Silicon wafer printing machine suitable for double-half-wafer printing

By using the left and right calibration modules for visual positioning and angle adjustment in a silicon wafer printing machine, the problem of slow adjustment speed of printing modules is solved, and the efficiency of double half-film printing is improved.

CN119175935APending Publication Date: 2024-12-24FOLUNGWIN AUTOMATIC EQUIP CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
CN202411432581.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-14
Publication Date
2024-12-24

AI Technical Summary

Technical Problem

During the existing double half-sheet printing process, the printing module adjustment speed is slow, resulting in a slow alignment calibration process, affecting printing efficiency.

Method used

Using a silicon wafer printing machine including left and right calibration modules, the calibration camera is used to visually position the end of the conveying rail. The left half is used as a reference to adjust the angle of the right half is shortened to shorten the alignment time and improve printing. efficiency.

Benefits of technology

It greatly shortens the alignment time of the double half piece, saves the wire mesh correction action, and speeds up the printing efficiency on the turntable assembly.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119175935A_ABST
    Figure CN119175935A_ABST
Patent Text Reader

Abstract

The invention discloses a silicon wafer printing machine suitable for double-half-wafer printing. The silicon wafer printing machine comprises a working platform, a rotating disc assembly, a front section conveying rail, a left side calibration module and a right side calibration module, and a calibration vision camera is installed above the tail end of the front section conveying rail; the left linear module is connected with a left motor module, and the left motor module is connected with a left adsorption module; the right linear module is connected with a right motor module, the right motor module is connected with two calibration cylinders, the calibration cylinders are connected with calibration bearings, and the two calibration bearings are jointly connected with a right adsorption module. According to the silicon wafer printing machine suitable for double-half-wafer printing, visual positioning is conducted at the tail end of the conveying rail, the positions and angles of the double half wafers are judged, the left half wafer serves as the reference, the right half wafer is controlled to adjust the angle, the alignment time of the double half wafers is greatly shortened, double-head double-half-wafer printing is improved into single-head double-half-wafer printing, a front-back printing mode is adopted, and the printing efficiency is greatly improved. The size of the index plate is reduced, and the efficiency of printing on the rotary disc assembly is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production, and in particular to a silicon wafer printer suitable for double-half wafer printing. Background Art

[0002] Photovoltaic solar silicon wafers (hereinafter referred to as silicon wafers) are the core part of the solar power generation system and also the most valuable part of the solar power generation system. The function of the silicon wafer is to convert solar energy into electrical energy, which is stored by batteries or directly loaded for work. In the existing double-half-sheet printing process, the double-half-sheet is first transferred from the two front conveyor rails to the turntable assembly, and then the camera is used to position and adjust the printing module so that the screen can be accurately aligned with the double-half-sheet on the turntable assembly. Due to the slow adjustment speed of the printing module, the alignment and calibration process is slow, which affects the efficiency of the printing process. Summary of the invention

[0003] One object of the present invention is to provide a silicon wafer printer suitable for double half-wafer printing. Before the double half-wafers are transferred to the turntable assembly, two calibration modules are used for alignment. The left calibration module is used as a reference, and the right calibration module is used for angle correction, thereby saving subsequent alignment time and improving printing efficiency.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] A silicon wafer printer suitable for double half wafer printing, comprising a working platform, a turntable assembly, a front conveyor rail, a left calibration module and a right calibration module, wherein the turntable assembly is located in the middle of the working platform, the front conveyor rail is located on one side of the working platform, the left calibration module and the right calibration module are respectively located on both sides of the front conveyor rail, and a calibration visual camera is installed above the end of the front conveyor rail;

[0006] The left calibration module includes a left linear module, a driving end of the left linear module is connected to a left motor module, and a driving end of the left motor module is connected to a left adsorption module along a vertical direction;

[0007] The right calibration module includes a right linear module, the driving end of the right linear module is connected to the right motor module, the driving end of the right motor module is connected to two calibration cylinders, the two calibration cylinders are placed in parallel, the driving end of the calibration cylinder is downwardly connected to a calibration bearing, and the two calibration bearings are commonly connected to the right adsorption module.

