Evaporation device and evaporation system

Abstract

The invention provides an evaporation device and an evaporation system, and relates to the technical field of display. The evaporation device comprises a crucible body, a first limiting plate, a second limiting plate and an adjusting mechanism. The crucible body is provided with an evaporation cavity and an evaporation opening communicating the evaporation cavity with the outside, and an evaporation source is arranged in the evaporation cavity. The first limiting plate is arranged between the evaporation source and the evaporation opening, and the first limiting plate is provided with a through first evaporation hole; the second limiting plate is arranged between the evaporation source and the evaporation opening, and the second limiting plate is provided with a second through evaporation hole. The first limiting plate and the second limiting plate are arranged in a stacked mode in the depth direction of the evaporation cavity, the first evaporation holes and the second evaporation holes are overlapped to form an evaporation channel, and the evaporation channel communicates with the evaporation source and the evaporation opening. The adjusting mechanism is in transmission connection with the second limiting plate and used for enabling the second limiting plate to be arranged in a sliding mode relative to the first limiting plate so as to change the overlapping area of the first evaporation holes and the second evaporation holes. According to the evaporation device, the evaporation rates of different areas can be adjusted.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to an evaporation device and an evaporation system. Background Art

[0002] In the manufacturing process of display panels, material evaporation is a core process. Evaporation refers to the process of heating the film-forming material to evaporate or sublimate it in a vacuum environment, and then condensing or depositing it on the surface of the substrate to form a film layer. In the current evaporation process, when the evaporation material leaves the evaporation chamber from the evaporation port, the evaporation rate in each area is uneven, which affects the utilization rate of the evaporation material and the evaporation effect.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0004] The purpose of the present disclosure is to overcome the above-mentioned deficiencies of the prior art and to provide an evaporation device and an evaporation system, which can adjust the evaporation rates of different areas when the evaporation material leaves the evaporation chamber from the evaporation port.

[0005] According to one aspect of the present disclosure, there is provided an evaporation device, comprising:

[0006] The crucible body has an evaporation chamber and an evaporation port connecting the evaporation chamber with the outside, wherein an evaporation source is arranged in the evaporation chamber;

[0007] A first limiting plate, disposed between the evaporation source and the evaporation port, the first limiting plate having a through first evaporation hole;

[0008] a second limiting plate, disposed between the evaporation source and the evaporation port, the second limiting plate having a through second evaporation hole; the first limiting plate and the second limiting plate are stacked in a depth direction of the evaporation chamber, the first evaporation hole and the second evaporation hole overlap to form an evaporation channel, the evaporation channel connects the evaporation source and the evaporation port;

[0009] The adjusting mechanism is drivingly connected to the second limiting plate and is used to enable the second limiting plate to be slidably arranged relative to the first limiting plate to change the overlapping area of ​​the first evaporation hole and the second evaporation hole.

[0010] In an exemplary embodiment of the present disclosure, the evaporation source includes a source container and a heater. The source container is arranged in the evaporation chamber and is used to hold the evaporation material. The heater is arranged on the periphery of the source container and is used to heat to vaporize the evaporation material. The evaporation device includes a plurality of nozzles arranged along a first direction, and the nozzles are connected to the evaporation port so that the gaseous evaporation material can be discharged from the nozzles. The first direction is perpendicular to the depth direction of the evaporation chamber.

[0011] In an exemplary embodiment of the present disclosure, the heater includes a heating base plate, which is arranged on a side of the source container away from the evaporation port, and the heating base plate has a first heating zone and a second heating zone along the first direction, the first heating zone is provided with a first heating element, and the second heating zone is provided with a second heating element.

[0012] In an exemplary embodiment of the present disclosure, a plurality of evaporation sources arranged along the first direction are provided in the evaporation chamber, and the source containers of the evaporation sources are not connected; the evaporation sources at least include a first evaporation source located in the first heating zone, a second evaporation source located in the second heating zone, and a third evaporation source located between the first evaporation source and the second evaporation source;

[0013] The nozzles at least include a first nozzle, a second nozzle and a third nozzle, wherein the orthographic projection of the first nozzle on the heating base plate is located within the first evaporation source, the orthographic projection of the second nozzle on the heating base plate is located within the second evaporation source, and the orthographic projection of the third nozzle on the heating base plate is located within the third evaporation source; wherein the number of the first nozzles is greater than the number of the third nozzles, and the number of the second nozzles is greater than the number of the third nozzles.

[0014] In an exemplary embodiment of the present disclosure, the evaporation device further includes a plating rate monitoring mechanism, and the plating rate monitoring mechanism is used to monitor the evaporation rate v1 of the first nozzle and the evaporation rate v2 of the second nozzle;

[0015] The plating rate monitoring mechanism is used to control the second heating element to increase its temperature relative to the first heating element when v1>v2; the plating rate monitoring mechanism is used to control the second heating element to decrease its temperature relative to the first heating element when v1<v2.

