A semiconductor packaging structure

Abstract

The present invention relates to the field of semiconductor packaging technology, and more specifically, to a semiconductor packaging structure, including a package, a metal frame, pins, a top plate, a heat sink, a bottom plate and a chip body, etc.; a bottom plate is installed at the bottom of the package, a heat sink is connected to the top of the package in a snap-fit ​​manner, a top plate is connected to the top of the heat sink, a heat sink assembly is arranged inside the heat sink, a metal frame is installed on the lower side of the package, a plurality of pins are evenly connected at two places of the metal frame, the pins extend from two places of the package, and a chip body is snap-fitted inside the package. Through components such as heat insulation tubes, arc frames, capillaries and connecting tubes, rapid absorption and uniform distribution of heat are achieved, ensuring that the chip maintains a low temperature during operation, and improving working stability and life; the suction ball and the metal frame are magnetically matched, and the clamp block and the spring are combined to ensure that the chip body is stable inside the package, and a good electrical connection can be maintained even in a vibration or impact environment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging structure. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductor packaging refers to the process of packaging a chip in a shell after it is manufactured in order to protect the chip, achieve electrical connection, and facilitate application.

[0003] For example, the semiconductor packaging structure disclosed in Chinese patent CN115939063A aims to solve the problem that semiconductor chips will generate a certain amount of heat when in use. After the chip is packaged, the chip body is wrapped by packaging glue, and the thermal conductivity between the packaging glue and the thermal pad is poor, which will restrict the heat dissipation of the chip to a certain extent. The above patent improves the heat dissipation efficiency by achieving surface contact between the chip body and the heat dissipation tube and the heat dissipation plate. The heat of the heat dissipation tube can be transferred to the heat dissipation plate on the one hand, and to the heat dissipation teeth and the plastic sealing layer on the other hand. The heat of the plastic sealing layer can be transferred to the adjacent heat dissipation teeth, realizing multi-directional heat dissipation of the chip body and improving the heat dissipation efficiency; however, the heat transfer between components such as the heat dissipation tube and the heat dissipation plate may still have some deficiencies in actual use, as follows:

[0004] 1. Although heat transfer can be improved by contact between the heat sink and the heat plate, it may not be enough to completely remove the heat generated by the chip in high power consumption applications.

[0005] 2. The static contact surface may wear over time, affecting the heat dissipation effect. In addition, the design of the heat dissipation teeth may affect the flow of the plastic sealant under special circumstances, resulting in uneven distribution of the plastic sealant and affecting the packaging quality. Summary of the invention

[0006] In order to overcome the above-mentioned shortcomings of the prior art, the present invention provides a semiconductor packaging structure with better heat dissipation and more secure sealing.

[0007] In order to solve the above technical problems, the present invention provides a semiconductor packaging structure, including a package, a metal frame, pins, a top plate, a heat sink, a bottom plate, a chip body, a suction ball and a heat dissipation component, wherein a bottom plate is installed at the bottom of the package, a heat sink is connected to the top of the package in a snap-fitting manner, a top plate is connected to the top of the heat sink, a heat dissipation component is arranged in the heat sink, a metal frame is installed on the lower side of the package, a plurality of pins are evenly connected at two places of the metal frame, the pins extend from two places of the package, a chip body is snap-fitted in the package, a plurality of suction balls are evenly arranged at the bottom of the chip body, a plurality of snap-fitting grooves are opened at the bottom of the package, and the suction balls pass through the snap-fitting grooves to magnetically cooperate with the top surface of the metal frame.

[0008] As an improvement of the above solution, the heat sink has a cavity inside for accommodating cooling liquid, the bottom surface of the heat sink is closed, and the bottom surface of the heat sink is in contact with the top surface of the chip body below.

