Liquid ejecting head and liquid ejecting apparatus

Abstract

The invention provides a liquid ejecting head and a liquid ejecting apparatus which can restrain reduction of adhesive strength between a first flow path member and a second flow path member and maintain adhesion stability for a long period of time. The liquid ejecting head includes: a nozzle (21) that ejects a liquid; a first flow path member (15, 100) that defines a part of a flow path for supplying liquid to the nozzle (21); a second flow path member (40) which is bonded to the first flow path member (15), defines a part of the flow path, and is made of a metal; and an adhesive (60) that adheres the first flow path member and the second flow path member, the adhesive containing a water-insoluble chelate compound.

Description

Technical Field

[0001] The present invention relates to a liquid ejecting head for ejecting liquid and a liquid ejecting device. Background Art

[0002] Liquid ejecting apparatuses represented by ink jet recording apparatuses such as printers and plotters include a liquid ejecting head such as an ink jet recording head that ejects ink.

[0003] For example, Patent Document 1 discloses a liquid ejection head including: a nozzle plate having a nozzle for ejecting liquid; a flow channel plate stacked on the nozzle plate; a vibration plate member stacked on the flow channel plate; and a frame member stacked on the vibration plate member. The vibration plate member is formed of a nickel (Ni) metal plate and manufactured by electroforming (electroforming). Furthermore, it is described that the nozzle plate, the flow channel plate, and the vibration plate member as a thin film member are stacked.

[0004] However, when a metal flow channel component is bonded to a flow channel component forming a flow channel for liquid flow by an adhesive as in the liquid ejecting head disclosed in Patent Document 1, the bonding interface contacts the liquid in the flow channel, so that metal ions are eluted from the bonding interface into the liquid in the flow channel, and the bonding strength may decrease. Such a problem also exists in liquid ejecting heads and liquid ejecting devices that eject liquids other than ink.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-54446 Summary of the invention

[0006] The method of the present invention for solving the above-mentioned problems is a liquid injection head, characterized in that it comprises: a nozzle that ejects liquid; a first flow channel component that defines a portion of a flow channel for supplying liquid to the nozzle; a second flow channel component that is bonded to the first flow channel component and defines a portion of the flow channel, and is made of metal; and an adhesive that bonds the first flow channel component and the second flow channel component, and the adhesive contains a water-insoluble chelate.

[0007] Furthermore, another aspect of the present invention is a liquid ejecting device including the liquid ejecting head of the above aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic diagram of an ink jet recording device according to Embodiment 1.

[0009] Figure 2 This is an exploded perspective view of the recording head according to the first embodiment.

[0010] Figure 3It is a top view of the recording head according to the first embodiment.

[0011] Figure 4 It is a cross-sectional view of the recording head according to the first embodiment.

[0012] Figure 5 Table 1 shows the components of chelate mixtures 1-4 and chelate 5-6 and the test results.

[0013] Figure 6 Table ta2 shows the components of adhesive samples 1 to 10 and the test results.

[0014] Figure 7 Table ta3 shows the components of adhesive samples 11 to 20 and the test results.

[0015] Figure 8 Table 4 shows the components of adhesive samples 21 to 30 and the test results.

[0016] Fig. 9 Table ta5 shows the components of adhesive samples 31 to 40 and the test results.

[0017] Fig.10 Table ta6 shows the components of adhesive samples 41 to 44 and test results. DETAILED DESCRIPTION

[0018] Hereinafter, the present invention will be described in detail based on the embodiment. However, the following description shows one embodiment of the present invention and can be arbitrarily changed within the scope of the present invention.

[0019] In each figure, X, Y, and Z represent three mutually orthogonal spatial axes. Without limiting the positive and negative directions, the directions along these three axes are set as the X direction, the Y direction, and the Z direction. The directions pointed by the arrows in each figure are set as the X1 direction, the Y1 direction, and the Z1 direction, and the opposite directions of the arrows are set as the X2 direction, the Y2 direction, and the Z2 direction. The Y direction (Y1 direction and the Y2 direction) is equivalent to the conveying direction of the medium. The Z2 direction is the vertical direction pointing downward, and the Z1 direction is the vertical direction pointing upward. In addition, the Z direction does not necessarily have to be the vertical direction. Furthermore, although the X-axis, the Y-axis, and the Z-axis are mutually orthogonal, they are not limited to this. For example, they can also intersect at an angle within the range of more than 80 degrees and less than 100 degrees.

[0020] Implementation Method 1

[0021] Figure 1The inkjet recording device (hereinafter, simply referred to as "recording device") 1 shown is an example of a liquid ejecting device, and is a printing device that ejects / drops ink, which is a kind of liquid, onto a medium M such as printing paper in the form of ink droplets and prints an image or the like by arranging dots formed on the medium M. Examples of the liquid include ultraviolet curing ink (hereinafter, referred to as UV ink) or solvent-based ink. In addition, as the medium M, in addition to recording paper, any material such as a resin film or cloth can be used.

[0022] The so-called solvent-based ink refers to an ink whose main component of the solvent is an organic solvent, and is also called solvent ink or non-aqueous ink. Solvent-based ink is an ink containing any one or more of glycol ethers, glycol ether esters, dibasic acid esters, ester solvents, hydrocarbon solvents, and alcohol solvents. In addition, the so-called UV ink refers to an ink that includes, for example, monomers and oligomers that are cured by polymerization reaction caused by ultraviolet irradiation. The composition of UV ink can be, for example, any ink containing (meth)acrylates, (meth)acrylamides, and N-vinyl compounds as polymerizable compounds.

[0023] The recording device 1 includes an inkjet recording head 2 (hereinafter, simply referred to as “recording head 2 ”), a liquid container 3 , a control unit 4 , a transport mechanism 5 for feeding a medium M, and a moving mechanism 6 .

[0024] The recording head 2 is an example of a liquid ejecting head, and ejects ink supplied from a liquid container 3 from a plurality of nozzles toward a medium M. The detailed structure of the recording head 2 will be described below.

[0025] The liquid container 3 is an example of a liquid storage unit that stores the liquid supplied to the recording head 2, and stores the multiple types (for example, multiple colors) of ink ejected from the recording head 2. Examples of the liquid storage unit include a cartridge that can be attached to and detached from the recording device 1, a bag-shaped ink bag formed of a flexible film, and an ink tank that can replenish ink.

[0026] The control unit 4 includes a control device such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage device such as a semiconductor memory. The control unit 4 executes a program stored in the storage device through the control device, thereby comprehensively controlling various elements of the recording device 1, namely, the recording head 2, the conveying mechanism 5, the moving mechanism 6, etc.

