Control method of wafer cutting fluid

By adjusting the shaft spacing between the wire mesh groove wheels and automatically controlling the flow of the cutting fluid, the problem of the impact of large-sized wafer cutting fluid on the diamond wire shaking is solved, the cutting quality and silicon wafer yield are improved, and the impact of the cutting fluid on the diamond wire is significantly reduced. , improves the stability of the TTV of the chip.

CN119189085APending Publication Date: 2024-12-27ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411620286.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-13
Publication Date
2024-12-27

AI Technical Summary

Technical Problem

With the increase in the diameter of semiconductor wafers, the existing cutting liquid control methods cannot guarantee the stability of the diamond wire cutting state and the surface quality of the silicon wafer, resulting in the degradation of cutting quality and hidden cracking problems.

Method used

By adjusting the shaft spacing of the wire mesh groove wheels based on the diameter of the crystal rod, the minimum flow rate of the cutting fluid is obtained, and the flow rate of the cutting fluid first decreases and then increases as the cutting depth increases. The flow rate is automatically adjusted by using the relationship between the cutting depth and the chord length to ensure the diamond line The stability of the network.

Benefits of technology

It minimizes the impact of the cutting liquid on the diamond wire, improves the cutting quality and silicon wafer yield, significantly reduces the impact of the cutting liquid on the diamond wire, and improves the TTV (total deviation value) level and stability of the wafer.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a control method of wafer cutting fluid, which comprises the following steps of: adjusting the axial distance of a wire net grooved wheel based on the diameter of a crystal bar; the minimum flow of the cutting fluid is obtained; and the cutting fluid flow is controlled to be reduced and then increased along with the increase of the cutting depth. According to the control method for the wafer cutting fluid, the flow of the cutting fluid is quantified according to the relation between the cutting depth and the chord length of the wafer; and based on the relative position of the cutting position and the jet flow of the nozzle, the flow speed of the cutting liquid is automatically adjusted, the impact of the cutting liquid on the diamond wire net is reduced to the maximum extent, the stability of the diamond wire net is guaranteed, the cutting quality is improved, and the yield of silicon wafers can also be improved.
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Citation Information

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