Server cooling with immersion heat sink

Abstract

A method of cooling an assembly includes cooling at least one peripheral heat generating device with a first cooling medium, cooling at least one heat generating electronic device with a cold plate having an internal fluid circuit configured to receive a second cooling medium, and cooling the first cooling medium via a heat sink, the assembly includes at least one heat-generating electronic device and at least one peripheral heat-generating device enclosed within a container.

Description

Technical Field

[0001] The exemplary embodiments relate to the field of thermal management, and more particularly, to thermal management of servers within a data center. Background Art

[0002] "Data center" refers to the physical location of one or more servers. Data centers and the servers housed within the data centers typically consume considerable amounts of electrical power. Existing servers are designed to be cooled at least in part by air flow. Such servers often include one or more printed circuit boards having a plurality of operable heat generating devices mounted thereon. The printed circuit boards are typically housed in an enclosure having vents configured to direct outside air from the data center into, through, and out of the enclosure. The air absorbs the heat dissipated by the components and, after being exhausted from the enclosure, mixes with ambient air. Next, air conditioning is used to cool and recirculate the heated air in the data center, repeating the cooling process.

[0003] Higher performance server components typically dissipate more power. However, the amount of heat that conventional cooling systems can remove from a server is limited in part by the degree of air conditioning available in a data center. Therefore, there is a need to more efficiently cool high performance server components. Summary of the invention

[0004] According to an embodiment, a method of cooling an assembly includes cooling at least one peripheral heat generating device using a first cooling medium, cooling at least one heat generating electronic device using a cold plate having an internal fluid circuit configured to receive a second cooling medium, and cooling the first cooling medium via a heat sink, the assembly including at least one heat generating electronic device and at least one peripheral heat generating device enclosed in a container.

[0005] In addition to, or as an alternative to, one or more of the features described herein, further embodiments may include circulating a first cooling medium within the vessel.

[0006] In addition or as an alternative to one or more of the features described herein, further embodiments may include that the first cooling medium is cooled via a heat sink at a location upstream of the at least one peripheral heat generating device relative to a flow direction of the first cooling medium.

[0007] In addition to or as an alternative to one or more of the features described herein, further embodiments may include cooling at least one heat generating electronic device using a first medium.

[0008] In addition to or alternatively to one or more of the features described herein, further embodiments may include: cooling at least one heat generating electronic device using a cold plate having an internal fluid circuit further includes transferring heat from the at least one heat generating electronic device to a body of the cold plate, and transferring heat from the body of the cold plate to a second cooling medium within the fluid circuit.

[0009] In addition or alternatively to one or more of the features described herein, further embodiments may include at least one heat generating electronic device being mounted directly to a surface of the cold plate.

[0010] In addition to or as an alternative to one or more of the features described herein, further embodiments may include at least one heat generating electronic device being mounted directly to the printed circuit board, and the cold plate being thermally coupled to the printed circuit board.

[0011] In addition or alternatively to one or more of the features described herein, further embodiments may include cooling at least one heat generating electronic device with a cold plate having an internal fluid loop further comprising positioning a portion of the fluid loop in an overlapping arrangement with the at least one heat generating electronic device.

[0012] In addition or alternatively to one or more of the features described herein, further embodiments may include cooling the first cooling medium via the heat sink further includes conducting heat from the first cooling medium to the body of the cold plate, and transferring heat from the body of the cold plate to the second cooling medium.

[0013] In addition to or as an alternative to one or more of the features described herein, further embodiments may include that the first cooling medium is a dielectric fluid.

[0014] In addition to or as an alternative to one or more of the features described herein, further embodiments may include that the second cooling medium is a refrigerant.

[0015] According to an embodiment, an assembly includes a fluid-tight container, at least one heat generating electronic device disposed within the container, at least one peripheral heat generating device disposed within the container, and a first cooling medium disposed within the container. The at least one heat generating electronic device and the at least one peripheral heat generating device are encapsulated by the first cooling medium. A cold plate is thermally coupled to the at least one heat generating electronic device. The cold plate has an internal fluid circuit configured to receive a second cooling medium.

[0016] In addition to or as an alternative to one or more of the features described herein, further embodiments may include at least one heat generating electronic device being mounted directly to the cold plate.

