Adjusting mechanism, semiconductor process apparatus

Abstract

The application provides a kind of adjusting mechanism, semiconductor process equipment, comprising: mounting flange, fixedly arranged in reaction chamber;Mobile flange, arranged on mounting flange and connected gas shower head;Locking member, connected with mounting flange and mobile flange, and can realize locking and unlocking between mounting flange and mobile flange;Adjusting member, movably connected with mounting flange and mobile flange, and position adjusting is carried out to mobile flange relative to mounting flange;Wherein, one of locking member and adjusting member is hollow structure, and is set on the outside of the other one.The adjusting mechanism described above is locked by locking member to gas shower head, avoids the distance and levelness of gas shower head and silicon wafer fluctuation, and the adjusting member and locking member set, can balance the stress of mobile flange and mounting flange to eliminate bending moment and avoid stress deformation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a regulating mechanism and a semiconductor process equipment. BACKGROUND

[0002] The gas shower head is a core component of a CVD (CVD, full name: Chemical Vapor Deposition) equipment and an ALD (ALD, full name: Atomic Layer Deposition) equipment, which is used to input process gas into a reaction chamber to form a thin film on a silicon wafer, and needs to maintain a constant gas flow field between the gas shower head and the silicon wafer during the thin film generation process. Precise control of the gas flow field requires accurate adjustment of the distance and levelness between the gas shower head and the silicon wafer.

[0003] At present, the regulating mechanism for adjusting the distance and levelness between the gas shower head and the silicon wafer is achieved by spring compression after the position and levelness of the gas shower head are adjusted (the silicon wafer is kept horizontal in the reaction chamber). Since the spring is prone to elastic deformation, when the vacuum degree of the reaction chamber changes, the gas shower head is also prone to overcome the compression force of the spring and cause fluctuations in the distance and levelness from the silicon wafer, affecting the film formation quality. In addition, the compression position of the spring on the adjusting component connected to the gas shower head is different from the support and adjustment position of the gas shower head, which will cause the adjusting component to deform due to uneven stress, affecting the control accuracy of the distance and levelness between the gas shower head and the silicon wafer. SUMMARY

[0004] Therefore, the present application provides a regulating mechanism which can improve the stability and force balance of the gas shower head, thereby improving the generation quality of the thin film. In addition, the present application also provides a semiconductor process equipment with the above regulating mechanism.

[0005] In order to achieve the above purpose, the present application provides the following technical solutions:

[0006] A regulating mechanism for installing a gas shower head in a reaction chamber and adjusting the position of the gas shower head, comprising:

[0007] A mounting flange fixedly arranged in the reaction chamber;

[0008] A moving flange arranged on the mounting flange and connected to the gas shower head, the gas shower head axially penetrating through the moving flange and the mounting flange;

[0009] A locking member connected with the mounting flange and the moving flange and capable of locking and unlocking between the mounting flange and the moving flange;

[0010] An adjusting member movably connected with the mounting flange and the moving flange and capable of adjusting the position of the moving flange relative to the mounting flange;

[0011] One of the locking member and the adjusting member is a hollow structure and is sleeved outside the other.

[0012] Optionally, the adjusting mechanism further comprises a detachable cooling flange provided on the moving flange and in heat-conducting connection with the gas shower head, and the cooling flange is provided with a cooling channel for guiding the cooling medium.

[0013] Optionally, the cooling flange comprises a plurality of cooling flanges with different heat conductivities, each of which is capable of being assembled with the moving flange and matched with the mounting flange, the locking member and the adjusting member.

[0014] Optionally, the cooling flange comprises at least two annular parts which are axially stacked and fixedly connected.

[0015] Optionally, the moving flange is provided with a first threaded hole, the adjusting member is a threaded member in threaded connection with the first threaded hole, and one end of the adjusting member penetrating through the first threaded hole is in abutment with the mounting flange.

[0016] Optionally, the adjusting member is a hollow structure and is sleeved outside the locking member, and

[0017] the mounting flange is provided with a second threaded hole, one end of the locking member penetrating through the adjusting member is a threaded end capable of being in threaded connection with the second threaded hole, and the other end of the locking member not penetrating through the adjusting member is provided with a flange capable of abutting against the adjusting member.

[0018] Optionally, the cooling flange is provided with a protruding part on an end face in abutment with the moving flange, the protruding part extends into a flange hole of the moving flange and is fixedly and heat-conductingly connected with the gas shower head.

[0019] Optionally, in the circumferential direction of the cooling flange, the cooling channel extends around the protruding part, and the cooling flange is provided with a radially protruding cooling liquid inlet joint and a cooling liquid outlet joint, and two ends of the cooling channel are respectively in communication with the cooling liquid inlet joint and the cooling liquid outlet joint.

[0020] Optionally, in the adjusting mechanism, the mounting flange and the moving flange are communicated through a bellows, and the gas shower head penetrates through the bellows.

[0021] The cooling flange is provided with a purge gas path, and the gas blown out by the purge gas path enters the gap between the bellows and the gas shower head.

[0022] Optionally, in the adjusting mechanism, the purge gas path comprises:

[0023] An air inlet connector is arranged on the cooling flange.

[0024] An annular gas path is arranged on the cooling flange and surrounds the protruding portion in the circumferential direction of the cooling flange.

[0025] A plurality of uniform flow holes are in communication with the annular gas path and are axially arranged on the cooling flange to form a plurality of gas outlets.

[0026] Optionally, in the adjusting mechanism, the mounting flange and the moving flange are communicated through a bellows, and,

[0027] An annular connecting groove is arranged on the end surface of the mounting flange facing the moving flange, and the bellows penetrates into the annular connecting groove and is connected with the bottom wall of the annular connecting groove.

