Adhesive film and method for manufacturing adhesive film
By designing a symmetrically arranged protective layer and functional layer structure in the adhesive film, the cracking problem of the adhesive layer and the pressure-sensitive adhesive film during peeling is solved, manufacturing efficiency is improved, and deformation and curling marks are prevented.
Patent Information
- Application Number
- CN202480002164.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-04-19
- Filing Date
- 2024-03-06
- Publication Date
- 2024-12-20
AI Technical Summary
During the adhesive film manufacturing process, the pre-cut shape of the adhesive layer and the pressure-sensitive adhesive film causes no need to break or lose the parts easily when peeled off, affecting the handling speed and manufacturing efficiency.
An adhesive film structure is designed, in which multiple functional layers are composed of an adhesive layer and a pressure-sensitive adhesive film, and a plurality of protective layers surround the functional layer in a symmetrical configuration, and are circular in the top view of the substrate film. Island-shaped or trapezoidal-shaped, containing straight sections to uniformize peeling forces to ensure reduced fractures and defects when peeling at high speeds.
It effectively suppresses unnecessary partial rupture or defect, improves the manufacturing efficiency of the adhesive film, and prevents deformation and transfer of curling marks during winding.
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Figure CN119173601A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to an adhesive film and a method for manufacturing the adhesive film. Background Art
[0002] As a conventional adhesive film, there is a die attach laminated sheet support body described in Patent Document 1. The conventional die attach laminated sheet support body includes a long substrate film and a plurality of die attach laminated films dispersedly arranged on one surface of the substrate sheet in the longitudinal direction of the substrate film.
[0003] The die bonding laminated film is composed of the die bonding film on the substrate film side and the dicing film on the die bonding film. On one side of the substrate film, a protective film having the same thickness as the die bonding laminated film is arranged in a manner to surround each of the die bonding laminated films. According to the arrangement of such a protective film, for example, the die bonding laminated film can be protected from the pressure when the adhesive film is rolled into a roll, and deformation of the laminated film, transfer of the rolling mark, etc. can be suppressed.
[0004] Previous technical literature
[0005] Patent Literature
[0006] Patent Document 1: Japanese Patent Application Publication No. 2006-202927 Summary of the invention
[0007] Technical issues to be solved by the invention
[0008] In the manufacture of the adhesive film as described above, for example, a roll-to-roll method is used. In this method, a base film having an adhesive layer on one side is fed out from an original roll, and a pressure-sensitive adhesive film is laminated on the adhesive layer. Thereafter, the adhesive layer and the pressure-sensitive adhesive film on the base film are pre-cut in a predetermined pattern by a roller cutter. After pre-cutting, the unnecessary parts of the adhesive layer and the pressure-sensitive adhesive film are peeled off from the base film, and a functional layer based on the adhesive layer and the pressure-sensitive adhesive film and a protective layer surrounding the functional layer are formed on one side of the base film.
[0009] However, in the manufacturing process of such adhesive film, depending on the pre-cut shape of the adhesive layer and the pressure-sensitive adhesive film, when peeling off the unnecessary part of the adhesive layer and the pressure-sensitive adhesive film, the unnecessary part may be cracked or damaged. If such an undesirable situation occurs, it is impossible to roll up the adhesive film at a certain conveying speed and peel off the unnecessary part, which may lead to a decrease in the manufacturing efficiency of the adhesive film.
[0010] The present invention is completed to solve the above-mentioned problems, and its purpose is to provide an adhesive film and a method for manufacturing an adhesive film that can suppress the rupture or defect of the unnecessary part even when it is rolled up at a certain conveying speed and the unnecessary part is peeled off, and achieve improved manufacturing efficiency.
