Automatic compensation device and method for recombined material dipping glue solution

Abstract

The invention discloses an automatic compensation device and method for a recombined material dipping glue solution, and relates to the technical field of wood processing. The bottom of the impregnation tank is communicated with an inlet of the circulating pump through a liquid outlet pipeline; an outlet of the circulating pump is communicated with the top of the impregnation tank through a liquid return pipeline; the compensation device comprises a liquid-solid content compensation device, a liquid level compensation device and a pH value compensation device; the control system comprises a controller; the controller is also electrically connected with the pH determinator, the solid content determinator and the liquid level detector respectively; the pH determinator and the solid content determinator are both arranged in the liquid return pipeline, and the liquid level detector is arranged on one side of the gum dipping tank. The automatic compensation device is controlled through a control system, and the solid content adjustment of the glue solution, the liquid level adjustment of the dipping glue solution and the stable adjustment of the pH value can be accurately realized; compared with the traditional method, the method has the characteristics of short response time, high efficiency, more uniform pH regulation and the like.

Description

Technical Field

[0001] The invention relates to the technical field of wood processing, and in particular to an automatic compensation device and method for reconstituted material impregnated with glue. Background Art

[0002] Dipping is an important process of wood recombinant materials, that is, the recombinant units (wood fiber bundles and bamboo fiber bundles) are stacked in a hanging cage, immersed in a phenolic resin glue pool for a certain period of time, and then taken out and drained. In this process, as the dipping time is extended, the extract in the recombinant unit (especially the heat-treated recombinant unit) is continuously dissolved, causing the pH value of the phenolic resin glue in the glue pool to decrease, thereby causing the phenolic resin water-soluble multiple to decrease and the curing properties to change. Therefore, during the dipping process, it is necessary to frequently supplement alkaline substances such as sodium hydroxide and its aqueous solution in the glue. At the same time, as the number of dippings continues to increase, the glue is impregnated into the recombinant unit, and it is necessary to regularly adjust the solid content and supplement the dipping glue. At present, adjusting pH is usually to directly add sodium hydroxide or sodium hydroxide aqueous solution into the glue pool, but because the glue pool of the recombinant material is generally large, the glue mass in the glue pool reaches 5-30 tons, and it is difficult to mix evenly by the direct addition method, resulting in a local glue pH value that is too high, thereby affecting the performance of the adhesive. The way to adjust the solid content and replenish the impregnation glue solution is to add original glue and water to the impregnation tank, and adjust the amount of original glue and water to make the solid content of the impregnation solution reach the required value. This method is mostly adjusted by operators based on experience, has high dependence on personnel, and has low adjustment efficiency. Summary of the invention

[0003] The purpose of the present invention is to provide an automatic compensation device and method for recombinant material impregnation glue solution to solve the problems existing in the above-mentioned prior art, and the device has the characteristics of short response time, high efficiency, more uniform pH adjustment, etc.

[0004] To achieve the above-mentioned object, the present invention provides the following scheme: The present invention provides an automatic compensation device for recombinant material impregnation glue liquid, comprising a glue impregnation device, comprising a glue impregnation tank; the bottom of the glue impregnation tank is connected to the inlet of a first circulation pump through a liquid outlet pipe, and the outlet of the first circulation pump is connected to the top of the glue impregnation tank through a liquid return pipe;

[0005] The compensation device comprises a liquid level compensation device; the liquid level compensation device comprises a glue compensation liquid storage tank and an anti-overflow storage tank; the outlet end of the glue compensation liquid storage tank is connected to the compensation pipeline through a branch pipeline; the inlet end of the glue compensation liquid storage tank is also connected to the outlet of the phenolic resin storage tank and the outlet of the water storage tank respectively; the outlet end of the anti-overflow storage tank is connected to the compensation pipeline through a branch pipeline; the inlet end of the anti-overflow storage tank is connected to the top of the dipping tank; the glue compensation liquid storage tank and the anti-overflow storage tank transport glue into the dipping tank through the compensation pipeline and the second circulation pump, so as to achieve the high stability of the glue liquid level in the dipping tank;

[0006] The control system comprises a controller; the controller is electrically connected to a measuring component; the measuring component comprises a liquid level acquisition unit, and the liquid level acquisition unit is used to monitor the liquid level height in the dipping tank.

