Magnetic sensor device
By designing small surface-mounted connectors, the difference in heat capacity and space occupation problems of magnetic sensors and small electrical and electronic components when installed on the substrate are solved, and the effect of simplifying the installation process and increasing the installation space is achieved.
Patent Information
- Application Number
- CN202410799080.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-23
- Filing Date
- 2024-06-20
- Publication Date
- 2024-12-24
AI Technical Summary
When existing magnetic sensors and small surface-mounted electrical and electronic components are installed on the substrate, the difference in heat capacity leads to complex welding, and the magnetic sensor occupies a large area, limiting the installation space of other electrical and electronic components.
A small surface-mounted connector (3rd and 4th connectors) is designed to be installed with other electrical and electronic components through reflow soldering, reducing welding time and increasing installation space through the settings between the bridge connectors.
The installation process of magnetic sensors and other electrical and electronic components is simplified, the welding time is reduced, and the number of electrical and electronic components that can be installed on the substrate is increased.
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Figure CN119178457A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a magnetic sensor device utilizing the large Barkhausen effect. Background Art
[0002] The magnetic sensor using the large Barkhausen effect has: a magnetic wire that exerts a large Barkhausen effect, a bobbin with a magnetic wire disposed inside, a coil formed by winding an electric wire around the bobbin, and two terminals for connecting the coil to an external detection circuit. The two terminals are respectively fixed to the two ends of the bobbin. Of the two terminals, one terminal is connected to one end of the electric wire forming the coil, and the other terminal is connected to the other end of the electric wire forming the coil. The magnetic sensor is fixed to the substrate, for example, by welding the ends of the two terminals to the conductive portion provided on the substrate. An example of such a magnetic sensor is described in International Publication No. 2016 / 021074 (Patent Document 1).
[0003] For example, as described in International Publication No. 2016 / 021074, when a magnetic sensor is used to detect the rotation of a rotating shaft, a magnet is fixed to the outer periphery of the rotating shaft so that a rotating magnetic field is formed on the outer periphery of the rotating shaft when the rotating shaft rotates. In addition, a substrate is provided on the outer periphery of the rotating shaft in a manner that does not contact the rotating shaft and any of the magnets, and a plurality of magnetic sensors are provided on the substrate. In addition, a plurality of magnetic sensors are arranged near the rotating track of the magnet and at positions different from each other in the rotation direction of the magnet. Thus, the rotating magnetic field formed by the rotation of the rotating shaft can be detected by a plurality of magnetic sensors, and the rotation amount and the rotation direction of the rotating shaft can be detected based on the detection signal output from the coil of each magnetic sensor.
[0004] Patent Document 1: International Publication No. 2016 / 021074
[0005] In addition to the magnetic sensor, a plurality of electrical and electronic components are also provided on the substrate on which the magnetic sensor is provided. As these electrical and electronic components, various components such as resistors, capacitors, diodes, transistors or integrated circuits can be considered, but due to the requirements of reducing the substrate area, small surface-mounted components (chip components) are used as these electrical and electronic components. On the other hand, as described in International Publication No. 2016 / 021074, the previous magnetic sensor is an insertion-mounted component (DIP component).
[0006] When conventional magnetic sensors are mounted on a substrate together with other electric and electronic components, the following problems occur.
[0007] For example, by changing the shape of each terminal of the conventional magnetic sensor, the conventional magnetic sensor can be made into a structure that can be surface mounted. However, the magnetic sensor is larger in size than the small electrical and electronic components of the surface mounting type, and therefore has a large heat capacity. When multiple components are surface mounted on a substrate by reflow soldering, when the difference in heat capacity between the multiple components is large, the settings or measures for heating, heat insulation, heat dissipation, etc. for proper soldering become complicated. Therefore, it is not easy to surface mount the magnetic sensor and other electrical and electronic components on the substrate at one time by reflow soldering. As a result, the process of mounting the magnetic sensor on the substrate must be set independently from the process of surface mounting other electrical and electronic components on the substrate, and the man-hours for soldering the magnetic sensor and other electrical and electronic components to the substrate increase.
[0008] In addition, since the magnetic sensor is larger than the small surface-mounted electrical and electronic components, when the magnetic sensor is provided on the substrate, the ratio of the area occupied by the magnetic sensor to the area of the substrate becomes larger. As a result, the space for mounting other electrical and electronic components on the substrate becomes smaller, and the number of electrical and electronic components that can be mounted on the substrate becomes smaller. Summary of the invention
[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a magnetic sensor device in which a magnetic sensor can be easily provided on a substrate together with other electric and electronic components.
[0010] In order to solve the above-mentioned problems, the magnetic sensor device of the present invention is characterized in that it comprises: a magnetic sensor, comprising a magnetic wire that exerts a large Barkhausen effect, a bobbin in which the magnetic wire is arranged, a coil formed by winding an electric wire around the bobbin, a first connector provided at one end of the bobbin, and a second connector provided at the other end of the bobbin; a third connector detachably connected to the first connector; and a fourth connector detachably connected to the second connector, the first connector The second connector includes a second engaging portion and a second terminal connected to one end of the electric wire, the third connector includes a third engaging portion engaged with the first engaging portion, and a third terminal contacting the first terminal when the first engaging portion is engaged with the third engaging portion, and the fourth connector includes a fourth engaging portion engaged with the second engaging portion, and a fourth terminal contacting the second terminal when the second engaging portion is engaged with the fourth engaging portion.
[0011] In the magnetic sensor device of the present invention described above, the third connector and the fourth connector are mounted on a substrate together with other electrical and electronic components, for example, and thereafter, the first connector and the second connector of the magnetic sensor are respectively connected to the third connector and the fourth connector mounted on the substrate, thereby enabling the magnetic sensor to be set on the substrate.
[0012] The 3rd connector and the 4th connector can be configured as a surface-mounted type. The 3rd connector and the 4th connector are respectively smaller than the magnetic sensor and have a smaller heat capacity. Therefore, in the case where the 3rd connector and the 4th connector are surface-mounted on the substrate together with other electrical and electronic components by reflow soldering, compared with the case where the magnetic sensor is surface-mounted on the substrate together with other electrical and electronic components by reflow soldering, the setting or measures for heating, heat insulation, heat dissipation, etc. for proper welding become easier. Therefore, the 3rd connector, the 4th connector and other electrical and electronic components can be easily surface-mounted on the substrate at one time by reflow soldering. Therefore, when the magnetic sensor and other electrical and electronic components are arranged on the substrate, the welding man-hours can be reduced.
