Intelligent reactor intelligent temperature control system and control process

Abstract

The present invention discloses an intelligent temperature control system for an intelligent reactor and its control process. The key technical aspects of the system are: a central processing unit (CPU); a temperature monitoring module connected to the CPU via an I2C interface for acquiring real-time temperatures inside and outside the chemical reactor, thereby transmitting external and internal temperature signals to the CPU; and a temperature regulation module coupled to the CPU via a drive circuit. The system utilizes a small, high-power AC relay connected to a semiconductor refrigeration unit and a heater to maintain a circuit break during heating, preventing instability caused by simultaneous heating or cooling. During signal transmission, the system also incorporates a single-channel output transistor coupler, which, through coupling, achieves electrical isolation and interference resistance, thereby improving control accuracy.

Description

Technical Field

[0001] The present invention relates to chemical experiment control technology, and more particularly to an intelligent temperature control system of an intelligent reactor and a control process. Background Art

[0002] Currently, in industrial processing and experimental testing, chemical substances need to be added to a reactor for mixing reaction, and the degree of reaction needs to be monitored to prepare the required additives. Referring to Chinese patent publication number CN207628423U, a reactor is disclosed, which includes a reactor body, a main stirring head provided in the reactor body, and a motor provided on the top of the reactor body. The main stirring head connected to the motor is driven by the motor to stir and mix the chemical materials in the reactor, and the bottom of the reactor body is fully stirred with the help of the first auxiliary stirring head and the second auxiliary stirring head.

[0003] The above solution solves the problems of low mixing efficiency and poor mixing uniformity of chemical substances. However, during the chemical reaction process, the chemical materials participating in the chemical reaction will produce heat absorption or heat release. For example, in the reaction mechanism of the neutralization reaction of alkali and acid to form salt, heat will be released, and different temperatures will also cause changes in reaction efficiency. During the reaction, in order to ensure the reaction rate, the stability of the substance and the purity of the reactants, the reaction temperature needs to be precisely controlled during the reaction. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide an intelligent temperature control system and control process for an intelligent reactor.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions: an intelligent reactor intelligent temperature control system, applied to chemical reactor reaction process control, including a central processing unit, and also including:

[0006] The temperature monitoring module is connected to the central processing unit through the I2C interface and is used to obtain the real-time temperature inside and outside the chemical reactor to transmit the external temperature signal and the internal temperature signal to the central processing unit;

[0007] A temperature regulating module is coupled to the central processing unit via a driving circuit, and is activated to adjust the temperature inside and outside the reactor in response to the internal temperature signal and the external temperature signal received by the central processing unit being higher or lower than a set reference temperature;

[0008] The drive circuit includes a cooling drive circuit, a heating drive circuit and a motor drive circuit, and the cooling drive circuit and the heating drive circuit each include a single-channel output transistor coupler and a transistor switch circuit, and the output end of the transistor switch circuit is connected to the temperature adjustment module;

[0009] The temperature regulation module includes at least two groups of semiconductor refrigeration chips and heaters. The output ends of the refrigeration drive circuit and the heating drive circuit are coupled to the semiconductor refrigeration chips and the heater via a small high-power AC relay. When the small high-power AC relay responds to the drive signal output by the refrigeration drive circuit to maintain the connection between the small high-power AC relay and the semiconductor refrigeration chip, the connection between the small high-power AC relay and the heater is disconnected.

[0010] By adopting the above-mentioned technical solution, in this application, the temperature conditions inside and outside the chemical reactor are monitored by a temperature monitoring module. By controlling the external temperature, the reaction conditions of the chemical substances can be controlled, thereby improving the reaction efficiency. At the same time, the internal temperature is monitored, and the reaction degree and progress of the chemical substances can be fed back. At the same time, the internal and external temperature conditions are compared. When heat or heat absorption during the reaction of the chemical substances affects the temperature inside the chemical reactor, the heater or semiconductor refrigeration chip can be driven by the heating drive circuit and the cooling drive circuit, thereby ensuring the stability of environmental factors during the reaction process and improving the reaction efficiency and purity. At the same time, in this application, a small high-power AC relay is used to connect the semiconductor refrigeration chip and the heater to keep the semiconductor refrigeration chip open during the heating operation, thereby avoiding instability caused by simultaneous heating or cooling. During the signal transmission process, a single-channel output transistor coupler is also provided in this application. Through coupling, electrical isolation and anti-interference can be achieved, thereby improving the control accuracy.

