Feedthrough and electronic device

Abstract

The invention provides a feed-through piece and electronic equipment, and relates to the technical field of communication, and the feed-through piece comprises an airtight cavity which is enclosed and sealed by a housing and a bottom plate; the optical module is arranged on one side, inside the airtight cavity, of the bottom plate, the optical module comprises an electric signal processor, an optical transmitter and an optical receiver, and the optical module is used for converting an optical signal into an electric signal and / or converting the electric signal into the optical signal; the optical interface is arranged on one side, outside the airtight cavity, of the shell, and the optical interface is in optical connection with the optical transmitter and the optical receiver; the electrical interface is arranged on one side, outside the airtight cavity, of the bottom plate, and the electrical interface is electrically connected with the electrical signal processor through the bottom plate. According to the feed-through piece provided by the invention, the airtight cavity is adopted to package the optical module, an electric signal in vacuum can be converted into an optical signal, the optical signal is transmitted out through the optical interface, and system integration and miniaturization can be realized in vacuum feed-through and long-distance data transmission.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and more particularly, to a feed-through and an electronic device. Background Art

[0002] Feedthrough is a device that enables interconnection between different systems. For example, feedthrough can connect vacuum and non-vacuum environments, playing the role of sealing and isolating environmental differences and signal connection. Feedthrough can be used in aviation, vacuum systems, semiconductor equipment and other fields.

[0003] For example, in the electron microscope or medical field, the requirements for imaging accuracy and real-time performance are constantly increasing, which leads to the continuous increase in the bandwidth and rate of data transmission required. The transmission loss of optical signals is significantly lower than that of electrical signals, showing great advantages in long-distance and high-speed transmission. Therefore, it is often necessary to convert the high-speed electrical signals in the equipment into optical signals for transmission.

[0004] The traditional solution combines vacuum electrical feedthrough, interface conversion and electro-optical conversion. The traditional feedthrough uses a single-core RF electrical interface to transmit electrical signals, while the optical module that converts electrical signals into optical signals uses other types of interfaces. Therefore, the interface type often needs to be converted during the vacuum electrical feedthrough and opto-electrical conversion process, which is not conducive to system integration and miniaturization.

[0005] Therefore, how to achieve system integration and miniaturization in vacuum feedthrough and long-distance data transmission is an urgent problem to be solved. Summary of the invention

[0006] The present application provides a feedthrough and an electronic device, which can achieve system integration and miniaturization in vacuum feedthrough and long-distance data transmission.

[0007] In a first aspect, a feedthrough is provided, comprising: an airtight cavity enclosed and sealed by a shell and a base plate; an optical module, which is arranged on a side of the base plate inside the airtight cavity, the optical module comprising an electrical signal processor, an optical transmitter (transmitting optical sub-assembly, TOSA) and an optical receiver (receiving optical sub-assembly, ROSA), and the optical module is used to convert an optical signal into an electrical signal and / or convert an electrical signal into an optical signal; an optical interface, which is arranged on a side of the shell outside the airtight cavity, the optical interface is optically connected to the optical transmitter and the optical receiver; an electrical interface, which is arranged on a side of the base plate outside the airtight cavity, the electrical interface is electrically connected to the electrical signal processor through the base plate.

[0008] In the embodiment of the present application, a sealed optical module is integrated in the airtight cavity, and the airtight cavity is integrated on the feed-through, which can convert the electrical signal in the vacuum into an optical signal, and transmit the optical signal through the optical interface, or receive the optical signal through the optical interface, and convert the optical signal into an electrical signal and transmit it into the vacuum environment. When the feed-through is connected to the device to be fed through, the airtight cavity can seal the device to be fed through, thereby helping to achieve the vacuum environment of the device to be fed through and maintain the vacuum degree. Therefore, the feed-through provided by the embodiment of the present application can simultaneously realize electro-optical conversion and vacuum sealing. On the other hand, compared with the solution combining vacuum electric feed-through, interface conversion and electro-optical conversion, the embodiment of the present application can complete vacuum feed-through and electro-optical conversion in one step, without the need for additional interface conversion, so that system integration and miniaturization can be realized in the scenario of vacuum feed-through and long-distance data transmission. In addition, since no additional interface conversion is required, the number of transfers of the electrical signal is reduced, which helps to improve the signal quality.