[0027] The conveying mechanism 5 is a mechanism for conveying the medium M in the X direction. Specifically, the conveying mechanism 5 includes a conveying roller 7, and the conveying roller 7 rotates to convey the medium M in the X direction. The conveying mechanism 5 for conveying the medium M is not limited to a mechanism including a conveying roller 7, and may be a mechanism for conveying the medium M by a belt or a roller, for example.

[0028] The moving mechanism 6 is a mechanism for reciprocating the recording head 2 in the Y direction, and includes a conveyor body 8 and a conveyor belt 9. The conveyor body 8 is a roughly box-shaped structure that accommodates the recording head 2, and is a so-called slide, and is fixed to the conveyor belt 9. The conveyor belt 9 is an endless belt stretched along the Y direction. The conveyor belt 9 rotates under the control of the control unit 4, so that the recording head 2 and the conveyor body 8 reciprocate in the Y direction. In addition, the conveyor body 8 may also be a structure that carries the recording head 2 and the liquid container 3 together.

[0029] The recording head 2 performs a jetting operation of jetting the ink supplied from the liquid container 3 as ink droplets from a plurality of nozzles in the Z2 direction onto the medium M under the control of the control unit 4. The jetting operation performed by the recording head 2 is performed in parallel with the conveyance of the medium M by the conveyance mechanism 5 and the reciprocating movement of the recording head 2 by the moving mechanism 6, thereby performing so-called printing in which an image composed of ink is formed on the surface of the medium M.

[0030] use Figures 2 to 4 The recording head 2 will be described. Figure 2 is an exploded perspective view of the recording head 2. Figure 3 is a top view of the recording head 2, Figure 4 is a cross-sectional view of the recording head. Figure 3 1 shows the pressure chamber substrate 10 and the filter member 40 among the elements constituting the recording head 2 , and omits the illustration of the protection substrate 30 and the case member 100 . Figure 4 For Figure 3 The corresponding figure of AA line.

[0031] As shown in the figure, the recording head 2 according to the present embodiment includes a pressure chamber substrate 10. The pressure chamber substrate 10 is composed of, for example, a silicon substrate, a glass substrate, an SOI substrate, various ceramic substrates, or the like.

[0032] On the pressure chamber substrate 10, a recessed portion opening toward the Z2 direction side, namely, a pressure chamber 12, is arranged along the X direction. A plurality of pressure chambers 12 are arranged on a straight line along the X direction in such a manner that their positions in the Y direction are the same. Pressure chambers 12 adjacent to each other in the X direction are divided by a partition wall not shown. In the present embodiment, the pressure chambers 12 are arranged in a row along the X direction. The row of pressure chambers consisting of a plurality of pressure chambers 12 arranged in such a row is provided in two rows in the Y direction. The plurality of pressure chambers 12 in each row are arranged so that their positions in the Y direction are the same. In addition, the arrangement of the pressure chambers 12 is not particularly limited. For example, the arrangement of the plurality of pressure chambers 12 arranged in the X direction may also be a so-called staggered position in which the respective pressure chambers 12 are alternately staggered in the Y direction.

[0033] When viewed from above along the Z direction, the pressure chamber 12 is formed into a rectangular shape whose length in the Y direction is longer than its length in the X direction. Of course, the shape of the pressure chamber 12 is not particularly limited, and may be a parallelogram shape, a polygonal shape, a circular shape, an oblong shape, etc. In addition, the oblong shape mentioned here refers to a shape in which both ends in the long side direction are semicircular based on a rectangular shape, and includes a rounded rectangular shape, an elliptical shape, an egg shape, etc.

[0034] On the Z2 direction side of the pressure chamber substrate 10 , the communication plate 15 , the nozzle plate 20 , and the compliance substrate 110 are stacked in this order.

[0035] A nozzle connecting channel 16 for connecting the pressure chamber 12 and the nozzle 21 is provided on the connecting plate 15. A first manifold portion 17 and a second manifold portion 18 constituting a part of a manifold 130 are provided on the connecting plate 15, and the manifold 130 becomes a common liquid chamber for connecting a plurality of pressure chambers 12. The first manifold portion 17 is provided in a manner penetrating the connecting plate 15 in the Z direction. The second manifold portion 18 is provided in a manner not penetrating the connecting plate 15 in the Z direction but opening on the surface on the Z2 direction side. In addition, the first manifold portion 17 and the second manifold portion 18 constitute the manifold 130. The manifold 130 is continuously provided across the X direction, and the supply connecting channels 19 for connecting each pressure chamber 12 and the manifold 130 are arranged in an array in the X direction.

[0036] The connecting plate 15 is provided with a supply connecting passage 19 connected to one end of the pressure chamber 12 in the Y direction, respectively, for each pressure chamber 12. The supply connecting passage 19 connects the second manifold 18 and each pressure chamber 12, thereby supplying ink in the manifold 130 to each pressure chamber 12.

[0037] As the communication plate 15 , a silicon substrate, a glass substrate, an SOI substrate, various ceramic substrates, a metal substrate, or the like can be used.

[0038] The nozzle plate 20 is provided on the surface of the communication plate 15 on the side opposite to the pressure chamber substrate 10, that is, on the Z2 direction side. The nozzle plate 20 has nozzles 21 that communicate with the pressure chambers 12 via the nozzle communication passages 16 formed therein.

[0039] The plurality of nozzles 21 are provided corresponding to the respective pressure chambers 12, and are arranged in a row along the X direction. The nozzle row consisting of the plurality of nozzles 21 arranged in such a row is provided in two rows in the Y direction. The plurality of nozzles 21 in each row are arranged in such a manner that the positions in the Y direction are the same. In addition, the arrangement of the nozzles 21 is not particularly limited. For example, the nozzles 21 arranged in the X direction may also be arranged at positions alternately staggered in the Y direction.

[0040] The material of the nozzle plate 20 is not particularly limited, and for example, a silicon substrate, a glass substrate, an SOI substrate, various ceramic substrates, and a metal substrate can be used. As the metal plate, for example, a stainless steel substrate can be cited. Furthermore, as the material of the nozzle plate 20, an organic substance such as a polyimide resin can also be used.