[0011] The present invention is further configured as follows: the input end of the single-channel output transistor coupler is connected to a central processing unit, receives a low-level digital signal output by the central processing unit to couple a coupling unit within the single-channel output transistor coupler, and the transistor switching circuit includes a switching transistor, the base of which is electrically connected to the central processing unit and turns on the switching transistor in response to a high-level signal output by the central processing unit. The collector of the switching transistor is connected to a power supply, the emitter of the switching transistor is connected in series with a fixed resistor and then to ground, and the emitter of the switching transistor is connected as an output end to a small high-power AC relay.

[0012] By adopting the above technical solution, the coupled connection of the single-channel output transistor coupler can realize the mirror signal replication in response to the high-level segment and low-level segment of the heating pulse signal or the cooling pulse signal, and the existing high-frequency or low-frequency noise signals will be filtered during the coupled transmission, thereby ensuring the stability and accuracy of the heating pulse signal or the cooling pulse signal after transmission, and can accurately adjust the working efficiency of the heater and the semiconductor refrigerator. At the same time, the output end is coupled to the transistor switching circuit, and the switching transistor is used as the switching component. By turning on and off the switching transistor, a small high-power AC relay can be controlled to realize the conduction and cutoff of a small current to control the conduction and cutoff of a large current.

[0013] The present invention is further configured such that: the output end of the single-channel output transistor coupler and the transistor switch circuit are commonly connected to a multi-interface terminal, and the multi-interface terminal is electrically connected to a temperature adjustment module for controlling heating and cooling power supply.

[0014] By adopting the above technical solution, the setting of multi-interface terminal blocks facilitates the connection of multiple modules when realizing circuit layout and assembly, and the multi-interface terminal blocks can ensure the consistency of power supply current, voltage values ​​and pulse signals in multiple modules.

[0015] The present invention is further configured as follows: the temperature adjustment module further includes a low-side switch circuit and a high-side switch circuit, the low-side switch circuit and the high-side switch circuit being based on an NMOS transistor and a PMOS transistor, respectively; the output end of the single-channel output transistor coupler is connected to the gate of the NMOS transistor, the source of the NMOS transistor is grounded, the drain of the NMOS transistor is connected in series with a plurality of resistors and then connected to the gate of the PMOS transistor, and the source of the PMOS transistor is connected to the output end of a small high-power AC relay;

[0016] When the central processing unit responds to a cooling or heating instruction, it outputs a cooling pulse signal or a heating pulse signal to the single-channel output transistor coupler. The single-channel output transistor coupler responds to the low-level segment of the cooling pulse signal or the heating pulse signal to conduct and output a low level, and responds to the high-level segment of the cooling pulse signal or the heating pulse signal to output a high level.

[0017] The cooling pulse signal or heating pulse signal output by the central processing unit is output to the low-side switching circuit via a single-channel output transistor coupler, and a symmetrical pulse signal that is a reverse mirror image of the cooling pulse signal or the heating pulse signal is output to the high-side switching circuit via the low-side switching circuit. The high-side switching circuit responds to the high-level pulse segment to be in a conductive state, and the output end of the high-side switching circuit is electrically connected to the heater or the semiconductor refrigeration plate.

[0018] By adopting the above technical solution, the NMOS tube and the PMOS tube constitute a low-side switch circuit and a high-side switch circuit, and the low-side switch circuit and the high-side switch circuit are connected to each other, so that two symmetrical pulse signals that are mirror images of each other can be obtained through the same pulse signal, ensuring the same frequency of the signal, and can control the switch of the heater or semiconductor cooling plate.

[0019] The present invention is further configured as follows: a unidirectional diode is connected between the source and drain of the NMOS tube and the PMOS tube, the unidirectional diode located in the NMOS tube is used to realize unidirectional conduction of current from the source to the drain, and the unidirectional diode located in the PMOS tube is used to realize unidirectional conduction of current from the drain to the source.

[0020] By adopting the above technical solution, electrical protection of the NMOS tube and the PMOS tube is achieved with the help of parallel unidirectional diodes, and the voltage of the potential point at the common connection point of the NMOS tube and the PMOS tube can be controlled through the unidirectional conduction performance.

[0021] The present invention is further configured as follows: the temperature monitoring module also includes a self-calibrating analog-to-digital converter and a reference source circuit electrically connected to the self-calibrating analog-to-digital converter, pins 3 and 4 of the self-calibrating analog-to-digital converter are respectively connected to the central processing unit, the input terminal VIN+ and the input terminal VIN- of the self-calibrating analog-to-digital converter are respectively electrically connected to the potential point of the reference source circuit, for obtaining a reference potential signal provided by the reference source circuit, and an isolation capacitor is connected in series between the input terminal VIN+ and the input terminal VIN- of the same self-calibrating analog-to-digital converter.