[0011] Means for solving technical problems
[0012] The adhesive film involved in one aspect of the present invention comprises a long substrate film, and an adhesive layer and a pressure-sensitive adhesive film arranged on one side of the substrate film, wherein the one side of the substrate film comprises: a plurality of functional layers, which are composed of adhesive layers and pressure-sensitive adhesive films and are arranged separately from each other along the extension direction of the substrate film; a plurality of protective layers, which are composed of adhesive layers and pressure-sensitive adhesive films and are arranged symmetrically with respect to the width direction of the substrate film in a manner of surrounding the functional layers, the functional layers are circular when viewed from above the substrate film, and the protective layers have a straight line portion along the extension direction of the substrate film and a straight line portion facing the circumference of the functional layer when viewed from above the substrate film.
[0013] In the adhesive film, the protective layer has a straight portion along the extension direction of the substrate film and a straight portion facing the circumference of the functional layer when viewed from above the substrate film. With this structure, compared with the case where the protective layer is along the circumference of the functional layer, the area of the unnecessary portion of the adhesive layer and the pressure-sensitive adhesive film can be ensured, and the straight portion can be included in its shape. Thus, the force applied to the unnecessary portion when peeling from one side of the substrate film can be uniformized, and even when the adhesive film is rolled up at a certain conveying speed and the unnecessary portion is peeled, it is possible to suppress the occurrence of undesirable conditions such as rupture or defect in the unnecessary portion. By continuously rolling up the adhesive film at a certain conveying speed without causing any undesirable conditions, the manufacturing efficiency can be improved.
[0014] The protective layer may have an island portion that is triangular in shape when viewed from above the substrate film, and the hypotenuse of the island portion is configured to face the circumference of the functional layer, and the bottom edge of the island portion faces the end of the width direction of the substrate film. According to such a structure, the protective layer can be effectively configured around the functional layer. Therefore, the functional layer can be firmly protected from the pressure when the adhesive film is wound into a roll, and the deformation of the functional layer, the transfer of the roll marks, etc. can be suppressed. In addition, by utilizing the straight line portion of the island portion, the straight line portion can be fully formed in the shape of the unnecessary part of the adhesive layer and the pressure-sensitive adhesive film. Thus, the force applied to the unnecessary part when peeling from one side of the substrate film can be more reliably uniformed.
[0015] The protective layer may have an island portion that is trapezoidal in shape when viewed from above the substrate film, and the hypotenuse of the island portion is configured to face the circumference of the functional layer, and the bottom of the island portion faces the end of the width direction of the substrate film. According to such a structure, the protective layer can be effectively configured around the functional layer. Therefore, the functional layer can be firmly protected from the pressure when the adhesive film is wound into a roll, and the deformation of the functional layer, the transfer of the roll marks, etc. can be suppressed. In addition, by utilizing the straight line portion of the island portion, the straight line portion can be fully formed in the shape of the unnecessary part of the adhesive layer and the pressure-sensitive adhesive film. Thus, the force applied to the unnecessary part when peeling from one side of the substrate film can be more reliably uniformed.
[0016] The protective layer may have strip-shaped portions extending in the extending direction of the substrate film at both ends in the width direction of the substrate film. By disposing the protective layer at both ends in the width direction of the substrate film, the functional layer can be further fully protected from the pressure when the adhesive film is wound into a roll. In addition, by utilizing the straight portion of the strip-shaped portion, the straight portion can be fully formed into the shape of the unnecessary portion of the adhesive layer and the pressure-sensitive adhesive film. Thus, the force applied to the unnecessary portion when peeling from one side of the substrate film can be more reliably uniformed.