[0041] The plastic substrate 110 is provided together with the nozzle plate 20 on the surface of the connecting plate 15 on the side opposite to the pressure chamber substrate 10, that is, on the side in the Z2 direction. The plastic substrate 110 is provided around the nozzle plate 20, and seals the openings of the first manifold portion 17 and the second manifold portion 18 provided on the connecting plate 15. In the present embodiment, the plastic substrate 110 includes a sealing film 111 formed of a flexible thin film, and a fixed substrate 112 formed of a hard material such as metal. The region of the fixed substrate 112 facing the manifold 130 becomes a removed portion 118 completely removed in the thickness direction. Therefore, one side of the manifold 130 becomes a plastic portion 119 sealed only by the flexible sealing film 111.

[0042] The vibration plate 84 and the piezoelectric actuator 80 are provided on the surface on the Z1 direction side of the pressure chamber substrate 10. That is, the pressure chamber substrate 10, the vibration plate 84, and the piezoelectric actuator 80 are stacked in this order from the Z2 direction toward the Z1 direction.

[0043] The vibration plate 84 is composed of an elastic film provided on the surface on the Z1 direction side of the pressure chamber substrate 10 and an insulating film provided on the surface on the Z1 direction side of the elastic film. The elastic film is, for example, a film formed of silicon oxide (SiO2). Such an elastic film can be formed, for example, by thermally oxidizing the surface on the Z1 direction side of the pressure chamber substrate 10 when a silicon substrate is used as the pressure chamber substrate 10. The insulating film is, for example, a film formed of zirconium oxide (ZrO2). Such an insulating film can be formed, for example, by thermally oxidizing a layer of zirconium monomer after the layer is formed by sputtering or the like. In addition, the vibration plate is not limited to being composed of an elastic film and an insulating film. For example, as the vibration plate 84, it is also possible to be a vibration plate provided with either an elastic film or an insulating film. In addition, it is also possible not to provide an elastic film and an insulating film, and use the first electrode 81 of the piezoelectric actuator 80 described below as a vibration plate.

[0044] A piezoelectric actuator 80 including a first electrode 81, a piezoelectric layer 82, and a second electrode 83 is provided on the surface of the vibration plate 84 on the Z1 direction side. Such a piezoelectric actuator 80 is also called a piezoelectric element, and is referred to as a portion including the first electrode 81, the piezoelectric layer 82, and the second electrode 83. In addition, the piezoelectric actuator 80 becomes a driving element that causes a pressure change in the ink in the pressure chamber 12. In addition, the portion that generates piezoelectric deformation on the piezoelectric layer 82 when a voltage is applied between the first electrode 81 and the second electrode 83 is referred to as an active portion. That is, the active portion is referred to as a portion where the piezoelectric layer 82 is sandwiched between the first electrode 81 and the second electrode 83. In this embodiment, an active portion is formed for each pressure chamber 12. The plurality of active portions become a "driving element" that causes a pressure change in the ink in the pressure chamber 12. And, generally speaking, the electrode on one side of the active portion is set as an independent electrode independent for each active portion, and the electrode on the other side is set as a common electrode shared by a plurality of active portions. In this embodiment, the first electrode 81 is divided for each active portion to form an independent electrode of the active portion, and the second electrode 83 is continuously provided across multiple active portions to form a common electrode of multiple active portions. Of course, the following structure can also be used, that is, the first electrode 81 forms a common electrode and the second electrode 83 forms an independent electrode.

[0045] The piezoelectric layer 82 is formed using a piezoelectric material composed of a composite oxide having a perovskite structure represented by the general formula ABO 3 , for example.

[0046] An independent lead electrode 91 is led out from the first electrode 81, and a common lead electrode 92 is led out from the second electrode 83. A flexible wiring substrate 120 is connected to the independent lead electrode 91 and the common lead electrode 92 at the end on the side opposite to the piezoelectric actuator 80. In the present embodiment, the independent lead electrode 91 and the common lead electrode 92 are extended so as to be exposed in the first wiring insertion hole 32 formed on the protective substrate 30, and are electrically connected to the wiring substrate 120 in the first wiring insertion hole 32. A driving circuit 121 having a switching element for driving the piezoelectric actuator 80 is mounted on the wiring substrate 120.

[0047] Although the piezoelectric actuator 80 described above has the first electrode 81 as an independent electrode for each piezoelectric actuator 80 and the second electrode as a common electrode for each piezoelectric actuator 80, the present invention is not limited to such a structure. In other words, the first electrode 81 may be a common electrode for each piezoelectric actuator 80 and the second electrode may be an independent electrode for each piezoelectric actuator 80.

[0048] A protective substrate 30 having substantially the same size as the pressure chamber substrate 10 is bonded to the surface on the Z1 direction side of the pressure chamber substrate 10. The protective substrate 30 has a holding portion 31 as a space for protecting the piezoelectric actuator 80. The holding portion 31 is independently provided for each column of the piezoelectric actuators 80 arranged in the X direction, and two are arranged in the Y direction. In addition, the protective substrate 30 is provided with a first wiring insertion hole 32 that penetrates in the Z direction between the two holding portions 31 arranged side by side in the Y direction.

[0049] In this manner, the filter member 40 is joined to the surface of the communication plate 15 on the side in the Z1 direction, and the case member 100 is joined to the surface of the filter member 40 on the side in the Z1 direction.

[0050] Here, the connecting plate 15 and the housing member 100 are examples of a first flow channel member, and the filter member 40 is an example of a second flow channel member. Figure 2 as well as Figure 3 In FIG. 1 , only a region R where the filter holes 50 are provided on the surface on the Z1 direction side of the filter member 40 is indicated by hatching, and illustration of each filter hole 50 is omitted.

[0051] The housing member 100 has a storage portion 101 as a space of a depth capable of storing the pressure chamber substrate 10 and the protective substrate 30. The storage portion 101 has an opening area wider than the surface of the protective substrate 30 bonded to the pressure chamber substrate 10. In addition, in a state where the pressure chamber substrate 10 and the protective substrate 30 are stored in the storage portion 101, the opening surface of the storage portion 101 on the pressure chamber substrate 10 side is sealed by the vibration plate 84. Furthermore, the housing member 100 is provided with a second wiring insertion hole 103 which communicates with the first wiring insertion hole 32 of the protective substrate 30 and through which the wiring substrate 120 is inserted.

[0052] In the case member 100 , ink introduction sections 102 are defined on both outer sides of the storage section 101 in the Y direction. The case member 100 is provided with introduction ports 104 that communicate with the ink introduction sections 102 and supply ink to the ink introduction sections 102 .

[0053] Here, the ink introduction portion 102 and the manifold 130 formed on the above-mentioned communication plate 15 constitute a reservoir 140 .