[0009] As an improvement of the above scheme, the heat dissipation component includes an insulation tube, an arc frame, a capillary tube and a connecting tube. A plurality of insulation tubes are evenly spaced and connected inside the heat dissipation element. The insulation tubes pass through the top of the heat dissipation element. An arc frame for gathering heat sources is installed in the middle of the heat dissipation element. The middle of the insulation tube passes through the arc frame, and the bottom end of the insulation tube is close to the bottom of the heat dissipation element. The top of the heat dissipation element is evenly connected with a plurality of connecting tubes. The plurality of connecting tubes are evenly covered on the outside of the plurality of insulation tubes. The outer side of the upper part of each insulation tube is connected with a capillary tube for guiding the liquid, and the capillary tube is located inside the connecting tube.

[0010] As an improvement of the above solution, the capillaries are evenly spread out in a crown shape and arranged on the outer side of the upper part of the insulation tube, and the outward side of the capillaries is close to the inner wall surface of the insulation tube.

[0011] As an improvement of the above solution, the heat sink forms an overall structure of cyclic heat conduction and cooling with a heat dissipation component.

[0012] As an improvement of the above solution, it also includes a clamping rod and a docking piece. The four corners of the bottom of the heat sink are connected to the clamping rod, and the four corners of the bottom of the package are connected to the docking piece. The clamping rod and the docking piece are clamped and matched.

[0013] As an improvement of the above scheme, it also includes a card block and a spring. The middle position of each side surface of the bottom of the package is slidably connected with a card block, and a spring is connected between the card block and the package. The adjacent sides of each card block are inclined, and the card block is in contact with the chip body.

[0014] As an improvement of the above solution, it also includes spring sheets, which are connected to positions near the pins on both sides of the metal frame, and the spring sheets abut against one side of the pins.

[0015] The present invention overcomes the shortcomings of the prior art and can achieve the following beneficial effects:

[0016] 1. Through components such as insulation tubes, arc frames, capillaries and connecting tubes, the heat can be quickly absorbed and evenly distributed to ensure that the chip maintains a low temperature during operation and improves working stability and life; the magnetic combination of the suction ball and the metal frame, and the combination of the card block and the spring ensure that the chip body is stable inside the package and can maintain good electrical connection even in a vibration or impact environment.

[0017] 2. The clamping type heat sink connection method and the coordinated use of the clamping rod and the docking piece simplify the assembly process between the packaging part and the heat sink, improve production efficiency, and reduce assembly difficulty.

[0018] 3. The spring enhances the contact force between the pin and the metal frame to ensure the reliability of the electrical connection; at the same time, the combination of the block and the spring also improves the overall stability of the packaging structure, effectively reducing the risk of chip displacement caused by external stress.

[0019] 4. The entire packaging structure is easy to disassemble and replace, which makes it easy to replace damaged components during later maintenance or upgrades without having to replace the entire packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is an assembly schematic diagram of the present invention.

[0021] Figure 2 The figure is a partial cross-sectional schematic diagram showing the structure of each internal component of the packaging component and the heat sink of the present invention.

[0022] Figure 3 This is a front view of the package and heat sink of the present invention after being cut open to show the structures of the internal components.

[0023] Figure 4 It is a front view of the exploded structure of the package, chip body, base plate and other components of the present invention.

[0024] Figure 5 It is a left side view of the exploded structure of the package, chip body, base plate and other components of the present invention.

[0025] Figure 6 The figure is a partial cross-sectional schematic diagram showing the structure of each internal component of the heat sink of the present invention.

[0026] Figure 7 This is a front view of the heat sink of the present invention after being cut open to show the structure of the internal components.

[0027] Figure 8 This is a diagram showing the connection structure of the chip body, the card block, the spring and other components of the present invention.

[0028] Fig. 9 It is a partial cross-sectional schematic diagram of the packaging component, the clamping block and the spring of the present invention.

[0029] Fig.10 It is a schematic diagram of the three-dimensional structure of the clamping block and the spring of the present invention.