[0017] The manufacturing method of the adhesive film involved in one aspect of the present invention comprises: a feeding step of feeding a long strip of substrate film provided with an adhesive layer on one side at a specified conveying speed; a laminating step of laminating a pressure-sensitive adhesive film on the adhesive layer; a cutting step of pre-cutting the adhesive layer and the pressure-sensitive adhesive film in a specified pattern; a peeling step of peeling off unnecessary parts of the adhesive layer and the pressure-sensitive adhesive film from one side of the substrate film, forming a plurality of functional layers separated from each other along the extension direction of the substrate film and a plurality of protective layers symmetrically arranged with respect to the width direction of the substrate film in a manner of surrounding the functional layers on one side of the substrate film; and a winding step of winding the adhesive film obtained in the peeling step into a roll, wherein in the cutting step, the adhesive layer and the pressure-sensitive adhesive film are pre-cut in a manner such that the functional layer is circular when viewed from above the substrate film, and the protective layer has a straight line portion along the extension direction of the substrate film and a straight line portion facing the circumference of the functional layer when viewed from above the substrate film.
[0018] In the manufacturing method of the adhesive film, in the pre-cutting of the adhesive layer and the pressure-sensitive adhesive film, a straight portion along the extension direction of the substrate film and a straight portion facing the circumference of the functional layer are formed on the protective layer. With this structure, compared with the case where the protective layer is along the circumference of the functional layer, the area of the unnecessary portion of the adhesive layer and the pressure-sensitive adhesive film can be ensured, and the straight portion can be included in its shape. The force applied to the unnecessary portion when peeling from one side of the substrate film can be made uniform, and even when the unnecessary portion is peeled while the adhesive film is rolled at a certain conveying speed, it is possible to suppress the occurrence of undesirable conditions such as rupture or defect in the unnecessary portion. By continuously rolling up the adhesive film at a certain conveying speed without causing any undesirable conditions, the manufacturing efficiency is improved.
[0019] Effects of the Invention
[0020] According to the present invention, even when the winding is performed at a constant conveying speed and the unnecessary portion is peeled, the unnecessary portion can be prevented from being broken or damaged, thereby improving the manufacturing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a perspective view showing an adhesive film according to one embodiment of the present invention.
[0022] Figure 2 yes Figure 1 A top view of the adhesive film is shown.
[0023] Figure 3 is along Figure 2 Cross-sectional view taken along line III-III.
[0024] Figure 4 This is a flowchart showing a method for producing an adhesive film according to one embodiment of the present invention.
[0025] Figure 5 It is a perspective view showing the state of the peeling step.
[0026] Figure 6 It is a plan view showing an adhesive film according to a modification.
[0027] Figure 7 It is a top view showing an adhesive film according to another modification.
[0028] Figure 8 It is a top view showing an adhesive film according to still another modification. DETAILED DESCRIPTION
[0029] Hereinafter, preferred embodiments of an adhesive film and a method for producing the adhesive film according to one aspect of the present invention will be described in detail with reference to the accompanying drawings.
[0030] Figure 1 It is a perspective view showing an adhesive film according to one embodiment of the present invention. Figure 2 yes Figure 1 A top view of the adhesive film is shown. Figure 3 is along Figure 2 Cross-sectional view taken along line III-III. Figure 1 to Figure 3 The adhesive film 1 shown is a film used in, for example, a semiconductor chip manufacturing process. The adhesive film 1 is used, for example, to fix a semiconductor wafer in a back grinding process or to bond a semiconductor chip to a wafer in a bonding process. Except when in use, the adhesive film 1 is stored in a rolled state (see Figure 1 ).
[0031] like Figure 1 to Figure 3 As shown, the adhesive film 1 includes a long substrate film 2, an adhesive layer 3 provided on one side of the substrate film 2, and a pressure-sensitive adhesive film 4 (see Figure 3 ). Figure 3 As shown, the adhesive layer 3 is disposed on the base film 2, and the pressure-sensitive adhesive film 4 is disposed on the adhesive layer 3. Although not shown in the figure, the pressure-sensitive adhesive film 4 is composed of a base film and a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is disposed on the adhesive layer 3 so as to face the adhesive layer 3 side.
