Slitting device for thin film

By using marking units to form a support pattern dispersing pressure of the adhesive layer in the film slitting device, the problem of adhesive discharge in the prior art is solved and the product quality is improved.

CN119176441APending Publication Date: 2024-12-24NPS CORP
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Patent Information

Application Number
CN202311314260.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-27
Filing Date
2023-10-11
Publication Date
2024-12-24

AI Technical Summary

Technical Problem

The existing thin film slitting device causes thermal deformation of the cutting surface of the polarizing film material during the slitting process, and the adhesive flows out due to concentrated pressure, affecting product quality.

Method used

A slitting device for thin films is designed, by using a marking unit to form a support pattern corresponding to the shoulder after slitting, and the pressure of the adhesive is dispersed, thereby preventing the adhesive from flowing out through the cutting surface. The device includes an unwinding machine, a cutting unit, a marking unit and a material rewinder, which uses a laser scanner to form a support pattern on the film material to disperse the pressure.

Benefits of technology

It effectively prevents the adhesive from flowing out through the cutting surface, and improves the quality of the film materials and products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a slitting device for a film, comprising: an unwinding machine for winding and supplying a film material in the longitudinal direction; a cutting unit for cutting the thin film material by laser cutting the side part of the thin film material along the length direction to cut the thin film material, thereby cutting the thin film material into unit thin film materials; a marking unit that laser marks a support pattern on the unit film material, the support pattern having a height corresponding to a shoulder, the shoulder being thermally deformed during laser cutting of the film material and protruding in the thickness direction of the unit film material at a side end portion of the unit film material; and a material rewinding machine for winding and collecting the unit film material on which the support pattern is formed.
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Description

Technical Field

[0001] The present invention relates to a slitting device for a film. Background Art

[0002] Figure 1 This is a diagram showing a laser cut surface of a general polarizing film.

[0003] Generally, the polarizing film material F0 used to make a display panel may include an active layer (PVA), a transmittance enhancing layer (TAC), a protective film layer (P / F), a release film layer (R / F), and the like.

[0004] The active layer (PVA) is a film layer used to change the polarization characteristics of light, and contains at least polyvinyl alcohol.

[0005] The transmittance enhancement layer (TAC) is a film layer used to project the light source to the front of the display to the maximum extent, and contains at least triacetyl cellulose. This transmittance enhancement layer (TAC) is stacked on the lower surface of the active layer (PVA).

[0006] The protective film layer (P / F) is a film layer for preventing the surface of the polarizing film from being damaged, and comprises at least one of polyethylene terephthalate and polyethylene. The protective film layer (P / F) is laminated on the upper surface of the active layer (PVA) in a state where polyethylene terephthalate (PET) is formed between the protective film layer (P / F) and the active layer (PVA), so as to be located at the outermost layer on one side of the polarizing film material F0 among the multiple film layers included in the polarizing film material F0.

[0007] The release film layer (R / F) is a film layer for isolating an adhesive layer (PSA) for attaching the polarizing film to the liquid crystal panel from contaminants, and includes at least one of polyethylene terephthalate and polyethylene.

[0008] This release film layer (R / F) is bonded to the adhesive layer (PSA) in a releasable manner. The adhesive layer (PSA) is coated with a pressure sensitive adhesive (Pressure sensitive adhesive) and other adhesives on the lower surface of the transmittance enhancement layer (TAC) so as to be located at the outermost layer on the other side opposite to the outermost layer on the one side among the multiple film layers included in the film material.

[0009] The display panel has various sizes. In order to adapt the polarizing film material F0 to the display panel, the following process is required: a process of cutting and slitting the polarizing film material F0 along the length direction in a way that the polarizing film material F0 has the same width as one of the width and length of the display panel, and the following cutting process of cutting and cutting the slit polarizing film material F0 along the length direction of the polarizing film material F0 at an interval that is the same as the other of the width and length of the display panel, so that the slit polarizing film material F0 is divided into multiple polarizing film sheets having the same width and length as the display panel.

[0010] Figure 2 This is a diagram showing a schematic structure of a conventional film slitting device. Figure 3 This is a diagram showing a state where a polarizing film material is slit by a conventional film slitting device.

[0011] and, Figure 4 This is a diagram showing a state in which a polarizing film material is thermally deformed when being slit by a conventional film slitting device. Figure 5 This is a diagram showing a state in which an adhesive flows out through the cut surface of a polarizing film material wound in a roll state after slitting.

