Combined acoustic transducer and pressure sensor package

Abstract

The invention relates to a combined acoustic transducer and pressure sensor package. A combined acoustic transducer and pressure sensor package (100) is provided that includes a planar substrate (110) and a first cover (120) attached to a first substrate surface (111) with a first cavity (130) defined between the first cover (120) and the first substrate surface (111). A second cover (220) is attached to an opposing second substrate surface (112), where a second cavity (230) is defined between the second cover (220) and the second substrate surface (112), and where the second cover (220) comprises a fluid opening (240) for allowing fluid to enter the second cavity (230). A MEMS acoustic transducer (150) and a MEMS pressure sensor (250) are provided, each disposed inside opposing ones of the first and second cavities (130, 230). A transfer block for providing an electrical path between the package pad and the MEMS acoustic transducer and the MEMS pressure sensor is provided as a discrete component separate from the substrate.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to packaged electronic components, and in particular to microstructured MEMS (micro-electromechanical systems) pressure sensors such as ambient pressure sensors, and microstructured MEMS acoustic transducers such as microphones or speakers. In particular, the innovative concepts described herein relate to a combined acoustic transducer and pressure sensor package, in which a MEMS pressure sensor and a MEMS acoustic transducer are typically packaged. Background Art

[0002] MEMS pressure sensors and MEMS acoustic transducers are an integral part of today's consumer electronics. For example, smartphones, tablets, smart watches, etc. are typically equipped with one or more acoustic transducers such as microphones and speakers, as well as pressure sensors such as ambient atmospheric pressure sensors for determining altitude, etc. In addition, these consumer devices include an increasing number of additional integrated electronic components in order to meet consumers' growing demands and expectations for additional functionality. However, at the same time, the size and form factor of the devices tend to decrease. Therefore, there is a trade-off between the increase in electronic components and the reduction in available assembly space.

[0003] In some instances, the mounting space inside electronic device housings may be very limited, forcing manufacturers of integrated electronic components to find new solutions for mounting their components into small devices. One of the challenging tasks is to properly fit MEMS pressure sensors and MEMS acoustic transducers into a common housing for consumer electronic devices, as these MEMS components require additional space for fluid channels that communicate with the environment.

[0004] For example, the acoustic transducer and the pressure sensor require their own fluid channels for allowing pressure and sound waves to enter the housing. Therefore, one physical channel connected to the MEMS pressure sensor and an additional physical channel connected to the MEMS acoustic transducer must be provided. At the same time, two physical inlet ports / openings must be provided in the housing, which increases the risk of unwanted ingress of moisture, dust, environmental particles, etc. Some manufacturers provide so-called elastic brackets that act as internal port separators inside the housing so that only one physical port (opening) needs to be provided in the housing.

[0005] In addition, the MEMS pressure sensor and the MEMS acoustic transducer are each packaged in separate packages. Of course, this not only increases cost, but also consumes the already limited available assembly space within the device housing. Therefore, some manufacturers combine the MEMS pressure sensor and the MEMS acoustic transducer into a common package, which results in a very bulky package.

[0006] In addition, in order to allow the fluid to enter the corresponding package, each package must include a fluid port / opening connected to the fluid channel mentioned above. The advantage of the combined sensor package is that only one fluid port needs to be provided. However, the MEMS acoustic transducer should be installed so that it covers the fluid port in order to provide a larger back cavity that increases the overall performance of the acoustic transducer. Therefore, the MEMS acoustic transducer is installed in front of the MEMS pressure sensor in the fluid path. Since the membrane of the MEMS acoustic transducer attenuates the arriving pressure waves, this may lead to erroneous pressure sensing by the subsequently arranged pressure sensor.

[0007] Another advantage of the combined sensor package may be the possibility of joint package connection, i.e. both the MEMS pressure sensor and the MEMS acoustic transducer may be electrically connected via package pads provided on the outside of the common package. However, since this may be dictated by the limited available assembly space inside the housing, it may sometimes be necessary to mount such a package so that its fluid opening is positioned opposite the package pad. Therefore, the package pad and the fluid opening must be positioned on two opposite sides of the package, which may be a challenging task.