[0013] In addition, in the magnetic sensor of the present invention, the third connector and the fourth connector are respectively installed at two mutually separated positions in the mounting surface of the substrate, for example, and the first connector and the second connector of the magnetic sensor are respectively connected to the third connector and the fourth connector, thereby enabling the magnetic sensor to be arranged on the substrate. In this case, the magnetic sensor can be arranged to bridge the third connector and the fourth connector. By arranging the magnetic sensor in this way, a space in which other electrical and electronic components can be installed can be formed between the middle part between one end of the magnetic sensor provided with the first connector and the other end provided with the second connector and the mounting surface of the substrate. By installing other electrical and electronic components in this space, the number of electrical and electronic components that can be installed on the substrate can be increased.
[0014] In the magnetic sensor device of the present invention, the coil may be arranged between one end and the other end of the bobbin, the first connector may be arranged at a lower portion of one end of the bobbin, the second connector may be arranged at a lower portion of the other end of the bobbin, the third connector may be arranged on an upper surface of the substrate in such a manner that the first engaging portion can be engaged with the third engaging portion from above the third engaging portion, the fourth connector may be arranged on an upper surface of the substrate in such a manner that the second engaging portion can be engaged with the fourth engaging portion from above the fourth engaging portion, the third connector and the fourth connector may be arranged separately from each other on the upper surface of the substrate, and in a state in which the first engaging portion is engaged with the third engaging portion from above the third engaging portion and the second engaging portion is engaged with the fourth engaging portion from above the fourth engaging portion, the magnetic wire and the bobbin extend in parallel with the upper surface of the substrate, and a space is formed between a lower portion of an outer peripheral surface of the coil and the upper surface of the substrate. In addition, in the magnetic sensor device of the present invention, the third connector and the fourth connector may be surface-mounted on the substrate, respectively. In addition, in the magnetic sensor device of the present invention, a yoke for controlling the direction of the magnetic flux of the external magnetic field may be provided, and the yoke may be fixed to the magnetic sensor. In addition, in the magnetic sensor device of the present invention, a yoke for controlling the direction of the magnetic flux of the external magnetic field may be provided, and a housing for accommodating the magnetic sensor may be provided, and the yoke may be fixed to the housing. In this case, the yoke may be integrated with the housing by insert molding.
[0015] According to the present invention, the magnetic sensor can be easily provided on the substrate together with other electric and electronic components. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is an explanatory diagram showing a rotation detection device including a magnetic sensor device according to an embodiment of the present invention.
[0017] Figure 2 It means along Figure 1 The cross section of the rotation detection device cut along the cutting line AA in FIG. Figure 1 A cross-sectional view of the state viewed from the lower right.
[0018] Figure 3 It is a perspective view showing a state of the magnetic sensor device according to the embodiment of the present invention as viewed from the upper front right.
[0019] Figure 4 (A) is a perspective view showing a state of the sensor unit in the magnetic sensor device according to the embodiment of the present invention as viewed from the upper rear right. Figure 4(B) is a perspective view showing the sensor unit as viewed from the lower right front side.
[0020] Figure 5 This is an explanatory diagram showing a state of a magnetic sensor, a yoke, and a case included in a sensor unit in the magnetic sensor device according to the embodiment of the present invention, as viewed from the upper front right.
[0021] Figure 6 This is a perspective view showing a state of the magnetic sensor in the magnetic sensor device according to the embodiment of the present invention as viewed from the upper front right.
[0022] Figure 7 (A) is a perspective view showing a state of a bobbin in a magnetic sensor of a magnetic sensor device according to an embodiment of the present invention as viewed from the upper front right. Figure 7 (B) is a perspective view showing the bobbin as viewed from the lower rear right side.
[0023] Figure 8 (A) is an appearance diagram showing a state where the left end portion of the magnetic sensor in the magnetic sensor device according to the embodiment of the present invention is viewed from below, Figure 8 (B) means along Figure 8 1 is a cross-sectional view of the left end portion of the magnetic sensor cut along the cutting line BB in (A) as viewed from the left.
[0024] Fig. 9 It is a perspective view showing a yoke and a housing integrated by insert molding in the magnetic sensor device according to the embodiment of the present invention.
[0025] Fig.10 It is an explanatory diagram showing a method of attaching a magnetic sensor to a housing in the magnetic sensor device according to the embodiment of the present invention.
[0026] Fig.11 (A) is an appearance diagram showing a state in which a substrate-side connector in a magnetic sensor device according to an embodiment of the present invention is viewed from above, Fig.11 (B) is an external view showing the board-side connector as viewed from below.
[0027] Fig.12 (A) is a cross-sectional view showing a state where the sensor side connector and the substrate side connector are separated. Fig.12 (B) is a cross-sectional view showing a state where the sensor-side connector and the board-side connector are connected.
[0028] Fig.13 It is an explanatory diagram showing a state in which a board-side connector in the magnetic sensor device according to the embodiment of the present invention is provided on a board of a rotation detection device.
[0029] Fig.14 It is an explanatory diagram showing a state of the magnetic sensor device according to the embodiment of the present invention provided on a substrate, as seen from the front.
[0030] Fig.15 It is an explanatory diagram showing the magnetic field detection operation of the magnetic sensor device according to the embodiment of the present invention.
[0031] Fig.16 It is an explanatory diagram showing a first modified example of the magnetic sensor device according to the embodiment of the present invention.
[0032] Fig.17 It is an explanatory diagram showing a second modified example of the magnetic sensor device according to the embodiment of the present invention.
[0033] Fig.18 It is an explanatory diagram showing a third modified example of the magnetic sensor device according to the embodiment of the present invention.
[0034] Description of Reference Numerals
[0035] 3...magnetic sensor device; 5...magnetic sensor; 6...magnetic wire; 7...bobbin; 12...coil; 13...insulated wire (wire); 14, 15, 51...sensor side connector (first connector, second connector); 16...fitting portion (first fitting portion, second fitting portion); 17, 52...terminal (first terminal, second terminal); 18...yoke; 19...housing; 24, 25, 61...substrate side connector (third connector, fourth connector); 27...fitting portion (third fitting portion, fourth fitting portion); 33, 62...terminal (third terminal, fourth terminal); 35...substrate. DETAILED DESCRIPTION
[0036] (Rotation detection device)
[0037] Figure 1 A rotation detection device 1 including a magnetic sensor device 3 according to an embodiment of the present invention is shown. Figure 2 Shown along Figure 1 The cross section of the rotation detection device 1 cut along the cutting line AA in FIG. Figure 1 The state observed in the lower right corner.
