Loudspeaker system, diffusion structure and headphone
By introducing a diffusion structure into the speaker system, the sound pressure level of the acoustic waves generated by the acoustic energy converter is improved and its directionality is reduced, which solves the problem of insufficient acoustic performance of the MEMS structure acoustic energy converter in large acoustic devices.
Patent Information
- Application Number
- CN202311581258.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-07
- Filing Date
- 2023-11-24
- Publication Date
- 2024-12-20
AI Technical Summary
The acoustic waves generated by the acoustic energy converter with a MEMS structure have a small sound pressure level and a high directionality, making it difficult to effectively use in large acoustic devices.
Using a speaker system and a diffusion structure, by setting a diffusion structure on the acoustic energy converter, the acoustic waves are guided through the sound path, so that the sound pressure level of the acoustic waves is increased and the directionality is reduced during the propagation process.
It effectively improves the sound pressure level of the acoustic wave and reduces the directionality of the acoustic wave, which is suitable for the improvement of acoustic performance of large acoustic devices.
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Figure CN119172692A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a loudspeaker system, a diffusion structure and a headphone, and in particular to a loudspeaker system, a diffusion structure and a headphone capable of improving the acoustic performance of an acoustic wave generated by an acoustic transducer. Background Art
[0002] Since acoustic energy transducers (eg, acoustic chips with a micro-electromechanical systems (MEMS) structure) can be widely used in various electronic devices due to their small size, acoustic energy transducers have developed rapidly in recent years.
[0003] However, the acoustic waves generated by the acoustic transducer having a MEMS structure have some acoustic properties (e.g., a smaller sound pressure level (SPL) and a higher directivity), which are not conducive to use in an acoustic device having a larger device sound outlet. Therefore, it is necessary to improve these acoustic properties of the acoustic waves generated by the acoustic transducer. Summary of the invention
[0004] Therefore, the main object of the present invention is to provide a speaker system, a diffusion structure and a headphone, which can improve the acoustic performance of the acoustic waves generated by the acoustic energy transducer.
[0005] One embodiment of the present invention provides a speaker system, which includes a first acoustic energy converter, a second acoustic energy converter and a diffusion structure. The first acoustic energy converter is used to generate a first acoustic wave, and the second acoustic energy converter is used to generate a second acoustic wave. The diffusion structure is arranged on the first acoustic energy converter, and the diffusion structure is used to guide the first acoustic wave to propagate through a sound path formed in the diffusion structure. After the first acoustic wave propagates through the sound path in the diffusion structure, the directivity of the first acoustic wave is diffused at the sound outlet of the diffusion structure.
[0006] Another embodiment of the present invention provides a diffusion structure, which is arranged or to be arranged in a speaker system. The diffusion structure includes a main body and a cover, and the cover is arranged on the main body. The diffusion structure is arranged or to be arranged on a first acoustic energy converter of the speaker system, and the diffusion structure is used to guide a first acoustic wave generated by the first acoustic energy converter to propagate through a sound path formed in the diffusion structure.
[0007] Another embodiment of the present invention provides a headset, which includes a first acoustic energy converter and a diffusion structure. The first acoustic energy converter is used to generate a first acoustic wave, wherein the first acoustic energy converter is a MEMS speaker. The diffusion structure is arranged on the first acoustic energy converter, and the diffusion structure is used to guide the first acoustic wave to propagate through a sound path formed in the diffusion structure. After the first acoustic wave propagates through the sound path in the diffusion structure, the directivity of the first acoustic wave is diffused at the sound outlet of the diffusion structure.
[0008] The purpose of the present invention should become clear to those skilled in the art after reading the following detailed description of the embodiments shown in various figures. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 FIG. 1 is a cross-sectional schematic diagram of a core part of a speaker system according to an embodiment of the present invention.
[0010] Figure 2 FIG. 4 is a schematic diagram of a speaker system according to an embodiment of the present invention.
[0011] Figure 3 Shown is a schematic diagram of the central portion of a speaker system according to an embodiment of the present invention.
[0012] Figure 4 FIG. 1 is a schematic diagram showing a central portion of a sound diffusion plate of a speaker system according to an embodiment of the present invention.
[0013] Figure 5 FIG. 1 is a schematic cross-sectional view of a central portion of a speaker system according to an embodiment of the present invention.
[0014] Figure 6 FIG. 1 is an exploded schematic diagram of a headset according to an embodiment of the present invention.
