Metal surface ablation residue cleaning method and device based on laser cleaning technology, equipment and medium

Abstract

The embodiment of the invention discloses a metal surface ablation residue cleaning method and device based on a laser cleaning technology, equipment and a medium, and the method comprises the steps: carrying out the simulation model construction of a metal substrate based on the working environment of the metal substrate, and generating a metal substrate model; according to the metal substrate model, simulation modeling is carried out on the process of ablating the surface of the metal substrate by flame flow, and an ablation motion simulation model is generated; based on the ablation motion simulation model, generating ablation mechanism analysis information by analyzing the generation mechanism of the ablation residues; and finally, based on the ablation mechanism analysis information, the laser probe cleans the ablation residues on the metal surface of the metal substrate through the laser cleaning path with the set parameters. According to the embodiment of the invention, the laser cleaning technology can clean the ablation residues on the premise that the substrate material is not damaged, the problems of slow manual mechanical cleaning and the like are solved, and the cyclic utilization efficiency of the substrate material is improved.

Description

Technical Field

[0001] The present disclosure relates to laser cleaning technology, and in particular to a method and device, equipment and medium for cleaning ablation residues on a metal surface based on laser cleaning technology. Background Art

[0002] During the operation of the equipment, the high-temperature and high-speed flame flow ejected when the engine uses propellant as fuel will cause serious ablation and high-speed gas scouring (scouring-erosion coupling effect of condensed phase particles on materials) on the inner wall surface of the metal substrate supporting the engine, among which ablation is the main form of damage. The products of ablation have no protective effect on the metal substrate, but will only affect the normal operation of the next engine and the smooth completion of the production task. Moreover, as time goes by, they will also cause corrosion and other harmful effects on the inner wall, so it is very necessary to remove the ablated products.

[0003] At present, the cleaning and maintenance of ablated products is very complicated. It is time-consuming and laborious to achieve a good cleaning effect. The main methods of manual mechanized cleaning are traditional sandblasting and angle grinder grinding. Mechanical means such as scraping, wiping, brushing, and sandblasting are used to remove surface pollutants. It takes a long time, which is not conducive to the rapid and continuous use of the metal substrate and affects the efficiency of equipment operation. At the same time, there are also shortcomings such as high requirements for operators, many subsequent processing procedures, obvious thinning of the wall thickness of the weld after multiple grindings, high labor intensity, and poor cleaning consistency, which seriously affect the subsequent use of the metal substrate.

[0004] Therefore, one or more methods are needed to solve the above problems.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0006] The purpose of the present disclosure is to provide a method and device, equipment and medium for cleaning metal surface ablation residues based on laser cleaning technology, thereby overcoming one or more problems caused by limitations and defects of related technologies at least to a certain extent.

[0007] According to one aspect of the present disclosure, a method for cleaning metal surface ablation residues based on laser cleaning technology is provided, comprising:

[0008] Based on the working environment of the metal substrate, a metal substrate model is generated by constructing a simulation model of the metal substrate;

[0009] Based on the metal substrate model, a simulation model of ablation motion is generated by simulating and modeling the process of flame flow ablating the surface of the metal substrate;

[0010] Based on the ablation motion simulation model, by analyzing the generation mechanism of ablation residues, ablation mechanism analysis information is generated;

[0011] Based on the ablation mechanism analysis information, laser system parameters are set to generate a laser cleaning path, and the laser probe completes the cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

[0012] In an exemplary embodiment of the present disclosure, a simulation model is constructed for a metal substrate, including:

[0013] Based on the working environment of the metal substrate, the support guide form of the metal substrate is established to generate guide form parameter information;

[0014] Based on the working environment of the metal substrate, the shape of the metal substrate is established to generate shape parameter information;

[0015] Based on the working environment of the metal substrate, material parameter information is generated by establishing material parameters of the metal substrate;

[0016] Based on the working environment of the metal substrate, the material size of the metal substrate is established to generate size parameter information;

[0017] Based on the guide form parameter information, shape parameter information, material parameter information, and size parameter information, a metal substrate model is generated by constructing a simulation model of the metal substrate.

