Substrate processing apparatus and substrate processing method

Abstract

The invention provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus may include a levitation unit portion, a transfer unit, and a liquid chemical discharge unit. The levitation unit portion levitates the plurality of substrates in a third direction orthogonal to the first direction and the second direction while aligning the plurality of substrates in the second direction orthogonal to the transfer direction (the first direction) of the substrates, and extends in the transfer direction. The transfer unit simultaneously transfers a plurality of substrates aligned in a second direction along a floating unit portion extending in a first direction. The liquid chemical discharge unit simultaneously discharges a liquid chemical to the plurality of substrates simultaneously transferred by the transfer unit.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to a substrate processing apparatus and a substrate processing method capable of simultaneously performing a liquid chemical discharge process on a plurality of substrates. Background Art

[0002] Recently, large-area substrates are widely used in the manufacture of display elements such as organic EL display elements, etc. The manufacturing process for large-area substrates includes a liquid chemical discharge process for discharging liquid chemicals onto the large-area substrate.

[0003] However, as the area of ​​the substrate increases, the time required for the liquid chemical discharge process and the like increases, and thus the increase in the area of ​​the substrate may cause a decrease in productivity in the manufacture of display elements.

[0004] In particular, a conventional device for coating liquid chemicals on a substrate for a display element generally includes an air suspension unit on which a glass substrate is loaded, a gripper for adsorbing and transferring the glass substrate, and a nozzle. However, the conventional liquid chemical coating device sets the air suspension unit as only a single unit. Therefore, in the case of performing a liquid chemical coating process using the liquid chemical coating device, only one glass substrate can be put in when performing a liquid chemical coating process, so the productivity of the process is low. It is necessary to improve the productivity by shortening the overall tact time of the conventional liquid chemical coating device. Summary of the invention

[0005] Technical issues to be solved

[0006] The technical problem of the present invention is to provide a substrate processing apparatus capable of shortening the time required to perform a liquid chemical discharging process, thereby improving the productivity of the process.

[0007] Another technical problem of the present invention is to provide a substrate processing method that can shorten the time required to perform a liquid chemical discharge process, thereby improving the productivity of the process.

[0008] Solution

[0009] A substrate processing device according to an exemplary embodiment for solving the technical problem of the present invention described above may include a suspension unit, a transfer unit, and a liquid chemical discharge unit. The suspension unit is configured to extend along a first direction as a transfer direction of a substrate, and is configured to suspend a plurality of substrates in a third direction orthogonal to the first direction and the second direction while being aligned and placed along a second direction orthogonal to the first direction. The transfer unit is configured to simultaneously transfer the plurality of substrates aligned and placed in the second direction along the suspension unit extending in the first direction. The liquid chemical discharge unit may be configured to simultaneously discharge liquid chemicals to the plurality of substrates simultaneously transferred by the transfer unit.

[0010] In an exemplary embodiment, the suspension unit portion may include a plurality of suspension units, the plurality of suspension units being divided and arranged along the second direction to respectively correspond to a plurality of substrates aligned and placed in the second direction; the transfer unit may be configured to transfer the plurality of substrates along the first direction between the plurality of suspension units and at the periphery of the outermost suspension unit; and the liquid chemical discharge unit may be arranged to extend along the second direction on the upper portion of the plurality of suspension units.

[0011] In an exemplary embodiment, the suspension unit part may be configured to simultaneously suspend the plurality of substrates in the third direction, and may suspend the plurality of substrates by supplying air to lower surfaces of the plurality of substrates or performing vacuum suction while supplying air to lower surfaces of the plurality of substrates.

[0012] In an exemplary embodiment, the transfer unit may include: a guide rail portion, including a first guide rail and a second guide rail, the first guide rail being configured to extend along the first direction between adjacent suspension units, and the second guide rail being configured to extend along the first direction at the periphery of both side ends of the two outermost suspension units; a clamping portion, including a first clamping portion and a second clamping portion, the first clamping portion being configured to transfer along the first guide rail in a state of clamping the end portion of the substrate located between adjacent suspension units, and the second clamping portion being configured to transfer along the second guide rail in a state of clamping the end portion of the substrate located at the periphery of both side ends of the two outermost suspension units; and a driving portion configured to provide a driving force that enables the clamping portion to transfer multiple substrates along the guide rail portion.

[0013] In an exemplary embodiment, the first clamping portion may be configured to be one between each two adjacent suspension units, thereby simultaneously clamping the ends of the two substrates located between the two adjacent suspension units, or may be configured to be two between each two adjacent suspension units, thereby respectively clamping the ends of the two substrates located between the two adjacent suspension units.

[0014] In an exemplary embodiment, the clamping portion may be configured to clamp by vacuum suctioning a lower surface of the substrate.

[0015] In an exemplary embodiment, the liquid chemical discharge unit may be provided to be divided into at least two to respectively correspond to the plurality of substrates.

[0016] In an exemplary embodiment, the substrate processing apparatus may further include: a carry-in unit configured to carry the plurality of substrates into the suspension unit portion; and a carry-out unit configured to carry the plurality of substrates out of the suspension unit portion. The carry-in unit may include a carry-in transfer portion and a carry-in conversion portion, the carry-in transfer portion being configured to transfer the plurality of substrates in a state of being aligned in the first direction, the carry-in conversion portion being arranged at a portion facing the suspension unit portion, and being configured to convert the alignment direction of the plurality of substrates aligned in the first direction into the second direction. The carry-out unit may include a carry-out transfer portion and a carry-out conversion portion, the carry-out transfer portion being configured to transfer the plurality of substrates in a state of being aligned in the first direction, the carry-out conversion portion being arranged at a portion facing the suspension unit portion, and being configured to convert the alignment direction of the plurality of substrates aligned in the second direction into the first direction.

[0017] A substrate processing device according to an exemplary embodiment for solving a technical problem of the present invention may include a suspension unit, a transfer unit, a liquid chemical discharge unit, a carry-in unit, and a carry-out unit. The suspension unit is configured to extend along a first direction as a transfer direction of the substrate, and to suspend a first substrate and a second substrate in a third direction orthogonal to the first direction and the second direction while being aligned and placed along a second direction orthogonal to the first direction. The transfer unit is configured to simultaneously transfer the first substrate and the second substrate along the suspension unit extending in the first direction. The liquid chemical discharge unit is configured to simultaneously discharge liquid chemicals to the first substrate and the second substrate simultaneously transferred by the transfer unit. The carry-in unit is configured to carry the first substrate and the second substrate into the suspension unit. The carry-out unit is configured to carry the first substrate and the second substrate out of the suspension unit.