[0015] The reference numerals are as follows:
[0016] 100:Speaker System
[0017] 110: The first sound energy converter
[0018] 120: Sound diffusion plate
[0019] 122: Main body
[0020] 122a: External extension structure
[0021] 122ab: bottom part
[0022] 122aw: side wall
[0023] 122i: Inner channel structure
[0024] 124: Sound through structures
[0025] 124h: Hollow part
[0026] 126: Surrounding area
[0027] 130: Cover part
[0028] 132: Top structure
[0029] 134: Side structure
[0030] 140: Second sound energy converter
[0031] 200:Headphones
[0032] 210: Headphone cover
[0033] 212: Holes
[0034] 220: cushion
[0035] 230: Foaming structure
[0036] 240: Ring
[0037] CBI: Inner Channel
[0038] CBI_1: First End
[0039] CBI_2: Second end
[0040] CP1, CP2: bending part
[0041] HS: Diffusion structure
[0042] OP1: Sound entry
[0043] OP2: Sound export
[0044] SP: Sound channel
[0045] SP1: Part 1
[0046] SP2: Part 2
[0047] SP3: Part 3
[0048] W1: First acoustic wave
[0049] W2: Second acoustic wave
[0050] X,Y,Z: Direction DETAILED DESCRIPTION
[0051] In order to enable those skilled in the art to further understand the present invention, the preferred embodiments of the present invention, the typical materials or parameter ranges of the key components listed will be described in detail below, and the components of the present invention and the desired effects will be described in conjunction with the marked drawings. It should be noted that the drawings are simplified schematic diagrams, and the materials and parameter ranges of the key components are described based on the current technology. Therefore, only the components and combination relationships related to the present invention are shown to provide a clearer description of the basic architecture, implementation method or operation of the present invention. The actual components and layout may be more complex, and the materials or parameter ranges used may change with the development of future technology. In addition, for the convenience of explanation, the components shown in the drawings of the present invention may not be drawn in proportion to the actual number, shape, and size, and the details may be adjusted according to the design requirements.
[0052] In the following description and claims, words such as "include", "contain", "have" and the like are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present invention, they specify the existence of corresponding features, regions, steps, operations and / or components, but do not exclude the existence of one or more corresponding features, regions, steps, operations and / or components.
[0053] In the following description and claims, when "A1 component is formed by B1", B1 exists in the formation of A1 component or B1 is used in the formation of A1 component, and the formation of A1 component does not exclude the existence and use of one or more other features, regions, steps, operations and / or components.
[0054] In the following specification and claims, the term "substantially" means that slight deviations may or may not exist. For example, the terms "substantially parallel" and "substantially along" mean that the angle between two components may be less than or equal to a specific angle threshold, such as 10 degrees, 5 degrees, 3 degrees or 1 degree. For example, the term "substantially aligned" means that the deviation between two components may be less than or equal to a specific difference threshold, such as 2 μm (micrometers) or 1 μm. For example, the term "substantially the same" means that the deviation is within a given value or a given range, such as within 10%, 5%, 3%, 2%, 1% or 0.5%.
[0055] In the following description and claims, the term "horizontal direction" refers to a direction parallel to a horizontal plane, the term "horizontal plane" refers to a plane parallel to the direction X and the direction Y in the accompanying drawings (that is, the direction X and the direction Y of the present invention can be regarded as horizontal directions), and the terms "vertical direction" and "top view direction" refer to directions parallel to the direction Z and perpendicular to the horizontal direction in the accompanying drawings, wherein the directions X, Y, and Z are perpendicular to each other. In the following description and claims, the term "top view" refers to the viewing result along the vertical direction. In the following description and claims, the term "side view" refers to the viewing result along the horizontal direction. In the following description and claims, the term "section" refers to the viewing result of a structure cut along the vertical direction and viewed from the horizontal direction.
[0056] The ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify the elements. They do not imply or represent any previous ordinal numbers of the element (or elements), nor do they represent the order of one element and another element, or the order of the manufacturing method. The use of multiple ordinal numbers is only used to make the element with a certain name clearly distinguishable from another element with the same name. The same words may not be used in the claims and the specification. Accordingly, the first component in the specification may be the second component in the claims.
[0057] It should be noted that the following embodiments can replace, reorganize, or mix features in several different embodiments to complete other embodiments without departing from the spirit of the present invention. The features between the embodiments can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.
[0058] In the present invention, the acoustic energy transducer is used to perform acoustic transformation, wherein the acoustic energy transducer may be a sound-generating element, a speaker, a micro speaker or other suitable devices, so that the acoustic transformation of the acoustic energy transducer can convert a signal (eg, an electrical signal) into an acoustic wave.