[0008] It would therefore be desirable to provide a combined MEMS acoustic transducer and MEMS pressure sensor package that does not suffer from the above mentioned disadvantages. Summary of the invention

[0009] This can be achieved by a combined acoustic transducer and pressure sensor package according to independent claim 1. The innovative acoustic transducer and pressure sensor package comprises a planar substrate and a first cover attached to a first substrate surface, wherein a first cavity is defined between the first cover and the first substrate surface, and wherein the first cover comprises a fluid opening for allowing fluid to enter the first cavity. The package also comprises a second cover attached to an opposite second substrate surface, wherein a second cavity is defined between the second cover and the second substrate surface. The substrate comprises a through hole for providing fluid communication between the first cavity and the second cavity. The MEMS acoustic transducer is arranged inside one of the first and second cavities, and the MEMS acoustic transducer covers the through hole. The MEMS pressure sensor is arranged inside the other cavity of the first and second cavities, and the MEMS pressure sensor is spaced apart from the through hole. The package comprises one or more package pads for electrically contacting the MEMS acoustic transducer and the MEMS pressure sensor from outside the package. The one or more package pads and the fluid opening in the first cover are positioned at two opposite sides of the package. According to the innovative concepts described herein, a transfer block is arranged at the second substrate surface, wherein the transfer block is configured to provide an electrical path between one or more package pads and the MEMS acoustic transducer and the MEMS pressure sensor. The transfer block is provided as a discrete component separated from the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Hereinafter, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings, in which:

[0011] Figure 1 shows a schematic side cross-sectional view of a combined acoustic transducer and pressure sensor package according to one embodiment,

[0012] Figure 2 shows a schematic side cross-sectional view of a combined acoustic transducer and pressure sensor package according to another embodiment,

[0013] Figure 3 shows a schematic side cross-sectional view of a combined acoustic transducer and pressure sensor package according to another embodiment,

[0014] Figure 4 shows a schematic side cross-sectional view of a combined acoustic transducer and pressure sensor package according to another embodiment,

[0015] Figure 5 shows a schematic side cross-sectional view of a combined acoustic transducer and pressure sensor package according to another embodiment,

[0016] Figure 6 shows a schematic side cross-sectional view of a combined acoustic transducer and pressure sensor package according to another embodiment, and

[0017] Figure 7 A schematic side cross-sectional view of a combined acoustic transducer and pressure sensor package according to another embodiment is shown. DETAILED DESCRIPTION

[0018] In the following description, the same or equivalent elements or elements having the same or equivalent functions are denoted by the same or equivalent reference numerals.

[0019] The method steps depicted by means of the block diagrams and described with reference to the block diagrams may also be performed in an order different from the depicted and / or described order. Furthermore, method steps relating to specific features of the device may be replaced with said features of the device and vice versa.

[0020] Figure 1 A combined acoustic transducer and pressure sensor package 100 is shown according to one embodiment. The package 100 may be configured for packaging microstructured electronics. Thus, the package 100 may include relatively small dimensions, such as 5×5 mm.

[0021] The package 100 includes a planar substrate 110 and a first cover 120 attached to a first substrate surface 111 , wherein a first cavity 130 is defined between the first cover 120 and the first substrate surface 111 .

[0022] The package 100 further includes a second cover 220 attached to the opposing second substrate surface 112, wherein a second cavity 230 is defined between the second cover 220 and the second substrate surface 112. The second cover 220 includes a fluid opening 240 for allowing fluid to enter the second cavity 230.

[0023] Optionally, an environmental barrier structure 280 may be arranged in or at the fluid opening 240 provided in the second cover 220. The environmental barrier structure 280 may be used for the purpose of preventing unwanted ingress of environmental dust, moisture, liquids, solid particles, etc. The environmental barrier structure 280 may be configured as a rigid mesh or a compliant / flexible membrane. The environmental barrier structure 280 is an optional feature that may be optionally provided in each of the embodiments discussed herein.

[0024] Further optionally, a mechanical stopper 281 may be disposed in the fluid opening 240 provided in the second cover 220. The mechanical stopper 281 may be provided downstream of the environmental barrier structure 280 relative to the fluid path of the fluid entering the second chamber 230. The mechanical stopper 281 is configured to limit the amount of deflection of the environmental barrier structure 280. For example, in the case where the environmental barrier structure 280 may be provided as a flexible membrane, the mechanical stopper 281 may avoid undesirable excessive bending of the environmental barrier structure 280, as the deflected environmental barrier structure 280 may hit the mechanical stopper 281.

[0025] The substrate 110 includes a through hole 140 for providing fluid communication between the first cavity 130 and the second cavity 230. According to this non-limiting exemplary embodiment, the MEMS acoustic transducer 150 is arranged inside the first cavity 130. The MEMS acoustic transducer 150 is mounted at the first substrate surface 111 so that it covers the through hole 140. The substrate 110 itself may be cavity-free, that is, except for the through hole 140, the substrate 110 itself may not include other cavities.