[0018] In an exemplary embodiment, the suspension unit may include: a first suspension unit extending along the first direction and configured to suspend the first substrate; and a second suspension unit extending along the first direction and configured to suspend the second substrate. The transfer unit may include a rail portion, a clamping portion, and a driving portion. The rail portion may include a first rail extending along the first direction between the portions of the first suspension unit and the second suspension unit facing each other, and a second rail extending along the first direction at the peripheries of both side ends of the first suspension unit and the second suspension unit, respectively. The clamping portion may include a first clamping portion and a second clamping portion, the first clamping portion being configured to transfer along the first rail while clamping the ends of the first substrate and the second substrate located between the first suspension unit and the second suspension unit, and the second clamping portion being configured to transfer along the second rail while clamping the ends of the first substrate and the second substrate located at both side peripheries of the first suspension unit and the second suspension unit, respectively. In addition, the driving portion may be configured to provide a driving force that enables the clamping portion to transfer the first substrate and the second substrate along the rail portion.

[0019] In an exemplary embodiment, the suspension unit portion may be configured to suspend the first substrate and the second substrate at the same time, may be configured to suspend the first substrate and the second substrate by supplying air to the lower surface of the first substrate and the lower surface of the second substrate, or may be configured to suspend the first substrate and the second substrate by performing vacuum suction while supplying air to the lower surface of the first substrate and the lower surface of the second substrate.

[0020] In an exemplary embodiment, the first clamping portion may be configured to be provided in two between the first suspension unit and the second suspension unit, thereby clamping the end of the first substrate and the end of the second substrate respectively, or may be configured to be provided in one between the first suspension unit and the second suspension unit, thereby clamping the end of the first substrate and the end of the second substrate at the same time.

[0021] In an exemplary embodiment, the clamping portion may be configured to clamp by vacuum-sucking a lower surface of the first substrate and a lower surface of the second substrate.

[0022] In an exemplary embodiment, the liquid chemical discharge unit may include: a first liquid chemical discharge unit extending along the second direction to correspond to the first substrate; and a second liquid chemical discharge unit extending along the second direction to correspond to the second substrate. The first liquid chemical discharge unit may be configured to supply liquid chemicals from an opposite side end of the second liquid chemical discharge unit to an end facing the second liquid chemical discharge unit, and the second liquid chemical discharge unit may be configured to supply liquid chemicals from an opposite side end of the first liquid chemical discharge unit to an end facing the first liquid chemical discharge unit.

[0023] In an exemplary embodiment, the carry-in unit may include a carry-in transfer unit configured to transfer the first substrate and the second substrate in a state of being aligned in the first direction, and a carry-in conversion unit, the carry-in transfer unit being arranged at a portion facing the suspension unit unit and configured to convert the alignment direction of the first substrate and the second substrate aligned in the first direction into the second direction. The carry-out unit may include a carry-out transfer unit configured to transfer the first substrate and the second substrate in a state of being aligned in the first direction, and a carry-in conversion unit being arranged at a portion facing the suspension unit unit and configured to convert the alignment direction of the first substrate and the second substrate aligned in the second direction into the first direction.

[0024] In an exemplary embodiment, the substrate processing apparatus may further include a cutting unit which cuts one original plate into the first substrate and the second substrate.

[0025] A substrate processing method according to an exemplary embodiment for solving another technical problem of the present invention described above may include: a step of suspending a first substrate and a second substrate in a third direction orthogonal to the first direction and the second direction while being aligned and placed along a second direction orthogonal to the first direction in a suspension unit portion extending along a first direction as a transfer direction of the substrate; a step of using a transfer unit to simultaneously transfer the first substrate and the second substrate along the suspension unit portion extending in the first direction; and a step of using a liquid chemical discharge unit to simultaneously discharge liquid chemicals to the first substrate and the second substrate that are being transferred simultaneously.

[0026] In an exemplary embodiment, the simultaneous transfer of the first and second substrates may be achieved in a state where a clamping portion clamps ends of the first and second substrates facing each other and clamps ends of the first and second substrates opposite to each other.

[0027] In an exemplary embodiment, the substrate processing method may further include: a step of converting the alignment direction of the first substrate and the second substrate that are transferred in a state of being aligned in the first direction into the second direction and moving the first substrate and the second substrate into the suspension unit portion; and a step of converting the alignment direction of the first substrate and the second substrate that are transferred in a state of being aligned in the second direction into the first direction and moving the first substrate and the second substrate out of the suspension unit portion.

[0028] In an exemplary embodiment, the substrate processing method may further include: before the first substrate and the second substrate are moved into the suspension unit portion, cutting a single original plate into the first substrate and the second substrate.

[0029] Effects of the Invention

[0030] According to the substrate processing apparatus and substrate processing method of the exemplary embodiment of the present invention, the liquid chemical discharge process can be performed on multiple substrates at the same time, so the time required for the liquid chemical discharge process can be relatively shortened. In this way, each time the liquid chemical discharge process is performed, the liquid chemical can be discharged from multiple substrates, so the productivity of the process can be greatly improved.

[0031] The substrate processing apparatus and substrate processing method according to the exemplary embodiment of the present invention can be applied to discharge liquid chemicals such as photoresist from substrates for manufacturing display elements, especially large-area substrates. Since the time required for the photoresist discharge process for large-area substrates can be relatively shortened, the productivity of display element manufacturing can be greatly improved.

[0032] However, the effects of the present invention are not limited to the above-mentioned effects, and various expansions can be made within the scope not departing from the idea and field of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figures 1 to 3 is a schematic view for explaining a substrate processing apparatus according to an exemplary embodiment of the present invention, wherein: Figure 1 is a plan view showing the configuration of the substrate processing apparatus, Figure 2 It is shown in Figure 1 A cross-sectional view of the substrate processing apparatus along line AA, Figure 3 Shows Figure 2 Another configuration example of the first clamping portion in the "B" area.

