A high-lead BGA soldering equipment for integrated circuit packaging

Abstract

The invention discloses a high-lead BGA welding device for integrated circuit packaging, which relates to the technical field of welding equipment and includes a composite mechanism. The high-lead BGA welding device for integrated circuit packaging, through the composite mechanism design, places the material on a placing table, and then clamps the material through a clamping mechanism, so as to achieve the function of fixing the material, prevent the material from being offset when welding, and affect the welding efficiency and welding quality. The bogie can rotate on the top of the welding frame to increase the flexibility of the components. The welder is slidably connected with the sliding group to achieve the function of adjusting the welding height, expand the scope of application, weld the material through the welding port, and align the positioning mechanism with the material welding point during welding, so as to achieve the function of pre-positioning, improve the accuracy of welding, prevent offset, and improve welding efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of welding equipment, in particular to a high-lead BGA welding equipment for integrated circuit packaging. Background Art

[0002] BGA (Ball Grid Array) welding equipment is a professional equipment used for welding BGA packaged chips in electronic manufacturing. BGA is the abbreviation of ball grid array packaging technology. It is a high-density surface mounting packaging technology for chips. At the bottom of the package, the pins are spherical and arranged in a grid-like pattern. Motherboard control chipsets mostly use this type of packaging technology, and the materials are mostly ceramics. When welding chips, BGA welding equipment is needed to weld the chips.

[0003] The existing BGA welding equipment needs to be manually adjusted slowly when placing materials, which affects the welding efficiency. Secondly, there is an offset in the manual positioning during welding, which is prone to shaking and affects the welding effect. Therefore, a new design was made to address this situation. Summary of the invention

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a high-lead BGA welding device for integrated circuit packaging, comprising:

[0005] A composite mechanism for soldering high-lead BGAs;

[0006] A processing mechanism, the processing mechanism is used to clean the composite mechanism;

[0007] The two sides of the top of the composite mechanism are fixedly connected to the bottom of the processing mechanism;

[0008] Wherein, the composite mechanism comprises a composite base, the two sides of the top of the composite base are fixedly connected to the bottom of the processing mechanism, the top of the composite base is fixedly connected with a welding frame, the side of the welding frame outside the composite base is rotatably connected with a bogie, and the bogie can rotate on the top of the welding frame to increase the flexibility of the components, the side of the bogie outside the welding frame is fixedly connected with a sliding group, and the inner side of the sliding group is slidably connected with a welder, and the welder is slidably connected with the sliding group to achieve the effect of adjusting the welding height and expand the scope of application, the side of the welder outside the composite base is fixedly connected with a welding port, and the material is welded through the welding port. When welding, the positioning mechanism is aligned with the welding point of the material, so as to achieve the effect of pre-positioning, improve the accuracy of welding, prevent deviation, and improve welding efficiency, the side of the welder outside the welding port is fixedly connected with a positioning mechanism, and the side of the composite base top near the welding frame is fixedly connected with a placing table, the material is placed on the placing table, and then the material is clamped by the clamping mechanism, so as to achieve the effect of fixing the material, prevent deviation when welding the material, and affect the welding efficiency and welding quality, and the two sides of the placing table are fixedly connected with clamping mechanisms.

[0009] Preferably, the positioning mechanism includes an upper connecting block, a side of the upper connecting block away from the composite base is fixedly connected to the bottom of the welding machine, a square slide groove is provided on one side of the outer side of the upper connecting block, and when the lower connecting block contacts the surface of the material, the lower connecting block slides toward the upper connecting block to squeeze the spring block, thereby achieving a shock-absorbing and buffering effect through the spring material, a connecting rod is fixedly connected to the inner side of the square slide groove, and a lower connecting block is slidably connected to the outer side of the connecting rod, and when the lower connecting block contacts the material, the material welding point is squeezed around to prevent the material from shifting, thereby achieving the effect of fixing the welding point, improving the welding accuracy, and improving the welding quality, and a spring block is fixedly connected to the outer side of the connecting rod away from the lower connecting block.

