Electronic chip visual detection equipment and detection method

Abstract

The invention relates to the technical field of chip processing, in particular to electronic chip visual detection equipment and a detection method.The electronic chip visual detection equipment comprises a workbench and further comprises a distance adjusting mechanism, a supporting plate, a conveyor, a first support, an image collecting mechanism, a cleaning mechanism, a misjudgment preventing mechanism, a displayer and a computer, and the distance adjusting mechanism is fixedly connected to the upper surface of the workbench; the two supporting plates are transversely installed at the front end and the rear end of the top of the distance adjusting mechanism correspondingly. The conveyor is transversely installed on the upper surface of the supporting plate, and the electronic chips are conveyed from left to right through the conveyor. The first support is fixedly connected to the middle of the rear side of the upper surface of the workbench. The image acquisition mechanism is installed at the front end of the lower surface of the first support. The automatic feeding device is suitable for feeding electronic chips of various specifications, improves the visual detection efficiency, has an electronic chip cleaning effect, prevents detection misjudgment, regularly removes dust and maintains the CCD camera and the visual light source, improves the image definition, and further improves the detection accuracy.

Description

Technical Field

[0001] The present invention relates to the field of chip processing technology, and in particular to an electronic chip visual inspection device and an inspection method. Background Art

[0002] In the modern electronic manufacturing industry, the quality inspection of electronic chips is an important part of ensuring product performance and reliability. With the miniaturization and complexity of electronic devices, the size and structure of chips are becoming more and more precise, and the requirements for their quality inspection are also getting higher and higher. Traditional manual inspection methods are difficult to meet the needs of large-scale production due to their low efficiency and high misjudgment rate.

[0003] Existing electronic chip inspection equipment usually has the following problems in transportation, image acquisition and cleaning: 1. Insufficient adaptability of the conveying system: The conveying system of existing equipment is usually fixed and difficult to adapt to the detection requirements of chips of different specifications. This results in the need to frequently adjust the equipment when changing chip specifications, increasing the complexity and time cost of production.

[0004] 2. The image acquisition clarity is not enough: In the process of image acquisition, traditional equipment often has insufficient or uneven light source, resulting in insufficient clarity of the image taken by the CCD camera, which affects the subsequent detection accuracy.

[0005] 3. Incomplete cleaning of the chip surface: Chips are easily contaminated with dust and impurities during production and transportation. If these impurities are not removed in time, they will lead to misjudgment of visual inspection. However, the current cleaning system is inefficient and cannot effectively remove fine particles on the chip surface.

[0006] 4. Electrostatic adsorption problem: During the operation of the equipment, static electricity can cause dust to be adsorbed on key detection components, such as CCD cameras and light sources, further affecting the accuracy of detection. Summary of the invention

[0007] In order to overcome the shortcomings of the prior art that electronic chips of various specifications cannot be fed, the electronic chips cannot be cleaned, and the light source and CCD camera cannot be regularly maintained, the technical problem to be solved by the present invention is an electronic chip visual inspection device and an inspection method.

[0008] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an electronic chip visual inspection device, comprising a workbench, and also comprising a distance adjusting mechanism, a support plate, a conveyor, a first bracket, an image acquisition mechanism, a cleaning mechanism, an anti-misjudgment mechanism, a display and a computer, wherein the distance adjusting mechanism is fixedly connected to the upper surface of the workbench; there are two support plates, which are respectively transversely mounted at the front and rear ends of the top of the distance adjusting mechanism; the conveyor is transversely mounted on the upper surface of the support plate, and the electronic chip is transported from left to right by the conveyor; the first bracket is fixedly connected to the middle of the rear side of the upper surface of the workbench; the image acquisition mechanism is mounted on the front end of the lower surface of the first bracket; the cleaning mechanism is mounted in the middle of the front side of the first bracket; the anti-misjudgment mechanism is vertically mounted at the left end of the front side of the distance adjusting mechanism; the display and the computer are respectively mounted on the front and rear ends of the upper surface of the first bracket, and the display is electrically connected to the computer.