[0034] Figure 4 and Figure 51 is a view for explaining an example in which the substrate processing apparatus according to the exemplary embodiment of the present invention is applied to a liquid chemical discharge process for a substrate for manufacturing a display element. DETAILED DESCRIPTION

[0035] The present invention can be modified in various ways and can have multiple forms, and the embodiments will be described in detail herein. However, this is not intended to limit the present invention to a specific disclosed form, and should be understood to include all modifications, equivalents and substitutions included within the thought and technical scope of the present invention.

[0036] When describing the various drawings, similar reference numerals are used for similar components. Terms such as first, second, etc. may be used to describe various components, but the above components should not be limited by the above terms. The above terms are only used to distinguish one component from another component.

[0037] The terms used in this application are only used to illustrate specific embodiments and are not intended to limit the present invention. Unless otherwise clearly indicated in the context, expressions in the singular include expressions in the plural. In this application, terms such as "including" or "comprising" should be understood to specify the existence of features, numbers, steps, operations, constituent elements, parts or combinations thereof recorded in the specification, without excluding the existence or additional possibility of one or more other features, numbers, steps, operations, constituent elements, parts or combinations thereof in advance.

[0038] Unless otherwise defined, all terms used herein, including technical terms and scientific terms, have the same meanings as those generally understood by ordinary technicians in the field to which the present invention belongs. Terms that are the same as those defined in commonly used dictionaries should be interpreted as having the same meanings as those in the context of the relevant technology, and should not be interpreted as idealized or overly formalized meanings unless clearly defined in this application.

[0039] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the drawings, and repeated description of the same components will be omitted.

[0040] Figures 1 to 3 The configuration and operation principle of a substrate processing apparatus according to an exemplary embodiment of the present invention are schematically illustrated.

[0041] The substrate processing apparatus 100 according to the exemplary embodiment of the present invention may be applied to a liquid chemical discharge process of discharging liquid chemicals onto a substrate. For example, a process for manufacturing a display element may include a process of discharging liquid chemicals such as photoresist onto a substrate. The substrate processing apparatus 100 may be an apparatus applied to such a process of discharging liquid chemicals onto a substrate.

[0042] Reference Figures 1 to 3 The substrate processing apparatus 100 according to the exemplary embodiment may include a suspension unit part, a transfer unit 25 , a liquid chemical discharge unit 27 , a carry-in unit 13 , a carry-out unit 19 , and the like.

[0043] The suspension unit section may be configured to suspend the substrate S while providing an upper surface on which the substrate S can be placed. The suspension unit section may be configured to place a plurality of substrates S simultaneously on its upper surface while causing the plurality of substrates S to move upward in this state ( Figure 1 in the z direction) suspension.

[0044] According to one embodiment, the suspension unit section may include a plurality of suspension units 11. Each suspension unit 11 may be configured to process one substrate S at a time (for example, to apply a liquid chemical). Therefore, in order to simultaneously process a plurality of substrates S when performing a liquid chemical discharge process, the suspension unit 11 may be provided in plurality corresponding to the number of substrates S that are input from the loading unit 13 at a time. That is, the plurality of suspension units 11 may include a plurality of suspension units 11 configured to move along a first direction ( Figure 1 The second direction ( Figure 1 The substrate processing apparatus 100 may include at least two suspension units 11 that are divided and arranged along the y direction in the second direction to correspond to the plurality of substrates S arranged spaced apart along the second direction. The combination of the plurality of suspension units 11 can simultaneously process the plurality of substrates S at one time. For example, in order to perform a liquid chemical discharge process on three substrates S at the same time, the substrate processing apparatus 100 may include three suspension units 11. Each suspension unit 11 may extend longer than the length of the substrate S, for example, the length of the suspension unit 11 may be at least longer than twice the length of the substrate S. The plurality of suspension units 11 may be arranged in a form extending in parallel along the transfer direction (i.e., the first direction) of the substrate S.

[0045] Each suspension unit 11 may be configured so that the plurality of substrates S placed on its upper surface are oriented in a third direction (direction of the normal line) which is a vertical direction (direction of the normal line) of the upper surface. Figure 1As an example, in order to simultaneously process a plurality of substrates S spaced apart from each other along the second direction (y direction) and simultaneously introduced along the first direction in the suspension unit 11, a plurality of suspension units 11 corresponding to the number of substrates S introduced simultaneously may be arranged to be divided (distinguished) from each other along the second direction. In addition, each of the plurality of suspension units 11 may be arranged to extend a predetermined length along the first direction (x direction) which is the same as the transfer direction. Therefore, a plurality of substrates S may exist in each suspension unit 11.

[0046] The substrate S may be provided to the suspension unit 11 by the carrying unit 13. That is, the carrying unit 13 may carry the plurality of substrates S in a state of being arranged along the second direction into the plurality of suspension units 11. In this case, the plurality of suspension units 11 may be configured to place the plurality of substrates S arranged spaced apart along the second direction as they are respectively placed on their respective upper surfaces while placing the plurality of substrates S in the third direction ( Figure 1 In this case, similar to the suspension unit 11, the carrying unit 13 may be configured to be divided (divided) in the second direction to correspond to the plurality of substrates S, respectively.

[0047] The suspension unit 11 may be configured to suspend the plurality of substrates S to a predetermined height, and for example, may be configured to simultaneously suspend the plurality of substrates S. As another example, the suspension unit 11 may also be configured to sequentially suspend the plurality of substrates S at predetermined time intervals.

[0048] In one embodiment, the suspension unit 11 may be configured to suspend the plurality of substrates S in the third direction by supplying air to the lower surface of each of the plurality of substrates S. Since the suspension unit 11 is applied to the section where the liquid chemical is discharged onto the surface of the substrate S rather than to the section where the plurality of substrates S are moved in or out, the suspension height at which the plurality of substrates S are suspended in the third direction should be adjusted more accurately. Therefore, the suspension unit 11 may be configured to suspend the plurality of substrates S in the third direction by performing vacuum suction while supplying air to the lower surface of the plurality of substrates S.

[0049] In another embodiment, since the carrying-in unit 13 and the carrying-out unit 19 are used in the section where the plurality of substrates S are carried in and out relative to the suspension unit 11, the precise adjustment of the suspension height of the suspension unit 11 may be relatively loose. Therefore, the carrying-in unit 13 and the carrying-out unit 19 may also be configured to supply air to the lower surfaces of the plurality of substrates S.