[0022] By adopting the above technical solution, with the help of a self-calibrating analog-to-digital converter, the same analog signal is provided in the reference source circuit, and the self-calibrating analog-to-digital converter is used to achieve precise signal processing, thereby improving the accuracy of data signal transmission through the I2C port.

[0023] The present invention is further configured as follows: the reference source circuit includes a controllable precision voltage regulator based on a chip TL431, pin 3 of the chip TL431 is grounded, pin 2 of the chip is connected in series with a pull-up resistor to a power supply, and a capacitor is connected between one end of the pull-up resistor connected to the power supply and the ground, a first voltage divider resistor and a second voltage divider resistor are connected in series between pins 2 and 3 of the chip TL431, pin 1 of the chip TL431 is electrically connected to a common pin connecting the first voltage divider resistor and the second voltage divider resistor, pin 2 of the chip TL431 is connected in series with two pull-down resistors, the common pin of the two pull-down resistors is electrically connected to the input terminal VIN+ of the self-calibration analog-to-digital converter, pin 2 of the chip TL431 is electrically connected to several calibration resistors with the same resistance as one of the pull-down resistors, and the ends of the two calibration resistors away from the chip TL431 are respectively connected to the input terminals VIN- of the two self-calibration analog-to-digital converters.

[0024] The present invention is further configured to include: a transistor coupler, which is connected to a central processing unit, receives a pulse signal output from the central processing unit for driving a stirring motor, and outputs a PWN-adjustable square wave pulse signal through the transistor coupler to a motor terminal for connecting the stirring motor.

[0025] The present invention is further configured as follows: a control process of the intelligent temperature control system of the intelligent reactor, wherein the control process is as follows: after the intelligent reactor is powered on and started, the temperature condition inside the chemical reactor is obtained through the temperature monitoring module; when the temperature inside the reactor meets the preset value, the temperature outside the reactor is monitored to determine whether cooling or heating needs to be turned on;

[0026] When the internal or external temperature of the reactor deviates from the preset value, temperature control is performed:

[0027] The reactor temperature sensor and the reactor external temperature sensor are connected to the central processing unit via the I2C interface, and the acquired temperature conditions are transmitted to the central processing unit via the I2C interface. The acquired temperature conditions are transmitted to the central processing unit through the self-calibration analog-to-digital converter in the temperature monitoring module. The central processing unit receives the temperature conditions via the SLC port and the SDA port and compares the data with the set temperature preset value. When the actual temperature condition is lower than the set temperature preset value, the central processing unit outputs a heating pulse signal. The heating pulse signal is output to the low-side switching circuit via the single-channel output transistor coupler. The low-side switching circuit outputs a symmetrical pulse signal that is a reverse mirror image of the heating pulse signal to the high-side switching circuit. The high-side switching circuit responds to the high-level pulse segment to be in a conducting state. The output end of the high-side switching circuit is connected to the heater. The heating efficiency of the heater is controlled by modulating the pulse frequency output by the heating pulse signal.

[0028] When the actual temperature is higher than the set temperature preset value, the central processing unit outputs a cooling pulse signal, which is output to the low-side switch circuit through the single-channel output transistor coupler. The low-side switch circuit outputs a symmetrical pulse signal that is a reverse mirror image of the cooling pulse signal to the high-side switch circuit. The high-side switch circuit responds to the high-level pulse segment to be in a conducting state. The output end of the high-side switch circuit is connected to the heater, and the working efficiency of the semiconductor refrigeration chip is controlled by modulating the pulse frequency output by the cooling pulse signal.

[0029] When the actual temperature is adjusted to the set temperature preset value, the central processing unit outputs a pulse signal for driving the stirring motor. The pulse signal outputs a PWN-adjustable square wave pulse signal to the motor terminal for connecting the stirring motor through the transistor coupler. The stirring motor starts to stir and mix the chemical solvent in the chemical reactor. When the stirring motor is driven, the temperature monitoring module monitors the temperature inside and outside the chemical reactor at the same time. When the actual temperature deviates from the set temperature preset value, the central processing unit is fed back to modulate the heating pulse signal or the cooling pulse signal.

[0030] The present invention is further configured as follows: when the actual temperature situation deviates from the set temperature preset value, the central processing unit outputs a heating pulse signal or a cooling pulse signal to a single-channel output transistor coupler for signal sorting, and then transmits the heating signal or cooling signal to a small high-power AC relay through a multi-interface terminal. After the small high-power AC relay receives the heating signal or cooling signal, it keeps the adjacent cooling signal or heating signal open.