[0017] In addition to or as an alternative to one or more of the features described herein, further embodiments may include a printed circuit board, at least one heat generating electronic device mounted directly to the printed circuit board, and the cold plate thermally coupled to the printed circuit board.

[0018] In addition to or as an alternative to one or more of the features described herein, further embodiments may include a movement mechanism for moving the first cooling medium within the container.

[0019] In addition to or as an alternative to one or more of the features described herein, further embodiments may include at least a portion of the internal fluid circuit being positioned in an overlapping arrangement with at least one heat generating electronic device.

[0020] In addition or alternatively to one or more of the features described herein, further embodiments may include that the internal fluid circuit of the cold plate comprises a single continuous path.

[0021] In addition or alternatively to one or more of the features described herein, further embodiments may include an internal fluid circuit of the cold plate including a first manifold, a second manifold, and at least one fluid channel connecting the first manifold and the second manifold.

[0022] In addition or alternatively to one or more of the features described herein, further embodiments may include that the first cooling medium is a dielectric fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The following description should not be considered limiting in any way. Referring to the accompanying drawings, similar elements are similarly numbered:

[0024] Figure 1 is a front view of a data center rack having a plurality of servers installed therein;

[0025] Figure 2A is a perspective view of a server according to an embodiment;

[0026] Figure 2B is a cross-sectional side view of a server according to an embodiment;

[0027] Figure 3 is a cross-sectional view of an assembly including a server with an integrated cooling system according to an embodiment;

[0028] Figure 4 is a cross-sectional view of an internal fluid circuit of a radiator according to an embodiment;

[0029] Figure 5 is a cross-sectional view of another internal fluid circuit of a heat sink according to an embodiment; and

[0030] Figure 6 According to an embodiment, Figure 3 A cross-sectional view of the multiple components of a data center. DETAILED DESCRIPTION

[0031] A detailed description of one or more embodiments of the disclosed apparatus and methods is presented herein by way of example and not limitation with reference to the accompanying figures.

[0032] Now refer to Figure 1 , an example of a data center 20 is shown. As shown, the data center 20 includes a cabinet 22 having at least one and in some embodiments a plurality of slots (not shown) formed therein. One or more server rack subassemblies (also referred to herein as servers 30) may be capable of being permanently or removably mounted within the cabinet 22, such as within one or more slots formed therein. The plurality of slots, and therefore at least one server 30 that may be received therein, may have a generally vertical orientation (shown), or alternatively, may have a horizontal orientation. In some embodiments, the data center 20 may include a combination of both horizontally oriented slots and vertically oriented slots. In addition, although only a single cabinet 22 is shown in the figure, it should be appreciated that the data center 20 may include several cabinets 22. In embodiments including a plurality of cabinets 22, the plurality of cabinets 22 may be arranged at the same location within a building, or alternatively, one or more of the cabinets 22 may be arranged at different locations within a single building or within multiple buildings.

[0033] Referring now to FIG. 2 , an example of a server 30 that can be received within a slot of a cabinet 22 is shown. As shown, the server 30 may include a frame or chassis 32 having at least one printed circuit board 34 mounted to the frame. Although only a single printed circuit board 34 is shown in the figure, it should be understood that in some embodiments, multiple printed circuit boards may be mounted to the chassis 32. The chassis 32 is designed to be insertable, such as being able to be slidably inserted into a slot of a server rack, and allows connection to power cables, data cables, and / or other connection cables provided at or by the cabinet 22.

[0034] The chassis 32 may include a plurality of walls 36, 38, 40 that are oriented at an angle to the printed circuit board 34 and extend around all or at least a portion of the periphery of the printed circuit board 34. Figure 2B, the chassis 32 additionally includes at least one flat, generally planar panel connected to one or more of the peripheral walls 36, 38, 40 of the chassis 32. At least one flat panel 42 may be disposed at a first side or a second side of the printed circuit board 34. When the server 30 is in a horizontal orientation as shown, such a flat panel 42 may be disposed vertically below the printed circuit board 34, vertically above the printed circuit board 34, or in some embodiments, the flat panel 42 may be disposed above and below the printed circuit board. In an embodiment, the chassis 32 and the flat panel 42 combine to form an airtight container surrounding the server 30. However, embodiments are also contemplated herein in which a separate sheath or container is positioned around the server 30 to form an airtight assembly.