[0028] Optionally, in the adjusting mechanism, the annular portion comprises a first annular portion and a second annular portion, and a splicing groove is arranged on the joint surface of the first annular portion and the second annular portion, and the cooling channel is formed by splicing the splicing groove on the first annular portion and the splicing groove on the second annular portion.

[0029] A semiconductor process equipment comprises a reaction chamber, a gas shower head, and an adjusting mechanism for mounting and adjusting the position of the gas shower head on the reaction chamber, wherein the adjusting mechanism is the adjusting mechanism described above.

[0030] The adjusting mechanism is fixedly arranged on the reaction chamber through the mounting flange, the moving flange is connected to the mounting flange through the adjusting member and the locking member, and the gas spraying head is connected to the moving flange and extends into the reaction chamber along the axial direction of the moving flange and the mounting flange. When the locking member is unlocked, the multiple adjusting members distributed in the circumferential direction of the moving flange can adjust the position of the moving flange, that is, the whole or part of the moving flange is moved to approach or move away from the mounting flange along the axial direction. Since the gas spraying head is connected to the moving flange, the gas spraying head can be moved and the levelness can be changed along with the movement of the moving flange, so that the distance and the levelness between the gas spraying head and the silicon wafer are adjusted. After the adjustment is completed, the locking (that is, the fixed locking) between the mounting flange and the moving flange is realized through the locking member. In this way, the firm connection between the moving flange and the mounting flange is realized, that is, the firm connection between the gas spraying head and the reaction chamber is realized. Even if the vacuum degree of the reaction chamber changes, the gas spraying head will not be displaced, and the distance and the levelness between the gas spraying head and the silicon wafer are prevented from fluctuating. At the same time, when the adjusting member and the locking member are arranged, one of them is arranged as a hollow structure to be sleeved on the outside of the other, so that the arrangement positions of the adjusting member and the locking member on the moving flange and the mounting flange are the same position, that is, the position of the moving flange and the mounting flange subjected to the locking force is the position subjected to the adjusting force. In this way, the stress of the moving flange and the mounting flange in the axial direction is balanced, and the bending moment between the moving flange and the mounting flange is eliminated to avoid stress deformation. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of the provided drawings.

[0032] Figure 1 The structure schematic view of the adjusting mechanism provided by the embodiments of the present application cooperates with the gas spraying head and the reaction chamber;

[0033] Figure 2 The top view of Figure 1 ;

[0034] Figure 3 The sectional view of Figure 2 ;

[0035] Figure 4 The top view of the cooling flange;

[0036] Figure 5 The sectional view of Figure 4 ;

[0037] Figure 6 for Figure 5 A sectional view;

[0038] Figure 7 Top view of the mounting flange and the movable flange;

[0039] Figure 8 for Figure 7 A sectional view;

[0040] Figure 9 This is a top view of the gas spray head;

[0041] Figure 10 for Figure 9 A sectional view;

[0042] Figure 11 A schematic diagram showing the connection between the adjustment mechanism and the gas spray head and reaction chamber;

[0043] Figure 12 This is a schematic diagram showing the structure of the adjustment mechanism, gas spray head, silicon wafer, and heater working together.

[0044] exist Figures 1-12 middle:

[0045] 1-Adjustment mechanism, 2-Gas spray head, 3-Reaction chamber, 4-Silicon wafer, 5-Heater;

[0046] 11-Mounting flange, 12-Moving flange, 13-Locking fastener, 14-Adjusting component, 15-Cooling flange, 16-Bellwall, 17-First sealing ring, 18-Second sealing ring, 19-Third sealing ring;

[0047] 111-Second threaded hole, 112-Annular connecting groove, 113-Third through hole;

[0048] 121 - First threaded hole, 122 - Third threaded hole, 123 - Second sealing groove;

[0049] 1501-Cooling channel, 1502-Protrusion, 1503-First sealing surface, 1504-Second sealing surface, 1505-Coolant inlet connector, 1506-Coolant outlet connector, 1507-Air inlet connector, 1508-Annular air passage, 1509-Flow equalization hole, 1510-First annular part, 1511-Splicing groove, 1512-First through hole, 1513-Second through hole;

[0050] 21-Spraying section, 22-Through section, 23-Air inlet end, 24-Contact surface, 25-Fourth threaded hole, 26-First sealing groove;

[0051] 31 - Fifth threaded hole, 32 - Third sealing groove. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work are within the protection scope of the present application.