[0010] Preferably, a silicone block is fixedly connected to one side of the outer part of the lower connecting block away from the upper connecting block. When the silicone block contacts the material, the friction performance is increased, the wear on the surface of the material is reduced, and the damage to the surface of the material is avoided. A square groove is provided on one side of the outer part of the silicone block. By providing the square groove, the contact area is increased through the groove, and the friction effect is improved. Secondly, the groove has a certain anti-slip effect to prevent the material from shaking.

[0011] Preferably, the clamping mechanism comprises a clamping frame, the outer side of the clamping frame is fixedly connected to the outer side of the placement table, a first electric push rod is fixedly connected to one side of the outer side of the clamping frame, and a clamping plate is fixedly connected to one side of the outer side of the first electric push rod away from the clamping frame. The material is placed on the placement table, and the clamping plate is controlled by the first electric push rod to move toward the middle of the component, so as to clamp the material and fix the material to prevent the material from moving during welding.

[0012] Preferably, the processing mechanism includes a processing frame, the bottom of the processing frame is fixedly connected to the top of the composite base, the side of the processing frame close to the composite base is fixedly connected to a plastic tube, the outside of the plastic tube is fixedly connected to a ring-shaped frame on the side away from the processing frame, the outside of the ring-shaped frame is fixedly connected to a second electric push rod, and the second electric push rod moves toward the composite mechanism to drive the plastic tube to extend, so as to adjust the contact distance, and start the fan to generate suction, which facilitates approaching the material and improves the working efficiency. One side of the outside of the second electric push rod is fixedly connected to the outside of the ring-shaped frame, and the inside of the ring-shaped frame is fixedly connected to a guide plate, and the guide plate is arranged on the inside of the ring-shaped frame, so as to achieve the effect of guiding impurities to enter and improve the absorption efficiency.

[0013] Preferably, a fixing mechanism is fixedly connected to the side of the processing frame away from the plastic tube, a collecting mechanism is clamped and connected to the inner side of the fixing mechanism, and a fan is fixedly connected to the side of the collecting mechanism away from the processing frame. The fan generates suction to absorb dust from the surface of the material, reduce dust on the surface of the material, prevent dust from affecting the welding effect, avoid dust from affecting the connection quality, and suck dust and other impurities into the collection mechanism, thereby collecting impurities and facilitating collection and processing.

[0014] Preferably, the fixing mechanism includes a fixing frame, the outer side of the fixing frame is fixedly connected to a cylindrical shell, the inner side of the cylindrical shell is provided with a spring bar, the collecting mechanism is placed on the inner side of the fixing frame, the fixing plate is squeezed, the sliding rod squeezes the spring bar, and then the sliding rod is supported by the spring bar, so as to clamp and fix the material, facilitate disassembly and quick connection of parts, and reduce the fixing steps; the inner wall of the cylindrical shell is slidably connected to the sliding rod, the side of the sliding rod away from the spring bar is fixedly connected to the fixing plate, and the side of the fixing plate away from the sliding rod is provided with a block surface cut, and the contact area is increased by providing the block surface cut and the groove, thereby improving the friction clamping effect and achieving an anti-slip effect, further improving the braking effect on the parts and preventing the parts from shaking.

[0015] Preferably, the collection mechanism includes a collection shell, which generates suction through a fan to allow impurities to enter the collection shell, driving the filter plate to rotate, thereby achieving the effect of adsorbing impurities; a funnel plate is fixedly connected to one side of the inner wall of the collection shell, and the funnel plate adopts a reverse funnel structure to reduce the circle of the collection shell, thereby achieving the effect of preventing impurities from overflowing; the inner wall of the collection shell is fixedly connected to a connecting frame, and the outer side of the connecting frame is rotatably connected to a filter plate, and the filter plate is connected to a friction mechanism, which drives the friction mechanism to rotate, thereby achieving the effect of scraping the inner wall of the equipment, thereby achieving the effect of cleaning surface impurities, reducing impurity attachment, and avoiding excessive accumulation affecting the collection effect; the outer side of the filter plate is fixedly connected to an external plate, and the external plate is provided with a filter plate surface, thereby achieving the effect of increasing the contact area and improving the filtering effect; one side of the outside of the filter plate is rotatably connected to the friction mechanism, and the side of the inner wall of the collection shell away from the funnel plate is fixedly connected to a grille plate.