[0031] In summary, the present invention has the following beneficial effects:

[0032] In this application, the temperature conditions inside and outside the chemical reactor are monitored by a temperature monitoring module. By controlling the external temperature, the reaction conditions of the chemical substances can be controlled, thereby improving the reaction efficiency. At the same time, the internal temperature is monitored to provide feedback on the reaction degree and progress of the chemical substances. By comparing the internal and external temperature conditions, when heat or heat absorption during the reaction of the chemical substances affects the temperature inside the chemical reactor, the heater or semiconductor refrigerator can be driven by the heating drive circuit and the cooling drive circuit, thereby ensuring the stability of environmental factors during the reaction and improving the reaction efficiency and purity. At the same time, in this application, a small high-power AC relay is used to connect the semiconductor refrigerator and the heater to keep the semiconductor refrigerator open during the heating operation, thereby avoiding instability caused by simultaneous heating or cooling. During the signal transmission process, a single-channel output transistor coupler is also provided in this application. Through coupling, electrical isolation and anti-interference can be achieved, thereby improving the control accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 is a system block diagram of the present invention;

[0035] Figure 2 This is a circuit diagram of the central processing unit in the present invention;

[0036] Figure 3 Schematic diagram of the circuit of the self-calibrating analog-to-digital converter in the present invention;

[0037] Figure 4 1 is a circuit diagram of the motor drive circuit of the present invention;

[0038] Figure 5 Schematic diagram of the cooling drive circuit and the heating drive circuit in the present invention;

[0039] Figure 6 This is a circuit diagram of the temperature adjustment module in the present invention;

[0040] Figure 7 The electrical wiring diagram for the small and medium-sized high-power AC relays in the temperature control module;

[0041] Figure 8 This is a circuit diagram of the alarm module in the present invention;

[0042] Figure 9 This is a circuit diagram of the power module in the present invention.

[0043] On the figure: 1. Central processing unit; 2. Temperature monitoring module; 3. Temperature regulation module; 4. Refrigeration drive circuit; 5. Heating drive circuit; 6. Motor drive circuit; 7. Transistor switching circuit; 8. Low-side switch circuit; 9. High-side switch circuit; 10. Self-calibration analog-to-digital converter; 11. Reference source circuit. DETAILED DESCRIPTION

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0045] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0046] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. Example 1

[0047] like Figure 1 and Figure 2 As shown, an intelligent temperature control system for an intelligent reactor is applied to the reaction process control of a chemical reactor, comprising a central processing unit 1 and further comprising:

[0048] The temperature monitoring module 2 is connected to the central processing unit 1 through the I2C interface and is used to obtain the real-time temperature inside and outside the chemical reactor to transmit the external temperature signal and the internal temperature signal to the central processing unit 1;

[0049] The temperature regulating module 3 is coupled to the central processing unit 1 through a driving circuit. When the internal temperature signal and the external temperature signal received by the central processing unit 1 are higher or lower than the set reference temperature, the temperature regulating module 3 is activated to adjust the temperature inside and outside the reactor.

[0050] The drive circuit includes a cooling drive circuit 4, a heating drive circuit 5, and a motor drive circuit 6. The cooling drive circuit 4 and the heating drive circuit 5 each include a single-channel output transistor coupler and a transistor switch circuit 7. The output end of the transistor switch circuit 7 is connected to the temperature adjustment module 3.

[0051] The temperature adjustment module 3 includes at least two groups of semiconductor refrigeration chips and heaters. The output ends of the cooling drive circuit 4 and the heating drive circuit 5 are coupled to the semiconductor refrigeration chips and the heater via a small high-power AC relay. When the small high-power AC relay responds to the driving signal output by the cooling drive circuit 4 to maintain the connection between the small high-power AC relay and the semiconductor refrigeration chip, and disconnects the small high-power AC relay from the heater, and in this embodiment, as Figure 8 As shown, the central processing unit 1 is also electrically connected to the alarm module, which includes a transistor, an indicator light and a buzzer. When the central processing unit 1 outputs a high-level signal to the transistor, the indicator light and the buzzer complete the work of the alarm, and an ultra-low power timer based on the chip TPL5010DDCR is set, which can maintain the μC in low power mode to save current to the maximum extent, and wake up only in certain time intervals to collect data or provide services for interrupts.