[0018] In an exemplary embodiment of the present disclosure, a simulation model is performed on a process in which a flame ablates a metal substrate surface, including:

[0019] Based on the metal substrate model, an initial flow field calculation domain is generated by defining a flow field calculation domain of the jet;

[0020] Based on the metal substrate model, an ablation flow field calculation domain is generated by constraining the boundary conditions of the initial flow field calculation domain.

[0021] In an exemplary embodiment of the present disclosure, a simulation model is performed on a process in which a flame ablates a metal substrate surface, including:

[0022] Based on the ablation flow field calculation domain, gas characteristic data is generated by extracting gas temperature and gas velocity;

[0023] Based on the jet environment on the inner wall surface of the metal substrate, a gas flow field model is generated by analyzing the gas characteristic data;

[0024] Based on the gas flow field model, particle characteristic data is generated by classifying the sizes of condensed particles;

[0025] Based on the heat exchange between the condensed particles and the fuel gas, an ablation motion simulation model is generated by analyzing the particle characteristic data.

[0026] In an exemplary embodiment of the present disclosure, the generation mechanism of ablation residues is analyzed, including:

[0027] Based on the ablation motion simulation model, the thermomechanical effect of the gas is analyzed to generate thermomechanical analysis information;

[0028] Based on the ablation motion simulation model, generating component analysis information by analyzing the components of the ablated product on the surface of the metal substrate;

[0029] Ablation mechanism analysis information is generated by integrating the thermomechanical analysis information and the component analysis information.

[0030] In an exemplary embodiment of the present disclosure, by setting the laser system parameters, including:

[0031] Based on the ablation mechanism analysis information, laser power parameter information is generated by setting the laser power;

[0032] Based on the ablation mechanism analysis information, pulse frequency parameter information is generated by setting the laser pulse frequency;

[0033] Based on the ablation mechanism analysis information, by setting the laser clearing times, clearing times parameter information is generated;

[0034] Based on the ablation mechanism analysis information, generating duty cycle parameter information by setting the duty cycle;

[0035] Laser parameter information is generated by integrating the laser power parameter information, pulse frequency parameter information, clearing times parameter information, and duty cycle parameter information.

[0036] In an exemplary embodiment of the present disclosure, by setting the laser system parameters, including:

[0037] Based on the laser parameter information, a scanning width parameter is generated by setting the scanning width of the laser probe;

[0038] Based on the laser parameter information, a scanning speed parameter is generated by setting a scanning speed of the laser probe;

[0039] Based on the laser parameter information, a swing direction parameter is generated by setting the swing direction of the laser probe;

[0040] Based on the scanning width parameter, scanning speed parameter, and swing direction parameter, a laser cleaning path is generated by planning a cleaning path of the laser probe, and the laser probe completes cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

[0041] In one aspect of the present disclosure, a device for cleaning metal surface ablation residues based on laser cleaning technology is provided, comprising:

[0042] A metal substrate model generation module is used to generate a metal substrate model by constructing a simulation model of the metal substrate;

[0043] An ablation motion simulation model building module is used to generate an ablation motion simulation model by simulating and modeling the process of flame flow ablation of the metal substrate surface;

[0044] An ablation mechanism analysis module is used to generate ablation mechanism analysis information by analyzing the generation mechanism of ablation residues;

[0045] The laser cleaning path generation module is used to generate a laser cleaning path by setting laser system parameters, and the laser probe completes the cleaning of the ablation residue on the metal surface of the metal substrate through the laser cleaning path.

[0046] In one aspect of the present disclosure, there is provided an electronic device, comprising:

[0047] Processor; and

[0048] A memory having computer-readable instructions stored thereon, wherein the computer-readable instructions, when executed by the processor, implement the method according to any one of the above items.

[0049] In one aspect of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method according to any one of the above items is implemented.

