Semiconductor wafer etching fluid nozzle

Abstract

The invention discloses a semiconductor wafer etching fluid nozzle, and relates to the technical field of wafer etching, and the semiconductor wafer etching fluid nozzle comprises a nozzle main body, the middle part of which is provided with a vertically through liquid inlet channel; the spray head is embedded into the liquid inlet channel; the Venturi tube structure is arranged in the liquid inlet channel and comprises a contraction part, a throat part and an expansion part; the first mounting groove and the second mounting groove are formed in the side part of the nozzle main body and are symmetrically arranged; each of the first mounting groove and the second mounting groove comprises a groove body; the nozzle body is further provided with a plurality of air inlet channels communicating with the groove body and the throat part. A self-adaptive plugging assembly corresponding to the air inlet channel is arranged in the groove body; when the nozzle body inclines, the self-adaptive blocking assembly can selectively block the gas inlet channel based on the inclination angle of the nozzle body, the inclination angle of the nozzle and the gas participation amount can be accurately controlled, and the uniform etching effect is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer etching, in particular to a semiconductor wafer etching fluid nozzle. Background Art

[0002] Semiconductor wafer etching is a key step in the integrated circuit manufacturing process, which involves the precise removal of material layers on the wafer to form circuit patterns. With the rapid development of semiconductor technology, the requirements for etching processes are becoming increasingly higher, especially in terms of uniformity and depth control. However, there are some shortcomings in the existing semiconductor wafer etching fluid nozzle technology, which limits the accuracy and efficiency of the etching process. Specifically, existing etching nozzles often lack precise control mechanisms for the tilt angle and gas participation, which makes it difficult to achieve a uniform etching effect during the etching process, and the wafer surface may be unevenly etched or have inconsistent depth (the material layer is not removed cleanly). In addition, many existing nozzle designs make the maintenance and replacement of the nozzle complicated. When the nozzle is worn or clogged, the entire nozzle assembly needs to be removed for replacement, which not only increases maintenance costs, but also prolongs the downtime of the equipment.

[0003] Therefore, it is necessary to develop a semiconductor wafer etching fluid nozzle to solve the above problems. Summary of the invention

[0004] In order to solve the above problems, the present invention provides the following technical solution: a semiconductor wafer etching fluid nozzle, comprising:

[0005] The nozzle body has a vertically penetrating liquid inlet passage in the middle;

[0006] A spray head, which is detachably embedded in the liquid inlet channel from the bottom of the nozzle body;

[0007] A venturi tube structure, which is arranged in the liquid inlet channel and includes a contraction portion, a throat portion, and an expansion portion;

[0008] The first mounting groove and the second mounting groove are both provided on the side of the nozzle body and are symmetrically arranged;

[0009] Wherein, the first mounting slot and the second mounting slot both include a slot body;

[0010] The nozzle body is also provided with a plurality of air inlet passages connecting the groove body and the throat;

[0011] An adaptive blocking component corresponding to the air inlet passage is arranged in the tank body;

[0012] When the nozzle body is tilted, the adaptive blocking assembly can selectively block the air inlet passage based on the tilt angle of the nozzle body.

[0013] Further, preferably, the adaptive blocking component comprises:

[0014] A slide rail, which is fixed in the groove body and extends radially along the nozzle body;

[0015] A slider, which is slidably disposed on the slide rail;

[0016] A weight-increasing block, which is fixed on the sliding block, and a spring is provided between the weight-increasing block and the slot body;

[0017] A blocking block, which is fixed on the weight-increasing block;

[0018] The elasticity of each spring is different and satisfies the following requirement: whenever the inclination angle of the nozzle body increases by 3°-5°, an adaptive blocking component is added to block the air inlet channel.

[0019] Furthermore, preferably, a clearance groove is provided on the weight-increasing block for installing and accommodating one end of the spring, and the horizontal length H of the clearance groove is greater than the ultimate compression length of the spring.

[0020] Furthermore, preferably, a sealing pad having elasticity is attached to a side of the sealing block close to the air inlet passage.

[0021] Further, preferably, the cross-sections of the first mounting groove and the second mounting groove are fan-shaped, and the central angle B of the fan-shaped is 45°-65°.