[0038] exist Figure 1 The rotation detection device 1 is a device that detects the rotation of a rotating shaft 40 as a rotating body. The rotation detection device 1 includes a magnetic field forming member 2 that forms a rotating magnetic field, a plurality of magnetic sensor devices 3 that detect the rotating magnetic field, and a substrate 35.
[0039] The magnetic field forming member 2 is formed into a ring shape by a magnetic material such as ferrite. The magnetic field forming member 2 is coaxially arranged on the outer peripheral side of the rotating shaft 40 and fixed to the rotating shaft 40. The magnetic field forming member 2 is a magnet magnetized by multi-pole, and four magnetic poles of N pole, S pole, N pole, and S pole are formed in this order, for example, at intervals of 90 degrees on the circumference of the magnetic field forming member 2 on the outer peripheral side of the magnetic field forming member 2. In addition, the magnetic field forming member 2 can also be formed by four magnets that are not multi-pole magnetized.
[0040] The substrate 35 is disposed on the outer peripheral side of the rotating shaft 40. Figure 2 As shown in the figure, the substrate 35 is arranged so that the plane including the mounting surface 35A thereof is orthogonal to the axis X of the rotating shaft 40. In addition, a through hole 35B is formed in the central portion of the substrate 35, and the rotating shaft 40 is inserted into the through hole 35B. The diameter of the through hole 35B is larger than the outer diameter of the rotating shaft 40, and the rotating shaft 40 does not contact the substrate 35. In addition, the substrate 35 is fixed to a frame or the like of a device (such as a motor, etc.) that supports the rotating shaft 40 so that it can rotate, via a bracket or the like.
[0041] A plurality of magnetic sensor devices 3 are disposed on the mounting surface 35A of the substrate 35. Figure 1 As shown, in this embodiment, three magnetic sensor devices 3 are provided on the substrate 35. The three magnetic sensor devices 3 are arranged on the outer peripheral side of the magnetic field forming component 2 at a predetermined interval (for example, 120 degrees). In addition, the three magnetic sensor devices 3 are arranged so that the distances between them and the axis X of the rotating shaft 40 are equal to each other. In addition, each magnetic sensor device 3 is separated from the magnetic field forming component 2. In addition, as Figure 2 As shown, in the axial direction of the rotating shaft 40 , the position of each magnetic sensor device 3 substantially coincides with the position of the magnetic field forming member 2 .
[0042] The magnetic field forming component 2 rotates together with the rotating shaft 40, while each magnetic sensor device 3 does not move. When the magnetic field forming component 2 rotates together with the rotating shaft 40, the magnetic field formed by the magnetic field forming component 2 rotates. As a result, a rotating magnetic field is formed that rotates with the axis X of the rotating shaft 40 as the rotation axis. Each magnetic sensor device 3 detects the rotating magnetic field. Specifically, the direction of the magnetic field acting on each magnetic sensor device 3 changes by rotating the magnetic field formed by the magnetic field forming component 2. Each magnetic sensor device 3 outputs a pulse signal corresponding to the change in the direction of the magnetic field. The rotation amount and rotation direction of the rotating shaft 40 can be detected based on the pulse signal output from each magnetic sensor device 3.
[0043] Although not shown in the figure, in addition to the magnetic sensor device 3, a plurality of small surface-mounted electrical and electronic components such as resistors, capacitors, diodes, transistors or integrated circuits (referred to as "other electrical and electronic components") are mounted on the mounting surface 35A of the substrate 35.
[0044] (Magnetic sensor device)
[0045] exist Figure 1 In the embodiment, three identical magnetic sensor devices 3 are provided on the substrate 35 . Figure 3 One of the three magnetic sensor devices 3 is shown. Hereinafter, although the one magnetic sensor device 3 is described, in the description, when describing the directions of front (Fd), back (Bd), up (Ud), down (Dd), left (Ld), and right (Rd), the directions are as follows: Figures 3 to 12 , 14 and the arrows depicted in the lower right corners of 15.
[0046] like Figure 3 As shown, the magnetic sensor device 3 includes a sensor unit 4 and two board-side connectors 24 and 25. The board-side connectors 24 and 25 are mounted on a mounting surface 35A of a board 35. The sensor unit 4 is provided on the board 35 by being connected to the board-side connectors 24 and 25.
[0047] (Sensor unit)
[0048] Figure 4 (A) shows the state of the sensor unit 4 as viewed from the upper rear right. Figure 4 (B) shows the state of the sensor unit 4 as viewed from the lower right front. Figure 5 The sensor unit 4 includes a magnetic sensor 5, a yoke 18, and a housing 19. Figure 5 In the figure, regarding the housing 19, only its outer shape is indicated by a two-dot chain line.
[0049] like Figure 4 (A) Figure 4 (B) and Figure 5 As shown, the sensor unit 4 includes the magnetic sensor 5 , a yoke 18 , and a housing 19 . The magnetic sensor 5 and the yoke 18 are provided inside the housing 19 .
[0050] Figure 6 A magnetic sensor 5 is shown. Figure 7 (A) shows a state of the bobbin 7 of the magnetic sensor 5 as viewed from the upper front right. Figure 7 (B) shows the state of the bobbin 7 as viewed from the rear lower right. Figure 8 (A) shows a state where the left end portion of the magnetic sensor 5 is viewed from below. Figure 8 (B) shows the Figure 8 FIG. 1 is a state of a cross section of the left end portion of the magnetic sensor 5 cut along the cutting line BB in FIG. 1 as viewed from the left.
[0051] The magnetic sensor 5 is a part of the magnetic sensor device 3 that detects the rotating magnetic field. Figure 6 As shown, the magnetic sensor 5 includes a magnetic wire 6 , a bobbin 7 , a coil 12 , and two sensor-side connectors 14 and 15 .
[0052] The magnetic wire 6 is a magnetic wire that exerts a large Barkhausen effect and is called a composite magnetic wire. The magnetic wire 6 is formed of, for example, a semi-hard magnetic material containing iron and cobalt, and is a wire having a diameter of, for example, about 0.1 mm to 1 mm and a length of, for example, about 10 mm to 30 mm. The magnetic wire 6 is formed, for example, by drawing the semi-hard magnetic material and twisting it multiple times while changing the direction. The magnetic wire 6 has a uniaxial anisotropy in which the direction of easy magnetization is the direction of the central axis of the magnetic wire 6. In addition, in the magnetic wire 6, the coercive force of the central side portion is greater than the coercive force of the peripheral side portion thereof. The magnetic wire 6 has the property that the magnetization direction of the magnetic wire 6 (the peripheral side portion thereof) is rapidly reversed in accordance with the change in the direction of the external magnetic field.
