Heat pump control method, device and equipment and storage medium

Abstract

The invention provides a heat pump control method and device, equipment and a storage medium, and the heat pump control method comprises the steps that a heat pump control request for a target heat pump is responded, and the heat pump operation temperature and the heat pump operation frequency of the target heat pump are obtained; determining a target saturation temperature corresponding to the target heat pump in the target pressure state according to the heat pump operation temperature and the heat pump operation frequency; and heat pump operation parameters of the target heat pump are adjusted based on the target saturation temperature, and a heat pump control result is obtained. A pressure sensor does not need to be used in the operation of the heat pump, all heat pump operation parameters in the target heat pump and the heat pump operation frequency of the target heat pump are obtained, and the corresponding target saturation temperature of the target heat pump under the target pressure state of all operation working conditions is simulated through the heat pump operation parameters and the heat pump operation frequency; and the target heat pump is subjected to parameter adjustment through the target saturation temperature, so that the operation cost of the heat pump system is reduced, and the operation stability of the heat pump system is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat pump control, and in particular to a heat pump control method, device, equipment and storage medium. Background Art

[0002] At present, with the rapid development of heat pump technology, more and more users use air energy heat pumps for cooling or heating to meet the user's temperature regulation needs. In order to control the operation of the system and protect the reliable operation of the system, the existing heat pump system needs to install corresponding pressure sensors on the high-pressure side and the low-pressure side of the system for monitoring. The use of pressure sensors will increase the cost of heat pumps and increase the quality risks of heat pumps, such as abnormal operation of heat pumps due to failure of pressure sensors and leakage of heat pump refrigerant due to pipeline rupture. Summary of the invention

[0003] The embodiments of the present application provide a heat pump control method, device, equipment and storage medium, which are intended to solve the technical problems in the prior art that the use of pressure sensors for monitoring in heat pump systems leads to increased costs and increased quality risks of the heat pumps.

[0004] On the one hand, an embodiment of the present application provides a heat pump control method, the heat pump control method comprising the following steps:

[0005] In response to a heat pump control request for a target heat pump, obtaining a heat pump operating temperature and a heat pump operating frequency of the target heat pump;

[0006] Determining a target saturation temperature of the target heat pump corresponding to a target pressure state according to the heat pump operating temperature and the heat pump operating frequency;

[0007] The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain a heat pump control result.

[0008] In a possible implementation of the present application, the target pressure state includes a cooling high pressure state, a cooling low pressure state, a heating high pressure state, and a heating low pressure state;

[0009] The step of determining the target saturation temperature of the target heat pump corresponding to the target pressure state according to the heat pump operating temperature and the heat pump operating frequency includes:

[0010] Obtaining the outer ring temperature corresponding to the target heat pump, and calculating the first target saturation temperature corresponding to the refrigeration high pressure state according to the heat pump condensing temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature;

[0011] and / or, calculating a second target saturation temperature corresponding to the refrigeration low pressure state according to the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operation frequency in the heat pump operation temperature;

[0012] and / or, calculating a third target saturation temperature corresponding to the heating high pressure state according to the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operation frequency in the heat pump operation temperature;

[0013] And / or, a fourth target saturation temperature corresponding to the heating low-pressure state is calculated according to the heat pump condensing temperature, the compressor return air temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature.

[0014] In a possible implementation of the present application, the calculating the first target saturation temperature corresponding to the refrigeration high pressure state according to the heat pump condensing temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature includes:

[0015] Obtaining a first simulation coefficient and a second simulation coefficient corresponding to the refrigeration high pressure state;

[0016] Adjust the outer ring temperature according to the first simulation coefficient to obtain a first outer ring temperature, and adjust the heat pump operating frequency according to the second simulation coefficient to obtain a first operating frequency;

[0017] The first target saturation temperature is calculated according to the heat pump condensing temperature, the first outer loop temperature, and the first operating frequency.

[0018] In a possible implementation of the present application, the calculating the second target saturation temperature corresponding to the refrigeration low pressure state according to the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operation frequency in the heat pump operation temperature includes:

[0019] Obtaining a third simulation coefficient and a fourth simulation coefficient corresponding to the refrigeration low-pressure state;

[0020] Determine the target refrigerant temperature according to the refrigerant liquid pipe temperature and the refrigerant gas pipe temperature in the heat pump refrigerant temperature, and the compressor return air temperature;

[0021] Calculating the average temperature of the cooling water circuit according to the cooling water inlet temperature and the cooling water outlet temperature in the cooling water circuit temperature;

[0022] A second target saturation temperature is calculated according to the target refrigerant temperature, the third simulation coefficient, the average temperature of the refrigeration water circuit, the heat pump operation frequency and the fourth simulation coefficient.

[0023] In a possible implementation of the present application, the calculating the third target saturation temperature corresponding to the heating high pressure state according to the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operation frequency in the heat pump operation temperature includes:

[0024] Obtaining a fifth simulation coefficient and a sixth simulation coefficient corresponding to the heating high pressure state;

[0025] Calculating the average temperature of the hot water circuit according to the heating water inlet temperature and the heating water outlet temperature in the hot water circuit temperature;

[0026] The third target saturation temperature is calculated according to the refrigerant liquid pipe temperature, the hot water circuit average temperature, the fifth simulation coefficient, the sixth simulation coefficient and the heat pump operation frequency.

[0027] In a possible implementation of the present application, the fourth target saturation temperature corresponding to the heating low pressure state is calculated according to the heat pump condensing temperature, the compressor return air temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature, including:

[0028] Obtaining a seventh simulation coefficient and an eighth simulation coefficient corresponding to the heating low-pressure state;

[0029] Determining a target heating refrigerant pipeline temperature according to the heat pump condensing temperature and the compressor return air temperature;

[0030] A fourth target saturation temperature is calculated according to the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient and the heat pump operation frequency.