[0009] In combination with the first aspect, in some implementations of the first aspect, the feedthrough further includes: a heat dissipation portion extending from the housing toward the interior of the airtight cavity to the electrical signal processor.

[0010] The feedthrough provided in the embodiment of the present application may further include a heat dissipation portion, which provides a heat dissipation path for the electrical signal processor in the optical module, prevents components inside the feedthrough from overheating, and ensures the normal operation of the feedthrough.

[0011] In combination with the first aspect, in some implementations of the first aspect, a first through hole is provided on the housing at a position corresponding to the optical interface, and a lens is provided in the first through hole.

[0012] The feedthrough provided in the embodiment of the present application can provide a transmission path for the optical connection between the optical interface and the optical transmitter and the optical receiver by setting the first through hole and the lens, so that the feedthrough can input or output optical signals.

[0013] In combination with the first aspect, in some implementations of the first aspect, the electrical signal processor includes a clock and data recovery chip (CDR), and the CDR is electrically connected to the optical transmitter and the optical receiver respectively.

[0014] The feedthrough provided in the embodiment of the present application may include a CDR. Using the CDR to relay electrical signals can improve the signal quality of the feedthrough performing optical-to-electrical conversion or electrical-to-optical conversion.

[0015] In combination with the first aspect, in some implementations of the first aspect, the base plate is manufactured by a sintering process.

[0016] The bottom plate of the embodiment of the present application can be made by a sintering process, thereby improving the hardness of the outer side of the airtight cavity and the sealing of the airtight cavity. When the feedthrough is connected to the device to be fed through, the airtight cavity can seal the device to be fed through, thereby reducing the difficulty of achieving and maintaining a vacuum degree in the device to be fed through.

[0017] In combination with the first aspect, in some implementations of the first aspect, the base plate is connected to the shell by gluing.

[0018] The airtight cavity formed by the bottom plate and the housing is well sealed by adhesive connection. On the one hand, the well-sealed airtight cavity can protect the optical path of the optical transmitter and the optical receiver from the influence of particles such as dust, thereby improving the quality of the optical signal. On the other hand, when the feedthrough is connected to the device to be fed through, the well-sealed airtight cavity can serve as a buffer layer to reduce the difficulty of achieving and maintaining the vacuum degree in the device to be fed through.

[0019] In combination with the first aspect, in certain implementations of the first aspect, the feedthrough also includes: an optical interface base, the optical interface base is fixed to the outside of the shell, the optical interface base is provided with a second through hole, and the optical interface part is provided inside the second through hole.

[0020] The feed-through provided in the embodiment of the present application may also include an optical interface base, which can make the optical interface more firmly connected to the outside of the airtight cavity, not easy to shake, and make it easy for the optical interface to connect to other external components, thereby improving the durability of the feed-through. In addition, the optical interface portion is arranged inside the second through hole, that is, the height of the optical interface is higher than the optical interface base, so that the feed-through is easy to connect to other external components.

[0021] In combination with the first aspect, in certain implementations of the first aspect, the optical interface includes an optical fiber, a ceramic ferrule, and a sleeve arranged in sequence from inside to outside, wherein the sleeve is partially arranged inside the second through hole.

[0022] The optical interface provided in the embodiment of the present application may be in the form of a fiber optic interface connector, which facilitates the insertion of other external components into the optical interface and improves the versatility of the feed-through.

[0023] In combination with the first aspect, in some implementations of the first aspect, the optical interface includes an optical cable extending to the outside of the housing.

[0024] The optical interface provided in the embodiment of the present application includes an optical cable, which can be inserted into other interfaces, thereby improving the adaptability of the feed-through component.

[0025] In combination with the first aspect, in some implementations of the first aspect, the feedthrough further includes: an electrical interface base, the electrical interface base is fixed to the outer side of the bottom plate, and the electrical interface base is sintered integrally with the electrical interface.

[0026] The electrical interface base provided in the embodiment of the present application can be sintered integrally with the electrical interface, thereby improving the sealing of the feed-through component. When the feed-through component is connected to the device to be fed-through, the vacuum environment of the device to be fed-through can be protected from being less affected by the outside world, thereby reducing the difficulty of achieving and maintaining a vacuum degree in the device to be fed-through.

[0027] In combination with the first aspect, in some implementations of the first aspect, the electrical interface includes a universal connector.

[0028] The electrical interface provided in the embodiment of the present application may include a universal connector, thereby improving the adaptability of the feed-through.