[0007] The compensation device also includes a liquid-solid content compensation device, which realizes the stability of the solid content of the glue liquid in the dipping tank by conveying phenolic resin and water into the dipping tank; the liquid-solid content compensation device includes a phenolic resin storage tank and a water storage tank; the outlet of the phenolic resin storage tank is connected to the compensation pipeline; the outlet of the water storage tank is connected to the top of the dipping tank through a branch pipe and a third circulation pump; the measuring component also includes a solid content acquisition unit, and the solid content acquisition unit is used to monitor the solid content of the glue liquid in the dipping tank.

[0008] The compensation device also includes a pH value compensation device, which realizes the stability of the pH value in the dipping tank by conveying sodium hydroxide solution into the dipping tank; the pH value compensation device includes a sodium hydroxide solution storage tank and a water storage tank; the sodium hydroxide solution storage tank is connected to the top of the dipping tank through a branch pipe and a fourth circulation pump; the measuring component also includes a pH acquisition unit, and the pH acquisition unit is used to monitor the pH value in the dipping tank.

[0009] The compensation pipeline is communicated with the inlet of the second circulation pump, and the second circulation pump is communicated with the top of the dipping tank through a pipeline.

[0010] The pH acquisition unit and the solid content acquisition unit are both placed in the liquid return pipeline; the liquid level acquisition unit is placed on one side of the dipping tank.

[0011] The glue dipping tank is a vertical tank body or a horizontal tank body.

[0012] A method for automatically compensating a recombinant material impregnated with a glue solution comprises the following steps:

[0013] pH value compensation, setting the pH value of the glue solution to a specific value K, and detecting the pH value of the glue solution in the glue dipping tank according to the pH acquisition unit; if the pH value of the glue solution is less than K-1.5, start the pH value compensation program, and the controller controls the control valves on the sodium hydroxide solution storage tank and the water storage tank to open, and transport the sodium hydroxide solution and water to the glue dipping tank; when the pH value of the glue solution is equal to K, terminate the pH value compensation program of the glue solution, close the control valves on the sodium hydroxide solution storage tank and the water storage tank, and stop replenishing sodium hydroxide and water into the glue dipping tank; when the pH value of the glue solution is greater than K-1.5 and less than K+1.5, the pH compensation program is no longer started; when the pH value of the glue solution in the glue dipping tank is greater than K+1.5, start the alarm device;

[0014] Liquid-solid content compensation, setting the solid content of the glue solution to a specific value S, and detecting the solid content of the glue solution in the dipping tank according to the solid content acquisition unit; if the solid content of the glue solution is less than S-1%, the glue solution solid content compensation program is started, the controller controls the control valve on the phenolic resin storage tank to open, and the phenolic resin is added to the dipping tank. When the solid content of the glue solution is equal to S, the glue solution solid content compensation program is terminated, the controller controls the control valve on the phenolic resin storage tank to close, and the injection of phenolic resin into the dipping tank is stopped; if the solid content of the glue solution is greater than S+1%, the glue solution solid content compensation program is started, the controller controls the control valve on the water storage tank to open, and water is added to the dipping tank. When the solid content of the glue solution is equal to S, the glue solution solid content compensation program is terminated, the controller controls the control valve on the water storage tank to close, and the injection of water into the dipping tank is stopped.

[0015] It also includes liquid level compensation, setting the inner diameter height of the glue dipping tank to H, and detecting the glue level in the glue dipping tank according to the liquid level acquisition unit; if the glue level is less than 0.5H, the glue level compensation program is started, and the controller controls the control valves of the anti-overflow storage tank and the glue compensation liquid storage tank to open in sequence, and the glue or glue compensation liquid is added to the glue dipping tank. When the glue level is equal to 0.75H, the glue level compensation program is terminated, and the controller controls the control valves of the anti-overflow storage tank and the glue compensation liquid storage tank to close in sequence, and the glue or glue compensation liquid is stopped from being added to the glue dipping tank; when the glue level is greater than 0.5H, the glue level compensation program is not started.