[0009] The purpose is to adjust the conveying width and realize the feeding of electronic chips of different specifications. The distance adjustment mechanism includes a base, a first motor, a first rotating shaft, an active bevel gear, a second rotating shaft, a driven bevel gear, a first gear, a guide rod, a slide, a rack and a support column. The base is fixedly connected to the upper surface of the workbench; the first motor is installed in the middle of the right side wall of the base; one end of the first rotating shaft is installed at the output end of the first motor, and the other end is connected to the left inner wall of the base through a bearing; there are two active bevel gears, which are respectively installed at the left and right ends of the outer wall of the first rotating shaft; there are two second rotating shafts, which are respectively installed at the bottom of the inner cavity of the base and can rotate around their own axes through bearings. The driven bevel gear and the first gear are respectively mounted on the upper and lower ends of the outer wall of the second rotating shaft, and the driven bevel gear is meshed with the active bevel gear. The active bevel gear can be rotated under the drive of the first motor, and the second rotating shaft is rotated under the transmission of the active bevel gear and the driven bevel gear. There are two guide rods, which are respectively mounted on the left and right ends of the inner cavity of the base along the front and back directions; there are four slides, and each group of two is respectively sleeved on the front and back ends of the outer walls of the two guide rods; a rack is mounted on the lower surface of the slide, and the rack is meshed with the first gear; one end of the support column is mounted in the middle of the upper surface of the slide, and the other end is mounted on the lower surface of the support plate.

[0010] Preferably, the two racks are respectively located on the left and right sides of the first gear.

[0011] Preferably, the purpose is to capture the image of the electronic chip, and the image capture mechanism includes a cylinder, a second bracket, a mounting plate, a CCD camera and a visual light source. The cylinder is vertically mounted on the front end of the lower surface of the first bracket; the second bracket is mounted on the output end of the cylinder; the mounting plate is mounted on the bottom end of the second bracket; the CCD camera and the visual light source are respectively mounted on the upper and lower surfaces of the mounting plate, and the CCD camera and the visual light source are electrically connected to the computer, so that the CCD camera and the visual light source can move up and down when driven by the cylinder.

[0012] Preferably, the purpose is to regularly clean the CCD camera and the visual light source to improve the detection accuracy. The cleaning mechanism includes a base, a rotating drum, a second gear, a conduit, a nozzle, a box body, a negative ion generator, a first fan, a first air outlet pipe, a second motor and a third gear. The base is installed in the middle of the front of the first bracket; the rotating drum is installed at the center of the base through a bearing so that it can rotate around its own axis; the second gear and the conduit are installed on the outer wall of the rotating drum from top to bottom; the nozzle is installed on the right end of the upper surface of the conduit; the box body is installed on the top of the outer wall of the rotating drum through a bearing; the negative ion generator is installed on the inner wall of the box body, and negative oxygen ions are generated through the negative ion generator; the first fan is installed on the right end of the upper surface of the base; one end of the first air outlet pipe is installed on the air outlet of the first fan, and the other end is connected to the top of the box body, and gas is injected into the box body through the first fan; the second motor is installed on the left end of the upper surface of the base; the third gear is installed on the output end of the second motor, and the third gear is meshed with the second gear. Under the drive of the second motor, the rotating drum can be rotated through the transmission of the third gear and the second gear, so that the conduit can drive the nozzle to move directly below the visual light source.

[0013] Preferably, a filter bag is installed at the air inlet of the first fan.

[0014] Preferably, the purpose is to remove dust from electronic chips to prevent misjudgment of detection. The anti-misjudgment mechanism includes a third bracket, a purification box, a second fan, a second air outlet pipe, an air inlet pipe and a dust suction assembly. The third bracket is vertically installed at the left end of the front side of the base; the purification box and the second fan are respectively installed at the front and rear ends of the upper surface of the third bracket, and filtered water is stored in the purification box; one end of the second air outlet pipe is installed at the air outlet of the second fan, and the other end extends to the bottom of the inner cavity of the purification box; one end of the air inlet pipe is installed at the air inlet of the second fan; and the dust suction assembly is installed at the other end of the air inlet pipe.