[0012] However, if Figure 2 and Figure 3 As shown, usually, the slitting process of the polarizing film material F0 is implemented by using a film slitting device 100, and the film slitting device 100 includes: an unwinder 110, which supplies the polarizing film material F0 wound into a roll by unwinding it; a pair of laser nozzles 120, so that the polarizing film material F0 supplied from the unwinder 110 has a preset reference width W, and irradiates a laser beam to one of the left and right side parts of the polarizing film material F0 along the length direction of the polarizing film material F0 to slit the polarizing film material F0; a material rewinder 130, which winds up and recovers the polarizing film material F0 that has been slit in a manner having the above-mentioned reference width W; and a first scrap rewinder 140 and a second scrap rewinder 150, which respectively wind up and recover one of a pair of scraps (Sc) formed by cutting the left and right side parts of the polarizing film material F0 along the length direction of the polarizing film material F0 by laser beams released from multiple laser nozzles 120.

[0013] When the conventional film slitting device 100 is used to slit the polarizing film material F0, as shown in FIG. Figure 4As shown, the cut surface of the polarizing film material F0 is thermally deformed due to the heat applied from the laser beam, and thus, the cut surface of the polarizing film material F0 is formed into a tapered surface T having a predetermined tapered width (Wt). Furthermore, when a plurality of laser nozzles 120 are arranged in such a manner that the laser beam is released from the outer surface side of the protective film layer (P / F) toward the polarizing film material F0, the shoulder portion S is formed protruding in the thickness direction of the polarizing film material F0 and extending in a long manner along the above-mentioned length direction at the heat-affected portion of the protective film layer (P / F) located at the left and right side ends of the polarizing film material F0 in a manner adjacent to the cut surface of the polarizing film material F0 and extending in a manner long along the above-mentioned length direction. Furthermore, the heat-affected portion of the adhesive layer (PSA) located at the left and right side ends of the polarizing film material F0 is in a viscous gel state for a predetermined time due to the relatively low melting point of the adhesive constituting the adhesive layer (PSA) so as to be adjacent to the cut surface of the polarizing film material F0.

[0014] On the other hand, Figure 5 As shown, when the polarizing film material F0 is recovered by using the material rewinding machine 130, the polarizing film material F0 is wound in a roller state and stacked into multiple layers along the thickness direction. In this case, the polarizing film material F0 is subjected to the following forces along the thickness direction of the polarizing film material F0, the tension applied to the polarizing film material F0 in order to wind the polarizing film material F0 and the pressure (Pt) caused by the load of the polarizing film material F0. In this regard, according to the existing film slitting device 100, after the slitting process, in the process of winding the polarizing film material F0 into a roller state for recovery, the above-mentioned pressure (Pt) is concentratedly applied to the left and right side ends of the polarizing film material F0 due to the shoulder S, thereby, the adhesive A in the heat-affected part of the adhesive layer (PSA) in a gel state frequently leaks to the outside through the cut surface of the polarizing film material F0 (the cut surface of the adhesive layer (PSA)) due to the above-mentioned pressure (Pt). Such a conventional film slitting apparatus 100 has a problem that the adhesive A flows out through the cut surface of the polarizing film material F0 to the outside, thereby deteriorating the quality of the polarizing film material F0 and the polarizing film sheet and other products manufactured using the polarizing film material F0. Summary of the invention

[0015] The present invention is used to solve the problems of the above-mentioned prior art. The purpose of the present invention is to provide a film slitting device as follows, which improves the method of preventing the adhesive constituting the adhesive layer from flowing out through the cut surface of the film material during the process of recovering the film material in the form of a roller after the slitting process.

[0016] The film slitting device of the preferred embodiment of the present invention for solving the above-mentioned problem comprises: an unwinder, which winds and supplies the film material along the length direction; a cutting unit, which laser cuts the side of the film material along the length direction to slit the film material, thereby forming unit film materials from the film material; a marking unit, which laser marks a supporting pattern on the unit film material, the supporting pattern having a height corresponding to the shoulder, the shoulder undergoes thermal deformation during the laser cutting of the film material and protrudes along the thickness direction of the unit film material to form a side end portion of the unit film material; and a material rewinder, which winds and recycles the unit film material with the supporting pattern.