[0016] The priority of the glue liquid added for the liquid level compensation is the glue liquid in the overflow prevention tank, followed by the glue liquid in the glue compensation liquid storage tank.

[0017] The priorities of the automatic compensation method for the impregnated glue solution are automatic compensation for the pH value of the glue solution, automatic compensation for the solid content of the glue solution, and automatic compensation for the glue amount of the glue solution.

[0018] The present invention discloses the following technical effects: the automatic compensation device is controlled by a control system to accurately achieve stable adjustment of the pH value and the solid content of the glue solution; compared with traditional methods, it has the characteristics of short response time, high efficiency, and more uniform pH adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 This is a schematic overall diagram of the structure of the automatic glue compensation device of the present invention;

[0021] Figure 2 This is a schematic diagram of the structure of the automatic glue level compensation device of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the automatic compensation device for the glue level and the automatic compensation device for the solid content of the present invention;

[0023] Figure 4 This is a flow chart of the automatic compensation method of the present invention;

[0024] Among them, 1. Glue dipping tank; 2. First circulation pump; 3. Glue liquid compensation liquid storage tank; 4. Anti-overflow storage tank; 5. Second circulation pump; 6. Phenolic resin storage tank; 7. Water storage tank; 8. Controller; 9. Liquid level acquisition unit; 10. Third circulation pump; 11. Solid content acquisition unit; 12. Sodium hydroxide solution storage tank; 13. Fourth circulation pump; 14. pH acquisition unit. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] The present invention provides an automatic compensation device for recombinant material impregnation glue solution, as shown in the attached Figure 1-3 As shown, including:

[0028] It includes a dipping device, including a dipping tank 1; the bottom port D of the dipping tank 1 is connected to the inlet of the first circulation pump 2 through a liquid outlet pipe, and the outlet of the first circulation pump 2 is connected to the top port C of the dipping tank 1 through a liquid return pipe;

[0029] The compensation device includes a liquid level compensation device; the liquid level compensation device includes a glue compensation liquid storage tank 3 and an anti-overflow storage tank 4; the outlet end of the glue compensation liquid storage tank 3 is connected to the compensation pipeline through a branch pipeline; the inlet end of the glue compensation liquid storage tank 3 is also connected to the outlet of the phenolic resin storage tank 6 and the outlet of the water storage tank 7 respectively; the outlet end of the anti-overflow storage tank 4 is connected to the compensation pipeline through a branch pipeline; the inlet end of the anti-overflow storage tank 4 is connected to the top of the dipping tank 1; the glue compensation liquid storage tank 3 and the anti-overflow storage tank 4 transport glue into the dipping tank 1 through the compensation pipeline and the second circulation pump 5, so as to achieve a high stability of the glue liquid level in the dipping tank 1;

[0030] The control system includes a controller 8 ; the controller 8 is electrically connected to the measuring component; the measuring component includes a liquid level acquisition unit 9 , and the liquid level acquisition unit 9 is used to monitor the liquid level height in the dipping tank 1 .

[0031] The compensation device also includes a liquid-solid content compensation device, which realizes the stability of the solid content of the glue solution in the dipping tank 1 by conveying phenolic resin and water into the dipping tank 1; the liquid-solid content compensation device includes a phenolic resin storage tank 6 and a water storage tank 7; the outlet E of the phenolic resin storage tank 6 is connected to the compensation pipeline; the outlet of the water storage tank 7 is connected to the top B port of the dipping tank 1 through a branch pipe and a third circulation pump 10; the measuring component also includes a solid content acquisition unit 11, which is used to monitor the solid content of the glue solution in the dipping tank 1.

