Photovoltaic packaging adhesive, photovoltaic module and photovoltaic module packaging method

Abstract

The invention is suitable for the technical field of photovoltaic module packaging, and provides a photovoltaic packaging adhesive, a photovoltaic module and a photovoltaic module packaging method.The photovoltaic packaging adhesive comprises methyl methacrylate, diester hydrogen phosphate and a photoinitiator, the mass ratio of methyl methacrylate to diester hydrogen phosphate is 100: (3-9), and the photoinitiator is a mixture of methyl methacrylate and diester hydrogen phosphate. And the mass ratio of the photoinitiator in the photovoltaic packaging adhesive is 2%-4%. And the photovoltaic packaging glue is coated between the glass sheet and the solar cell. The methyl methacrylate, the diester hydrogen phosphate and the photoinitiator are stirred to form the photovoltaic packaging adhesive, and the photovoltaic packaging adhesive can be cured by placing the photovoltaic packaging adhesive under ultraviolet irradiation without being cured in a high-temperature and high-pressure environment. The thermal damage and deformation stress of the photovoltaic module during packaging are reduced, the packaging quality of the photovoltaic module is improved, and the packaging efficiency of the photovoltaic module is effectively improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of photovoltaic module packaging, and in particular relates to a photovoltaic packaging adhesive, a photovoltaic module and a photovoltaic module packaging method. Background Art

[0002] Nowadays, energy shortage and environmental degradation have become important issues faced by human survival and development. Therefore, the need for renewable energy is becoming more and more urgent. In nature, solar energy is a renewable and clean energy, so it has received extensive attention and utilization. In existing technologies, photovoltaic modules are usually used to convert solar energy into electrical energy for people's daily life and production.

[0003] There are many kinds of existing photovoltaic modules. The structure of a common photovoltaic module is that a substrate is provided at both ends of the upper and lower ends of the solar cell, and a packaging material is filled between the substrate and the solar cell to fix the solar cell to the substrate. Among them, the packaging material is usually EVA film or POE film. When in use, the EVA film or POE film is placed between the solar cell and the substrate, and then subjected to hot pressing treatment, the EVA film or POE film is melted and solidified to bond and fix the solar cell and the substrate. However, when the photovoltaic module is encapsulated using EVA film or POE film, a high-temperature lamination process is required, in which the high temperature and lamination process will cause thermal damage to the substrate and the solar cell, thereby reducing the production quality of the photovoltaic module. And the use of EVA film or POE film for encapsulation needs to be carried out in a high temperature and high pressure environment, with high investment cost and low processing efficiency, resulting in high production cost and low production efficiency of photovoltaic modules. Summary of the invention

[0004] A photovoltaic encapsulation adhesive provided in an embodiment of the present invention is intended to reduce thermal damage and deformation during encapsulation of photovoltaic modules, improve the encapsulation efficiency of photovoltaic modules, and reduce the production cost of photovoltaic modules.

[0005] The embodiment of the present invention is implemented as follows: a photovoltaic encapsulation adhesive is used to encapsulate a photovoltaic module, wherein the photovoltaic module includes a solar cell and glass plates disposed at the upper and lower ends of the solar cell, and the photovoltaic encapsulation adhesive includes: Methyl methacrylate; Dihydrogen phosphate is mixed with the methyl methacrylate, and the mass ratio of the methyl methacrylate to the dihydrogen phosphate is 100: (3-9); A photoinitiator, wherein the mass proportion of the photoinitiator in the photovoltaic encapsulation adhesive is 2% to 4%; The photovoltaic encapsulation adhesive is used to be coated between the glass sheet and the solar cell sheet to encapsulate the photovoltaic component.

[0006] Furthermore, the methyl methacrylate, the diester of hydrogen phosphate, and the photoinitiator are stirred and mixed under light-proof conditions.

[0007] Furthermore, under the light-proof condition, the methyl methacrylate, the diester of hydrogen phosphate, and the photoinitiator are mixed and stirred for 8 hours.