[0032] The base film 2 is a film-like portion that serves as a base of the adhesive film 1. Examples of the constituent material of the base film 2 include polysemi-aromatic ester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, fully aromatic polyester films, liquid crystalline aromatic polyester films, polyamide films, polyimide films, and polyamideimide films. The surface of the base film 2 may be subjected to a mold release treatment using silicone or the like.
[0033] The adhesive layer 3 is, for example, a film-like portion called NCF (Non Conductive Film). As a constituent material of the adhesive layer 3, for example, a thermosetting resin having electrical insulation properties can be cited. As a thermosetting resin, epoxy resin, bismaleimide resin, triazine resin, polyimide resin, polyamide resin, cyanoacrylate resin, phenolic resin, unsaturated polyester resin, melamine resin, urea-formaldehyde resin, polyurethane resin, polyisocyanate resin, furan resin, resorcinol resin, xylene resin, benzoguanamine resin, diallyl phthalate resin, silicone resin, polyvinyl butyral resin, siloxane-modified epoxy resin, siloxane-modified polyamide-imide resin, acrylate resin, etc. can be cited. These can be used alone or as a mixture of two or more.
[0034] The pressure-sensitive adhesive film 4 is, for example, a film-like portion called a back grinding tape. The pressure-sensitive adhesive film 4 may include one or more pressure-sensitive adhesive layers and one or more base film layers, or may be composed of one pressure-sensitive adhesive layer and one base film layer. The thickness of the pressure-sensitive adhesive film 4 may be, for example, 10 μm to 200 μm, or 20 μm to 150 μm.
[0035] As the substrate layer, for example, plastic films such as polyester film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, etc. can be cited. Among these, polyester film is preferred, and polyethylene terephthalate film is more preferred. The substrate layer can be a layer formed by mixing two or more of the above materials or a layer formed by multi-layering the above films. The thickness of the substrate layer can be, for example, 10 μm to 100 μm, or 20 μm to 80 μm.
[0036] The pressure-sensitive adhesive layer preferably has adhesive force at room temperature and has the required adhesion force relative to the adherend. The pressure-sensitive adhesive layer preferably has the property of being cured by high-energy rays such as radiation or heat (reduced adhesive force), but it is more preferably that it can be easily peeled off from the adhesive film 1 even without applying high-energy rays such as radiation or heat. The pressure-sensitive adhesive layer can be a pressure-sensitive pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer can be formed using, for example, acrylic resins, various synthetic rubbers, natural rubbers, and polyimide resins. The thickness of the pressure-sensitive adhesive layer can be, for example, 5μm to 100μm, or 10μm to 80μm.
[0037] like Figure 2 As shown, the adhesive layer 3 and the pressure-sensitive adhesive film 4 are pre-separated into a plurality of functional layers 11 and a plurality of protective layers 12 by pre-cutting. The functional layer 11 and the protective layer 12 are both laminated bodies of the adhesive layer 3 and the pressure-sensitive adhesive film 4. The plurality of functional layers 11, 11 are separated from each other, the plurality of protective layers 12, 12 are separated from each other, and the functional layers 11 and the protective layers 12 are separated from each other by peeling off the unnecessary part P described later. The separated part is formed by winding up the unnecessary part P using a peeling roller (refer to Figure 5 ), so it becomes connected to the extending direction of the base film 2. In the separated part, the adhesive layer 3 and the pressure-sensitive adhesive film 4 are removed, and one side of the base film 2 is exposed.
[0038] The functional layer 11 is a part used in the manufacturing process of the semiconductor chip. Figure 2As shown, each of the functional layers 11 is in a perfect circular shape when viewed from above the substrate film 2, and is disposed separately from each other along the extension direction of the substrate film 2. The planar shape of the functional layer 11 is not necessarily a perfect circular shape, but may be an elliptical shape, an oblong shape, or other circular shapes. In the functional layer 11, a mark (not shown) may also be attached to a predetermined position of the pressure-sensitive adhesive film 4. The mark can be formed, for example, by screen printing, embossing, or inkjet.