[0050] Based on the embodiment of the present disclosure, first, according to the working environment of the metal substrate, a metal substrate model is generated by constructing a simulation model of the metal substrate. Then, based on the metal substrate model, a simulation model of the flame ablating the surface of the metal substrate is simulated and modeled to generate an ablation motion simulation model. Then, based on the ablation motion simulation model, the generation mechanism of the ablation residue is analyzed to generate ablation mechanism analysis information. Finally, based on the ablation mechanism analysis information, the laser probe completes the cleaning of the ablation residue on the metal surface of the metal substrate through a laser cleaning path with set parameters. Therefore, the laser cleaning technology provided by the embodiment of the present disclosure can clean the ablation residue without damaging the substrate material, solves the problem of slow manual mechanized cleaning, and improves the recycling efficiency of the substrate material.

[0051] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

[0052] The technical solution of the present disclosure is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0054] The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0055] Figure 1 A flow chart of a method for cleaning metal surface ablation residues based on laser cleaning technology according to an embodiment of the method disclosed herein;

[0056] Figure 2 A design diagram of a flow field calculation domain for a method for cleaning metal surface ablation residues based on laser cleaning technology in one embodiment of the method disclosed herein;

[0057] Figure 3 A gas velocity distribution curve diagram of the inner wall of a metal substrate in a method for cleaning metal surface ablation residues based on laser cleaning technology according to an embodiment of the method disclosed herein;

[0058] Figure 4 A gas temperature distribution curve diagram of the inner wall of a metal substrate in a method for cleaning metal surface ablation residues based on laser cleaning technology in one embodiment of the method disclosed herein;

[0059] Figure 5 A schematic diagram of a laser experimental platform for a method for cleaning ablation residues on a metal surface based on laser cleaning technology in accordance with an embodiment of the method disclosed herein;

[0060] Figure 6A schematic diagram of laser thermal ablation to remove aluminum oxide in a method for cleaning ablation residues on a metal surface based on laser cleaning technology in one embodiment of the method disclosed herein;

[0061] Figure 7 This is a structural block diagram of a metal surface ablation residue cleaning device based on laser cleaning technology in one embodiment of the method disclosed herein;

[0062] Figure 8 A block diagram of an electronic device according to an embodiment of the method disclosed herein. DETAILED DESCRIPTION

[0063] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0064] In addition, the described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, devices, steps, etc. may be adopted. In other cases, known structures, methods, devices, implementations, materials or operations are not shown or described in detail to avoid blurring the various aspects of the present disclosure.

[0065] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or these functional entities or parts of functional entities may be implemented in one or more software hardened modules, or these functional entities may be implemented in different networks and / or processor devices and / or microcontroller devices.

[0066] In the embodiment of the present disclosure, a method for cleaning metal surface ablation residues based on laser cleaning technology is first provided; Figure 1 As shown in , the method for cleaning metal surface ablation residues based on laser cleaning technology may include the following steps:

[0067] Step S110, generating a metal substrate model by constructing a simulation model of the metal substrate based on the working environment of the metal substrate;

[0068] Step S120, based on the metal substrate model, generating an ablation motion simulation model by simulating and modeling the process of flame flow ablating the metal substrate surface;

[0069] Step S130, generating ablation mechanism analysis information by analyzing the generation mechanism of ablation residues based on the ablation motion simulation model;

[0070] Step S140, based on the ablation mechanism analysis information, by setting the laser system parameters, a laser cleaning path is generated, and the laser probe completes the cleaning of the ablation residues on the metal surface of the metal substrate through the laser cleaning path.

[0071] Next, a method for cleaning metal surface ablation residues based on laser cleaning technology in an embodiment of the present disclosure will be further described.

[0072] In step S110, a metal substrate model may be generated by constructing a simulation model of the metal substrate based on the working environment of the metal substrate.

[0073] In some optional embodiments of this example, first, the support and guide form of the metal substrate can be divided into three categories: adapter type, guide rail type and hybrid type. According to the different support forms of the engine, different support and guide forms can be selected as the guide form parameter information of the metal substrate; according to different usage requirements, the shape parameter information of the metal substrate is determined by selecting different shapes such as rectangle, cylinder, diamond, octagon, etc.; according to the heat resistance requirements of the metal substrate material in different working environments, the material parameter information of the metal substrate is determined; according to the size of the engine and the size of the work site in different environments, the size parameter information of the metal substrate is determined.

