Manufacturing method of coil with bottom electrode and manufacturing method of inductor

Abstract

The invention provides a manufacturing method of a coil with a bottom surface electrode and a manufacturing method of an inductor, and the manufacturing method of the coil with the bottom surface electrode comprises the following steps: S1, preparing a full-page multi-layer coil which comprises a plurality of multi-layer coils arranged in an array; wherein the starting end of the bottom layer coil of each multi-layer coil is a first electrode end, the tail end of the top layer coil of each multi-layer coil is a second electrode end, and the first electrode end and the second electrode end are distributed on the two opposite sides of each multi-layer coil; s2, covering the whole multi-layer coil with insulating glue; s3, the insulation paste corresponding to each electrode end is removed in the same direction, and a conduction channel for each electrode end to make contact with external connection is formed; s4, adding an electrode lead in each conduction channel; and S5, removing the residual insulation paste so as to form a full-page multi-layer coil of which all electrode end parts are positioned on the same side.

Description

Technical Field

[0001] The present invention relates to the field of electronic component manufacturing, and in particular to a method for manufacturing a coil with a bottom electrode and a method for manufacturing an inductor. Background Art

[0002] In the field of electronic component manufacturing, inductors, as important magnetic components, are widely used in communication equipment, sensitive circuits, audio equipment, power management, automotive electronics and other fields. The design and manufacturing process of inductors are directly related to their performance and application effects. The bottom electrode of a conventional inductor is usually formed by bending the metal coils at both ends of the coil downward at the same time through mechanical secondary bending or processing, such as Figure 1 Although this traditional manufacturing method meets the structural requirements of the inductor to a certain extent, it has obvious shortcomings and deficiencies in the actual production and use process.

[0003] (1) High risk of copper damage: During the mechanical secondary bending process, the metal coils at both ends of the coil need to withstand greater physical stress. This stress acts on the metal material and can easily cause copper damage at the bend, such as scratches and cracks. These damages will not only affect the electrical performance of the inductor, such as changes in parameters such as inductance and resistance, but may also accelerate the corrosion and aging of the material, reducing the service life of the inductor. (2) Large space occupation: Before bending, the electrode metal needs to occupy a larger space in the entire layout, thereby reducing the number of products produced in the entire layout with the same layout area, thereby reducing production efficiency. (3) Complex process and low efficiency: Mechanical secondary bending or processing methods require precise processing equipment and require a high level of technical skills from the operator. At the same time, problems such as inaccurate positioning and inconsistent bending angles may occur during the processing process, affecting the yield and consistency of the inductor. Summary of the invention

[0004] In order to solve the above problems, the purpose of the present invention is to provide a method for manufacturing a coil with a bottom electrode and an inductor. By arranging electrode leads at the electrode ends of the multi-layer coil and leading the electrodes down to the same side of the coil, the problems of electrode damage and difficulty in processing caused by mechanical bending of the electrodes are solved.

[0005] The present invention is achieved through the following technical solutions:

[0006] A method for manufacturing a coil having a bottom electrode comprises the following steps:

[0007] S1. Prepare a full-page multi-layer coil, which includes a plurality of multi-layer coils arranged in an array; wherein the starting end of the bottom coil of each multi-layer coil is a first electrode end, the end of the top coil is a second electrode end, and the first electrode end and the second electrode end are distributed on opposite sides of the multi-layer coil;

[0008] S2, cover the whole multi-layer coil with insulating glue;

[0009] S3, removing the insulating glue corresponding to each electrode end in the same direction to form a conducting channel between each electrode end and the external contact;

[0010] S4, adding electrode leads to each conduction channel;

[0011] S5. Remove the remaining insulating glue to form a full-page multi-layer coil with all electrode ends located on the same side.

[0012] Furthermore, the method for preparing the full-page multi-layer coil includes:

[0013] S11, preparing at least two full-page double-sided coils, each full-page double-sided coil comprising a plurality of sub-coils arranged in an array, and each sub-coil is a double-sided coil;

[0014] S12, performing insulation treatment on each full-page double-sided coil so that the outer surface of each double-sided coil is coated with an insulation layer;

[0015] S13, opening a conducting hole, removing the insulating layer corresponding to the starting end of each bottom coil of the full-page double-sided coil on the top layer, removing the insulating layer corresponding to the end of each top coil of the full-page double-sided coil on the bottom layer, removing the insulating layer corresponding to the starting end of the bottom coil and the end of the top coil of the full-page double-sided coil in the middle, and forming a conducting hole for connecting the coil to the outside world;

[0016] S14, the conductive hole of the top coil is filled with conductive material, and the height of the conductive material is greater than twice the height of the peripheral insulating layer;

[0017] S15, stacking and laminating a plurality of full-page double-sided coils processed by S12, S13 and S14, and aligning the through holes of two adjacent full-page double-sided coils one by one;

[0018] S16, heating so that the insulating layers of adjacent full-page double-sided coils are adhered and fixed.