[0022] Further, as a preference, the outer sleeve of the nozzle is provided with a first locking member, the first locking member is a slot structure, and the slot of the slot structure is in contact with the lower surface of the nozzle body;

[0023] The middle part of the first locking member has a stabilizing opening for being mounted on the end of the nozzle; the notch of the first locking member is also provided with a first shoulder, the bottom of the nozzle body is also threadedly connected to the second locking member, and the second locking member is provided with a second shoulder corresponding to the first shoulder.

[0024] Further, preferably, the side of the nozzle has a limiting protrusion;

[0025] A stepped groove communicating with the liquid inlet channel is formed at the lower portion of the nozzle body so as to accommodate and limit the limiting protrusion.

[0026] Further, as a preference, an annular extension frame is provided below the limiting protrusion;

[0027] The first locking member is provided with an extension ring corresponding to the extension frame;

[0028] Wherein, the extension frame, the extension ring, the nozzle, and the first locking member form a first accommodating space for accommodating the temperature sensor.

[0029] Further, as a preference, a second accommodating space is formed among the extension frame, the extension ring, the nozzle body, and the first locking member for accommodating the angle sensor.

[0030] Compared with the prior art, the present invention provides a semiconductor wafer etching fluid nozzle having the following features:

[0031] Beneficial effects:

[0032] In the present invention, the inclination angle of the nozzle and the amount of gas involved can be accurately controlled through the adaptive blocking component and the angle sensor, so as to optimize the fluid flow and mixing and achieve a uniform etching effect.

[0033] In the present invention, the nozzle adopts a detachable design, which is convenient for quick maintenance and replacement, reduces equipment downtime, and improves production efficiency. In addition, the double locking mechanism and precise positioning ensure the stability and reliability of the nozzle in the nozzle body, reducing the risk of accidental movement or falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the main structure of a semiconductor wafer etching fluid nozzle;

[0035] Figure 2 for Figure 1 A schematic diagram of the enlarged structure at point A;

[0036] Figure 3 A schematic diagram of the structure of an adaptive plugging component in a semiconductor wafer etching fluid nozzle;

[0037] Figure 4 It is a schematic diagram of a top view of a first mounting groove and a second mounting groove in a semiconductor wafer etching fluid nozzle;

[0038] In the figure: 1. nozzle body; 2. liquid inlet channel; 3. venturi tube structure; 4. air inlet channel; 5. first mounting groove; 6. second mounting groove; 7. adaptive plugging assembly; 8. nozzle; 9. first locking member; 10. second locking member; 11. rotating shaft; 12. stepped groove; 13. temperature sensor; 14. angle sensor; 81. extension frame; 91. first shoulder; 92. extension ring; 93. stabilizing mouth; 101. second shoulder; 71. slide rail; 72. slider; 73. weight block; 74. plugging block; 75. plugging pad; 76. clearance groove; 77. spring; 78. limit plate. DETAILED DESCRIPTION

[0039] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned description of the drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, which is merely a way of distinguishing the objects of the same attributes when describing them in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0040] Example: Please refer to Figure 1-Figure 4 In an embodiment of the present invention, a semiconductor wafer etching fluid nozzle is provided, comprising:

[0041] The nozzle body 1 has a liquid inlet channel 2 extending vertically through the nozzle body 1, and a rotating shaft 11 is fixed to one side of the nozzle body 1. The rotating shaft 11 enables the nozzle body 1 to deflect left and right, thereby making the inclination angle of the nozzle body 1 adjustable;

[0042] A spray head 8, which is detachably embedded in the liquid inlet channel 2 from the bottom of the nozzle body 1, so as to facilitate maintenance and replacement of the spray head 8;

[0043] A venturi tube structure 3, which is disposed in the liquid inlet channel 2 and includes a contraction portion, a throat portion, and an expansion portion;

[0044] The first mounting groove 5 and the second mounting groove 6 are both provided on the side of the nozzle body 1 and are symmetrically arranged;

[0045] Wherein, the first mounting groove 5 and the second mounting groove 6 both include a groove body;

[0046] The nozzle body 1 is also provided with a plurality of air inlet passages 4 connecting the groove body and the throat;

[0047] The tank body is provided with an adaptive blocking component 7 corresponding to the air inlet channel 4;

[0048] When the nozzle body 1 is tilted, the adaptive blocking component 7 can selectively block the air inlet passage 4 based on the tilt angle of the nozzle body 1 .