[0059] In the present invention, the frequency range of the acoustic waves generated by the acoustic energy transducer can be designed according to the needs. For example, the frequency range of the acoustic waves generated by the acoustic energy transducer can completely cover the human audible frequency range (e.g., 20 Hz to 20 kHz), but is not limited thereto. For example, the frequency of the acoustic waves that the acoustic energy transducer can generate can be higher than a specific frequency, so that the acoustic energy transducer can be a high-frequency sound-generating unit (e.g., a tweeter), but is not limited thereto. For example, the frequency of the acoustic waves that the acoustic energy transducer can generate can be lower than a specific frequency, so that the acoustic energy transducer can be a low-frequency sound-generating unit (e.g., a woofer), but is not limited thereto. It should be noted that the above-mentioned specific frequency can be a value between 800 Hz and 4 kHz (e.g., 1.44 kHz), but is not limited thereto. For details of the high-frequency sound unit and the low-frequency sound unit, reference may be made to US Pat. Nos. 17 / 153,849 and 17 / 720,333 filed by the applicant, and these contents are incorporated herein by reference and become part of the specification of the present invention.
[0060] Please refer to Figure 1 , Figure 1 FIG. 2 is a cross-sectional schematic diagram of the core part of a speaker system according to an embodiment of the present invention. Figure 1 As shown, the speaker system 100 includes a first acoustic energy converter 110 for generating a first acoustic wave W1, wherein the first frequency range of the first acoustic wave W1 can be designed according to requirements. For example, the first acoustic energy converter 110 can be a high-frequency sound generating unit (i.e., a high-frequency speaker), so that the first frequency range of the first acoustic wave W1 can be higher than a specific frequency, but is not limited thereto.
[0061] In some embodiments, the first acoustic transducer 110 may be a MEMS device, such as a MEMS speaker including a MEMS structure (e.g., the unit may have an anchoring structure and a diaphragm anchored on the anchoring structure, and the diaphragm is actuated to generate the first acoustic wave W1). For example, the first acoustic transducer 110, which is a MEMS speaker, may be included in a MEMS chip, so that the first acoustic transducer 110 may be formed by a semiconductor process, but is not limited to this. For example, the first acoustic transducer 110 may include silicon (e.g., single crystal silicon or polycrystalline silicon), silicon compounds (e.g., silicon carbide, silicon oxide), germanium, germanium compounds, gallium, gallium compounds (e.g., gallium nitride, gallium arsenide), other suitable materials or combinations thereof, but are not limited to this.
[0062] like Figure 1As shown, the speaker system 100 includes a diffusion structure HS, which is disposed on a first acoustic energy converter 110, wherein the diffusion structure HS may have a sound inlet OP1 and a sound outlet OP2, a sound path SP exists between the sound inlet OP1 and the sound outlet OP2, the first acoustic energy converter 110 corresponds to the sound inlet OP1, and the first acoustic wave W1 generated by the first acoustic energy converter 110 passes through the sound path SP (that is, the first acoustic wave W1 passes through the diffusion structure HS). In some embodiments, as Figure 1 As shown, the size of the sound inlet OP1 may be smaller than the size of the sound outlet OP2.
[0063] The shape of the sound inlet OP1 and the shape of the sound outlet OP2 may be any suitable shape and may be designed according to requirements. In some embodiments, the shape of the sound inlet OP1 and the shape of the sound outlet OP2 may be different from each other.
[0064] like Figure 1 As shown, the sound path SP of the diffusion structure HS has a first portion (first sound path portion) SP1, the first portion SP1 is between the sound inlet OP1 and the sound outlet OP2, and the first path size of the first portion SP1 is smaller than the size of the sound inlet OP1 and the size of the sound outlet OP2. It should be noted that the term "path size" can refer to the cross-sectional size / area of the corresponding / related portion of the sound path SP. In the present invention, since the first path size of the first portion SP1 is smaller than the size of the sound inlet OP1 and the size of the sound outlet OP2, after the first acoustic wave W1 passes through the sound path SP of the diffusion structure HS, the sound pressure level of the first acoustic wave W1 is increased (that is, the sound pressure level of the first acoustic wave W1 at the sound outlet OP2 is greater than the sound pressure level of the first acoustic wave W1 at the sound inlet OP1). In addition, the directivity of the first acoustic wave W1 is diffused by the diffusion structure HS, so when the first acoustic wave W1 propagates out from the sound outlet OP2, the directivity of the first acoustic wave W1 is weakened. Furthermore, since the size of the sound inlet OP1 is smaller than the size of the sound outlet OP2 , the effect of improving the sound pressure level of the first acoustic wave W1 and the diffusion effect of the first acoustic wave W1 can be further improved.
[0065] Due to the design of the sound path SP of the diffusion structure HS, the length of the sound path SP increases. In order to reduce the size of the diffusion structure HS, the diffusion structure HS can be designed so that the sound path SP has at least one curved portion (eg, Figure 1 Thus, the design of the sound path SP of the diffusion structure HS is achieved while minimizing the size of the diffusion structure HS. Figure 1 For example, the sound path SP has two curved portions CP1 and CP2 to present an N-shape in cross section, but the present invention is not limited thereto.
[0066] Hereinafter, an example of the speaker system 100 will be described in detail, but the speaker system 100 of the present invention is not limited to the following.