[0019] Furthermore, the method for preparing the full-page multi-layer coil includes:

[0020] S11', preparing at least two full-page double-sided coils, each full-page double-sided coil comprising a plurality of sub-coils arranged in an array, and each sub-coil is a double-sided coil;

[0021] S12', the whole-page double-sided coils are stacked, and adjacent whole-page double-sided coils are connected by soldering.

[0022] A method for manufacturing an inductor, comprising the above-mentioned method for manufacturing a coil having a bottom electrode, further comprising:

[0023] S6, forming an insulating thin layer on the surface of the whole multi-layer coil in S5 through a vapor deposition process;

[0024] S7, introducing magnetic slurry to cover the entire multi-layer coil in S6 to form an inductor group;

[0025] S8, cutting the inductor group to form a plurality of single coil inductors, each coil inductor comprising an inductor body and a magnet covering the inductor body, the inductor body comprising a multilayer coil with two electrode ends located on the same side and an insulating layer on the surface of the multilayer coil.

[0026] Compared with the prior art, the technical solution of the present invention and its beneficial effects are as follows:

[0027] (1) The present invention covers the whole-page multi-layer coil with insulating material, removes the insulating glue corresponding to each electrode end in the same direction, forms a conduction channel for each electrode end to contact the external connection, and adds electrode leads in each conduction channel, thereby leading the coil electrodes down to the same side. Since the electrode leads are perpendicular to the radial direction of the coil when they are set, the position occupied by the electrode leads in the radial plane of the coil is extremely small, which is much smaller than the space occupied by the whole-page layout before the traditional electrode ends are bent. Therefore, under the same layout, the present application can batch manufacture more coils with bottom electrodes, and at the same time, avoid electrode damage caused by physical bending. The electrode lead-down method of the present invention also greatly reduces the manufacturing accuracy.

[0028] (2) The multi-layer coil structure of the present invention provides insulation treatment on the outer surface of the sub-coil, and opens aligned conductive holes between adjacent sub-coils and fills them with conductive materials, so that adjacent sub-coils are conductive. This solves the insulation problem of the multi-layer multi-turn coil structure, while at the same product height, breaking through the number of turns of the coil manufactured by traditional processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of a method for forming a bottom electrode in the prior art provided by the present invention, wherein the coil is a top view;

[0030] Figure 2 is a schematic diagram of a full-page multi-layer coil provided in an embodiment of the present invention (only two multi-layer coils are shown);

[0031] Figures 3 to 8 This is a manufacturing step of a full-sheet layer coil provided by an embodiment of the present invention;

[0032] Figures 9 to 11 is a schematic diagram of a multi-layer single-turn coil structure provided by an embodiment of the present invention;

[0033] Figures 12 to 16 This is a manufacturing step of a full-page multi-layer coil for forming a bottom electrode provided by an embodiment of the present invention.

[0034] Illustration Description:

[0035] Full-page multi-layer coil-1; multi-layer coil-2, first electrode end-3; second electrode end-4; insulating glue-5; conduction channel-6; electrode lead-7;

[0036] Sub-coil-10; bottom coil-11; top coil-12; insulating film-13; contact-14; insulating layer-20; via-21; metal contact-22;

[0037] first sub-coil-100, first contact-101; first conductive hole-102

[0038] The second sub-coil-200, the second contact-201; the second conductive hole-202; the third conductive hole-203;

[0039] The third sub-coil 300 ; the third contact point 301 ; and the fourth conductive hole 302 . DETAILED DESCRIPTION

[0040] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0041] A method for manufacturing a coil having a bottom electrode comprises the following steps:

[0042] S1. Prepare a full-page multilayer coil 1, which includes a plurality of multilayer coils 2 arranged in an array. The starting end of the bottom coil of each multilayer coil 2 is a first electrode terminal 3, and the end of the top coil is a second electrode terminal 4. The first electrode terminal 3 and the second electrode terminal 4 are distributed on opposite sides of the multilayer coil. Figure 2 As shown, a cross-sectional view of two multi-layer coils in a full-page multi-layer coil is shown, and the second electrode ends 4 of the two adjacent multi-layer coils are connected together. It is not difficult to understand that Figure 2 The first electrode terminal 3 is also connected to the first electrode terminal of the adjacent multi-layer coil, thereby forming a full-page multi-layer coil 1 consisting of a plurality of multi-layer coils arranged in an array.