[0026] The MEMS pressure sensor 250 is arranged inside the second cavity 230 formed by the second cover 220. The MEMS pressure sensor 250 is mounted at the second substrate surface 112 such that it is laterally spaced apart from the through-hole 140 in the substrate 110.

[0027] The package 100 further comprises one or more package pads 160 for electrically contacting the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 from outside the package 100. The one or more package pads 160 and the fluid openings 240 in the second cover 220 are positioned at two opposite sides 101, 102 of the package 100.

[0028] A rigid transfer block 180 is disposed at the first substrate surface 111. The transfer block 180 is configured to provide an electrical path between one or more package pads 160 and the MEMS acoustic transducer 150 and the MEMS pressure sensor 250. The transfer block 180 is provided as a discrete component separate from the substrate 110. According to this non-limiting exemplary embodiment, the transfer block 180 is disposed inside the first cavity 130.

[0029] The package pad 160 for externally contacting the package 100 may be arranged at the transfer block 180. For example, the first cover 120 may include a hole 128 provided at the first side 101 of the package 100. The hole 128 may be configured to accommodate a receiving portion 175 of the transfer block 180. The receiving portion 175 may be a protruding portion protruding from the upper surface of the transfer block 180. The upper surface may be a surface of the transfer block 180 facing the first cover 120. The receiving portion 175 may include a smaller width / diameter than the rest of the transfer block 180.

[0030] The hole 128 provided in the first cover 120 can be wider than the width of the accommodating portion 175 of the transfer block 180, so that the transfer block 180 is accommodated in the hole 128 by a clearance fit. The gap between the accommodating portion 175 and the hole 128 can be filled with a bonding material 129, in particular a non-conductive bonding material such as glue. For example, the non-conductive bonding material 129 can be permanently elastic, so that it is elastic before and after curing. For example, the bonding material 129 may include a permanent elastic soft glue. Alternatively, the non-conductive bonding material 129 may be temporarily elastic, so that it is elastic before curing, but inelastic after curing. For example, the bonding material 129 may include a solder that is solid at room temperature but viscous / flexible at a certain reflow temperature.

[0031] For example, the rigid transfer block 180 may be securely secured to one of the first substrate surface 111 and the first cover 120 while being flexibly secured (at least temporarily, such as during assembly) to the other of the first substrate surface 111 and the first cover 120. Figure 1 In the exemplary embodiment shown, the rigid transfer block 180 may be securely secured to the first substrate surface 111 and flexibly secured to the first cover 120 .

[0032] The planar substrate 110 may be configured as a rigid substrate. For example, the planar substrate 110 may be configured as a laminated printed circuit board (PCB). The planar substrate 110 may include wiring connections including one or more wiring structures for electrically connecting the transfer block 180, the MEMS acoustic transducer 150, and the MEMS pressure sensor 250 to each other. The wiring connections of the substrate 110 may include at least one of one or more conductive surface pads 126, one or more conductive surface traces 125, and one or more integrated conductive layers 124 to provide the electrical paths mentioned above between the externally accessible package pads 160 and any electronic components residing in the package 100 (e.g., the MEMS acoustic transducer 150 and the MEMS pressure sensor 250).

[0033] The transfer block 180 may also be rigid. For example, the transfer block 180 may be made of the same or similar material as the substrate 110, such as a PCB material. The transfer block 180 may include one or more external electrical conductors (not explicitly shown) routed vertically along its periphery, and / or one or more internal electrical conductors (not explicitly shown) routed through the interior of the transfer block 180. The one or more electrical conductors may provide a conductive path between a first side of the transfer block 180 facing the first cover 120 and an opposite second side of the transfer block 180 facing the first substrate surface 111. For example, the one or more electrical conductors may provide a conductive path between the package pad 160 and the wiring structure 126 of the substrate 110.

[0034] Alternatively, a first control circuit device 190 for controlling the MEMS acoustic transducer 150 may reside inside the first cavity 130, for example adjacent to the MEMS acoustic transducer 150 on the same substrate surface 111. The MEMS acoustic transducer 150 may be coupled to the first control circuit device 190 by means of a flexible conductor 121 (for example by means of a bonding wire). Figure 1 As exemplarily depicted in FIG. 1 , the first control circuit arrangement 190 may be placed in the electrical path between the transfer block 180 and the MEMS acoustic transducer 150 . However, the first control circuit arrangement 190 is merely optional, as it may also be provided outside the package 100 .