[0053] As Figures 1-12As shown, the embodiment of the present application provides a regulating mechanism 1 for installing on a semiconductor process equipment to set a gas shower head 2 on a reaction chamber 3 of the semiconductor process equipment and capable of regulating the position of the gas shower head 2, which mainly comprises a mounting flange 11, a moving flange 12, a locking member 13 and a regulating member 14, wherein the mounting flange 11 is fixedly arranged on the reaction chamber 3, specifically on the upper cover of the reaction chamber 3, and is the installation base of the moving flange 12, the locking member 13, the regulating member 14 and the gas shower head 2, that is, the other components of the regulating mechanism 1 and the gas shower head 2 are all installed on the reaction chamber 3 through the mounting flange 11; the moving flange 12 is movably arranged on the mounting flange 11 and the gas shower head 2 is fixedly arranged on the moving flange 12, so that the movement of the moving flange 12 relative to the mounting flange 11 realizes the movement of the gas shower head 2 relative to the reaction chamber 3 (and the silicon wafer 4 arranged horizontally and fixedly in the reaction chamber 3), and further realizes the regulation of the distance and the levelness between the gas shower head 2 and the silicon wafer 4 (since the silicon wafer 4 is fixedly placed on the heater 5 in the reaction chamber 3, the regulation of the distance and the levelness between the gas shower head 2 and the silicon wafer 4 can be realized by moving the gas shower head 2 and changing the levelness); when the gas shower head 2 is connected with the moving flange 12, the part of the gas shower head 2 outside the reaction chamber 3 (i.e. the penetrating part 22 described below) is first made to penetrate through the mounting flange 11, the bellows 16 described below and the moving flange 12 in the axial direction and then connected, and the other part of the gas shower head 2 (i.e. the showering part 21 described below) is located in the reaction chamber 3 for spraying process gas to the silicon wafer 4; the locking member 13 is a component for locking the moving flange 12, after the moving flange 12 drives the gas shower head 2 to move to the position, the locking of the moving flange 12 relative to the mounting flange 11 can be realized by operating the locking member 13, so that the moving flange 12 cannot change the position relative to the mounting flange 11, thereby the gas shower head 2 cannot change the position relative to the reaction chamber 3 and the silicon wafer 4 in the reaction chamber 3 (the position change includes the distance change and the levelness change), and further realizes the stable setting of the gas shower head 2 in the reaction chamber 3, avoiding the distance and the levelness between the gas shower head 2 and the silicon wafer 4 from fluctuating due to the change of the vacuum degree of the reaction chamber 3; when it is necessary to regulate the position of the gas shower head 2, the locking member 13 can realize the unlocking of the moving flange 12, so that the moving flange 12 can drive the gas shower head 2 to move and realize the change of the distance and the levelness between the gas shower head 2 and the silicon wafer 4.Adjusting component 14 is used to adjust the position of the movable flange 12 relative to the mounting flange. In other words, adjusting component 14 is a component that drives the movable flange 12 and the gas spray head 2 on it to move. Adjusting component 14 is movably connected to both the mounting flange 11 and the movable flange 12. The movement includes movement, rotation, and extension / retraction. The connection includes contact and natural contact. That is, adjusting component 14 can move the movable flange 12 relative to the mounting flange 11 through movement, rotation, extension / retraction, and other actions, as well as through connection, contact, or natural contact with the mounting flange 11 and the movable flange 12. For example, adjusting component 14 can adjust the distance between the two by rotating relative to the movable flange 12 and contacting the mounting flange 11, thereby driving the gas spray head 2 to move. More preferably, multiple adjusting components 14 are provided. These adjusting components 14 are distributed in the circumferential direction of the mounting flange 11 and the movable flange 12, for example, evenly spaced (or evenly angled) in the circumferential direction. When adjusting components 14 at different angles are operated, the levelness of the movable flange 12 and the gas spray head 2 can be changed. More importantly, in the above structure, one of the locking fastener 13 and the adjusting member 14 is made into a hollow structure, and it is fitted over the outside of the other. That is, the adjusting member 14 can be made into a hollow structure and the locking fastener 13 can pass through and be set inside the adjusting member 14, or the locking fastener 13 can be made into a hollow structure and the adjusting member 14 can pass through and be set inside the locking member 13, so that the adjustment point position and the locking point position on the mounting flange 11 and the moving flange 12 coincide.

[0054] Compared with existing adjustment mechanisms, the adjustment mechanism 1 described above differs in that it no longer uses a spring to position the adjusted gas spray head 2. Instead, it uses a locking fastener 13 to lock and fix the adjusted gas spray head 2. This positioning method provides a more stable and reliable positioning effect compared to springs, which are prone to elastic deformation. It ensures a firm position of the gas spray head 2, preventing displacement even if the vacuum level of the reaction chamber 3 changes. This avoids fluctuations in the distance and levelness between the gas spray head 2 and the silicon wafer 4, thus guaranteeing the thin film's... On the one hand, by setting the adjusting member 14 and the locking member in a nested manner, the setting positions of the adjusting member 14 and the locking member 13 on the moving flange 12 and the mounting flange 11 coincide. That is to say, the position where the moving flange 12 and the mounting flange 11 bear the locking force is the position where the adjusting force is borne. Since the directions of these two forces are opposite, this setting can balance the axial force on the moving flange 12 and the mounting flange 11, eliminate the bending moment between the moving flange 12 and the mounting flange 11 and avoid deformation under stress, thereby improving the adjustment efficiency and accuracy of the gas spray head 2.

[0055] Furthermore, such as Figures 1-6As shown, the adjusting mechanism 1 further comprises a detachable cooling flange 15 arranged on the moving flange 12 and in heat-conducting connection with the gas shower head 2. The cooling flange 15 can conduct heat away from the gas shower head 2 to achieve heat dissipation of the gas shower head 2. The cooling flange 15 comprises a plurality of cooling flanges 15 with different heat conductivity coefficients, each of which can be assembled with the moving flange 12 and cooperated with the mounting flange 11, the locking member 13 and the adjusting member 14. In some processes, the temperature of the gas shower head 2 needs to be adjusted and controlled. However, the adjusting mechanism in the prior art is of an integrated structure, i.e. the entire adjusting mechanism is made of a single material with a fixed heat conductivity coefficient, which cannot adjust the heat dissipation effect of the gas shower head 2 and cannot meet the diversified process requirements. Moreover, when the adjusting mechanism in the prior art cannot meet the requirements of different processes, the entire adjusting mechanism has to be replaced, resulting in increased production cost. The adjusting mechanism 1 in the present application is provided with a plurality of cooling flanges 15 with different materials, each of which has a different heat conductivity coefficient and can achieve different heat dissipation effects of the gas shower head 2. The cooling flange 15 is detachably connected with the moving flange 12 and the gas shower head 2, so that the cooling flange 15 with a different heat conductivity coefficient can be replaced to connect with the moving flange 12 and the gas shower head 2 and change the temperature of the gas shower head 2 and the gas parameters (for example, different materials of the cooling flange 15 are selected to match the process gas) to a different degree, so that the gas shower head 2 can conduct more (or less) heat to the cooling flange 15 to exchange heat with the cooling medium in the cooling flange 15, thereby more specifically reducing (or increasing) the temperature of the gas shower head 2. At the same time, by arranging the cooling flange 15, the moving flange 12 and the gas shower head 2 in a split structure, only a part of the adjusting mechanism 1 (i.e. the cooling flange 15) can be replaced to meet the requirements of different process equipment and achieve different functions, so that the adjusting mechanism 1 has higher universality.