[0016] In an exemplary embodiment of the present disclosure, the evaporation device includes a weight monitoring mechanism, which includes a first pressure sensor and a second pressure sensor, the first pressure sensor is arranged in the first heating zone, and the second pressure sensor is arranged in the second heating zone, and the weight monitoring mechanism is used to obtain the weight difference t of the evaporation material in the source container located in the first heating zone and the second heating zone. When t>0, the weight of the evaporation material in the source container in the first heating zone is greater than that in the second heating zone; when t<0, the weight of the evaporation material in the source container in the second heating zone is greater than that in the first heating zone.

[0017] In an exemplary embodiment of the present disclosure, the adjustment mechanism is signal-connected to the weight monitoring mechanism;

[0018] The first limit plate is arranged on a side of the second limit plate away from the evaporation port, and the adjustment mechanism is used to drive the second limit plate to move toward the second heating zone when t>0, and the adjustment mechanism is used to drive the second limit plate to move toward the first heating zone when t<0;

[0019] Alternatively, the first limit plate is arranged on the side of the second limit plate close to the evaporation port, and the adjusting mechanism is used to drive the second limit plate to move toward the direction close to the first heating zone when t>0, and the adjusting mechanism is used to drive the second limit plate to move toward the direction close to the second heating zone when t<0.

[0020] In an exemplary embodiment of the present disclosure, the adjustment mechanism includes a transmission rod, the axis of which is arranged along the first direction, one end of the transmission rod abuts against the second limiting plate, and the other end of the transmission rod passes through the crucible body.

[0021] In an exemplary embodiment of the present disclosure, the adjustment mechanism also includes a driving motor, the transmission rod is threadedly connected to the crucible body, and a swing arm is provided at one end of the transmission rod that passes through the crucible body. The driving motor is used to drive the swing arm to swing back and forth so that the transmission rod pushes the second limit plate to slide along the first direction.

[0022] In an exemplary embodiment of the present disclosure, the adjustment mechanisms are provided in pairs at opposite ends of the second limit plate along the first direction, and the adjustment mechanism on either side is used to push the second limit plate to slide toward the opposite side.

[0023] In an exemplary embodiment of the present disclosure, the heater includes a heating top plate, and the heating top plate is located on a side of the first limiting plate away from the source container and on a side of the second limiting plate away from the source container.

[0024] According to one aspect of the present disclosure, a vapor deposition system is provided, comprising any one of the vapor deposition devices described above.

[0025] The evaporation device and evaporation system disclosed in the present invention can make the second limit plate slide relative to the first limit plate through an adjustment mechanism to change the overlapping area of ​​the first evaporation hole and the second evaporation hole. The side wall of the evaporation channel is composed of the inner hole wall of the overlapping part of the first evaporation hole and the second evaporation hole. Therefore, the change of the overlapping area of ​​the first evaporation hole and the second evaporation hole makes the side wall of the evaporation channel have an inclination angle, so that the gaseous evaporation material is ejected from the evaporation port toward a specific angle. The evaporation rate of the area in the inclined direction of the evaporation channel is increased, and the evaporation rate of the area in the opposite direction is reduced, thereby realizing the adjustment of the evaporation rate of different areas.

[0026] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0028] Figure 1 It is a schematic diagram of an embodiment of the evaporation device disclosed in the present invention.

[0029] Figure 2 It is a schematic diagram of a first evaporation hole and a second evaporation hole of an embodiment of the evaporation device disclosed in the present invention.

[0030] Figure 3 It is a schematic diagram of a first evaporation hole and a second evaporation hole of an embodiment of the evaporation device disclosed in the present invention.

[0031] Figure 4 This is a schematic diagram of a first limiting plate of an embodiment of the evaporation device disclosed herein.

[0032] Figure 5 Schematic diagram of a second limiting plate of an embodiment of the evaporation device disclosed herein.

[0033] Figure 6 This is a schematic diagram of the movement of the second limiting plate relative to the first limiting plate in one embodiment of the evaporation device disclosed herein.

[0034] Figure 7 It is a schematic diagram of a plating rate monitoring mechanism and a weight monitoring mechanism of an embodiment of the evaporation device disclosed in the present invention.

[0035] 1. Crucible body; 2. First limiting plate; 201. First evaporation hole; 3. Second limiting plate; 301. Second evaporation hole; 41. First evaporation source; 42. Second evaporation source; 43. Third evaporation source; 51. First nozzle; 52. Second nozzle; 53. Third nozzle; 61. First plating rate monitor; 62. Second plating rate monitor; 71. First pressure sensor; 72. Second pressure sensor. DETAILED DESCRIPTION

[0036] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0037] Although overlapping terms such as "upper", "lower", "top", and "bottom" are used in this specification to describe the overlapping relationship of one component of the icon to another component, these terms are used in this specification only for convenience, such as according to the direction of the examples described in the drawings. It is understood that if the device of the icon is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that a certain structure is formed integrally on the other structure, or that a certain structure is "directly" arranged on the other structure, or that a certain structure is "indirectly" arranged on the other structure through another structure. The "signal connection" described in the present disclosure can be a wired communication connection or a wireless communication connection, and can be direct communication or indirect signal connectivity through an intermediate medium.

[0038] The terms "a", "an", "the", "said" and "at least" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first" and "second" are used merely as labels and are not intended to limit the quantity of their objects.