[0031] In a possible implementation of the present application, adjusting the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain a heat pump control result includes:

[0032] If the heat pump operation state of the target heat pump is the heating operation state, and the third target saturation temperature of the target heat pump is greater than the first temperature threshold, the compressor speed and the fan speed of the target heat pump are reduced according to the heating high pressure adjustment strategy to obtain a first heat pump control result;

[0033] If the heat pump operation state of the target heat pump is the heating operation state, and the third target saturation temperature of the target heat pump is lower than the second temperature threshold, the compressor speed and the fan speed of the target heat pump are increased or decreased according to the heating high pressure strategy to obtain a second heat pump control result.

[0034] On the other hand, the present application provides a heat pump control device, the heat pump control device comprising:

[0035] a parameter acquisition module, configured to respond to a heat pump control request for a target heat pump and acquire a heat pump operating temperature and a heat pump operating frequency of the target heat pump;

[0036] a parameter conversion module, configured to determine a target saturation temperature corresponding to the target heat pump at a target pressure state according to the heat pump operating temperature and the heat pump operating frequency;

[0037] The heat pump control module is configured to adjust the heat pump operation parameters of the target heat pump based on the target saturation temperature to obtain a heat pump control result.

[0038] On the other hand, the present application also provides a heat pump control device, the heat pump control device comprising:

[0039] one or more processors;

[0040] Memory; and

[0041] One or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the processor to implement the steps of the heat pump control method.

[0042] On the other hand, the present application also provides a computer-readable storage medium on which a computer program is stored. The computer program is loaded by a processor to execute the steps in the heat pump control method.

[0043] In the present application, the heat pump operating temperature and heat pump operating frequency of the target heat pump are obtained by responding to the heat pump control request for the target heat pump; the target saturation temperature corresponding to the target heat pump in the target pressure state is determined according to the heat pump operating temperature and the heat pump operating frequency; the heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain the heat pump control result. It is achieved that there is no need to use a pressure sensor in the heat pump operation, and the target saturation temperature corresponding to the target heat pump in the target pressure state of each operating condition is simulated by the heat pump operating parameters and the heat pump operating frequency, and the target heat pump is adjusted by the target saturation temperature, so as to reduce the operating cost of the heat pump system and improve the operating stability of the heat pump system. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0045] Figure 1 A schematic diagram of a heat pump control method according to an embodiment of the present application;

[0046] Figure 2 A schematic flow chart of an embodiment of a heat pump control method in an embodiment of the present application;

[0047] Figure 3A schematic diagram of the structure of an embodiment of a target heat pump in a heat pump control method provided in an embodiment of the present application;

[0048] Figure 4 A schematic flow chart of an embodiment of determining a target saturation temperature corresponding to a heating low-pressure state in a heat pump control method provided in an embodiment of the present application;

[0049] Figure 5 A schematic diagram of the structure of an embodiment of a heat pump control device provided in an embodiment of the present application;

[0050] Figure 6 A schematic structural diagram of an embodiment of a heat pump control device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0052] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0053] In this application, the word "exemplary" is used to mean "serving as an example, illustration, or illustration." Any embodiment described in this application as "exemplary" is not necessarily to be construed as being preferred or advantageous over other embodiments. The following description is given to enable any person skilled in the art to implement and use the invention. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the invention can be implemented without using these specific details. In other instances, well-known structures and processes are not elaborated in detail to avoid obscuring the description of the invention with unnecessary details. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in this application.

[0054] At present, with the rapid development of heat pump technology, more and more users use air energy heat pumps for cooling or heating to meet the user's temperature regulation needs. In order to control the operation of the system and protect the reliable operation of the system, the existing heat pump system needs to install corresponding pressure sensors on the high-pressure side and the low-pressure side of the system for monitoring. The use of pressure sensors will increase the cost of heat pumps and increase the quality risks of heat pumps, such as abnormal operation of heat pumps due to failure of pressure sensors and leakage of heat pump refrigerant due to pipeline rupture.

[0055] Based on this, the present application proposes a heat pump control method, device, equipment and computer-readable storage medium to solve the technical problem in the prior art that the use of pressure sensor monitoring in heat pump systems leads to increased costs and increased heat pump quality risks.

[0056] The heat pump control method in the embodiment of the present invention is applied to a heat pump control device, and the heat pump control device is arranged in a heat pump control device. The heat pump control device is provided with one or more processors, memories, and one or more applications, wherein the one or more applications are stored in the memories and are configured to be executed by the processor to implement the heat pump control method; wherein the heat pump control device can be the heat pump master control of the target heat pump itself. In addition, the heat pump control device can also be an intelligent terminal for controlling the target heat pump, for example, the heat pump control device can also be a mobile phone, a tablet computer, a network device, a heat pump master control and a smart computer, etc.

[0057] like Figure 1 As shown, Figure 1The schematic diagram of the heat pump control method of the embodiment of the present application is shown in FIG. The heat pump control scene in the embodiment of the present invention includes a heat pump control device 100 (a heat pump control device is integrated in the heat pump control device 100) and a target heat pump 200. A computer-readable storage medium corresponding to the heat pump control method is run in the heat pump control device 100 to execute the steps of the heat pump control method. The target heat pump 200 is an air energy heat pump or other heat pump that is connected to the heat pump control device 100 for temperature control of a designated indoor area.

[0058] Understandably, Figure 1 The heat pump control equipment in the heat pump control method scenario shown, or the devices included in the heat pump control equipment, does not constitute a limitation on the embodiments of the present invention, that is, the number of devices and types of devices of the heat pump control equipment included in the heat pump control method scenario, or the number of devices and types of devices included in each device, do not affect the overall implementation of the technical solution in the embodiments of the present invention, and can all be regarded as equivalent replacements or derivatives of the technical solution claimed to be protected in the embodiments of the present invention.

[0059] The heat pump control device 100 in the embodiment of the present invention is mainly used to: respond to a heat pump control request for a target heat pump, and obtain a heat pump operating temperature and a heat pump operating frequency of the target heat pump;

[0060] Determining a target saturation temperature of the target heat pump corresponding to a target pressure state according to the heat pump operating temperature and the heat pump operating frequency;

[0061] The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain a heat pump control result.

[0062] The embodiments of the present application provide a heat pump control method, device, equipment and computer-readable storage medium, which are described in detail below.