[0032] The compensation device also includes a pH value compensation device, which realizes the stability of the pH value in the dipping tank 1 by conveying sodium hydroxide solution into the dipping tank 1; the pH value compensation device includes a sodium hydroxide solution storage tank 12 and a water storage tank 7; the sodium hydroxide solution storage tank 12 is connected to the B port on the top of the dipping tank 1 through a branch pipe and a fourth circulation pump 13; the measuring component also includes a pH acquisition unit 14, and the pH acquisition unit 14 is used to monitor the pH value in the dipping tank 1.

[0033] The compensation pipeline is communicated with the inlet of the second circulation pump 5, and the second circulation pump 5 is communicated with the port B at the top of the dipping tank 1 through a pipeline.

[0034] The pH acquisition unit 14 and the solid content acquisition unit 11 are both placed in the liquid return pipeline; the liquid level acquisition unit 9 is placed on one side of the dipping tank 1.

[0035] A method for automatically compensating a recombinant material impregnated with a glue solution comprises the following steps:

[0036] pH value compensation, setting the pH value of the glue solution to a specific value K, and detecting the pH value of the glue solution in the dipping tank 1 according to the pH acquisition unit 14; if the pH value of the glue solution is less than K-1.5, start the pH value compensation program, the controller 8 controls the control valves on the sodium hydroxide solution storage tank 12 and the water storage tank 7 to open, and transport the sodium hydroxide solution and water to the dipping tank 1; when the pH value of the glue solution is equal to K, terminate the pH value compensation program of the glue solution, the control valves on the sodium hydroxide solution storage tank 12 and the water storage tank 7 are closed, and stop replenishing sodium hydroxide and water into the dipping tank 1; when the pH value of the glue solution is greater than K-1.5 and less than K+1.5, the pH compensation program is no longer started; when the pH value of the glue solution in the dipping tank 1 is greater than K+1.5, start the alarm device;

[0037] Liquid-solid content compensation, set the solid content of the glue solution to a specific value S, and detect the solid content of the glue solution in the dipping tank 1 according to the solid content acquisition unit 11; if the solid content of the glue solution is less than S-1%, start the glue solution solid content compensation program, the controller 8 controls the control valve on the phenolic resin storage tank 6 to open, and add the phenolic resin to the dipping tank 1. When the solid content of the glue solution is equal to S, terminate the glue solution solid content compensation program, the controller 8 controls the control valve on the phenolic resin storage tank 6 to close, and stop injecting phenolic resin into the dipping tank 1; if the solid content of the glue solution is greater than S+1%, start the glue solution solid content compensation program, the controller 8 controls the control valve on the water storage tank 7 to open, and add water to the dipping tank 1. When the solid content of the glue solution is equal to S, terminate the glue solution solid content compensation program, the controller 8 controls the control valve on the water storage tank 7 to close, and stop injecting water into the dipping tank 1.

[0038] It also includes liquid level compensation, setting the inner diameter height of the glue dipping tank 1 to H, and detecting the glue level in the glue dipping tank 1 according to the liquid level acquisition unit 9; if the glue level is less than 0.5H, the glue level compensation program is started, and the controller 8 controls the control valves of the anti-overflow storage tank 4 and the glue compensation liquid storage tank 3 to open in sequence, and replenish glue or glue compensation liquid into the glue dipping tank 1; when the glue level is equal to 0.75H, the glue level compensation program is terminated, and the controller 8 controls the control valves of the anti-overflow storage tank 4 and the glue compensation liquid storage tank 3 to close in sequence, and stop replenishing glue or glue compensation liquid into the glue dipping tank 1; when the glue level is greater than 0.5H, the glue level compensation program is not started.

[0039] The priority of the glue added for liquid level compensation is the glue in the overflow prevention tank 4, followed by the glue in the glue compensation liquid tank 3.

[0040] The priority of the automatic compensation method of the impregnating glue solution is automatic compensation of the pH value of the glue solution, automatic compensation of the solid content of the glue solution, and automatic compensation of the glue amount of the glue solution.