[0008] Furthermore, the mixture of the methyl methacrylate, the diester of hydrogen phosphate, and the photoinitiator is photocured under ultraviolet irradiation.

[0009] Furthermore, the wavelength of the ultraviolet rays is configured between 350nm and 400nm.

[0010] Furthermore, the irradiation time of the photovoltaic encapsulation adhesive under the ultraviolet light is between 85s and 100s.

[0011] Furthermore, the material of the photoinitiator is at least one of 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester, 2-hydroxy-2-methyl-1-phenylpropanone, and 1-hydroxycyclohexylphenylketone.

[0012] The embodiment of the present invention further provides a photovoltaic module packaging method, using the above-mentioned photovoltaic packaging glue, comprising the following steps: Methyl methacrylate, diester hydrogen phosphate, and ethyl 2,4,6-trimethylbenzoylphenylphosphonate are stirred and mixed in the dark to obtain a photovoltaic encapsulation adhesive; Photovoltaic encapsulation glue is coated on one surface of each glass plate and degassing treatment is performed in a vacuum environment; A glass plate is attached to both the upper and lower ends of the solar cell, and the surface of the glass plate coated with photovoltaic encapsulation glue is brought into contact with the solar cell; The glass plate and solar cell are placed under ultraviolet light to photo-cure the photovoltaic encapsulation adhesive and complete the encapsulation of the photovoltaic module.

[0013] The embodiment of the present invention further provides a photovoltaic module, which is manufactured by the above-mentioned photovoltaic module packaging method, and includes: Solar cells; A glass plate, wherein a glass plate is provided at the upper end and the lower end of the solar cell; The photovoltaic encapsulation adhesive according to any one of claims 1 to 7 is applied between the glass plate and the solar cell and is photocured to connect the glass plate and the solar cell.

[0014] Furthermore, the surface of each glass plate facing the solar cell is coated with the photovoltaic encapsulation adhesive and is degassed in a vacuum environment.

[0015] In a photovoltaic encapsulation adhesive provided by the present invention, methyl methacrylate, diester hydrogen phosphate, and a photoinitiator are stirred and mixed to form a photovoltaic encapsulation adhesive, and the photovoltaic encapsulation adhesive is used to encapsulate photovoltaic modules. The photovoltaic encapsulation adhesive can be cured by simply placing it under ultraviolet light for irradiation, without the need for curing in a high temperature and high pressure environment. Therefore, the thermal damage and deformation stress of the photovoltaic module during encapsulation are reduced, the encapsulation quality of the photovoltaic module is improved, and the photovoltaic encapsulation adhesive can be cured in a relatively short time, effectively improving the encapsulation efficiency of the photovoltaic module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic flow chart of a photovoltaic module packaging method provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of the structure of a photovoltaic module provided by an embodiment of the present invention.

[0017] Explanation of reference numerals: 100, solar cell; 200, glass plate; 300, photovoltaic encapsulation adhesive. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0019] In the description of the present invention, it is necessary to understand that the orientation or positional relationship indicated in the description of the direction and positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the examples of various specific processes and materials provided by the present invention, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0022] As described in the background technology, there are many kinds of existing photovoltaic modules. The structure of a common photovoltaic module is that a substrate is provided at both ends of the upper and lower ends of the solar cell, and a packaging material is filled between the substrate and the solar cell to fix the solar cell to the substrate. Among them, the packaging material is usually an EVA film or a POE film. When in use, the EVA film or the POE film is placed between the solar cell and the substrate, and then subjected to a hot pressing process, the EVA film or the POE film is melted and solidified to bond and fix the solar cell to the substrate. However, when the photovoltaic module is encapsulated using the EVA film or the POE film, a high-temperature lamination process is required, in which the high temperature and the lamination process cause thermal damage to the substrate and the solar cell, thereby reducing the production quality of the photovoltaic module. And the use of EVA film or POE film for encapsulation requires that it be carried out in a high temperature and high pressure environment, with high input cost and low processing efficiency, resulting in high production cost and low production efficiency of the photovoltaic module. For this reason, an embodiment of the present invention provides a photovoltaic encapsulation adhesive, which is intended to reduce the thermal damage during the encapsulation of the photovoltaic module, and improve the encapsulation efficiency of the photovoltaic module, and reduce the production cost of the photovoltaic module.