[0049] In this embodiment, the liquid inlet channel 2 in the nozzle body 1 is used to transport the etching liquid to the nozzle head 8 .

[0050] In this embodiment, the contraction portion, throat and expansion portion of the venturi tube structure 3 are designed to accelerate the flow of etching liquid and generate negative pressure, thereby inhaling an appropriate amount of gas. The gas is inhaled into the venturi tube structure 3 and mixed with the etching liquid to improve the etching effect.

[0051] In this embodiment, the adaptive plugging component 7 can adjust the opening and closing of the air inlet channel 4 according to the inclination angle of the nozzle body 1, thereby controlling the amount of gas involved.

[0052] It should be explained that the inclination angle of the nozzle body 1 affects the residence time of the etching liquid on the wafer surface. A smaller inclination angle will cause the etching liquid to stay on the wafer surface for a longer time, which may lead to uneven etching; while a larger inclination angle will cause the etching liquid to stay on the wafer surface for a shorter time, which may fail to achieve the expected etching depth.

[0053] The amount of gas involved will affect the fluidity and dispersion of the etching liquid. If the amount of gas involved is small, the etching may be uneven; if the amount of gas involved is large, although the etching uniformity can be improved, it may shorten the residence time of the etching liquid on the wafer surface and affect the etching depth.

[0054] Based on this, in this embodiment, the following configuration is performed: when the inclination angle of the nozzle body 1 is large, the residence time of the etching liquid on the wafer surface is short. At this time, reducing the amount of gas involved can balance this phenomenon and ensure a certain etching depth.

[0055] When the nozzle body is tilted at a small angle, the etching liquid stays on the wafer surface for a long time. At this time, increasing the amount of gas involved can help improve etching uniformity and avoid local over-etching.

[0056] Through the design of this adaptive blocking component, the etching process can be adjusted to ensure the etching effect, which helps to improve the quality and efficiency of semiconductor wafer manufacturing.

[0057] The inclination angle of the nozzle body 1 refers to the complementary angle between the central axis of the nozzle body 1 and the horizontal plane.

[0058] More specifically, the adaptive blocking component 7 comprises:

[0059] A slide rail 71, which is fixed in the groove body and extends radially along the nozzle body 1;

[0060] A slider 72, which is slidably disposed on the slide rail 71;

[0061] A weight-increasing block 73, which is fixed on the sliding block 72, and a spring 77 is provided between the weight-increasing block 73 and the slot body;

[0062] A blocking block 74, which is fixed on the weight-increasing block 73;

[0063] The elasticity of each spring 77 is different and satisfies the following requirement: whenever the inclination angle of the nozzle body 1 increases by 3°-5°, an adaptive blocking component 7 is added to block the air inlet channel 4 .

[0064] When the inclination angle of the nozzle body 1 is small, the elastic force of the spring 77 is sufficient to resist the component force of the gravity of the weight-adding block 73 in the length direction of the spring 77, and the blocking block 74 will not block the air inlet channel 4;

[0065] As the inclination angle of the nozzle body 1 increases, the component force of the gravity of the weight-adding block 73 in the length direction of the spring 77 begins to exceed the elastic force of the spring 77, causing the slider 72 to move along the slide rail 71, thereby causing the blocking block 74 to block the air inlet channel 4;

[0066] Moreover, whenever the inclination angle of the nozzle body 1 increases by 3°-5°, an adaptive blocking component 7 is added to block the air inlet passage 4. This means that as the inclination angle increases, more air inlet passages will be blocked, thereby reducing the inflow of gas.

[0067] It is worth mentioning that the blocking condition of the air inlet passage is automatically adjusted according to the inclination angle of the nozzle body 1 without external intervention, and the fluid behavior can be controlled without using electronic sensors and control systems.