[0054] In addition, although the material of the housing member 100 is not particularly limited, in the present embodiment, it is composed of a thermosetting resin. As the thermosetting resin, although not particularly limited, for example, phenolic resin, urea resin, melamine resin, epoxy resin, alkyd resin, unsaturated polyester resin, diallyl phthalate resin, etc. can be cited. They can be used alone or in combination of two or more in the form of a copolymer or a blend. In the thermosetting resin, one or both of an inorganic filler and an inorganic fiber substrate can be included.

[0055] The filter member 40 is a member that allows the ink to pass through and captures foreign matter that is directed toward the nozzle 21. Figure 2 as well as Figure 3 In the example shown, the filter member 40 is arranged to partition the reservoir 140 into the manifold 130 and the ink introduction portion 102. That is, the filter member 40 is interposed between the communication plate 15 and the case member 100 and bonded to the communication plate 15 and the case member 100.

[0056] The filter member 40 is made of metal such as nickel or palladium, and is preferably manufactured by electroforming.

[0057] The method for manufacturing the filter member 40 is not limited to the electroforming method, and for example, a method using dry etching or wet etching may be used.

[0058] The filter member 40 is not necessarily composed of one layer, but may be a laminated body in which a plurality of layers are laminated, but at least one layer is composed of metal. In addition, two filter members 40 may be connected to each other to form a frame-like structure.

[0059] By bonding such a filter member 40 made of metal with the adhesive used in the present invention, even if it contacts the liquid in the flow channel, the elution of metal ions into the liquid can be reduced, thereby suppressing interface peeling, etc., which will be described in detail below.

[0060] In addition, although such metal ion dissolution may be generated by metals other than nickel and palladium, copper or an alloy containing copper can also achieve the same effect in addition to nickel and palladium, but an electroformed filter containing at least one of nickel and palladium is particularly preferred. In this embodiment, the filter member 40 is an electroformed filter composed of Ni-Pd.

[0061] In this embodiment, when viewed from above along the Z2 direction, the outer shape of the filter member 40 has a shape that is substantially the same as the outer shape of the connecting plate 15. In addition, the filter member 40 has an opening 45 excluding a region facing the pressure chamber substrate 10 in the Z direction. The filter member 40 is provided on the surface of the connecting plate 15 on the Z1 direction side in a state where the pressure chamber substrate 10 is arranged inside the opening 45.

[0062] The filter member 40 is provided with the filter hole 50 in the region R facing the first manifold portion 17 in the plan view as viewed in the Z2 direction. The detailed structures of the filter member 40 and the filter hole 50 are not particularly limited.

[0063] In this manner, the filter member 40 is disposed between the connecting plate 15 and the housing member 100, and they are bonded together by the adhesive 60. By stacking the connecting plate 15, the filter member 40, and the housing member 100 in this order from the Z2 direction toward the Z1 direction using the adhesive 60 in this manner, the manifold 130 and the ink introduction portion 102 communicate with each other via the filter hole 50 of the filter member 40. Here, the adhesive 60 indicates an adhesive layer after the adhesive is cured.

[0064] Here, since the thermosetting resin has excellent filling property for the metal mold, it will become a molded object with edges, so the filler and epoxy resin of the molded object component are easy to detach and become foreign matter. In the case where foreign matter is generated in the middle of using the recording head 2 after the ink is filled into the recording head 2, the foreign matter has the possibility of clogging the nozzle 21, so it is necessary to set a filter near the nozzle 21. The filter needs to be smaller than the diameter of the nozzle 21, so considering the pressure loss, it is also necessary to set it as a thin film. Therefore, it is preferred that, as in the present embodiment, an electroformed film made by electroforming is used in the filter component 40. In particular, considering liquid resistance and corrosion resistance, it is preferred that an electroformed filter composed of nickel, palladium or an alloy thereof is used in the filter component 40. However, since the filter component 40 is metal, it is possible that the metal ions of the filter component 40 are dissolved into the ink at the bonding interface between the filter component 40 and the housing component 100 due to contact with the ink, thereby reducing the bonding strength.

[0065] Therefore, in the present invention, an adhesive containing a water-insoluble chelate compound is used as the adhesive 60 .

[0066] When such an adhesive is used, the chelate can suppress the dissolution of metal ions from the filter member 40, thereby suppressing interfacial peeling, and improving the reliability of the adhesive strength of the adhesive 60. In addition, since the chelate is water-insoluble, the dissolution of the chelate into the liquid (ink) can be reduced, and the stability of the adhesion can be maintained for a long time.

[0067] Here, the term "water-insoluble" means that when 0.5 g of the chelate compound is dissolved in 100 g of water at 25°C, the amount of the chelate compound that is not dissolved is 99% by mass or more.

[0068] In addition, the chelate is a compound having a benzotriazole skeleton, preferably an oil-soluble benzotriazole. Examples of the oil-soluble benzotriazole include 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, 5-carboxybenzotriazole, and tolyltriazole, and 5-carboxybenzotriazole is particularly preferred.

[0069] Here, oil-soluble means that the compound as a whole is lipophilic (organic solvent-friendly), and benzotriazole having many hydrophilic substituents is not preferred. Oil-soluble benzotriazole means a compound that does not dissolve 0.5 g or more in 100 g of pure water at 20°C.

[0070] The adhesive used in the present invention is not particularly limited as long as it is an adhesive that has adhesive properties on the connecting plate 15 of the first flow channel component and the housing component 100 and the filter component 40 of the second flow channel component, in addition to the adhesive containing the chelate as described above. For example, epoxy adhesives can be cited. In particular, epoxy adhesives containing the following components are preferred: a multifunctional epoxy resin having a difunctional or higher epoxy group as a main agent; at least one of a curing accelerator and a curing agent. In addition, the adhesive may also contain inorganic powders such as silica powder or alumina powder.

[0071] Examples of the curing agent include aliphatic polyamines, polyaminoamides, polythiols, acid anhydrides, novolac resins, dicyandiamide, and the like. Examples of the curing accelerator include DBU, DBN, tris(dimethylaminomethyl)benzene, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 3-phenyl-1,1-dimethylurea, and sulfonium salts. Any curing accelerator may be used as long as it has one or more active hydrogen atoms capable of undergoing addition reaction with an epoxy group in the molecule. Examples of the curing accelerator include aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane; aromatic amine compounds such as 4,4'-diaminodiphenylmethane and 2-methylaniline; imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, and 2-isopropylimidazole; imidazoline compounds such as imidazoline, 2-methylimidazoline, and 2-ethylimidazoline, etc. From the viewpoint of liquid state and storage stability, aromatic amine compounds are preferred.