[0035] Further optionally, a second control circuit device 290 for controlling the MEMS pressure sensor 250 may reside inside the second cavity 230, for example between the MEMS pressure sensor 250 and the second substrate surface 112. The MEMS pressure sensor 250 may be coupled to the second control circuit device 290 by means of a flexible conductor 221 (for example by means of a bonding wire). Figure 1As exemplarily depicted in FIG. 1 , the second control circuit device 290 may be placed in the electrical path between the transfer block 180 and the MEMS pressure sensor 250. However, the second control circuit device 290 is merely optional, as it may also be provided outside the package 100. Further optionally, at least one of the first control circuit device 190 and the second control circuit device 290 may be configured to control both the MEMS acoustic transducer 150 and the MEMS pressure sensor 250, so that one of the first control circuit device 190 and the second control circuit device 290 may be omitted.

[0036] Further optionally, additional passive electronic devices, such as resistors, capacitors, and inductors, may be provided in at least one of the first cavity 130 and the second cavity 230. For example, one or more integrated passive devices (IPDs) 291 may be mounted at one of the first substrate surface 111 and the second substrate surface 112.

[0037] like Figure 1 100, the first cover 120 may include a box shape, because this box shape is easy to manufacture. The first cover 120 may include or be made of at least one of metal, plastic or ceramic. The second cover 220 may include a chimney shape, which has a flange 260 extending away from the substrate 110. A sealing ring (not shown) may be provided around the flange 260. For example, the fluid opening 240 of the package 100 can be connected to a fluid channel or a fluid port inside an electronic device (smartphone, etc.). The sealing ring can allow a fluid seal between the package 100 and the device.

[0038] According to the present innovative concept, both the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 are included in a common package 100. Since the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 are arranged on opposite substrate surfaces 111, 112, the package 100 can have a smaller footprint. Fluid from an environment, such as ambient air, can enter the second cavity 230 through a fluid opening 240 provided in the second cover 220. Inside the second cavity 230, the fluid pressure can be sensed by the MEMS pressure sensor 250. The control circuit device 290 can generate a corresponding electrical signal, which can be routed to the externally accessible package pad 160 via the wiring structure 124, 125, 126 of the substrate via the transfer block 180.

[0039] The fluid may then flow through the through-holes 140 in the substrate 110 where it strikes the membrane 151 of the MEMS acoustic transducer 150. The membrane 151 may vibrate in response to the striking acoustic waves, wherein the control circuitry 190 may generate a corresponding electrical signal which may be routed through the wiring structures 124, 125, 126 of the substrate via the transfer block 180 to the externally accessible package pads 160.

[0040] According to the reference Figure 1 Arranging the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 in the manner discussed may be advantageous because the fluid entering the fluid opening 240 in the second cover 220 first reaches the MEMS pressure sensor 250 before reaching the MEMS acoustic transducer 150. Otherwise, the membrane 151 of the MEMS acoustic transducer 150 may attenuate some of the pressure of the entering fluid, which may result in a reduced signal-to-noise ratio (SNR) of the MEMS pressure sensor 250 or pressure measurement errors.

[0041] Figure 2 Another embodiment of the package 100 is shown, wherein Figure 1 The same elements having the same or similar functions are denoted by the same reference numerals. Figure 1 Everything discussed also applies to Figure 2 The embodiment shown is also vice versa.

[0042] according to Figure 2 , the MEMS pressure sensor 250 is arranged inside the first cavity 130 , and the MEMS acoustic transducer 150 is arranged inside the second cavity 230 , so that the fluid entering the second cavity 230 through the fluid opening 240 in the second cover 220 first reaches the MEMS acoustic transducer 150 before reaching the MEMS pressure sensor 250 .

[0043] In other words, the MEMS acoustic transducer 150 is mounted at the second substrate surface 112 such that it covers the through-hole 140. The MEMS pressure sensor 250 is arranged at the first substrate surface 111, laterally spaced apart from the through-hole 140.

[0044] This embodiment may be advantageous because the first control circuit device 190 for controlling the MEMS acoustic transducer 150 may be arranged on a substrate surface opposite to the MEMS acoustic transducer 150 itself. For example, the MEMS acoustic transducer 150 may be mounted at the second substrate surface 112, while the first control circuit device 190 may be mounted at the first substrate surface 111. The MEMS acoustic transducer 150 and the first control circuit device 190 may be coupled to each other via the wiring structures 124, 125, 126 of the substrate 110. This embodiment may save assembly space inside the package 100.