[0053] The bobbin 7 is formed of a non-magnetic material such as resin. Figure 7 As shown in (A), the bobbin 7 includes a wire winding portion 8, two wire supporting portions 9, two flange portions 10, and a wire receiving groove 11. The wire winding portion 8 is provided in the middle portion of the bobbin 7 in the left-right direction, and is formed into a cylindrical shape extending in the left-right direction. The wire supporting portion 9 is provided at the left end and the right end of the bobbin 7, respectively. The flange portion 10 is provided between the wire winding portion 8 and the wire supporting portion 9 on the left, and between the wire winding portion 8 and the wire supporting portion 9 on the right, respectively. The diameter of each flange portion 10 is larger than the diameter of the wire winding portion 8. The wire receiving groove 11 is a groove extending from the left end to the right end of the bobbin 7.
[0054] The magnetic wire 6 is arranged inside the bobbin 7 in a manner extending linearly in the left-right direction. Specifically, the magnetic wire 6 is arranged in the wire receiving groove 11. The left end of the magnetic wire 6 is supported (fixed) to the left end of the wire receiving groove 11 of the wire support portion 9 formed on the left side by a method such as bonding using an adhesive. Similarly, the right end of the magnetic wire 6 is supported (fixed) to the right end of the wire receiving groove 11 of the wire support portion 9 formed on the right side. In addition, instead of the wire receiving groove 11, a hole extending from the left end to the right end of the bobbin 7, that is, a wire receiving hole, may be provided, and the magnetic wire 6 may be arranged in the wire receiving hole.
[0055] The coil 12 is disposed on the outer circumference of the magnetic wire 6 disposed in the wire receiving groove 11. Figure 6As shown, the coil 12 is formed by winding an insulated electric wire 13 such as an enameled wire around the electric wire winding portion 8 .
[0056] like Figure 7 As shown in (B), the sensor side connectors 14 and 15 are respectively provided at the left end and the right end of the bobbin 7. Specifically, the sensor side connector 14 is integrally formed at the lower portion of the wire support portion 9 on the left side in the bobbin 7. The sensor side connector 15 is integrally formed at the lower portion of the wire support portion 9 on the right side in the bobbin 7. In addition, the sensor side connector 14 protrudes downward from the wire support portion 9 on the left side, and the sensor side connector 15 protrudes downward from the wire support portion 9 on the right side. The sensor side connector 14 is detachably connected to the substrate side connector 24, and the sensor side connector 15 is detachably connected to the substrate side connector 25.
[0057] like Figure 8 (A) and Figure 8 As shown in (B), the sensor side connector 14 includes a fitting portion 16 and a terminal 17. The fitting portion 16 fits with the fitting portion 27 of the substrate side connector 24. The fitting portion 16 is formed into a cylindrical shape (e.g., a square cylindrical shape) protruding downward from the wire support portion 9 on the left side. The terminal 17 is formed into a rod-shaped shape bent into an L-shape by a conductive material such as a metal material such as a copper alloy. The terminal 17 is arranged in the left-right central portion of the rear portion of the fitting portion 16. One end side portion of the terminal 17 becomes a wire connection portion 17A, and the other end side portion of the terminal 17 becomes a contact portion 17B, the wire connection portion 17A extends in the front-to-back direction, and the contact portion 17B extends in the up-down direction. The wire connection portion 17A extends backward from the upper side portion of the rear portion of the fitting portion 16, and its terminal portion protrudes to the outside of the bobbin 7. In addition, one end portion of the insulated wire 13 is fixed and electrically connected to the wire connection portion 17A. The contact portion 17B is located at the rear portion of the inner side of the fitting portion 16 and extends from the upper end to the lower end of the fitting portion 16. The sensor side connector 14 is a specific example of the "first connector", the fitting portion 16 of the sensor side connector 14 is a specific example of the "first fitting portion", and the terminal 17 of the sensor side connector 14 is a specific example of the "first terminal".
[0058] The sensor side connector 15 is formed to be bilaterally symmetrical with the sensor side connector 14, and is provided with a fitting portion 16 and a terminal 17 similarly to the sensor side connector 14. In addition, the other end of the insulated wire 13 is fixed and electrically connected to a wire connecting portion 17A of the terminal 17 of the sensor side connector 15. The sensor side connector 15 is a specific example of a "second connector", the fitting portion 16 of the sensor side connector 15 is a specific example of a "second fitting portion", and the terminal 17 of the sensor side connector 15 is a specific example of a "second terminal".
[0059] The yoke 18 has a function of controlling the direction of the magnetic flux of the external magnetic field. In the present embodiment, the yoke 18 controls the direction of the magnetic flux of the magnetic field formed by the magnetic field forming member 2. Figure 5 As shown, the yoke 18 has two yoke pieces 18A. Each yoke piece 18A is formed of a soft magnetic material such as iron. A portion of the yoke piece 18A on one side is arranged in front of the left portion of the magnetic sensor 5, and the other portion of the yoke piece 18A on one side is arranged above the left end portion of the magnetic sensor 5. In addition, a portion of the yoke piece 18A on the other side is arranged in front of the right portion of the magnetic sensor 5, and the other portion of the yoke piece 18A on the other side is arranged above the right end portion of the magnetic sensor 5.
[0060] The housing 19 has the function of integrating the magnetic sensor 5 and the yoke 18. The housing 19 is formed of a non-magnetic material such as resin. Fig. 9 As shown in FIG. 1 , the yoke 18 is integrated with the housing 19 by being buried in the housing 19. Specifically, the yoke 18 is integrated with the housing 19 by insert molding. Fig.10 As shown in FIG. 1 , a sensor receiving portion 20 is provided in the housing 19. The sensor receiving portion 20 is a hole formed on the lower surface of the housing 19, which is open downward and closed at the top. Figure 4 As shown in FIG. 2 (B), the magnetic sensor 5 is accommodated in the sensor accommodation portion 20 .