[0039] The protective layer 12 is a portion that protects the functional layer 11 from the pressure when the adhesive film 1 is rolled into a roll. Figure 2 As shown, the protective layer 12 is symmetrically arranged in the width direction of the base film 2 so as to surround each functional layer 11. In this embodiment, the protective layer 12 is arranged so that the functional layers 11 adjacent to each other in the extending direction of the base film 2 form a pair with the center of the base film 2 in the width direction interposed therebetween.
[0040] The protective layer 12 has a straight portion 13A along the extension direction of the substrate film 2 and a straight portion 13B facing the circumference 11a of the functional layer 11 when viewed from above the substrate film 2. The straight portion 13A is a straight portion extending in parallel with the extension direction of the substrate film 2. A slight angle deviation relative to the extension direction of the substrate film 2 is allowed. The “facing the circumference 11a of the functional layer 11” in the straight portion 13B means that an imaginary straight line orthogonal to the straight portion 13B intersects the circumference 11a of the functional layer 11. The imaginary straight line orthogonal to the straight portion 13B does not necessarily intersect the circumference 11a of the functional layer 11 in the entire straight portion 13B, as long as it intersects the circumference 11a of the functional layer 11 in at least a portion of the straight portion 13B.
[0041] The diameter of the functional layer 11 may be, for example, 295 mm to 310 mm, or 298 mm to 305 mm. The width of the substrate film 2 (the length of the substrate film 2 in a direction perpendicular to the extending direction) is not particularly limited as long as it is greater than the diameter of the functional layer 11 and the width of the strip-shaped portion 22 described later, and may be, for example, 320 mm to 400 mm, or 330 mm to 350 mm.
[0042] When forming the straight line portions 13A, 13B, Figure 2In the example, the protective layer 12 has an island portion 21 that is triangular in shape when viewed from above the substrate film 2 and a strip portion 22 that extends along the extension direction of the substrate film 2 at both ends 2a in the width direction of the substrate film 2. The planar shape of the island portion 21 is, for example, an isosceles triangle. The planar shape of the island portion 21 can be a right-angled isosceles triangle or an equilateral triangle. The corners of the island portion 21 can be rounded. The island portion 21 is configured so that its vertex is oriented toward the center in the width direction of the substrate film 2. The bottom side 21a of the island portion 21 is equivalent to the straight line portion 13A along the extension direction of the substrate film 2, and faces the end 2a in the width direction of the substrate film 2 and the inner edge 22a of the strip portion 22. The hypotenuse 21b of the island portion 21 is equivalent to the straight line portion 13B that faces the circumference 11a of the functional layer 11.
[0043] The strip-shaped portion 22 is arranged with a predetermined width from the edge in the width direction of the base film 2. The strip-shaped portion 22 extends over the entire length in the extension direction of the base film 2. The inner edge 22a of the strip-shaped portion 22 corresponds to the straight line portion 13A along the extension direction of the base film 2. The portion of the inner edge 22a of the strip-shaped portion 22 where an imaginary straight line perpendicular to the inner edge 22a intersects the circumference 11a of the functional layer 11 corresponds to the straight line portion 13B facing the circumference 11a of the functional layer 11. That is, the inner edge 22a of the strip-shaped portion 22 has both the straight line portions 13A and 13B.
[0044] Next, a method for producing the above-mentioned pressure-sensitive adhesive sheet will be described.
[0045] Figure 4 1 is a flow chart showing a method for manufacturing an adhesive film according to an embodiment of the present invention. Figure 4 As shown, the method for manufacturing the adhesive film includes a feeding step (step S01), a laminating step (step S02), a cutting step (step S03), a peeling step (step S04) and a winding step (step S05).