[0063] It can be understood by those skilled in the art that Figure 1 The application environment shown in is only one of the application scenarios related to the present application solution and does not constitute a limitation on the application scenario of the present application solution. Other application environments may also include Figure 1 More or fewer heat pump control devices, or heat pump control network connections, are shown, for example Figure 1 Only one heat pump control device is shown. It can be understood that the scenario of the heat pump control method can also include one or more heat pump control devices, which are not specifically limited here. The heat pump control device 100 can also include a memory for storing operating parameters and other data.

[0064] It should be noted that Figure 1The scenario diagram of the heat pump control method shown is only an example. The scenario of the heat pump control method described in the embodiment of the present invention is to more clearly illustrate the technical solution of the embodiment of the present invention, and does not constitute a limitation on the technical solution provided by the embodiment of the present invention.

[0065] Based on the scenario of the above heat pump control method, various embodiments of the heat pump control method disclosed in the present invention are proposed.

[0066] like Figure 2 As shown, Figure 2 This is a flow chart of an embodiment of a heat pump control method in an embodiment of the present application. The heat pump control method includes the following steps 201 to 203:

[0067] 201. Responding to a heat pump control request for a target heat pump, obtaining a heat pump operating temperature and a heat pump operating frequency of the target heat pump;

[0068] The heat pump control method in this embodiment is applied to a heat pump control device, and the type and quantity of the heat pump control device are not specifically limited, that is, the heat pump control device can be a target heat pump and a heat pump main control module of the target heat pump itself. Optionally, the heat pump control device can also be an intelligent terminal that is connected to the target heat pump for controlling the operating state of the target heat pump. For example, the heat pump control device can also be an intelligent terminal such as a heat pump remote controller, a mobile phone, a tablet computer, and a smart computer. In a specific embodiment, the heat pump control device is a heat pump main control corresponding to the target heat pump. Among them, the target heat pump is a heat pump device that can adjust the temperature of a specified area.

[0069] Specifically, since setting a pressure sensor in the target heat pump will increase the hardware costs such as pressure sensor, pipeline and electronic control, and may increase stability issues such as pressure sensor failure, pipeline rupture and system refrigerant leakage. Therefore, in order to reduce the hardware cost of the target heat pump and improve the operating stability of the target heat pump, when the target heat pump device is not provided with a pressure sensor or the pressure sensor in the target heat pump is in a faulty state, the heat pump control device can simulate the target saturation temperature corresponding to different target pressure states, and then adjust the heat pump operating parameters of the target heat pump according to the target saturation temperature to obtain the heat pump operating results, thereby simulating the system operating pressure parameters using the heat pump operating temperature of the target heat pump, and then not using a pressure sensor in the target heat pump, reducing the cost of the target heat pump and improving the system operating stability.

[0070] Specifically, during operation, the heat pump control device responds to a heat pump control request for a target heat pump, wherein the heat pump control request is a control instruction for driving the heat pump control device to simulate a target saturation temperature corresponding to a target pressure state according to the heat pump operating temperature and heat pump operating efficiency of the target heat pump, and to control the operation of the target heat pump through the target saturation temperature. The heat pump control request may be triggered when a pressure sensor is not installed in the target heat pump, and may also be triggered when a pressure sensor is installed in the target heat pump and the pressure sensor fails.

[0071] Specifically, after receiving the heat pump control request for the target heat pump, the heat pump control device obtains the heat pump operating temperature and heat pump operating frequency of the target heat pump. The heat pump operating temperature is the temperature parameter corresponding to each component of the target heat pump system during the operation of the target heat pump. The heat pump operating frequency is the compressor operating frequency of the compressor that characterizes the target heat pump during the operation.

[0072] Optionally, the heat pump operating temperature includes at least the heat pump condensing temperature, the heat pump refrigerant temperature, the refrigeration water circuit temperature and the compressor return air temperature, which are operating temperatures corresponding to when the target heat pump is in operation.

[0073] The heat pump condensing temperature is a temperature parameter corresponding to the condenser inlet temperature or the condenser outlet temperature when the target heat pump is running. When the target heat pump is in the heating state, the heat pump condensing temperature is the condensing inlet temperature. When the target heat pump is in the cooling state, the heat pump condensing temperature is the refrigerant outlet temperature.

[0074] The heat pump refrigerant temperature is a temperature parameter corresponding to the refrigerant gas pipe temperature and the refrigerant liquid pipe temperature of the water module in the target heat pump. In a specific embodiment, the heat pump refrigerant temperature includes the refrigerant liquid pipe temperature and the refrigerant gas pipe temperature.

[0075] The refrigeration water circuit temperature is an operating temperature parameter corresponding to the water inlet temperature and the water outlet temperature of the water module when the target heat pump is operating in the refrigeration state. In a specific embodiment, the refrigeration water circuit temperature includes the refrigeration water inlet temperature and the refrigeration water outlet temperature.

[0076] The compressor return air temperature is a return air temperature of the target heat pump compressor when the target heat pump is running.

[0077] The operating temperature of the heat pump can be detected by a temperature sensing package or a temperature sensor set in the corresponding heat pump area of ​​the target heat pump, such as Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of an embodiment of a target heat pump in the heat pump control method provided in the embodiment of the present application. Figure 3It can be seen that the heat pump operating parameters can be collected through the water inlet temperature sensing package, water outlet temperature sensing package, gas pipe temperature sensing package, liquid pipe temperature sensing package, exhaust temperature sensor and return air temperature sensor when the target heat pump is running.

[0078] 202. Determine a target saturation temperature corresponding to a target pressure state of the target heat pump according to the heat pump operating temperature and the heat pump operating frequency;

[0079] Specifically, after obtaining the heat pump operating temperature and the heat pump operating frequency, the heat pump control device also simulates the target saturation temperature corresponding to the target pressure state according to the heat pump operating temperature and the heat pump operating frequency, thereby realizing state control of the target heat pump without using a pressure sensor. The target saturation temperature is a saturation state temperature that indicates that the refrigerant of the target heat pump reaches equilibrium at a specific pressure under the corresponding target pressure state.

