is to adjust the number of paths in the identification circuit to match the number of PCB types, and the circuit structure of the identification circuit needs to be adapted to the structure of the type identification module package. In this implementation, the identification circuit can have multiple output terminals, so it can output multiple voltage signals.

[0060] In one possible implementation, when the identification circuit outputs multiple voltage signals, the identification circuit includes a power supply terminal, multiple voltage divider devices, a first output terminal and a second output terminal. After the first modules of different types of PCBs are coupled to the identification circuit, the connection relationship between the power supply terminal, the first output terminal and the multiple first voltage divider devices is different, and the connection relationship between the power supply terminal, the second output terminal and the multiple first voltage divider devices is different.

[0061] For example, see Fig.10 The coupling diagram of the identification circuit and the type identification module package of the PCB shown in the figure, the voltage divider device can be a resistor, and the identification circuit includes a power supply terminal (V io )、resistor R1、resistor R2、resistor R3、resistor R4、first output terminal(V out1 ) and the second output terminal (V out2 ), after obtaining the voltage at the power supply end, the first output end outputs the corresponding first voltage signal to the processing circuit, and the second output end outputs the corresponding second voltage signal to the processing circuit. After receiving the first voltage signal and the second voltage signal, the processing circuit searches the second classification data information for the PCB type that matches the first voltage signal, the second voltage signal, and thereby determines the type corresponding to the connected PCB to be identified

[0062] As examples, PCB types include type A, type B, type C, type D, type E, type F, type G, type H, type I, type J, type K, type L, type M, type N, type O, and type P.

[0063] When the first voltage signal is GND and the second voltage signal is GND, according to the correspondence between the first voltage signal, the second voltage signal and the PCB type, the PCB to be identified is determined to be type A. When the first voltage signal is GND and the second voltage signal is suspended, according to the correspondence between the first voltage signal, the second voltage signal and the PCB type, the PCB to be identified is determined to be type B. When the first voltage signal is GND and the second voltage signal is V io When the first voltage signal is GND and the second voltage signal is 0.5V, the PCB to be identified is determined to be type C according to the correspondence between the first voltage signal, the second voltage signal and the PCB type. io When the PCB to be identified is determined to be type D according to the correspondence between the first voltage signal, the second voltage signal and the PCB type.

[0064] When the first voltage signal is suspended and the second voltage signal is GND, according to the correspondence between the first voltage signal, the second voltage signal and the PCB type, the PCB to be identified is determined to be type E. When the first voltage signal is suspended and the second voltage signal is suspended, according to the correspondence between the first voltage signal, the second voltage signal and the PCB type, the PCB to be identified is determined to be type F. When the first voltage signal is suspended and the second voltage signal is V io When the first voltage signal is suspended and the second voltage signal is 0.5V, the PCB to be identified is determined to be type G according to the correspondence between the first voltage signal, the second voltage signal and the PCB type. io When the PCB to be identified is determined to be type H according to the correspondence between the first voltage signal, the second voltage signal and the PCB type.

[0065] When the first voltage signal is V io , when the second voltage signal is GND, the PCB to be identified is determined to be type I according to the correspondence between the first voltage signal, the second voltage signal and the PCB type. io , when the second voltage signal is suspended, the PCB to be identified is determined to be type J according to the correspondence between the first voltage signal, the second voltage signal and the PCB type. io , the second voltage signal is V io When the first voltage signal is V io , the second voltage signal is 0.5V io When the PCB to be identified is determined to be type L according to the correspondence between the first voltage signal, the second voltage signal and the PCB type.

[0066] When the first voltage signal is 0.5V io, when the second voltage signal is GND, according to the correspondence between the first voltage signal, the second voltage signal and the PCB type, it is determined that the PCB to be identified is type M. When the first voltage signal is 0.5V io , when the second voltage signal is suspended, the PCB to be identified is determined to be type N according to the correspondence between the first voltage signal, the second voltage signal and the PCB type. io , the second voltage signal is V io When the first voltage signal is 0.5V, the PCB to be identified is determined to be type O according to the correspondence between the first voltage signal, the second voltage signal and the PCB type. io , the second voltage signal is 0.5V io When the PCB to be identified is determined to be type P according to the correspondence between the first voltage signal, the second voltage signal and the PCB type.

[0067] When determining to adjust the RF parameters of the PCB to be identified, the adjustment can be made through the correspondence between the parameter matching data information pre-stored by the type of the PCB. In a feasible implementation manner, adjusting the RF parameters of the PCB to be identified according to the type of the PCB to be identified includes: determining the RF compensation parameters of the PCB to be identified according to the type of the PCB to be identified and the parameter matching data information, the parameter matching data information including the correspondence between the PCB type and the RF compensation parameters, and adjusting the RF parameters of the PCB to be identified according to the RF compensation parameters.