[0072] The adhesive of the present invention is an adhesive obtained by mixing a chelate compound with a mixture of the components of a basic adhesive component, such as a one-component epoxy adhesive. Although the chelate compound is mixed as described above, when the chelate compound is an oil-soluble benzotriazole that is solid before curing, or in other words, an oil-soluble benzotriazole that forms a complex film after curing, it is preferably dissolved in an appropriate organic solvent and mixed with the adhesive component. Here, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, etc. can be used as the organic solvent.

[0073] When the chelate is mixed into a two-component epoxy adhesive, it is preferably premixed into the epoxy resin as the main agent or into any one of the curing accelerator and the curing agent, that is, the auxiliary agent, and more preferably mixed into the main agent.

[0074] Here, the content of the chelate in the adhesive used in the present invention is preferably 0.56% by mass or more. This is because the chelate can effectively inhibit the dissolution of metal ions from the filter member 40, thereby inhibiting interface peeling and improving the reliability of the adhesive strength.

[0075] The content of the chelate in the adhesive is preferably 3.51% by mass or less because, when the housing member 100 as the first flow channel member is a thermosetting resin, if the amount of the chelate is increased beyond necessity, the adhesion to the housing member 100 tends to decrease.

[0076] Therefore, the content of the chelate in the adhesive is preferably 0.56% by mass or more and 3.51% by mass or less. This is because the chelate can effectively inhibit the dissolution of metal ions from the filter component 40, thereby inhibiting interface peeling, thereby improving the reliability of the adhesive strength of the adhesive, and even if the first flow channel component is a thermosetting resin, the adhesion to the first flow channel component will not be reduced.

[0077] Here, the content of the chelate in the adhesive is a ratio relative to the mass of the adhesive after curing. That is, although the 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, etc. as the chelate contained in the adhesive is a liquid, it becomes a complex film (solid) after curing, so the content of the chelate in the adhesive is the ratio of the complex film to the mass of the adhesive after curing.

[0078] In the recording head 2 of the present embodiment, ink is supplied from an inlet 104 connected to an external ink supply unit (not shown) to the ink introduction portion 102. The ink in the ink introduction portion 102 passes through the filter member 40 to remove foreign matter, and is supplied to the manifold 130. After the inside from the manifold 130 to the nozzle 21 is filled with ink, a voltage is applied to each piezoelectric actuator 80 corresponding to the pressure chamber 12 according to a recording signal from the drive circuit 121. As a result, the vibration plate 84 is flexed and deformed together with the piezoelectric actuator 80 to increase the pressure in each pressure chamber 12, and ink droplets are ejected from each nozzle 21.

[0079] Although in the present embodiment, UV ink or solvent-based ink is preferred as the ink, since the hygroscopic UV ink or solvent-based ink contains 1 to 2% of water, a current is easily generated between the filter member 40 and the ink when it is supplied to the flow path of the recording head 2, and thus metal ions are easily eluted from the filter member 40 into the water in the ink. However, in the present invention, since a chelate-containing adhesive is used as the adhesive 60, a chelate that forms a complex with the metal ions exists at the bonding interface of the filter member 40, and thus the elution of the metal ions from the filter member 40 into the water in the ink is reduced, and the decrease in bonding strength can be suppressed.

[0080] The present invention is further described in detail based on the following examples.

[0081] Figure 5 Table 1 shows the components of chelate mixtures 1-4 and chelate 5-6 and the test results. Figure 6 Table ta2 shows the components of adhesive samples 1 to 10 and the test results. Figure 7 Table ta3 shows the components of adhesive samples 11 to 20 and the test results. Figure 8 Table 4 shows the components of adhesive samples 21 to 30 and the test results. Fig. 9 Table ta5 shows the components of adhesive samples 31 to 40 and the test results. Fig.10 Table ta6 shows the components of adhesive samples 41 to 44 and test results.

[0082] Chelate mixture 1-4, chelate 5-6

[0083] Will Figure 5 The chelate compounds shown in Table ta1 and the respective dispersants were mixed in the blending ratios shown in Table ta1 to prepare chelate mixtures 1 to 4. In the chelate mixtures 1 to 4, 5-carboxybenzotriazole was used as the oil-soluble chelate compound.

[0084] Since 5-carboxybenzotriazole is a powder solid, an organic solvent, namely diethylene glycol diethyl ether or diethylene glycol dibutyl ether, is added as a dispersant and stirred for one hour by a stirrer to prepare chelate mixtures 1-4.

[0085] because Figure 5Since 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole and 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole as chelate compounds 5-6 shown in Table ta1 are liquid, no organic solvent is particularly used. In addition, chelate compounds 5-6 can also be stirred with the above-mentioned organic solvent as a dispersant to form a chelate mixture.

[0086] Here, for each of the chelate mixtures 1 to 4, whether there was an aggregate and whether there was a supernatant after 28 days were observed. In the former, when the aggregate was measured using a particle size meter, the case where no line of aggregates larger than 20 μm was observed was evaluated as A, and the case where the line of aggregates larger than 20 μm was observed but no line of aggregates larger than 50 μm was observed was evaluated as B. The case where no supernatant was observed after 28 days was evaluated as A, and the case where a supernatant was observed after 28 days was evaluated as B.

[0087] In addition, since the chelate 5-6 was a liquid, neither the generation of aggregates nor the generation of supernatant occurred. Therefore, the above observation was not performed on the chelate 5-6, and it was recorded as not evaluated (-) in Table ta1.

[0088] As shown in Table ta1, it is known that, since supernatant was observed in chelate mixture 1-2 after 28 days, when the dispersant was diethylene glycol diethyl ether, chelate and dispersant were easily separated. Therefore, preferably, chelate mixture 1-2 was mixed with a binder immediately after mixing. In addition, since the amount of dispersant in chelate mixture 2 was more than that in chelate mixture 1, it was not easy to form agglomerates.

[0089] As shown in Table ta1, in the chelate mixture 3-4, no supernatant was observed after 28 days, and no aggregates were easily formed. Therefore, it is preferable to use diethylene glycol dibutyl ether as a dispersant.

[0090] Adhesive samples 1-10

[0091] exist Figure 6 The epoxy adhesives of Table ta2 were mixed with the chelate mixture 1 by the mixing shown in Table ta2, and the adhesive samples 1-10 were prepared.

[0092] As the epoxy-based adhesive, an adhesive obtained by mixing the following components was used.