[0061] The opening shape of the sensor receiving portion 20 is a quadrilateral corresponding to the shape and size of the magnetic sensor 5, so that the magnetic sensor 5 can be inserted into the sensor receiving portion 20, and the left-right dimension of the sensor receiving portion 20 is substantially equal to the left-right dimension of the magnetic sensor 5, and the front-back dimension of the sensor receiving portion 20 is substantially equal to the front-back dimension of the left end and the right end of the winding bobbin 7 of the magnetic sensor 5. In addition, as Fig.10 As shown in FIG. 1 , notches 21 are formed at the left rear portion and the right rear portion of the housing 19. When the magnetic sensor 5 is inserted into the sensor receiving portion 20, as shown in FIG. Figure 4 As shown in (A), the terminal end portion of the terminal 17 protruding rearward from the left end portion of the bobbin 7 of the magnetic sensor 5 is arranged inside the cutout 21 of the left rear portion of the housing 19, and the terminal end portion of the terminal 17 protruding rearward from the right end portion of the bobbin 7 of the magnetic sensor 5 is arranged inside the cutout 21 of the right rear portion of the housing 19. Fig.10 As shown, a plurality of protrusions 22 protruding forward are formed on the rear surface of the sensor housing portion 20. When the magnetic sensor 5 is inserted into the sensor housing portion 20, each protrusion 22 strongly abuts against the bobbin 7. Thus, the magnetic sensor 5 is fixed in the sensor housing portion 20. When the magnetic sensor 5 is mounted on the housing 19, the operator presses the magnetic sensor 5 into the sensor housing portion 20.
[0062] In addition, if Figure 4 As shown in (B), when the magnetic sensor 5 is installed in the sensor housing portion 20, the portion of the magnetic sensor 5 other than the sensor side connectors 14 and 15 is arranged in the sensor housing portion 20, but the sensor side connectors 14 and 15 extend from the sensor housing portion 20. That is, the sensor side connectors 14 and 15 protrude downward from the housing 19, respectively.
[0063] (PCB side connector)
[0064] Fig.11 (A) shows the board-side connector 24 viewed from above. Fig.11 (B) shows the board-side connector 24 viewed from below. Fig.12 (A) shows a state in which the sensor-side connector 14 and the board-side connector 24 of the magnetic sensor 5 are separated. Fig.12 (B) shows the state where the sensor side connector 14 is connected to the substrate side connector 24. Fig.12 (A) and Fig.12 In (B), the magnetic sensor 5 is along Figure 8 The cross section of the left end of the magnetic sensor 5 cut along the cutting line BB in (A) is viewed from the left, and the substrate side connector 24 is along Fig.11 The cross section of the board-side connector 24 cut along the cutting line CC in (A) is shown as viewed from the left.
[0065] The sensor side connector 14 of the magnetic sensor 5 is connected to the substrate side connector 24. Fig.11 As shown in (A), the substrate-side connector 24 includes: a housing 26 having a fitting portion 27, and two terminals 33. The substrate-side connector 24 is a specific example of the "third connector", the "fitting portion 27" of the substrate-side connector 24 is a specific example of the "third fitting portion", and the "terminal 33" of the substrate-side connector 24 is a specific example of the "third terminal".
[0066] The housing 26 is formed of a non-magnetic material such as resin. Figure 3 As shown, the housing 26 is formed into a columnar shape (eg, a quadrangular columnar shape) having an axis extending in the vertical direction. The board-side connector 24 of this embodiment is low in height, and its vertical dimension is smaller than any of its horizontal and front-back dimensions.
[0067] The fitting portion 27 is disposed on the upper portion of the housing 26. Specifically, Fig.11 (A) and Fig.12As shown in (A), the fitting portion 27 includes a bottomed hole 28 formed on the upper surface of the housing 26, and a protrusion 29 protruding upward from the center of the bottom surface of the hole 28. The fitting portion 16 of the sensor-side connector 14 enters the space between the inner peripheral surface of the hole 28 and the outer peripheral surface of the protrusion 29. The opening shape of the hole 28 and the shape of the protrusion 29 correspond to the shape of the fitting portion 16 of the sensor-side connector 14. For example, the opening shape of the hole 28 and the shape of the protrusion 29 when the substrate-side connector 24 is viewed from above are both quadrilateral.
[0068] In addition, if Fig.11 As shown in (B), on the lower surface of the housing 26, terminal arrangement grooves 30 extending in the front-to-back direction are formed at the front and rear portions of the center in the left-right direction. Fig.11 As shown in (A), in the protruding portion 29 of the fitting portion 27, a displacement allowing groove 31 extending in the vertical direction is formed at the front and rear portions in the center in the left-right direction. In addition, in the housing 26, a terminal fixing hole 32 extending in the vertical direction is formed at the front and rear portions in the center in the left-right direction.
[0069] The two terminals 33 are respectively arranged at the front and rear of the central part of the housing 26 in the left-right direction. Fig.12 As shown in (A), each terminal 33 is formed of a conductive material such as a copper alloy or other metal material into a rod-shaped shape bent into an L shape. In addition, one end side portion of each terminal 33 becomes a substrate connection portion 33A, and the other end side portion of the terminal 17 becomes a contact portion 33B, the substrate connection portion 33A extends in the front-to-back direction, and the contact portion 33B extends in the up-down direction. In addition, each terminal 33 is provided with a fixing portion 33C for fixing the terminal 33 to the housing 26, and the fixing portion 33C protrudes upward from the substrate connection portion 33A.
[0070] In the rear terminal 33, the substrate connection portion 33A is arranged in the terminal arrangement groove 30 formed at the rear of the lower surface of the housing 26. The substrate connection portion 33A extends along the lower surface of the housing 26, and its terminal end protrudes backward from the terminal arrangement groove 30 and extends to the outside of the housing 26. The contact portion 33B is arranged at a position close to the rear surface of the protruding portion 29, and extends along the rear surface of the protruding portion 29 from the terminal arrangement groove 30 to the upper surface of the housing 26. In addition, the contact portion 33B is located behind the displacement allowing groove 31 (in this embodiment, a part of the contact portion 33B enters the displacement allowing groove 31). In addition, the fixing portion 33C is inserted into the terminal fixing hole 32 formed at the rear of the housing 26. A locking piece is formed on the fixing portion 33C, and the fixing portion 33C is fixed in the terminal fixing hole 32 by hooking the locking piece on the inner peripheral surface of the terminal fixing hole 32. In this way, the rear terminal 33 is fixed to the housing 26.
[0071] The front terminal 33 is configured to be symmetrical with the rear terminal 33. That is, in the front terminal 33, the substrate connection portion 33A is configured in the terminal configuration groove 30 formed in the front portion of the lower surface of the housing 26, and its terminal end protrudes forward from the terminal configuration groove 30. In addition, the contact portion 33B is configured at a position close to the front surface of the protruding portion 29, and is located in front of the displacement allowing groove 31. In addition, the fixing portion 33C is fixed in the terminal fixing hole 32 formed in the front portion of the housing 26, thereby fixing the front terminal 33 to the housing 26.