[0015] Preferably, the dust suction assembly includes a dust suction pipe, air holes and a valve core. The dust suction pipe is installed at the bottom end of the air inlet pipe in the front-to-back direction. A plurality of air holes are equidistantly provided on the lower surface of the dust suction pipe from front to back. Gas is sucked in through the air holes to take away impurities such as dust on the surface of the electronic chip. There are two valve cores, which are respectively inserted into the front and rear sides of the inner cavity of the dust suction pipe, and the bottom of the valve core is connected to the top of the support plate.

[0016] Preferably, the dust suction pipe is located at the center above the two conveyors.

[0017] A detection method of electronic chip visual detection equipment, comprising the following steps: Step 1: The first motor drives the first rotating shaft to rotate, and under the transmission of the active bevel gear and the driven bevel gear, the second rotating shaft drives the first gear to rotate clockwise or counterclockwise, so that the two racks move in the opposite direction, and the two slides move outward or inward at the same time, so that the distance between the two support plates becomes larger or smaller, and the conveying width of the conveyor is adjusted, which is suitable for the conveying of electronic chips of different specifications for visual inspection; Step 2: As the support plate moves, the two valve cores also move outward or inward at the same time, and the number of air holes connected to the dust suction pipe increases or decreases, and the dust suction width is changed according to the area of ​​the electronic chip; When the electronic chip passes through the dust collection pipe, the second fan is started to form a negative pressure state in the dust collection pipe, and impurities such as dust on the electronic chip are sucked into the air holes, and the gas carrying dust is discharged from the bottom opening of the second air outlet pipe. The filtered water in the purification box absorbs the dust and purifies the gas, thereby cleaning the surface of the electronic chip and preventing blind spots from appearing when taking photos of the electronic chip. Step 3: When the electronic chip passes directly under the visual light source, the visual light source illuminates the electronic chip, and the CCD camera takes a picture and transmits it to the computer. The computer analyzes the image, detects the electronic chip pins, scratches, welding quality, etc., and displays it on the monitor; Step 4. When the CCD camera and the visual light source need to be dusted, the third gear is driven to rotate by the second motor. Under the transmission of the third gear and the second gear, the rotating drum drives the conduit to rotate until the nozzle reaches directly below the visual light source. The first fan delivers gas into the box body. At this time, the negative ion generator generates negative oxygen ions. The gas carries the negative oxygen ions into the conduit, and the nozzle blows toward the CCD camera and the visual light source. The negative oxygen ions neutralize the charged particles on the luminous surface of the CCD camera lens and the visual light source, remove excess electrons, and blow away the dust at the same time to maintain the clarity of the CCD camera and the brightness of the visual light source.

[0018] Compared with the prior art, the present invention has the following beneficial effects: 1. Under the drive of the first motor, the present invention can drive the first gear to rotate clockwise or counterclockwise through the transmission of the active bevel gear and the driven bevel gear, so that the two racks move in the opposite direction. At the same time, the two slides drive the support plates to move outward or inward at the same time, and the distance between the two conveyors increases or decreases, and the conveying width is adjusted. It is suitable for feeding electronic chips of various specifications and improving the efficiency of visual inspection.

[0019] 2. The valve core of the present invention moves with the support plate, and the number of air holes that are open is changed according to the size of the electronic chip. Under the suction force of the second fan, negative pressure is formed in the dust suction pipe. The air holes suck away dust on the surface of the electronic chip and discharge it through the second air outlet pipe. The filtered water adsorbs dust in the gas, which has the effect of cleaning the electronic chip and preventing misjudgment of detection.