[0050] The transfer unit 25 may be configured to transfer the plurality of substrates S suspended while being placed on the suspension unit 11. The transfer unit 25 may be configured to simultaneously transfer the plurality of substrates S along the suspension unit 11 extending in the first direction.

[0051] In an exemplary embodiment, the transfer unit 25 may be configured to transfer the plurality of substrates S along the peripheries of the portions facing each other and the end portions of the plurality of suspension units 11 having the divided structure when transferring the plurality of substrates S. That is, the transfer unit 25 may be configured to have a structure that slides along the portions facing each other of the plurality of suspension units 11, and may be configured to have a structure that slides along the peripheries of the end portions of the two outermost suspension units 11.

[0052] Figure 2 is Figure 1 2 is a cross-sectional view of the substrate processing apparatus 100 illustrated in FIG. 1 as viewed along line AA.

[0053] Reference Figure 2 More than three suspension units 11 are arranged along the second direction, and each suspension unit 11 can be configured to support a substrate S on its upper surface 12 and suspend the substrate S in the third direction (z direction).

[0054] In an exemplary embodiment, the transfer unit 25 may include a guide rail portion 29 , a clamping portion 35 , and a driving portion 41 .

[0055] The guide rail portion 29 may include at least one first guide rail 31 and at least two second guide rails 33, wherein the at least one first guide rail 31 is arranged to extend along the first direction (x direction) between adjacent suspension units 11, and the at least two second guide rails 33 are arranged to extend along the first direction (x direction) at the peripheries of both side ends of the two outermost suspension units 11. The first guide rail 31 and the second guide rail 33 and the plurality of suspension units 11 may be arranged parallel to each other along the first direction, and may be arranged to not overlap each other in the third direction (z direction) in which the suspension units 11 are suspended.

[0056] The clamping part 35 may include a first clamping part 37 and a second clamping part 39, wherein the first clamping part 37 is configured to be able to slide and move along the first guide rail 31, and the second clamping part 39 is configured to be able to slide and move along the second guide rail 33. More than one first clamping part 37 may be provided, and more than two second clamping parts 39 may be provided. The first clamping part 37 may be configured to be provided between two adjacent suspension units 11, thereby clamping the ends of the two substrates S located between the two adjacent suspension units 11 at the same time, or may be configured to be provided between the two adjacent suspension units 11, thereby clamping the ends of the two substrates S located between the two adjacent suspension units 11 respectively. The first clamping part 37 may be configured to transfer along the first guide rail 31 while clamping one side of the substrate S located between the two adjacent suspension units 11, and the second clamping part 39 may be configured to transfer along the second guide rail 33 while clamping the ends of the substrate S located on both sides of the outermost suspension unit 11.

[0057] The driving portion 41 may be configured to provide a driving force that enables the clamping portion 35 to slide along the guide rail portion 29. The driving portion 41 may be configured to provide a driving force to both the first clamping portion 37 and the second clamping portion 39. Alternatively, the driving portion 41 may be configured to provide a driving force to each of the first clamping portion 37 and the second clamping portion 39.

[0058] In the transfer unit 25, as Figure 2 As shown, each first clamping portion 37 may be configured to simultaneously clamp two facing side ends of two adjacent substrates S located on two adjacent suspension units 11. That is, each first clamping portion 37 may be configured as a common clamping tool for clamping two adjacent substrates S simultaneously.

[0059] Figure 3 An example of the configuration of the first clamping portion 37 which is different from this is shown.

[0060] Reference Figure 3 , shows an example in which each first clamping portion 37 is configured to clamp only one substrate S. That is, Figure 2 In the "B" region, two first clamping portions 37 are provided between two adjacent suspension units 11, and the two adjacent first clamping portions 37 can be configured to clamp one side end portion of two adjacent substrates S, respectively. Here, the "B" region means a region including the region between each adjacent suspension unit 11. That is, Figure 3 As shown, each first clamping portion 37 can only clamp one side end of a substrate S.

[0061] In the transfer unit 25, the first clamping portion 37 may be configured to clamp the side surface of one end portion of the substrate S. Different from this, since the first clamping portion 37 needs to clamp the end portion of the substrate S between two adjacent suspension units 11, the first clamping portion 37 may be configured to clamp the lower surface of the one end portion of the substrate S. The first clamping portion 37 may be configured to clamp the lower surface of the substrate S in a vacuum suction manner. In the clamping portion 35, the second clamping portion 39 clamps the ends of the substrate S located at the outermost sides of the suspension units 11, and the second clamping portion 39 may be configured to clamp the ends of the substrate S in the same manner as the first clamping portion 37. That is, the second clamping portion 39 may be configured to clamp the side surface of the end portion of the substrate S, or may be configured to clamp the lower surface portion of the substrate S in a vacuum suction manner.

[0062] The liquid chemical discharge unit 27 may be configured to discharge liquid chemicals to a plurality of substrates S. The liquid chemical discharge unit 27 may be configured to simultaneously discharge liquid chemicals to a plurality of substrates S simultaneously transferred by the transfer unit 25. The liquid chemical discharge unit 27 may be arranged to extend along the second direction at the upper portion of the suspension unit 11. As an example, the liquid chemical discharge unit 27 may be a slit nozzle having a length corresponding to the plurality of substrates S arranged in the second direction. Since the liquid chemical may not be uniformly supplied through the entire liquid chemical discharge unit 27 when the liquid chemical discharge unit 27 is configured to have a length corresponding to the entirety of the plurality of substrates S arranged in the second direction, the liquid chemical discharge unit 27 may also be configured to be divided into a plurality of forms to correspond to the plurality of substrates S, respectively. That is, the liquid chemical discharge unit 27 may be configured to correspond to the number of the plurality of substrates S. In an exemplary embodiment, the liquid chemical discharge unit 27 may be configured to have a structure divided into a plurality of structures corresponding to the number of the plurality of substrates S in a structure having a box structure, and each liquid chemical discharge unit 27 may have a cavity and a channel.