[0056] In order to improve the heat dissipation efficiency of the cooling flange 15 on the gas shower head 2, as shown in the drawings, Figures 4-6 and Figure 11As shown, the cooling flange 15 is also provided with a cooling channel 1501 for flowing cooling medium to flow through, so that the cooling flange 15 can not only dissipate heat through its outer surface with the ambient environment, but also can more efficiently take away heat by flowing cooling medium inside the cooling flange 15, wherein the cooling medium can be liquid medium with higher heat exchange efficiency, such as cooling water or cooling oil, etc., so that the cooling flange 15 is a liquid cooling component, or the cooling medium flowing through the cooling channel 1501 can be gas, such as air, etc., so that the cooling flange 15 is an air cooling component. In the present application, the connection mode of the moving flange 12 and the gas spray head 2 is that the moving flange 12 is connected with the cooling flange 15 and the cooling flange 15 is connected with the gas spray head 2, that is, the moving flange 12 is connected with the gas spray head 2 through the transition connection of the cooling flange 15, and the cooling flange 15 is a component directly connected with the gas spray head 2, so the cooling flange 15 has heat dissipation function and the cooling efficiency of the cooling flange 15 is improved by providing the cooling channel 1501, so that the temperature control of the gas spray head 2 can be better realized. Specifically, the heat of the gas spray head 2 is conducted to the cooling flange 15 through the contact surface 24 and the first sealing surface 1503 of the cooling flange 15 (the contact surface 24 and the first sealing surface 1503 are the surfaces of the gas spray head 2 and the cooling flange 15 respectively, which contact and adhere to each other), the cooling liquid flows through the cooling channel 1501 to take away the heat conducted to the cooling flange 15, so as to cool the gas spray head 2.

[0057] In optional embodiments, as Figures 1-12As shown, the first threaded hole 121 is formed in the moving flange 12, and the adjusting member 14 is a threaded member which is screwed with the first threaded hole 121, and the end of the adjusting member 14 which penetrates through the first threaded hole 121 abuts against the mounting flange 11. This structure is to adjust the moving flange 12 by screwing the adjusting member 14 and the moving flange 12 together. Specifically, the adjusting member 14 is a threaded member such as a bolt or a sleeve, and the first threaded hole 121 is formed in the moving flange 12 along the axial direction of the moving flange 12. The adjusting member 14 can be screwed into the first threaded hole 121 to be screwed with the first threaded hole 121. With the continuous screwing, the adjusting member 14 can be screwed to the state that the end thereof penetrates out of the first threaded hole 121 and abuts against the mounting flange 11 below the moving flange 12. Under the gravity of the moving flange 12, the cooling flange 15 and the gas shower head 2, the end of the adjusting member 14 which penetrates out of the first threaded hole 121 always abuts against the mounting flange 11. Then, when the adjusting member 14 is screwed again, the length of the adjusting member 14 which penetrates out of the first threaded hole 121 can be changed, so that the distance between the moving flange 12 and the mounting flange 11 can be changed, and the position of the moving flange 12 and the gas shower head 2 thereon can be changed. As mentioned above, the adjusting member 14 is provided with a plurality of adjusting members in the circumferential direction of the moving flange 12 and the mounting flange 11. Correspondingly, the first threaded hole 121 is also provided with a plurality of first threaded holes which are circumferentially distributed, and each adjusting member 14 penetrates through one first threaded hole 121 to abut against the mounting flange 11. In this case, by screwing the adjusting members 14 at different positions, the moving flange 12 and the gas shower head 2 thereon can be lifted or lowered in different parts in the circumferential direction, so that the distance and the levelness of the gas shower head 2 can be adjusted. In this structure, the adjusting member 14 can be screwed by a torque wrench, so that the locking force of each adjusting member 14 after being screwed can be consistent, and the distance and the levelness of the gas shower head 2 can be accurately adjusted. The adjusting member 14 is a threaded member, and the first threaded hole 121 is formed in the moving flange 12 to cooperate with the adjusting member 14. The distance and the levelness can be finely adjusted by the threaded hole with high machining precision, and the adjusting precision can be higher, and the structure of the threaded member and the threaded hole is simple and easy to machine, and is more suitable for use in the adjusting mechanism 1 provided in the application. In addition, the adjusting member 14 can also have other structures. For example, the adjusting member 14 can be a telescopic member which is arranged between the moving flange 12 and the mounting flange 11 and can be telescoped, such as a telescopic sleeve or a scissor mechanism.