[0068] After determining the type of PCB, the identification information corresponding to the PCB type can be used as a matching basis to search for the corresponding RF compensation parameters in the pre-stored parameter matching data information. Each PCB type can correspond to a RF compensation parameter. The RF compensation parameters may include transmit power compensation parameters and receive sensitivity compensation parameters. As an example, when the PCB is type A, the corresponding transmit power compensation parameter may be -0.7dB, and when the PCB is type B, the corresponding transmit power compensation parameter may be -0.5dB. By compensating for different types of PCBs with different RF compensation parameters, the RF performance of electronic devices manufactured using different types of PCBs can be made consistent.

[0069] Then, based on the identified PCB type, the compensation parameters matching this type of PCB can be found. Through the compensation parameters, RF compensation can be performed on the identified PCB to adjust the performance deviation of the electronic equipment caused by mixing different types of PCBs. Even when different types of PCBs are mixed, the RF performance of the electronic equipment can still maintain a high degree of consistency.

[0070] The present application provides an electronic device, which includes a processing circuit and an identification circuit. The processing circuit is coupled to the identification circuit, and the processing circuit is configured to: obtain a voltage signal output after the identification circuit is coupled to a type identification module package of a PCB to be identified, the circuit structure of the type identification module package of different types of PCBs is different, and the type of the PCB to be identified is determined based on the voltage signal and classification data information, and the classification data information includes the correspondence between the voltage signal output by the identification circuit and the PCB type.

[0071] In a possible embodiment, the PCB includes a first type identification module package, the identification circuit includes a power supply end, multiple voltage divider devices and a first output end, the voltage signal includes a first voltage signal, and the classification data information includes first classification data information. After the first type identification module packages of different types of PCBs are coupled to the identification circuit, the connection relationship between the power supply end, the first output end and the multiple voltage divider devices is different. The processing circuit is specifically configured to: obtain the first voltage signal output by the first output end after the identification circuit is coupled to the first type identification module package, determine the type of the PCB to be identified according to the first voltage signal and the first classification data information, and the first classification data information includes the correspondence between the first voltage signal output by the identification circuit and the PCB type.

[0072] In a possible implementation, the PCB includes a first type identification module package and a second type identification module package, the identification circuit includes a power supply end, multiple voltage divider devices, a first output end and a second output end, the voltage signal includes a first voltage signal and a second voltage signal, and the classification data information includes second classification data information. After the first type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply end, the first output end and multiple first voltage divider devices among the multiple voltage divider devices is different; after the second type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply end, the second output end and multiple second voltage divider devices among the multiple voltage divider devices is different. The processing circuit is specifically configured to: obtain a first voltage signal output from the first output end after the identification circuit is coupled to the first type identification module package and the second type identification module package, and a second voltage signal output from the second output end; determine the type of the PCB to be identified according to the first voltage signal, the second voltage signal and the second classification data information; the second classification data information includes the correspondence between the first voltage signal, the second voltage signal output by the identification circuit and the PCB type.

[0073] In a possible implementation, the processing circuit is further configured to: determine the RF compensation parameters of the PCB to be identified based on the type of the PCB to be identified and the parameter matching data information, the parameter matching data information including the correspondence between the PCB type and the RF compensation parameters, and adjust the RF parameters of the PCB to be identified based on the RF compensation parameters.

[0074] This embodiment also provides a computer-readable storage medium, in which computer instructions are stored. When the computer instructions are executed on an electronic device, the electronic device executes each function or step in the above method embodiment.

[0075] This embodiment also provides a computer program product. When the computer program product is run on a computer, it enables the computer to execute each function or step in the above method embodiment.

[0076] Among them, the electronic device, computer-readable storage medium, and computer program product provided in this embodiment are all used to execute the corresponding methods provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods provided above, and will not be repeated here.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A recognition method, characterized in that: The method comprises: Acquire a voltage signal outputted after the identification circuit is coupled to the type identification module package of the printed circuit board PCB to be identified, the circuit structure of the type identification module package of different types of PCBs is different, and the PCB to be identified is a PCB with the same structure and function produced by different suppliers; Determine the type of the PCB to be identified according to the voltage signal and the classification data information, wherein the classification data information includes a correspondence between the voltage signal output by the identification circuit and the PCB type; Determine the radio frequency compensation parameters of the PCB to be identified according to the type of the PCB to be identified and the parameter matching data information, wherein the parameter matching data information includes a correspondence between the PCB type and the radio frequency compensation parameters; The radio frequency parameters of the PCB to be identified are adjusted according to the radio frequency compensation parameters.