[0039] It should be noted that the first direction herein is a direction perpendicular to the depth direction of the evaporation chamber, that is, a direction perpendicular to the thickness direction of the first limiting plate 2 and the second limiting plate 3. The first direction herein does not have a specific orientation. For example, the first heating zone and the second heating zone are arranged along the first direction, which is equivalent to the second heating zone and the first heating zone being arranged along the first direction. In addition, due to the upper limit of the precision of the manufacturing, assembly, and measurement processes, the verticality described in the present disclosure may not actually be 90° without error. For example, two mutually perpendicular parts may also form an angle of 85° or 95°. As long as they are within the error range allowed by the manufacturing precision, they should be regarded as mutually perpendicular. Therefore, it can be further explained that the concepts of plane, parallelism, symmetry, etc. mentioned in the present disclosure are all within the range allowed by the process precision.

[0040] The "overlap" of feature A and feature B herein means that the orthographic projection of feature A on a plane and the orthographic projection of feature B on the plane at least partially overlap; the plane may be the bottom wall of the crucible body 1, the heating bottom plate, the surface of the substrate to be evaporated, etc. For example, the first evaporation hole 201 overlaps with the second evaporation hole 301, which means that the first evaporation hole 201 and the second evaporation hole 301 at least partially overlap in the depth direction of the evaporation chamber to form an evaporation channel connecting the evaporation source and the evaporation port.

[0041] In display panels, material evaporation is a core process. For example, the organic layer of a display panel is usually made by evaporation. The evaporation process refers to a process in which the evaporation material is heated and evaporated or sublimated in a vacuum environment, and the gaseous evaporation material is ejected from the evaporation port and finally deposited on a substrate at a lower temperature to form a continuous film layer.

[0042] In the related art, due to the power of the heater, the setting position deviation and other reasons, the evaporation material is vaporized by heat. When it leaves the evaporation chamber from the evaporation port and is deposited on the substrate, there is a problem of uneven evaporation rate in different areas, which affects the utilization rate of the evaporation material and the evaporation effect.

[0043] In view of the above technical problems, the present disclosure provides a vapor deposition device, referring to Figure 1As shown, it includes a crucible body 1, a first limiting plate 2, a second limiting plate 3 and an adjusting mechanism. The crucible body 1 has an evaporation chamber and an evaporation port connecting the evaporation chamber with the outside, and an evaporation source is arranged in the evaporation chamber. The first limiting plate 2 is arranged between the evaporation source and the evaporation port, and the first limiting plate 2 has a through first evaporation hole 201; the second limiting plate 3 is arranged between the evaporation source and the evaporation port, and the second limiting plate 3 has a through second evaporation hole 301. The first limiting plate 2 and the second limiting plate 3 are stacked in the depth direction of the evaporation chamber, and the first evaporation hole 201 overlaps with the second evaporation hole 301 to form an evaporation channel, and the evaporation channel connects the evaporation source and the evaporation port. The adjusting mechanism is transmission-connected to the second limiting plate 3, and is used to make the second limiting plate 3 slidably arranged relative to the first limiting plate 2 to change the overlapping area of ​​the first evaporation hole 201 and the second evaporation hole 301.

[0044] During the evaporation process, the evaporation material is vaporized, passes through the evaporation channel, and then is ejected from the evaporation port. The second limiting plate 3 can be slid relative to the first limiting plate 2 by an adjustment mechanism to change the overlapping area of ​​the first evaporation hole 201 and the second evaporation hole 301. The side wall of the evaporation channel is composed of the inner hole wall of the overlapping part of the first evaporation hole 201 and the second evaporation hole 301. Therefore, the change in the overlapping area of ​​the first evaporation hole 201 and the second evaporation hole 301 makes the side wall of the evaporation channel have an inclination angle, so that the gaseous evaporation material is ejected from the evaporation port at a specific angle. The evaporation rate in the area in the inclined direction of the evaporation channel is increased, and the evaporation rate in the opposite direction is decreased, thereby realizing the adjustment of the evaporation rate in different areas.

[0045] For example, refer to Figure 2 As shown, the first limiting plate 2 is arranged on the side of the second limiting plate 3 away from the evaporation port, that is, the first limiting plate 2 is arranged below the second limiting plate 3. When the second limiting plate 3 moves to the left in the figure, the second evaporation hole 301 is offset to the left relative to the first evaporation hole 201, so that the side wall of the evaporation channel is tilted to the left, and the evaporation rate of the left area is improved; when the second limiting plate 3 moves to the right, the second evaporation hole 301 is offset to the right relative to the first evaporation hole 201, so that the side wall of the evaporation channel is tilted to the right, and the evaporation rate of the right area is improved. Figure 2 The dot-dash arrows in the figure show the flow direction of the gaseous evaporation material when the side wall of the evaporation channel is tilted to the left.