[0023] The present application proposes a photovoltaic encapsulant 300, which is used to encapsulate a photovoltaic module. A general photovoltaic module includes a solar cell 100 and a glass plate 200 disposed at the upper and lower ends of the solar cell 100. The photovoltaic encapsulant 300 includes methyl methacrylate, hydrogen phosphate diester, and a photoinitiator. The hydrogen phosphate diester is mixed with methyl methacrylate, and the mass ratio of methyl methacrylate to hydrogen phosphate diester is 100: (3-9). The mass proportion of the photoinitiator in the photovoltaic encapsulant 300 is 2%-4%. The photovoltaic encapsulant 300 is used to be coated between the glass sheet and the solar cell 100 to encapsulate the photovoltaic module.

[0024] In this way, methyl methacrylate, diester of hydrogen phosphate, and photoinitiator are stirred and mixed to form photovoltaic encapsulation glue 300, and photovoltaic encapsulation glue 300 is used to encapsulate photovoltaic modules. The photovoltaic encapsulation glue 300 only needs to be placed under ultraviolet light to be cured. Compared with the traditional method of encapsulation using EVA film or POE film, this solution does not need to be cured in a high temperature and high pressure environment. Therefore, the thermal damage and deformation stress of the photovoltaic module during encapsulation are reduced, the encapsulation quality of the photovoltaic module is improved, and there is no need to process in a high temperature and high pressure environment, which reduces the processing cost of encapsulating photovoltaic modules. In addition, the photovoltaic encapsulation glue 300 can be cured in a relatively short time under the irradiation of ultraviolet rays, which effectively improves the encapsulation efficiency of the photovoltaic module.

[0025] Furthermore, methyl methacrylate and dihydrogen phosphate are stirred and mixed, so that the formed mixture will not react chemically with the photovoltaic module after curing, and the refractive index of the mixture matches the refractive index of the glass plate 200 in the photovoltaic module, reducing the reflection loss of light at the interface where the photovoltaic module receives solar energy, improving the light transmittance of the photovoltaic module, and thus improving the photoelectric conversion efficiency of the photovoltaic module. In addition, dihydrogen phosphate contains phosphate groups, which can effectively inhibit the leakage of lead ions in the photovoltaic module, reducing the damage to the natural environment or human body caused by the leakage of heavy metals such as lead ions in the photovoltaic module.

[0026] Preferably, the mass ratio of methyl methacrylate to diester of hydrogen phosphate is configured at 100:(3-9), for example, the mass ratio of methyl methacrylate to diester of hydrogen phosphate can be configured at 100:4, 100:5, 100:6, 100:7, etc. However, it is not limited thereto, and more preferably, the mass ratio of methyl methacrylate to diester of hydrogen phosphate is configured at 100:(6-8). The photovoltaic encapsulation glue 300 has a refractive index and thermal expansion coefficient that is more compatible with the glass plate 200 in the photovoltaic module after photocuring compared to the existing photocuring glue, thereby improving the light transmittance and structural stability of the photovoltaic module. If the mass ratio of methyl methacrylate to diester of hydrogen phosphate is configured too high or too low, the refractive index of the cured photovoltaic encapsulation glue 300 does not match the photovoltaic module, which will increase the light reflection loss of the photovoltaic module, thereby reducing the light transmittance of the photovoltaic module, resulting in a decrease in the photoelectric conversion efficiency of the photovoltaic module. It will also cause a large difference in thermal expansion coefficient between the cured photovoltaic encapsulation adhesive 300 and the photovoltaic module, making it easy for the photovoltaic module to receive deformation stress from the photovoltaic encapsulation adhesive 300 when it is heated during operation or in a high temperature environment, thereby causing the photovoltaic module to suffer stress damage or separate from the photovoltaic encapsulation adhesive 300, reducing the structural stability of the photovoltaic module.