[0008] As a preferred technical solution, a snapping motor is installed on the front conveying rail, the driving end key of the snapping motor is connected to a snapping synchronous wheel, the snapping synchronous wheel is transmission-connected to a snapping synchronous belt, and a snapping rod is fixed on the snapping synchronous belt.

[0009] As a preferred technical solution, it includes a rear-section conveyor rail, on which a fragment lifting cylinder is installed, the driving end of the fragment lifting cylinder is upwardly connected to a fragment lifting plate, both sides of the fragment lifting plate are located on the outside of the rear-section conveyor rail, and a detection bracket is installed at the rear end of the rear-section conveyor rail, and a sensor is installed on the top of the detection bracket. The sensor is located above the rear-section conveyor rail, and the sensor is used to sense whether there is a fragment blockage in the rear reflow furnace.

[0010] As a preferred technical solution, it includes a printing module, a group of X-axis modules and two groups of Y-axis modules are installed at the lower end of the printing module, and one group of X-axis modules and two groups of Y-axis modules are connected to a screen mounting frame.

[0011] As a preferred technical solution, lifting modules are installed on both sides of the rear end of the working platform, and the lifting modules include side brackets. A lifting servo motor is installed on the upper end of the side bracket, and a lifting ball screw is connected to the driving end of the lifting servo motor. Lifting plates are connected on both sides of the printing module, and a lifting ball nut is fixed to the outer side of the lifting plate. The lifting ball screw is threadedly connected to the lifting ball nut, and the lifting plate slides on the side bracket in a vertical direction. A lifting guide rail is installed on the side bracket, and a lifting slider is fixed to the outer side of the lifting plate, and the lifting slider slides on the lifting guide rail.

[0012] As a preferred technical solution, a scraper linear module is installed on the printing module, and the scraper linear module includes a profile base, an adapter plate and an electrical installation board. Electrical components and drag chains are installed on the electrical installation board. The lower ends of the adapter plate slide along the front and rear directions with the profile base through guide rails and sliders. The adapter plate is fixed on one side of the electrical installation board, and the adapter plate is locked with a printing kit.

[0013] As a preferred technical solution, the driving end of the scraper linear module is connected to a scraper forward and backward moving plate, the printing kit is fixed on one side of the scraper forward and backward moving plate, the lower end of the printing kit is connected to a slurry scraper, and the upper end of the printing kit is equipped with a scraper motor. The scraper motor controls the slurry scraper to move in a vertical direction through a ball screw and a ball nut. The lower end of the printing kit is also connected to an ink return knife, and the upper end of the printing kit is also equipped with an ink return motor. The ink return motor also controls the ink return knife seat with the ink return knife to move in a vertical direction through a ball screw and a ball nut, and the two ends of the ink return knife are respectively locked on the two ends of the ink return knife seat.

[0014] As a preferred technical solution, the X-axis module and the Y-axis module both have a module mechanism, which includes a module base plate, a module motor, an adjustment screw and an adjustment slide, the driving end of the module motor is transmission-connected to the adjustment screw, the adjustment screw is threadedly connected to the adjustment nut under the adjustment slide, the adjustment slide slides along the length direction of the adjustment screw, and the adjustment slide has a connecting bearing, the connecting bearing slides on the adjustment slide, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide, and the edge of the wire mesh mounting frame is locked in the connecting bearing.

[0015] As a preferred technical solution, the turntable assembly includes a circular turntable, an electrical integrated slip ring and a turntable motor. Four groups of workstations are installed around the circular turntable, and each group of the workstations is provided with two half-sheet printing positions. The driving end of the turntable motor is vertically connected to the electrical integrated slip ring, and the middle part of the circular turntable is connected to the electrical integrated slip ring. The lower end of the circular turntable is rotatably connected to a paper roll transport component, and the paper roll transport component includes a unwinding shaft and a winding shaft. A paper roll is transmission-connected between the unwinding shaft and the winding shaft. The paper roll passes through the half-sheet printing position and carries the silicon wafer, thereby transporting the silicon wafer. The paper roll is air permeable, and the paper roll transport component transports the silicon wafer to the workstation of the circular turntable, as well as to the printing position where the double half-sheet precision screen printer outputs the silicon wafer.