[0020] 3. Under the drive of the first motor, the present invention can drive the conduit to rotate through the second gear and the third gear, so that the nozzle reaches directly below the visual light source. The first fan transports gas into the box body under its own suction, and the negative ion generator produces negative oxygen ions. The gas carries the negative oxygen ions into the conduit, and the nozzle blows air toward the CCD camera and the visual light source. First, the negative oxygen ions neutralize the positively charged electrons on the surface of the CCD camera and the visual light source, and second, the dust is blown away. The CCD camera and the visual light source are regularly dust-removed and maintained, which improves image clarity and thus improves detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a top view cross-sectional view of the distance adjustment mechanism of the present invention; Figure 3 It is a left side cross-sectional view of the distance adjustment mechanism of the present invention; Figure 4 It is a structural schematic diagram of the image acquisition mechanism of the present invention; Figure 5 This is a schematic diagram of the cleaning mechanism structure of the present invention; Figure 6 It is a front cross-sectional view of the cleaning mechanism of the present invention; Figure 7 This is a schematic diagram of the structure of the anti-misjudgment mechanism of the present invention; Figure 8 It is a left side cross-sectional view of the purification box of the present invention; Fig. 9 It is a right side cross-sectional view of the dust collection assembly of the present invention.

[0022] In the figure: 1, workbench; 2, distance adjustment mechanism; 3, support plate; 4, conveyor; 5, first bracket; 6, image acquisition mechanism; 7, cleaning mechanism; 8, anti-misjudgment mechanism; 9, display; 10, computer; 21, base; 22, first motor; 23, first rotating shaft; 24, active bevel gear; 25, second rotating shaft; 26, driven bevel gear; 27, first gear; 28, guide rod; 29, slide; 210, rack; 211, support column; 61, cylinder; 62, second bracket; 63 , mounting plate; 64, CCD camera; 65, visual light source; 71, base; 72, rotating drum; 73, second gear; 74, conduit; 75, nozzle; 76, box body; 77, negative ion generator; 78, first fan; 79, first air outlet pipe; 710, second motor; 711, third gear; 81, third bracket; 82, purification box; 83, second fan; 84, second air outlet pipe; 85, air inlet pipe; 86, dust suction assembly; 861, dust suction pipe; 862, air hole; 863, valve core. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] The present invention provides a technical solution: an electronic chip visual inspection device, such as Figure 1-9 As shown, it includes a workbench 1, a distance adjusting mechanism 2 is fixedly connected to the upper surface of the workbench 1, support plates 3 are installed at the front and rear ends of the top of the distance adjusting mechanism 2 along the left and right directions, the top of the support plate 3 is installed on the conveyor 4, and the electronic chip is conveyed from left to right by the conveyor 4, and an anti-misjudgment mechanism 8 is installed at the left end of the front side of the workbench 1, and dust and other impurities on the surface of the electronic chip are removed by the anti-misjudgment mechanism 8 to prevent the surface of the electronic chip from being blocked, a first bracket 5 is vertically fixedly connected to the middle of the rear side of the upper surface of the workbench 1, an image acquisition mechanism 6 is vertically installed at the front end of the lower surface of the first bracket 5, and the surface image of the electronic chip is collected by the image acquisition mechanism 6, a cleaning mechanism 7 is installed in the middle of the front side of the first bracket 5, and a display 9 and a computer 10 are respectively installed at the front and rear ends of the upper surface of the first bracket 5, and the display 9 is electrically connected to the computer 10.