[0027] It is understood that the photoinitiator acts as a catalyst and the mixture of methyl methacrylate and diester of hydrogen phosphate undergoes a polymerization reaction under ultraviolet irradiation. The polymerization reaction here refers to the photoinitiator being decomposed by light to produce active free radicals that react with the double bonds in methyl methacrylate to form new free radicals. The newly generated free radicals will continue to react with the methyl methacrylate monomer to form a polymer with extremely high transparency, good optical properties, good chemical stability, and high mechanical strength. This polymer has strong adhesion and will tightly fit the glass sheet to the upper and lower ends of the solar cell 100.

[0028] Preferably, the mass proportion of the photoinitiator in the photovoltaic encapsulant 300 is configured to be 2% to 4%, so that the photovoltaic encapsulant 300 can be fully cured, reducing the possibility of unstable connection between the glass sheet and the solar cell 100 due to insufficient photocuring of the photovoltaic encapsulant 300, thereby improving the stability of the photovoltaic module structure and the packaging quality.

[0029] In the embodiment of the present invention, the performance of the photovoltaic module before and after encapsulation with the photovoltaic encapsulation glue 300 was tested respectively. The test was carried out under the same test conditions and environment. Please refer to the following table for various performance data:

[0030] From the above table, we can see that under the same test conditions, the photovoltaic module before encapsulation with photovoltaic encapsulation glue 300 has an open circuit voltage of 1.822mV and a short circuit current density of 17.937mA / cm 2 , the fill factor is 79.551%. The photovoltaic module encapsulated with photovoltaic encapsulation glue 300: the open circuit voltage is 1.821mV, and the short circuit current density is 18.018mA / cm 2 , the filling factor is 80.466%.

[0031] It is understood that the open circuit voltage (Voc) mentioned in this article refers to the voltage across the solar cell 100 when no current flows through it. A higher open circuit voltage (Voc) means that the photovoltaic module can produce a higher voltage output under the same lighting conditions. The short circuit current density (Jsc) refers to the amount of current passing through the solar cell 100 per unit area under short circuit conditions. A higher short circuit current density (Jsc) generally means a higher photoelectric conversion efficiency; the fill factor (FF) refers to the ratio of the maximum power of the photovoltaic module to the product of the open circuit voltage (Voc) and the short circuit current density (Jsc). The larger the fill factor (FF), the higher the photoelectric conversion efficiency of the photovoltaic module.

[0032] Since the photovoltaic conversion efficiency (PCE) of the photovoltaic module is affected by factors such as open circuit voltage (Voc), short circuit current density (Jsc), and fill factor (FF), and the calculation formula of photovoltaic conversion efficiency (PCE) is: photovoltaic conversion efficiency (PCE) = incident light power / output power × 100%, where the output power refers to the electric power generated by the photovoltaic module. Incident power = open circuit voltage (Voc) × short circuit current density (Jsc) × fill factor (FF), where the incident light power refers to the total amount of light energy irradiated to the surface of the photovoltaic module per unit time, and the incident light power is mainly affected by the light intensity of sunlight in the natural environment. Since the test was conducted under the same light intensity, the incident light power of the photovoltaic module before and after encapsulation with photovoltaic encapsulation glue 300 is the same. By comparing the various performance data of the photovoltaic module before and after encapsulation with photovoltaic encapsulation glue 300, it can be seen that the short circuit current density (Jsc) and fill factor (FF) of the photovoltaic module encapsulated with photovoltaic encapsulation glue 300 are greater than those of the photovoltaic module before encapsulation with photovoltaic encapsulation glue 300. Thus, after calculation, the photoelectric conversion efficiency (PCE) of the photovoltaic module before packaging with the photovoltaic encapsulation glue 300 is 25.979%, and the PCE of the photovoltaic module after packaging with the photovoltaic encapsulation glue 300 is 26.377%. The photoelectric conversion efficiency (PCE) of the photovoltaic module after packaging with the photovoltaic encapsulation glue 300 is greater than that of the photovoltaic module before packaging with the photovoltaic encapsulation glue 300. Therefore, packaging with the photovoltaic encapsulation glue 300 can effectively improve the photoelectric conversion efficiency (PCE) of the photovoltaic module.