[0068] In this embodiment, a clearance groove 76 is further provided on the weight-increasing block 73 for installing and accommodating one end of the spring 77 , and the horizontal length H of the clearance groove 76 is greater than the ultimate compression length of the spring 77 .

[0069] In this embodiment, the horizontal length H of the clearance groove 76 is greater than the ultimate compression length of the spring 77, so that even if the spring 77 is compressed to the maximum extent, it will not be damaged or lose its elasticity due to the limitation of the clearance groove 76. This also provides sufficient space for the spring 77 to compress and rebound, ensuring that the blocking block 74 can be moved to the correct position as needed.

[0070] As a preferred embodiment, a sealing pad 75 with elasticity is attached to the side of the sealing block 74 close to the air inlet passage 4, so as to improve the sealing and adaptability of the sealing. Moreover, the sealing pad 75 can better adapt to the slight unevenness of the surface of the air inlet passage 4, ensure the sealing effect, and reduce gas leakage. In addition, the elastic sealing pad 75 can also provide additional buffering when the sealing block 74 contacts the air inlet passage 4, protecting both from damage.

[0071] As a preferred embodiment, the cross-sections of the first mounting groove 5 and the second mounting groove 6 are sector-shaped, and the central angle B of the sector is 45°-65°.

[0072] In this embodiment, the central angle B of the sector is 45°-65°. This angle range ensures that the mounting grooves (first mounting groove 5, second mounting groove 6) have enough space to accommodate the slide rail 71, the slider 72, the weight block 73, the spring 77 and the blocking block 74, while providing sufficient structural strength.

[0073] As a preferred embodiment, a limiting plate 78 is disposed on one side of each of the first mounting groove 5 and the second mounting groove 6 .

[0074] In this embodiment, the side of the nozzle 8 has a limiting protrusion;

[0075] A stepped groove 12 communicating with the liquid inlet channel 2 is formed at the lower portion of the nozzle body 1 so as to accommodate and limit the limiting protrusion.

[0076] When the nozzle 8 is inserted into the stepped groove 12 , the limiting protrusion can be closely matched with the corresponding part of the stepped groove 12 , ensuring that the nozzle 8 is in the correct position and will not shake at will.

[0077] In this embodiment, the first locking member 9 is sleeved on the outside of the nozzle 8. The first locking member 9 is a groove structure, and the groove of the groove structure is in contact with the lower surface of the nozzle body 1.

[0078] The middle part of the first locking member 9 has a stabilizing opening 93 for being mounted on the end of the nozzle 8; the notch of the first locking member 9 is also provided with a first shoulder 91, and the bottom of the nozzle body 1 is also screwed to the second locking member 10, and the second locking member 10 is provided with a second shoulder 101 corresponding to the first shoulder 91.

[0079] In this embodiment, the middle portion of the first locking member 9 has a stabilizing opening 93 for sleeved on the end of the spray head 8. In this way, the stabilizing opening 93 can ensure that the spray head 8 is correctly aligned and positioned in the first locking member 9.

[0080] When the first locking member 9 and the nozzle 8 are installed in place, the second locking member 10 can be raised or lowered by rotation, so that the second clamping shoulder 101 is in close contact with the first clamping shoulder 91, further fixing the first locking member 9 and the nozzle 8.

[0081] This double locking mechanism (the first locking member 9 cooperates with the spray head 8, and the limiting protrusion cooperates with the stepped groove 12) ensures that the spray head 8 is firmly fixed in the nozzle body 1 and will not loosen due to external vibration or fluid impact.

[0082] Furthermore, an annular extension frame 81 is provided below the limiting protrusion;

[0083] The first locking member 9 is provided with an extension ring 92 corresponding to the extension frame 81;

[0084] The extending frame 81 , the extending ring 92 , the nozzle 8 , and the first locking member 9 form a first accommodating space for accommodating the temperature sensor 13 .

[0085] The first accommodating space provides a stable installation position for the temperature sensor 13, which is convenient for monitoring and controlling the temperature of the etching fluid, thereby optimizing the etching process.

[0086] As a preferred embodiment, the extension frame 81 , the extension ring 92 , the nozzle body 1 , and the first locking member 9 form a second accommodating space for accommodating the angle sensor 14 .