[0016] As a preferred technical solution, the positions between the four groups of workstations of the circular turntable form a fan-shaped area, which stores the discharger elements and control components together with the middle position of the circular turntable, and then is covered with a protective cover. Each of the half-sheet printing positions is provided with a breathable negative pressure plate, and a plurality of air holes are arranged on the breathable negative pressure plate. The air holes adsorb and fix the silicon wafer on the half-sheet printing position through the roll of paper.

[0017] The beneficial effects of the present invention are as follows: a silicon wafer printer suitable for double half wafer printing is provided, which determines the position and angle of the double half wafers by performing visual positioning at the end of the conveying rail, controls the adjustment angle of the right half wafer based on the left half wafer, and moves the right half wafer onto the turntable assembly for printing after being aligned with the left half wafer, thereby greatly shortening the alignment time of the double half wafers, saving the action of correcting the screen deviation, and accelerating the efficiency of printing on the turntable assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0019] Figure 1 A top view of a silicon wafer printer suitable for double half wafer printing according to an embodiment;

[0020] Figure 2 It is a first combined structural diagram of the front conveying rail, the left calibration module and the right calibration module described in the embodiment;

[0021] Figure 3 A second combined structural diagram of the front conveying rail, the left calibration module and the right calibration module described in the embodiment;

[0022] Figure 4 It is a structural schematic diagram of the right calibration module described in the embodiment;

[0023] Figure 5 It is a structural schematic diagram of the left calibration module described in the embodiment;

[0024] Figure 6 is a front perspective view of the turntable assembly described in the embodiment;

[0025] Figure 7 It is a front view of the turntable assembly described in the embodiment;

[0026] Figure 8 A middle flip diagram of the turntable assembly described in the embodiment;

[0027] Fig. 9 A front perspective view of the printing module described in the embodiment;

[0028] Fig.10 A bottom view of the printing module described in the embodiment;

[0029] Fig.11 An exploded view of the X-axis module / Y-axis module described in the embodiment;

[0030] Fig.12 It is a three-dimensional structural diagram of the lifting module described in the embodiment;

[0031] Fig.13 It is a structural schematic diagram of the printing kit described in the embodiment;

[0032] Fig.14 An exploded view of the printing kit according to the embodiment;

[0033] Fig.15 It is a schematic structural diagram of the rear section conveyor rail described in the embodiment.

[0034] Figures 1 to 15 middle:

[0035] 1. Work platform; 2. Turntable assembly; 3. Front conveyor rail; 4. Calibration module on the left; 5. Calibration module on the right; 6. Calibration visual camera; 7. Snap motor; 8. Snap synchronous wheel; 9. Snap rod; 10. Linear module on the left; 11. Motor module on the left; 12. Adsorption module on the left; 13. Linear module on the right; 14. Motor module on the right; 15. Calibration cylinder; 16. Calibration bearing; 17. Adsorption module on the right; 18. Circular turntable; 19. Electrical integrated slip ring; 20. Turntable motor; 21. Half-sheet printing position; 22. Unwinding shaft; 23. Rewinding shaft; 24. Paper roll; 25. Protective cover; 26. Breathable negative pressure plate; 27. Printing module; 28. X-axis module; 29. ​​Y Axis module; 30, screen installation frame; 31, module bottom plate; 32, module motor; 33, adjustment screw; 34, adjustment slide; 35, connecting bearing; 36, lifting module; 37, side bracket; 38, lifting servo motor; 39, lifting ball screw; 40, lifting plate; 41, lifting guide rail; 42, scraper linear module; 43, profile base; 44, drag chain; 45, printing kit; 46, scraper front and rear moving plate; 47, slurry scraper; 48, scraper motor; 49, ink return knife; 50, ink return motor; 51, ink return knife seat; 52, slurry knife seat; 53, rear section conveyor rail; 54, fragment lifting cylinder; 55, fragment lifting plate; 56, detection bracket; 57, sensor. DETAILED DESCRIPTION

[0036] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0037] like Figures 1 to 15 As shown, in this embodiment, a silicon wafer printer suitable for double half-wafer printing includes a working platform 1, a turntable assembly 2, a front-end conveying rail 3, a left calibration module 4 and a right calibration module 5. The turntable assembly 2 is located in the middle of the working platform 1, the front-end conveying rail 3 is located on one side of the working platform 1, the left calibration module 4 and the right calibration module 5 are respectively located on both sides of the front-end conveying rail 3, and a calibration vision camera 6 is installed above the end of the front-end conveying rail 3.