[0046] For example, refer to Figure 3As shown, the first limiting plate 2 is arranged on the side of the second limiting plate 3 close to the evaporation port, that is, the first limiting plate 2 is arranged above the second limiting plate 3. When the second limiting plate 3 moves to the left as shown in the figure, the second evaporation hole 301 is offset to the left relative to the first evaporation hole 201, so that the side wall of the evaporation channel is tilted to the right, and the evaporation rate of the right area is improved; when the second limiting plate 3 moves to the right, the second evaporation hole 301 is offset to the right relative to the first evaporation hole 201, so that the side wall of the evaporation channel is tilted to the left, and the evaporation rate of the left area is improved. Figure 3 The dot-dash arrows in the figure show the flow direction of the gaseous evaporation material when the side wall of the evaporation channel is tilted to the right.

[0047] It should be noted that the transmission connection between the adjustment mechanism and the second limit plate 3 described in the present disclosure means that the adjustment mechanism and the second limit plate 3 can transmit power unidirectionally or bidirectionally under certain circumstances, for example, the adjustment mechanism can drive the second limit plate 3 to move in a specific position, or the second limit plate 3 can drive the adjustment mechanism to move in a specific position, but it does not mean that the two must be connected in contact. For example, the adjustment mechanism can contact or disengage from the second limit plate 3. When the adjustment mechanism contacts the second limit plate 3, the adjustment mechanism can push the second limit plate 3 to move; when the adjustment mechanism disengages from the second limit plate 3, the adjustment mechanism does not drive the second limit plate 3 to move when it moves.

[0048] Specifically, refer to Figure 4 The schematic diagram of the first limiting plate 2 is shown in FIG. Figure 5 The schematic diagram of the second limiting plate 3 is shown, the first limiting plate 2 may have a plurality of first evaporation holes 201, the second limiting plate 3 may have a plurality of second evaporation holes 301, the first evaporation holes 201 may be arranged in an array in two directions perpendicular to the thickness direction of the first limiting plate 2, the first evaporation holes 201 may be arranged equidistantly or unequally. The second evaporation holes 301 may correspond one-to-one with the first evaporation holes 201 to form each evaporation channel.

[0049] Exemplarily, the first evaporation hole 201 and the second evaporation hole 301 may have the same shape and size. For example, the first evaporation hole 201 and the second evaporation hole 301 are both circular. The array spacing of the first evaporation hole 201 and the second evaporation hole 301 may also be equal, so that when the second limiting plate 3 moves relative to the first limiting plate 2, the shapes of the evaporation channels are the same. The schematic diagram of the movement of the second limiting plate 3 relative to the first limiting plate 2 can refer to Figure 6 shown.

[0050] Exemplarily, the shapes and sizes of the first evaporation hole 201 and the second evaporation hole 301 may be different. For example, the first evaporation hole 201 may be a circular hole, the second evaporation hole 301 may be a square hole, or the first evaporation hole 201 and the second evaporation hole 301 may both be polygonal holes, making the shape of the evaporation channel more complex.

[0051] The evaporation source may include a source container and a heater, the source container is arranged in the evaporation chamber for containing the evaporation material, and the heater is arranged on the periphery of the source container for heating to vaporize the evaporation material. The evaporation material may be solid, and the heater heats the evaporation material to make it sublime, or the evaporation material may be liquid, and the heater heats the evaporation material to make it evaporate. For example, the heater may include a heating base plate, the heating base plate is arranged on the side of the source container away from the evaporation port, the heating base plate has a first heating zone and a second heating zone along a first direction, the first heating zone is provided with a first heating element, and the second heating zone is provided with a second heating element. In addition, the heater may also include a heating side plate, and the heating side plate may be arranged around the side wall of the source container perpendicular to the heating base plate. The heating base plate can heat the evaporation material at the bottom of the source container, and the heating side plate can heat the evaporation material at the side of the source container, so that the evaporation material is heated evenly and the evaporation efficiency is high.

[0052] In an exemplary embodiment of the present disclosure, the heater may further include a heating top plate, which is located on a side of the first limiting plate 2 away from the source container, and on a side of the second limiting plate 3 away from the source container. That is, the heating top plate is located above the limiting plate disposed at the top of the first limiting plate 2 and the second limiting plate 3. For example, if the first limiting plate 2 is disposed above the second limiting plate 3, the heating top plate is located above the first limiting plate 2; for example, if the second limiting plate 3 is disposed above the first limiting plate 2, the heating top plate is located above the second limiting plate 3. The heating top plate can maintain the temperature of the gaseous evaporation material so that it still has good fluidity when leaving the evaporation port, and the heating top plate can heat the first limiting plate 2 and the second limiting plate 3 to prevent the gaseous evaporation material from being deposited at the first limiting plate 2 and the second limiting plate 3.

[0053] For example, refer to Figure 1 As shown, a plurality of evaporation sources are provided in the evaporation chamber, and the source containers of the evaporation sources are not connected. The evaporation source may include a first evaporation source 41 located in the first heating zone, a second evaporation source 42 located in the second heating zone, and a third evaporation source 43 located between the first evaporation source 41 and the second evaporation source 42. Exemplarily, the first evaporation source 41, the third evaporation source 43 and the second evaporation source 42 are arranged in sequence along the first direction. A heating side plate may be provided on the periphery of the source container of each evaporation source, and each evaporation source may share the same heating top plate. In other embodiments, fewer evaporation sources may be provided in the evaporation chamber, for example, one or two evaporation sources are provided; more evaporation sources may also be provided in the evaporation chamber.