[0035] At least one heat generating electronic device 50 may be mounted or electrically connected to the printed circuit board 34. Examples of heat generating electronic devices 50 include, but are not limited to, processors, such as central processing units and / or graphics processing units, memory, hard drives, and power supply modules. In an embodiment, one or more fans 52 are mounted to the printed circuit board 34 and are operable to move a flow of a fluid, such as air, over the heat generating electronic devices 50. In the non-limiting embodiment shown, at least one fan 52 is disposed near a first end 54 of the printed circuit board 34, such that when the server 30 is installed within the cabinet 22, the at least one fan 52 is positioned closer to the front of the cabinet 22 than the heat generating electronic devices 50. However, embodiments in which one or more fans 52 are disposed at another suitable location, such as, for example, near a second end 56 of the printed circuit board 34 or near a second end of the chassis 32 associated with the rear of the cabinet 22, are also within the scope of the present disclosure.

[0036] In an embodiment, the fluid moved by the at least one fan 52 is configured to make a single pass over the heat generating electronic devices 50. For example, cool air can be drawn into the fan 52 from a location adjacent to the front of the chassis 32, and after removing heat from the heat generating electronic devices 50, the hot air can be exhausted at the back of the chassis 32. In other embodiments, such as where the chassis 32 includes, for example, at least one flat panel 42, the fluid can be configured to circulate continuously within the server 30. For example, as in Figure 2B , the fan 52 may propel a fluid flow across the heat generating electronic devices 50 disposed at a first surface 58 of the printed circuit board 34. Upon reaching a second end 56 of the printed circuit board 34, the fluid may turn around, pass through one or more openings, and make a second pass along a second opposing surface 60 of the printed circuit board 34. Upon reaching the first end 54 of the printed circuit board 34, the fluid may turn around again and be drawn back into the inlet of the at least one fan 52.

[0037] Now refer to Figure 3 , shows an example of an assembly 100, such as a server 30 with, for example, an integrated cooling system. Figure 2A and Figure 2B , in the illustrated non-limiting embodiment, the assembly 100 includes a server 30 having a chassis 32, at least one printed circuit board 34 mounted thereto, and at least one heat generating electronic device 50 mounted or electrically connected to the printed circuit board 34. In the illustrated non-limiting embodiment, the server 30 includes four heat generating electronic devices 50. However, it should be understood that embodiments in which the server 30 includes one, two, three, or more than four heat generating electronic devices 50 are also within the scope of the present disclosure.

[0038] The assembly 100 additionally includes a sealed container 102, and the server 30 may be enclosed or surrounded in its entirety within an interior 104 of the sealed container 102. The sealed container 102 may be formed by a chassis 32 and a plurality of flat panels 42 as previously described, or may be a separate container that can be positioned around the server 30. In an embodiment, the container 102 is hermetically sealed to prevent the flow of any fluid from the interior 104 of the container 102. The interior 104 of the container 102 may be filled with a first cooling medium C1 so that the heat generating electronic device 50 is immersed or encapsulated in the first cooling medium C1. When the first cooling medium C1 contacts one or more heat generating electronic devices 50, the first cooling medium C1 is configured to absorb heat, thereby removing heat from the plurality of heat generating electronic devices 50. In an embodiment, the first cooling medium C1 is a dielectric fluid. The first cooling medium C1 may include a single dielectric fluid, or alternatively, may include a mixture of two or more dielectric fluids having different boiling points.

[0039] The density of the dielectric fluid is configured to change with the temperature of the dielectric fluid. Therefore, the density change caused when the dielectric fluid absorbs heat can cause the dielectric fluid to circulate naturally within the container 102. However, in other embodiments, a fluid movement mechanism (such as, for example, a pump or a circulator) can be positioned within the interior 104 of the container 102, in fluid communication with the first cooling medium C1.