[0093] Ingredient P: Triglycidyl p-aminophenol

[0094] Ingredient Q: Bisphenol F epoxy resin (epoxy equivalent 160)

[0095] Component S: 2-ethyl-4-methylimidazole

[0096] In addition, component S may be a component having one or more active hydrogen atoms capable of undergoing addition reaction with an epoxy group in the molecule. Component S includes aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexylmethane, and m-phenylenediamine; aromatic amine compounds such as 4,4'-diaminodiphenylmethane and 2-methylaniline; imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2-phenylimidazole; and imidazoline compounds such as imidazoline, 2-methylimidazoline, and 2-ethylimidazoline.

[0097] Adhesion test: Transfer film shape

[0098] First, adhesive samples 1 to 10 were coated on a 100 μm thick, A4-sized PET film of Lumière ( Registered trademark). The short sides of the millimeter are overlapped with each other in such a way that the surface of the millimeter coated with the adhesive sample becomes the outer side, thereby bending the millimeter into a curved surface. The transfer is performed by vertically pressing the surface of the bent millimeter coated with the adhesive on the surface of a rectangular object (width 100mm×depth 100mm×thickness 2mm) on which epoxy resin is cured. Then, the shape of the transfer film of the adhesive sample formed on the surface of the epoxy resin object is observed, and whether or not bumps are observed on the surface of the adhesive on the rectangular object on which epoxy resin is cured is evaluated in the following manner.

[0099] In addition, the adhesive sample was pre-filled into a syringe and applied to the surface of a Ni-Pd electroformed sheet (width 20 mm × depth 20 mm × thickness 10 μm) with a diameter of about 2 mm × height 1 mm. Next, the short sides of Lumire (registered trademark) as a PET film of A4 size with a thickness of 100 μm were overlapped with each other, and the coated material was crushed using Lumire bent into a curved surface, and then the dragging of the boundary line between the adhesive and the Ni-Pd electroformed was evaluated as follows.

[0100] A: No irregularities were observed on the surface of the adhesive on the rectangular object on which the epoxy resin was cured. Furthermore, no dragging of the boundary line between the adhesive and the Ni—Pd electroforming was observed.

[0101] B: No irregularities were observed on the surface of the adhesive on the rectangular object on which the epoxy resin was cured, but dragging of the boundary line between the adhesive and the Ni—Pd electroforming was observed.

[0102] Adhesion test: strength of adhesion

[0103] Furthermore, the adhesive strength after bonding and the adhesive strength after immersion in the evaluation liquid at 60° C. for eight weeks were measured.

[0104] Regarding the adhesive strength, a Ni—Pd electroformed sheet was sandwiched between a 200 μm-thick gasket and a thermosetting resin molded product using adhesive samples 1 to 10, and cured at 100° C. for eight hours to prepare a tensile strength test piece.

[0105] Here, the tensile strength test piece is specifically described. When making a set of test pieces, two cubes with a single side of 300 mm as a cured product of epoxy resin (hereinafter, one is referred to as the first epoxy molded product and the other is referred to as the second epoxy molded product), two stainless steel washers with a thickness of 100 μm (hereinafter, one is referred to as the first washer and the other is referred to as the second washer) and a Ni-Pd electroformed sheet with a thickness of 10 μm are prepared. The first washer is placed on the first epoxy molded product. In addition, on the same surface of the first epoxy molded product as the surface on which the first washer is placed, an adhesive sample is applied to the inner side of the first washer in a manner that does not contact the first washer. In addition, by placing the electroformed sheet on the surface of the first washer on the opposite side of the first epoxy molded product, the surface of the electroformed sheet placed on the first washer is bonded to the first epoxy molded product through the adhesive sample applied on the first epoxy molded product. Next, the second washer is placed on the surface of the electroformed sheet on the opposite side of the first washer. Then, the adhesive sample was applied to the inner side of the second gasket on the same surface of the electroformed sheet as the surface on which the second gasket was placed, so as not to contact the second gasket. Then, by placing the second epoxy molded product on the surface of the second gasket opposite to the electroformed sheet, the surface of the second epoxy molded product placed on the second gasket was bonded to the electroformed sheet through the adhesive sample applied to the surface of the electroformed sheet opposite to the first epoxy molded product. Thereafter, the test piece assembled by laminating the epoxy molded product, the gasket, and the electroformed sheet in the manner described above was heated at a curing temperature of 100° C. for eight hours for curing, thereby preparing a test piece.

[0106] The test piece obtained in this way is placed in a tensile testing machine, the first epoxy molded product and the second epoxy molded product are grasped and stretched in the direction of being pulled apart from each other, thereby implementing a destruction inspection of the stretched adhesive. The inspection is implemented based on JIS K 6849. In addition, the MPa value as the bonding strength is obtained based on the maximum load (N) at which the adhesive of the adhesive sample is destroyed (interface peeling) and the area of ​​the adhesive sample remaining in the epoxy molded product after the adhesive failure measured by a digital microscope.

[0107] The tensile strength test piece was measured by a tensile testing machine before and after being immersed in the evaluation liquid, and the evaluation was performed as follows. In addition, the tensile strength test piece was immersed in the evaluation liquid using a UV monomer evaluation liquid that was excessively hygroscopic by UV ink of N-vinyl-ε-caprolactam (CAS2235-00-9): tetrahydrofurfuryl acrylate (CAS2399-48-6): water = 48:48:4. The test piece after immersion was taken out, and after being washed with ethanol, a tensile evaluation based on the tensile adhesive strength test method (JIS K 6849) was performed.

[0108] A: Initial bonding strength is 30 MPa or more, and bonding strength after immersion is 10 MPa or more

[0109] B: Initial bonding strength is 20 MPa or more, and bonding strength after immersion is 10 MPa or more

[0110] C: The initial adhesive strength was less than 20 MPa, or the adhesive strength after immersion was less than 10 MPa or more. The results are shown in Table ta2.

[0111] Table ta2 shows the mass of the chelate contained in the adhesive after curing and the value obtained by rounding off the mass percentage (%) of the chelate to the adhesive after curing to two decimal places.

[0112] Result 1

[0113] In the case of adhesive sample 1-10, there was no particular problem in that the transfer film had a shape of B. However, since drag was observed at the boundary line between the adhesive and the Ni—Pd electroform, the adhesive before curing had poor wettability and was difficult to spread.

[0114] Furthermore, although the adhesive strength of adhesive samples 1-8 was within the range of B, the adhesive strength was low in adhesive sample 9 having a chelate content as low as 0.3% by mass and adhesive sample 10 having a chelate content as high as 5.71% by mass.

[0115] Adhesive samples 11-20

[0116] exist Figure 7 The chelate mixture 2 was mixed with the epoxy adhesive having the blending shown in Table ta3, thereby preparing adhesive samples 11 to 20.