[0052] like Figure 9 As shown, in this embodiment, a power supply module is also provided, which is connected to 24V DC through the power management chip EG1192L and outputs 5V DC through the filter capacitor, filter inductor and voltage regulator diode D2.

[0053] like Figure 5 As shown, the input end of the single-channel output transistor coupler is connected to the central processing unit 1, and receives the low-level digital signal output by the central processing unit 1 to couple the coupling unit in the single-channel output transistor coupler. The transistor switching circuit 7 includes a switching transistor, the base of which is electrically connected to the central processing unit 1. In response to the high-level signal output by the central processing unit 1, the switching transistor is turned on. The collector of the switching transistor is connected to the power supply, the emitter of the switching transistor is connected in series with a fixed resistor and then to ground, and the emitter of the switching transistor is connected to a small high-power AC relay as an output end. The output ends of the single-channel output transistor coupler and the transistor switching circuit 7 are commonly connected to a multi-interface terminal, which is electrically connected to the temperature adjustment module 3 for controlling the heating and cooling power supply.

[0054] like Figure 2As shown, in the present embodiment, the central processing unit 1 is based on the STM32 series single-chip microcomputer, and specifically selects the STM32F103 chip. The PB port of the STM32F103 chip is connected in series with the temperature sensor as the serial interface of the I2C structure, and in the present embodiment, at least two groups of temperature sensors are provided, which are respectively arranged inside the chemical reactor and outside the chemical reactor; and the PD port of the STM32F103 chip is defined as the control port of the stirring motor, and the start and stop control of the stirring motor is realized by electrically connecting the motor drive circuit 6. The PC port of the STM32F103 chip is used as the control port for temperature control, and is connected to the heater and the semiconductor refrigeration sheet through the heating drive circuit 5 and the cooling drive circuit 4, respectively.

[0055] like Figure 6 、 Figure 7 As shown, the temperature adjustment module 3 further includes a low-side switch circuit 8 and a high-side switch circuit 9. The low-side switch circuit 8 and the high-side switch circuit 9 are based on an NMOS transistor and a PMOS transistor, respectively. The output end of the single-channel output transistor coupler is connected to the gate of the NMOS transistor, the source of the NMOS transistor is grounded, the drain of the NMOS transistor is connected in series with several resistors and then connected to the gate of the PMOS transistor, and the source of the PMOS transistor is connected to the output end of a small high-power AC relay. A unidirectional diode is connected between the source and drain of the NMOS transistor and the PMOS transistor. The unidirectional diode located in the NMOS transistor is used to achieve unidirectional conduction of current from the source to the drain, and the unidirectional diode located in the PMOS transistor is used to achieve unidirectional conduction of current from the drain to the source.

[0056] When the central processing unit 1 responds to a cooling or heating instruction, it outputs a cooling pulse signal or a heating pulse signal to the single-channel output transistor coupler. The single-channel output transistor coupler responds to the low-level segment of the cooling pulse signal or the heating pulse signal to conduct and output a low level, and responds to the high-level segment of the cooling pulse signal or the heating pulse signal to output a high level.

[0057] The cooling pulse signal or heating pulse signal output by the central processing unit 1 is output to the low-side switching circuit 8 through a single-channel output transistor coupler, and a symmetrical pulse signal that is a reverse mirror image of the cooling pulse signal or the heating pulse signal is output to the high-side switching circuit 9 through the low-side switching circuit 8. The high-side switching circuit 9 responds to the high-level pulse segment to be in a conductive state, and the output end of the high-side switching circuit 9 is electrically connected to the heater or the semiconductor refrigeration chip.

[0058] like Figure 3As shown, the temperature monitoring module 2 also includes a self-calibration analog-to-digital converter 10 and a reference source circuit 11 electrically connected to the self-calibration analog-to-digital converter 10. Pins 3 and 4 of the self-calibration analog-to-digital converter 10 are respectively connected to the central processing unit 1. The input terminal VIN+ and the input terminal VIN- of the self-calibration analog-to-digital converter 10 are respectively electrically connected to the potential point of the reference source circuit 11 for obtaining the reference potential signal provided by the reference source circuit 11. An isolation capacitor is connected in series between the input terminal VIN+ and the input terminal VIN- of the same self-calibration analog-to-digital converter 10.