[0087] The second accommodation space allows the angle sensor 14 to be stably installed near the nozzle body 1 so as to accurately and in real time measure the tilt angle of the nozzle body 1 , thereby guiding the angle adjustment of the nozzle body 1 .

[0088] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor wafer etching fluid nozzle, characterized in that: include: A nozzle body (1) having a liquid inlet channel (2) extending vertically therethrough in the middle thereof; A spray head (8) which is detachably embedded in the liquid inlet channel (2) from the bottom of the nozzle body (1); A venturi tube structure (3), which is arranged in the liquid inlet channel (2) and comprises a contraction portion, a throat portion, and an expansion portion; A first mounting groove (5) and a second mounting groove (6), both of which are arranged on the side of the nozzle body (1) and are symmetrically disposed; Wherein, the first installation groove (5) and the second installation groove (6) both comprise a groove body; The nozzle body (1) is also provided with a plurality of air inlet passages (4) connecting the groove body and the throat; An adaptive blocking component (7) corresponding to the air inlet passage (4) is arranged in the tank body; When the nozzle body (1) is tilted, the adaptive blocking component (7) can selectively block the air inlet passage (4) based on the tilt angle of the nozzle body (1).

2. A semiconductor wafer etching fluid nozzle according to claim 1, characterized in that: The adaptive blocking component (7) comprises: A slide rail (71) fixed in the groove body and extending radially along the nozzle body (1); A slider (72) slidably disposed on the slide rail (71); A weight-increasing block (73) is fixed on the sliding block (72), and a spring (77) is provided between the weight-increasing block (73) and the slot body; A blocking block (74) fixed on the weight-increasing block (73); The elasticity of each of the springs (77) is different and satisfies the following requirement: whenever the inclination angle of the nozzle body (1) increases by 3°-5°, an adaptive blocking component (7) is added to block the air inlet passage (4).

3. A semiconductor wafer etching fluid nozzle according to claim 2, characterized in that: The weight-increasing block (73) is also provided with a clearance groove (76) for installing and accommodating one end of the spring (77), and the horizontal length H of the clearance groove (76) is greater than the ultimate compression length of the spring (77).

4. A semiconductor wafer etching fluid nozzle according to claim 2, characterized in that: A sealing pad (75) having elasticity is also attached to a side of the sealing block (74) close to the air inlet passage (4).

5. The semiconductor wafer etching fluid nozzle according to claim 2, characterized in that: The cross-sections of the first mounting groove (5) and the second mounting groove (6) are sector-shaped, and the central angle B of the sector is 45°-65°.

6. The semiconductor wafer etching fluid nozzle according to claim 1, characterized in that: The outside of the spray head (8) is sleeved with a first locking member (9), the first locking member (9) is a groove structure, and the groove of the groove structure is in contact with the lower surface of the nozzle body (1); The middle part of the first locking member (9) has a stabilizing opening (93) for being sleeved on the end of the nozzle (8); the notch of the first locking member (9) is also provided with a first clamping shoulder (91); the bottom of the nozzle body (1) is also screwed to the second locking member (10); the second locking member (10) is provided with a second clamping shoulder (101) corresponding to the first clamping shoulder (91).

7. A semiconductor wafer etching fluid nozzle according to claim 6, characterized in that: The side of the spray head (8) has a limiting protrusion; The lower part of the nozzle body (1) is provided with a stepped groove (12) connected to the liquid inlet channel (2) so as to accommodate and limit the limiting protrusion.

8. The semiconductor wafer etching fluid nozzle according to claim 7, characterized in that: An annular extension frame (81) is provided below the limiting protrusion; The first locking member (9) is provided with an extension ring (92) corresponding to the extension frame (81); The extension frame (81), the extension ring (92), the nozzle (8) and the first locking member (9) form a first accommodation space for accommodating a temperature sensor (13).

9. A semiconductor wafer etching fluid nozzle according to claim 8, characterized in that: A second accommodating space is formed between the extension frame (81), the extension ring (92), the nozzle body (1) and the first locking member (9) and is used to accommodate the angle sensor (14).

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