[0046] The feeding step S01 is a step of feeding a long substrate film 2 having an adhesive layer 3 provided on one side at a predetermined conveying speed. The laminating step S02 is a step of laminating a pressure-sensitive adhesive film 4 on the adhesive layer 3. The cutting step S03 is a step of pre-cutting the adhesive layer 3 and the pressure-sensitive adhesive film 4 in a predetermined pattern. The peeling step S04 is a step of peeling off an unnecessary portion P of the adhesive layer 3 and the pressure-sensitive adhesive film 4 from one side of the substrate film 2.
[0047] In the cutting step S03, the adhesive layer 3 and the pressure-sensitive adhesive film 4 are pre-cut in such a way that the functional layer 11 is circular when viewed from above the base film 2. Furthermore, the protective layer 12 is pre-cut in such a way that it has a straight line portion 13A along the extending direction of the base film 2 and a straight line portion 13B facing the circumference 11a of the functional layer 11 when viewed from above the base film 2.
[0048] In this embodiment, in the cutting step S03, the adhesive layer 3 and the pressure-sensitive adhesive film 4 are pre-cut in such a manner that the protective layer 12 has an island portion 21 which is triangular in shape when viewed from above the substrate film 2, the oblique side 21b of the island portion 21 faces the circumference 11a of the functional layer 11, and the bottom side 21a of the island portion 21 faces the end 2a in the width direction of the substrate film 2.
[0049] like Figure 5 As shown, in the peeling step S04, the unnecessary portion P of the adhesive layer 3 and the pressure-sensitive adhesive film 4 is peeled off by winding up the peeling roller 37. The peeled unnecessary portion P is wound up by a winding roller (not shown) at the rear section of the peeling roller 37. The unnecessary portion P is a portion other than the functional layer 11 and the protective layer 12 finally formed in the adhesive layer 3 and the pressure-sensitive adhesive film 4 on one side of the substrate film 2. In the present embodiment, the unnecessary portion P is divided by the circumference 11a of the functional layer 11, the bottom edge 21a and the oblique edges 21b, 21b of the island portion 21 of the protective layer 12, and the inner edge 22a of the band portion 22 of the protective layer 12. The unnecessary portion P is connected to the extension direction of the substrate film 2 and can be continuously peeled off from one side of the substrate film 2 by winding up the peeling roller 37. Thereafter, the adhesive film 1 is wound up by the winding roller to obtain Figure 1 The adhesive film 1 is shown in a roll.
[0050] As described above, in the adhesive film 1, the protective layer 12 has a straight portion 13A along the extension direction of the substrate film 2 and a straight portion 13B facing the circumference 11a of the functional layer 11 when viewed from above the substrate film 2. With this structure, compared with the case where the protective layer 12 is arranged along the circumference 11a of the functional layer 11, the area of the unnecessary portion P of the adhesive layer 3 and the pressure-sensitive adhesive film 4 can be ensured, and the straight portions 13A and 13B can be included in their shapes. As a result, the force applied to the unnecessary portion P when peeling from one side of the substrate film 2 can be made uniform, and even when the unnecessary portion P is peeled while the adhesive film 1 is rolled up at a certain conveying speed, it is possible to suppress the occurrence of undesirable conditions such as cracks or defects in the unnecessary portion P. By continuously rolling up the adhesive film 1 at a certain conveying speed without causing any undesirable conditions, the manufacturing efficiency can be improved.
[0051] In the present embodiment, the protective layer 12 has an island portion 21 that is triangular in shape when viewed from above the substrate film 2. The island portion 21 is configured so that the hypotenuse 21b faces the circumference 11a of the functional layer 11, and the bottom 21a faces the end 2a in the width direction of the substrate film 2. According to such a structure, the protective layer 12 can be effectively arranged around the functional layer 11. Therefore, the functional layer 11 can be firmly protected from the pressure when the adhesive film 1 is rolled into a roll, and the deformation of the functional layer 11, the transfer of the roll marks, etc. can be suppressed. In addition, by utilizing the straight portion (bottom 21a and hypotenuse 21b, 21b) of the island portion 21, the straight portions 13A and 13B can be fully formed in the shape of the unnecessary portion P of the adhesive layer 3 and the pressure-sensitive adhesive film 4. As a result, the force applied to the unnecessary portion P when peeling from one side of the substrate film 2 can be more reliably uniformed.