[0074] Afterwards, the metal substrate model is simulated and constructed using Ansys fluent software according to the guidance form parameter information, shape parameter information, material parameter information, size parameter information, etc. And based on this metal substrate model, the ablation process of the tail flame on the inner wall of the metal substrate during the engine launch process can be simulated.

[0075] In step S120, based on the metal substrate model, a simulation model of ablation motion may be generated by simulating and modeling the process of flame ablating the surface of the metal substrate.

[0076] In some optional embodiments of this example, after the solid engine is ignited, the charge is ignited in the combustion chamber, and a large amount of gas flame flow will be generated while producing a violent chemical reaction. These high-temperature and high-pressure gases are accelerated by the Laval nozzle and ejected from the tail of the engine at a speed close to the speed of sound onto the metal substrate. Therefore, by simulating and modeling the process of the gas flame flow ejecting onto the metal substrate, the ablation impact properties of the metal substrate can be fully analyzed, thereby providing theoretical support for the subsequent formulation of a laser cleaning plan.

[0077] When constructing an ablation motion simulation model, first of all, its computational domain needs to be delineated. For example, a closed symmetrical metal substrate model is selected to carry the engine. Because it is a symmetrical structure, half the size of the symmetrical metal substrate model can be used as the flow field computational domain.

[0078] In a specific example, Figure 2 As shown, the length of the initial flow field calculation domain can be set to 50 meters, the width to 15 meters, and the height to 10 meters.

[0079] Afterwards, in order to describe the behavior of the physical process on the boundary of the computational domain, the boundary conditions of the initial flow field computational domain are also set to form a complete ablation flow field computational domain. These include:

[0080] The boundary conditions of the inlet are constrained to generate the inlet boundary conditions; the boundary conditions of the metal wall are constrained to generate the metal wall boundary conditions; the boundary conditions of the outlet are constrained to generate the outlet boundary conditions.

[0081] Specifically, the total inlet pressure can be set to 8 MPa, the inlet temperature can be set to 3500K, the metal wall can be set to an adiabatic, no-slip wall, and the pressure outlet boundary P = 1 standard atmosphere.

[0082] In some optional embodiments of this example, based on the constructed ablation flow field calculation domain, a gas flow field model is constructed to analyze the flow field motion characteristic data of the gas in the closed symmetrical metal substrate model.

[0083] In a specific example, after the engine starts to move in the box, the high-pressure gas is accelerated through the Laval nozzle to form a high-speed jet, which then collides with the inner wall of the metal substrate and is reflected to form an oblique shock wave. As the jet moves downstream, the direction of the jet movement is almost parallel to the box wall. Figure 3-Figure 4 As shown in the figure, the gas velocity change trend near the inner wall of the metal substrate is opposite to the temperature change trend. The temperature is lower at the location with high velocity and higher at the location with low velocity. In the process of material ablation, the gas temperature and gas velocity correspond to the thermal effect and impact damage of the gas on the metal substrate respectively.

[0084] Therefore, the jet trajectory is simulated by constructing a gas flow field model to intuitively analyze the jet environment on the inner wall surface of the metal substrate, thereby realizing the extraction of gas temperature and gas velocity data at different positions on the inner wall surface of the metal substrate.

[0085] At the same time, in order to comprehensively consider the maximum ablation effect of the jet on the material, the working conditions with the highest speed and the highest temperature can also be selected as the basis for ablation (as can be seen from the figure, in this example, the maximum temperature near the inner wall of the metal substrate is 2450K (2176.85℃), and the maximum speed is 1700m / s).

[0086] After that, it is necessary to analyze the trajectory of the condensed particles in the solid propellant. First, assume that the particle size of the condensed particles in the solid propellant is normally distributed, and generate particle feature data containing multiple characteristic sizes of the normal distribution according to the distribution interval.