[0033] The photovoltaic modules are tested only at a temperature of 85°C and a relative humidity of 85% (double 85 damp heat aging test) and only under ultraviolet irradiation with a wavelength of 365nm. The data of various performances can be found in the following table:

[0034] As can be seen from the above table, only under the conditions of 85°C temperature and 85% relative humidity (double 85 damp heat aging test), after 1000h of testing, the photovoltaic module before encapsulation with photovoltaic encapsulation glue 300: the normalized PCE of the photovoltaic module does not exist, that is, the photovoltaic module fails under this condition; the photovoltaic module after encapsulation with photovoltaic encapsulation glue 300: the normalized PCE of the photovoltaic module is greater than 96%. The photovoltaic module was tested only under the conditions of ultraviolet irradiation with a wavelength of 365nm. After irradiation for 500h, the photovoltaic module before encapsulation with photovoltaic encapsulation glue 300: the normalized PCE of the photovoltaic module does not exist, that is, the photovoltaic module fails under this condition; the photovoltaic module after encapsulation with photovoltaic encapsulation glue 300: the normalized PCE of the photovoltaic module is greater than 98%. The normalized PCE mentioned here refers to the efficiency of the ratio of the photoelectric conversion efficiency measured by the photovoltaic module under specified conditions to the theoretical maximum photoelectric conversion efficiency under standard conditions.

[0035] In this way, the use of photovoltaic encapsulation glue 300 for encapsulation can greatly improve the operating stability of photovoltaic modules under the conditions of 85°C temperature and 85% relative humidity, and increase the service life of photovoltaic modules in harsh environments, and reduce the reduction in photoelectric conversion efficiency, which can ensure that photovoltaic modules still operate efficiently. It can also enable photovoltaic modules to still operate efficiently under the condition of 500 hours of ultraviolet radiation with a wavelength of 365nm, and the reduction in the photoelectric conversion efficiency of photovoltaic modules is small, which improves the stability and service life of photovoltaic modules in harsh environments.

[0036] Preferably, methyl methacrylate, diester of hydrogen phosphate, and photoinitiator are stirred and mixed under light-protected conditions.

[0037] Thus, methyl methacrylate, diester hydrogen phosphate, and photoinitiator are stirred and mixed under light-proof conditions. When methyl methacrylate, diester hydrogen phosphate, and photoinitiator are stirred and mixed, if light is encountered, the photoinitiator will spontaneously decompose under light conditions to generate active free radicals, and undergo polymerization reaction with methyl methacrylate. The mixture of methyl methacrylate, diester hydrogen phosphate, and photoinitiator is light-cured in advance, resulting in failure of the photovoltaic encapsulation adhesive 300 to be applied, resulting in waste of materials.

[0038] Preferably, methyl methacrylate, diester of hydrogen phosphate, and photoinitiator are mixed and stirred for 8 hours under light-proof conditions.

[0039] In this way, methyl methacrylate, diester of hydrogen phosphate, and photoinitiator are stirred and mixed for 8 hours under light-proof conditions, so that materials such as methyl methacrylate, diester of hydrogen phosphate, and photoinitiator can be uniformly mixed. To ensure that the materials can fully contact and react, the reaction between materials such as methyl methacrylate, diester of hydrogen phosphate, and photoinitiator is more sufficient, reducing the possibility of insufficient reaction between the materials and causing the quality of the photovoltaic encapsulation adhesive 300 to be reduced, and improving the production quality of the photovoltaic encapsulation adhesive 300. And uniform mixing between the materials can reduce the possibility of local uncuring or local over-curing of the photovoltaic encapsulation adhesive 300 during photocuring. It can also reduce the generation of bubbles in the mixture of methyl methacrylate, diester of hydrogen phosphate, and photoinitiator during stirring, and improve the transparency and quality of the photovoltaic encapsulation adhesive 300 after curing.