[0016] Preferably, the friction mechanism includes a rotating block, one side of the outside of the rotating block is fixedly connected to a spring frame, which has a shock-absorbing and buffering effect and improves the stability of friction, and the side of the outside of the spring frame away from the rotating block is fixedly connected to a friction column, and when the friction column rubs the inner wall of the equipment, a rotational motion is generated, thereby achieving a uniform scraping effect, keeping the components evenly stressed, reducing unilateral stress, and extending the service life of the equipment, and the outer side of the friction column is fixedly connected to a raised block, which is connected to the surface of the friction column, thereby increasing the friction effect, improving the cleaning efficiency, protecting the components, and reducing surface wear of the components.

[0017] The present invention provides a high-lead BGA welding device for integrated circuit packaging. It has the following beneficial effects:

[0018] 1. The high-lead BGA welding equipment for integrated circuit packaging, through the composite mechanism design, places the material on the placement table, and then clamps the material through the clamping mechanism to achieve the function of fixing the material and prevent it from shifting during welding, which affects the welding efficiency and welding quality. The bogie can rotate on the top of the welding frame to increase the flexibility of the components. The welder is slidably connected with the sliding group to achieve the function of adjusting the welding height and expand the scope of application. The material is welded through the welding port. When welding, the positioning mechanism is aligned with the material welding point to achieve the function of pre-positioning, improve the welding accuracy, prevent shifting, and improve the welding efficiency.

[0019] 2. The high-lead BGA welding equipment for integrated circuit packaging is designed with a positioning mechanism. When the lower connecting block contacts the surface of the material, the lower connecting block slides toward the upper connecting block to squeeze the spring block, and the spring material is used to achieve a shock-absorbing and buffering effect. At the same time, when the lower connecting block contacts the material, the material welding point is squeezed around to prevent the material from shifting, thereby achieving the effect of fixing the welding point, improving the welding accuracy, and improving the welding quality. When the silicone block contacts the material, the friction performance is increased, the wear on the material surface is reduced, and the damage to the material surface is avoided. By opening a square groove, the contact area is increased by grooving, and the friction effect is improved. Secondly, the grooving has a certain anti-slip effect to prevent the material from shaking.

[0020] 3. The high-lead BGA welding equipment for integrated circuit packaging is designed with a processing mechanism. The second electric push rod moves toward the composite mechanism to drive the plastic tube to extend, so as to adjust the contact distance. The fan is started to generate suction, which is convenient for approaching the material and improving the working efficiency. The guide plate is arranged on the inner side of the ring frame to guide the entry of impurities and improve the absorption efficiency. The fan generates suction to absorb dust on the surface of the material, reduce dust on the surface of the material, prevent dust from affecting the welding effect, and avoid dust from affecting the connection quality. Dust and other impurities are sucked into the collection mechanism to collect impurities and facilitate collection and processing.

[0021] 4. The high-lead BGA welding equipment for integrated circuit packaging, through the fixed mechanism design, places the collecting mechanism inside the fixed frame, squeezes the fixed plate, makes the sliding rod squeeze the spring bar, and then supports the sliding rod through the spring bar, so as to clamp and fix the material, facilitate disassembly and quick connection of components, reduce the fixing steps, and increase the contact area by opening the block surface cut and opening the groove, thereby improving the friction clamping effect, and at the same time playing an anti-slip effect, further improving the braking effect on the components and preventing the components from shaking.