[0052] In the present embodiment, the protective layer 12 has a strip-shaped portion 22 extending in the extending direction of the substrate film 2 at both ends 2a, 2a in the width direction of the substrate film 2. By disposing the protective layer 12 at both ends 2a, 2a in the width direction of the substrate film 2, the functional layer 11 can be further fully protected from the pressure when the adhesive film 1 is rolled into a roll. In addition, by utilizing the straight portion of the strip-shaped portion 22, the straight portions 13A, 13B can be fully formed into the shape of the unnecessary portion P of the adhesive layer 3 and the pressure-sensitive adhesive film 4. As a result, the force applied to the unnecessary portion P when peeling from one side of the substrate film 2 can be more reliably uniformed.
[0053] For example, in the above embodiment, the protective layer 12 has the strip-shaped portions 22 extending along the extending direction of the substrate film 2 at both ends 2a, 2a in the width direction of the substrate film 2, but it may also be Figure 6 The adhesive film 1A shown generally omits the strip-shaped portion 22, and only the triangular island-shaped portion 21 constitutes the protective layer 12. In this structure, the same effect as the above-mentioned embodiment can be exerted. In addition, since the strip-shaped portion 22 is omitted, the area of the unnecessary portion P of the adhesive layer 3 and the pressure-sensitive adhesive film 4 can be further ensured. Therefore, the force applied to the unnecessary portion P when peeling from one side of the base film 2 can be more reliably uniformed.
[0054] Furthermore, in the above-mentioned embodiment, the triangular island portion 21 is disposed in the top view of the base film 2, but the island portion 21 may be replaced by a Figure 7 As in the adhesive film 1B shown in FIG. 1 , a trapezoidal island portion 51 is provided in a plan view of the base film 2. Figure 7In the example of , the island-shaped portion 21 is in an isosceles trapezoidal shape and is arranged so that its upper base 51a faces the center in the width direction of the base film 2. The upper base 51a of the island-shaped portion 21 corresponds to the straight line portion 13A along the extending direction of the base film 2. The lower base 51b of the island-shaped portion 51 corresponds to the straight line portion 13A along the extending direction of the base film 2, and faces the end 2a in the width direction of the base film 2 and the inner edge 22a of the band-shaped portion 22. The oblique side 51c of the island-shaped portion 51 corresponds to the straight line portion 13B facing the circumference 11a of the functional layer 11.
[0055] This structure can also achieve the same effect as the above-mentioned embodiment. Furthermore, by making the island portion 51 into a trapezoidal shape, the straight portion 13A can be fully arranged, and the force applied to the unnecessary portion P when peeling from one side of the base film 2 can be more reliably uniform. Figure 7 In the form of Figure 6 The strip portion 22 may be omitted in the same manner.
[0056] like Figure 8 The adhesive film 1C shown can omit the island-shaped portion, and the protective layer 12 can be formed only by the strip-shaped portion 22. In this structure, the same effect as the above embodiment can be achieved. In addition, since the island-shaped portion is omitted, the area of the unnecessary portion P of the adhesive layer 3 and the pressure-sensitive adhesive film 4 can be further ensured. Therefore, the force applied to the unnecessary portion P when peeling from one side of the base film 2 can be more reliably uniformed. By omitting the island-shaped portion, the pattern of the pre-cutting process is simplified, thereby also achieving an improvement in the yield of the adhesive film 1C.