[0040] In an embodiment, the assembly 100 includes a heat sink 110 disposed within the interior 104 of the container 102. In the illustrated non-limiting embodiment, the heat sink 110 is disposed at the center of the container 102. Embodiments in which the heat sink 110 is disposed at another location within the container 102 are also contemplated herein. As illustrated, the heat sink 110 may be mounted directly to the printed circuit board 34. Thus, the heat sink 110 may be indirectly thermally coupled to one or more of the heat generating electronic devices 50 via the printed circuit board 34. Alternatively or in addition, one or more heat generating electronic devices 50 that are not mounted to the printed circuit board 34 may be directly mounted to the surface 112 of the heat sink 110. Such heat generating electronic devices 50 may be considered to be directly thermally coupled to the heat sink 110. The heat generating electronic devices 50 that are directly coupled to the heat sink 110 or indirectly coupled to the heat sink 110 via the printed circuit board 34 may be referred to herein as selected heat generating devices. Similarly, heat generating electronic devices 50 of the server 30 that are not directly thermally coupled to the heat sink 110 or indirectly thermally coupled to the heat sink 110 via the printed circuit board 34 may be considered “peripheral” heat generating devices 50 .

[0041] In an embodiment, the heat sink 110 is a cold plate having an internal fluid circuit 120 configured to receive a second cooling medium C2 to remove heat therefrom. It should be appreciated that the first cooling medium C1 and the second cooling medium C2 described herein may be the same, or alternatively, may be distinct or different media or fluids. Furthermore, while only a single cold plate 110 is shown, it should be appreciated that embodiments including multiple cold plates fluidly coupled in parallel or in series are also within the scope of the present disclosure.

[0042] Figure 4 and Figure 5 The cross-sectional view shown in FIG. 1 shows an example of an internal fluid circuit 120 of the heat sink 110. As shown, the fluid circuit 120 includes a fluid inlet 122 and a fluid outlet 124 formed in the body of the cold plate. The fluid inlet 122 and the fluid outlet 124 may be any shape, such as in the depth dimension (e.g., in the zx plane of the drawing), including circular, elliptical, triangular, square, rectangular shapes, or any simple polygonal shape or portion thereof. In addition, in an embodiment, the fluid outlet 124 may have a much larger diameter than the fluid inlet 122, thereby helping to reduce the pressure drop of the second cooling medium C2 passing through the fluid outlet 124.

[0043] exist Figure 4 In the embodiment best shown in FIG. 1 , the fluid circuit 120 includes a continuous flow path having a serpentine configuration extending between a fluid inlet 122 and a fluid outlet 124. However, in other embodiments, such as Figure 5As shown in FIG. 1 , the fluid circuit 120 may include a first or inlet manifold 126, a second or outlet manifold 128, and at least one fluid channel 130 connecting the first manifold 126 and the second manifold 128. In an embodiment, the at least one fluid channel 130 includes a plurality of fluid channels 130.

[0044] In an embodiment, one or more fluid channels 130 of the fluid circuit 120 may be positioned to perform local cooling at an area of ​​the heat sink 110 with the maximum heat flux, such as at an area of ​​the heat sink 110 that is directly aligned with or in an overlapping arrangement with the heat generating electronic device 50. Thus, at least one fluid channel 130 may be associated with at least one selected heat generating electronic device 50. In an embodiment in which the heat sink 110 is associated with a plurality of selected heat generating electronic devices 50, one or more fluid channels 130 may be associated with each of the corresponding selected heat generating electronic modules and configured to remove heat therefrom. More specifically, at least one fluid channel 130 associated with the corresponding selected heat generating electronic device 50 may be physically located within the cold plate 110 in an overlapping arrangement or alignment with the selected heat generating electronic device 50. In an embodiment, the total number of fluid channels 130 disposed in a localized area of ​​increased heat flux associated with the corresponding heat generating electronic device 50 may vary based on the heat that needs to be removed from the corresponding heat generating electronic device 50. Thus, a different number of fluid channels 130 may be aligned with each heat generating electronic device 50 associated with the heat sink 110, such as Figure 5 As shown in .