[0045] Alternatively, the first control circuit arrangement 190 may be arranged at the second substrate surface 112 , as schematically indicated by means of a first control circuit arrangement 190 ′ drawn in dashed lines. In this case, additional assembly space is available at the first substrate surface 111 for integrating further components.

[0046] Figure 3 Another embodiment of a package 100 is shown, wherein the same elements having the same or similar functions as in the previous figures are indicated by the same reference numerals. Therefore, everything discussed with reference to the previous figures also applies to the Figure 3 The embodiment shown is also vice versa.

[0047] according to Figure 3 , at least one of the available first control circuit device 190 and the second control circuit device 290 can be optionally integrated inside the planar substrate 110. The MEMS sound transducer 150 and the MEMS pressure sensor 250 can be coupled to the first control circuit device 190 and the second control circuit device 290 via at least one of the wiring structures 124, 125, 126 of the substrate, in particular via the integrated conductive layer 124 provided in the substrate 110 (not explicitly shown here).

[0048] This embodiment may be advantageous since additional assembly space for integrating other components is available at both the first substrate surface 111 and the second substrate surface 112 . Furthermore, the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 may be arranged on the same substrate surface 111 , 112 .

[0049] In addition, as in Figure 3 As exemplarily depicted in FIG, the transfer block 180 may include two or more of the above-discussed receiving portions 175. Each receiving portion 175 may include a package pad 160 for making external contact to the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 from outside the package 100. The transfer block 180 may be coupled to the electrical path via two or more of the wiring structures 124, 125, 126 of the substrate.

[0050] Figure 4 Another embodiment of a package 100 is shown, wherein the same elements having the same or similar functions as in the previous figures are indicated by the same reference numerals. Therefore, everything discussed with reference to the previous figures also applies to the Figure 4 The embodiment shown is also vice versa.

[0051] according to Figure 4, the transfer block 180 may be arranged outside the first cavity 130, adjacent to the first cover 120. The transfer block 180 may be mounted at the first substrate surface 111. At opposite end faces of the transfer block 180, one or more package pads 160 discussed above (not visible here) may be provided for contacting the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 from outside the package 100.

[0052] As in Figure 4 As exemplarily depicted in FIG, the innovative package 100 may be coupled to a separate component board 210, which may be part of a device (e.g., a smartphone, etc.) in which the innovative package 100 may be mounted. The component board 210 may be arranged at a first package side 101 opposite to the first substrate surface 111. A transfer block 180 may be arranged between the substrate 110 and the component board 210. For example, the transfer block 180 may be mechanically and galvanically coupled to the component board 210, for example, by means of the aforementioned one or more package pads 160.

[0053] The component board 210 can be configured as a planar and rigid substrate. The height of the transfer block 180 and the height of the first cover 120 can be substantially the same. This means that the height of the transfer block 180 can deviate from the height of the first cover 120 by less than ±20%, or less than ±10%. Therefore, the component board 210 can be placed on the outer surface of the first cover 120, in particular, the outer surface facing away from the substrate 110. Therefore, the innovative package 100 can be directly mounted on the component board 210, so that the first cover 120 is in direct contact with the component board 210, which significantly reduces the assembly space required for mounting the package 100. Therefore, even if the fluid opening 240 and the package pad 160 are positioned on two opposite sides of the package 100, the height of the installed package 100 can also be significantly reduced.

[0054] The component board 210 may include wiring structures (not explicitly shown), such as conductive surface pads and / or conductive traces and / or integrated conductive layers, as previously discussed with respect to the substrate 110. Via the wiring structures, a conductive path may be established between the component board 210 and the transfer block 180, wherein one or more package pads 160 are disposed between the transfer block 180 and the component board 210 in the conductive path.

[0055] The transfer block 180 may include one or more inner and / or outer electrical conductors 181 that are respectively routed vertically along the periphery thereof or through the interior of the transfer block 180. The one or more electrical conductors 181 may provide a conductive path between the substrate 110 and the component board 210.

[0056] For example, the electrical conductor 181 may provide a conductive path between the component board 210 and the wiring structures 124, 125, 126 of the substrate 110. As described above, the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 may be coupled to the transfer block 180 via the wiring structures 124, 125, 126 of the substrate 110. Therefore, even if the transfer block 180 may be arranged outside the package 100, an electrical path may be provided between at least one of the package pad 160 and the transfer block 180 and the MEMS acoustic transducer 150 and the MEMS pressure sensor 250.

[0057] In addition, the transfer block 180 as previously discussed with reference to the previous drawings may be provided inside the first cavity 130. In this case, the package pad 160 protruding from the first cover 120 may be connected to the wiring structure of the component board 210.