[0087] Then, according to the heat exchange between particles and gas, the particle characteristic data is introduced into the above-mentioned gas flow field model to improve the ablation motion simulation model, which can be attributed to the behavior of high-speed and high-temperature particles ablating and adhering to the surface of the metal substrate under the propulsion of gas.

[0088] In one specific example, solid propellant with aluminum powder added is used as the propellant for the engine.

[0089] Based on the normal distribution of the particle size of the condensed state, through the analysis of alumina particles of different sizes, it can be seen that the condensed phase velocity of small-sized particles increases faster than that of large-sized particles. Therefore, the velocity of small-sized particles decreases faster at the booster nozzle outlet, which is easy to produce turbulence in the airflow. Although large-sized particles accelerate slowly, they reach the surface of the metal substrate faster.

[0090] At the same time, in the process of the aluminum oxide particles moving toward the surface of the metal substrate, due to the heat exchange between the particles and the fuel gas, the larger the surface area of ​​the aluminum oxide particles and the fuel gas, the more heat is transferred from the particles to the fuel gas.

[0091] Therefore, by approximately describing the ablation process of the engine flame on the metal substrate, we can build an ablation motion simulation model of the ablation of the metal substrate by aluminum oxide particles and combustion gas. This provides theoretical support for analyzing the generation mechanism and composition analysis of the ablated products on the metal substrate surface. Furthermore, it provides a strong theoretical basis for the subsequent laser cleaning solution.

[0092] In step S130, ablation mechanism analysis information may be generated by analyzing the generation mechanism of ablation residues based on the ablation motion simulation model.

[0093] In some optional embodiments of this example, the ablation problem on the surface of the metal substrate is found in the analysis of the ablation process through the above-mentioned ablation motion simulation model, which can be attributed to the thermomechanical effect of the gas on the metal substrate, and the ablation and adhesion behavior of high-temperature and high-speed particles on the inner surface of the metal substrate under the action of the gas. Therefore, if you want to obtain ablation mechanism analysis information about the ablation residue information, you can analyze the ablation residue on the surface of the metal substrate from two parts.

[0094] In the first part, the thermomechanical effect of the gas on the metal substrate is analyzed to obtain thermomechanical analysis information.

[0095] Among them, the thermal effect can cause local melting, carbonization or ablation of the substrate material surface. In more serious cases, the thermal effect may also cause thermal expansion, stress concentration or microcracks in the substrate material, affecting the mechanical properties and structural integrity of the material. Impact damage can cause cracks, peeling or fragments on the surface of the substrate material. In more serious cases, it will cause structural damage on a larger scale.

[0096] The second part is to analyze the composition of the ablation residues formed after the high-temperature and high-speed particles ablate and adhere to the metal substrate to obtain the composition analysis information.

[0097] Taking solid propellant with aluminum powder as an example, the solidified phase content in the gas combustion product can reach 30wt%, and the aluminum oxide particles generated by the oxidation reaction account for 98wt% of the solidified phase. The main component of the ablation residue at this time is aluminum oxide particles.

[0098] By integrating the above-mentioned thermomechanical analysis information and component analysis information to obtain the ablation mechanism analysis information, we can understand the damage degree of the metal substrate and the main components of the ablation residues on the metal substrate, and thus propose a corresponding removal plan.

[0099] In step S140, based on the ablation mechanism analysis information, laser system parameters may be set to generate a laser cleaning path, and the laser probe completes cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

[0100] In some optional embodiments of this example, when the metal substrate meets the cleaning requirements, the parameters of the laser cleaning system are set according to the physical properties of different residue components, including the setting of laser power parameter information, pulse frequency parameter information, cleaning times parameter information, duty cycle parameter information, etc.

[0101] Furthermore, these parameter information can be adjusted according to the actual laser cleaning process to ensure complete cleaning of the ablation residues.

[0102] Preferably, only one parameter information can be changed while keeping other parameters constant. And the parameter to be changed should have a tendency to increase or decrease slowly, so that the beginning and end stages of laser removal of ablation residues on the metal substrate can be more stable, ensuring minimal damage to the metal substrate by the laser.