[0117] The adhesion test was carried out in the same manner as described above, and the results are shown in Table ta3.

[0118] Result 2

[0119] In the case of adhesive samples 11-20, there is no problem in that the shape of the transfer film is A. Comparison with Result 1 shows that the line of the aggregate becomes smaller when the organic solvent as the dispersant is larger, and the shape of the transfer film is good.

[0120] In addition, in adhesive samples 11-18, the bonding strength is A, which is a completely problem-free range, but in adhesive sample 19 with a chelate content as small as 0.23% by mass and adhesive sample 20 with a chelate content as large as 4.35% by mass, the bonding strength is relatively small. In other words, the bonding strength depends on the shape of the transfer film. In addition, the bonding strength depends on the content of the chelate contained in the cured adhesive.

[0121] Adhesive samples 21-30

[0122] exist Figure 8 The chelate mixture 3 was mixed with the epoxy adhesive having the blending shown in Table ta4, thereby preparing adhesive samples 21 to 30.

[0123] The adhesion test was carried out in the same manner as described above, and the results are shown in Table 4.

[0124] Result 3

[0125] In the case of adhesive samples 21 to 30, the shape of the transfer film A was no problem at all.

[0126] In adhesive samples 21 to 28, the adhesive strength was A, which was a completely acceptable range. However, in adhesive sample 29 having a chelate content as low as 0.26% by mass and adhesive sample 30 having a chelate content as high as 4.94% by mass, the adhesive strength was low.

[0127] Adhesive samples 31-40

[0128] exist Fig. 9 The chelate mixture 4 was mixed with the epoxy adhesive having the blending shown in Table ta5, thereby preparing adhesive samples 31 to 40.

[0129] The adhesion test was carried out in the same manner as described above, and the results are shown in Table ta5.

[0130] Result 4

[0131] In the case of adhesive samples 31 to 40, the shape of the transfer film A was no problem at all.

[0132] In adhesive samples 31 to 38, the adhesive strength is A, which is a completely acceptable range. However, in adhesive sample 39 having a chelate content as low as 0.26% by mass and adhesive sample 40 having a chelate content as high as 4.94% by mass, the adhesive strength is low.

[0133] Adhesive samples 41-44

[0134] exist Fig.10 The epoxy adhesives of Table ta6 were mixed with chelate compound 5 or 6 by the blending shown in Table ta6, thereby preparing adhesive samples 41 to 44.

[0135] The adhesion test was carried out in the same manner as described above, and the results are shown in Table 6.

[0136] Results 5

[0137] In the adhesive samples 41 to 44 using chelate compound 5 or 6, the shape of the transfer film and the adhesive strength were both B, and they were feasible samples.

[0138] Other Implementation Methods

[0139] Although an inkjet recording head is cited as an example of a liquid ejection head in the above embodiment, the present invention is widely applicable to liquid ejection heads and can also be applied to liquid ejection heads that eject liquids other than ink. Other liquid ejection heads include, for example, various recording heads used in image recording devices such as printers, color material ejection heads used in the manufacture of color filters for liquid crystal displays, electrode material ejection heads used in the formation of electrodes for organic EL (Electro-Luminescence) displays, FED (Field Emission Displays), etc., and biological organic ejection heads used in the manufacture of biochips, and can also be applied to liquid ejection devices having the liquid ejection heads involved.

[0140] Although the above embodiment uses a piezoelectric actuator as a driving element for causing a pressure change in the pressure chamber, the present invention is not particularly limited. For example, as the driving element, a driving element that arranges a heating element in the pressure chamber and causes ink droplets to be ejected from the nozzle by bubbles generated by the heating of the heating element, a so-called electrostatic actuator that generates static electricity between a vibration plate and an electrode and causes the vibration plate to deform by electrostatic force and causes ink droplets to be ejected from the nozzle, etc. can be used.

[0141] Although in the above-mentioned embodiment, the filter component 40 of the second flow channel component is bonded between the connecting plate 15 and the housing component 100 as the first flow channel component by the adhesive 60, the dissolution of metal ions from the filter component 40 into the liquid is suppressed by the chelate contained in the adhesive, thereby achieving the effect of suppressing the decrease in the bonding strength of the interface. However, as long as it is the same combination, the second flow channel component may not be the filter component 40. For example, the second flow channel component may be the vibration plate 84 and have the functions of both the filter and the vibration plate. In addition, since the second flow channel component can be any component that has the possibility of dissolving metal, it can be a flow channel component made of metal such as SUS.

[0142] In addition, the first flow channel component bonded to the second flow channel component such as the electroformed filter by an adhesive is, for example, a connecting plate 15 made of silicon and a housing component 100 made of a thermosetting resin in the above-mentioned embodiment, but is not limited thereto. It may also be a flow channel component made of metal such as SUS, ceramic, or thermoplastic resin.

[0143] In the above-described embodiment, for example, UV ink or solvent-based ink is preferred as the ink, but the present invention is not limited thereto, and for example, water-based ink may also be used.

[0144] In addition, the present invention is of course not limited to the above-mentioned embodiment. It goes without saying for those skilled in the art that the following is disclosed as an embodiment of the present invention:

[0145] · The components and structures that can be replaced with each other disclosed in the above embodiments can be applied by appropriately changing their combination

[0146] · Appropriately replace the components and structures that are not disclosed in the above embodiments but are well-known technologies and can be replaced with the components and structures disclosed in the above embodiments, and apply them in a manner of changing their combination

[0147] Although not disclosed in the above embodiments, those skilled in the art can conceive of using components and structures as substitutes for the components and structures disclosed in the above embodiments based on known technologies, etc., by appropriately replacing them and changing their combinations.

[0148] Notes

[0149] According to the above-exemplified embodiments, for example, the following configurations can be understood.

[0150] The liquid ejection head involved in method 1 as a preferred method comprises: a nozzle that ejects liquid; a first flow channel component that defines a portion of a flow channel for supplying liquid to the nozzle; a second flow channel component that is bonded to the first flow channel component and defines a portion of the flow channel, and is made of metal; and an adhesive that bonds the first flow channel component and the second flow channel component, the adhesive containing a water-insoluble chelate.

[0151] According to mode 1, since a material containing a water-insoluble chelate is used as an adhesive, the chelate can be used to suppress the dissolution of metal ions from the second flow channel component, thereby suppressing interface peeling, thereby improving the reliability of the adhesive strength. In addition, since the chelate is water-insoluble, the dissolution of the chelate into the liquid can be reduced, thereby maintaining the stability of the adhesion for a long time.