[0043] In this embodiment, Figures 3 to 8 The process of forming a multi-layer multi-turn coil, method 1:

[0044] S11, prepare at least two full-page double-sided coils, each full-page double-sided coil includes a plurality of array-arranged sub-coils 10, each sub-coil is a double-sided coil. Figure 3 The following figures only show the structure of the sub-coil or the single coil. Figure 3 The structure of a double-layer single-turn coil is shown. The current flows in from the starting end of the bottom coil, flows through the pattern of the bottom coil, flows from the end of the bottom coil through the contact to the starting end of the top coil, and finally flows out from the end of the top coil.

[0045] The production method of double-sided coil includes:

[0046] S111, laying a first conductive metal.

[0047] S112 , etching the first conductive metal into patterns of a plurality of bottom coils 11 .

[0048] S113, laying an insulating film 13 on the first conductive metal, the insulating film being provided with through holes (not shown), the through holes corresponding to the ends of the bottom coil one by one.

[0049] S114 , a contact 14 is provided in the through hole, and an upper end surface of the contact 14 protrudes from an upper surface of the insulating film 13 .

[0050] S115, laying a second conductive metal on the insulating film.

[0051] S116, etching the second conductive metal into a pattern of a plurality of top surface coils 12, wherein the starting ends of the top surface coils 12 correspond to the through holes one by one. The top surface coils are in contact with the contacts, thereby obtaining a full-page material containing a plurality of double-sided coils.

[0052] S12, insulating each full-page double-sided coil so that the outer surface of each double-sided coil is coated with an insulating layer 20, such as Figure 4 The outer surface of the double-sided coil includes the top surface and side surfaces of the bottom coil and the top coil, thereby achieving insulation between the multi-turn coils.

[0053] The method of coating the double-sided coil with an insulating layer includes: vacuum coating the double-sided coil so that the outer surface of the double-sided coil is coated with an insulating layer, and the material forming the insulating layer includes parylene or silicon dioxide. Alternatively, a printing process is used to coat the outer surface of the double-sided coil with an insulating layer, and the material forming the insulating layer includes epoxy resin or UV-fixing glue. Alternatively, a dispensing process is used to coat the outer surface of the double-sided coil with an insulating layer, and the material forming the insulating layer includes epoxy resin or UV-fixing glue.

[0054] S13, opening a via hole 21, such as Figure 5Specifically, the insulating layer corresponding to the starting end of each bottom coil of the full-page double-sided coil on the top layer is removed, the insulating layer corresponding to the end of each top coil of the full-page double-sided coil on the bottom layer is removed, and the insulating layer corresponding to the starting end of the bottom coil and the end of the top coil of the full-page double-sided coil in the middle layer is removed to form a conductive hole that connects the coil to the outside world.

[0055] S14, the conductive holes of the top coil are filled with conductive materials, such as metal contacts 22, such as Figure 6 The height of the conductive material is greater than twice that of the surrounding insulating layer, so that the conductive material can pass through the two aligned conductive holes.

[0056] S15, stacking and laminating a plurality of full-page double-sided coils processed by S12, S13 and S14, and aligning the via holes of two adjacent full-page double-sided coils one by one, such as Figure 7 The conduction between the adjacent double-sided coils is achieved through the metal contact 22 arranged in the conductive hole 21.

[0057] S16, heating, so that the insulation layers of the adjacent full-page double-sided coils are adhered and fixed, thereby forming a multi-layer and multi-turn coil structure, such as Figure 8 .

[0058] See also Figures 9 to 11 , the following takes each sub-coil as a double-layer single-turn as an example to illustrate the multi-layer coil structure of the present application.

[0059] Fig. 9 , the structure of the first sub-coil 100 is shown, with surface a being a top view from the bottom coil direction, and surface b being a top view from the top coil direction. The starting end of the bottom coil 110 of the first sub-coil 100 is the first electrode terminal 130, and the insulating film corresponding to the end of the bottom coil 110 is provided with a through hole and a first contact 101. The current flows from the first electrode 130 to the end of the bottom coil 110 of the first sub-coil 100, and then flows through the first contact 101 to the starting end of the top coil 120 of the first sub-coil 100, and finally is drawn out from the conductive material in the first conductive hole 102 provided at the end of the top coil 120.