[0058] according to Figure 4 In the illustrated embodiment, the MEMS acoustic transducer 150 may be arranged inside the first cavity 130 formed between the first cover 120 and the first substrate surface 111 of the substrate 110. The MEMS pressure sensor 250 may be arranged inside the second cavity 230 formed between the second cover 220 and the second substrate surface 112 of the substrate 110. This arrangement may be substantially the same as previously described with reference to Figure 1 Therefore, everything mentioned above also applies to Figure 4 The embodiment shown.

[0059] Figure 5 Another embodiment of a package 100 is shown, wherein the same elements having the same or similar functions as in the previous figures are indicated by the same reference numerals. Therefore, everything discussed with reference to the previous figures also applies to the Figure 5 The embodiment shown is also vice versa.

[0060] and Figure 4 compared to, Figure 5 The arrangement is exchanged, that is, the MEMS acoustic transducer 150 can be arranged inside the second cavity 230 between the second cover 220 and the second substrate surface 112 of the substrate 110, and the MEMS pressure sensor 250 can be arranged in the first cavity 130 formed between the first cover 120 and the first substrate surface 111 of the substrate 110. This arrangement can be basically the same as previously described with reference to Figure 2 Therefore, everything mentioned above also applies to Figure 5 The embodiment shown.

[0061] Figure 6Another embodiment of a package 100 is shown, wherein the same elements having the same or similar functions as in the previous figures are indicated by the same reference numerals. Therefore, everything discussed with reference to the previous figures also applies to the Figure 6 The embodiment shown is also vice versa.

[0062] Figure 6 The embodiment shown is substantially the same as previously described with reference to Figure 4 Therefore, everything discussed with reference to the previous figures also applies to Figure 6 In addition, according to the embodiment shown, Figure 6 The package 100 may include another transfer block 180', which is arranged outside the first cavity 130 and adjacent to the first cover 120. As exemplarily depicted, both the transfer block 180 and the other transfer block 180' may be positioned on opposite lateral sides (e.g., left and right) of the first cover 120. However, both the transfer block 180 and the other transfer block 180' may also be positioned on the same lateral side of the first cover 120.

[0063] The component plate 210 may be arranged on an outer surface of the first cover 120, in particular, an outer surface facing away from the substrate 110. The transfer block 180 and the further transfer block 180' may be arranged between the substrate 110 and the component plate 210.

[0064] Each of the transfer blocks 180, 180' may include one or more previously discussed package pads 160 (not visible here) for electrically contacting the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 from outside the package 100. In particular, one or more package pads 160 may be arranged between the respective transfer blocks 180, 180' and the component board 210. The component board 210 may be mechanically and / or electrically connected to the transfer blocks 180, 180', for example, by means of one or more package pads 160 arranged at the respective transfer blocks 180, 180'.

[0065] Another transfer block 180' may include one or more internal and / or external electrical conductors 181', which are respectively routed vertically along the periphery thereof or routed through the interior of the transfer block 180'. The one or more electrical conductors 181' may provide a conductive path between the substrate 110 and the component board 210.

[0066] For example, the electrical conductor 181' may provide a conductive path between the component board 210 and the wiring structures 124, 125, 126 of the substrate 110. As described above, the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 may be coupled to at least one of the transfer block 180 and the other transfer block 180' via the wiring structures 124, 125, 126 of the substrate 110. Therefore, even if the transfer blocks 180, 180' may be arranged outside the package 100, an electrical path may be provided between the package pad 160 and at least one of the transfer blocks 180, 180' and the MEMS acoustic transducer 150 and the MEMS pressure sensor 250.

[0067] exist Figure 6 In the embodiment of FIG. 1 , the positions of the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 may be swapped, for example Figure 5 In addition, another transfer block may be optionally arranged in the first cavity 130, for example Figure 1 As exemplarily depicted in .

[0068] Since the transmission blocks 180, 180' arranged on two opposite lateral sides of the first cover 120 can be provided for a symmetrical design which balances the mechanical loads during assembly of the package 100 or during replacement of its components, Figure 6 The arrangement depicted in may be advantageous. Furthermore, the symmetrical design may increase the number of transmission channels, which may be provided for the number of connections between the MEMS acoustic transducer 150 and the MEMS pressure sensor 250 .

[0069] Figure 7 Another embodiment of a package 100 is shown, wherein the same elements having the same or similar functions as in the previous figures are indicated by the same reference numerals. Therefore, everything discussed with reference to the previous figures also applies to the Figure 7 The embodiment shown is also vice versa.