[0080] The target pressure state includes a cooling high pressure state, a cooling low pressure state, a heating high pressure state and a heating low pressure state. Different target pressure states represent that the target heat pump is operating at different high pressures or different low pressures.

[0081] For example, the refrigeration high pressure state is information representing the pressure value in the high pressure state generated by the compressor during the target heat pump refrigeration process.

[0082] The refrigeration low-pressure state is information on a pressure value representing a low-pressure state generated by the compressor during the target heat pump refrigeration process.

[0083] The heating high pressure state is information representing the pressure value under the high pressure state generated by the compressor during the heating process of the target heat pump.

[0084] The heating low-pressure state is information on a pressure value representing a low-pressure state generated by the compressor during the target heating process.

[0085] Specifically, the heat pump control device obtains the outer loop temperature corresponding to the target heat pump, wherein the outer loop temperature is an outdoor ambient temperature representing the operating area of ​​the target heat pump.

[0086] Specifically, after obtaining the outer ring temperature, the heat pump operating temperature and the heat pump operating frequency, the heat pump control device also calculates the first target saturation temperature corresponding to the target heat pump in the refrigeration high-pressure state according to the heat pump condensing temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature.

[0087] Specifically, the heat pump control device also sets simulation coefficients according to different target pressure states and different heat pump models. For example, the first simulation coefficient and the second simulation coefficient corresponding to the target heat pump are set in the refrigeration high pressure state, and when simulating the refrigeration high pressure state, the first simulation coefficient and the second simulation coefficient are used to adjust the outer ring temperature and the heat pump operation frequency. In a specific embodiment, the first simulation coefficient is -0.05 and the second simulation coefficient is 0.18. The values ​​of each simulation coefficient can be customized according to the actual scene requirements.

[0088] Specifically, when simulating the first target saturation temperature corresponding to the high-pressure state of refrigeration, the heat pump control device obtains the first simulation coefficient and the second simulation coefficient corresponding to the command high-pressure state. Furthermore, the outer ring temperature is adjusted according to the first simulation coefficient to obtain the first outer ring temperature, and the heat pump operating frequency is adjusted according to the second simulation coefficient to obtain the first operating frequency, that is, the heat pump control device calculates the product of the first simulation coefficient and the outer ring temperature to obtain the first outer ring temperature. The product between the second simulation coefficient and the heat pump operating frequency is calculated to obtain the first operating frequency.

[0089] Specifically, after obtaining the first outer ring temperature and the first operating frequency, the heat pump control device calculates the sum of the heat pump condensation temperature, the first outer ring temperature and the first operating frequency to obtain the first target saturation temperature corresponding to the target heat pump in the refrigeration high pressure state. Specifically, the calculation formula of the first target saturation temperature is as follows:

[0090] T1=T df +C1*T env +C2*F;

[0091] Where T1 is the first target saturation temperature, T df is the heat pump condensing temperature, C1 is the first simulation coefficient, C2 is the second simulation coefficient, and F is the heat pump operating frequency.

[0092] Optionally, the heat pump control device can also calculate a second target saturation temperature corresponding to the target heat pump in the refrigeration low-pressure state according to the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operating frequency in the heat pump operating temperature.

[0093] That is, the heat pump control device obtains the third simulation coefficient and the fourth simulation coefficient pre-set for the target heat pump under the refrigeration low pressure state. In the subsequent steps, the third simulation coefficient is used to adjust the average temperature of the refrigeration water circuit, and the fourth simulation coefficient is used to adjust the operating frequency of the heating pump. In a specific embodiment, the third simulation coefficient is -0.02 and the fourth simulation coefficient is -0.002.

[0094] The heat pump control device also determines the target refrigerant temperature based on the refrigerant liquid pipe temperature and the refrigerant gas pipe temperature in the heat pump refrigerant temperature, and the compressor return air temperature, wherein the target refrigerant temperature is the lowest temperature in the refrigerant pipeline. That is, the heat pump control device obtains the refrigerant liquid pipe temperature and the refrigerant gas pipe temperature in the heat pump refrigerant temperature, and the compressor return air temperature, compares the refrigerant liquid pipe temperature and the refrigerant gas pipe temperature in the heat pump refrigerant temperature, and the compressor return air temperature, determines the minimum temperature value between the heat pump refrigerant temperature and the compressor return air temperature, and determines the minimum temperature value as the target refrigerant temperature.

[0095] Specifically, the heat pump control device also calculates the average refrigeration water circuit temperature of the target heat pump according to the refrigeration water inlet temperature and the refrigeration water outlet temperature in the command water circuit temperature, wherein the average refrigeration water circuit temperature is the average temperature of the refrigeration water circuit pipeline that characterizes the current operating state of the target heat pump. That is, the heat pump control device calculates the average temperature of the refrigeration water inlet temperature and the refrigeration water outlet temperature to obtain the average refrigeration water circuit temperature.

[0096] Specifically, after obtaining the target refrigerant temperature and the average temperature of the refrigeration water circuit, the heat pump control device also calculates the second target saturation temperature corresponding to the target heat pump in the refrigeration low-pressure state according to the target refrigerant temperature, the third simulation coefficient, the average temperature of the refrigeration water circuit, the heat pump operating frequency and the fourth simulation coefficient. That is, the heat pump control device uses the third simulation coefficient to adjust the average temperature of the refrigeration water circuit to obtain the adjusted average temperature of the refrigeration water circuit, and uses the fourth simulation coefficient to adjust the operating frequency of the heat pump to obtain the second operating frequency. And calculate the sum of the target refrigerant temperature, the adjusted average temperature of the refrigeration water circuit and the second operating frequency to obtain the second target saturation temperature corresponding to the target heat pump in the refrigeration low-pressure state. Specifically, the calculation of the second target saturation temperature is shown as follows:

[0097] T2=MIN(T L ,T G ,T s )+C3*AVE(T in ,T out )+C4*F;

[0098] Where T2 is the second target saturation temperature, MIN(T L ,T G ,T s ) is the target refrigerant temperature, C3 is the third simulation coefficient, AVE(T in ,T out ) is the average temperature of the cooling water circuit, C4 is the fourth simulation coefficient, and F is the operating frequency of the heat pump.