[0067] Please refer to Figures 2 to 4 , Figure 2 FIG. 1 is a schematic diagram of a speaker system according to an embodiment of the present invention. Figure 3 FIG. 1 is a schematic diagram showing a central part of a speaker system according to an embodiment of the present invention. Figure 4 FIG. 2 is a schematic diagram showing the central portion of a sound diffusion plate of a speaker system according to an embodiment of the present invention. Figures 1 to 4 As shown, the diffusion structure HS of the speaker system 100 includes a sound diffusion plate body 120 and a cover 130, and the cover 130 is disposed on the sound diffusion plate body 120. Figures 1 to 4 In the embodiment, the sound diffusion plate 120 includes a main body 122, wherein the main body 122 has the sound inlet OP1 and the sound outlet OP2 in the diffusion structure HS, and the cover 130 is disposed on the main body 122 and covers the sound inlet OP1. It should be noted that Figure 1 for Figure 3 The cross-sectional view of the first sound energy converter 110, the main body 122 of the sound diffusion plate 120 and the cover 130 is shown. In this embodiment, Figure 1 The core of the loudspeaker system 100 shown consists of Figure 3 The first sound energy converter 110 shown is formed by the main body 122 of the sound diffusion plate 120 and the cover 130 .
[0068] In the present invention, the main body 122 can be located at any suitable position in the sound diffusion plate body 120. In some embodiments, as Figures 2 to 4 As shown, the main body 122 may be located at the center of the sound diffusion plate 120 , so that the first sound energy converter 110 may correspond to the center of the sound diffusion plate 120 in the direction Z, but the present invention is not limited thereto.
[0069] like Figure 1 and Figure 4 As shown, the main body 122 has an inner channel structure 122i and an outer extension structure 122a, the outer extension structure 122a is connected to the inner channel structure 122i and surrounds the inner channel structure 122i, wherein the inner channel structure 122i is covered by the cover 130.
[0070] The external extension structure 122a has a bottom portion 122ab and a side wall portion 122aw connected to each other, the bottom portion 122ab is connected to the side wall portion 122aw and the inner channel structure 122i, and the sound outlet OP2 of the main body 122 (i.e., the sound outlet OP2 of the diffusion structure HS) is surrounded by the top of the side wall portion 122aw (i.e., the side wall portion 122aw forms the sound outlet OP2). In some embodiments, Figure 1 and Figure 4 In the embodiment, the external extension structure 122a may be a bowl-shaped structure, and the shape of the sound outlet OP2 may be a chamfered rectangle, but is not limited thereto. Figure 1 and Figure 4 In the embodiment, the outer expansion structure 122a may be narrower at the bottom portion 122ab and may be wider at the top of the sidewall portion 122aw, but is not limited thereto.
[0071] exist Figure 1 and Figure 4 In the embodiment, the inner channel structure 122i may have a hollow structure (e.g., a tubular structure) and is higher than the bottom portion 122ab of the outer extension structure 122a in the direction Z, and the inner channel CBI exists in the inner channel structure 122i (i.e., the inner channel CBI is covered by the cover 130), wherein the inner channel CBI has a first end CBI_1 and a second end CBI_2, the first end CBI_1 being the sound inlet OP1 of the body 122 (i.e., the sound inlet OP1 of the diffusion structure HS), and the second end CBI_2 being higher than the bottom portion 122ab of the outer extension structure 122a in the direction Z and facing the cover 130. For example, the shape of the sound inlet OP1 (i.e., the first end CBI_1 of the inner channel CBI) may be (substantially) a rectangle, and the shape of the second end CBI_2 of the inner channel CBI may be a rectangle with chamfered corners, but is not limited thereto.
[0072] For example, in Figure 1 In the embodiment, the top of the inner channel structure 122i used to form the second end CBI_2 of the inner channel CBI may be located between the sound inlet OP1 (i.e., the first end CBI_1 of the inner channel CBI) and the sound outlet OP2 in the direction Z (i.e., the top of the inner channel structure 122i may not be higher than the sound outlet OP2 in the direction Z), but the invention is not limited thereto. For example, the inner channel structure 122i may be located at the center of the main body 122 in a top view, but the invention is not limited thereto.
[0073] like Figures 1 to 3 As shown, the cover 130 may have a top structure 132 and a side structure 134, the side structure 134 is connected to the top structure 132 and surrounds the top structure 132, wherein the top structure 132 may overlap the inner channel structure 122i of the main body 122 in the direction Z, and the side structure 134 surrounds the inner channel structure 122i of the main body 122. Figures 1 to 3 In the embodiment, the cover 130 may be disposed between the sound inlet OP1 and the sound outlet OP2 of the main body 122 , so that the cover 130 may not be higher than the sound outlet OP2 in the direction Z. The cover 130 is surrounded by the external expansion structure 122 a of the main body 122 , but is not limited thereto.