[0152] In Embodiment 2, which is a specific example of Embodiment 1, the chelate is oil-soluble benzotriazole. According to Embodiment 2, since the chelate is oil-soluble benzotriazole, the elution of the chelate into the liquid can be more reliably reduced, thereby maintaining the stability of adhesion for a long time.

[0153] In Embodiment 3, which is a specific example of Embodiment 2, the chelate is 5-carboxybenzotriazole. According to Embodiment 3, since the chelate is 5-carboxybenzotriazole, the elution of the chelate into the liquid can be more reliably reduced, thereby maintaining the stability of adhesion for a long period of time.

[0154] In addition, in Embodiment 4 as a specific example of Embodiment 1, the adhesive contains at least one of a curing accelerator and a curing agent and a multifunctional epoxy resin having a difunctional or higher epoxy group as a main agent. According to such Embodiment 4, since an epoxy-based adhesive is used, the reliability of the bonding strength can be ensured, the dissolution of the chelate into the liquid can be more reliably reduced, and the stability of the bonding can be maintained for a long time.

[0155] In addition, in Embodiment 5 as a specific example of Embodiment 1, the content of the chelate relative to the adhesive is 0.56% by mass or more. According to such Embodiment 5, the following effect can be effectively exerted, that is, the chelate can more reliably reduce the dissolution of metal ions from the second flow channel component, thereby suppressing interface peeling, and thus improving the reliability of the adhesive strength of the adhesive.

[0156] In aspect 6 as a specific example of aspect 1, the content of the chelate compound relative to the binder is 3.51% by mass or less. According to aspect 6, even if the first flow channel member is a thermosetting resin, the chelate compound can reduce the decrease in adhesion to the first flow channel member.

[0157] In Embodiment 7, which is a specific example of Embodiment 1, the content of the chelate relative to the adhesive is 0.56% by mass or more and 3.51% by mass or less. According to such Embodiment 7, the chelate can effectively suppress the dissolution of metal ions from the second flow channel component, thereby suppressing interface peeling and improving the reliability of the adhesive strength of the adhesive, and even if the first flow channel component is a thermosetting resin, the adhesion to the first flow channel component will not be reduced.

[0158] In addition, in mode 8 as a specific example of mode 1, the second flow channel component is an electroformed filter composed of a metal containing at least one of nickel and palladium. According to such mode 8, the chelate can be used to suppress the dissolution of metal ions of nickel and palladium from the second flow channel component, thereby suppressing interface peeling, thereby improving the reliability of the bonding strength of the adhesive. In addition, since the chelate is water-insoluble, the dissolution of the chelate into the liquid can be reduced, thereby maintaining the stability of the bonding for a long time.

[0159] In a specific example of the embodiment 8, the first flow channel member is a thermosetting resin, and the liquid is supplied from the flow channel in the first flow channel member to the nozzle through the electroformed filter. According to the embodiment 9, the chelate can effectively suppress the dissolution of metal ions from the second flow channel member, thereby suppressing the interface peeling and improving the reliability of the adhesive strength. Even if the first flow channel member is a curable resin, the adhesion to the first flow channel member will not decrease.

[0160] Furthermore, in mode 10 as a specific example of mode 1, the liquid is an ultraviolet curable ink or a solvent-based ink. According to such mode 10, since 1 to 2% of water is contained in the hygroscopic UV ink or solvent-based ink, it is easy to generate a current between the second flow channel component and the ink by supplying it to the flow channel of the liquid ejection head, and the metal ions are easily eluted from the second flow channel component into the water in the ink. However, in the present invention, since an adhesive containing a chelate is used as the adhesive, a chelate that forms a complex with the metal ions exists on the bonding interface of the second flow channel component, thereby suppressing the dissolution of the metal ions from the electroformed filter into the water in the ink, and thus suppressing the decrease in bonding strength.

[0161] Furthermore, a liquid ejecting apparatus according to aspect 11 as another preferred aspect includes the liquid ejecting head described in any one of aspects 1 to 10.

[0162] According to method 11, since a material containing a water-insoluble chelate is used as an adhesive, a liquid injection device can be realized, that is, the liquid injection device can inhibit the dissolution of metal ions from the second flow channel component through the chelate, thereby inhibiting interface peeling, thereby improving the reliability of the adhesive strength.

[0163] Explanation of symbols

[0164] 1…recording device (liquid ejecting device); 2…recording head (liquid ejecting head); 3…liquid container (liquid storage unit); 10…pressure chamber substrate; 12…pressure chamber; 15…connecting plate; 20…nozzle plate; 21…nozzle; 40…filter component; 50…filter hole; 60…adhesive; 80…piezoelectric actuator; 84…vibration plate; 100…housing component; 110…plastic substrate; 120…wiring substrate; 121…driving circuit; 130…manifold; 140…liquid storage tank.

Claims

1. A liquid ejecting head, characterized in that: have: a nozzle, which ejects the liquid; a first flow channel member defining a portion of a flow channel for supplying liquid to the nozzle; a second flow channel component, which is bonded to the first flow channel component and defines a portion of the flow channel, and is made of metal; An adhesive for bonding the first flow channel component and the second flow channel component; The adhesive contains a water-insoluble chelate.

2. The liquid ejecting head according to claim 1, wherein: The chelate is an oil-soluble benzotriazole.

3. The liquid ejecting head according to claim 2, wherein: The chelate is 5-carboxybenzotriazole.

4. The liquid ejecting head according to claim 1, wherein: The adhesive contains at least one of a curing accelerator and a curing agent and a multifunctional epoxy resin having two or more epoxy groups as a main agent.

5. The liquid ejecting head according to claim 1, wherein: The content of the chelate compound relative to the binder is 0.56% by mass or more.

6. The liquid ejecting head according to claim 1, wherein: The content of the chelate compound relative to the binder is 3.51% by mass or less.

7. The liquid ejecting head according to claim 1, wherein: The content of the chelate compound relative to the binder is greater than or equal to 0.56% by mass and less than or equal to 3.51% by mass.

8. The liquid ejecting head according to claim 1, wherein: The second flow channel member is an electroformed filter made of a metal including at least one of nickel and palladium.

9. The liquid ejecting head according to claim 8, wherein: The first flow channel component is a thermosetting resin, The liquid is supplied from the flow channel in the first flow channel member to the nozzle through the electroformed filter.

10. The liquid ejecting head according to claim 1, wherein The liquid is ultraviolet curable ink or solvent-based ink.

11. A liquid ejection device, characterized in that: have: The liquid ejecting head according to any one of claims 1 to 10; The liquid storage portion stores the liquid supplied to the liquid ejecting head.

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