[0099] Optionally, the heat pump control device can also calculate a third target saturation temperature corresponding to the target heat pump in the heating high-pressure state according to the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operating frequency in the heat pump operating temperature.

[0100] That is, the heat pump control device obtains the fifth simulation coefficient and the sixth simulation coefficient of the target heat pump pre-set in the heating high pressure state. In the subsequent steps, the fifth simulation coefficient is used to adjust the average temperature of the hot water circuit, and the sixth simulation coefficient is used to adjust the heat pump operation frequency. In a specific embodiment, the fifth simulation coefficient is -0.05, and the sixth simulation coefficient is 0.13.

[0101] Specifically, after obtaining the hot water circuit temperature, the heat pump control device also calculates the hot water circuit average temperature according to the heating water inlet temperature and the heating water outlet temperature in the hot water circuit temperature. The hot water circuit average temperature is the average temperature of the hot water circuit pipeline that represents the current operating state of the target heat pump. That is, the heat pump control device calculates the average temperature of the heating water inlet temperature and the heating water outlet temperature to obtain the hot water circuit average temperature.

[0102] Specifically, after obtaining the average temperature of the hot water circuit, the heat pump control device calculates the third target saturation temperature according to the refrigerant liquid pipe temperature, the average temperature of the hot water circuit, the fifth simulation coefficient, the sixth simulation coefficient and the heat pump operating frequency. That is, the heat pump control device adjusts the average temperature of the hot water circuit by using the fifth simulation coefficient to obtain the adjusted average temperature of the hot water circuit, and adjusts the operating frequency of the heat pump by using the sixth simulation coefficient to obtain the third operating frequency, and then calculates the sum of the refrigerant liquid pipe temperature, the adjusted average temperature of the hot water circuit and the third operating frequency to obtain the third target saturation temperature corresponding to the target heat pump in the heating high pressure state. Specifically, the calculation formula for the third target saturation temperature is as follows:

[0103] T3=T L +C5*AVE(T in ,T out )+C6*F;

[0104] Wherein, T3 is the third target saturation temperature, T L is the refrigerant liquid pipe temperature, AVE(T in ,T out ) is the average temperature of the hot water circuit, F is the operating frequency of the heat pump, C5 is the fifth simulation coefficient, and C6 is the sixth simulation coefficient.

[0105] Optionally, in another specific embodiment, the heat pump control device can also calculate the fourth target saturation temperature corresponding to the target heat pump in the heating low-pressure state based on the heat pump condensing temperature, compressor return air temperature, external loop temperature and heat pump operating frequency in the heat pump operating temperature.

[0106] 203. Adjust a heat pump operating parameter of the target heat pump based on the target saturation temperature to obtain a heat pump control result.

[0107] Specifically, after obtaining the target saturation temperature corresponding to different target pressure states, the heat pump control device also uses the target saturation temperature instead of the heat pump operating pressure value to adjust the heat pump operating parameters of the target heat pump to obtain a heat pump control result.

[0108] Optionally, the heat pump control device can adjust the compressor speed of the target heat pump according to the numerical value and change of the target saturation temperature to improve the refrigerant flow and compression efficiency of the target heat pump.

[0109] Optionally, the heat pump control device can also adjust the expansion valve opening of the target heat pump according to the numerical value and change of the target saturation temperature, so as to increase the refrigerant flow rate and evaporation efficiency of the target heat pump.

[0110] Optionally, the heat pump control device can also adjust the fan speed of the target heat pump according to the numerical value and changes of the target saturation temperature, thereby increasing the heat dissipation efficiency and condensation effect of the target heat pump.

[0111] Optionally, in other embodiments, the heat pump control device can also adjust other heat pump operating parameters of the target heat pump according to the target saturation temperature to improve the heat pump operating effect of the target heat pump.

[0112] For example, in a specific embodiment, when the heat pump operating state of the target heat pump is the heating operating state, the heat pump control device can make corresponding adjustments to the target heat pump based on the comparison results of the third saturation temperature of the target heat pump and the preset first temperature threshold and second temperature threshold to improve the heat pump operating effect of the target heat pump.

[0113] That is, if the third target saturation temperature of the target heat pump is greater than the first temperature threshold, the compressor speed and fan speed of the target heat pump are reduced according to the heating high pressure adjustment strategy, and closing or opening the expansion valve is prohibited to obtain the first heat pump control result.

[0114] If the third target saturation temperature of the target heat pump is lower than the first temperature threshold, the compressor speed and fan speed of the target heat pump are increased according to the heating high pressure adjustment strategy, and the expansion valve is prohibited from being opened or closed to obtain the second heat pump control result.

[0115] In this embodiment, the heat pump control device obtains the heat pump operating temperature and heat pump operating frequency of the target heat pump by responding to the heat pump control request for the target heat pump; determines the target saturation temperature corresponding to the target heat pump in the target pressure state according to the heat pump operating temperature and the heat pump operating frequency; adjusts the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result. It is achieved that there is no need to use a pressure sensor in the heat pump operation, by obtaining each heat pump operating parameter in the target heat pump and the heat pump operating frequency of the target heat pump, the target saturation temperature corresponding to the target heat pump in the target pressure state of each operating condition is simulated by the heat pump operating parameters and the heat pump operating frequency, and the target heat pump is adjusted according to the target saturation temperature, thereby reducing the operating cost of the heat pump system and improving the operating stability of the heat pump system.

[0116] like Figure 4 As shown, Figure 4 This is a flow chart of an embodiment of determining the target saturation temperature corresponding to the heating low-pressure state in the heat pump control method provided in the embodiment of the present application. Specifically, in this embodiment, the heat pump control method further includes steps 301 to 303:

[0117] 301. Obtain a seventh simulation coefficient and an eighth simulation coefficient corresponding to the heating low-pressure state;

[0118] 302. Determine a target heating refrigerant pipeline temperature according to the heat pump condensing temperature and the compressor return air temperature;

[0119] 303. Calculate a fourth target saturation temperature according to the target heating refrigerant pipeline temperature, the seventh simulation coefficient of the outer ring temperature, the eighth simulation coefficient and the heat pump operation frequency.