[0022] 5. The high-lead BGA welding equipment for integrated circuit packaging is designed with a collection mechanism. The fan generates suction to allow impurities to enter the collection shell, driving the filter plate to rotate, thereby adsorbing impurities. The external plate is provided with a filter plate surface to increase the contact area and improve the filtering effect. The filter plate is connected to a friction mechanism to drive the friction mechanism to rotate, thereby scraping the inner wall of the equipment to clean the surface impurities, reduce impurity attachment, and avoid excessive accumulation that affects the collection effect. The funnel plate adopts a reverse funnel structure to reduce the collection shell opening to prevent impurities from overflowing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the external structure of the high-lead BGA welding equipment for integrated circuit packaging of the present invention;

[0024] Figure 2 It is a schematic cross-sectional structure diagram of a high-lead BGA welding device for integrated circuit packaging of the present invention;

[0025] Figure 3 It is a schematic diagram of the composite mechanism structure of the present invention;

[0026] Figure 4 It is a schematic diagram of the positioning mechanism structure of the present invention;

[0027] Figure 5 It is a schematic diagram of the cross-sectional structure of the clamping mechanism of the present invention;

[0028] Figure 6 It is a schematic diagram of the cross-sectional structure of the processing mechanism of the present invention;

[0029] Figure 7 It is a schematic diagram of the cross-sectional structure of the fixing mechanism of the present invention;

[0030] Figure 8 It is a schematic diagram of the cross-sectional structure of the collecting mechanism of the present invention;

[0031] Fig. 9 It is a schematic diagram of the friction mechanism structure of the present invention.

[0032] In the figure: 1. composite mechanism; 2. processing mechanism; 11. composite base; 12. welding frame; 13. bogie; 14. sliding group; 15. welding machine; 16. welding port; 17. positioning mechanism; 18. placing table; 19. clamping mechanism; 171. upper connecting block; 172. square slide groove; 173. connecting rod; 174. spring block; 175. lower connecting block; 176. silicone block; 177. square groove; 191. clamping frame; 192. first electric push rod; 193. clamping plate; 21. processing frame; 22. plastic tube; 23. ring Frame; 24, guide plate; 25, second electric push rod; 26, fixing mechanism; 27, collecting mechanism; 28, fan; 261, fixing frame; 262, cylindrical shell; 263, spring bar; 264, sliding rod; 265, fixing plate; 266, block surface cut; 271, collecting shell; 272, funnel plate; 273, connecting frame; 274, filter plate; 275, external plate; 276, friction mechanism; 277, grille plate; 2761, rotating block; 2762, spring frame; 2763, friction column; 2764, raised block. DETAILED DESCRIPTION

[0033] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0034] The first embodiment, as Figures 1 to 3 As shown, the present invention provides a technical solution: a high-lead BGA welding device for integrated circuit packaging, comprising a composite mechanism 1, the composite mechanism 1 is used for welding high-lead BGA;

[0035] A processing mechanism 2, the processing mechanism 2 is used to clean the composite mechanism 1;

[0036] The two sides of the top of the composite mechanism 1 are fixedly connected to the bottom of the processing mechanism 2;

[0037] Among them, the composite mechanism 1 includes a composite base 11, the two sides of the top of the composite base 11 are fixedly connected to the bottom of the processing mechanism 2, the top of the composite base 11 is fixedly connected to a welding frame 12, the side of the welding frame 12 outside away from the composite base 11 is rotatably connected to a bogie 13, the side of the bogie 13 outside away from the welding frame 12 is fixedly connected to a sliding group 14, the inner side of the sliding group 14 is slidably connected to a welder 15, the side of the welder 15 outside close to the composite base 11 is fixedly connected to a welding port 16, the side of the welder 15 outside close to the welding port 16 is fixedly connected to a positioning mechanism 17, the top of the composite base 11 is fixedly connected to a placement table 18 on one side close to the welding frame 12, and both sides of the outside of the placement table 18 are fixedly connected to clamping mechanisms 19. The material is placed on the placement table 18, and then clamped by the clamping mechanism 19 to fix the material and prevent it from shifting during welding, which affects the welding efficiency and welding quality. The bogie 13 can rotate on the top of the welding frame 12 to increase the flexibility of the components. The welder 15 is slidably connected with the sliding group 14 to adjust the welding height and expand the scope of application. The material is welded through the welding port 16. When welding, the positioning mechanism 17 is aligned with the material welding point to achieve the effect of pre-positioning, improve the accuracy of welding, prevent shifting, and improve welding efficiency.