[0063] As described above, the substrate processing apparatus 100 according to the exemplary embodiment of the present invention may include the suspending unit 11, the transfer unit 25, and the liquid chemical discharge unit 27 so as to be able to simultaneously perform the liquid chemical discharge process on a plurality of substrates S. Thus, the liquid chemical discharge process can be performed more efficiently, so that the time required for the liquid chemical discharge process can be relatively shortened.

[0064] In one embodiment, not one but at least two of the carrying-in units 13 may be arranged to be divided in the vertical direction and extend in the same direction. In an embodiment different from this, a plurality of suspension units 11 may be arranged to extend in the first direction while being divided in the second direction, and one carrying-in unit 13 may be arranged to extend in the first direction.

[0065] The carrying-in unit 13 may be configured to carry a plurality of substrates S into the suspension unit 11. However, it is necessary to carry the plurality of substrates S from one carrying-in unit 13 configured to extend along the first direction to at least two suspension units 11 configured to extend along the first direction while being divided along the second direction. To this end, the carrying-in unit 13 may include a carrying-in transfer unit 15 configured to transfer the plurality of substrates S in a state of being aligned in the first direction, and a carrying-in conversion unit 17 provided at a portion facing the suspension unit 11 to convert the alignment direction of the plurality of substrates S aligned in the first direction into the second direction. Therefore, the plurality of substrates S may be transferred in a state of being aligned in the first direction by the carrying-in transfer unit 15, and the plurality of substrates S may be converted to the second direction by the carrying-in conversion unit 17 so as to be carried in and transferred to the suspension unit 11. Here, one carrying-in transfer unit 15 in the carrying-in unit 13 may be configured to extend along the first direction. In this way, the configuration of providing one carrying-in transfer section 15 can relatively simplify the configuration of the carrying-in unit 13 compared to a configuration in which at least two carrying-in transfer sections extend in the first direction.

[0066] In addition, the carrying-out unit 19 may be configured to carry out the plurality of substrates S from the suspension unit 11. However, the plurality of substrates S need to be carried out from the plurality of suspension units 11 that are arranged to extend in the first direction while being divided in the second direction to one carrying-out unit 19 that is arranged to extend in the first direction. Therefore, the carrying-out unit 19 may include a carrying-out transfer section 21 configured to transfer the plurality of substrates S in a state of being aligned in the first direction, and a carrying-out conversion section 23 that is provided at a portion facing the suspension unit 11 to convert the alignment direction of the plurality of substrates S aligned in the second direction into the first direction. Therefore, the alignment direction of the plurality of substrates S may be converted into the first direction by the carrying-out conversion section 23, and the plurality of substrates S may be carried out and transferred in a state of being aligned in the first direction by the carrying-out transfer section 21.

[0067] In one embodiment, one carry-out transfer part 21 in the carry-out unit 19 may be provided to extend along the first direction. A structure including one carry-out transfer part 21 may be relatively simpler than a structure including at least two carry-out transfer parts extending along the first direction.

[0068] Hereinafter, an example to which the substrate processing apparatus according to the exemplary embodiment of the present invention is specifically applied will be described.

[0069] Figure 4 and Figure 5 1 is a view for explaining an example in which the substrate processing apparatus according to the exemplary embodiment of the present invention is applied to a liquid chemical discharge process for a substrate for manufacturing a display element.

[0070] Reference Figure 4 and Figure 5 The substrate processing apparatus 200 according to the exemplary embodiment of the present invention can be applied to a liquid chemical discharge apparatus capable of performing a liquid chemical discharge process for discharging liquid chemicals such as photoresists onto a substrate for manufacturing a display element. The substrate processing apparatus 200 is configured to perform a liquid chemical discharge process with two substrates (i.e., a first substrate 43 and a second substrate 45) as objects. The substrate processing apparatus 200 may include a suspension unit 51, a transfer unit 56, a liquid chemical discharge unit 83, etc., and may also include a carry-in unit 71, a carry-out unit 77, a cutting unit (not shown), etc.

[0071] The first substrate 43 and the second substrate 45 may not be two original plates, but may be split plates having the same size cut from one original plate. That is, the substrate processing apparatus 200 may not perform the liquid chemical discharge process on two original plates, but may perform the liquid chemical discharge process on two split plates, and the two split plates may be the first substrate 43 and the second substrate 45.

[0072] The suspension unit 51 may be configured to align the first substrate 43 and the second substrate 45 in a second direction (i.e., y direction) orthogonal to the first direction (i.e., x direction) as the substrate transfer direction while being suspended, and may be arranged to extend along the first direction. That is, the suspension unit 51 may be arranged to align the first substrate 43 and the second substrate 45 in a second direction orthogonal to the first direction instead of being arranged in a row along the first direction. The suspension unit 51 may include a first suspension unit 53 and a second suspension unit 55 having a structure divided from each other along the second direction. The first suspension unit 53 may be arranged to suspend the first substrate 43 and extend along the first direction as the substrate transfer direction, and the second suspension unit 55 may be arranged to suspend the second substrate 45 and also extend along the first direction.

[0073] The suspension unit 51 may be configured to suspend the first substrate 43 and the second substrate 45 at the same time. As an example, the suspension unit 51 may be configured to suspend the first substrate 43 and the second substrate 45 by supplying air to the lower surface of the first substrate 43 and the lower surface of the second substrate 45. As another example, the suspension unit 51 may be configured to suspend the first substrate 43 and the second substrate 45 by performing vacuum suction while supplying air to the lower surface of the first substrate 43 and the lower surface of the second substrate 45. In order to suspend the first substrate 43 and the second substrate 45 at the same time, the suspension unit 51 may be configured to supply air to the lower surface of the first substrate 43 and the lower surface of the second substrate 45 at the same time, or may be configured to perform vacuum suction while supplying air to the lower surface of the first substrate 43 and the lower surface of the second substrate 45 at the same time.

[0074] Since the suspension unit 51 is applied to the process of discharging liquid chemicals toward the first substrate 43 and the second substrate 45, the suspension unit 51 is preferably configured to be able to very accurately adjust the suspension height of the first substrate 43 and the second substrate 45. As a configuration example for this purpose, the suspension unit 51 may be configured to perform vacuum suction while simultaneously supplying air to the lower surface of the first substrate 43 and the lower surface of the second substrate 45.