[0017] Preferably, the support pattern is formed to be long and extended along the length direction so as to be parallel to the shoulder.

[0018] Preferably, the support pattern extends along a width direction of the unit film material perpendicular to the length direction so as to be perpendicular to the shoulder, and is repeatedly formed at preset intervals along the length direction.

[0019] Preferably, the support pattern is repeatedly formed at preset intervals along the length direction to form a zigzag pattern.

[0020] Preferably, the marking unit separates the support pattern from the side end of the unit film material by a preset reference interval along the width direction of the unit film material perpendicular to the length direction and separates it from the shoulder by a preset sufficient interval along the width direction.

[0021] Preferably, the marking unit includes: a camera for photographing the side end of the unit film material; and an image analysis unit for specifying the position of the side end of the unit film material based on the image transmitted from the camera.

[0022] Preferably, the marking unit further includes a laser scanner for irradiating a laser beam toward the unit film material based on the position of the side end of the unit film material specified by the image analysis unit to form the support pattern.

[0023] Preferably, the marking unit further comprises: a fixed bracket for fixing the camera and the laser scanner respectively; and a conveyor for conveying the fixed bracket along the width direction of the unit film material.

[0024] Preferably, the marking unit further includes a lighting unit, which is fixedly mounted on the fixing bracket in a manner facing the camera across the unit film material, and irradiates photographing light toward the unit film material.

[0025] Preferably, the marking unit further comprises a suction portion having a suction hole for sucking in foreign matter generated when forming the support pattern, and is fixedly mounted on the fixed bracket so that the laser beam released from the laser scanner passes through the suction hole and then irradiates the unit film material.

[0026] The present invention relates to a film slitting device, when a film material slit by a laser beam is wound into a roll form and recovered, at least a part of the pressure concentratedly applied to both side ends of the film material due to the shoulder is dispersed to the formation position side of the support pattern by using a support pattern marked in a manner having a height corresponding to the shoulder. Therefore, in the present invention, when the slit film material is wound into a roll form and recovered, the adhesive of the adhesive layer that becomes a gel state due to the heat applied from the laser beam during slitting can be prevented from flowing out through the cut surface of the film material, thereby improving the quality of the film material and the film product made using the same. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A diagram showing the stacked structure of polarizing film materials.

[0028] Figure 2 This is a diagram showing a schematic structure of a conventional film slitting device.

[0029] Figure 3 This is a diagram showing a state where a polarizing film material is cut by a film cutting device.

[0030] Figure 4 The figure shows a state where the polarizing film material is thermally deformed when the polarizing film material is slit by a film slitting device.

[0031] Figure 5 The figure shows a state where an adhesive flows out through a cut surface of a polarizing film material that is wound into a roll after slitting.

[0032] Figure 6 A diagram showing a schematic structure of a film slitting device according to a preferred embodiment of the present invention.

[0033] Figure 7 A diagram showing a schematic shape of a cutting unit.

[0034] Figure 8 FIG. 4 is a top view showing a schematic structure of a marking unit.

[0035] Fig. 9 for Figure 8 A side view of the marking unit is shown.

[0036] Fig.10 A diagram showing a state in which a support pattern is marked on a thin film material by a marking unit.

[0037] Fig.11 A diagram showing a state in which a support pattern is marked on a thin film material by a marking unit.

[0038] Fig.12 A diagram for explaining the shape of a support pattern.

[0039] Fig.13 This is a diagram showing a state in which outflow of the adhesive is prevented by the support pattern.