[0038] The front conveyor track 3 conveys the double half-sheets backwards from the two sections of the track respectively. When the double half-sheets move to the end of the track, the calibration visual camera 6 on the camera stand takes pictures of the double half-sheets on the two sections of the track. After determining the position of the double half-sheets, the left calibration module 4 directly absorbs the half-sheet on the left, and the right calibration module 5 adjusts the angle of the absorbed half-sheet based on the left half-sheet, and then synchronously puts the left and right sides into the turntable assembly 2. There is no need to adjust the printing scraper part, which effectively improves the printing efficiency and quality.

[0039] A snap-on motor 7 is installed on the front conveying rail 3, and a snap-on synchronous wheel 8 is key-connected to the driving end of the snap-on motor 7. The snap-on synchronous wheel 8 is transmission-connected to a snap-on synchronous belt, and a snap-on rod 9 is fixed on the snap-on synchronous belt.

[0040] When the silicon wafer transported from the front is not in a flat position, the snapping motor 7 controls the snapping synchronous wheel 8 to rotate, and links the snapping synchronous belt transmission, so that the snapping rods 9 on both sides of the front conveying rail 3 move closer to the middle, and the silicon wafer is flattened in the middle position of the front conveying rail 3.

[0041] Then, the left calibration module 4 includes a left linear module 10, the driving end of the left linear module 10 is connected to the left motor module 11, and the driving end of the left motor module 11 is connected to the left adsorption module 12 along the vertical direction; the right calibration module 5 includes a right linear module 13, the driving end of the right linear module 13 is connected to the right motor module 14, and the driving end of the right motor module 14 is connected to two calibration cylinders 15, the two calibration cylinders 15 are placed in parallel, and the driving end of the calibration cylinder 15 is downwardly connected to the calibration bearing 16, and the two calibration bearings 16 are commonly connected to the right adsorption module 17.

[0042] The left motor module 11 on the left linear module 10 controls the left adsorption module 12 to descend, adsorbs the left half-sheet on the left track, and moves it to the loading station of the turntable assembly 2 driven by the left linear module 10. The right motor module 14 on the right linear module 13 controls the right adsorption module 17 to descend, adsorbs the right half-sheet on the right track, and according to the positions of the left and right half-sheets captured by the calibration visual camera 6 and the left half-sheet as the reference, the two calibration cylinders 15 extend and retract the driving end to rotate the angle of the right adsorption module 17, and the calibration bearing 16 assists in steering so that the right half-sheet is aligned with the position of the left half-sheet. The right linear module 13 also synchronizes the left linear module 10 to move the right half-sheet to the loading station of the turntable assembly 2.

[0043] The turntable assembly 2 includes a circular turntable 18, an electrical integrated slip ring 19 and a turntable motor 20. Four groups of workstations are installed around the circular turntable 18, and each group of workstations is provided with two half-sheet printing positions 21. The driving end of the turntable motor 20 is vertically connected to the electrical integrated slip ring 19, and the middle part of the circular turntable 18 is connected to the electrical integrated slip ring 19. The lower end of the circular turntable 18 is rotatably connected with a roll paper 24 transport component, and the roll paper 24 transport component includes a unwinding shaft 22 and a reeling shaft 23. The unwinding shaft 22 and the reeling shaft 23 are transmission-connected with a roll paper 24. The roll paper 24 passes through the half-sheet printing position 21 and carries the silicon wafer, so as to transport the silicon wafer. The roll paper 24 is air permeable. The roll paper 24 transport component transports the silicon wafer to the workstation of the circular turntable 18, and to the printing position where the double half-sheet precision screen printer outputs the silicon wafer.