[0120] Specifically, in this embodiment, the heat pump control device can also calculate the fourth target saturation temperature corresponding to the target heat pump in the heating low-pressure state according to the heat pump condensing temperature, compressor return air temperature, outer ring temperature and heat pump operating frequency in the heat pump operating temperature.

[0121] Specifically, the heat pump control device obtains the seventh simulation coefficient and the eighth simulation coefficient preset for the target heat pump in the heating low-pressure state. In a specific embodiment, the value of the seventh simulation coefficient is -0.02, and the value of the eighth simulation coefficient is -0.02.

[0122] Specifically, the heat pump control device also determines the target heating refrigerant temperature according to the heat pump condensing temperature and the compressor return air temperature of the target heat pump, wherein the target heating refrigerant temperature is the lowest temperature of the heating refrigerant pipeline of the target heat pump when heating. That is, after obtaining the heat pump condensing temperature and the compressor return air temperature of the target heat pump, the heat pump control device compares the heat pump condensing temperature and the compressor return air temperature, and sets the smaller temperature between the heat pump condensing temperature and the compressor return air temperature as the target heating refrigerant temperature.

[0123] Specifically, after determining the target heating refrigerant temperature, the heat pump control device also calculates the fourth target saturation temperature according to the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient and the heat pump operation frequency. That is, the heat pump control device uses the seventh simulation coefficient to adjust the outer ring temperature to obtain the adjusted outer ring temperature, and uses the eighth simulation coefficient to adjust the heat pump operation frequency to obtain the fourth operation frequency, and calculates the sum of the target heating refrigerant pipeline temperature, the adjusted outer ring temperature and the fourth operation frequency to obtain the fourth target saturation temperature of the target heat pump in the heating low pressure state. Specifically, the calculation formula of the fourth target saturation temperature is as follows:

[0124] T4=MIN(T df ,T s )+C7*T env +C8*F;

[0125] Wherein, T4 is the fourth target saturation temperature, MIN(T df ,T s ) is the target heating refrigerant temperature, T env is the outer ring temperature, F is the heat pump operating frequency, C7 is the seventh simulation coefficient, and C8 is the eighth simulation coefficient.

[0126] Specifically, after determining the fourth target saturation temperature of the target heat pump in the heating low-pressure state, the heat pump control device also uses the fourth target saturation temperature to control the heat pump operating parameters of the target heat pump, thereby obtaining a heat pump control result.

[0127] In this embodiment, the heat pump control device obtains the seventh simulation coefficient and the eighth simulation coefficient corresponding to the heating low-pressure state; determines the target heating refrigerant pipeline temperature according to the heat pump condensing temperature and the compressor return air temperature; and calculates the fourth target saturation temperature according to the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient and the heat pump operation frequency. It is realized that the fourth target saturation temperature of the target heat pump in the heating low-pressure state is calculated according to the heat pump operation temperature of the target heat pump without setting a pressure sensor, providing a control basis for the subsequent adjustment of the operation state of the target heat pump, reducing the heat pump cost of the target heat pump, and improving the operation stability of the heat pump.

[0128] In order to better implement the heat pump control method in the embodiment of the present application, based on the heat pump control method, a heat pump control device is also provided in the embodiment of the present application, such as Figure 5 As shown, Figure 5 This is a schematic diagram of the structure of a heat pump control device provided in an embodiment of the present application. Specifically, the heat pump control device 400 includes:

[0129] The parameter acquisition module 401 is configured to respond to a heat pump control request for a target heat pump and acquire a heat pump operating temperature and a heat pump operating frequency of the target heat pump;

[0130] A parameter conversion module 402 is configured to determine a target saturation temperature corresponding to the target heat pump at a target pressure state according to the heat pump operating temperature and the heat pump operating frequency;

[0131] The heat pump control module 403 is configured to adjust the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain a heat pump control result.

[0132] In a possible implementation of this embodiment, the heat pump control device determines the target saturation temperature corresponding to the target heat pump in the target pressure state according to the heat pump operating temperature and the heat pump operating frequency, including:

[0133] Obtaining the outer ring temperature corresponding to the target heat pump, and calculating the first target saturation temperature corresponding to the refrigeration high pressure state according to the heat pump condensing temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature;

[0134] and / or, calculating a second target saturation temperature corresponding to the refrigeration low pressure state according to the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operation frequency in the heat pump operation temperature;

[0135] and / or, calculating a third target saturation temperature corresponding to the heating high pressure state according to the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operation frequency in the heat pump operation temperature;

[0136] And / or, a fourth target saturation temperature corresponding to the heating low-pressure state is calculated according to the heat pump condensing temperature, the compressor return air temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature.

[0137] In a possible implementation of this embodiment, the heat pump control device calculates the first target saturation temperature corresponding to the refrigeration high pressure state according to the heat pump condensing temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature, including:

[0138] Obtaining a first simulation coefficient and a second simulation coefficient corresponding to the refrigeration high pressure state;

[0139] Adjust the outer ring temperature according to the first simulation coefficient to obtain a first outer ring temperature, and adjust the heat pump operating frequency according to the second simulation coefficient to obtain a first operating frequency;

[0140] The first target saturation temperature is calculated according to the heat pump condensing temperature, the first outer loop temperature, and the first operating frequency.

[0141] In a possible implementation of this embodiment, the heat pump control device calculates the second target saturation temperature corresponding to the refrigeration low pressure state according to the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operation frequency in the heat pump operation temperature, including:

[0142] Obtaining a third simulation coefficient and a fourth simulation coefficient corresponding to the refrigeration low-pressure state;

[0143] Determine the target refrigerant temperature according to the refrigerant liquid pipe temperature and the refrigerant gas pipe temperature in the heat pump refrigerant temperature, and the compressor return air temperature;

[0144] Calculating the average temperature of the cooling water circuit according to the cooling water inlet temperature and the cooling water outlet temperature in the cooling water circuit temperature;

[0145] A second target saturation temperature is calculated according to the target refrigerant temperature, the third simulation coefficient, the average temperature of the refrigeration water circuit, the heat pump operation frequency and the fourth simulation coefficient.