[0059] like Figure 3 As shown, the reference source circuit 11 includes a controllable precision voltage regulator based on the chip TL431, pin 3 of the chip TL431 is grounded, pin 2 of the chip is connected in series with a pull-up resistor to the power supply, and a capacitor is connected between one end of the pull-up resistor connected to the power supply and the ground, a first voltage divider resistor and a second voltage divider resistor are connected in series between pins 2 and 3 of the chip TL431, pin 1 of the chip TL431 is electrically connected to the common pin connecting the first voltage divider resistor and the second voltage divider resistor, pin 2 of the chip TL431 is connected in series with two pull-down resistors, the common pin of the two pull-down resistors is electrically connected to the input terminal VIN+ of the self-calibration analog-to-digital converter 10, pin 2 of the chip TL431 is electrically connected to a number of calibration resistors with the same resistance as one of the pull-down resistors, and the ends of the two calibration resistors away from the chip TL431 are respectively connected to the input terminals VIN- of the two self-calibration analog-to-digital converters 10.

[0060] like Figure 4 As shown, it also includes a transistor coupler, which is connected to the central processing unit 1 and receives a pulse signal output from the central processing unit 1 for driving the stirring motor. The pulse signal outputs a PWN-adjustable square wave pulse signal to the motor terminal for connecting the stirring motor through the transistor coupler. Example 2

[0061] The control process of the intelligent temperature control system of the intelligent reactor is applied to the operation process control of the intelligent temperature control system of the intelligent reactor. The control process is as follows: after the intelligent reactor is powered on and started, the temperature condition inside the chemical reactor is obtained through the temperature monitoring module 2. When the temperature inside the reactor meets the preset value, the temperature outside the reactor is monitored to determine whether cooling or heating needs to be turned on;

[0062] When the internal or external temperature of the reactor deviates from the preset value, temperature control is performed:

[0063] The reactor temperature sensor and the reactor external temperature sensor are connected to the central processor 1 via the I2C interface, and the acquired temperature conditions are transmitted to the central processor 1 via the I2C interface. The acquired temperature conditions are transmitted to the central processor 1 through the self-calibration analog-to-digital converter 10 in the temperature monitoring module 2. The central processor 1 receives the temperature conditions via the SLC port and the SDA port and compares the data with the set temperature preset value. When the actual temperature condition is lower than the set temperature preset value, the central processor 1 outputs a heating pulse signal. The heating pulse signal is output to the low-side switch circuit 8 via the single-channel output transistor coupler. The low-side switch circuit 8 outputs a symmetrical pulse signal that is a reverse mirror image of the heating pulse signal to the high-side switch circuit 9. The high-side switch circuit 9 responds to the high-level pulse segment to be in a conducting state. The output end of the high-side switch circuit 9 is connected to the heater, and the heating efficiency of the heater is controlled by modulating the pulse frequency output by the heating pulse signal.

[0064] When the actual temperature is higher than the set temperature preset value, the central processing unit 1 outputs a cooling pulse signal, which is output to the low-side switch circuit 8 via the single-channel output transistor coupler. The low-side switch circuit 8 outputs a symmetrical pulse signal that is a reverse mirror image of the cooling pulse signal to the high-side switch circuit 9. The high-side switch circuit 9 responds to the high-level pulse segment to be in a conducting state. The output end of the high-side switch circuit 9 is connected to the heater. By modulating the pulse frequency output by the cooling pulse signal, the working efficiency of the semiconductor refrigeration chip is controlled.

[0065] When the actual temperature is adjusted to the set temperature preset value, the central processing unit 1 outputs a pulse signal for driving the stirring motor. The pulse signal outputs a PWN-adjustable square wave pulse signal to the motor terminal for connecting the stirring motor through the transistor coupler. The stirring motor starts to stir and mix the chemical solvent in the chemical reactor. When the stirring motor is driven, the temperature monitoring module 2 simultaneously monitors the temperature inside and outside the chemical reactor. When the actual temperature deviates from the set temperature preset value, the central processing unit 1 is fed back to modulate the heating pulse signal or the cooling pulse signal.

[0066] When the actual temperature deviates from the set temperature preset value, the central processing unit 1 outputs a heating pulse signal or a cooling pulse signal to the single-channel output transistor coupler for signal processing, and then transmits the heating signal or cooling signal to the small high-power AC relay through the multi-interface terminal. After the small high-power AC relay receives the heating signal or cooling signal, it keeps the adjacent cooling signal or heating signal open.