[0040] Preferably, the mixture of methyl methacrylate, diester hydrogen phosphate, and photoinitiator is photocured under ultraviolet light. The selected photoinitiator is a substance that can react under ultraviolet light. After the mixture of methyl methacrylate, diester hydrogen phosphate, and photoinitiator is applied between the glass plate 200 and the solar cell, the photovoltaic component is placed under ultraviolet light for irradiation to photocure the photovoltaic encapsulant 300 to encapsulate the photovoltaic component.

[0041] Preferably, the wavelength of the ultraviolet light is configured between 350nm and 400nm. For example, the wavelength of the ultraviolet light can be configured at 360nm, 370nm, 380nm or 390nm, etc. The wavelength configuration of the ultraviolet light is not limited to this, and more preferably, the wavelength of the ultraviolet light is configured at 365nm. The photoinitiator mentioned in this article has the strongest absorption capacity for ultraviolet light when the wavelength of the ultraviolet light is 365nm. Therefore, when the ultraviolet light is preferably configured at 365nm, the curing rate of the photovoltaic encapsulation glue 300 can be increased, thereby improving the packaging efficiency of the photovoltaic module. Of course, the longer the wavelength of the ultraviolet light is set, the stronger the penetration of the ultraviolet light, and the more fully the photovoltaic encapsulation glue 300 can be cured, but it is easy to cause damage to other components of the photovoltaic module, reducing the production quality of the photovoltaic module.

[0042] Preferably, the irradiation time of the photovoltaic encapsulant 300 under ultraviolet rays is between 85s and 100s.

[0043] When the photovoltaic encapsulation glue 300 is light-cured, the photovoltaic encapsulation glue 300 is placed under ultraviolet light for 85s to 100s. Specifically, the photovoltaic encapsulation glue 300 can be placed under ultraviolet light for 85s, 88s, 91s, 95s, etc. Of course, the irradiation time is not limited to this. More preferably, the photovoltaic encapsulation glue 300 is placed under ultraviolet light for 90s. This irradiation time is determined according to the mass ratio of methyl methacrylate and hydrogen phosphate diester. When the mass ratio of methyl methacrylate to hydrogen phosphate diester is preferably configured to be 100: (6~8), the photovoltaic encapsulation glue 300 is placed under ultraviolet light for 90s, and the photovoltaic encapsulation glue 300 can be fully cured. If the irradiation time is shortened, the photovoltaic encapsulation glue 300 may reduce the packaging quality of the photovoltaic module due to incomplete curing, resulting in unstable structure of the photovoltaic module; if the irradiation time is extended, the photovoltaic encapsulation glue 300 has already been fully cured, and the packaging time of the photovoltaic module is extended, thereby reducing the packaging efficiency and production cost of the photovoltaic module.

[0044] Optionally, in one embodiment, the material of the photoinitiator is at least one of 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester, 2-hydroxy-2-methyl-1-phenylpropanone, and 1-hydroxycyclohexylphenylketone.

[0045] Thus, there are many choices for the material of the photoinitiator, such as 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester, 2-hydroxy-2-methyl-1-phenylpropanone, and 1-hydroxycyclohexylphenylketone. These photoinitiators can realize the photocuring of the photovoltaic encapsulation adhesive 300 under the irradiation of ultraviolet rays, and have the strongest absorption capacity for ultraviolet rays when the ultraviolet wavelength is 365nm.