[0072] like Figure 3 As shown, although the magnetic sensor device 3 has two substrate-side connectors 24 and 25, the substrate-side connector 25 is the same as the substrate-side connector 24. The substrate-side connector 25 is a specific example of the "fourth connector", the "fitting portion 27" of the substrate-side connector 25 is a specific example of the "fourth fitting portion", and the "terminal 33" of the substrate-side connector 25 is a specific example of the "fourth terminal".
[0073] like Fig.12 As shown in (B), the fitting portion 16 of the sensor side connector 14 provided at the left end of the bobbin 7 of the magnetic sensor 5 enters the fitting portion 27 of the substrate side connector 24, whereby the two are fitted with each other. The sensor side connector 14 is fixed to the substrate side connector 24 by the fitting of the fitting portion 16 and the fitting portion 27. In addition, a locking mechanism or a locking mechanism may be provided in the fitting portion 16 and the fitting portion 27 so as to more firmly fix the sensor side connector 14 to the substrate side connector 24. In addition, when the fitting portion 16 is fitted into the fitting portion 27, the contact portion 17B of the terminal 17 of the sensor side connector 14 contacts the contact portion 33B of the terminal 33 of the substrate side connector 24, and the contact portion 33B is pressed. The contact portion 33B is elastically deformed and displaced forward, and enters the displacement allowing groove 31. As a result, the contact portion 17B and the contact portion 33B are strongly in contact with each other, and the two are electrically connected. Similarly, the fitting portion 16 of the sensor side connector 15 provided at the right end of the bobbin 7 of the magnetic sensor 5 enters the fitting portion 27 of the substrate side connector 25, whereby the two are fitted and fixed to each other. At this time, the contact portion 17B of the terminal 17 of the sensor side connector 15 and the contact portion 33B of the terminal 33 of the substrate side connector 25 are strongly contacted, and the two are electrically connected. In addition, the fitting of the fitting portion 16 and the fitting portion 27 can be released by, for example, pulling the sensor unit 4 relative to the substrate 35.
[0074] In addition, since the substrate-side connectors 24 and 25 both have a front-to-back symmetrical structure, when the substrate-side connectors 24 and 25 are set on the substrate 35, even if the front and back directions of the substrate-side connector 24 are reversed, it will not hinder the connection between the sensor-side connector 14 and the substrate-side connector 24. In addition, even if the front and back directions of the substrate-side connector 25 are reversed, it will not hinder the connection between the sensor-side connector 15 and the substrate-side connector 25.
[0075] (Installation of the Magnetic Sensor Device on the Substrate)
[0076] like Figure 1 As shown, in order to form a rotation detection device 1, when three magnetic sensor devices 3 are set on a substrate 35, the three magnetic sensor devices 3 are arranged on the outer peripheral side of the magnetic field forming component 2 at intervals of 120 degrees, and are arranged so that the distances between the three magnetic sensor devices 3 and the axis X of the rotating shaft 40 are respectively equal to each other, and are arranged so that the front of each magnetic sensor device 3 faces the axis X of the rotating shaft 40.
[0077] The procedure for placing the three magnetic sensor devices 3 on the substrate 35 is as follows.
[0078] First, if Fig.13 As shown in FIG. 1 , the substrate-side connectors 24 and 25 of the three magnetic sensor devices 3 are surface-mounted on the mounting surface 35A of the substrate 35. When the substrate-side connectors 24 and 25 are surface-mounted on the mounting surface 35A of the substrate 35, the positions of the substrate-side connectors 24 and 25 on the mounting surface 35A of the substrate 35 are determined so that these positions become the same as shown in FIG. Figure 1The positions of the sensor side connectors 14 and 15 in the three magnetic sensor devices 3 configured as shown are corresponding to each other. Next, the lower surfaces of the housings 26 of the substrate side connectors 24 and 25 are placed on the mounting surface 35A of the substrate 35. Since the lower surface of the housing 26 of the substrate side connector 24 is placed on the mounting surface 35A of the substrate 35, the substrate side connector 24 is provided on the mounting surface 35A of the substrate 35 in such a manner that the fitting portion 16 of the sensor side connector 14 can be fitted into the fitting portion 27 of the substrate side connector 24 from above. In addition, since the lower surface of the housing 26 of the substrate side connector 25 is placed on the mounting surface 35A of the substrate 35, the substrate side connector 25 is provided on the mounting surface 35A of the substrate 35 in such a manner that the fitting portion 16 of the sensor side connector 15 can be fitted into the fitting portion 27 of the substrate side connector 25 from above. Next, the substrate connection portion 33A of each terminal 33 of the substrate-side connectors 24 and 25 is soldered to the conductive portion provided on the mounting surface 35A of the substrate 35 by reflow soldering. Since the substrate connection portion 33A of each terminal 33 of the substrate-side connectors 24 and 25 is soldered to the conductive portion on the mounting surface 35A, the terminals 33 of the substrate-side connectors 24 and 25 are electrically connected to the conductive portion of the substrate 35, and the substrate-side connectors 24 and 25 are fixed to the substrate 35.
[0079] Next, the sensor units 4 of the three magnetic sensor devices 3 are connected to the substrate-side connectors 24 and 25, respectively. Specifically, in each magnetic sensor device 3, the fitting portions 16 of the sensor-side connectors 14 and 15 of the magnetic sensor 5 fixed to the housing 19 are fitted into the fitting portions 27 of the substrate-side connectors 24 and 25 from above the substrate-side connectors 24 and 25, respectively. Thus, the terminals 17 of the sensor-side connectors 14 and 15 are electrically connected to the terminals 33 of the substrate-side connectors 24 and 25, respectively. In addition, the sensor unit 4 is fixed to the substrate 35.
[0080] Fig.14 FIG. 2 shows a state where one magnetic sensor device 3 provided on a substrate 35 is viewed from the front. Fig.14 In the figure, the magnetic sensor 5 is indicated by a dotted line, but the yoke 18 is omitted. When the magnetic sensor device 3 is set on the substrate 35, as shown in FIG. Fig.14As shown, the substrate-side connectors 24 and 25 of the magnetic sensor device 3 are arranged on the mounting surface 35A of the substrate 35 in a state separated from each other. In addition, the housing 26 of the substrate-side connectors 24 and 25 protrudes upward from the mounting surface 35A of the substrate 35. In addition, the extension direction of the magnetic wire 6 and the bobbin 7 of the magnetic sensor 5 is parallel to the mounting surface 35A of the substrate 35. In addition, the sensor unit 4 is configured to bridge the substrate-side connector 24 and the substrate-side connector 25 separated from each other, and as a result, a space S in which other electrical and electronic components can be installed is formed between the lower surface of the left-right central part of the sensor unit 4 (the lower part of the outer peripheral surface of the coil 12 of the magnetic sensor 5) and the mounting surface 35A of the substrate 35.