[0054] Exemplarily, the orthographic projection of the first evaporation source 41 on the heating base plate is within the range of the first heating element, the orthographic projection of the second evaporation source 42 on the heating base plate is within the range of the second heating element, the side of the third evaporation source 43 close to the first evaporation source 41 is within the range of the first heating element, and the side of the third evaporation source 43 close to the second evaporation source 42 is within the range of the second heating element. During the evaporation process, the first heating element and the second heating element can be heated and temperature-controlled independently to achieve different heating effects on the first evaporation source 41, the second evaporation source 42, and the third evaporation source 43, and achieve different evaporation rates in different areas of the evaporation ports corresponding to the first evaporation source 41, the second evaporation source 42, and the third evaporation source 43.

[0055] In an exemplary embodiment of the present disclosure, the evaporation device may include a plurality of nozzles, and the nozzles are connected to the evaporation port so that the gaseous evaporation material is discharged from the nozzles. For example, the evaporation source may be a point source evaporation structure or a line source evaporation structure, and the nozzle may be a slit structure or a hole structure. Exemplarily, the plurality of nozzles are arranged in an array along the first direction.

[0056] In an exemplary embodiment of the present disclosure, reference Figure 1 As shown, the nozzles at least include a first nozzle 51, a second nozzle 52 and a third nozzle 53. The orthographic projection of the first nozzle 51 on the heating base plate is located in the first evaporation source 41, the orthographic projection of the second nozzle 52 on the heating base plate is located in the second evaporation source 42, and the orthographic projection of the third nozzle 53 on the heating base plate is located in the third evaporation source 43. When the axes of the first evaporation hole 201 and the second evaporation hole 301 coincide, the evaporation channel is connected in the vertical direction. In the absence of interference from other factors, the evaporation material in the first evaporation source 41 is mainly ejected from the first nozzle 51, the evaporation material in the second evaporation source 42 is mainly ejected from the second nozzle 52, and the evaporation material in the third evaporation source 43 is mainly ejected from the third nozzle 53. In addition, the vaporized evaporation materials in the evaporation sources can be mixed below the nozzles. Therefore, part of the evaporation materials in the first evaporation source 41 and the second evaporation source 42 may also be ejected from the third nozzle 53, and part of the evaporation materials in the third evaporation source 43 may also be ejected from the first nozzle 51 and the second nozzle 52.

[0057] When the second limiting plate 3 is translated relative to the first limiting plate 2 under the action of the adjustment mechanism, the axes of the first evaporation hole 201 and the second evaporation hole 301 are staggered, and the evaporation channel has an inclination angle in the vertical direction, so that the amount of evaporation material gas entering each nozzle is affected. For example, with reference to the description of the aforementioned embodiment, when the side wall of the evaporation channel is inclined toward the first nozzle 51 / first evaporation source 41 (to the left in the figure), the portion of the evaporation material in the third evaporation source 43 that enters the first nozzle 51 increases, and the portion of the evaporation material in the second evaporation source 42 that enters the third nozzle 53 increases. When the side wall of the evaporation channel is inclined toward the second nozzle 52 / second evaporation source 42 (to the right in the figure), the portion of the evaporation material in the third evaporation source 43 that enters the second nozzle 52 increases, and the portion of the evaporation material in the first evaporation source 41 that enters the third nozzle 53 increases.

[0058] In an exemplary embodiment of the present disclosure, the number of the first nozzles 51 is greater than the number of the third nozzles 53, and the number of the second nozzles 52 is greater than the number of the third nozzles 53. Exemplarily, the number of the first nozzles 51 may be equal to the number of the second nozzles 52. Exemplarily, the nozzles may be symmetrical with respect to the central axis of the evaporation chamber in the first direction.

[0059] In an exemplary embodiment of the present disclosure, the evaporation device further includes a plating rate monitoring mechanism, which can monitor the plating rate of a specific area. For example, the plating rate monitoring mechanism can include a first plating rate monitor 61 and a second plating rate monitor 62. Figure 7 As shown, the first plating rate monitor 61 and the second plating rate monitor 62 are both disposed outside the evaporation port, and the first plating rate monitor 61 and the second plating rate monitor 62 can be disposed on opposite sides of the first direction of the evaporation port (left and right sides in the figure). Exemplarily, the first plating rate monitor 61 can be used to monitor the evaporation rate v1 of the first nozzle 51, and the second plating rate monitor 62 can be used to monitor the evaporation rate v2 of the second nozzle 52.

[0060] In other embodiments, more monitors may be used to monitor the evaporation rate v1 of the plurality of first nozzles 51 and the evaporation rate v2 of the second nozzles 52. For example, the first plating rate monitor 61 and the second plating rate monitor 62 may detect the plating rate, for example, the plating rate may be calculated by the evaporation state of the evaporation material deposited on its surface. In other embodiments, the plating rate may also be calculated by other methods in the prior art, which will not be described in detail in this disclosure.