[0044] On the circular turntable 18, the positions between the four groups of workstations form a fan-shaped area, which stores the discharger elements and control components together with the middle position of the circular turntable 18, and then is covered with a protective cover 25. Each of the half-sheet printing positions 21 is provided with a breathable negative pressure plate 26, and the breathable negative pressure plate 26 is provided with a plurality of breathable holes. The breathable holes pass through the roll paper 24 to adsorb and fix the silicon wafer on the half-sheet printing position 21.

[0045] The silicon wafer on the front conveyor rail 3 is placed at the half-sheet printing position 21, and the turntable motor 20 provides power to control the electrical integrated slip ring 19 to link the circular turntable 18 to rotate in the horizontal direction, driving the silicon wafer to move to the bottom of the screen mounting frame 30. At the same time, the printed silicon wafer is moved from the bottom of the screen mounting frame 30 to the front of the rear conveyor rail 53, and the winding shaft 23 and the unwinding shaft 22 rotate synchronously to wipe the half-sheet printing position 21 with the clean roll paper 24.

[0046] The silicon wafer printer suitable for double half wafer printing comprises a printing module 27, a group of X-axis modules 28 and two groups of Y-axis modules 29 are installed at the lower end of the printing module 27, the group of X-axis modules 28 and the two groups of Y-axis modules 29 are connected to a screen installation frame 30, the X-axis module 28 and the Y-axis module 29 both have a module mechanism, the module mechanism comprises a module bottom plate 31, a module motor 32, an adjustment screw 33 and an adjustment slide 34, the driving end of the module motor 32 is transmission-connected with the adjustment screw 33, the adjustment screw 33 is threadedly connected with the adjustment nut under the adjustment slide 34, the adjustment slide 34 slides along the length direction of the adjustment screw 33, and the adjustment slide 34 is provided with a connecting bearing 35, the connecting bearing 35 slides on the adjustment slide 34, the moving direction of the connecting bearing 35 is perpendicular to the moving direction of the adjustment slide 34, and the edge of the screen installation frame 30 is locked in the connecting bearing 35.

[0047] The printing module 27 controls a group of X-axis modules 28 and two groups of Y-axis modules 29 through visual positioning according to the position and angle of the left half sheet, so that the screen mounting frame 30 with the screen is aligned with the position of the double half sheets. After it is lowered onto the turntable assembly 2, printing operations can be carried out.

[0048] A lifting module 36 is installed on both sides of the rear end of the working platform 1, and the lifting module 36 includes a side bracket 37. A lifting servo motor 38 is installed on the upper end of the side bracket 37. The driving end of the lifting servo motor 38 is connected to a lifting ball screw 39. Lifting plates 40 are connected on both sides of the printing module 27. A lifting ball nut is fixed to the outer side of the lifting plate 40. The lifting ball screw 39 is threadedly connected to the lifting ball nut. The lifting plate 40 slides on the side bracket 37 along the vertical direction. A lifting guide rail 41 is installed on the side bracket 37. A lifting slider is fixed to the outer side of the lifting plate 40, and the lifting slider slides on the lifting guide rail 41.

[0049] When controlling the lifting of the printing module 27, the lifting servo motor 38 controls the rotation of the lifting ball screw 39, and the lifting plate 40 with the lifting ball nut drives the printing module 27 to move along the direction of the lifting guide rail 41, so that the accuracy is improved and the moving speed is also faster.

[0050] A scraper linear module 42 is installed on the printing module 27, and the scraper linear module 42 includes a profile base 43, an adapter plate and an electrical installation plate 44. Electrical components and a drag chain 45 are installed on the electrical installation plate 44. The lower ends of the adapter plate slide along the front-to-back direction with the profile base 43 through guide rails and sliders. The adapter plate is fixed on one side of the electrical installation plate 44, and the adapter plate is locked with a printing kit 46.