[0074] like Figure 1 As shown, the cover 130 is disposed on the inner channel structure 122i, which means that in the diffusion structure HS, there is a space between the main body 122 and the cover 130, so that a part of the sound path SP (such as the curved portion CP1) is formed between the main body 122 and the cover 130. Figure 1 In the embodiment, the sound path SP has a first portion SP1 formed between the inner channel structure 122i of the main body 122 and the inner surface of the cover 130, wherein the first portion SP1 has a first path size that is smaller than the size of the sound inlet OP1 and the size of the sound outlet OP2. Figure 1 In the figure, the sound path SP also has a second part (second sound path part) SP2 and a third part (third sound path part) SP3, the first part SP1 is connected between the second part SP2 and the third part SP3, wherein the second part SP2 is between the external extension structure 122a of the main body 122 and the outer surface of the cover 130, and the third part SP3 is formed by the inner channel CBI of the inner channel structure 122i (that is, the third part SP3 is formed in the inner channel structure 122i).
[0075] In some embodiments, Figure 1 In the sound path SP, the first path size of the first portion SP1 is smaller than the second path size of the second portion SP2 and the third path size of the third portion SP3, so that after the first acoustic wave W1 passes through the sound path SP of the diffusion structure HS, the sound pressure level of the first acoustic wave W1 is increased, and the first acoustic wave W1 is diffused to reduce the directivity of the first acoustic wave W1. In some embodiments, the minimum path size of the sound path SP may exist in the first portion SP1.
[0076] exist Figure 1 In order to make the first portion SP1 of the sound path SP have a smaller first path size, the top structure 132 of the cover 130 can be as close to the inner channel structure 122i as possible to increase the effect of improving the sound pressure level of the first acoustic wave W1 and the diffusion effect of the first acoustic wave W1. In addition, due to the existence of the cover 130, the first portion SP1 of the sound path SP will have an appropriate length, wherein the effect of improving the sound pressure level of the first acoustic wave W1 and the diffusion effect of the first acoustic wave W1 will increase with the increase of the length of the first portion SP1 of the sound path SP.
[0077] In addition, Figure 1 In the sound path SP, since the first path size of the first part SP1 is smaller than the third path size of the third part SP3, the first path size of the first part SP1 is smaller than the size of the sound entrance OP1 (i.e., the first end CBI_1 of the inner channel CBI) and the size of the second end CBI_2 of the inner channel CBI. In some embodiments, the size of the sound entrance OP1 (i.e., the first end CBI_1 of the inner channel CBI) may be larger than the size of the second end CBI_2 of the inner channel CBI, so that the first acoustic wave W1 will be compressed when passing through the inner channel CBI to improve the effect of improving the sound pressure level of the first acoustic wave W1 and the diffusion effect of the first acoustic wave W1. For example, in Figure 1 In the inner channel CBI, the cross-sectional size of the inner channel CBI may gradually decrease (become narrower) from the first end CBI_1 to the second end CBI_2.
[0078] In addition, the top of the inner channel structure 122i used to form the second end CBI_2 of the inner channel CBI can be designed to additionally affect the sound pressure level of the first acoustic wave W1 in a specific frequency range (this specific frequency range overlaps at least a portion of the first frequency range of the first acoustic wave W1) to enhance the clarity of the first acoustic wave W1 in this specific frequency range. In some embodiments, since the first acoustic energy converter 110 is a high-frequency sound-generating unit (high-frequency speaker) so that the first frequency range of the first acoustic wave W1 is higher than a specific frequency, the above-mentioned specific frequency range can be higher than this specific frequency (for example, the top of the inner channel structure 122i can affect the sound pressure level of the intermediate frequency and high frequency in the acoustic wave). In some embodiments, the size and shape of the top of the inner channel structure 122i (or the size and shape of the second end CBI_2 of the inner channel CBI) are related to the above-mentioned specific frequency range. For example, the above-mentioned specific frequency range can increase with the increase of the length and / or width of the second end CBI_2 of the inner channel CBI.
[0079] On the other hand, Figure 1 As shown in FIG. 1 , the curved portions CP1 and CP2 of the sound path SP may be formed by the cover portion 130 and the main body 122. Figure 1 In the embodiment, the bending portion CP1 connected between the first portion SP1 and the third portion SP3 may be caused by the top structure 132 of the cover 130 and the inner channel structure 122i of the main body 122, and the bending portion CP2 connected between the first portion SP1 and the second portion SP2 may be caused by the side structure 134 of the cover 130 and the bottom portion 122ab of the external extension structure 122a of the main body 122, but is not limited to this.