[0029] In combination with the first aspect, in some implementations of the first aspect, the electrical interface includes an electrical cable extending to the outside of the base plate.

[0030] The electrical interface provided in the embodiment of the present application includes an electrical cable, which can be inserted into other interfaces, thereby improving the adaptability of the feed-through component.

[0031] In a second aspect, an embodiment of the present application provides an electronic device, comprising a feedthrough according to the first aspect or any possible implementation of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a schematic block diagram of a feedthrough.

[0033] Figure 2 It is a schematic diagram of a feed-through provided in an embodiment of the present application.

[0034] Figure 3 It is a schematic block diagram of an optical module provided in an embodiment of the present application.

[0035] Figure 4 It is a schematic diagram of another feed-through provided in an embodiment of the present application.

[0036] Figure 5 It is a schematic diagram of another feed-through provided in an embodiment of the present application.

[0037] Figure 6 Schematic diagram of another feed-through provided in an embodiment of the present application. DETAILED DESCRIPTION

[0038] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0039] The present application will present various aspects, embodiments or features around a system that may include multiple devices, components, modules, etc. It should be understood and appreciated that each system may include additional devices, components, modules, etc., and / or may not include all of the devices, components, modules, etc. discussed in conjunction with the figures. In addition, combinations of these schemes may also be used.

[0040] In addition, in the embodiments of the present application, words such as "exemplary" and "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present concepts in a concrete way.

[0041] The business scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Ordinary technicians in this field can know that with the emergence of new business scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0042] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0043] Figure 1 It is a schematic block diagram of a feedthrough. The feedthrough 100 may include an electrically connected interface 110, a main body 120, and an interface 130. For example, the main body 120 may be sealedly connected to the device to be fed through, and the interface 110 may receive an electrical signal from a vacuum environment in the device to be fed through, and the electrical signal is transmitted to the outside of the device to be fed through through the interface 130.

[0044] However, the interface 130 often uses a radio frequency single-core electrical interface, while the optical module that converts the electrical signal into an optical signal uses other types of interfaces. Therefore, the interface type often needs to be converted during the vacuum electrical feedthrough and photoelectric conversion process, which is not conducive to system integration and miniaturization. On the other hand, if an optical module is added inside the device to be fed through, since the internal environment of the device to be fed through is a vacuum, the cleanliness and vacuum requirements are relatively high, which increases the design difficulty of the optical module and the device to be fed through.

[0045] The feed-through 100 may also be referred to as a homogeneous feed-through because the types of signals transmitted on both sides of the feed-through 100 are both electrical signals.

[0046] Figure 2 is a schematic diagram of a feedthrough 200 provided in an embodiment of the present application. In some embodiments, the feedthrough 200 is substantially a cylinder. Figure 2 It can be regarded as a longitudinal cross-section of a cylinder.

[0047] The feedthrough 200 includes: an airtight cavity 210 enclosed and sealed by a housing 211 and a bottom plate 212; an optical module 220, which is disposed on one side of the bottom plate 212 inside the airtight cavity 210, and includes an electrical signal processor 221, an optical transmitter 222 (transmitting optical sub-assembly, TOSA) and an optical receiver 223 (receiving optical sub-assembly, ROSA), the optical module 220 is used to convert optical signals into electrical signals and / or convert electrical signals into optical signals; an optical interface 230, the optical interface 230 is arranged on a side of the shell 211 outside the airtight cavity 210, and the optical interface 230 is optically connected to the optical transmitter 222 and the optical receiver 223; an electrical interface 240, the electrical interface 240 is arranged on a side of the base plate 212 outside the airtight cavity 210, and the electrical interface 240 is electrically connected to the electrical signal processor 221 through the base plate 212.

[0048] The housing 211 may be made of stainless steel. The present application does not limit the material of the housing 211, and the housing 211 may be made of other metal materials.

[0049] The bottom plate 212 may include a multilayer circuit board, and the bottom plate 212 may be made of materials such as ceramic, glass or metal. The airtight cavity 210 may be filled with an inert gas, such as argon, nitrogen, etc. Maintaining the airtightness of the airtight cavity 210 can prevent the optical module 220 and other components in the airtight cavity 210 from precipitating particles when working under low pressure. The particles may contaminate the optical path, thereby affecting the quality of the optical signal. In addition, the inert gas can prevent the metal parts in the airtight cavity 210 from degrading their performance due to oxidation.