[0045] During operation of the server 30 of the assembly 100, the heat generating electronic devices 50 are cooled via two different types of cooling. The first type of cooling includes direct cooling of one or more peripheral heat generating devices 50 using a first cooling medium C1 within the interior 104 of the container 102. The first cooling medium C1 is arranged to be in direct contact with one or more surfaces of at least one peripheral heat generating device 50. Therefore, as the first cooling medium C1 circulates or moves through the interior 104, heat is transferred from the peripheral heat generating device to the first cooling medium C1. In some embodiments, because the first cooling medium C1 is also configured to contact one or more surfaces of one or more selected heat generating electronic devices 50, the first cooling medium C1 can also be configured to cool selected heat generating electronic devices 50.

[0046] The second type of cooling of the assembly 100 includes removing heat from at least one selected heat generating electronic device 50 through the heat sink 110. As previously mentioned, the selected heat generating device may include one or more of the heat generating electronic devices 50 mounted on the printed circuit board 34 and / or one or more heat generating electronic devices 50 mounted directly to the heat sink 110. In operation, at least a portion of the heat generated by the at least one selected heat generating electronic device 50 is transferred to the body of the heat sink 110 (such as via, for example, conduction). At the same time, a second cooling medium C2 (such as, for example, a refrigerant) is provided to the fluid inlet 122 of the fluid circuit 120. The second cooling medium C2 provided to the fluid circuit 120 may be a liquid, or alternatively, may be a two-phase mixture of liquid and vapor. As the second cooling medium C2 passes through the fluid circuit 120, at least a portion of the heat transferred from the at least one selected heat generating electronic device 50 to the heat sink is transferred from the body of the heat sink 110 to the second cooling medium C2. The heat transferred to the second cooling medium C2 causes the temperature of the second cooling medium C2 within the fluid circuit to increase. Thus, the temperature of the second cooling medium C2 at the fluid outlet 124 is greater than the temperature of the second cooling medium C2 at the fluid inlet 122. Furthermore, in some embodiments, the heat transfer may cause at least a portion of the second cooling medium C2 within the fluid circuit 120 to evaporate.

[0047] In addition, the heat sink and the second cooling medium C2 can be used to condition the first cooling medium C1 by removing heat from the first cooling medium C1, so that the first cooling medium C1 has a temperature suitable for removing heat from one or more peripheral heat generating devices and / or one or more heat generating electronic devices thermally coupled to the heat sink 110. Therefore, the first cooling medium C1 can be cooled by the heat sink 110 at a position upstream of the one or more peripheral heat generating devices relative to the flow direction of the first cooling medium C1 within the container 102. The first cooling medium C1 within the interior 104 of the container 102 is configured to contact one or more surfaces of the heat sink 110. Due to this contact, at least a portion of the heat absorbed by the first cooling medium C1 from the peripheral heat generating devices 50 can be transferred to the heat sink 110, thereby cooling the first cooling medium C1. This heat, along with the heat transferred from at least one selected heat generating electronic device 50 to the heat sink 110, is removed from the body of the heat sink 110 via the flow of the second cooling medium C2 within the fluid circuit 120.

[0048] The heated secondary cooling medium C2 output from the fluid outlet 124 of the fluid circuit 120 may be directed to one or more downstream loads (schematically shown at 130). Heat removed from the primary cooling medium C1, at least one selected heat generating electronic device 50 by the secondary cooling medium fluid C1 may be rejected to another fluid at one or more loads 140. For example, in an embodiment, the downstream load is a hot water heater or air conditioning system of a building.

[0049] exist Figure 6 In an embodiment best shown in FIG. 1 , a plurality of assemblies 100 may be arranged within a cabinet 22 or other data center. In such an embodiment, a secondary cooling medium C2 may be provided to each of the plurality of assemblies 100 in series or in parallel. In an embodiment in which the assemblies 100 are arranged in parallel, an inlet manifold 142 may be fluidly coupled to the fluid inlet 122 of each fluid circuit 120, and an outlet manifold 144 may be fluidly coupled to the fluid outlet 124 of each fluid circuit 120. In such an embodiment, the heated second cooling medium C2 collected within the outlet manifold 144 from each of the assemblies 100 is mixed and then delivered to one or more downstream loads 140.

[0050] The assembly 100 with an integrated cooling system as shown and described herein provides an easily scalable solution for cooling heat generating components. Such cooling solutions can improve the sustainability and efficiency of heat generating components by rejecting the heat absorbed from the heat generating components to downstream heating applications. In addition, the air conditioning load used to cool the area containing the data center is reduced.