[0051] The driving end of the scraper linear module 42 is connected to the scraper forward and backward moving plate 47, the printing kit 46 is fixed on one side of the scraper forward and backward moving plate 47, the lower end of the printing kit 46 is connected to the slurry scraper 48, and the upper end of the printing kit 46 is equipped with a scraper motor 49. The scraper motor 49 controls the slurry knife seat with the slurry scraper 48 to move in the vertical direction through a ball screw and a ball nut. The lower end of the printing kit 46 is also connected to an ink return knife 50, and the upper end of the printing kit 46 is also equipped with an ink return motor 51. The ink return motor 51 also controls the ink return knife seat 52 with the ink return knife 50 to move in the vertical direction through a ball screw and a ball nut. The two ends of the ink return knife 50 are respectively locked on the two ends of the ink return knife seat 52.

[0052] When scraping the slurry, the scraper motor 49 controls the slurry scraper 48 to move down to the screen, and the scraper linear module 42 links the printing kit 46 to move through the forward and backward movement of the scraper forward and backward moving plate 47, so that the slurry scraper 48 scrapes the slurry from the screen to the silicon wafer when moving forward and backward.

[0053] The silicon wafer printer suitable for double half wafer printing includes a rear conveying rail 53, on which a chip lifting cylinder 54 is installed, and the driving end of the chip lifting cylinder 54 is upwardly connected to a chip lifting plate 55, and both sides of the chip lifting plate 55 are located on the outside of the rear conveying rail 53, and a detection bracket 56 is installed at the rear end of the rear conveying rail 53, and a sensor 57 is installed on the top of the detection bracket 56. The sensor 57 is located above the rear conveying rail 53, and the sensor 57 is used to sense whether there is a chip blockage in the rear reflow furnace.

[0054] When the silicon wafer needs to be transferred or inspected on the rear conveyor rail 53, the wafer lifting plate 55 can be lifted by the wafer lifting cylinder 54 to operate the silicon wafer independently. The sensor 57 at the end of the rear conveyor rail 53 senses the presence of the silicon wafer in preparation for subsequent docking.

[0055] It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the technical principles used. Within the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by technicians familiar with this technical field should be included in the protection scope of the present invention.

Claims

1. A silicon wafer printer suitable for double half wafer printing, characterized in that: It includes a working platform, a turntable assembly, a front conveying rail, a left calibration module and a right calibration module, wherein the turntable assembly is located in the middle of the working platform, the front conveying rail is located on one side of the working platform, the left calibration module and the right calibration module are respectively located on both sides of the front conveying rail, and a calibration visual camera is installed above the end of the front conveying rail; The left calibration module includes a left linear module, a driving end of the left linear module is connected to a left motor module, and a driving end of the left motor module is connected to a left adsorption module along a vertical direction; The right calibration module includes a right linear module, the driving end of the right linear module is connected to the right motor module, the driving end of the right motor module is connected to two calibration cylinders, the two calibration cylinders are placed in parallel, the driving end of the calibration cylinder is downwardly connected to a calibration bearing, and the two calibration bearings are commonly connected to the right adsorption module.

2. A silicon wafer printer suitable for double half wafer printing according to claim 1, characterized in that: A snapping motor is installed on the front conveying rail, a driving end key of the snapping motor is connected with a snapping synchronous wheel, the snapping synchronous wheel is transmission-connected with a snapping synchronous belt, and a snapping rod is fixed on the snapping synchronous belt.

3. The silicon wafer printer suitable for double half wafer printing according to claim 1, characterized in that: It includes a rear-section conveying rail, on which a fragment lifting cylinder is installed, a driving end of the fragment lifting cylinder is upwardly connected to a fragment lifting plate, both sides of the fragment lifting plate are located on the outside of the rear-section conveying rail, a detection bracket is installed at the rear end of the rear-section conveying rail, a sensor is installed on the top of the detection bracket, the sensor is located above the rear-section conveying rail, and the sensor is used to sense whether there is a fragment blockage in the rear reflow furnace.

4. The silicon wafer printer suitable for double half wafer printing according to claim 1, characterized in that: It comprises a printing module, wherein a group of X-axis modules and two groups of Y-axis modules are installed at the lower end of the printing module, and the group of X-axis modules and the two groups of Y-axis modules are connected to a screen installation frame.