[0038] The second embodiment is based on the first embodiment. Figures 4 to 5As shown, the positioning mechanism 17 includes an upper connecting block 171, and the side of the upper connecting block 171 away from the composite base 11 is fixedly connected to the bottom of the welding machine 15. A square slide groove 172 is provided on one side of the outer side of the upper connecting block 171, and a connecting rod 173 is fixedly connected to the inner side of the square slide groove 172. A lower connecting block 175 is slidably connected to the outer side of the connecting rod 173, and a spring block 174 is fixedly connected to the outer side of the connecting rod 173 away from the lower connecting block 175. When the lower connecting block 175 contacts the surface of the material, the lower connecting block 175 slides toward the upper connecting block 171 to squeeze the spring block 174, and the spring material is used to achieve the effect of shock absorption and buffering. At the same time, when the lower connecting block 175 contacts the material, it squeezes the surroundings of the material welding point to prevent the material from shifting, thereby achieving the effect of fixing the welding point, improving the accuracy of welding, and improving the welding quality.

[0039] A silicone block 176 is fixedly connected to one side of the lower connecting block 175 away from the upper connecting block 171, and a square groove 177 is provided on one side of the outer side of the silicone block 176. When the silicone block 176 contacts the material, the friction performance is increased, the wear on the surface of the material is reduced, and the surface of the material is prevented from being damaged. By providing the square groove 177, the contact area is increased by the groove, and the friction effect is improved. Secondly, the groove has a certain anti-slip effect to prevent the material from shaking.

[0040] The clamping mechanism 19 includes a clamping frame 191, the outer side of the clamping frame 191 is fixedly connected to the outer side of the placement table 18, a first electric push rod 192 is fixedly connected to one side of the outer side of the clamping frame 191, and a clamping plate 193 is fixedly connected to one side of the outer side of the first electric push rod 192 away from the clamping frame 191. The material is placed on the placement table 18, and the clamping plate 193 is controlled by the first electric push rod 192 to move toward the middle of the component, so as to clamp the material and fix the material to prevent the material from moving during welding.

[0041] The third embodiment is based on the first and second embodiments. Figures 6 to 9 As shown, the processing mechanism 2 includes a processing frame 21, the bottom of the processing frame 21 is fixedly connected to the top of the composite base 11, a plastic tube 22 is fixedly connected to the side of the processing frame 21 close to the composite base 11, a ring frame 23 is fixedly connected to the side of the plastic tube 22 away from the processing frame 21, a second electric push rod 25 is fixedly connected to the outside of the ring frame 23, one side of the outside of the second electric push rod 25 is fixedly connected to the outside of the ring frame 23, and a guide plate 24 is fixedly connected to the inside of the ring frame 23. The second electric push rod 25 moves toward the composite mechanism 1, driving the plastic tube 22 to extend, so as to adjust the contact distance, and the suction force is generated by starting the fan 28, so as to facilitate approaching the material and improve the working efficiency. The guide plate 24 is arranged on the inside of the ring frame 23, so as to guide the impurities to enter and improve the absorption efficiency.

[0042] A fixing mechanism 26 is fixedly connected to the side of the processing frame 21 away from the plastic tube 22, and a collecting mechanism 27 is clamped and connected to the inner side of the fixing mechanism 26. A fan 28 is fixedly connected to the side of the collecting mechanism 27 away from the processing frame 21. The fan 28 generates suction force to absorb dust from the surface of the material, reduce dust on the surface of the material, prevent dust from affecting the welding effect, avoid dust from affecting the connection quality, and suck dust and other impurities into the collecting mechanism 27, thereby achieving the function of collecting impurities and facilitating collection and processing.