[0046] Preferably, the photoinitiator is selected as ethyl 2,4,6-trimethylbenzoylphenylphosphonate, because ethyl 2,4,6-trimethylbenzoylphenylphosphonate can absorb ultraviolet rays and visible light. Compared with general photoinitiators, ethyl 2,4,6-trimethylbenzoylphenylphosphonate can be applied to different photocuring scenarios. Since ethyl 2,4,6-trimethylbenzoylphenylphosphonate itself is light yellow, the mass proportion of ethyl 2,4,6-trimethylbenzoylphenylphosphonate in the photovoltaic encapsulation adhesive 300 is configured between 2% and 4%, so that the photovoltaic encapsulation adhesive 300 is not easy to appear darker yellow due to the high content of ethyl 2,4,6-trimethylbenzoylphenylphosphonate, thereby reducing the light transmittance of the photovoltaic module and reducing the photoelectric conversion efficiency of the photovoltaic module.

[0047] Please refer to Figure 1 , Figure 1 The figure is a schematic flow chart of a photovoltaic module packaging method according to an embodiment of the present invention. According to an embodiment of the present invention, a photovoltaic module packaging method is provided, comprising the following steps: S1: Methyl methacrylate, diester of hydrogen phosphate, and ethyl 2,4,6-trimethylbenzoylphenylphosphonate are stirred and mixed in the dark to obtain a photovoltaic encapsulation adhesive; Specifically, methyl methacrylate and diester hydrogen phosphate are stirred and mixed in a mass ratio of 100: (6~8), and 2%~4% by mass of ethyl 2,4,6-trimethylbenzoylphenylphosphonate is added and stirred and mixed, and stirred for eight hours in a light-proof condition to obtain a photovoltaic encapsulation adhesive.

[0048] S2: A photovoltaic encapsulation adhesive is coated on one surface of each glass plate and degassing treatment is performed in a vacuum environment; Specifically, photovoltaic encapsulation glue is coated on the surface of each glass plate for attaching to the solar cell sheet, and the photovoltaic encapsulation glue is degassed in a vacuum environment to reduce bubbles in the photovoltaic encapsulation glue and make the surface of the photovoltaic encapsulation glue smoother.

[0049] S3: A glass plate is attached to the upper and lower ends of the solar cell, and the surface of the glass plate coated with photovoltaic encapsulation glue is brought into contact with the solar cell; Specifically, glass plates are attached to the upper and lower ends of the solar cell, and the photovoltaic encapsulation adhesive is bonded to the solar cell. The solar cell is placed from bottom to top, so that the glass plate, photovoltaic encapsulation adhesive, solar cell, photovoltaic encapsulation adhesive and glass plate are stacked.

[0050] S4: placing the glass plate and the solar cell under ultraviolet light to photo-cure the photovoltaic encapsulation adhesive and complete the encapsulation of the photovoltaic module.

[0051] Specifically, the stacked photovoltaic modules are placed under ultraviolet light with a wavelength of 365nm for irradiation, and the parts with photovoltaic encapsulation glue are fully irradiated for 90 seconds to fully photo-cure the photovoltaic encapsulation glue to complete the packaging of the photovoltaic modules.

[0052] See also Figure 2 The embodiment of the present invention further provides a photovoltaic module, which includes a solar cell 100, a glass plate 200, and the aforementioned photovoltaic encapsulation glue 300. A glass plate 200 is provided at the upper end and the lower end of the solar cell 100. The photovoltaic encapsulation glue 300 is coated between the glass plate 200 and the solar cell 100, and is light-cured to connect the glass plate 200 and the solar cell 100. The specific content of the photovoltaic encapsulation glue 300 refers to the above embodiment. Since the photovoltaic module adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0053] Optionally, in one embodiment, the surface of each glass plate 200 facing the solar cell 100 is coated with photovoltaic encapsulation adhesive 300 and subjected to degassing treatment in a vacuum environment.