[0030] Fig.11 It is a schematic diagram of the three-dimensional structure of the metal frame, pins and springs of the present invention.

[0031] Fig.12 It is a top view of the metal frame, pins and springs of the present invention.

[0032] Fig.13 It is a schematic diagram of the three-dimensional structure of the chip body and the suction ball of the present invention.

[0033] Fig.14 It is a bottom view of the chip body and the suction ball of the present invention.

[0034] The names and serial numbers of the parts in the figure are: 1: packaging part, 101: metal frame, 102: pins, 103: springs, 2: top plate, 21: heat sink, 22: clamping rod, 23: docking part, 24: insulation tube, 25: arc frame, 26: capillary, 27: connecting tube, 3: bottom plate, 4: chip body, 41: suction ball, 42: clamping groove, 51: clamping block, 52: spring. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Embodiment: A semiconductor packaging structure, such as Figure 1-Figure 9 and Figure 11-Figure 14As shown, it includes a package 1, a metal frame 101, pins 102, a top plate 2, a heat sink 21, a bottom plate 3, a chip body 4, a suction ball 41 and a heat sink assembly. The package 1 is the basic shell of the entire packaging structure, which protects the internal chip from the influence of the external environment, provides an installation basis for other components, and ensures the stability and integrity of the overall structure. The bottom of the package 1 is installed with a bottom plate 3, and the bottom plate 3 provides support. The top of the package 1 is connected with a heat sink 21 in a snap-on manner. The heat sink 21 has a cavity for accommodating cooling liquid for heat dissipation. The bottom surface of the heat sink 21 is closed, and the top of the heat sink 21 is connected to the top. The top plate 2 and the heat sink 21 together constitute an external structure for guiding heat dissipation. A heat sink 21 is provided with a heat sink assembly. A metal frame 101 is installed on the lower side of the package 1. The metal frame 101 is used to support the chip body 4. The metal frame 101 is evenly spaced at two locations. A number of pins 102 are connected, and the metal frame 101 realizes the connection between the chip body 4 and the external circuit through the pins 102. The metal frame 101 provides mechanical support for the chip body 4 to ensure that the chip body 4 is fixed in the package 1. The pins 102 extend from the left and right sides of the lower part of the package 1, and the chip body 4 is reliably connected to the external circuit through the pins 103. The chip body 4 is clamped in the package 1. The chip body 4 is the core part of the packaging structure. The bottom surface of the heat sink 21 contacts the top surface of the chip body 4 below to directly absorb the heat from the chip. A number of suction balls 41 are evenly arranged on the bottom of the chip body 4. The suction balls 41 are made of magnetic material. A number of clamping grooves 42 adapted to the outer contour of the suction balls 41 are opened at the bottom of the package 1. The suction balls 41 pass through the clamping grooves 42 and magnetically cooperate with the top surface of the metal frame 101 to ensure the stability of the chip body 4 in the package 1.

[0037] like Figure 1 and Figure 4-Figure 7As shown, the heat dissipation assembly includes an insulation tube 24, an arc frame 25, a capillary tube 26 and a connecting tube 27. A plurality of insulation tubes 24 are evenly spaced and connected in the heat dissipation element 21. The insulation tube 24 is used to transfer heat. The insulation tube 24 runs through the top of the heat dissipation element 21. An arc frame 25 for gathering heat sources is installed in the middle of the heat dissipation element 21. The arc frame 25 is arranged in a wave-like alternating manner to help concentrate the heat source. The middle of the insulation tube 24 runs through the arc frame 25 to improve the heat conduction efficiency, and the bottom end of the insulation tube 24 is close to the bottom of the heat dissipation element 21. The top of the heat dissipation element 21 is evenly connected with a plurality of connecting tubes 27, and the plurality of connecting tubes 27 are evenly shielded in the plurality of The outside of the root insulation tube 24 ensures that the cooling liquid can be evenly distributed and circulated. The outside of the upper part of each insulation tube 24 is connected to a capillary 26 for guiding the liquid. The capillary 26 is located inside the connecting tube 27 to form a circulation path. The capillary 26 is evenly spread out in a crown shape and arranged on the outside of the upper part of the insulation tube 24 to ensure that the cooling liquid is evenly distributed. The outward side of the capillary 26 is close to the inner wall surface of the insulation tube 24. The heat sink 21 forms an overall structure of circulating heat conduction and cooling with the heat sink assembly. The cooling liquid inside the heat sink 21 forms a circulating cooling system through the insulation tube 24, the capillary 26 and the connecting tube 27 to improve the heat dissipation efficiency.