[0043] The fixing mechanism 26 comprises a fixing frame 261, a cylindrical shell 262 is fixedly connected to the outer side of the fixing frame 261, a spring bar 263 is arranged on the inner side of the cylindrical shell 262, a sliding rod 264 is slidably connected to the inner wall of the cylindrical shell 262, a fixing plate 265 is fixedly connected to the side of the sliding rod 264 away from the spring bar 263, and a block surface cutout 266 is provided on the side of the fixing plate 265 away from the sliding rod 264. The collecting mechanism 27 is placed inside the fixing frame 261, the fixing plate 265 is pressed, the sliding rod 264 presses the spring bar 263, and then the sliding rod 264 is supported by the spring bar 263, so as to clamp and fix the material, facilitate disassembly and quick connection of components, reduce fixing steps, and increase the contact area by opening the block surface cutout 266 and the groove, thereby improving the friction clamping effect, and playing an anti-slip effect, further improving the braking effect of the components, and preventing the components from shaking.

[0044] The collecting mechanism 27 includes a collecting shell 271, a funnel plate 272 is fixedly connected to one side of the inner wall of the collecting shell 271, a connecting frame 273 is fixedly connected to the inner wall of the collecting shell 271, a filter plate 274 is rotatably connected to the outer side of the connecting frame 273, an external plate 275 is fixedly connected to the outer side of the filter plate 274, a friction mechanism 276 is rotatably connected to one side of the outside of the filter plate 274, and a grille plate 277 is fixedly connected to the side of the inner wall of the collecting shell 271 away from the funnel plate 272. Suction is generated by the fan 28 to allow impurities to enter the interior of the collection shell 271, driving the filter plate 274 to rotate, thereby achieving the effect of adsorbing impurities. The external plate 275 is set on the surface of the filter plate 274 to increase the contact area and improve the filtering effect. The filter plate 274 is connected to the friction mechanism 276, which drives the friction mechanism 276 to rotate, thereby scraping the inner wall of the equipment, thereby cleaning the surface impurities, reducing the attachment of impurities, and avoiding excessive accumulation that affects the collection effect. The funnel plate 272 adopts a reverse funnel structure to reduce the circle of the collection shell 271, thereby preventing impurities from overflowing.

[0045] The friction mechanism 276 includes a rotating block 2761, a spring frame 2762 is fixedly connected to one side of the rotating block 2761, a friction column 2763 is fixedly connected to one side of the spring frame 2762 away from the rotating block 2761, and a protrusion 2764 is fixedly connected to the outer side of the friction column 2763. When the friction column 2763 rubs against the inner wall of the device, a rotational motion is generated, thereby achieving a uniform scraping effect, keeping the components evenly stressed, reducing unilateral stress, and extending the service life of the device. The protrusion 2764 is connected to the surface of the friction column 2763, thereby increasing the friction effect, improving the cleaning efficiency, protecting the components, reducing the wear on the surface of the components, and achieving a shock-absorbing and buffering effect through the spring frame 2762, thereby improving the stability of friction.

[0046] When in use, the staff places the material on the placement table 18 inside the composite structure 1, and then clamps the material through the clamping mechanism 19 to fix the material and avoid shaking during operation. The welding machine 15 connects the welding port 16 to weld the material, and drives the positioning mechanism 17 to move toward the welding point of the material during welding. The positioning mechanism 17 plays a role of pre-fixing. Before welding, the welding points of the materials are first docked to achieve the effect of pre-fixing, improve the welding accuracy, and improve the welding quality.

[0047] Before the composite mechanism 1 welds the material, the processing mechanism 2 is started, and the fan 28 inside the processing mechanism 2 is used to generate suction through the rotation of the fan 28 to absorb impurities on the surface of the material, so as to achieve the purpose of cleaning impurities, avoid impurities affecting the welding effect, and prevent short circuits from affecting the welding quality. At the same time, the impurities are absorbed and then enter the collecting mechanism 27, and the impurities are stored by the collecting mechanism 27 for subsequent processing.