[0075] Since the loading unit 71 and the unloading unit 77 can be used in the interval of loading and unloading the first substrate 43 and the second substrate 45, the adjustment of the suspension height may be relatively loose. Therefore, the loading unit 71 and the unloading unit 77 can be configured to supply air to the lower surface of the first substrate 43 and the lower surface of the second substrate 45.

[0076] The transfer unit 56 may be configured to simultaneously transfer the first substrate 43 and the second substrate 45 along the suspension unit 51 extending in the first direction. The transfer unit 56 may include a guide rail portion 57 , a clamping portion 63 , and a driving portion 69 .

[0077] The guide rail portion 57 may include a first guide rail 59 and a second guide rail 61. The first guide rail 59 may be provided to extend along a first direction as a substrate transfer direction between the first suspension unit 53 and the second suspension unit 55, and two second guide rails 61 may be provided to extend along the first direction at the peripheries of the first suspension unit 53 and the second suspension unit 55.

[0078] The clamping portion 63 may include a first clamping portion 65 and a second clamping portion 67. The first clamping portion 65 may be configured to be able to slide and move along the first guide rail 59. That is, the first clamping portion 65 may be configured to transfer the first substrate 43 and the second substrate 45 while sliding along the first guide rail 59 in a state of clamping one side end portion of the first substrate 43 and one side end portion of the second substrate 45. Both ends of the first substrate 43 and the second substrate 45 clamped by the first clamping portion 65 may be lower surface portions of the first substrate 43 and the second substrate 45, respectively. The second clamping portion 67 may be configured to be able to slide and move along the second guide rail 61. The second clamping portion 67 may be arranged to transfer along the second guide rail 61 arranged along the periphery of the first suspension unit 53 and the second suspension unit 55, respectively, in a state of clamping both ends of the first substrate 43 and the second substrate 45 located at the periphery of the first suspension unit 53 and the second suspension unit 55. The two second clamping portions 67 may clamp the lower surface of the first substrate 43 and the lower surface of the second substrate 45, respectively.

[0079] The clamping portion 63 may be configured to clamp the lower surface of the first substrate 43 and the lower surface of the second substrate 45 by vacuum suction. However, in the case of the second clamping portion 67, it may be configured to clamp the end side surface of the first substrate 43 and the end side surface of the second substrate 45 instead of the lower surface of the first substrate 43 and the lower surface of the second substrate 45.

[0080] The driving portion 69 may be configured to provide a driving force to slide the clamping portion 63 along the guide rail portion 57. The driving portion 69 may be configured to provide a synchronous driving force to the first clamping portion 65 and the second clamping portion 67, or may be configured to provide a driving force to the first clamping portion 65 and the second clamping portion 67 separately.

[0081] The transfer unit 56 can transfer the first substrate 43 and the second substrate 45 in the suspension unit 51 by moving the first substrate 43 and the second substrate 45 to a desired position along the guide rail portion 57 in the first direction while clamping both side ends of each of the first substrate 43 and the second substrate 45 when the first substrate 43 and the second substrate 45 are located vertically above the first suspension unit 53 and the second suspension unit 55. The simultaneous transfer of the first substrate 43 and the second substrate 45 using the transfer unit 56 can be achieved in a state where the transfer unit 56 clamps the ends of the first substrate 43 and the second substrate 45 facing each other and clamps the ends of the first substrate 43 and the second substrate 45 opposite to each other.

[0082] The liquid chemical discharge unit 83 may be provided to simultaneously discharge liquid chemicals toward the first substrate 43 and the second substrate 45 simultaneously transferred by the transfer unit 56. The liquid chemical discharge unit 83 may be provided to extend along the second direction, and may be configured to include a first liquid chemical discharge unit 85 and a second liquid chemical discharge unit 87 corresponding to the first substrate 43 and the second substrate 45, respectively. The first liquid chemical discharge unit 85 may be provided to extend along the second direction to correspond to the first substrate 43, and may be a slit nozzle having a length corresponding to the length of the first substrate 43 in the second direction. Likewise, the second liquid chemical discharge unit 87 may be provided to extend along the second direction to correspond to the second substrate 45, and may be a slit nozzle having a length corresponding to the length of the second substrate 45 in the second direction.

[0083] In the liquid chemical discharge unit 83, the first liquid chemical discharge unit 85 may be configured to supply liquid chemicals from the opposite side end of the second liquid chemical discharge unit 87 to the end facing the second liquid chemical discharge unit 87, and the second liquid chemical discharge unit 87 may be configured to supply liquid chemicals from the opposite side end of the first liquid chemical discharge unit 85 to the end facing the first liquid chemical discharge unit 85. This is because it may be somewhat difficult to supply liquid chemicals through the first liquid chemical discharge unit 85 and the second liquid chemical discharge unit 87 facing each other, and the first liquid chemical discharge unit 85 and the second liquid chemical discharge unit 87 may be configured to have relatively short lengths corresponding to the first substrate 43 and the second substrate 45 as the sub-plates, respectively. In addition, in the liquid chemical discharge unit 83, the first liquid chemical discharge unit 85 and the second liquid chemical discharge unit 87 may be respectively arranged in a structure having a box structure. In this case, each of the first liquid chemical discharge unit 85 and the second liquid chemical discharge unit 87 may have a cavity and a channel. In addition, it may be configured to supply the liquid chemicals from the outer side surface end of the first liquid chemical discharging unit 85 and the outer side surface end of the second liquid chemical discharging unit 87 .

[0084] In this way, since the substrate processing device 200 includes the suspension unit 51, the transfer unit 56 and the liquid chemical discharge unit 83, it is easier to perform the liquid chemical discharge process on the first substrate 43 and the second substrate 45 at the same time, so the time required for the liquid chemical discharge process can be relatively sufficiently shortened.

[0085] The first substrate 43 and the second substrate 45 may be carried into the suspension unit 51 in a state of being arranged side by side in a first direction that is the same as the transfer direction, and may be carried out from the suspension unit 51 after the discharge of the liquid chemical. The carrying-in unit 71 may be configured to carry the first substrate 43 and the second substrate 45 into the suspension unit 51, and the carrying-out unit 77 may be configured to carry the first substrate 43 and the second substrate 45 out of the suspension unit 51.