[0081] (Magnetic field detection operation of magnetic sensor device)
[0082] Fig.15 (A) shows the positional relationship between the magnetic sensor 5 and the yoke 18 and the magnetic field forming member 2 in the three magnetic sensor devices 3 provided on the substrate 35. Fig.15 The magnetic field detection operation of the magnetic sensor device 3 will be described with reference to one magnetic sensor device 3 arranged on the upper side among the three magnetic sensor devices 3 in (A).
[0083] exist Fig.15 In (A), the S pole of the magnetic field forming component 2 is close to the left front of the upper magnetic sensor device 3, and the N pole of the magnetic field forming component 2 is close to the right front of the magnetic sensor device 3. When the rotating shaft 40 rotates 90 degrees clockwise from this state, as shown in FIG. Fig.15 As shown in (B), the N pole of the magnetic field forming component 2 is close to the left front of the magnetic sensor device 3, and the S pole of the magnetic field forming component 2 is close to the right front of the magnetic sensor device 3. At this time, the direction of the magnetic field acting on the magnetic wire 6 of the magnetic sensor device 3 changes to the right direction. As a result, the magnetization direction of the magnetic wire 6, which was in the left direction just before, is rapidly reversed to the right direction. As a result, Fig.15 As shown in (D) of FIG. 1 , a current pulse P1 in a positive direction, for example, is generated in the coil 12 .
[0084] Thereafter, when the rotating shaft 40 is further rotated 90 degrees clockwise, as shown in FIG. Fig.15 As shown in (C), the S pole of the magnetic field forming component 2 is close to the left front of the magnetic sensor device 3, and the N pole of the magnetic field forming component 2 is close to the right front of the magnetic sensor device 3. At this time, the direction of the magnetic field acting on the magnetic wire 6 of the magnetic sensor device 3 changes to the left direction. As a result, the magnetization direction of the magnetic wire 6, which was in the right direction just before, is rapidly reversed to the left direction. As a result, Fig.15 As shown in (D), a current pulse P2 in a negative direction, for example, is generated in the coil 12 .
[0085] One end of the insulated wire 13 forming the coil 12 is connected to, for example, a detection circuit provided on the substrate 35 via the terminal 17 of the sensor-side connector 14, the terminal 33 of the substrate-side connector 24, and a conductive portion provided on the mounting surface 35A of the substrate 35. In addition, the other end of the insulated wire 13 forming the coil 12 is connected to the above-mentioned detection circuit via the terminal 17 of the sensor-side connector 15, the terminal 33 of the substrate-side connector 25, and another conductive portion provided on the mounting surface 35A of the substrate 35. With this structure, the current pulses P1 and P2 generated in the coil 12 are output to the above-mentioned detection circuit as pulse signals.
[0086] The detection circuit detects the rotation amount and rotation direction of the rotating shaft 40 based on the pulse signals respectively outputted from the coils 12 of the magnetic sensors 5 of the three magnetic sensor devices 3 provided on the substrate 35. Among them, as a method for detecting the rotation amount and rotation direction of the rotating shaft 40 in the rotation detection device 1, for example, the method described in International Publication No. 2016 / 002437 can be used.
[0087] In order to increase the level of the current pulse generated in the coil 12 or to make the waveform of the current pulse sharp, it is preferable to concentrate the magnetic flux of the magnetic field formed by the two magnetic poles of the magnetic field forming member 2 near the left front and right front of the magnetic sensor device 3 on the magnetic line 6. Fig.15 (B) or Fig.15 As shown in (C), a yoke 18 is arranged between the magnetic sensor 5 and the magnetic field forming component 2. The yoke 18 controls the direction of the magnetic flux in such a way that the magnetic flux of the magnetic field formed by the two magnetic poles of the magnetic field forming component 2 close to the left front and right front of the magnetic sensor device 3 is concentrated on the magnetic line 6. Fig.15 (B) and Fig.15 Arrow F in (C) indicates the flow of magnetic flux whose direction is controlled by yoke 18. By concentrating magnetic flux on magnetic wire 6 by yoke 18, magnetic flux flows along the extending direction of magnetic wire 6 and magnetic flux passes through magnetic wire 6 reliably.
[0088] As described above, the magnetic sensor device 3 according to the embodiment of the present invention includes the sensor unit 4 including the magnetic sensor 5, and the substrate-side connectors 24 and 25, and the magnetic sensor 5 includes the sensor-side connectors 14 and 15. Then, the substrate-side connectors 24 and 25 are surface-mounted on the mounting surface 35A of the substrate 35 by reflow soldering, and thereafter, the sensor-side connectors 14 and 15 are connected to the substrate-side connectors 24 and 25, thereby enabling the magnetic sensor device 3 to be installed on the substrate 35. The volume of the substrate-side connectors 24 and 25 is smaller than the volume of the entire magnetic sensor device 3, and therefore, the heat capacity of the substrate-side connectors 24 and 25 is smaller than the heat capacity of the entire magnetic sensor device 3. Therefore, the difference in heat capacity between the substrate-side connectors 24 and 25 and other electrical and electronic components surface-mounted on the mounting surface 35A of the substrate 35 is smaller than the difference in heat capacity between the entire magnetic sensor device 3 and other electrical and electronic components surface-mounted on the mounting surface 35A of the substrate 35. Therefore, the substrate-side connectors 24 and 25 and other electrical and electronic components can be easily surface-mounted on the mounting surface 35A of the substrate 35 at one time by reflow soldering. Therefore, when the magnetic sensor device 3 and other electrical and electronic components are placed on the substrate 35, the soldering man-hours can be reduced.
[0089] In addition, in a state where the magnetic sensor device 3 is installed on the mounting surface 35A of the substrate 35, as shown in FIG. Fig.14 As shown, a space S in which other electric and electronic components can be mounted is formed between the lower surface of the left-right center portion of the sensor unit 4 (the lower portion of the outer peripheral surface of the coil 12 of the magnetic sensor 5) and the mounting surface 35A of the substrate 35. Therefore, the space S can be utilized to expand the space in which other electric and electronic components can be mounted on the mounting surface 35A of the substrate 35, and the number of other electric and electronic components mounted on the mounting surface 35A of the substrate 35 can be increased.