[0146] In a possible implementation of this embodiment, the heat pump control device calculates the third target saturation temperature corresponding to the heating high pressure state according to the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operation frequency in the heat pump operation temperature, including:

[0147] Obtaining a fifth simulation coefficient and a sixth simulation coefficient corresponding to the heating high pressure state;

[0148] Calculating the average temperature of the hot water circuit according to the heating water inlet temperature and the heating water outlet temperature in the hot water circuit temperature;

[0149] The third target saturation temperature is calculated according to the refrigerant liquid pipe temperature, the hot water circuit average temperature, the fifth simulation coefficient, the sixth simulation coefficient and the heat pump operation frequency.

[0150] In a possible implementation of this embodiment, the heat pump control device calculates the fourth target saturation temperature corresponding to the heating low pressure state according to the heat pump condensing temperature, the compressor return air temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature, including:

[0151] Obtaining a seventh simulation coefficient and an eighth simulation coefficient corresponding to the heating low-pressure state;

[0152] Determining a target heating refrigerant pipeline temperature according to the heat pump condensing temperature and the compressor return air temperature;

[0153] A fourth target saturation temperature is calculated according to the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient and the heat pump operation frequency.

[0154] In a possible implementation of this embodiment, the heat pump control device adjusts the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain a heat pump control result, including:

[0155] If the heat pump operation state of the target heat pump is the heating operation state, and the third target saturation temperature of the target heat pump is greater than the first temperature threshold, the compressor speed and the fan speed of the target heat pump are reduced according to the heating high pressure adjustment strategy to obtain a first heat pump control result;

[0156] If the heat pump operation state of the target heat pump is the heating operation state, and the third target saturation temperature of the target heat pump is lower than the second temperature threshold, the compressor speed and the fan speed of the target heat pump are increased or decreased according to the heating high pressure strategy to obtain a second heat pump control result.

[0157] In this embodiment, the heat pump control device obtains the heat pump operating temperature and heat pump operating frequency of the target heat pump by responding to the heat pump control request for the target heat pump; determines the target saturation temperature corresponding to the target heat pump in the target pressure state according to the heat pump operating temperature and the heat pump operating frequency; adjusts the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain the heat pump control result. It is achieved that there is no need to use a pressure sensor in the heat pump operation, by obtaining each heat pump operating parameter in the target heat pump and the heat pump operating frequency of the target heat pump, the target saturation temperature corresponding to the target heat pump in the target pressure state of each operating condition is simulated by the heat pump operating parameters and the heat pump operating frequency, and the target heat pump is adjusted according to the target saturation temperature, thereby reducing the operating cost of the heat pump system and improving the operating stability of the heat pump system.

[0158] The embodiment of the present invention also provides a heat pump control device, such as Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of an embodiment of a heat pump control device provided in an embodiment of the present application.

[0159] The heat pump control device integrates any one of the heat pump control devices provided in the embodiments of the present invention, and the heat pump control device includes:

[0160] one or more processors;

[0161] Memory; and

[0162] One or more applications, wherein the one or more applications are stored in the memory and are configured to cause the processor to execute the steps of the heat pump control method described in any of the above heat pump control method embodiments.

[0163] Specifically, the heat pump control device may include one or more processors 501 of processing cores, one or more computer-readable storage media memories 502, a power supply 503, an input unit 504 and other components. Those skilled in the art will understand that Figure 5 The heat pump control device structure shown in the figure does not constitute a limitation on the heat pump control device, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0164] The processor 501 is the control center of the heat pump control device. It uses various interfaces and lines to connect various parts of the entire heat pump control device. By running or executing software programs and / or modules stored in the memory 502, and calling data stored in the memory 502, it performs various functions of the heat pump control device and processes data, thereby monitoring the heat pump control device as a whole. Optionally, the processor 501 may include one or more processing cores; preferably, the processor 501 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 501.

[0165] The memory 502 can be used to store software programs and modules. The processor 501 executes various functional applications and data processing by running the software programs and modules stored in the memory 502. The memory 502 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area may store data created according to the use of the heat pump control device, etc. In addition, the memory 502 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 may also include a memory controller to provide the processor 501 with access to the memory 502.

[0166] The heat pump control device also includes a power supply 503 for supplying power to each component. Preferably, the power supply 503 can be logically connected to the processor 501 through a power management system, so as to manage charging, discharging, and power consumption through the power management system. The power supply 503 can also include any components such as one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, and power status indicators.

[0167] The heat pump control device may further include an input unit 504, which may be used to receive input digital or character information and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.

[0168] Although not shown, the heat pump control device may further include a display unit, etc., which will not be described in detail herein. Specifically in this embodiment, the processor 501 in the heat pump control device will load the executable files corresponding to the processes of one or more application programs into the memory 502 according to the following instructions, and the processor 501 will run the application programs stored in the memory 502, thereby realizing various functions, as follows:

[0169] In response to a heat pump control request for a target heat pump, obtaining a heat pump operating temperature and a heat pump operating frequency of the target heat pump;

[0170] Determining a target saturation temperature of the target heat pump corresponding to a target pressure state according to the heat pump operating temperature and the heat pump operating frequency;

[0171] The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain a heat pump control result.

[0172] To this end, an embodiment of the present invention provides a computer-readable storage medium, which may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc. A computer program is stored thereon, and the computer program is loaded by a processor to execute the steps in any heat pump control method provided in an embodiment of the present invention. For example, the computer program can be loaded by a processor to execute the following steps:

[0173] In response to a heat pump control request for a target heat pump, obtaining a heat pump operating temperature and a heat pump operating frequency of the target heat pump;

[0174] Determining a target saturation temperature of the target heat pump corresponding to a target pressure state according to the heat pump operating temperature and the heat pump operating frequency;

[0175] The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain a heat pump control result.

[0176] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the detailed description of other embodiments above, and will not be repeated here.

[0177] In specific implementation, the above units or structures can be implemented as independent entities, or can be arbitrarily combined to be implemented as the same or several entities. The specific implementation of the above units or structures can refer to the previous method embodiments, which will not be repeated here.