[0061] Exemplarily, the plating rate monitoring mechanism is connected to the first heating element and the second heating element by signal. When v1>v2, the plating rate monitoring mechanism can control the second heating element to increase the temperature relative to the first heating element; when v1<v2, the plating rate monitoring mechanism can control the second heating element to decrease the temperature relative to the first heating element. The feedback adjustment mechanism between the plating rate monitoring mechanism and the first heating element and the second heating element is conducive to making the evaporation rate of the evaporation device uniform.

[0062] When the plating rate monitoring mechanism detects that the evaporation rate v1 of the first nozzle 51 is high, the second heating element can be heated relative to the first heating element. Specifically, the second heating element is heated, or the first heating element is cooled, or the first heating element is cooled while the second heating element is heated, so that the evaporation rate of the area corresponding to the second heating element, such as the second evaporation source 42 and the side of the third evaporation source 43 close to the second evaporation source 42, is relatively increased.

[0063] Similarly, when the plating rate monitoring mechanism detects that the evaporation rate of the second nozzle 52 is high, the second heating element can be cooled relative to the first heating element (the first heating element can be heated relative to the second heating element). Specifically, the second heating element can be cooled, or the first heating element can be heated, or the first heating element can be heated while the second heating element is cooled, so that the evaporation rate of the area corresponding to the first heating element, such as the first evaporation source 41 and the side of the third evaporation source 43 close to the first evaporation source 41, is relatively increased.

[0064] In an exemplary embodiment of the present disclosure, the evaporation device may further include a weight monitoring mechanism for obtaining a weight difference t between the evaporation material in the source container located in the first heating zone and the source container located in the second heating zone. Figure 7 As shown, the weight monitoring mechanism may include a first pressure sensor 71 and a second pressure sensor 72, wherein the first pressure sensor 71 is disposed in the first heating zone, and the second pressure sensor 72 is disposed in the second heating zone. The first pressure sensor 71 and the second pressure sensor 72 may be symmetrically disposed relative to the central axis of the evaporation chamber in the first direction. By comparing the first pressure sensor 71 with the second pressure sensor 72, the weight difference t of the evaporation materials on both sides of the evaporation chamber may be obtained, and the direction in which the weight of the evaporation chamber is tilted may be determined, and the relationship between the consumption of the evaporation materials in the first heating zone and the second heating zone may also be determined.

[0065] Exemplarily, the first pressure sensor 71 can be used to obtain the weight m1 of the evaporation material in the source container located in the first heating zone, and the second pressure sensor 72 can be used to obtain the weight m2 of the evaporation material in the source container located in the second heating zone, t=m1-m2.

[0066] For example, due to the power of the heater, the deviation of the setting position, the number and position of the nozzles, etc., the consumption speed of the evaporation materials in the first evaporation source 41, the second evaporation source 42 and the third evaporation source 43 may not be equal. Therefore, the exhaustion time of the evaporation materials in each source container is also different. When the evaporation materials in a source container are exhausted in advance, the evaporation process stops, which affects the utilization rate of the evaporation materials.

[0067] For another example, when the evaporation material is a solid material (sublimable material), its physical properties cause the evaporation material to be unable to flow levelly in the source container. Regardless of whether it is for each independent evaporation source or within a single evaporation source, the consumption of the evaporation material corresponding to different heating zones may be different.

[0068] By obtaining the relationship between the consumption amounts of the evaporation materials corresponding to different heating zones through the weight monitoring mechanism, the consumption of the evaporation materials can be understood, and balanced by timely replenishing the evaporation materials or adjusting the power of the heater, which is conducive to exhausting the evaporation materials in various locations in the evaporation device at the same time.

[0069] In an exemplary embodiment of the present disclosure, the adjusting mechanism is signal-connected to the weight monitoring mechanism, and the adjusting mechanism can adjust the relative position relationship between the second limiting plate 3 and the first limiting plate 2 through feedback from the weight monitoring mechanism.

[0070] Specifically, when t>0, m1>m2, the remaining amount of the evaporation material in the source container corresponding to the first heating zone is greater than that in the second heating zone, and the adjustment mechanism can drive the second limiting plate 3 to tilt the side wall of the evaporation channel toward the second nozzle 52 / the second evaporation source 42 (to the right in the figure), so that the evaporation rate of the second nozzle 52 is increased, and under the feedback adjustment of the plating rate monitoring mechanism and the heater, the second heating element is cooled relative to the first heating element (the first heating element is heated relative to the second heating element), so that the consumption rate of the evaporation material in the source container corresponding to the first heating zone is increased, which is conducive to the simultaneous exhaustion of the evaporation material corresponding to the second heating zone.

[0071] With reference to the description of the foregoing embodiment, the side wall of the evaporation channel is inclined toward the second nozzle 52 / second evaporation source 42 (to the right in the figure), that is, when the first limit plate 2 is arranged on the side of the second limit plate 3 away from the evaporation port, the second limit plate 3 moves toward the second heating zone; when the first limit plate 2 is arranged on the side of the second limit plate 3 close to the evaporation port, the second limit plate 3 moves toward the first heating zone.