[0025] As a preferred solution, further, the pitch adjustment mechanism 2 includes a base 21 fixedly connected to the upper surface of the workbench 1, a first motor 22 is installed in the middle of the right side wall of the base 21, one end of the first rotating shaft 23 is installed at the output end of the first motor 22, the other end of the first rotating shaft 23 is connected to the left inner wall of the base 21 through a bearing, and the left and right ends of the outer wall of the first rotating shaft 23 are both installed with active bevel gears 24 with the same direction, and the left and right ends of the bottom of the inner cavity of the base 21 are both installed with a second rotating shaft 25 that can rotate around its own axis through bearings, and the upper and lower ends of the outer wall of the second rotating shaft 25 are respectively installed with a driven bevel gear 26 and a first gear 27, and the driven bevel gear 26 and the active bevel gear 2 4 meshing connection, under the drive of the first motor 22, the second rotating shaft 25 can be rotated through the transmission of the active bevel gear 24 and the driven bevel gear 26, the left and right sides of the inner cavity of the base 21 are both installed with guide rods 28 along the front and rear directions, the front and rear ends of the outer wall of the guide rod 28 are sleeved with slides 29, the upper and lower ends of the slide 29 are respectively installed with support columns 211 and racks 210, and the racks 210 are meshingly connected with the first gear 27, the top of the support column 211 is connected to the lower surface of the support plate 3, and the two racks 210 are respectively located on the left and right sides of the first gear 27. When the first gear 27 rotates, the two racks 210 can move in the opposite direction, so that the two slides 29 can gradually approach or move away; The first rotating shaft 23 is driven to rotate by the first motor 22, and the second rotating shaft 25 drives the first gear 27 to rotate clockwise or counterclockwise under the transmission of the active bevel gear 24 and the driven bevel gear 26, so that the two racks 210 move in the opposite direction, and the two slides 29 move outward or inward at the same time, so that the distance between the two support plates 3 becomes larger or smaller, and the conveying width of the conveyor 4 is adjusted, which is suitable for the conveying of electronic chips of different specifications for visual inspection.

[0026] As a preferred solution, further, the image acquisition mechanism 6 includes a cylinder 61 vertically mounted on the front end of the lower surface of the first bracket 5, a second bracket 62 is mounted on the output end of the cylinder 61, a mounting plate 63 is mounted on the bottom of the second bracket 62, a CCD camera 64 and a visual light source 65 are mounted on the upper and lower surfaces of the mounting plate 63, respectively, and the CCD camera 64 and the visual light source 65 are electrically connected to the computer 10, the CCD camera 64 and the visual light source 65 are raised or lowered by the cylinder 61, the visual light source 65 illuminates the electronic chip, improves the brightness of the CCD camera 64 when taking pictures, and makes the image clearer, and the computer 10 analyzes the image to detect the electronic chip pins, scratches, welding quality, etc.; When the electronic chip passes directly under the visual light source 65, the visual light source 65 emits light to illuminate the electronic chip, and at the same time, the CCD camera 64 takes a picture and transmits it to the computer 10. The computer 10 analyzes the image, detects the electronic chip pins, scratches, welding quality, etc., and displays them on the display 9.

[0027] As a preferred embodiment, further, the cleaning mechanism 7 includes a base 71 installed in the middle of the front side of the first bracket 5, a rotating drum 72 capable of rotating around its own axis is installed at the center of the base 71 through a bearing, a second gear 73 and a conduit 74 are installed on the outer wall of the rotating drum 72 from top to bottom, a nozzle 75 is installed on the right end of the upper surface of the conduit 74, the nozzle 75 sprays gas upward to blow away the dust on the surface of the CCD camera 64 and the visual light source 65, a box body 76 is installed on the top of the outer wall of the rotating drum 72 through a bearing, a negative ion generator 77 is installed on the inner wall of the box body 76, negative oxygen ions are generated by the negative ion generator 77, and the negative oxygen ions are used to neutralize the surface of the CCD camera 64 and the visual light source 65 Positively charged electrons prevent dust from gathering. A first fan 78 is installed at the right end of the upper surface of the base 71. The air outlet of the first fan 78 is installed with one end of a first air outlet pipe 79. The other end of the first air outlet pipe 79 is connected to the top of the box body 76. The gas is released into the box body 76 through the first fan 78. A filter bag is installed at the air inlet of the first fan 78 to prevent dust from being sucked in. A second motor 710 is installed at the left end of the upper surface of the base 71. A third gear 711 meshing with the second gear 73 is installed at the output end of the second motor 710. Under the drive of the second motor 710, the second gear 73 and the third gear 711 can be driven to rotate the drum 72, so that the nozzle 75 moves to the bottom of the visual light source 65. When the CCD camera 64 and the visual light source 65 need to be dusted, the third gear 711 is driven to rotate by the second motor 710. Under the transmission of the third gear 711 and the second gear 73, the rotating drum 72 drives the conduit 74 to rotate until the nozzle 75 reaches directly below the visual light source 65. The first fan 78 transports gas into the box body 76. At this time, the negative ion generator 77 generates negative oxygen ions, and the gas carries the negative oxygen ions into the conduit 74. The nozzle 75 blows air toward the CCD camera 64 and the visual light source 65. The negative oxygen ions neutralize the charged particles on the lens of the CCD camera 64 and the luminous surface of the visual light source 65, remove excess electrons, and blow away the dust at the same time, so as to maintain the clarity of the CCD camera 64 and the brightness of the visual light source 65.