5. The silicon wafer printer suitable for double half wafer printing according to claim 4, characterized in that: Lifting modules are installed on both sides of the rear end of the working platform, and the lifting modules include side brackets. A lifting servo motor is installed on the upper end of the side bracket, and a lifting ball screw is connected to the driving end of the lifting servo motor. Lifting plates are connected on both sides of the printing module, and a lifting ball nut is fixed to the outer side of the lifting plate. The lifting ball screw is threadedly connected to the lifting ball nut. The lifting plate slides on the side bracket in a vertical direction, and a lifting guide rail is installed on the side bracket. A lifting slider is fixed to the outer side of the lifting plate, and the lifting slider slides on the lifting guide rail.

6. The silicon wafer printer suitable for double half wafer printing according to claim 5, characterized in that: A scraper linear module is installed on the printing module, and the scraper linear module includes a profile base, an adapter plate and an electrical installation board. Electrical components and drag chains are installed on the electrical installation board. The lower ends of the adapter plate slide along the front-to-back direction with the profile base through guide rails and sliders. The adapter plate is fixed on one side of the electrical installation board, and the adapter plate is locked with a printing kit.

7. A silicon wafer printer suitable for double half wafer printing according to claim 6, characterized in that: The driving end of the scraper linear module is connected to a scraper forward and backward moving plate, the printing kit is fixed on one side of the scraper forward and backward moving plate, the lower end of the printing kit is connected to a slurry scraper, and the upper end of the printing kit is equipped with a scraper motor, and the scraper motor controls the slurry scraper to move in a vertical direction through a ball screw and a ball nut, the lower end of the printing kit is also connected to an ink return knife, and the upper end of the printing kit is also equipped with an ink return motor, and the ink return motor also controls the ink return knife seat with the ink return knife to move in a vertical direction through a ball screw and a ball nut, and the two ends of the ink return knife are respectively locked on the two ends of the ink return knife seat.

8. The silicon wafer printer suitable for double half wafer printing according to claim 4, characterized in that: The X-axis module and the Y-axis module both have a module mechanism, which includes a module base plate, a module motor, an adjustment screw and an adjustment slide. The driving end of the module motor is transmission-connected to the adjustment screw, and the adjustment screw is threadedly connected to the adjustment nut under the adjustment slide. The adjustment slide slides along the length direction of the adjustment screw, and the adjustment slide is provided with a connecting bearing, which slides on the adjustment slide. The moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide, and the edge of the wire mesh mounting frame is locked in the connecting bearing.

9. The silicon wafer printer suitable for double half wafer printing according to claim 1, characterized in that: The turntable assembly includes a circular turntable, an electrical integrated slip ring and a turntable motor. Four groups of workstations are installed around the circular turntable, and each group of the workstations is provided with two half-sheet printing positions. The driving end of the turntable motor is vertically connected to the electrical integrated slip ring, and the middle part of the circular turntable is connected to the electrical integrated slip ring. The lower end of the circular turntable is rotatably connected to a roll paper transport component, and the roll paper transport component includes a unwinding shaft and a winding shaft. A roll paper is transmission-connected between the unwinding shaft and the winding shaft. The roll paper passes through the half-sheet printing position and carries the silicon wafer, so as to transport the silicon wafer. The roll paper is air-permeable. The roll paper transport component transports the silicon wafer to the workstation of the circular turntable and to the printing position where the double half-sheet precision screen printer outputs the silicon wafer.

10. The silicon wafer printer suitable for double half wafer printing according to claim 9, characterized in that: The positions between the four groups of workstations of the circular turntable form a fan-shaped area, which stores the discharger elements and control components together with the middle position of the circular turntable, and then is covered with a protective cover. Each half-sheet printing position is provided with a breathable negative pressure plate, and a plurality of breathable holes are arranged on the breathable negative pressure plate. The breathable holes pass through the roll of paper to adsorb and fix the silicon wafer on the half-sheet printing position.

Citation Information

Patent Citations

  • Synchronous and same-direction double-half-piece precise screen printing machine

    CN118700687A

  • Image positioning and correcting device for silicon wafer of full-automatic printing machine

    CN201941235U

  • Battery piece processing device

    CN219800881U

  • Silicon wafer printing machine suitable for double-half-wafer printing

    CN223314638U

  • Image processing apparatus

    JP2014075754A