[0040] Description of Reference Numerals

[0041] 1: Film slitting device

[0042] 10: Unwinding machine

[0043] 20: Cutting unit

[0044] 22: Laser nozzle 24: Driver

[0045] 24a: Sliding part 24b: Driving member

[0046] 30: Marking unit

[0047] 31: Camera 32: Lighting

[0048] 33: Image analysis unit 34: Laser oscillator

[0049] 35: Optical components 36: Laser scanner

[0050] 37: Suction part 37a: Suction port

[0051] 38: Fixed bracket 39: Transfer machine

[0052] 39a: Bracket 39b: Sliding part

[0053] 39c: driving part 39d: transfer screw

[0054] 39e: Drive motor

[0055] 40: Material rewinding machine

[0056] 50: First waste rewinder

[0057] 60: Second waste rewinder

[0058] 100: Existing film slitting device

[0059] 110: Unwinding machine

[0060] 120: Laser nozzle

[0061] 130: Material rewinding machine

[0062] 140: First waste rewinder

[0063] 150: Second waste rewinder

[0064] F: Film material F1: Unit film material

[0065] Sc: Scrap

[0066] PVA: Active layer TAC: Transmittance enhancement layer

[0067] P / F: Protective film R / F: Release film

[0068] PET: Polyethylene terephthalate PSA: Adhesive layer

[0069] A: Binder

[0070] LB: Laser beam

[0071] S: Shoulder

[0072] T: Conical surface

[0073] P: Support pattern DETAILED DESCRIPTION

[0074] Hereinafter, some embodiments of the present invention will be described in detail through illustrative drawings. In the process of assigning reference numerals to the drawings, even if the same structural elements are presented in different drawings, the same reference numerals will be assigned to the same structural elements as much as possible. In addition, in the process of describing the embodiments of the present invention, if it is determined that the specific description of the relevant known structure or function confuses the understanding of the embodiments of the present invention, the detailed description thereof will be omitted.

[0075] In the process of describing the structural elements of the embodiments of the present invention, the terms such as first, second, A, B, A, (a), (b) etc. may be used. Such terms are only used to distinguish between two structural elements, and the nature, sequence or order of the corresponding structural elements are not limited to these terms. Furthermore, unless otherwise defined, the meaning of all terms used herein, including technical or scientific terms, is the same as that generally understood by a person of ordinary skill in the present invention. The meaning of the terms defined in the commonly used dictionaries is the same as that in the relevant technical context, and cannot be interpreted as an ideal or excessive form of meaning unless it is clearly defined in its own weight.

[0076] Figure 6 1 is a diagram showing a schematic structure of a film slitting device according to a preferred embodiment of the present invention. Figure 7 A diagram showing a schematic shape of a cutting unit.

[0077] Reference Figure 6The film slitting device 1 of the preferred embodiment of the present invention may include: an unwinder 10, which winds and supplies the film material F along the length direction of the film material F; a cutting unit 20, which laser cuts the left and right side portions of the film material F supplied from the unwinder 10 along the above-mentioned length direction, so as to slit the film material F into a preset reference width W; a marking unit 30, which marks a support pattern P on the film material F, wherein the support pattern P has a height corresponding to the shoulder S, and the shoulder is formed by thermal deformation during the slitting of the film material F by the cutting unit 20; a material rewinder 40, which winds and recycles the film material F marked with the support pattern P along the above-mentioned length direction; and a first scrap rewinder 50 and a second scrap rewinder 60, which respectively wind and recycle one of a pair of scraps Sc formed by cutting the left and right side portions of the film material F by the cutting unit 20 along the above-mentioned length direction.

[0078] This film slitting device 1 can be applied to the following various film materials. When the film material is slid by laser cutting, due to the heat applied to the cut surface of the film material, the shoulder protrudes along the thickness direction of the film material to form the heat-affected part of the protective film layer located at the left and right ends of the film material. After the slitting process of the film material, the heat-affected part of the adhesive layer located at the left and right ends of the film material maintains the gel state for a specified time. Figure 1 The present invention is described by taking the case where the polarizing film material F0 is the same as shown.

[0079] First, the unwinding machine 10 has the same structure as a general unwinding machine, and a detailed description thereof will be omitted.

[0080] The film material F supplied from the unwinder 10 is transferred along the longitudinal direction of the film material F by the tension applied from the rewinders 40 , 50 , 60 .

[0081] Next, the cutting unit 20 may include: a laser oscillator (not shown) that generates and oscillates a laser beam; an optical component (not shown) that transmits the laser beam LB oscillated from the laser oscillator along a preset path; a pair of laser nozzles 22 that irradiates the laser beam LB transmitted from the optical component to the film material F transferred along the length direction to laser cut the film material F, thereby slitting the film material F along the length direction; and a driver 24 that respectively moves the plurality of laser nozzles 22 along the width direction of the film material F perpendicular to the length direction of the film material F, so that the film material F is slit into a predetermined reference width W. In particular, the driver 24 may include: a pair of slides 24a that are respectively coupled to one of the plurality of laser nozzles 22; and a driving component 24b that moves the plurality of slides 24a along the width direction.