[0060] Fig.10 , the structure of the second sub-coil 200 is shown, with surface a being a top view from the bottom coil direction, and surface b being a top view from the top coil direction. A second via hole 202 is provided in the insulating layer corresponding to the starting end of the bottom coil 210 of the second sub-coil 200, and the opening position of the second via hole 202 is aligned with the first via hole 102.

[0061] The starting end of the bottom coil 210 is electrically connected to the end of the top coil 120 through the conductive material disposed in the first conductive hole 102. The current flows from the conductive material in the first conductive hole 102 to the starting end of the bottom coil 210, and then to the end of the bottom coil 210. The current is then electrically connected to the starting end of the top coil 220 of the second sub-coil 200 through the second contact 201 disposed at the end of the bottom coil 210, and finally is led out from the conductive material in the third conductive hole 203 disposed at the end of the top coil 220.

[0062] Fig.11 , the structure of the third sub-coil 300 is shown, with surface a being a top view from the bottom coil direction, and surface b being a top view from the top coil direction. A fourth conductive hole 302 is provided in the insulating layer corresponding to the starting end of the bottom coil 310 of the third sub-coil 300, and the opening position of the fourth conductive hole 302 is aligned with the third conductive hole 203.

[0063] The starting end of the bottom coil 310 of the third sub-coil 300 is electrically connected to the end of the top coil 220 of the second sub-coil 200 through the conductive material disposed in the third conductive hole 303. The current flows from the conductive material in the third conductive hole 203 to the starting end of the bottom coil 310, and then to the end of the bottom coil 310. The current is then electrically connected to the starting end of the top coil 320 of the third sub-coil 300 through the third contact 301 disposed at the end of the bottom coil 310, and finally flows out from the end of the top coil 320, namely the second electrode end 330.

[0064] In yet another embodiment, a second method of forming a multi-layer multi-turn coil includes:

[0065] S11', prepare at least two full-page double-sided coils, each full-page double-sided coil includes a plurality of array-arranged sub-coils, each sub-coil is a double-sided coil. The method for manufacturing the double-sided coil is the same as in S111 to S116 above, and will not be repeated here.

[0066] S12', the whole page double-sided coils are stacked, and the adjacent whole page double-sided coils are connected by soldering, and finally the following is obtained: Fig.12 The multi-layer coil shown.

[0067] S2, cover the whole multi-layer coil 1 with insulating glue 5, such as Fig.13 .

[0068] S3, remove the insulating glue 5 corresponding to each electrode end in the same direction to form a conducting channel 6 between each electrode end and the external contact, such as Fig.14 It can be understood that the conducting channel 6 connects the coil with the outside world. If the multilayer coil is made by method 1, the removed insulating material should include the corresponding insulating material 5 mentioned in S2 and the insulating layer 20 mentioned in S12, so that the coil surface is in direct contact with the outside world.

[0069] Meanwhile, it is worth noting that the side wall of the conducting channel 6 is made of insulating material, that is, the side wall of the conducting channel 6 does not contact the coil.

[0070] S4, adding electrode leads 7 in each conducting channel 6, such as Fig.15 The electrode lead 7 can be formed by electroplating or by filling a conductive material in the conduction channel 6. Preferably, the ends of the electrode lead 7 are located in the same plane. In this embodiment, the conductive material includes a metal paste such as silver paste and copper paste, and it needs to be cured after filling the conductive material so that the conductive material is firmly combined with the electrode end.

[0071] S5, removing the remaining insulating glue 5, thereby forming a full-page multi-layer coil with the ends of all electrodes located on the same side, such as Fig.16 .

[0072] The present invention also provides a method for manufacturing an inductor, and according to the above method, a full-page multi-layer coil with the ends of all electrodes located on the same side is obtained. It also includes:

[0073] S6, forming an insulating thin layer on the surface of the entire multi-layer coil with the ends of all electrodes located on the same side through a vapor deposition process;

[0074] S7, introducing magnetic slurry to cover the entire multi-layer coil in S6 to form an inductor group;

[0075] S8, cutting the inductor group to form a plurality of single coil inductors, each coil inductor comprising an inductor body and a magnet covering the inductor body, the inductor body comprising a multilayer coil with two electrode ends located on the same side and an insulating thin layer on the surface of the multilayer coil.