[0067] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. An intelligent temperature control system for an intelligent reactor, applied to the reaction process control of a chemical reactor, characterized by: The invention comprises a central processing unit (1), and further comprises: The temperature monitoring module (2) is connected to the central processing unit (1) via an I2C interface and is used to obtain the real-time temperature inside and outside the chemical reactor to transmit the external temperature signal and the internal temperature signal to the central processing unit (1); A temperature regulating module (3) is coupled to the central processing unit (1) via a driving circuit, and in response to the internal temperature signal and the external temperature signal received by the central processing unit (1) being higher or lower than a set reference temperature, the temperature regulating module (3) is activated to adjust the temperature inside and outside the reactor; The drive circuit comprises a cooling drive circuit (4), a heating drive circuit (5) and a motor drive circuit (6); the cooling drive circuit (4) and the heating drive circuit (5) each comprise a single-channel output transistor coupler and a transistor switch circuit (7); the output end of the transistor switch circuit (7) is connected to the temperature adjustment module (3); The temperature regulating module (3) comprises at least two groups of semiconductor refrigeration chips and heaters, the output ends of the refrigeration drive circuit (4) and the heating drive circuit (5) are coupled to the semiconductor refrigeration chips and the heater via a small high-power AC relay, and when the small high-power AC relay responds to the drive signal output by the refrigeration drive circuit (4) to maintain the connection between the small high-power AC relay and the semiconductor refrigeration chips, the connection between the small high-power AC relay and the heater is disconnected; The input end of the single-channel output transistor coupler is connected to the central processing unit (1), and receives the low-level digital signal output by the central processing unit (1) to couple the coupling unit in the single-channel output transistor coupler. The transistor switch circuit (7) includes a switch transistor, the base of which is electrically connected to the central processing unit (1), and responds to the high-level signal output by the central processing unit (1) to turn on the switch transistor. The collector of the switch transistor is connected to a power supply, the emitter of the switch transistor is connected in series with a fixed resistor and then grounded, and the emitter of the switch transistor is connected to a small high-power AC relay as an output end; The output ends of the single-channel output transistor coupler and the transistor switch circuit (7) are commonly connected to a multi-interface wiring terminal, and the multi-interface wiring terminal is electrically connected to the temperature adjustment module (3) for controlling the heating and cooling power supply; The temperature regulating module (3) further comprises a low-side switch circuit (8) and a high-side switch circuit (9), wherein the low-side switch circuit (8) and the high-side switch circuit (9) are based on an NMOS tube and a PMOS tube, respectively; the output end of the single-channel output transistor coupler is connected to the gate of the NMOS tube; the source of the NMOS tube is grounded; the drain of the NMOS tube is connected in series with a plurality of resistors and then connected to the gate of the PMOS tube; and the source of the PMOS tube is connected to the output end of a small high-power AC relay; When the central processing unit (1) responds to a cooling or heating instruction, it outputs a cooling pulse signal or a heating pulse signal to the single-channel output transistor coupler, and the single-channel output transistor coupler responds to a low-level segment of the cooling pulse signal or the heating pulse signal to conduct and output a low level, and responds to a high-level segment of the cooling pulse signal or the heating pulse signal to output a high level; The cooling pulse signal or heating pulse signal output by the central processing unit (1) is output to a low-side switch circuit (8) via a single-channel output transistor coupler, and a symmetrical pulse signal that is a reverse mirror image of the cooling pulse signal or the heating pulse signal is output to a high-side switch circuit (9) via the low-side switch circuit (8). The high-side switch circuit (9) responds to a high-level pulse segment to be in a conducting state, and the output end of the high-side switch circuit (9) is electrically connected to a heater or a semiconductor refrigeration chip.

2. The intelligent temperature control system for an intelligent reactor according to claim 1, characterized in that: A unidirectional diode is connected between the source and drain of the NMOS tube and the PMOS tube. The unidirectional diode located in the NMOS tube is used to realize unidirectional conduction of current from the source to the drain, and the unidirectional diode located in the PMOS tube is used to realize unidirectional conduction of current from the drain to the source.

3. The intelligent temperature control system for an intelligent reactor according to claim 1, characterized in that: The temperature monitoring module (2) further comprises a self-calibrating analog-to-digital converter (10) and a reference source circuit (11) electrically connected to the self-calibrating analog-to-digital converter (10); pins 3 and 4 of the self-calibrating analog-to-digital converter (10) are respectively connected to the central processing unit (1); the input terminal VIN+ and the input terminal VIN- of the self-calibrating analog-to-digital converter (10) are respectively electrically connected to the potential point of the reference source circuit (11) for obtaining a reference potential signal provided by the reference source circuit (11); and an isolation capacitor is connected in series between the input terminal VIN+ and the input terminal VIN- of the same self-calibrating analog-to-digital converter (10).