[0028] As a preferred solution, further, the anti-misjudgment mechanism 8 includes a third bracket 81 vertically installed at the left end of the front face of the base 21, and a purification box 82 and a second fan 83 are respectively installed at the front and rear ends of the upper surface of the third bracket 81. The top of the purification box 82 is connected to the air outlet of the second fan 83 through a second air outlet pipe 84, and the second air outlet pipe 84 extends to the bottom of the inner cavity of the purification box 82. The purification box 82 is filled with filtered water. The second fan 83 discharges the inhaled gas into the filtered water, and absorbs impurities in the gas through the filtered water. The air inlet of the second fan 83 is installed with one end of an air inlet pipe 85, and the other end of the air inlet pipe 85 is installed with a dust collection component 86; The dust suction assembly 86 includes a dust suction pipe 861 installed at the bottom end of the air inlet pipe 85. A plurality of air holes 862 are opened at equal intervals from front to back on the lower surface of the dust suction pipe 861. The dust suction pipe 861 is located directly above the two support plates 3 to ensure that the air holes 862 can suck away dust and other impurities on the surface of the electronic chip passing by. A valve core 863 is installed on both the front and rear sides of the inner cavity of the dust suction pipe 861, and the bottom end of the valve core 863 is connected to the upper surface of the support plate 3. When the support plate 3 moves inward or outward, the air holes 862 opened by the valve core 863 decrease or increase, and the dust suction area is changed according to the width of the electronic chip with detection. As the support plate 3 moves, the two valve cores 863 also move outward or inward at the same time, and the number of air holes 862 connected to the dust suction pipe 861 increases or decreases, and the dust suction width is changed according to the area of ​​the electronic chip; When the electronic chip passes through the dust suction pipe 861, the second fan 83 is started to form a negative pressure state in the dust suction pipe 861, and the dust and other impurities on the electronic chip are sucked into the air hole 862, and the gas carrying dust is discharged from the bottom opening of the second air outlet pipe 84. The filtered water in the purification box 82 absorbs the dust and purifies the gas, thereby cleaning the surface of the electronic chip and preventing blind spots from occurring when taking pictures of the electronic chip.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electronic chip visual inspection device, comprising a workbench (1), characterized in that: Also includes: A distance adjustment mechanism (2) fixedly connected to the upper surface of the workbench (1); Two support plates (3) are installed transversely at the front and rear ends of the top of the distance adjustment mechanism (2); A conveyor (4) is installed transversely on the upper surface of the support plate (3), and the electronic chips are transported from left to right via the conveyor (4); A first bracket (5) fixedly connected to the middle portion of the rear side of the upper surface of the workbench (1); An image acquisition mechanism (6) mounted on the front end of the lower surface of the first bracket (5); A cleaning mechanism (7) mounted on the middle portion of the front side of the first bracket (5); An anti-misjudgment mechanism (8) is vertically mounted on the left end of the front side of the distance adjustment mechanism (2); A display (9) and a computer (10) are respectively mounted on the front and rear ends of the upper surface of the first bracket (5), and the display (9) and the computer (10) are electrically connected; The distance adjustment mechanism (2) comprises: A base (21) fixedly connected to the upper surface of the workbench (1); A first motor (22) is mounted on the middle portion of the right side wall of the base (21); A first rotating shaft (23), one end of which is mounted on the output end of the first motor (22), and the other end of which is connected to the left inner wall of the base (21) via a bearing; Two active bevel gears (24) are respectively mounted on the left and right ends of the outer wall of the first rotating shaft (23); There are two second rotating shafts (25), which are respectively mounted at the left and right ends of the bottom of the inner cavity of the base (21) via bearings and can rotate around their own axes; A driven bevel gear (26) and a first gear (27) are respectively mounted on the upper and lower ends of the outer wall of the second rotating shaft (25), and the driven bevel gear (26) is meshingly connected with the driving bevel gear (24), and the driving bevel gear (24) can be rotated under the drive of the first motor (22), and the second rotating shaft (25) can be rotated under the transmission of the driving bevel gear (24) and the driven bevel gear (26); Two guide rods (28) are installed at left and right ends of the inner cavity of the base (21) along the front-rear direction respectively; Four slide seats (29), two in each group, are respectively sleeved on the front and rear ends of the outer walls of the two guide rods (28); A rack (210) is mounted on the lower surface of the slide seat (29), and the rack (210) is meshingly connected with the first gear (27); A support column (211) has one end mounted on the middle portion of the upper surface of the slide seat (29) and the other end mounted on the lower surface of the support plate (3).