[0048] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A high-lead BGA soldering device for integrated circuit packaging, characterized in that: include: A composite structure (1), the composite structure (1) is used for soldering high-lead BGA; A processing mechanism (2), the processing mechanism (2) is used to clean the composite mechanism (1); The two sides of the top of the composite mechanism (1) are fixedly connected to the bottom of the processing mechanism (2); The composite mechanism (1) comprises a composite base (11), the two sides of the top of the composite base (11) are fixedly connected to the bottom of the processing mechanism (2), the top of the composite base (11) is fixedly connected to a welding frame (12), the side of the welding frame (12) away from the composite base (11) is rotatably connected to a bogie (13), the side of the bogie (13) away from the welding frame (12) is fixedly connected to a sliding group (14), the inner side of the sliding group (14) is slidably connected to a welder (15), the side of the welder (15) close to the composite base (11) is fixedly connected to a welding port (16), the side of the welder (15) close to the welding port (16) is fixedly connected to a positioning mechanism (17), the top of the composite base (11) is fixedly connected to a placement table (18) on one side close to the welding frame (12), and both sides of the outside of the placement table (18) are fixedly connected to clamping mechanisms (19); The positioning mechanism (17) comprises an upper connecting block (171), a side of the upper connecting block (171) away from the composite base (11) is fixedly connected to the bottom of the welding machine (15), a square slide groove (172) is provided on an outer side of the upper connecting block (171), a connecting rod (173) is fixedly connected to the inner side of the square slide groove (172), a lower connecting block (175) is slidably connected to the outer side of the connecting rod (173), and a spring block (174) is fixedly connected to the outer side of the connecting rod (173) away from the lower connecting block (175); A silicone block (176) is fixedly connected to a side of the lower connecting block (175) away from the upper connecting block (171), and a square groove (177) is formed on one side of the outer side of the silicone block (176); The clamping mechanism (19) comprises a clamping frame (191), the outer side of the clamping frame (191) is fixedly connected to the outer side of the placement table (18), a first electric push rod (192) is fixedly connected to one side of the outer side of the clamping frame (191), and a clamping plate (193) is fixedly connected to one side of the outer side of the first electric push rod (192) away from the clamping frame (191); The processing mechanism (2) comprises a processing frame (21), the bottom of the processing frame (21) is fixedly connected to the top of the composite base (11), a side of the processing frame (21) close to the composite base (11) is fixedly connected to a plastic tube (22), an outer side of the plastic tube (22) away from the processing frame (21) is fixedly connected to a ring frame (23), an outer side of the ring frame (23) is fixedly connected to a second electric push rod (25), an outer side of the second electric push rod (25) is fixedly connected to the outer side of the ring frame (23), and an inner side of the ring frame (23) is fixedly connected to a guide plate (24); A fixing mechanism (26) is fixedly connected to the side of the processing frame (21) away from the plastic tube (22); a collecting mechanism (27) is clamped and connected to the inner side of the fixing mechanism (26); and a fan (28) is fixedly connected to the side of the collecting mechanism (27) away from the processing frame (21); The fixing mechanism (26) comprises a fixing frame (261), the outer side of the fixing frame (261) is fixedly connected to a cylindrical shell (262), the inner side of the cylindrical shell (262) is provided with a spring bar (263), the inner wall of the cylindrical shell (262) is slidably connected to a sliding rod (264), a side of the sliding rod (264) away from the spring bar (263) is fixedly connected to a fixing plate (265), and a side of the fixing plate (265) away from the sliding rod (264) is provided with a block surface cutout (266); The collecting mechanism (27) comprises a collecting shell (271), a funnel plate (272) being fixedly connected to one side of the inner wall of the collecting shell (271), a connecting frame (273) being fixedly connected to the inner wall of the collecting shell (271), a filter plate (274) being rotatably connected to the outer side of the connecting frame (273), an external connecting plate (275) being fixedly connected to the outer side of the filter plate (274), a friction mechanism (276) being rotatably connected to one side of the outer side of the filter plate (274), and a grid plate (277) being fixedly connected to the side of the inner wall of the collecting shell (271) away from the funnel plate (272); The friction mechanism (276) comprises a rotating block (2761), a spring frame (2762) is fixedly connected to one side of the rotating block (2761), a friction column (2763) is fixedly connected to one side of the spring frame (2762) away from the rotating block (2761), and a protruding block (2764) is fixedly connected to the outer side of the friction column (2763); The material is placed on a placement table (18), and the clamping plate (193) is controlled by a first electric push rod (192) to move toward the middle of the component.

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