[0080] The curved portion CP1 may be considered to be formed by the cover portion 130, that is, the curved portion CP1 is formed near / around the cover portion 130, and / or the curved portion CP1 is formed because of the cover portion 130. Similarly, the curved portion CP2 may be considered to be formed by the bottom portion 122ab, that is, the curved portion CP2 is formed near / around the bottom portion 122ab, and / or the curved portion CP2 is formed because of the bottom portion 122ab.
[0081] In addition, Figure 1 In the illustrated embodiment, the first acoustic wave W1 propagates in a first direction (eg, opposite to direction Z) in the first portion SP1, and propagates in a second direction (eg, direction Z) opposite to the first direction in the second portion SP2 and the third portion SP3.
[0082] By utilizing the curved portion, the size of the diffusion structure HS having a specific acoustic length corresponding to the sound path SP can be reduced.
[0083] In other words, the inner channel CBI can be regarded as being formed in the inner channel structure 122i, and the size of the inner channel CBI gradually narrows from the sound inlet OP1 to the second end CBI_2 of the inner channel CBI. The cover 130 is arranged on the inner channel structure 122i, so that the curved portion CP1 of the sound path SP is formed by the cover 130. On the other hand, the outer channel (or the second portion SP2) can be regarded as being formed between the cover 130 and the outer extension structure 122a. The shape of the side wall portion 122aw is such that the size of the outer channel gradually widens from the bottom of the outer extension structure 122a to the sound outlet OP2. The curved portion CP2 of the sound path SP is formed by the bottom portion 122ab of the outer extension structure 122a.
[0084] Please refer to Figure 5 , Figure 5 FIG. 1 is a schematic cross-sectional view of a central portion of a speaker system according to an embodiment of the present invention, wherein Figure 5 for Figure 3 The structural cross-section diagram of the section line AA' shown. Figure 1 , Figure 5 It also shows Figure 1 The speaker system 100 is shown around the core part and another sound energy converter. Figures 2 to 5 As shown, the speaker system 100 may further include a second acoustic energy converter 140 for generating a second acoustic wave W2, wherein the second frequency range of the second acoustic wave W2 may be designed according to requirements. For example, the second acoustic energy converter 140 may be a low-frequency sound generating unit (i.e., as a low-frequency speaker), so that the second frequency range of the second acoustic wave W2 may be lower than a specific frequency, but is not limited thereto. It should be noted that the average value of the first frequency range is higher than the average value of the second frequency range.
[0085] like Figure 5 As shown, the diffusion structure HS is disposed on the first acoustic energy converter 110 and is used to guide the first acoustic wave W1 to propagate through the sound path SP formed in the diffusion structure HS. After the first acoustic wave W1 propagates through the sound path SP in the diffusion structure HS, the first acoustic wave W1 is diffused at the sound outlet OP2 of the directional diffusion structure HS.
[0086] The second acoustic energy converter 140 may be any suitable speaker. For example, the second acoustic energy converter 140 may be a speaker having a dynamic driver (eg, an acoustic dynamic driver), a MEMS speaker including a MEMS structure, or other suitable speakers.
[0087] The second acoustic energy converter 140 can be disposed at any suitable location. Figure 5 As shown, the second sound energy converter 140 may correspond to the center of the sound diffusion plate 120 in the direction Z, but is not limited thereto. Figure 5 As shown, the second acoustic energy converter 140 may overlap the first acoustic energy converter 110 in the direction Z, but is not limited thereto. Figure 5 In the figure, the center of the first acoustic transducer 110 corresponds to the center of the second acoustic transducer 140 in the direction Z, but the present invention is not limited thereto.
[0088] The second acoustic wave W2 also passes through the sound diffusion plate 120. Figures 2 to 5 In the embodiment, the sound diffusion plate 120 may further include a sound passing structure 124, which corresponds to the second acoustic energy converter 140, wherein the sound passing structure 124 may have at least one hollow portion 124h, and the second acoustic wave W2 passes through the hollow portion 124h to pass through the sound diffusion plate 120.
[0089] The sound passing structure 124 can be designed according to the requirements. Figures 2 to 5 In the embodiment, the sound passing structure 124 can be directly connected to the main body 122, but the present invention is not limited thereto. Figures 2 to 5 In the embodiment, the main body 122 may be surrounded by the sound passing structure 124 and / or the hollow portion 124h, but the present invention is not limited thereto. Figures 2 to 5 In the present invention, the sound passing structure 124 and the main body 122 may be concentric (i.e., the center of the sound passing structure 124 may correspond to the center of the main body 122 in the direction Z), and / or the hollow portion 124h and the main body 122 may be concentric (i.e., the center of the hollow portion 124h may correspond to the center of the main body 122 in the direction Z), but is not limited thereto.
[0090] like Figures 2 to 5 As shown, the sound passing structure 124 may have a plurality of hollow portions 124h (eg, six hollow portions 124h are shown in the figure), and each hollow portion 124h has the same shape and size, but is not limited thereto. Figures 2 to 5 In the embodiment, the hollow portion 124h may overlap the second acoustic energy converter 140 in the direction Z, but is not limited thereto.