4. The intelligent temperature control system for an intelligent reactor according to claim 3, characterized in that: The reference source circuit (11) includes a controllable precision voltage stabilizing source based on a chip TL431, wherein the 3rd pin of the chip TL431 is grounded, the 2nd pin of the chip is connected in series with a pull-up resistor to a power supply, and a capacitor is connected between one end of the pull-up resistor connected to the power supply and the ground, a first voltage divider resistor and a second voltage divider resistor are connected in series between the 2nd and 3rd pins of the chip TL431, the 1st pin of the chip TL431 is electrically connected to a common pin connected to the first voltage divider resistor and the second voltage divider resistor, the 2nd pin of the chip TL431 is connected in series with two pull-down resistors, the common pin of the two pull-down resistors is electrically connected to the input terminal VIN+ of a self-calibration analog-to-digital converter (10), the 2nd pin of the chip TL431 is electrically connected to a plurality of calibration resistors with the same resistance as one of the pull-down resistors, and the ends of the two calibration resistors away from the chip TL431 are respectively connected to the input terminals VIN- of two self-calibration analog-to-digital converters (10).

5. The intelligent temperature control system for an intelligent reactor according to claim 1, characterized in that: The invention also includes a transistor coupler, which is connected to the central processing unit (1) and receives a pulse signal output from the central processing unit (1) for driving the stirring motor. The pulse signal outputs a square wave pulse signal with adjustable PWN to a motor terminal for connecting the stirring motor through the transistor coupler.

6. A control process of an intelligent temperature control system for an intelligent reactor, applied to the operation process control of the intelligent temperature control system for an intelligent reactor according to any one of claims 1 to 5, characterized in that: The control process is as follows: after the intelligent reactor is powered on and started, the temperature condition inside the chemical reactor is obtained through the temperature monitoring module (2). When the temperature inside the reactor meets the preset value, the temperature outside the reactor is monitored to determine whether cooling or heating is required. When the internal or external temperature of the reactor deviates from the preset value, temperature control is performed: The reactor temperature sensor and the reactor external temperature sensor are connected to the central processing unit (1) via the I2C interface, and the acquired temperature conditions are transmitted to the central processing unit (1) via the I2C interface. The acquired temperature conditions are transmitted to the central processing unit (1) via the self-calibration analog-to-digital converter (10) in the temperature monitoring module (2). The central processing unit (1) receives the temperature conditions via the SLC port and the SDA port and compares the data with the set temperature preset value. When the actual temperature condition is lower than the set temperature preset value, the central processing unit (1) outputs a heating pulse signal. The heating pulse signal is output to the low-side switch circuit (8) via the single-channel output transistor coupler. The low-side switch circuit (8) outputs a symmetrical pulse signal that is a reverse mirror image of the heating pulse signal to the high-side switch circuit (9). The high-side switch circuit (9) responds to the high-level pulse segment to be in a conducting state. The output end of the high-side switch circuit (9) is connected to the heater. The heating efficiency of the heater is controlled by modulating the pulse frequency output by the heating pulse signal. When the actual temperature is higher than the set temperature preset value, the central processing unit (1) outputs a cooling pulse signal, and the cooling pulse signal is output to the low-side switch circuit (8) through the single-channel output transistor coupler. The low-side switch circuit (8) outputs a symmetrical pulse signal that is a reverse mirror image of the cooling pulse signal to the high-side switch circuit (9). The high-side switch circuit (9) responds to the high-level pulse segment to be in a conducting state. The output end of the high-side switch circuit (9) is connected to the heater, and the working efficiency of the semiconductor refrigeration plate is controlled by modulating the pulse frequency output by the cooling pulse signal. When the actual temperature is adjusted to the set temperature preset value, the central processing unit (1) outputs a pulse signal for driving the stirring motor. The pulse signal outputs a PWN adjustable square wave pulse signal to the motor terminal for connecting the stirring motor through the transistor coupler. The stirring motor starts to stir and mix the chemical solvent in the chemical reactor. When the stirring motor is driven, the temperature monitoring module (2) monitors the temperature inside and outside the chemical reactor at the same time. When the actual temperature deviates from the set temperature preset value, the central processing unit (1) is fed back to modulate the heating pulse signal or the cooling pulse signal.

7. The control process of the intelligent temperature control system for an intelligent reactor according to claim 6 is characterized in that: When the actual temperature situation deviates from the set temperature preset value, the central processing unit (1) outputs a heating pulse signal or a cooling pulse signal to a single-channel output transistor coupler for signal sorting, and then transmits the heating signal or cooling signal to a small high-power AC relay through a multi-interface terminal. After the small high-power AC relay receives the heating signal or cooling signal, it keeps the adjacent cooling signal or heating signal open.

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