[0103] In some optional embodiments of this example, according to the laser parameter information set above, the cleaning path of the laser probe is set to control the laser probe's cleaning work on the metal substrate.

[0104] First, set appropriate scan width parameters (when the scan width is set too small, the substrate at the center of the unit scan width will be ablated by the laser; when the scan width is set too large, the area at the edges on both sides of the unit scan width will be too large to be sufficiently cleared).

[0105] Afterwards, set appropriate scanning speed parameters (when the scanning speed is set too fast, the ablation residues on the path will not be completely removed; when the scanning speed is set too slow, the metal substrate on the path will be excessively removed).

[0106] Then, set the appropriate probe swing direction to solve the focusing problem caused by radial cleaning when the pipe or cleaning surface is a curved surface.

[0107] Finally, the laser probe is controlled to clean the metal substrate according to the set parameters. At the same time, these parameter information can also be adjusted according to the actual laser cleaning process to ensure the complete cleaning of the ablation residue. For example, after the axial cleaning is completed once, the radial edges of the two sides of the scanning width unit can be cleaned twice.

[0108] In a specific example, Figure 5-Figure 6 As shown, based on the above ablation mechanism analysis information, the metal substrate of the example sample material is selected as a steel plate, and the ablation residue is selected as aluminum oxide (according to experiments, a laser with a power of 1500W has the highest removal efficiency for aluminum oxide).

[0109] First, set the laser power to 1500W, set the scanning speed v / (mm / s) to be constant at 15000, set the pulse frequency f / kHz to be constant at 50, set the duty cycle η / % to remain unchanged at the initial value 100%, set the scanning width to 500mm, set the number of scans to 1, and set the swing direction to clear along the axial direction.

[0110] Then, select a distance of 1m from the cleaning target and start cleaning the aluminum oxide on the steel surface at an angle of 60° to the steel surface.

[0111] During the cleaning process, you can stop briefly to observe the cleaning status. When a part of the substrate can be seen (different from the ablated product), you should pay attention to avoid excessive cleaning and damage to the steel substrate. When the exposed area is large, you should stop cleaning and wait for the temperature of the area to drop below 40°C before switching to mechanical cleaning or using a laser in the low power range of 0.7kW-0.9kW to remove the remaining small amount of ablated product to avoid adverse effects of the laser on the substrate.

[0112] This method mainly uses laser cleaning technology combined with traditional mechanical cleaning technology. While avoiding the impact of laser on the substrate as much as possible, it also reduces the difficulty of cleaning, shortens the cleaning time, and improves the cleaning efficiency, allowing the used metal substrate to be maintained more quickly, avoiding the impact of ablated materials on it, and improving its use efficiency.

[0113] It should be noted that, although the steps of the method in the present disclosure are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps, etc.

[0114] In addition, in this exemplary embodiment, a device for cleaning metal surface ablation residues based on laser cleaning technology is also provided. Figure 7 As shown, the metal surface ablation residue cleaning device 700 based on laser cleaning technology may include: a metal substrate model generation module 710, an ablation motion simulation model construction module 720, an ablation mechanism analysis module 730 and a laser cleaning path generation module 740. Among them:

[0115] The metal substrate model generation module 710 is used to generate a metal substrate model by constructing a simulation model of the metal substrate;

[0116] The ablation motion simulation model building module 720 is used to generate an ablation motion simulation model by simulating and modeling the process of flame flow ablation of the metal substrate surface;

[0117] The ablation mechanism analysis module 730 is used to generate ablation mechanism analysis information by analyzing the generation mechanism of ablation residues;

[0118] The laser cleaning path generation module 740 is used to generate a laser cleaning path by setting laser system parameters, and the laser probe completes the cleaning of the ablation residue on the metal surface of the metal substrate through the laser cleaning path.

[0119] The metal surface ablation residue cleaning device based on laser cleaning technology of the embodiment of the present disclosure corresponds to the embodiment of the metal surface ablation residue cleaning method based on laser cleaning technology of the present disclosure, and the relevant contents can be referenced to each other, which will not be repeated here. The beneficial technical effects corresponding to the metal surface ablation residue cleaning device based on laser cleaning technology of the embodiment of the present disclosure can refer to the corresponding beneficial technical effects of the corresponding exemplary method part above, which will not be repeated here.