2. The method according to claim 1, characterized in that The PCB includes a first type identification module package, the identification circuit includes a power supply terminal, a plurality of voltage divider devices and a first output terminal, the voltage signal includes a first voltage signal, the classification data information includes first classification data information, and after the first type identification module packages of different types of PCBs are coupled to the identification circuit, the connection relationship between the power supply terminal, the first output terminal and the plurality of voltage divider devices is different; The voltage signal outputted after the acquisition identification circuit is packaged and coupled with the type identification module of the PCB to be identified includes: Acquire a first voltage signal output by the first output terminal after the identification circuit is packaged and coupled to the first type identification module; Determining the type of the PCB to be identified according to the voltage signal and the classification data information includes: The type of the PCB to be identified is determined according to the first voltage signal and first classification data information, wherein the first classification data information includes a correspondence between the first voltage signal output by the identification circuit and the PCB type.

3. The method according to claim 1, characterized in that The PCB includes a first type identification module package and a second type identification module package, the identification circuit includes a power supply terminal, a plurality of voltage divider devices, a first output terminal and a second output terminal, the voltage signal includes a first voltage signal and a second voltage signal, the classification data information includes second classification data information, after the first type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply terminal, the first output terminal and a plurality of first voltage divider devices among the plurality of voltage divider devices is different, and after the second type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply terminal, the second output terminal and a plurality of second voltage divider devices among the plurality of voltage divider devices is different; The voltage signal outputted after the acquisition identification circuit is packaged and coupled with the type identification module of the PCB to be identified includes: Acquire a first voltage signal outputted from the first output terminal after the identification circuit is coupled to the first type identification module package and the second type identification module package, and acquire a second voltage signal outputted from the second output terminal; Determining the type of the PCB to be identified according to the voltage signal and the classification data information includes: The type of the PCB to be identified is determined according to the first voltage signal, the second voltage signal and the second classification data information, wherein the second classification data information includes the correspondence between the first voltage signal, the second voltage signal output by the identification circuit and the PCB type.

4. An electronic device, characterized in that: The electronic device comprises a processing circuit and an identification circuit, wherein the processing circuit is coupled to the identification circuit; The processing circuit is configured to: Acquire a voltage signal outputted after the identification circuit is coupled to the type identification module package of the PCB to be identified, the circuit structure of the type identification module package of different types of PCBs is different, and the PCB to be identified is a PCB with the same structure and function produced by different suppliers; Determine the type of the PCB to be identified according to the voltage signal and the classification data information, wherein the classification data information includes a correspondence between the voltage signal output by the identification circuit and the PCB type; Determine the radio frequency compensation parameters of the PCB to be identified according to the type of the PCB to be identified and the parameter matching data information, wherein the parameter matching data information includes a correspondence between the PCB type and the radio frequency compensation parameters; The radio frequency parameters of the PCB to be identified are adjusted according to the radio frequency compensation parameters.

5. The electronic device according to claim 4, characterized in that: The PCB includes a first type identification module package, the identification circuit includes a power supply terminal, a plurality of voltage divider devices and a first output terminal, the voltage signal includes a first voltage signal, the classification data information includes first classification data information, and after the first type identification module packages of different types of PCBs are coupled to the identification circuit, the connection relationship between the power supply terminal, the first output terminal and the plurality of voltage divider devices is different; The processing circuit is specifically configured as follows: Acquire a first voltage signal output by the first output terminal after the identification circuit is packaged and coupled to the first type identification module; The type of the PCB to be identified is determined according to the first voltage signal and first classification data information, wherein the first classification data information includes a correspondence between the first voltage signal output by the identification circuit and the PCB type.

6. The electronic device according to claim 4, characterized in that: The PCB includes a first type identification module package and a second type identification module package, the identification circuit includes a power supply terminal, a plurality of voltage divider devices, a first output terminal and a second output terminal, the voltage signal includes a first voltage signal and a second voltage signal, the classification data information includes second classification data information, after the first type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply terminal, the first output terminal and a plurality of first voltage divider devices among the plurality of voltage divider devices is different, and after the second type identification module package of different types of PCBs is coupled to the identification circuit, the connection relationship between the power supply terminal, the second output terminal and a plurality of second voltage divider devices among the plurality of voltage divider devices is different; The processing circuit is specifically configured as follows: Acquire a first voltage signal outputted from the first output terminal after the identification circuit is coupled to the first type identification module package and the second type identification module package, and acquire a second voltage signal outputted from the second output terminal; The type of the PCB to be identified is determined according to the first voltage signal, the second voltage signal and the second classification data information, wherein the second classification data information includes the correspondence between the first voltage signal, the second voltage signal output by the identification circuit and the PCB type.

7. A computer-readable storage medium, characterized in that: A computer program is stored, and when the computer program is executed by a processor of an electronic device, the method according to any one of claims 1 to 3 is implemented.

8. A computer program product, characterized in that The method comprises a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 3 is implemented.

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