[0082] According to the cutting unit 20, the film material F is divided into a unit film material F1 cut in a manner having the above-mentioned reference width W and a plurality of scraps Sc separated from the left and right sides of the film material F. The unit film material F1 is recovered by the material rewinder 40, and the plurality of scraps Sc are recovered by one of the first scrap rewinder 50 and the second scrap rewinder 60.

[0083] Figure 8 A top view showing a simplified structure of a marking unit is shown in FIG. Fig. 9 for Figure 8 A side view of the marking unit is shown, Fig.10 1 is a diagram showing a state in which a support pattern is marked on a film material by a marking unit, Fig.11 A diagram showing a state in which a support pattern is marked on a film material by a marking unit.

[0084] and, Fig.12 is a diagram for explaining the shape of a support pattern, Fig.13 This is a diagram showing a state in which outflow of the adhesive is prevented by the support pattern.

[0085] Then, if Figure 8 and Fig. 9 As shown, the marking unit 30 may include: a camera 31 for photographing the side end of the unit film material F1 transmitted from the cutting unit 20; an illumination unit 32 for irradiating the side end of the unit film material F1 transmitted from the cutting unit 20 with a photographing light for photographing the side end of the unit film material F1; an image analysis unit 33 for determining the position of the side end of the unit film material F1 based on the image transmitted from the camera 31; a laser oscillator 34 for generating and oscillating a laser beam LB for laser marking a support pattern P; an optical component 35 for transmitting the laser beam LB oscillated from the laser oscillator 34 along a preset path; a laser scanner 36 for irradiating the laser beam LB transmitted from the optical component 35 to the unit film material F1 to form a support pattern P having a height corresponding to a shoulder S formed on the side end of the unit film material F1 during the process of cutting the film material F at a preset distance from the side end of the unit film material F1; and a suction unit 37 for sucking in and removing smoke and other foreign matter generated when the support pattern P is formed on the unit film material F1 by the laser scanner 36.

[0086] And, if Fig. 9As shown, preferably, the camera 31 is disposed opposite to the upper surface of the unit film material F1, and the lighting unit 32 is disposed opposite to the lower surface of the unit film material F1 in a manner of facing the camera 31 across the unit film material F1, but the present invention is not limited thereto. The upper surface of the unit film material F1 corresponds to the outer surface of the protective film (P / F) stacked on the outermost layer of one side of the unit film material F1, and the lower surface of the unit film material F1 corresponds to the outer surface of the release film layer (R / F) stacked on the outermost layer of the other side of the unit film material F1 opposite to the outermost layer of the one side.

[0087] Furthermore, preferably, the camera 31 and the lighting unit 32 are disposed closer to the cutting unit 20 than the laser scanner 36, and the position of the side end of the unit film material F1 is specified before the support pattern P is formed on the unit film material F1, but the present invention is not limited thereto. That is, the camera 31 and the lighting unit 32 may be disposed closer to the material rewinder 40 than the laser scanner 36, so that the position of the side end of the unit film material F1 can be specified and the form of the support pattern P formed on the unit film material F1 can be observed.

[0088] like Fig. 9 As shown, the laser scanner 36 is disposed facing the upper surface of the unit film material F1 so as to irradiate the protective film (P / F) with a laser beam.

[0089] In addition, the laser scanner 36 has a current mirror (not shown) that can change the optical path of the laser beam LB into one direction between the length direction and the width direction of the unit film material F1. According to the moving speed of the unit film material F1 and the moving status of other unit film materials F1, the optical path of the laser beam LB can be changed into one direction between the length direction and the width direction of the unit film material F1.

[0090] like Fig. 9 As shown, the suction part 37 may be formed facing the upper surface of the unit film material F1 so that foreign matter generated from the support pattern P can be sucked and removed from the protective film (P / F).

[0091] Furthermore, the suction portion 37 may have a suction port 37a for sucking the foreign matter. Fig. 9 As shown, preferably, the suction part 37 is configured so that the laser beam LB released from the laser scanner 36 is irradiated to the unit film material F1 after passing through the suction port 37a so that the above-mentioned foreign matter can be smoothly sucked, but it is not limited thereto.

[0092] As described above, the cutting unit 20 laser cuts the two side portions of the film material F along the length direction to separate and form the unit film material F1. In this regard, the camera 31, the lighting unit 32, the laser oscillator 34, the optical component 35, the laser scanner 36, and the suction unit 37 form a pair so that the unit film material F1 faces one of the two side portions, so that the support patterns P can be formed on the two side portions of the unit film material F1.