[0120] It should be noted that, although several modules or units of the metal surface ablation residue cleaning device 700 based on the laser cleaning technology are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided into multiple modules or units to be embodied.

[0121] Below, reference Figure 8 The electronic device according to the embodiment of the present disclosure is described. The electronic device may be any one or both of the first device and the second device, or a stand-alone device independent of them, and the stand-alone device may communicate with the first device and the second device to receive the collected input signals from them.

[0122] Figure 8 A block diagram of an electronic device according to an embodiment of the present disclosure is illustrated.

[0123] like Figure 8 As shown, the electronic device includes one or more processors and memory.

[0124] The processor may be a central processing unit (CPU) or other forms of processing units having data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0125] The memory may store one or more computer program products, and the memory may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, a random access memory (RAM) and / or a cache memory (cache), etc. The non-volatile memory may include, for example, a read-only memory (ROM), a hard disk, a flash memory, etc. One or more computer program products may be stored on the computer-readable storage medium, and the processor may run the computer program product to implement the various embodiments of the present disclosure described above and / or other desired functions.

[0126] In one example, the electronic device may further include: an input device and an output device, and these components are interconnected via a bus system and / or other forms of connection mechanisms (not shown).

[0127] In addition, the input device may also include, for example, a keyboard, a mouse, and the like.

[0128] The output device can output various information to the outside, including determined distance information, direction information, etc. The output device can include, for example, a display, a speaker, a printer, a communication network and a remote output device connected thereto, and the like.

[0129] Of course, to simplify, Figure 8 Only some of the components related to the present disclosure in the electronic device are shown, and components such as a bus, an input / output interface, etc. are omitted. In addition, according to specific application situations, the electronic device may further include any other appropriate components.

[0130] In addition to the above methods and devices, an embodiment of the present disclosure may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present disclosure described in the above part of this specification.

[0131] The computer program product may be written in any combination of one or more programming languages ​​to write program code for performing the operations of the disclosed embodiments, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0132] In addition, an embodiment of the present disclosure may also be a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, enables the processor to execute the steps of the method according to various embodiments of the present disclosure described in the above part of this specification.

[0133] The computer readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can include, for example, but is not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0134] The basic principles of the present disclosure are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present disclosure. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, and are not limitations. The above details do not limit the present disclosure to the necessity of adopting the above specific details to be implemented.

[0135] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0136] The block diagrams of the devices, apparatuses, equipment, and systems involved in this disclosure are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including," "comprising," "having," and the like are open words, referring to "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or," and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0137] The method and apparatus of the present disclosure may be implemented in many ways. For example, the method and apparatus of the present disclosure may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above order of steps for the method is for illustration only, and the steps of the method of the present disclosure are not limited to the order specifically described above, unless otherwise specifically stated. In addition, in some embodiments, the present disclosure may also be implemented as a program recorded in a recording medium, which includes machine-readable instructions for implementing the method according to the present disclosure. Therefore, the present disclosure also covers a recording medium storing a program for executing the method according to the present disclosure.

[0138] It should also be noted that in the apparatus, device and method of the present disclosure, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present disclosure.

[0139] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0140] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A method for cleaning metal surface ablation residues based on laser cleaning technology, characterized in that: include: Based on the working environment of the metal substrate, a metal substrate model is generated by constructing a simulation model of the metal substrate; Based on the metal substrate model, a simulation model of ablation motion is generated by simulating and modeling the process of flame flow ablating the surface of the metal substrate; Based on the ablation motion simulation model, by analyzing the generation mechanism of ablation residues, ablation mechanism analysis information is generated; Based on the ablation mechanism analysis information, laser system parameters are set to generate a laser cleaning path, and the laser probe completes the cleaning of ablation residues on the metal surface of the metal substrate through the laser cleaning path.