[0090] Furthermore, the magnetic sensor device 3 can be easily attached to and detached from the substrate 35 by plugging and unplugging the sensor-side connectors 14 and 15 and the substrate-side connectors 24 and 25. Therefore, the magnetic sensor device 3 can be easily replaced.
[0091] In addition, the sensor unit 4 of the magnetic sensor device 3 has a structure in which the magnetic sensor 5 and the yoke 18 are integrated via the housing 19. Therefore, compared with the case where the magnetic sensor 5 and the yoke 18 are separated from each other and constitute separate bodies, it is easy to mount the magnetic sensor 5 and the yoke 18 on the substrate 35, and the arrangement accuracy of the magnetic sensor 5 and the yoke 18 can be improved.
[0092] Furthermore, by integrating the yoke 18 and the housing 19 by insert molding, the assemblability of the sensor unit 4 can be improved, and the arrangement accuracy of the magnetic sensor 5 and the yoke 18 can be further improved.
[0093] Furthermore, since the magnetic field detection performed by the magnetic sensor device utilizes the large Barkhausen effect of magnetic wires, it can be performed without power supply.
[0094] In addition, if Fig.16 As shown, the housings 19 of the sensor units 4 of the three magnetic sensor devices may be connected via a connecting portion 45 .
[0095] In addition, although the above embodiment exemplifies the case where the magnetic sensor 5 and the yoke 18 are integrated via the housing 19, the present invention is not limited thereto. Fig.17 As shown, the magnetic sensor 5 and the yoke 18 may also be integrated with each other, for example, by screw connection, adhesive-based bonding, or the like, without using a housing.
[0096] In addition, although the board-side connector 24 in the above embodiment is provided with two terminals 33 , the board-side connector 24 may be provided with one terminal 33 . The same applies to the board-side connector 25 .
[0097] In the above embodiment, the sensor side connector 14 having the fitting portion 16 and the terminal 17 is provided at one end of the bobbin 7 of the magnetic sensor 5, and the substrate side connector 24 having the housing 26 having the fitting portion 27 and the terminal 33 is provided on the substrate 35 as a connector connected to the sensor side connector 14. However, it is also possible to provide, for example, a Fig.18 The sensor side connector 51 shown is provided on the substrate 35 Fig.18 The substrate-side connector 61 shown in FIG. 1 is used as a connector to be connected to the sensor-side connector 51. Fig.18 In the figure, the sensor side connector 51 is composed only of a terminal 52 having a wire connection portion 52A and a contact portion 52B. In addition, the contact portion 52B is arranged in a recess 53 provided on the lower surface of the wire support portion 9 of the bobbin 7. On the other hand, the substrate side connector 61 is formed only of a sleeve-shaped terminal 62. The terminal 62 is surface-mounted on the mounting surface 35A of the substrate 35 and is open upward. The contact portion 52B of the terminal 52 is engaged (inserted) into the sleeve-shaped terminal 62 from above. Thus, the sensor side connector 51 is connected to the substrate side connector 61. According to this structure, the contact portion 52B of the terminal 52 of the sensor side connector 51 and the sleeve-shaped terminal 62 of the substrate side connector 61 respectively have the function of serving as a mating portion. Therefore, the terminal 52 of the sensor side connector 51 is both a terminal and a mating portion, and the terminal 62 of the substrate side connector 61 is both a terminal and a mating portion. Similarly, a contact portion 52B may be provided at the other end of the bobbin 7 of the magnetic sensor 5. Fig.18The sensor side connector 51 is shown and is provided on the substrate 35 Fig.18 The illustrated board-side connector 61 is used as a connector to which the sensor-side connector 51 provided at the other end of the bobbin 7 of the magnetic sensor 5 is connected.
[0098] In addition, the magnetic sensor device of the present invention may be an embodiment in which a yoke is not used. In addition, the magnetic sensor device of the present invention may be applied to devices other than the rotation detection device.
[0099] The present invention can be modified appropriately within the scope that does not violate the gist or concept of the invention that can be read from the claims and the entire specification, and the magnetic sensor device accompanying such modification is also included in the technical concept of the present invention.
Claims
1. A magnetic sensor device, characterized in that: The magnetic sensor device comprises: A magnetic sensor comprising a magnetic wire that exerts a large Barkhausen effect, a bobbin in which the magnetic wire is disposed, a coil formed by winding an electric wire around the bobbin, a first connector provided at one end of the bobbin, and a second connector provided at the other end of the bobbin; a third connector detachably connected to the first connector; as well as a fourth connector detachably connected to the second connector; The first connector includes a first fitting portion and a first terminal connected to one end of the electric wire. The second connector includes a second fitting portion and a second terminal connected to the other end of the electric wire. The third connector includes a third fitting portion that fits with the first fitting portion, and a third terminal that contacts the first terminal when the first fitting portion fits with the third fitting portion. The fourth connector includes a fourth fitting portion that fits with the second fitting portion, and a fourth terminal that contacts the second terminal when the second fitting portion is fitted into the fourth fitting portion.
2. The magnetic sensor device according to claim 1, characterized in that The coil is disposed between one end and the other end of the bobbin. The first connector is disposed at a lower portion of one end portion of the bobbin. The second connector is provided at the lower part of the other end of the bobbin. The third connector is provided on the upper surface of the substrate in such a manner that the first fitting portion can be fitted into the third fitting portion from above the third fitting portion. The fourth connector is provided on the upper surface of the substrate in such a manner that the second fitting portion can be fitted into the fourth fitting portion from above the fourth fitting portion. The third connector and the fourth connector are arranged separately from each other on the upper surface of the substrate. When the first interlocking portion is interlocked with the third interlocking portion from above the third interlocking portion and the second interlocking portion is interlocked with the fourth interlocking portion from above the fourth interlocking portion, the magnetic wire and the winding tube extend parallel to the upper surface of the substrate, forming a space between the lower portion of the outer peripheral surface of the coil and the upper surface of the substrate.
3. The magnetic sensor device according to claim 1, characterized in that The third connector and the fourth connector are respectively surface-mounted on a substrate.
4. The magnetic sensor device according to claim 1, characterized in that A yoke is provided for controlling the direction of the magnetic flux of the external magnetic field. The magnetic yoke is fixed to the magnetic sensor.
5. The magnetic sensor device according to claim 1, characterized in that have: a magnetic yoke to control the direction of the magnetic flux of the external magnetic field; and a housing containing the magnetic sensor, The yoke is fixed to the housing.
6. The magnetic sensor device according to claim 5, characterized in that The yoke is integrated with the housing by insert molding.