2. The electronic chip visual inspection device according to claim 1, characterized in that: The two racks (210) are respectively located on the left and right sides of the first gear (27).

3. The electronic chip visual inspection device according to claim 2, characterized in that: The image acquisition mechanism (6) comprises: A cylinder (61) vertically mounted on the front end of the lower surface of the first bracket (5); A second bracket (62) mounted on the output end of the cylinder (61); A mounting plate (63) mounted on the bottom end of the second bracket (62); A CCD camera (64) and a visual light source (65) are respectively mounted on the upper and lower surfaces of the mounting plate (63), and both the CCD camera (64) and the visual light source (65) are electrically connected to the computer (10), and can move up and down when driven by the cylinder (61).

4. The electronic chip visual inspection device according to claim 3, characterized in that: The cleaning mechanism (7) comprises: A base (71) mounted on the middle of the front side of the first bracket (5); A rotating drum (72) is mounted at the center of the base (71) via a bearing so as to be rotatable about its own axis; A second gear (73) and a guide tube (74) are mounted on the outer wall of the rotating drum (72) from top to bottom; A nozzle (75) is mounted on the right end of the upper surface of the conduit (74); A box body (76) is mounted on the top of the outer wall of the rotating drum (72) via a bearing; A negative ion generator (77) is installed on the inner wall of the box body (76), and negative oxygen ions are generated by the negative ion generator (77); A first fan (78) mounted on the right end of the upper surface of the base (71); A first air outlet pipe (79), one end of which is mounted on the air outlet of the first fan (78), and the other end of which is connected to the top of the box body (76), and injects gas into the box body (76) through the first fan (78); A second motor (710) is mounted on the left end of the upper surface of the base (71); The third gear (711) is mounted on the output end of the second motor (710), and the third gear (711) is meshingly connected with the second gear (73). When driven by the second motor (710), the third gear (711) and the second gear (73) are driven to rotate the rotating drum (72), so that the conduit (74) can drive the nozzle (75) to move to the position directly below the visual light source (65).

5. The electronic chip visual inspection device according to claim 4, characterized in that: A filter bag is installed at the air inlet of the first fan (78).