[0038] like Figure 2-Figure 5 As shown, it also includes a clamping rod 22 and a docking piece 23. The four corners of the bottom of the heat sink 21 are connected with the clamping rod 22, and the lower end of the clamping rod 22 is spherical. The four corners of the bottom inner bottom of the package 1 are connected with docking pieces 23 whose inner upper parts are adapted to the spherical parts of the clamping rod 22, and the clamping rod 22 and the docking piece 23 are clamped together to ensure that the heat sink 21 will not fall off easily.

[0039] like Figure 2-Figure 5 and Figure 8-Figure 10 As shown, it also includes a card block 51 and a spring 52. The middle position of each side surface of the bottom of the package 1 is slidably connected with a card block 51, and a spring 52 is connected between the card block 51 and the package 1. The adjacent sides of each card block 51 are all inclined, so that the placement of the chip body 4 is easier, and the card block 51 is in contact with the chip body 4.

[0040] like Figure 11-Figure 12 As shown, it also includes a spring sheet 103. The spring sheets 103 are connected to the positions near the pins 102 on both sides of the metal frame 101. The spring sheets 103 press against one side of the pins 102, so that the pins 102 are in good contact with the metal frame 101, helping to strengthen the fixation between the pins 102 and the metal frame 101.

[0041] During packaging, first install the bottom plate 3 at the bottom of the package 1. The bottom plate 3 supports the entire packaging structure and ensures that the package 1 has a stable foundation. Then, the heat sink 21 is connected to the top of the package 1 by snapping. The top of the heat sink 21 is connected to the top plate 2. The heat sink 21 and the top plate 2 together constitute a complete external structure for guiding heat and dissipating it. Next, place the chip body 4 at a specified position inside the package 1. A number of suction balls 41 are provided at the bottom of the chip body 4. These suction balls 41 pass through the pre-set snap-in grooves 42 at the bottom of the package 1 and magnetically cooperate with the top of the metal frame 101 to ensure good electrical connection and physical fixation between the chip body 4 and the metal frame 101. The heat sink 21 has a cavity for accommodating cooling liquid. The bottom surface of the heat sink 21 is closed and in contact with the top surface of the chip body 4 to directly absorb heat from the chip. The heat dissipation assembly consists of an insulation tube 24, an arc frame 25, a capillary 26 and a connecting tube 27. When the chip heats up , heat is transferred to the bottom of the heat sink 21 through contact, and then absorbed by the coolant in the insulation tube 24. The coolant expands and rises in the insulation tube 24 due to the heat, enters the connecting tube 27 through the capillary 26, and then flows along the connecting tube 27 to other parts of the heat sink 21 for cooling. Finally, the cooled liquid drops from the connecting tube 27 back to the bottom of the insulation tube 24 to form a cycle. In order to enhance the connection strength between the heat sink 21 and the package 1, the clamping rods 22 on the four corners of the bottom of the heat sink 21 are used in conjunction with the docking pieces 23 corresponding to the bottom of the package 1 to ensure that the heat sink 21 will not fall off easily. The clamping blocks 51 and springs 52 at the side positions of the bottom of the package 1 enable the chip body 4 to be firmly fixed during the packaging process and have a certain buffering effect when subjected to external impact. The springs 103 connected to the positions near the pins 102 on both sides of the metal frame 101 help to strengthen the contact between the pins 102 and the metal frame 101 to ensure the reliability of current transmission.