[0093] On the other hand, the reference width W of the unit film material F1 can be changed according to the width or length of the product made using the film material F. Accordingly, the positions of the two side ends of the unit film material F1 can also be changed along the width direction of the unit film material F1.

[0094] In this regard, preferably, the marking unit 30 can change the respective configuration positions of the camera 31 , the lighting unit 32 , the laser oscillator 34 , the optical component 35 , the laser scanner 36 , and the suction unit 37 along the width direction of the unit film material F1 .

[0095] To this end, the marking unit 30 may further include: a pair of fixed brackets 38, which respectively fix the camera 31, the lighting unit 32, the laser oscillator 34, the optical component 35, the laser scanner 36, and the suction unit 37 for forming the support pattern P on one end side of both ends of the unit film material F1; and a transfer machine 39, which transfers the plurality of fixed brackets 38 along the width direction. That is, the camera 31, the lighting unit 32, the laser oscillator 34, the optical component 35, the laser scanner 36, and the suction unit 37 are fixed to the fixed brackets 38 to form a group, and are transferred together along the width direction by the transfer machine 39.

[0096] The structure of the conveyor 39 is not particularly limited. For example, the conveyor 39 may include: a bracket 39a, which is provided in a manner to cross the unit film material F1 in the width direction in a state where a predetermined sufficient interval is spaced from one of the upper and lower surfaces of the unit film material F1 in the thickness direction of the unit film material F1; a pair of slides 39b, which are provided on the bracket 39a in a manner movable in the width direction and are coupled to one of the plurality of fixed brackets 38; and a pair of driving components 39c, which transfer one of the plurality of slides 39b and the structural elements (camera 31, lighting unit 32, laser oscillator 34, optical component 35, laser scanner 36, suction unit 37, etc.) fixed thereto together in the width direction. In addition, the plurality of driving components 39c may include: a conveying screw 39d, which is threadedly coupled to one of the plurality of slides 39b; and a driving motor 39e, which transfers the slide 39b and the structural elements coupled thereto together in the width direction to rotate the conveying screw 39d.

[0097] Next, the scrap rewinder 40, the first scrap rewinder 50, and the second scrap rewinder 60 have the same structure as a general rewinder, and detailed description thereof will be omitted.

[0098] Hereinafter, a method of forming the support pattern P on the unit film material F1 using the marking unit 30 will be described with reference to the drawings.

[0099] First, if Figure 8 As shown, the conveyor 39 conveys the plurality of fixed brackets 38 along the width direction so that the plurality of cameras 31 can capture the positions of the two side ends of the unit film material F1 estimated based on the reference width W of the unit film material F1.

[0100] Next, the multiple cameras 31 respectively photograph an area of ​​the unit film material F1 passing through the setting position of the multiple cameras 31 under the state of being illuminated by the lighting unit 32, and the image analysis unit 33 specifies the position of the side end of the unit film material F1 based on the image images transmitted from such multiple cameras 31.

[0101] When it is determined that the two side ends of the unit film material F1 are not located in the image transmitted from the multiple cameras 31 or the configuration positions of the multiple cameras 31 do not match, the conveyor 39 respectively transfers the multiple fixed brackets 38 along the above-mentioned width direction so that the two side ends of the unit film material F1 are located in a position suitable for forming a support pattern P in the shooting area of ​​the multiple cameras 31.

[0102] Afterwards, if Fig.10 and Fig.11 As shown, the laser scanner 36 irradiates the protective film (P / F) of the unit film material F1 with a laser beam LB based on the position of the side end of the unit film material F1 specified by the image analysis unit 33, so as to cause thermal deformation of the protective film (P / F). As a result, the support pattern P protrudes from the protective film (P / F) in the thickness direction of the film material F, and is separated from the two side ends of the unit film material F1 by a preset reference interval L1 along the above-mentioned width direction.

[0103] Preferably, the above-mentioned reference interval L1 is such that the support pattern P is spaced apart from the shoulder S by a preset sufficient interval L2.

[0104] Preferably, the support pattern P has the same height as the shoulder S or has a height higher than the shoulder S by a certain ratio, but is not limited thereto.