[0051] The term "about" is intended to include the degree of error associated with the measurement of the particular quantity based on the equipment available at the time the application was filed.

[0052] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to also include the plural forms unless the context clearly indicates otherwise. It will be further understood that when used in this specification, the terms "include" and / or "comprise" specify the presence of narrated features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, element components and / or groups thereof.

[0053] Although the present disclosure is described with reference to one or more exemplary embodiments, it will be appreciated by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt particular circumstances or materials to the teachings of the present disclosure without departing from the basic scope of the present disclosure. Therefore, it is intended that the present disclosure is not limited to the specific embodiments disclosed as the best mode contemplated for carrying out the present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.

Claims

1. A method of cooling an assembly comprising at least one heat generating electronic device and at least one peripheral heat generating device enclosed in a container, the method comprising: cooling the at least one peripheral heat generating device using a first cooling medium; cooling the at least one heat generating electronic device using a cold plate having an internal fluid circuit configured to receive a second cooling medium; and The first cooling medium is cooled via a radiator. 2 . The method of claim 1 , further comprising circulating the first cooling medium within the container.

3. The method according to claim 2, wherein: The first cooling medium is cooled via the radiator at a position upstream of the at least one peripheral heat generating device with respect to a flow direction of the first cooling medium.

4. The method of any one of claims 1 to 3, further comprising cooling the at least one heat generating electronic device using the first medium.

5. The method according to any one of claims 1 to 4, wherein: Cooling the at least one heat generating electronic device using the cold plate having the internal fluid circuit further comprises: transferring heat from the at least one heat generating electronic device to a body of the cold plate; and Heat is transferred from the body of the cold plate to the second cooling medium within the fluid circuit.

6. The method according to claim 5, wherein: The at least one heat generating electronic device is mounted directly to a surface of the cold plate.

7. The method according to claim 5 or 6, wherein: The at least one heat generating electronic device is mounted directly to a printed circuit board, and the cold plate is thermally coupled to the printed circuit board.

8. The method according to any one of claims 1 to 7, wherein: Cooling the at least one heat generating electronic device using the cold plate having the internal fluid circuit further includes positioning a portion of the fluid circuit in an overlapping arrangement with the at least one heat generating electronic device.

9. The method according to any one of claims 1 to 8, wherein: Cooling the first cooling medium via the radiator further comprises: conducting heat from the first cooling medium to the body of the cold plate; and Heat is transferred from the body of the cold plate to the second cooling medium.

10. The method according to any one of claims 1 to 9, wherein: The first cooling medium is a dielectric fluid.

11. The method according to any one of claims 1 to 10, wherein: The second cooling medium is a refrigerant.

12. A component comprising: fluid-tight containers; at least one heat generating electronic device disposed within the container; at least one peripheral heat generating device disposed within the container; a first cooling medium disposed within the container, the at least one heat generating electronic device and the at least one peripheral heat generating device being encapsulated by the first cooling medium; A cold plate is thermally coupled to the at least one heat generating electronic device, the cold plate having an internal fluid circuit configured to receive a second cooling medium.

13. The assembly of claim 12, wherein: The at least one heat generating electronic device is mounted directly to the cold plate.

14. The assembly of claim 12, further comprising a printed circuit board, the at least one heat generating electronic device being directly mounted to the printed circuit board, and the cold plate being thermally coupled to the printed circuit board.

15. The assembly of any one of claims 12 to 14, further comprising a movement mechanism for moving the first cooling medium within the container.

16. An assembly according to any one of claims 12 to 15, wherein At least a portion of the internal fluid circuit is positioned in an overlapping arrangement with the at least one heat generating electronic device.

17. An assembly according to any one of claims 12 to 16, wherein The internal fluid circuit of the cold plate includes a single continuous path.

18. An assembly according to any one of claims 12 to 16, wherein The internal fluid circuit of the cold plate includes a first manifold, a second manifold, and at least one fluid channel connecting the first manifold and the second manifold.

19. An assembly according to any one of claims 12 to 18, wherein The first cooling medium is a dielectric fluid.

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