[0042] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A semiconductor packaging structure, characterized in that: The invention comprises a package (1), a metal frame (101), pins (102), a top plate (2), a heat sink (21), a bottom plate (3), a chip body (4), a suction ball (41) and a heat sink assembly, wherein the bottom of the package (1) is mounted with the bottom plate (3), the top of the package (1) is connected with the heat sink (21) in a snap-fit ​​manner, the top of the heat sink (21) is connected with the top plate (2), a heat sink assembly is arranged inside the heat sink (21), a metal frame (101) is mounted on the lower side of the package (1), and the metal A plurality of pins (102) are evenly connected to two locations of the frame (101), the pins (102) extend from two locations of the package (1), a chip body (4) is clamped inside the package (1), a plurality of suction balls (41) are evenly arranged at the bottom of the chip body (4), the suction balls (41) are made of magnetic material, a plurality of clamping grooves (42) adapted to the outer contour of the suction balls (41) are opened at the bottom of the package (1), and the suction balls (41) pass through the clamping grooves (42) to magnetically engage with the top surface of the metal frame (101).

2. A semiconductor packaging structure according to claim 1, characterized in that: The heat sink (21) has a cavity inside for accommodating cooling liquid, the bottom surface of the heat sink (21) is closed, and the bottom surface of the heat sink (21) is in contact with the top surface of the chip body (4) below.

3. The semiconductor packaging structure according to claim 2, characterized in that: The heat dissipation component comprises a heat insulation tube (24), an arc frame (25), a capillary tube (26) and a connecting tube (27); a plurality of heat insulation tubes (24) are evenly spaced and connected inside the heat dissipation element (21); the heat insulation tube (24) passes through the top of the heat dissipation element (21); an arc frame (25) for gathering heat sources is installed in the middle of the heat dissipation element (21); the middle of the heat insulation tube (24) passes through the arc frame (25), and the bottom end of the heat insulation tube (24) is close to the bottom of the heat dissipation element (21); the top of the heat dissipation element (21) is evenly connected with a plurality of connecting tubes (27); the plurality of connecting tubes (27) are evenly shielded on the outside of the plurality of heat insulation tubes (24); the outer side of the upper part of each of the heat insulation tubes (24) is connected with a capillary tube (26) for guiding liquid; the capillary tube (26) is located inside the connecting tube (27).

4. The semiconductor packaging structure according to claim 3, characterized in that: The capillaries (26) are evenly spread out in a crown shape and arranged on the outer side of the upper portion of the thermal insulation tube (24), and the outward side of the capillaries (26) is close to the inner wall surface of the thermal insulation tube (24).

5. The semiconductor packaging structure according to claim 4, characterized in that: The heat sink (21) forms an integral structure of cyclic heat conduction and cooling with the heat sink assembly.

6. The semiconductor packaging structure according to claim 5, characterized in that: It also includes a clamping rod (22) and a docking piece (23), wherein the four corners of the bottom of the heat sink (21) are connected to the clamping rod (22), and the four corners of the bottom of the package (1) are connected to the docking piece (23), and the clamping rod (22) is engaged with the docking piece (23).

7. The semiconductor packaging structure according to claim 6, characterized in that: It also comprises a clamping block (51) and a spring (52); the middle position of each side surface of the bottom of the package (1) is slidably connected to a clamping block (51); a spring (52) is connected between the clamping block (51) and the package (1); the adjacent sides of each clamping block (51) are inclined; and the clamping block (51) is in contact with the chip body (4).

8. The semiconductor packaging structure according to claim 7, characterized in that: It also includes a spring sheet (103), and positions close to the pins (102) on both sides of the metal frame (101) are connected to the spring sheet (103), and the spring sheet (103) abuts against one side of the pin (102).

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