[0054] In this way, after the photovoltaic encapsulant 300 is applied on the glass plate 200, it is placed in a vacuum environment for degassing treatment under light-proof conditions to reduce the generation of bubbles in the photovoltaic encapsulant 300 on the glass plate 200. If bubbles are generated in the photovoltaic encapsulant 300, the bubbles will dissipate the heat of the light irradiated on the photovoltaic encapsulant 300, thereby reducing the light transmittance of the photovoltaic encapsulant 300, and then reducing the overall light transmittance of the photovoltaic module, and reducing the overall photoelectric conversion efficiency of the photovoltaic module. Therefore, the glass plate 200 coated with the photovoltaic encapsulant 300 is placed in a vacuum environment for degassing treatment to reduce the generation of bubbles in the photovoltaic encapsulant 300, which can improve the light transmittance of the photovoltaic encapsulant 300, and then improve the overall photoelectric conversion efficiency of the photovoltaic module.

[0055] It is understandable that those skilled in the art can, under the guidance of the above embodiments, combine various implementation methods in the above embodiments to obtain technical solutions of multiple implementation methods.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A photovoltaic encapsulation adhesive, characterized in that: include: Methyl methacrylate; Dihydrogen phosphate is mixed with the methyl methacrylate, and the mass ratio of the methyl methacrylate to the dihydrogen phosphate is 100: (3-9); The photoinitiator accounts for 2% to 4% by weight of the photovoltaic encapsulation adhesive.

2. The photovoltaic encapsulation adhesive according to claim 1, characterized in that: The methyl methacrylate, the diester of hydrogen phosphate, and the photoinitiator are stirred and mixed under light-proof conditions.

3. The photovoltaic encapsulation adhesive according to claim 2, characterized in that: Under the light-proof condition, the methyl methacrylate, the diester of hydrogen phosphate, and the photoinitiator are mixed and stirred for 8 hours.

4. The photovoltaic encapsulation adhesive according to claim 1, characterized in that: The mixture of the methyl methacrylate, the diester of hydrogen phosphate, and the photoinitiator is photocured under ultraviolet irradiation.

5. The photovoltaic encapsulation adhesive according to claim 4, characterized in that: The wavelength of the ultraviolet rays is configured between 350nm and 400nm.

6. The photovoltaic encapsulation adhesive according to claim 5, characterized in that: The irradiation time of the photovoltaic encapsulation adhesive under the ultraviolet light is between 85s and 100s.

7. The photovoltaic encapsulation adhesive according to claim 1, characterized in that: The material configuration of the photoinitiator is at least one of 2,4,6-trimethylbenzoylphenylphosphonic acid ethyl ester, 2-hydroxy-2-methyl-1-phenylpropanone, and 1-hydroxycyclohexylphenylketone.

8. A photovoltaic module packaging method, characterized in that: The photovoltaic encapsulation adhesive according to any one of claims 1 to 7 comprises the following steps: Methyl methacrylate, diester hydrogen phosphate, and ethyl 2,4,6-trimethylbenzoylphenylphosphonate are stirred and mixed in the dark to obtain a photovoltaic encapsulation adhesive; Photovoltaic encapsulation glue is coated on one surface of each glass plate and degassing treatment is performed in a vacuum environment; A glass plate is attached to both the upper and lower ends of the solar cell, and the surface of the glass plate coated with photovoltaic encapsulation glue is brought into contact with the solar cell; The glass plate and solar cell are placed under ultraviolet light to photo-cure the photovoltaic encapsulation adhesive and complete the encapsulation of the photovoltaic module.

9. A photovoltaic module, using the packaging method of claim 8, characterized in that: include: Solar cells; A glass plate, wherein a glass plate is provided at the upper end and the lower end of the solar cell; The photovoltaic encapsulation adhesive according to any one of claims 1 to 7 is applied between the glass plate and the solar cell and is photocured to connect the glass plate and the solar cell.

10. The photovoltaic module according to claim 9, characterized in that: The surface of each glass plate facing the solar cell is coated with the photovoltaic encapsulation adhesive and is degassed in a vacuum environment.

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