[0070] according to Figure 7 The transfer block 180 and optionally a further transfer block 180 ′ may be arranged on the first substrate surface 111 , for example adjacent to the first cover 120 and on the same lateral side of the first cover 120 .

[0071] In addition to the previously discussed embodiments, Figure 7 The package may include a housing 320 laterally surrounding the MEMS pressure sensor 250, wherein the housing 320 may be arranged at the second substrate surface 112. The housing 320 may be arranged inside the second cavity 230. The housing 320 may be positioned inside the second cover 220, for example, laterally surrounded by the second cover 220.

[0072] The interior of the housing 320 may be filled with a flexible pressure transmission material 330 that encapsulates the MEMS pressure sensor 250. The housing 320 may include an opening 340 in fluid communication with a fluid opening 240 provided in the second cover 220, such that a fluid entering the second cavity 230 through the fluid opening 220 contacts the flexible pressure transmission material 330 for transmitting fluid pressure toward the MEMS pressure sensor 250. The opening 340 may be provided on a side of the housing 320 facing away from the second substrate surface 112.

[0073] The housing 320 may include an outer diameter that is smaller than the inner diameter of the second cover 220. Therefore, some gap may remain between the housing 320 and the second cover 220, which may provide a fluid path 350 that allows fluid to flow into the direction of the through hole 140 provided in the substrate 110. Therefore, the fluid entering the second cavity 230 through the fluid opening 240 may flow through the housing 340 to reach the through hole 140, and thus reach the MEMS acoustic transducer 150 that is subsequently arranged.

[0074] Optionally, an environmental barrier structure 282 may be arranged between the MEMS acoustic transducer 150 and the first substrate surface 111, wherein the environmental barrier structure 282 may cover the through-hole 140. Additionally or alternatively, the environmental barrier structure 282 may be arranged at the opposite second substrate surface 112, wherein the environmental barrier structure 282 may cover the through-hole 140 from the opposite second side. The environmental barrier structure 282 may be provided alternatively or in combination with the environmental barrier structure 280 discussed previously.

[0075] Environmental barrier structure 282 can be provided in each embodiment discussed herein. In addition, housing 320 can be combined with each embodiment discussed herein. It should be noted that all embodiments discussed herein should not be considered as isolated embodiments. On the contrary, all embodiments can be combined with each other, and all features including the same reference numerals can be interchanged with each other.

[0076] Although some aspects have been described in the context of an apparatus, it is apparent that these aspects also represent a description of a corresponding method, wherein a block or device corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method step also represent a description of a corresponding block or item or feature of a corresponding apparatus.

[0077] Although the present disclosure has been described with reference to exemplary embodiments, the description is not intended to be interpreted in a limiting sense. Various modifications and combinations of the exemplary embodiments of the present disclosure and other embodiments will be apparent to those skilled in the art after reference to the specification. Therefore, the appended claims are intended to cover any such modifications or embodiments.

Claims

1. A combined acoustic transducer and pressure sensor package (100), comprising: a planar substrate (110), a first cover (120) attached to a first substrate surface (111), wherein a first cavity (130) is defined between the first cover (120) and the first substrate surface (111), a second cover (220) attached to the opposing second substrate surface (112), wherein a second cavity (230) is defined between the second cover (220) and the second substrate surface (112), and wherein the second cover (220) includes a fluid opening (240) for allowing fluid to enter the second cavity (230), wherein the substrate (110) comprises a through hole (140) for providing fluid communication between the first cavity (130) and the second cavity (230), A MEMS acoustic transducer (150) is arranged inside one of the first cavity (130) and the second cavity (230), and the MEMS acoustic transducer (150) covers the through hole (140). A MEMS pressure sensor (250) is arranged inside the other of the first cavity (130) and the second cavity (230), and the MEMS pressure sensor (250) is spaced apart from the through hole (140). One or more package pads (160) for electrically contacting the MEMS acoustic transducer (150) and the MEMS pressure sensor (250) from outside the package (100), wherein the one or more package pads (160) and the fluid opening (240) in the second cover (220) are positioned at two opposite sides (101, 102) of the package (100), and A transfer block (180) is arranged at the first substrate surface (111) and is configured to provide an electrical path between the one or more package pads (160) and the MEMS acoustic transducer (150) and the MEMS pressure sensor (250), wherein the transfer block (180) is provided as a discrete component separated from the substrate (110).