6. The electronic chip visual inspection device according to claim 5, characterized in that: The anti-misjudgment mechanism (8) comprises: A third bracket (81) is vertically mounted on the left end of the front side of the base (21); The purification box (82) and the second fan (83) are respectively mounted on the front and rear ends of the upper surface of the third bracket (81); filtered water is stored in the purification box (82); A second air outlet pipe (84), one end of which is mounted on the air outlet of the second fan (83), and the other end of which extends to the bottom of the inner cavity of the purification box (82); An air inlet pipe (85), one end of which is mounted on an air inlet of the second fan (83); A dust collection assembly (86) is installed at the other end of the air inlet pipe (85).

7. The electronic chip visual inspection device according to claim 6, characterized in that: The dust collection component (86) comprises: A dust suction pipe (861) is installed at the bottom end of the air inlet pipe (85) along the front-to-back direction. A plurality of air holes (862) are provided on the lower surface of the dust suction pipe (861) at equal intervals from front to back. Air is sucked in through the air holes (862) to remove dust and other impurities on the surface of the electronic chip. There are two valve cores (863) which are respectively inserted into the front and rear sides of the inner cavity of the dust suction pipe (861), and the bottom of the valve core (863) is connected to the top of the support plate (3).

8. The electronic chip visual inspection device according to claim 7, characterized in that: The dust suction pipe (861) is located at the center above the two conveyors (4).

9. An electronic chip visual inspection method, applied to an electronic chip visual inspection device as claimed in claim 8, characterized in that: The following steps are involved: Step 1: The first rotating shaft (23) is driven to rotate by the first motor (22), and the second rotating shaft (25) drives the first gear (27) to rotate clockwise or counterclockwise under the transmission of the active bevel gear (24) and the driven bevel gear (26), thereby causing the two racks (210) to move in the opposite direction, and the two slides (29) to move outward or inward at the same time, thereby increasing or decreasing the distance between the two support plates (3), adjusting the conveying width of the conveyor (4), and being suitable for conveying electronic chips of different specifications for visual inspection; Step 2: As the support plate (3) moves, the two valve cores (863) also move outward or inward at the same time, and the number of air holes (862) connected to the dust suction pipe (861) increases or decreases, thereby changing the dust suction width according to the area of ​​the electronic chip; When the electronic chip passes through the dust suction pipe (861), the second fan (83) is started to form a negative pressure state in the dust suction pipe (861), and impurities such as dust on the electronic chip are sucked into the air hole (862), and the gas carrying dust is discharged from the bottom opening of the second air outlet pipe (84). The filtered water in the purification box (82) absorbs the dust and purifies the gas, thereby cleaning the surface of the electronic chip and preventing blind spots from occurring when taking photos of the electronic chip; Step 3, when the electronic chip passes directly under the visual light source (65), the visual light source (65) emits light to illuminate the electronic chip, and at the same time, the CCD camera (64) takes a picture and transmits it to the computer (10). The computer (10) analyzes the image, detects the pins, scratches, welding quality, etc. of the electronic chip, and displays it on the display (9); Step 4: When the CCD camera (64) and the visual light source (65) need to be dusted, the third gear (711) is driven to rotate by the second motor (710). Under the transmission of the third gear (711) and the second gear (73), the rotating drum (72) drives the conduit (74) to rotate until the nozzle (75) reaches directly below the visual light source (65). The first fan (78) delivers gas into the box body (76). At this time, the negative ion generator (77) generates negative oxygen ions. The gas carries the negative oxygen ions into the conduit (74). The nozzle (75) blows air toward the CCD camera (64) and the visual light source (65). The negative oxygen ions neutralize the charged particles on the lens of the CCD camera (64) and the luminous surface of the visual light source (65), remove excess electrons, and blow away dust at the same time, thereby maintaining the clarity of the CCD camera (64) and the brightness of the visual light source (65).

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