[0041] Further, the liquid level height of the glue in the dipping tank 1 is detected in real time by the liquid level acquisition unit 9. If the glue level in the dipping tank 1 is between 1 / 2 and 3 / 4 of the depth of the dipping tank 1, the controller 8 turns off the automatic glue amount compensation operation; if the glue level in the dipping tank 1 is lower than 1 / 2 of the depth of the dipping tank 1, the controller 8 starts the automatic glue amount compensation operation, and sequentially replenishes the glue in the anti-overflow storage tank 4 and the glue in the glue compensation liquid storage tank 3 into the dipping tank 1 until the glue level in the dipping tank 1 reaches 3 / 4 of the glue level in the dipping tank 1, and the automatic glue amount compensation is completed;

[0042] In one embodiment of the present invention, the power of the first circulation pump 2 is 300-1500w.

[0043] In one embodiment of the present invention, the dipping tank 1 is a vertical tank body or a horizontal tank body.

[0044] In one embodiment of the present invention, the glue compensation liquid storage tank 3 can be configured in real time with glue having the same solid content as the glue in the dipping tank 1 through the phenolic resin storage tank 6 and the water storage tank 7 .

[0045] In one embodiment of the present invention, the compensating pipe is a corrosion-resistant pipe.

[0046] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solution of the present invention by ordinary technicians in this field should all fall within the scope of protection determined by the claims of the present invention.

Claims

1. An automatic compensation device for recombinant material impregnated with glue, characterized in that: include: A glue dipping device comprises a glue dipping tank (1); the bottom of the glue dipping tank (1) is connected to the inlet of a first circulation pump (2) through a liquid outlet pipe, and the outlet of the first circulation pump (2) is connected to the top of the glue dipping tank (1) through a liquid return pipe; A compensation device, comprising a liquid level compensation device; the liquid level compensation device comprises a glue compensation liquid storage tank (3) and an anti-overflow storage tank (4); the outlet end of the glue compensation liquid storage tank (3) is connected to the compensation pipeline through a branch pipeline; the inlet end of the glue compensation liquid storage tank (3) is also connected to the outlet of the phenolic resin storage tank (6) and the outlet of the water storage tank (7) respectively; the outlet end of the anti-overflow storage tank (4) is connected to the compensation pipeline through a branch pipeline; the inlet end of the anti-overflow storage tank (4) is connected to the top of the glue dipping tank (1); the glue compensation liquid storage tank (3) and the anti-overflow storage tank (4) transport glue into the glue dipping tank (1) through the compensation pipeline and the second circulation pump (5), so as to achieve a high stability of the glue liquid level in the glue dipping tank (1); The control system comprises a controller (8); the controller (8) is electrically connected to a measuring component; the measuring component comprises a liquid level acquisition unit (9), and the liquid level acquisition unit (9) is used to monitor the liquid level height in the dipping tank (1).

2. The automatic compensation device for recombinant material impregnation glue according to claim 1 is characterized by: The compensation device also includes a liquid-solid content compensation device, which realizes the stabilization of the solid content of the glue liquid in the glue dipping tank (1) by conveying phenolic resin and water into the glue dipping tank (1); the liquid-solid content compensation device includes a phenolic resin storage tank (6) and a water storage tank (7); the outlet of the phenolic resin storage tank (6) is connected to the compensation pipeline; the outlet of the water storage tank (7) is connected to the top of the glue dipping tank (1) through a branch pipe and a third circulation pump (10); the measuring component also includes a solid content acquisition unit (11), and the solid content acquisition unit (11) is used to monitor the solid content of the glue liquid in the glue dipping tank (1).

3. The automatic compensation device for recombinant material impregnation glue according to claim 2 is characterized in that: The compensation device further comprises a pH value compensation device, wherein the pH value compensation device realizes the stabilization of the pH value in the glue dipping tank (1) by conveying a sodium hydroxide solution into the glue dipping tank (1); the pH value compensation device comprises a sodium hydroxide solution storage tank (12) and a water storage tank (7); the sodium hydroxide solution storage tank (12) is connected to the top of the glue dipping tank (1) via a branch pipe and a fourth circulation pump (13); the measuring component further comprises a pH acquisition unit (14), wherein the pH acquisition unit (14) is used to monitor the pH value in the glue dipping tank (1).