[0072] When t<0, m1<m2, the remaining amount of evaporation material in the source container corresponding to the first heating zone is smaller than that in the second heating zone, and the adjustment mechanism can drive the second limiting plate 3 to tilt the side wall of the evaporation channel toward the first nozzle 51 / first evaporation source 41 (to the left in the figure), so that the evaporation rate of the first nozzle 51 is increased, and under the feedback adjustment of the plating rate monitoring mechanism and the heater, the second heating element is heated relative to the first heating element (the first heating element is cooled relative to the second heating element), so that the consumption rate of the evaporation material in the source container corresponding to the second heating zone is increased, which is conducive to the simultaneous exhaustion of the evaporation material corresponding to the first heating zone.

[0073] With reference to the description of the foregoing embodiment, the side wall of the evaporation channel is inclined toward the first nozzle 51 / first evaporation source 41 (to the left in the figure), that is, when the first limiting plate 2 is arranged on the side of the second limiting plate 3 away from the evaporation port, the second limiting plate 3 moves toward the direction close to the first heating zone; when the first limiting plate 2 is arranged on the side of the second limiting plate 3 close to the evaporation port, the second limiting plate 3 moves toward the direction close to the second heating zone.

[0074] In an exemplary embodiment of the present disclosure, the first limit plate 2 is detachably fixedly connected to the crucible body 1. For example, the first limit plate 2 is interference fit with the crucible body 1, or the first limit plate 2 is assembled in a structure such as a slide groove in the crucible body 1 to ensure that the first limit plate 2 does not move with the movement of the second limit plate 3 during the evaporation process. The first limit plate 2 is detachably connected to the crucible body 1 so that when the first limit plate 2 is damaged or deformed due to high temperature, or the first evaporation hole 201 is blocked due to adhesion of the evaporation material, the first limit plate 2 can be replaced, repaired and maintained.

[0075] In an exemplary embodiment of the present disclosure, the adjustment mechanism may include a transmission rod, the axis of which is arranged along the first direction, one end of the transmission rod abuts against the second limiting plate 3, and the other end of the transmission rod passes through the crucible body 1. Exemplarily, the transmission rod may be connected to the second limiting plate 3, and the second limiting plate 3 may be moved relative to the first limiting plate 2 by moving the transmission rod along the first direction.

[0076] In an exemplary embodiment of the present disclosure, the transmission rods are arranged in pairs at opposite ends of the second limit plate 3 along the first direction, and the transmission rod on either side is used to push the second limit plate 3 to slide to the opposite side. Specifically, the end of the transmission rod that abuts the second limit plate 3 may not be connected to the second limit plate 3, and the transmission rod on either side can push the second limit plate 3 to move in the same direction when moving to the opposite side, and when the transmission rod moves back to the direction away from the crucible body 1, no force in the same direction is applied to the second limit plate 3. In some application scenarios, the temperature inside the evaporation chamber is extremely high, and the end of the transmission rod that abuts the second limit plate 3 is not connected to the second limit plate 3, which is beneficial to prevent the connected part from being damaged at high temperature, resulting in failure of the adjustment mechanism.

[0077] In an exemplary embodiment of the present disclosure, the adjustment mechanism further includes a driving motor, and the transmission rod is threadedly connected to the crucible body 1. The driving motor drives the transmission rod to rotate, so that the transmission rod can push the second limiting plate 3 to slide along the first direction.

[0078] For example, a swing arm may be provided at one end of the transmission rod that passes through the crucible body 1, and the driving motor is used to drive the swing arm to swing back and forth, so that the transmission rod pushes the second limit plate 3 to slide along the first direction. The swing arm and the reciprocating swing described in the present disclosure refer to the driving motor driving the swing arm, thereby driving the transmission rod to rotate clockwise or counterclockwise within an angle of 360°. Specifically, the swing arm may be a hand wheel, an eccentric bolt or other structures, as long as it can be connected to the driving motor to drive the transmission rod to rotate synchronously.

[0079] Exemplarily, as described in the above embodiment, the adjustment mechanisms may be provided in pairs at opposite ends of the second limiting plate 3 along the first direction.

[0080] According to one aspect of the present disclosure, there is also provided an evaporation system, comprising an evaporation device as described in any one of the above. The evaporation system may further include a controller, which may be connected to the heater, the plating rate monitoring mechanism, the weight monitoring mechanism, etc. in the aforementioned example embodiments to realize communication, calculation, and feedback control functions. The evaporation system may further include a displacement device for driving the evaporation device to move as a whole to scan and form a film layer on the display panel. The evaporation system of the present disclosure may cause the second limiting plate 3 to slide relative to the first limiting plate 2 through an adjustment mechanism to change the overlapping area of ​​the first evaporation hole 201 and the second evaporation hole 301, so that the gaseous evaporation material is ejected from the evaporation port toward a specific angle, thereby realizing the adjustment of the evaporation rate in different areas.

[0081] It should be noted that since the evaporation system includes the evaporation device described above, and the structure and beneficial effects of the evaporation device have been explained in detail in the previous topic, the structure and beneficial effects of the evaporation device will not be repeated in this topic. You can refer to the above-mentioned specific explanation of the evaporation device, which is also within the scope of protection of the present disclosure.