2. The combined acoustic transducer and pressure sensor package (100) according to claim 1, wherein the MEMS acoustic transducer (150) is arranged inside the first cavity (130), and wherein the MEMS pressure sensor (250) is arranged inside the second cavity (230), The fluid entering the second cavity (230) through the fluid opening (240) in the second cover (220) reaches the MEMS pressure sensor (250) before reaching the MEMS acoustic transducer (150).

3. The combined acoustic transducer and pressure sensor package (100) according to claim 1, wherein the MEMS pressure sensor (250) is arranged inside the first cavity (130), and wherein the MEMS acoustic transducer (150) is arranged inside the second cavity (230), The fluid entering the second cavity (230) through the fluid opening (240) in the second cover (220) reaches the MEMS acoustic transducer (150) before reaching the MEMS pressure sensor (250).

4. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 1 to 3, The transfer block (180) is arranged inside the first cavity (130).

5. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 1 to 3, The transfer block (180) is arranged outside the first cavity (130) and adjacent to the first cover (120).

6. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 1 to 3, Another transfer block (180') is included, wherein both the transfer block (180) and the other transfer block (180') are arranged outside the first cavity (130), and both the transfer block (180) and the other transfer block (180') are adjacent to the first cover (120), but on opposite lateral sides of the first cover (120).

7. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 1 to 6, The one or more package pads (160) are provided at the transfer block (180) opposite to the first substrate surface (111).

8. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 1 to 7, wherein the transfer block (180) comprises a height substantially corresponding to a height of the first cover (120), and The one or more package pads (160) are configured to couple the transfer block (180) to a separate component board (210) disposed at an outer surface of the first cover (120).

9. The combined acoustic transducer and pressure sensor package (100) according to claim 8, The one or more package pads (160) are arranged between the transfer block (180) and the component board (210) to provide a conductive path between the wiring of the component board (210) and the transfer block (180).

10. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 3 to 9, comprising a housing (320) laterally surrounding the MEMS pressure sensor (250), wherein the housing (320) is arranged at the second substrate surface (112), The interior of the housing (320) is filled with a flexible pressure transmission material (330), and the flexible pressure transmission material (330) encapsulates the MEMS pressure sensor (250). wherein the housing (320) includes an opening (340) that is in fluid communication with the fluid opening (240) provided in the second cover (220), The fluid entering the second cavity (230) through the fluid opening (240) is brought into contact with the flexible pressure transmission material (330) for transmitting fluid pressure toward the MEMS pressure sensor (250).

11. The combined acoustic transducer and pressure sensor package (100) of claim 10, An environmental barrier structure (282) is included, covering the through hole (140) provided in the planar substrate (110).

12. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 1 to 11, An environmental barrier structure (280) is included and is arranged in or at the fluid opening (240) provided in the second cover (220).

13. The combined acoustic transducer and pressure sensor package (100) of claim 12, comprising a mechanical stop (281) provided downstream of the environmental barrier structure (280) relative to the fluid path of the fluid entering the second chamber (230), The mechanical stop (281) is configured to limit deflection of the environmental barrier structure (280).

14. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 1 to 13, The planar substrate (110) includes wiring connections (124, 125, 126) for electrically connecting the transfer block (180), the MEMS sound transducer (150), and the MEMS pressure sensor (250).

15. The combined acoustic transducer and pressure sensor package (100) according to any one of claims 1 to 14, A control circuit device (190, 290) is included for controlling at least one of the MEMS acoustic transducer (150) and the MEMS pressure sensor (250), and the control circuit device (190, 290) is integrated in the planar substrate (110).

16. A combined acoustic transducer and pressure sensor package (100) according to any one of the preceding claims, The transmission block (180) includes at least one electrical conductor passing through the interior of the transmission block (180).

17. A combined acoustic transducer and pressure sensor package (100) according to any one of the preceding claims, The transfer block (180) is securely fixed to one of the first substrate surface (111) and the first cover (120), and is flexibly fixed to the other of the first substrate surface (111) and the first cover (120).

18. A combined acoustic transducer and pressure sensor package (100) according to any one of the preceding claims, wherein the first cover (120) includes a hole (128), the hole (128) being configured to receive a receiving portion (175) of the transfer block (180), The hole (128) in the first cover (120) is wider than the width of the accommodating portion (175) of the transmission block (180), so that the transmission block (180) is accommodated in the hole (128) through clearance fit.

19. The combined acoustic transducer and pressure sensor package (100) of claim 18, wherein the transfer block (180) is attached to the hole (128) in the first cover (120) by means of at least one of solder or glue.

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