[0105] The shape of the support pattern P is not particularly limited. Fig.12As shown, the support pattern P is formed by extending in a long manner along the above-mentioned length direction in a manner parallel to the shoulder S, or by extending in the above-mentioned width direction in a manner perpendicular to the shoulder S and repeatedly formed at preset intervals along the above-mentioned length direction, or by repeatedly formed at preset intervals along the above-mentioned length direction in a manner forming a zigzag pattern.

[0106] According to this support pattern P, Fig.13 As shown, when the unit film material F1 is wound into a roll state by the material rewinder 40 and stacked into multiple layers in the thickness direction, the support pattern P of the protective film (P / F) formed on one layer of the unit film material F1 supports the release film layer (R / F) of another layer of the unit film material F1 along the thickness direction, thereby dispersing at least a part of the pressure Pt applied to the two side ends of the unit film material F1 due to the shoulder S to the formation position side of the support pattern P. Therefore, when the unit film material F1 is wound on the material rewinder 40, the support pattern P can prevent the pressure Pt from being concentrated on the two side ends of the unit film material F1 due to the shoulder S. In response to this, the film slitting device 1 prevents the adhesive A of the adhesive layer (PSA) that becomes a gel state due to the heat applied from the laser beam LB when slitting from flowing out through the cut surface of the unit film material F1, thereby improving the quality of the film material F and the film product made using it.

[0107] The above description is merely an illustrative description of the technical concept of the present invention, and a person skilled in the art in the technical field to which the present invention belongs can make various modifications and variations without departing from the essential characteristics of the present invention.

[0108] Therefore, the embodiments disclosed in the present invention are used to illustrate the present invention, but not to limit the technical ideas of the present invention, and the scope of the technical ideas of the present invention is not limited to these embodiments. The protection scope of the present invention is explained by the following invention claims, and all technical ideas within the equivalent scope belong to the protection scope of the present invention.

Claims

1. A film slitting device, characterized in that: include: An unwinder, which winds up the film material along the length direction and supplies it; a cutting unit for cutting the side of the film material by laser cutting along the length direction to cut the film material, thereby dividing the film material into unit film materials; A marking unit for laser marking a support pattern on the unit film material, wherein the support pattern has a height corresponding to a shoulder, and the shoulder is thermally deformed during laser cutting of the film material and protrudes along the thickness direction of the unit film material at a side end of the unit film material; and The material rewinder winds up the unit film material on which the support pattern is formed and recovers it.

2. The film slitting device according to claim 1, characterized in that: The support pattern is formed to extend long along the longitudinal direction so as to be parallel to the shoulder.

3. The film slitting device according to claim 1, characterized in that: The support pattern extends along a width direction of the unit film material perpendicular to the longitudinal direction so as to be perpendicular to the shoulder, and is repeatedly formed at predetermined intervals along the longitudinal direction.

4. The film slitting device according to claim 1, characterized in that: The support pattern is repeatedly formed at preset intervals along the length direction to form a zigzag pattern.

5. The film slitting device according to claim 1, characterized in that: The marking unit allows the support pattern to be spaced apart from the side end of the unit film material by a preset reference interval along the width direction of the unit film material perpendicular to the length direction and spaced apart from the shoulder by a preset sufficient interval along the width direction.

6. The film slitting device according to claim 5, characterized in that: The above-mentioned marking unit comprises: A camera, used for photographing the side end of the unit film material; and The image analysis unit specifies the position of the side end portion of the unit film material based on the image transmitted from the camera.

7. The film slitting device according to claim 6, characterized in that: The marking unit further includes a laser scanner for irradiating a laser beam toward the unit film material based on the position of the side end of the unit film material specified by the image analysis unit to form the support pattern.

8. The film slitting device according to claim 7, characterized in that: The marking unit further comprises: A fixing bracket, fixing the camera and the laser scanner respectively; and The transfer device transfers the fixed bracket along the width direction of the unit film material.

9. The film slitting device according to claim 8, characterized in that: The marking unit further includes a lighting unit, which is fixedly mounted on the fixing bracket in a manner facing the camera across the unit film material, and irradiates photographing light toward the unit film material.

10. The film slitting device according to claim 8, characterized in that: The marking unit further includes a suction portion having a suction hole for sucking foreign matter generated when forming the support pattern, and is fixedly mounted on the fixed bracket so that the laser beam released from the laser scanner passes through the suction hole and then irradiates the unit film material.