2. The method according to claim 1, characterized in that The simulation model of the metal substrate is constructed, including: Based on the working environment of the metal substrate, the support guide form of the metal substrate is established to generate guide form parameter information; Based on the working environment of the metal substrate, the shape of the metal substrate is established to generate shape parameter information; Based on the working environment of the metal substrate, material parameter information is generated by establishing material parameters of the metal substrate; Based on the working environment of the metal substrate, the material size of the metal substrate is established to generate size parameter information; Based on the guide form parameter information, shape parameter information, material parameter information, and size parameter information, a metal substrate model is generated by constructing a simulation model of the metal substrate.

3. The method according to claim 1, characterized in that The process of flame ablation on the metal substrate surface is simulated and modeled, including: Based on the metal substrate model, an initial flow field calculation domain is generated by defining a flow field calculation domain of the jet; Based on the metal substrate model, an ablation flow field calculation domain is generated by constraining the boundary conditions of the initial flow field calculation domain.

4. The method according to claim 3, characterized in that The process of flame ablation on the metal substrate surface is simulated and modeled, including: Based on the ablation flow field calculation domain, gas characteristic data is generated by extracting gas temperature and gas velocity; Based on the jet environment on the inner wall surface of the metal substrate, a gas flow field model is generated by analyzing the gas characteristic data; Based on the gas flow field model, particle characteristic data is generated by classifying the sizes of condensed particles; Based on the heat exchange between the condensed particles and the fuel gas, an ablation motion simulation model is generated by analyzing the particle characteristic data.

5. The method according to claim 1, characterized in that: By analyzing the generation mechanism of ablation residues, including: Based on the ablation motion simulation model, the thermomechanical effect of the gas is analyzed to generate thermomechanical analysis information; Based on the ablation motion simulation model, generating component analysis information by analyzing the components of the ablated product on the surface of the metal substrate; Ablation mechanism analysis information is generated by integrating the thermomechanical analysis information and the component analysis information.

6. The method according to claim 1, characterized in that By setting the laser system parameters, including at least one of the following: Based on the ablation mechanism analysis information, laser power parameter information is generated by setting the laser power; Based on the ablation mechanism analysis information, pulse frequency parameter information is generated by setting the laser pulse frequency; Based on the ablation mechanism analysis information, by setting the laser clearing times, clearing times parameter information is generated; Based on the ablation mechanism analysis information, generating duty cycle parameter information by setting the duty cycle; Laser parameter information is generated by integrating the laser power parameter information, pulse frequency parameter information, clearing times parameter information, and duty cycle parameter information.

7. The method according to claim 6, characterized in that By setting the laser system parameters, including: Based on the laser parameter information, a scanning width parameter is generated by setting the scanning width of the laser probe; Based on the laser parameter information, a scanning speed parameter is generated by setting a scanning speed of the laser probe; Based on the laser parameter information, a swing direction parameter is generated by setting the swing direction of the laser probe; Based on the scanning width parameter, scanning speed parameter, and swing direction parameter, a laser cleaning path is generated by planning the cleaning path of the laser probe, and the laser probe completes the cleaning of the ablation residue on the metal surface of the metal substrate through the laser cleaning path.

8. A device for cleaning metal surface ablation residues based on laser cleaning technology, characterized in that: include: A metal substrate model generation module is used to generate a metal substrate model by constructing a simulation model of the metal substrate; An ablation motion simulation model building module is used to generate an ablation motion simulation model by simulating and modeling the process of flame flow ablation of the metal substrate surface; An ablation mechanism analysis module is used to generate ablation mechanism analysis information by analyzing the generation mechanism of ablation residues; The laser cleaning path generation module is used to generate a laser cleaning path by setting laser system parameters, and the laser probe completes the cleaning of the ablation residue on the metal surface of the metal substrate through the laser cleaning path.

9. An electronic device, characterized in that: include: a memory for storing a computer program product; A processor is used to execute the computer program product stored in the memory, and when the computer program product is executed, it implements the method described in any one of claims 1 to 7.

10. A computer-readable storage medium having computer program instructions stored thereon, characterized in that: When the computer program instructions are executed by a processor, the method described in any one of claims 1 to 7 is implemented.

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