[0058] In alternative embodiments, as Figures 1-12As shown, the adjusting member 14 is a hollow structure and is sleeved outside the locking member 13 (i.e. the adjusting member 14 can be provided as a threaded sleeve), and the mounting flange 11 is provided with a second threaded hole 111, one end of the locking member 13 passing through the adjusting member 14 is a threaded end capable of being screwed with the second threaded hole 111, and the other end of the locking member 13 not passing through the adjusting member 14 is provided with a flange capable of pressing the adjusting member 14. On the one hand, the adjusting member 14 is preferably a hollow structure, and the locking member 13 passes through the adjusting member 14 provided with a through hole; on the other hand, the locking mode of the locking member 13 and the mounting flange 11 is also selected as threaded connection, and the locking mode of the locking member 13 and the moving flange 12 is selected as blocking and pressing. Specifically, the end of the locking member 13 passing through the through hole is a threaded end, and the other end not passing through the through hole is provided with a flange, which is similar to a bolt, or the locking member 13 can be provided as a bolt, the mounting flange 11 is provided with a second threaded hole 111, and after the threaded end of the locking member 13 passes through the through hole, it can be screwed into the second threaded hole 111 and connected with the second threaded hole 111. As the locking member 13 penetrates into the second threaded hole 111, the flange will press on the adjusting member 14 because the outer diameter of the flange is greater than the inner diameter of the through hole. Thus, the locking of the adjusting member 14 and the moving flange 12 is realized by the bolt-shaped locking member 13. Since the locking member 13 is sleeved by the adjusting member 14, the positions of the adjusting points and the fixed points on the moving flange 12 and the mounting flange 11 coincide, so that the opposite forces can be cancelled out to avoid the bending moment of the moving flange 12 and the stress deformation. Further, in order to more fully cancel the stress of the moving flange 12 and the mounting flange 11 in the axial direction, the locking member 13 and the adjusting member 14 can be coaxially sleeved, that is, the through hole provided on the adjusting member 14 is preferably an axial hole, and correspondingly, the first threaded hole 121 on the moving flange 12 and the second threaded hole 111 on the mounting flange 11 are also coaxially arranged. By sleeving the adjusting member 14 outside the locking member 13, the diameter of the second thread on the mounting flange 11 can be smaller than the diameter of the first threaded hole 121 on the moving flange 12, so that the end of the adjusting member 14 passing through the first threaded hole 121 directly abuts against the surface of the mounting flange 11, and the abutting position is the outer annular position of the opening of the second threaded hole 111. Thus, the adjusting accuracy and the machining accuracy can be improved. The locking member 13 can also be other structures or types, for example, the locking member 13 can be a magnetic member capable of being magnetically connected with the mounting flange 11, and the magnetic attraction force of the locking member 13 is greater than the maximum fluctuation force generated when the vacuum degree of the reverse chamber changes.

[0059] Alternatively, the locking element 13 can be a hollow structure and fitted onto the outside of the adjusting element 14, that is, the structures of the locking element 13 and the adjusting element 14 can be interchanged, so that the locking element 13 is a threaded sleeve and the adjusting element 14 is bolt-shaped. Furthermore, the outer locking element 13 needs to be threadedly connected to both the first threaded hole 121 and the second threaded hole 111. Simultaneously, the inner wall of the locking element 13 also has threads, which can engage with the threads on the inner adjusting element 14 (the threads on the adjusting element 14 can still be...). Figure 11 The adjusting member 14 and the movable flange 12 are connected by threads on the inner and outer walls of the locking member 13, which engage with the first threaded hole 121. The abutting end of the adjusting member 14 abuts against the bottom wall of the second threaded hole 111. During position adjustment, first, while ensuring the adjusting member 14 does not rotate, tighten the outer locking member 13 so that one end of the locking member 13 protruding from the first threaded hole 121 disengages from the second threaded hole 111, thereby releasing the locking of the movable flange 12 and the mounting flange 11. Then, while ensuring the locking member 13 does not rotate in the first threaded hole 121, tighten the adjusting member 14. Since the adjusting member 14 abuts against the bottom wall of the second threaded hole 111 of the mounting flange 11, and the threads on the adjusting member 14 engage with the threads on the inner wall of the locking member 13, Therefore, by turning the adjusting component 14, the locking fastener 13 and the movable flange 12 (since the locking fastener 13 does not rotate in the first threaded hole 121, the locking fastener 13 and the movable flange 12 can be considered as a fixed connection at this time) can move synchronously relative to the mounting flange 11 through the engagement of the threads, thereby achieving the adjustment of the distance and level of the gas spray head 2. Finally, while ensuring that the adjusting component 14 does not rotate, the locking fastener 13 is turned in the opposite direction so that the locking fastener 13 extends into the second threaded hole 111 again to lock the movable flange 12 and the mounting flange 11. The non-rotation of the locking fastener 13 and the adjusting component 14 can be achieved by using a wrench or screwdriver for positioning.

[0060] It should be noted that, in order to adjust the level of the gas spray head 2, multiple adjusting components 14 are provided in the circumferential direction of the moving flange 12 and the mounting flange 11. When the adjusting components 14 and the locking fasteners 13 are fitted together, the number of locking fasteners 13 can be flexibly set when the locking function is normal. For example, one locking fastener 13 can be set in each adjusting component 14 to maximize the working stability and reliability of the adjusting mechanism 1. Alternatively, locking fasteners 13 can be set only in some adjusting components 14, such as one locking fastener 13 in each of the two adjusting components 14 symmetrically arranged among the four circumferentially distributed adjusting components 14.

[0061] like Figure 3 , Figure 5 and Figure 11As shown, the protruding part 1502 is arranged on the end face of the cooling flange 15 abutting against the moving flange 12. The protruding part 1502 protruding along the axial direction of the cooling flange 15 extends into the flange hole of the moving flange 12 and is fixed and heat-conducting connected with the gas shower head 2. The protruding part 1502 is the structure of the cooling flange 15 for connecting with the gas shower head 2. The protruding part 1502 extending into the flange hole of the moving flange 12 can be more stable and more convenient to connect with the gas shower head 2. The protruding part 1502 is circular and located at the central part of the end face of the moving flange 12. A flange hole penetrating through the cooling flange 15 is arranged at the center of the protruding part 1502 for the gas inlet end 23 of the gas shower head 2 to pass through. The surface of the protruding part 1502 forms a first sealing surface 1503 connected and sealed with the gas shower head 2. The part of the surface of the cooling flange 15 around the protruding part 1502 forms a second sealing surface 1504 connected and sealed with the moving flange 12. By arranging the protruding part 1502, the matching structure of the cooling flange 15, the gas shower head 2 and the moving flange 12 can be optimized. The connection stability of the gas shower head 2 and the cooling flange 15 is improved. The cooling effect of the cooling flange 15 on the gas shower head 2 is also improved. It is also conducive to the compensation of the process gas into the reaction chamber 3.