4. The automatic compensation device for recombinant material impregnation glue according to claim 1 is characterized by: The compensation pipeline is in communication with the inlet of the second circulation pump (5), and the second circulation pump (5) is in communication with the top of the dipping tank (1) through a pipeline.

5. The automatic compensation device for recombinant material impregnation glue according to claim 3 is characterized by: The pH acquisition unit (14) and the solid content acquisition unit (11) are both placed in the liquid return pipeline; the liquid level acquisition unit (9) is placed on one side of the dipping tank (1).

6. A method for automatically compensating a recombinant material impregnated with glue, comprising the automatic compensating device for recombinant material impregnated with glue as claimed in any one of claims 1 to 5, characterized in that: The following steps are involved: pH value compensation, setting the pH value of the glue solution to a specific value K, and detecting the pH value of the glue solution in the glue dipping tank (1) according to the pH acquisition unit (14); if the pH value of the glue solution is less than K-1.5, starting the pH value compensation program, the controller (8) controls the control valves on the sodium hydroxide solution storage tank (12) and the water storage tank (7) to open, and transporting the sodium hydroxide solution and water into the glue dipping tank (1); when the pH value of the glue solution is equal to K, terminating the pH value compensation program of the glue solution, closing the control valves on the sodium hydroxide solution storage tank (12) and the water storage tank (7), and stopping the replenishment of sodium hydroxide and water into the glue dipping tank (1); when the pH value of the glue solution is greater than K-1.5 and less than K+1.5, the pH compensation program is no longer started; when the pH value of the glue solution in the glue dipping tank (1) is greater than K+1.5, starting the alarm device; Liquid-solid content compensation, setting the solid content of the glue liquid to a specific value S, and detecting the solid content of the glue liquid in the glue dipping tank (1) according to the solid content acquisition unit (11); if the solid content of the glue liquid is less than S-1%, the glue liquid solid content compensation program is started, the controller (8) controls the control valve on the phenolic resin storage tank (6) to open, and the phenolic resin is added to the glue dipping tank (1); when the solid content of the glue liquid is equal to S, the glue liquid solid content compensation program is terminated, the controller (8) controls the control valve on the phenolic resin storage tank (6) to close, and the injection of phenolic resin into the glue dipping tank (1) is stopped; if the solid content of the glue liquid is greater than S+1%, the glue liquid solid content compensation program is started, the controller (8) controls the control valve on the water storage tank (7) to open, and water is added to the glue dipping tank (1); when the solid content of the glue liquid is equal to S, the glue liquid solid content compensation program is terminated, the controller (8) controls the control valve on the water storage tank (7) to close, and the injection of water into the glue dipping tank (1) is stopped.

7. The automatic compensation method for recombinant material impregnation glue according to claim 6, characterized in that: The method also includes liquid level compensation, wherein the inner diameter height of the glue dipping tank (1) is set to H, and the glue level in the glue dipping tank (1) is detected by the liquid level acquisition unit (9); if the glue level is less than 0.5H, the glue level compensation program is started, and the controller (8) controls the control valves of the anti-overflow storage tank (4) and the glue compensation liquid storage tank (3) to open in sequence, and the glue or glue compensation liquid is added to the glue dipping tank (1); when the glue level is equal to 0.75H, the glue level compensation program is terminated, and the controller (8) controls the control valves of the anti-overflow storage tank (4) and the glue compensation liquid storage tank (3) to close in sequence, and the glue or glue compensation liquid is stopped from being added to the glue dipping tank (1); when the glue level is greater than 0.5H, the glue level compensation program is not started.

8. The automatic compensation method for recombinant material impregnation glue according to claim 7, characterized in that: The priority of the glue liquid added for liquid level compensation is the glue liquid in the anti-overflow storage tank (4), followed by the glue liquid in the glue liquid compensation liquid storage tank (3).

9. The automatic compensation method for recombinant material impregnation glue according to claim 8, characterized in that: The priorities of the automatic compensation method for the impregnated glue solution are automatic compensation for the pH value of the glue solution, automatic compensation for the solid content of the glue solution, and automatic compensation for the glue amount of the glue solution.

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