[0076] Of course, the final completion of the inductor product also includes grinding ends, sealing ends, and other steps.

[0077] The above description shows and describes the preferred embodiments of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the invention, through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art shall not depart from the spirit and scope of the present invention, and shall be within the scope of protection of the claims attached to the present invention.

Claims

1. A method for manufacturing a coil having a bottom electrode, characterized in that: The steps include: S1. Prepare a full-page multi-layer coil, which includes a plurality of multi-layer coils arranged in an array; wherein the starting end of the bottom coil of each multi-layer coil is a first electrode end, the end of the top coil is a second electrode end, and the first electrode end and the second electrode end are distributed on opposite sides of the multi-layer coil; S2, cover the whole multi-layer coil with insulating glue; S3, removing the insulating glue corresponding to each electrode end in the same direction to form a conducting channel between each electrode end and the external contact; S4, adding electrode leads in each conduction channel; S5. Remove the remaining insulating glue to form a full-page multi-layer coil with all electrode ends located on the same side.

2. The method for manufacturing a coil having a bottom electrode according to claim 1, characterized in that: The method for preparing a full-page multi-layer coil comprises: S11, preparing at least two full-page double-sided coils, each full-page double-sided coil comprising a plurality of sub-coils arranged in an array, and each sub-coil is a double-sided coil; S12, performing insulation treatment on each full-page double-sided coil so that the outer surface of each double-sided coil is coated with an insulation layer; S13, opening a conducting hole, removing the insulating layer corresponding to the starting end of each bottom coil of the full-page double-sided coil on the top layer, removing the insulating layer corresponding to the end of each top coil of the full-page double-sided coil on the bottom layer, removing the insulating layer corresponding to the starting end of the bottom coil and the end of the top coil of the full-page double-sided coil in the middle, and forming a conducting hole for connecting the coil to the outside world; S14, the conductive hole of the top coil is filled with conductive material, and the height of the conductive material is greater than twice the height of the peripheral insulating layer; S15, stacking and laminating a plurality of full-page double-sided coils processed by S12, S13 and S14, and aligning the through holes of two adjacent full-page double-sided coils one by one; S16, heating so that the insulating layers of adjacent full-page double-sided coils are adhered and fixed.

3. The method for manufacturing a coil having a bottom electrode according to claim 1, characterized in that: The method for preparing a full-page multi-layer coil comprises: S11', preparing at least two full-page double-sided coils, each full-page double-sided coil comprising a plurality of sub-coils arranged in an array, and each sub-coil is a double-sided coil; S12', the whole-page double-sided coils are stacked, and adjacent whole-page double-sided coils are connected by soldering.

4. A method for manufacturing a coil with a bottom electrode according to claim 2 or 3, characterized in that: The method for preparing a full-page double-sided coil includes: Laying a first conductive metal; Etching a plurality of bottom coil patterns from the first conductive metal; Laying an insulating film on the first conductive metal, wherein a through hole is provided on the insulating film; A contact is arranged in the through hole, and an upper end surface of the contact protrudes from an upper surface of the insulating film; Laying a second conductive metal on top of the insulating film; A plurality of top surface coil patterns are etched out of the second conductive metal, and the top surface coils are in contact with the contacts.

5. The method for manufacturing a coil having a bottom electrode according to claim 1, characterized in that: The method of adding electrode leads in S4 includes electroplating or filling conductive materials in the conductive channel.

6. The method for manufacturing a coil having a bottom electrode according to claim 1, characterized in that: The ends of the electrode leads are located in the same plane.

7. The method for manufacturing a coil having a bottom electrode according to claim 1, characterized in that: When the insulating material is removed in S3, the sidewalls of the conducting channel are made of insulating material.

8. A method for manufacturing an inductor, characterized in that: A method for manufacturing a coil having a bottom electrode according to any one of claims 1 to 7, further comprising: S6, forming an insulating thin layer on the surface of the whole multi-layer coil in S5 through a vapor deposition process; S7, introducing magnetic slurry to cover the entire multi-layer coil in S6 to form an inductor group; S8, cutting the inductor group to form a plurality of single coil inductors, each coil inductor comprising an inductor body and a magnet covering the inductor body, the inductor body comprising a multilayer coil with two electrode ends located on the same side and an insulating layer on the surface of the multilayer coil.

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