[0091] According to the above, the first acoustic wave W1 generated by the first acoustic energy converter 110 and the second acoustic wave W2 generated by the second acoustic energy converter 140 will pass through the diffusion structure HS (that is, the first acoustic wave W1 passes through the sound path SP formed by the main body 122 and the cover 130, and the second acoustic wave W2 passes through the hollow portion 124h of the sound passing structure 124), so that the two acoustic energy converters can generate sound in one speaker system 100.
[0092] In the present invention, the speaker system 100 is disposed in any suitable sound-generating device, so that the sound-generating device uses a MEMS speaker (ie, the first acoustic transducer 110 ) to generate loud and diffuse sound.
[0093] Please refer to Figure 6 , Figure 6 FIG. 1 is an exploded schematic diagram of a headset according to an embodiment of the present invention. Figure 6 As shown, the above-mentioned speaker system 100 can be disposed in a headset 200, and the headset 200 is a sound-generating device.
[0094] The headset 200 may also include any suitable components as desired. Figure 6 In the embodiment, the headset 200 may further include a headset cover 210 and a cushion 220, wherein the headset cover 210 and the cushion 220 are the outermost components, wherein the speaker system 100 is disposed between the headset cover 210 and the cushion 220. The headset cover 210 and the cushion 220 are used to protect the components disposed therebetween, and the cushion 220 improves the wearing comfort of the headset 200. In addition, in Figure 6 In the embodiment, the headphone cover 210 has a hole 212, so that the wire can be connected between the acoustic energy converter of the speaker system 100 and the external device through the hole 212. Figure 2 and Figure 6 In the embodiment, the sound diffusion plate 120 of the speaker system 100 may have a peripheral area 126 . The peripheral area 126 may surround the sound transmission structure 124 and the main body 122 . The buffer pad 220 may be disposed on the peripheral area 126 .
[0095] In addition, Figure 6In the embodiment, the headset 200 may further include a foam structure 230 disposed between the sound diffusion plate 120 and the cushion 220 of the speaker system 100, wherein the foam structure 230 may cover the sound passing structure 124 to prevent external objects (such as dust) from entering the speaker system 100 through the hollow portion 124h, thereby protecting the second sound energy converter 140. Figure 6 In the embodiment, the headset 200 may further include an annular body 240 , which is disposed on the foam structure 230 to fix the foam structure 230 .
[0096] In summary, according to the speaker system and the diffusion structure of the present invention, after the acoustic wave passes through the sound path of the diffusion structure, the sound pressure level of the acoustic wave is increased, and the acoustic wave is diffused so that the directivity of the acoustic wave is reduced.
[0097] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the claims of the present invention should fall within the scope of the present invention.
Claims
1. A speaker system, include: a first acoustic energy converter for generating a first acoustic wave; a second acoustic energy converter for generating a second acoustic wave; as well as A diffusion structure; wherein the diffusion structure is disposed on the first acoustic energy converter, and the diffusion structure is used to guide the first acoustic wave to propagate through a sound passage formed in the diffusion structure; After the first acoustic wave propagates through the sound passage in the diffusion structure, the directivity of the first acoustic wave is diffused at a sound outlet of the diffusion structure. 2 . The speaker system as claimed in claim 1 , wherein the diffusion structure comprises a main body and a cover, and the cover is disposed on the main body.
3. The speaker system according to claim 2, Wherein the main body comprises an inner channel structure; An inner channel is formed in the inner channel structure.
4. The speaker system according to claim 3, wherein the size of the inner passage gradually narrows from a sound inlet toward one end of the inner passage; The end of the inner channel faces the cover portion.
5. The speaker system according to claim 3, The cover is disposed on the inner channel structure so that a curved portion of the sound passage is formed by the cover.
6. The speaker system according to claim 2, Wherein the main body comprises an external expansion structure; An outer channel is formed between the cover and the outer expansion structure.
7. The speaker system according to claim 6, wherein the external extension structure comprises a side wall portion; The shape of the side wall portion is such that the size of the outer channel gradually widens from the bottom of the outer expansion structure toward the sound outlet.
8. The speaker system according to claim 6, wherein the external expansion structure comprises a bottom portion; A curved portion of the sound path is formed by the bottom portion of the external expansion structure.
9. The speaker system as claimed in claim 1, wherein a sound pressure level of the first acoustic wave at the sound outlet is greater than a sound pressure level of the first acoustic wave at a sound inlet of the diffusion structure.
10. The speaker system as claimed in claim 1, wherein the first sound energy transducer serves as a high-frequency speaker of the speaker system, and the second sound energy transducer serves as a low-frequency speaker of the speaker system.