[0086] In one embodiment, the carrying-in unit 71 may include a carrying-in transfer unit 73 and a carrying-in conversion unit 75. The carrying-in transfer unit 73 may be configured to transfer the first substrate 43 and the second substrate 45 in a state of being arranged side by side in the first direction. Since the first substrate 43 and the second substrate 45 are transferred in a state of being aligned in the first direction, when the suspension unit 51 is carried in, the first substrate 43 and the second substrate 45 need to be converted to the second direction. The carrying-in conversion unit 75 may be provided at a portion facing the suspension unit 51 to convert the first substrate 43 and the second substrate 45 arranged side by side in the first direction to the second direction.

[0087] In one embodiment, the carrying-out unit 77 may include a carrying-out transfer unit 79 and a carrying-out conversion unit 81. The carrying-out transfer unit 79 may be configured to transfer the first substrate 43 and the second substrate 45 in a state of being arranged side by side along the first direction. That is, since the first substrate 43 and the second substrate 45 are transferred in a state of being arranged in parallel and aligned in the second direction in the suspension unit 51, when being carried out from the suspension unit 51, the first substrate 43 and the second substrate 45 need to be converted to the first direction. The carrying-out conversion unit 81 may be configured to be provided at a portion facing the suspension unit 51 to convert the alignment direction of the first substrate 43 and the second substrate 45 aligned in the second direction, so that the first substrate 43 and the second substrate 45 are arranged side by side in the first direction.

[0088] Therefore, the substrate processing device 200 can use the carry-in unit 71 to transfer the first substrate 43 and the second substrate 45 in the first direction and convert the first substrate 43 and the second substrate 45 to the second direction so as to be carried into the suspension unit 51. In addition, the carry-out unit 77 can be used to convert the alignment direction of the first substrate 43 and the second substrate 45 to the first direction and carry the first substrate 43 and the second substrate 45 out of the suspension unit 51 along the first direction and transfer it.

[0089] As described above, the first substrate 43 and the second substrate 45 may be split boards obtained by cutting one original board into boards having the same size. Therefore, the substrate processing apparatus 200 may further include a cutting unit for cutting out the first substrate 43 and the second substrate 45. The cutting unit may be arranged at the front end of the carrying-in unit 71.

[0090] As described above, the substrate processing apparatus 200 can be configured to use the cutting unit to cut the original plate into the first substrate 43 and the second substrate 45, use the carrying-in unit 71 to carry the first substrate 43 and the second substrate 45 into the suspension unit 51, use the transfer unit 56 and the liquid chemical discharge unit 83 to discharge liquid chemicals to the first substrate 43 and the second substrate 45 at the same time, and use the carrying-out unit 77 to carry the first substrate 43 and the second substrate 45 out of the suspension unit 51 and transfer them to a subsequent process. Therefore, since the substrate processing apparatus 200 can simultaneously perform the liquid chemical discharge process on the first substrate 43 and the second substrate 45 as two substrates, the time required for the liquid chemical discharge process can be relatively sufficiently shortened.

[0091] The substrate processing apparatus and substrate processing method according to the exemplary embodiment of the present invention can be applied to a liquid chemical discharge process for discharging liquid chemicals to a substrate, and can be widely applied to the manufacture of display elements (such as the recent organic EL display elements) with large-area substrates as the target.

[0092] Although the present invention has been described above with reference to preferred embodiments, it will be appreciated by those skilled in the art that various modifications and variations may be made to the present invention without departing from the spirit and scope of the invention as described in the appended claims.

Claims

1. A substrate processing device, include: a suspension unit configured to extend along a first direction as a transfer direction of the substrates and to suspend a plurality of substrates in a third direction orthogonal to the first direction and the second direction while aligning and placing the plurality of substrates in a second direction orthogonal to the first direction; a transfer unit configured to simultaneously transfer the plurality of substrates aligned and placed in the second direction along the suspension unit portion extending in the first direction; as well as The liquid chemical discharge unit is configured to simultaneously discharge the liquid chemical toward the plurality of substrates simultaneously transferred by the transfer unit.

2. The substrate processing device according to claim 1, in, The suspension unit portion includes a plurality of suspension units, and the plurality of suspension units are divided and arranged along the second direction to respectively correspond to the plurality of substrates aligned and placed in the second direction; The transfer unit is configured to transfer the plurality of substrates along the first direction between the plurality of suspension units and at the periphery of the outermost suspension unit; as well as The liquid chemical discharge unit is arranged to extend along the second direction at an upper portion of the plurality of suspension units.

3. The substrate processing device according to claim 2, in, The suspension unit section is configured to simultaneously suspend the plurality of substrates in the third direction, and suspend the plurality of substrates by supplying air to lower surfaces of the plurality of substrates or performing vacuum suction while supplying air to lower surfaces of the plurality of substrates.

4. The substrate processing device according to claim 2, in, The transfer unit comprises: A guide rail portion, comprising a first guide rail and a second guide rail, wherein the first guide rail is arranged to extend along the first direction between adjacent suspension units, and the second guide rail is arranged to extend along the first direction at the peripheries of both side ends of two outermost suspension units; a clamping portion, comprising a first clamping portion and a second clamping portion, wherein the first clamping portion is configured to transfer along the first guide rail while clamping an end portion of the substrate located between adjacent suspension units, and the second clamping portion is configured to transfer along the second guide rail while clamping ends of the substrate located on both sides of the outermost two suspension units; and The driving portion is configured to provide a driving force that enables the clamping portion to move the plurality of substrates along the guide rail portion.

5. The substrate processing device according to claim 4, in, The first clamping portion is configured to be provided as one between two adjacent suspension units, thereby clamping the ends of the two substrates located between the two adjacent suspension units at the same time, or is configured to be provided as two between the two adjacent suspension units, thereby clamping the ends of the two substrates located between the two adjacent suspension units respectively.

6. The substrate processing apparatus according to claim 4, in, The clamping portion is configured to clamp the substrate by vacuum suctioning the lower surface of the substrate.

7. The substrate processing apparatus according to claim 2, in, The liquid chemical discharge unit is configured to be divided into at least two to respectively correspond to the plurality of substrates.