[0082] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A vapor deposition device, characterized in that: include: The crucible body has an evaporation chamber and an evaporation port connecting the evaporation chamber with the outside, and an evaporation source is arranged in the evaporation chamber; A first limiting plate, disposed between the evaporation source and the evaporation port, the first limiting plate having a through first evaporation hole; a second limiting plate, disposed between the evaporation source and the evaporation port, the second limiting plate having a through second evaporation hole; the first limiting plate and the second limiting plate are stacked in a depth direction of the evaporation chamber, the first evaporation hole and the second evaporation hole overlap to form an evaporation channel, the evaporation channel connects the evaporation source and the evaporation port; The adjusting mechanism is drivingly connected to the second limiting plate and is used to enable the second limiting plate to be slidably arranged relative to the first limiting plate to change the overlapping area of ​​the first evaporation hole and the second evaporation hole.

2. The evaporation device according to claim 1, characterized in that: The evaporation source includes a source container and a heater. The source container is arranged in the evaporation chamber and is used to contain the evaporation material. The heater is arranged on the outer periphery of the source container and is used to heat to vaporize the evaporation material. The evaporation device includes a plurality of nozzles arranged along a first direction. The nozzles are connected to the evaporation port so that the gaseous evaporation material can be discharged from the nozzles. The first direction is perpendicular to the depth direction of the evaporation chamber.

3. The evaporation device according to claim 2, characterized in that: The heater comprises a heating base plate, which is arranged on a side of the source container away from the evaporation port. The heating base plate has a first heating zone and a second heating zone along the first direction. The first heating zone is provided with a first heating element, and the second heating zone is provided with a second heating element.

4. The evaporation device according to claim 3, characterized in that: The evaporation chamber is provided with a plurality of evaporation sources arranged along the first direction, and the source containers of the evaporation sources are not connected; the evaporation sources at least include a first evaporation source located in the first heating zone, a second evaporation source located in the second heating zone, and a third evaporation source located between the first evaporation source and the second evaporation source; The nozzles at least include a first nozzle, a second nozzle and a third nozzle, wherein the orthographic projection of the first nozzle on the heating base plate is located within the first evaporation source, the orthographic projection of the second nozzle on the heating base plate is located within the second evaporation source, and the orthographic projection of the third nozzle on the heating base plate is located within the third evaporation source; wherein the number of the first nozzles is greater than the number of the third nozzles, and the number of the second nozzles is greater than the number of the third nozzles.

5. The evaporation device according to claim 4, characterized in that: The evaporation device further includes a plating rate monitoring mechanism, wherein the plating rate monitoring mechanism is used to monitor the evaporation rate v1 of the first nozzle and the evaporation rate v2 of the second nozzle; The plating rate monitoring mechanism is used to control the second heating element to increase its temperature relative to the first heating element when v1>v2; the plating rate monitoring mechanism is used to control the second heating element to decrease its temperature relative to the first heating element when v1<v2.

6. The evaporation device according to claim 5, characterized in that: The evaporation device includes a weight monitoring mechanism, the weight monitoring mechanism includes a first pressure sensor and a second pressure sensor, the first pressure sensor is arranged in the first heating zone, the second pressure sensor is arranged in the second heating zone, the weight monitoring mechanism is used to obtain the weight difference t of the evaporation material in the source container located in the first heating zone and the second heating zone, when t>0, the weight of the evaporation material in the source container in the first heating zone is greater than that in the second heating zone; When t<0, the weight of the evaporation material in the source container of the second heating zone is greater than that of the first heating zone.

7. The evaporation device according to claim 6, characterized in that: The regulating mechanism is signal-connected to the weight monitoring mechanism; The first limit plate is arranged on a side of the second limit plate away from the evaporation port, and the adjustment mechanism is used to drive the second limit plate to move toward the second heating zone when t>0, and the adjustment mechanism is used to drive the second limit plate to move toward the first heating zone when t<0; Alternatively, the first limit plate is arranged on the side of the second limit plate close to the evaporation port, and the adjusting mechanism is used to drive the second limit plate to move toward the direction close to the first heating zone when t>0, and the adjusting mechanism is used to drive the second limit plate to move toward the direction close to the second heating zone when t<0.

8. The evaporation device according to any one of claims 2 to 7, characterized in that: The adjusting mechanism comprises a transmission rod, the axis of which is arranged along the first direction, one end of the transmission rod abuts against the second limit plate, and the other end of the transmission rod passes through the crucible body; the adjusting mechanism also comprises a driving motor, the transmission rod is threadedly connected to the crucible body, and a swing arm is provided at one end of the transmission rod passing through the crucible body, and the driving motor is used to drive the swing arm to swing back and forth so that the transmission rod pushes the second limit plate to slide along the first direction.

9. The evaporation device according to claim 2, characterized in that: The heater includes a heating top plate, and the heating top plate is located on a side of the first limiting plate away from the source container and is located on a side of the second limiting plate away from the source container.

10. A vapor deposition system, characterized in that: include: The evaporation device according to any one of claims 1 to 9.

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