[0057] Explanation of symbols
[0058] 1-adhesive film, 2-base film, 2a-end, 3-adhesive layer, 4-pressure-sensitive adhesive film, 11-functional layer, 11a-circumference, 12-protective layer, 13A, 13B-straight portion, 21-island portion, 21a-bottom edge, 21b-bevel edge, 22-band portion, 51-island portion, 51a-upper bottom, 51b-lower bottom, 51c-bevel edge, P-unnecessary portion.
Claims
1. An adhesive film, comprising: A long strip of substrate film; and An adhesive layer and a pressure-sensitive adhesive film are provided on one side of the substrate film, On one side of the substrate film is provided: a plurality of functional layers, which are composed of the adhesive layer and the pressure-sensitive adhesive film and are arranged separately from each other along the extending direction of the substrate film; and A plurality of protective layers are formed of the adhesive layer and the pressure-sensitive adhesive film and are arranged symmetrically with respect to the width direction of the base film so as to surround the functional layer. The functional layer is circular in a plan view of the substrate film. The protective layer has a straight line portion along the extending direction of the base film and a straight line portion facing the circumference of the functional layer in a plan view of the base film.
2. The adhesive film according to claim 1, wherein The protective layer has an island portion that is triangular in plan view of the base film, and is arranged so that the oblique side of the island portion faces the circumference of the functional layer and the bottom side of the island portion faces the width direction end of the base film.
3. The adhesive film according to claim 1, wherein The protective layer has an island portion that is trapezoidal in plan view of the base film, and is arranged so that the oblique side of the island portion faces the circumference of the functional layer and the bottom of the island portion faces the widthwise end of the base film.
4. The adhesive film according to any one of claims 1 to 3, wherein The protective layer has strip-shaped portions extending in the extending direction of the base film at both ends in the width direction of the base film.
5. A method for manufacturing an adhesive film, comprising: A feeding step of feeding a long substrate film having an adhesive layer provided on one side thereof at a predetermined feeding speed; a laminating step of laminating a pressure-sensitive adhesive film on the adhesive layer; A cutting step of pre-cutting the adhesive layer and the pressure-sensitive adhesive film in a prescribed pattern; a peeling step of peeling off the adhesive layer and unnecessary portions of the pressure-sensitive adhesive film from one side of the substrate film, and forming a plurality of functional layers disposed separately from each other along the extension direction of the substrate film and a plurality of protective layers disposed symmetrically with respect to the width direction of the substrate film in a manner of surrounding the functional layers on one side of the substrate film; and a winding step of winding the adhesive film obtained in the stripping step into a roll shape, In the cutting step, the adhesive layer and the pressure-sensitive adhesive film are pre-cut in such a manner that the functional layer is circular when viewed from above the substrate film, and the protective layer has a straight line portion along the extension direction of the substrate film and a straight line portion facing the circumference of the functional layer when viewed from above the substrate film.
6. The method for producing an adhesive film according to claim 5, wherein: In the cutting step, the adhesive layer and the pressure-sensitive adhesive film are pre-cut in such a manner that the protective layer has an island-shaped portion which is triangular in shape when viewed from above the base film, the oblique side of the island-shaped portion faces the circumference of the functional layer, and the bottom side of the island-shaped portion faces the end portion in the width direction of the base film.
7. The method for producing an adhesive film according to claim 5, wherein: In the cutting step, the adhesive layer and the pressure-sensitive adhesive film are pre-cut in such a manner that the protective layer has an island-shaped portion that is trapezoidal in shape when viewed from above the base film, the oblique side of the island-shaped portion faces the circumference of the functional layer, and the lower bottom of the island-shaped portion faces the end portion in the width direction of the base film.
8. The method for producing an adhesive film according to any one of claims 5 to 7, wherein: In the cutting step, the adhesive layer and the pressure-sensitive adhesive film are preliminarily cut so that the protective layer has strip-shaped portions extending in the extending direction of the base film at both ends in the width direction of the base film.
Citation Information
Patent Citations
Laminated sheet support for die attachment
JP2006202927A