8. The substrate processing apparatus according to claim 1, in, Also includes: A carrying unit configured to carry the plurality of substrates into the suspension unit; as well as a carrying-out unit configured to carry out the plurality of substrates from the suspension unit portion, wherein the carrying-in unit comprises a carrying-in transfer unit and a carrying-in conversion unit, wherein the carrying-in transfer unit is configured to transfer the plurality of substrates in a state of being aligned in the first direction, and the carrying-in conversion unit is arranged at a portion facing the suspension unit and configured to convert the alignment direction of the plurality of substrates aligned in the first direction into the second direction, and Among them, the carry-out unit includes a carry-out transfer part and a carry-out conversion part, the carry-out transfer part is configured to transfer the multiple substrates in a state of being aligned in the first direction, and the carry-out conversion part is arranged at a part facing the suspension unit part, and is configured to convert the alignment direction of the multiple substrates aligned in the second direction to the first direction.

9. A substrate processing device, include: a suspension unit portion configured to extend along a first direction as a transfer direction of the substrate, and to suspend the first substrate and the second substrate in a third direction orthogonal to the first direction and the second direction while being aligned and placed along a second direction orthogonal to the first direction; a transfer unit configured to simultaneously transfer the first substrate and the second substrate along the suspension unit portion extending in the first direction; a liquid chemical discharge unit configured to simultaneously discharge the liquid chemical toward the first substrate and the second substrate simultaneously transferred by the transfer unit; a carrying unit configured to carry the first substrate and the second substrate into the suspension unit; as well as The carrying-out unit is configured to carry out the first substrate and the second substrate from the suspension unit.

10. The substrate processing apparatus according to claim 9, in, The suspension unit comprises: a first suspension unit extending along the first direction and configured to suspend the first substrate; and a second suspension unit extending along the first direction and configured to suspend the second substrate; and The transfer unit comprises: A guide rail portion, comprising a first guide rail and a second guide rail, wherein the first guide rail extends along the first direction between portions of the first suspension unit and the second suspension unit facing each other, and the second guide rail extends along the first direction at peripheries of both side ends of the first suspension unit and the second suspension unit; a clamping portion, comprising a first clamping portion and a second clamping portion, wherein the first clamping portion is configured to transfer the first substrate and the second substrate along the first guide rail while clamping the ends of the first substrate and the second substrate located between the first suspension unit and the second suspension unit, and the second clamping portion is configured to transfer the first substrate and the second substrate along the second guide rail while clamping the ends of the first substrate and the second substrate located on both sides of the first suspension unit and the second suspension unit; and The driving portion is configured to provide a driving force that enables the clamping portion to move the first substrate and the second substrate along the guide rail portion.

11. The substrate processing apparatus according to claim 10, in, The suspension unit portion is configured to suspend the first substrate and the second substrate at the same time, and is configured to suspend the first substrate and the second substrate by supplying air to the lower surface of the first substrate and the lower surface of the second substrate, or is configured to suspend the first substrate and the second substrate by performing vacuum suction while supplying air to the lower surface of the first substrate and the lower surface of the second substrate.

12. The substrate processing apparatus according to claim 10, in, The first clamping portion is configured to be set as two between the first suspension unit and the second suspension unit, thereby clamping the end of the first substrate and the end of the second substrate respectively, or configured to be set as one between the first suspension unit and the second suspension unit, thereby clamping the end of the first substrate and the end of the second substrate at the same time.

13. The substrate processing apparatus according to claim 10, in, The clamping portion is configured to clamp the lower surface of the first substrate and the lower surface of the second substrate by vacuum suction.

14. The substrate processing apparatus according to claim 10, in, The liquid chemical discharge unit comprises: a first liquid chemical discharge unit extending along the second direction to correspond to the first substrate; and a second liquid chemical discharge unit extending along the second direction to correspond to the second substrate, The first liquid chemical discharge unit is configured to supply liquid chemicals from an end portion on the opposite side of the second liquid chemical discharge unit to an end portion facing the second liquid chemical discharge unit, and the second liquid chemical discharge unit is configured to supply liquid chemicals from an end portion on the opposite side of the first liquid chemical discharge unit to an end portion facing the first liquid chemical discharge unit.

15. The substrate processing apparatus according to claim 9, in, The carrying-in unit includes a carrying-in transfer unit and a carrying-in conversion unit, wherein the carrying-in transfer unit is configured to transfer the first substrate and the second substrate in a state of being aligned in the first direction, and the carrying-in conversion unit is arranged at a portion facing the suspension unit and configured to convert the alignment direction of the first substrate and the second substrate aligned in the first direction into the second direction, and The carry-out unit includes a carry-out transfer portion and a carry-out conversion portion, the carry-out transfer portion is configured to transfer the first substrate and the second substrate in a state of being aligned in the first direction, and the carry-in conversion portion is arranged at a portion facing the suspension unit portion and is configured to convert the alignment direction of the first substrate and the second substrate aligned in the second direction to the first direction.

16. The substrate processing apparatus according to claim 9, in, Also includes: The cutting unit cuts an original plate into the first substrate and the second substrate.

17. A substrate processing method, include: A step of suspending a first substrate and a second substrate in a suspension unit extending in a first direction as a transfer direction of the substrates while being aligned and placed in a second direction orthogonal to the first direction and suspending in a third direction orthogonal to the first direction and the second direction; a step of simultaneously transferring the first substrate and the second substrate along the suspension unit portion extending in the first direction using a transfer unit; as well as A step of simultaneously discharging liquid chemicals toward the first substrate and the second substrate that are simultaneously transferred using a liquid chemical discharging unit.

18. The substrate processing method according to claim 17, in, The simultaneous transfer of the first substrate and the second substrate is achieved in a state where the clamping portion clamps the ends of the first substrate and the second substrate facing each other and clamps the ends of the first substrate and the second substrate opposite to each other.

19. The substrate processing method according to claim 17, in, Also includes: A step of converting the alignment direction of the first substrate and the second substrate transferred in the state of being aligned in the first direction to the second direction and moving the first substrate and the second substrate into the suspension unit; as well as A step of changing the alignment direction of the first substrate and the second substrate transferred in the state of being aligned in the second direction to the first direction and carrying the first substrate and the second substrate out of the suspension unit.

20. The substrate processing method according to claim 17, in, Also includes: Before the first substrate and the second substrate are moved into the suspension unit, a step of cutting an original plate into the first substrate and the second substrate.

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