[0178] The specific implementation of the above operations can be found in the previous embodiments, which will not be described in detail here.

[0179] The above is a detailed introduction to a heat pump control method provided in an embodiment of the present application. Specific embodiments are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A heat pump control method, characterized in that: The heat pump control method comprises: In response to a heat pump control request for a target heat pump, obtaining a heat pump operating temperature and a heat pump operating frequency of the target heat pump; Determining a target saturation temperature of the target heat pump corresponding to a target pressure state according to the heat pump operating temperature and the heat pump operating frequency; The heat pump operating parameters of the target heat pump are adjusted based on the target saturation temperature to obtain a heat pump control result.

2. The heat pump control method according to claim 1, characterized in that: The target pressure state includes a cooling high pressure state, a cooling low pressure state, a heating high pressure state and a heating low pressure state; The step of determining the target saturation temperature of the target heat pump corresponding to the target pressure state according to the heat pump operating temperature and the heat pump operating frequency includes: Obtaining the outer ring temperature corresponding to the target heat pump, and calculating the first target saturation temperature corresponding to the refrigeration high pressure state according to the heat pump condensing temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature; and / or, calculating a second target saturation temperature corresponding to the refrigeration low pressure state according to the heat pump refrigerant temperature, the refrigeration water circuit temperature and the heat pump operation frequency in the heat pump operation temperature; and / or, calculating a third target saturation temperature corresponding to the heating high pressure state according to the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operation frequency in the heat pump operation temperature; And / or, a fourth target saturation temperature corresponding to the heating low-pressure state is calculated according to the heat pump condensing temperature, the compressor return air temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature.

3. The heat pump control method according to claim 2, characterized in that: The calculating the first target saturation temperature corresponding to the refrigeration high pressure state according to the heat pump condensing temperature, the outer ring temperature and the heat pump operating frequency in the heat pump operating temperature includes: Obtaining a first simulation coefficient and a second simulation coefficient corresponding to the refrigeration high pressure state; Adjust the outer ring temperature according to the first simulation coefficient to obtain a first outer ring temperature, and adjust the heat pump operating frequency according to the second simulation coefficient to obtain a first operating frequency; The first target saturation temperature is calculated according to the heat pump condensing temperature, the first outer loop temperature, and the first operating frequency.

4. The heat pump control method according to claim 2, characterized in that: The calculating the second target saturation temperature corresponding to the refrigeration low pressure state according to the heat pump refrigerant temperature, the refrigeration water path temperature and the heat pump operation frequency in the heat pump operation temperature includes: Obtaining a third simulation coefficient and a fourth simulation coefficient corresponding to the refrigeration low-pressure state; Determine the target refrigerant temperature according to the refrigerant liquid pipe temperature and the refrigerant gas pipe temperature in the heat pump refrigerant temperature, and the compressor return air temperature; Calculating the average temperature of the cooling water circuit according to the cooling water inlet temperature and the cooling water outlet temperature in the cooling water circuit temperature; A second target saturation temperature is calculated according to the target refrigerant temperature, the third simulation coefficient, the average temperature of the refrigeration water circuit, the heat pump operation frequency and the fourth simulation coefficient.

5. The heat pump control method according to claim 2, characterized in that: The calculating the third target saturation temperature corresponding to the heating high pressure state according to the hot water circuit temperature, the refrigerant liquid pipe temperature and the heat pump operation frequency in the heat pump operation temperature includes: Obtaining a fifth simulation coefficient and a sixth simulation coefficient corresponding to the heating high pressure state; Calculating the average temperature of the hot water circuit according to the heating water inlet temperature and the heating water outlet temperature in the hot water circuit temperature; The third target saturation temperature is calculated according to the refrigerant liquid pipe temperature, the hot water circuit average temperature, the fifth simulation coefficient, the sixth simulation coefficient and the heat pump operation frequency.

6. The heat pump control method according to claim 2, characterized in that: The calculating, according to the heat pump condensing temperature, the compressor return air temperature, the outer ring temperature and the heat pump operating frequency, of the heat pump operating temperature, the fourth target saturation temperature corresponding to the heating low pressure state includes: Obtaining a seventh simulation coefficient and an eighth simulation coefficient corresponding to the heating low-pressure state; Determining a target heating refrigerant pipeline temperature according to the heat pump condensing temperature and the compressor return air temperature; A fourth target saturation temperature is calculated according to the target heating refrigerant pipeline temperature, the outer ring temperature, the seventh simulation coefficient, the eighth simulation coefficient and the heat pump operation frequency.

7. The heat pump control method according to any one of claims 1 to 6, characterized in that: The step of adjusting the heat pump operating parameters of the target heat pump based on the target saturation temperature to obtain a heat pump control result includes: If the heat pump operation state of the target heat pump is the heating operation state, and the third target saturation temperature of the target heat pump is greater than the first temperature threshold, the compressor speed and the fan speed of the target heat pump are reduced according to the heating high pressure adjustment strategy to obtain a first heat pump control result; If the heat pump operation state of the target heat pump is the heating operation state, and the third target saturation temperature of the target heat pump is lower than the second temperature threshold, the compressor speed and the fan speed of the target heat pump are increased or decreased according to the heating high pressure strategy to obtain a second heat pump control result.

8. A heat pump control device, characterized in that: The heat pump control device comprises: a parameter acquisition module, configured to respond to a heat pump control request for a target heat pump and acquire a heat pump operating temperature and a heat pump operating frequency of the target heat pump; a parameter conversion module, configured to determine a target saturation temperature corresponding to the target heat pump at a target pressure state according to the heat pump operating temperature and the heat pump operating frequency; The heat pump control module is configured to adjust the heat pump operation parameters of the target heat pump based on the target saturation temperature to obtain a heat pump control result.

9. A heat pump control device, characterized in that: The heat pump control device comprises: one or more processors; Memory; and One or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the processor to implement the steps of the heat pump control method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and the computer program is loaded by a processor to execute the steps of the heat pump control method according to any one of claims 1 to 7.

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