[0062] Further, as shown in Figs. 1, 2 and 3, Figure 4 and Figure 5 As shown, the cooling channel 1501 extends around the protruding part 1502 in the circumferential direction of the cooling flange 15. The cooling flange 15 is provided with a radially protruding cooling liquid inlet joint 1505 and a cooling liquid outlet joint 1506. The two ends of the cooling channel 1501 are respectively communicated with the cooling liquid inlet joint 1505 and the cooling liquid outlet joint 1506. By making the cooling channel 1501 extend in the circumferential direction of the cooling flange 15, the length of the cooling channel 1501 can be increased. The cooling channel 1501 can be more uniformly distributed on the cooling flange 15. The cooling liquid can flow through the cooling flange 15 more fully. Thus, the cooling effect of the cooling flange 15 can be improved as much as possible. Since the gas shower head 2 is connected to the protruding part 1502, the cooling channel 1501 arranged around the protruding part 1502 can more fully and efficiently take away the heat transferred from the gas shower head 2 to the cooling flange 15. The cooling liquid inlet joint 1505 is connected with an external pipeline for introducing cooling liquid into the cooling channel 1501. The cooling liquid flows in the cooling channel 1501 to absorb the heat of the gas shower head 2. Then the cooling liquid flows out of the cooling channel 1501 from the cooling liquid outlet joint 1506. The cooling liquid outlet joint 1506 is also connected with an external pipeline to send away the cooling liquid absorbing heat. In order to optimize the structure, facilitate the connection of the pipeline and the arrangement of the threaded hole and other structures on the cooling flange 15, the cooling liquid inlet joint 1505 and the cooling liquid outlet joint 1506 are arranged at the edge part of the cooling flange 15 and protrude in the radial direction of the cooling flange 15.

[0063] And, as Figure 3 , Figure 8 and Figure 11 shown, the flange hole of the mounting flange 11 and the flange hole of the moving flange 12 are communicated through the bellows 16, and the gas shower head 2 passes through the bellows 16, and there are radial gaps between the protruding part 1502 and the flange hole wall of the moving flange 12, between the gas shower head 2 and the bellows 16, and between the gas shower head 2 and the flange hole wall of the mounting flange 11; the cooling flange 15 is provided with a purge gas path, and the gas blown out of the purge gas path enters the gap between the bellows 16 and the gas shower head 2, that is, the gas outlet of the purge gas path is located between the protruding part 1502 and the flange hole wall of the moving flange 12 and communicates with the radial gap, so that the purge gas blown out of the gas outlet can enter the reaction chamber 3 through the flange hole of the moving flange 12, the bellows 16 and the flange hole of the mounting flange 11 in turn. In some processes, process gas needs to be filled into the reaction chamber 3 to compensate for the pressure in the reaction chamber 3, so the purge gas path is provided on the cooling flange 15, and in order to ensure that the process gas can enter the reaction chamber 3 through the purge gas path, the bellows 16 is arranged between the flange hole of the mounting flange 11 and the flange hole of the moving flange 12 to realize the communication of the two flange holes, and the gas shower head 2 connected with the cooling flange 15 passes through the bellows 16, and the bellows 16 is selected because it can stretch and contract, so as to ensure the normal adjustment between the moving flange 12 and the mounting flange 11, and in order to better adapt to different process gases and prolong the service life of the bellows 16, the material of the bellows 16 is preferably metal. The gas outlet of the purge gas path is located between the protruding part 1502 and the flange hole wall of the moving flange 12, the inner diameter of the bellows 16 is greater than the inner diameters of the flange holes of the moving flange 12 and the mounting flange 11, and through the arrangement of the above-mentioned multiple radial gaps, the process gas can smoothly enter the reaction chamber 3 to realize pressure compensation, so that when the flow of other process gases changes, the pressure in the reaction chamber 3 can be balanced by changing the flow of the gas.

[0064] And, the process gas is blown into the reaction chamber 3 through the above-mentioned multiple radial gaps in turn, which can not only realize pressure compensation, but also avoid the gas and particles in the reaction chamber 3 from entering the radial gaps, so as to avoid pollution to the radial gaps, and even the blown gas can also purge the radial gaps to clean the radial gaps.

[0065] In the above structure, the cooling channel 1501 for guiding the cooling liquid and the purge gas path for guiding the gas are arranged on the detachable cooling flange 15, so that the structure of the adjusting mechanism 1 is optimized and the functional layout is more reasonable, that is, the connecting structure of the water path, the gas path and the gas spraying head 2 are arranged on the cooling flange 15, and the mounting flange 11 and the moving flange 12 only serve to adjust the distance and the levelness of the gas spraying head 2, so that different process equipment requirements can be met by only replacing the cooling flange 15, and the design of the adjusting mechanism 1 is more reasonable, the cost is lower, and the universality is higher.

[0066] As shown in Figures 2-5 and Figure 11 , the purge gas path comprises: a gas inlet joint 1507 protruding and arranged on the cooling flange 15; an annular gas path 1508 arranged on the cooling flange 15 and surrounding the protruding portion 1502 in the circumferential direction of the cooling flange 15; and a plurality of uniform flow holes 1509 each in communication with the annular gas path 1508 and each axially arranged on the cooling flange 15 to form a plurality of gas outlets uniformly distributed around the protruding portion 1502. By arranging the purge gas path in this way, the process gas can enter the annular gas path 1508 from the gas inlet joint 1507, be guided by the annular gas path 1508 to be distributed in the circumferential direction of the protruding portion 1502, and then be blown from the upper part of the gas spraying head 2 into the radial gap through the uniform flow holes 1509 to form a gas curtain around the protruding portion 1502. The gas curtain passes through the flange holes of the moving flange 12, the corrugated pipe 16 and the flange holes of the mounting flange 11, and finally enters the reaction chamber 3 and passes through the upper surface of the silicon wafer 4 for film growth.