11. The speaker system of claim 1, wherein the first acoustic transducer is a micro-electromechanical system device.
12. The speaker system as described in claim 2 also includes a sound diffusion plate, the sound diffusion plate includes the main body of the diffusion structure, wherein the sound diffusion plate also includes at least one hollow portion, and the second acoustic wave passes through the at least one hollow portion.
13. The speaker system of claim 12, wherein the at least one hollow portion surrounds the body.
14. The speaker system of claim 12, wherein the body is concentric with the at least one hollow portion.
15. The speaker system of claim 1, wherein a center of the first acoustic transducer corresponds to a center of the second acoustic transducer.
16. The speaker system of claim 1, wherein the second acoustic transducer is an acoustic dynamic driver.
17. The speaker system according to claim 2, The main body includes an inner channel structure and an outer expansion structure; The sound path includes a first part, a second part and a third part; The first part is formed between an inner surface of the cover and the inner channel structure, the second part is formed between an outer surface of the cover and the external expansion structure, and the third part is formed in the inner channel structure.
18. The speaker system according to claim 17, wherein the first acoustic wave propagates in a first direction in the first portion, and the first acoustic wave propagates in a second direction in the second portion and the third portion; The second direction is opposite to the first direction.
19. The speaker system of claim 17, wherein the sound path include: a first curved portion connected to the first portion and the second portion; as well as A second bent portion is connected to the first portion and the third portion.
20. The speaker system of claim 1, wherein the sound path is N-shaped in cross section.
21. The speaker system of claim 1, wherein the speaker system is used in a headphone.
22. A diffusion structure, arranged or to be arranged in a speaker system, the diffusion structure include: One subject; as well as a cover portion, disposed on the main body; wherein the diffusion structure is or will be arranged on a first acoustic energy converter of the speaker system; The diffusion structure is used to guide a first acoustic wave generated by the first acoustic energy converter to propagate through a sound passage formed in the diffusion structure.
23. A diffusion structure as described in claim 22, wherein after the first acoustic wave propagates through the sound path within the diffusion structure, the directivity of the first acoustic wave is diffused at a sound outlet of the diffusion structure.
24. The diffusion structure according to claim 22, Wherein the main body comprises an inner channel structure; wherein an inner channel is formed in the inner channel structure; wherein the size of the inner passage gradually narrows from a sound inlet toward one end of the inner passage; The end of the inner channel faces the cover portion.
25. The diffusion structure according to claim 22, Wherein the main body comprises an external expansion structure; wherein an outer channel is formed between the cover portion and the outer expansion structure; wherein the external extension structure comprises a side wall portion; The shape of the side wall portion is such that the size of the outer channel gradually widens from the bottom of the outer expansion structure to a sound outlet of the diffusion structure.
26. The diffusion structure of claim 22, further comprising: include: a sound diffusion plate; wherein the main body is arranged in the sound diffusion plate body; wherein at least one hollow portion is formed in the sound diffusion plate body; The sound diffusion plate is disposed on a second sound energy converter; A second acoustic wave generated by the second acoustic energy converter propagates through the at least one hollow portion.
27. A headset, include: a first acoustic energy converter, used to generate a first acoustic wave, wherein the first acoustic energy converter is a micro-electromechanical system speaker; as well as A diffusion structure; wherein the diffusion structure is disposed on the first acoustic energy converter, and the diffusion structure is used to guide the first acoustic wave to propagate through a sound passage formed in the diffusion structure; After the first acoustic wave propagates through the sound passage in the diffusion structure, the directivity of the first acoustic wave is diffused at a sound outlet of the diffusion structure.
28. The headset according to claim 27, The diffusion structure comprises a main body and a cover, wherein the cover is disposed on the main body; The main body includes an inner channel structure and an outer expansion structure; wherein an inner channel is formed in the inner channel structure, the size of the inner channel gradually narrows from a sound inlet toward one end of the inner channel, and the end of the inner channel faces the cover; wherein the external extension structure comprises a side wall portion; An outer channel is formed between the cover portion and the outer expansion structure, and the side wall portion is shaped so that the size of the outer channel gradually widens from the bottom of the outer expansion structure to the sound outlet.
29. The headset according to claim 28, The diffusion structure further comprises a sound diffusion plate, and the main body is arranged in the sound diffusion plate; wherein at least one hollow portion is formed in the sound diffusion plate body; The headset includes a second acoustic energy converter, and the second acoustic energy converter is used to generate a second acoustic wave; The sound diffusion plate is disposed on the second acoustic energy converter, and the second acoustic wave propagates through the at least one hollow portion.
30. The headphone of claim 29, wherein the second acoustic transducer is an acoustic dynamic driver.
Citation Information
Patent Citations
Sound producing device
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Sound producing cell and manufacturing method thereof
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