[0067] In an optional embodiment, as shown in Figure 8 , the flange hole of the mounting flange 11 and the flange hole of the moving flange 12 are communicated through the corrugated pipe 16, and an annular connecting groove 112 is arranged on the end surface of the mounting flange 11 facing the moving flange 12, and the corrugated pipe 16 extends into the annular connecting groove 112 and is connected to the bottom wall of the annular connecting groove 112. The inner diameter of the annular connecting groove 112 is larger than that of the flange hole of the mounting flange 11, so that the corrugated pipe 16 is surrounded outside the flange hole of the mounting flange 11. By arranging the annular connecting groove 112 and connecting the corrugated pipe 16 to the groove bottom wall, the length of the corrugated pipe 16 can be increased, so that the moving flange 12 can have a larger adjusting stroke and a larger adjusting amount, and the working performance of the gas spraying head 2 is more prominent. Specifically, the annular connecting groove 112 can be formed in cooperation with the flange hole of the mounting flange 11, that is, the annular connecting groove 112 and the flange hole are combined to form a stepped hole, the end of the stepped hole close to the moving flange 12 has a larger diameter to become the annular connecting groove 112, and the end of the stepped hole away from the moving flange 12 is the flange hole, and the corrugated pipe 16 is connected to the stepped surface of the stepped hole.

[0068] Furthermore, the cooling flange 15 includes at least two annular portions that are stacked and fixedly connected along the axial direction. In actual manufacturing, at least two annular portions can be machined first according to the structure of the cooling flange 15, then these annular portions can be stacked along the axial direction, and finally adjacent annular portions can be welded to ultimately form the cooling flange 15. Manufacturing the cooling flange 15 in this way facilitates the processing and manufacturing of the cooling flange 15 with cooling channels 1501 and purging air passages, reducing the manufacturing difficulty of the cooling flange 15.

[0069] Among them, such as Figures 4-6 As shown, the annular portion includes a first annular portion 1510 and a second annular portion, and splicing grooves 1511 are formed on the mating surfaces of the first annular portion 1510 and the second annular portion. The cooling channel 1501 is formed by splicing the splicing grooves 1511 on the first annular portion 1510 and the splicing grooves 1511 on the second annular portion. With this arrangement, the splicing grooves 1511 can be machined on the annular portion first, and then the circumferentially closed cooling channel 1501 can be formed by splicing the splicing grooves 1511, thus making the cooling channel 1501 simpler and more convenient to process and form. Similarly, the purging air passage on the cooling flange 15 can also be processed and formed in this way.

[0070] In this application, such as Figures 4-11As shown, the fixing connection between the cooling flange 15 and the moving flange 12, the fixing connection between the cooling flange 15 and the gas shower head 2, and the fixing connection between the mounting flange 11 and the reaction chamber 3 are all achieved by the cooperation of bolts and threaded holes, and are all achieved by the sealing connection of sealing rings. In the specific arrangement, a plurality of first through holes 1512 and a plurality of second through holes 1513 are arranged on the cooling flange 15, a plurality of third threaded holes 122 are arranged on the moving flange 12, a plurality of fourth threaded holes 25 are arranged on the gas shower head 2, a plurality of third through holes 113 are arranged on the mounting flange 11, and a plurality of fifth threaded holes 31 are arranged on the reaction chamber 3. When connected, the bolts pass through the first through holes 1512 and extend into the third threaded holes 122 and are threadedly connected with the third threaded holes 122 to achieve the fixing connection of the cooling flange 15 and the moving flange 12, the bolts pass through the second through holes 1513 and extend into the fourth threaded holes 25 and are threadedly connected with the fourth threaded holes 25 to achieve the fixing connection of the cooling flange 15 and the gas shower head 2, and the bolts pass through the third through holes 113 and extend into the fifth threaded holes 31 and are threadedly connected with the fifth threaded holes 31 to achieve the fixing connection of the mounting flange 11 and the reaction chamber 3. At the same time, the first sealing groove 26 is arranged on the gas shower head 2, the second sealing groove 123 is arranged on the moving flange 12, and the third sealing groove 32 is arranged on the reaction chamber 3. The first sealing ring 17 is arranged in the first sealing groove 26 and achieves the sealing connection of the cooling flange 15 and the gas shower head 2 by abutting against the first sealing surface 1503, the second sealing ring 18 is arranged in the second sealing groove 123 and achieves the sealing connection of the cooling flange 15 and the moving flange 12 by abutting against the second sealing surface 1504, and the third sealing ring 19 is arranged in the third sealing groove 32 and achieves the sealing connection of the mounting flange 11 and the gas reaction chamber 3 by abutting against the mounting flange 11, so as to achieve the sealing isolation of the radial gap from the outside, so that the process gas can smoothly enter the reaction chamber 3 from the purge gas path.

[0071] In addition, the embodiment of the present application further provides a semiconductor process equipment, which comprises a reaction chamber 3, a gas shower head 2, and an adjusting mechanism 1 for mounting the gas shower head 2 on the reaction chamber 3 and adjusting the position of the gas shower head 2. The adjusting mechanism 1 is the adjusting mechanism 1 described above.

[0072] Since the semiconductor process equipment has the adjusting mechanism 1 described above, the beneficial effects of the semiconductor process equipment brought by the adjusting mechanism 1 are described above, and will not be described here.

[0073] As Figures 9-11As shown, the gas shower head 2 of the semiconductor process equipment comprises: a shower part 21 located in the reaction chamber 3 and having a plurality of gas outlets uniformly distributed; a penetrating part 22 in communication with the shower part 21 and used for guiding process gas to the shower part 21 and penetrating the upper cover of the reaction chamber 3, the mounting flange 11 and the moving flange 12; and a gas inlet end 23 in communication with an end of the penetrating part 22 away from the shower part 21 and penetrating the cooling flange 15; wherein the end of the penetrating part 22 away from the shower part 21 is provided with a plurality of fourth threaded holes 25 and a first sealing groove 26, so as to be fixedly connected with the cooling flange 15 through threaded connection with bolts penetrating the cooling flange 15. The gas shower head 2 with the above structure is matched with the adjusting mechanism 1, so that the adjusting effect can be more efficiently and accurately improved, and the thin film can be generated with high quality.

[0074] The above describes the basic principles of the present application in combination with specific embodiments, but it should be pointed out that the advantages, advantages, effects and the like mentioned in the present application are only examples and not limitations, and these advantages, advantages, effects and the like cannot be considered as the must-have of each embodiment of the present application. In addition, the above disclosed specific details are only for the purpose of example and understanding, and are not limited to the must-use specific details to realize the present application.

[0075] The block diagrams of the devices, apparatuses, equipment, systems involved in the present application are only illustrative examples and are not intended to require or imply the connection, arrangement, configuration shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, systems can be connected, arranged, configured in any way. Words such as "include", "contain", "have" and the like are open-ended words, which mean "including but not limited to", and can be used interchangeably. The words "or" and "and" used herein mean the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein means the phrase "such as but not limited to", and can be used interchangeably.

[0076] It should also be noted that in the devices, equipment and methods of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be considered as equivalent solutions of the present application.

[0077] The above description of the disclosed aspects is provided so that any person skilled in the art can make or use the present application. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0078] It should be understood that the limiting words "first", "second", "third", "fourth", "fifth" and "sixth" used in the embodiments of the present application are only used for more clearly explaining the technical solutions, and cannot be used to limit the protection scope of the present application.

[0079] The above description is given for the purpose of illustration and description. Furthermore, this description does not intend to limit the embodiments of the present application to the forms disclosed herein. Although several example aspects and embodiments have been discussed above, those of skill in the art will recognize certain modifications, permutations, additions, and sub-combinations thereof.

Claims

1. An adjustment mechanism, characterized in that, For installing a gas spray head in a reaction chamber and adjusting the position of the gas spray head, including: The mounting flange is fixedly installed in the reaction chamber; A movable flange is mounted on the mounting flange and connected to the gas spray head, the gas spray head passing axially through the movable flange and the mounting flange; The locking device is connected to the mounting flange and the movable flange, and can lock and unlock the mounting flange and the movable flange. An adjusting element is movably connected to the mounting flange and the movable flange, and adjusts the position of the movable flange relative to the mounting flange; In this embodiment, one of the locking element and the adjusting element is a hollow structure and is sleeved on the outside of the other.

2. The adjusting mechanism according to claim 1, characterized in that, It also includes a detachable cooling flange mounted on the movable flange and thermally connected to the gas spray head, wherein the cooling flange has a cooling channel for guiding the cooling medium.

3. The adjusting mechanism according to claim 2, characterized in that, The cooling flange includes multiple flanges with different thermal conductivity, and each cooling flange can be assembled with the movable flange and cooperate with the mounting flange, the locking fastener and the adjusting component.

4. The adjusting mechanism according to claim 2, characterized in that, The cooling flange includes at least two annular portions that are stacked and fixedly connected along the axial direction.

5. The adjusting mechanism according to claim 1, characterized in that, The movable flange has a first threaded hole, and the adjusting member is a threaded member that is threadedly connected to the first threaded hole, with one end of the adjusting member passing through the first threaded hole abutting against the mounting flange.

6. The adjusting mechanism according to claim 1 or 5, characterized in that, The adjusting component has a hollow structure and is sleeved on the outside of the locking fastener, and, The mounting flange has a second threaded hole. One end of the locking fastener that passes through the adjusting member is a threaded end that can be threadedly connected to the second threaded hole. The other end of the locking fastener that does not pass through the adjusting member is provided with a flange that can press against the adjusting member.

7. The adjusting mechanism according to claim 2, characterized in that, A protrusion is provided on the end face of the cooling flange that abuts against the movable flange. The protrusion extends into the flange hole of the movable flange and is fixed to the gas spray head and thermally connected.

8. The adjusting mechanism according to claim 7, characterized in that, In the circumferential direction of the cooling flange, the cooling channel extends around the protrusion, and the cooling flange is provided with a radially protruding coolant inlet connector and a coolant outlet connector, and the two ends of the cooling channel are respectively connected to the coolant inlet connector and the coolant outlet connector.

9. The adjusting mechanism according to claim 7, characterized in that, The mounting flange and the movable flange are connected by a bellows, and the gas spray head passes through the bellows; The cooling flange is provided with a purging air passage, and the gas blown out by the purging air passage enters the gap between the bellows and the gas spray head.

10. The adjusting mechanism according to claim 9, characterized in that, The purging air path includes: An air inlet connector is located on the cooling flange; An annular air passage is provided on the cooling flange and is arranged around the protrusion in the circumferential direction of the cooling flange; Multiple flow equalization holes are connected to the annular air passage and are axially opened on the cooling flange to form multiple air outlets.

11. The adjusting mechanism according to claim 1, characterized in that, The mounting flange and the movable flange are connected by a bellows, and, An annular connecting groove is provided on the end face of the mounting flange facing the movable flange, and the bellows extends into the annular connecting groove and is connected to the bottom wall of the annular connecting groove.

12. The adjusting mechanism according to claim 4, characterized in that, The annular portion includes a first annular portion and a second annular portion, and splicing grooves are provided on the joint surfaces of the first annular portion and the second annular portion. The cooling channel is formed by splicing the splicing groove on the first annular portion and the splicing groove on the second annular portion.

13. A semiconductor process apparatus, characterized in that, The device includes a reaction chamber, a gas spray head, and an adjustment mechanism for installing the gas spray head in the reaction chamber and adjusting the position of the gas spray head, wherein the adjustment mechanism is the adjustment mechanism according to any one of claims 1-12.

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