[0050] When in use, the feedthrough 200 can be connected to the device to be fed through. For example, a mounting plate can be provided on one side of the optical interface 230, and the mounting plate and the flange of the device to be fed through can be fixed and sealed by welding or O-ring screw transfer, thereby achieving the connection between the feedthrough 200 and the device to be fed through.

[0051] In some embodiments, the thickness of the mounting plate may be smaller than the thickness of the airtight cavity 210 .

[0052] The feedthrough 200 may also be referred to as a heterogeneous feedthrough because the types of signals transmitted at two sides of the feedthrough 200 are electrical signals and optical signals, respectively.

[0053] In the embodiment of the present application, the sealed optical module 220 is integrated in the airtight cavity 210, and the airtight cavity 210 is integrated on the feed-through 200, which can convert the electrical signal in the vacuum into an optical signal, and transmit the optical signal through the optical interface 230, or receive the optical signal through the optical interface 230, and convert the optical signal into an electrical signal and transmit it into the vacuum environment. When the feed-through 200 is connected to the device to be fed through, the airtight cavity 210 can seal the device to be fed through, thereby helping to achieve the vacuum environment of the device to be fed through and maintain the vacuum degree. Therefore, the feed-through 200 provided in the embodiment of the present application can simultaneously achieve electro-optical conversion and vacuum sealing. On the other hand, compared with the solution combining vacuum electric feed-through, interface conversion and electro-optical conversion, the embodiment of the present application can complete vacuum feed-through and electro-optical conversion in one step, without the need for additional interface conversion, so that system integration and miniaturization can be achieved in the scenario of vacuum feed-through and long-distance data transmission. In addition, since no additional interface conversion is required, the number of transfers of the electrical signal is reduced, which helps to improve the signal quality.

[0054] In some embodiments, the bottom plate 212 is connected to the housing 211 by gluing.

[0055] For example, the bottom plate 212 and the housing 211 may be connected by vacuum sealant, which has a lower outgassing rate and is conducive to achieving a vacuum environment and maintaining a vacuum degree.

[0056] The airtight cavity 210 formed by the bottom plate 212 and the housing 211 has good sealing performance through adhesive connection. On the one hand, the well-sealed airtight cavity 210 can protect the optical path of the optical transmitter 222 and the optical receiver 223 from the influence of particles such as dust, thereby improving the quality of the optical signal. On the other hand, when the feedthrough 200 is connected to the device to be fed through, the well-sealed airtight cavity 210 as a buffer layer can reduce the difficulty of achieving and maintaining the vacuum degree in the device to be fed through.

[0057] The present application does not limit the sealing method between the bottom plate 212 and the shell 211 . For example, the shell 211 and the bottom plate 212 may also be connected by welding to form the airtight chamber 210 .

[0058] In some embodiments, the base plate 212 is manufactured by a sintering process.

[0059] The bottom plate 212 of the embodiment of the present application can be manufactured by a sintering process, thereby improving the hardness of the outer side of the airtight cavity 210 and the sealing of the airtight cavity 210. When the feedthrough 200 is connected to the device to be fed through, the airtight cavity 210 can seal the device to be fed through, thereby reducing the difficulty of achieving and maintaining a vacuum degree in the device to be fed through.

[0060] Pin pads may be provided on both sides of the bottom plate 212, the optical module 220 may be welded on the pin pads on the side of the bottom plate 212 close to the airtight cavity 210, and the electrical interface 230 may be welded on the side of the bottom plate 212 away from the airtight cavity 210. Circuits may be provided on the inner layer of the bottom plate 212 to realize electrical connection between various components of the optical module 220, and electrical connection between the electrical interface 230 and the optical module 220.

[0061] Figure 3 is a schematic block diagram of an optical module 220 provided in an embodiment of the present application. Figure 3 The optical module 220 may include an electrical signal processor 221, an optical transmitter 222, and an optical receiver 223, wherein the electrical signal processor 221 is communicatively connected to the optical transmitter 222 and the optical receiver 223, respectively.

[0062] The electrical signal processor 221 can receive and process electrical signals, and send the processed electrical signals to the optical transmitter 222. The optical transmitter 222 can convert the processed electrical signals into optical signals and send the optical signals. The optical receiver 223 can receive optical signals, convert the optical signals into electrical signals and send the electrical signals to the electrical signal processor 221. The electrical signal processor 221 can process the electrical signals and send them out.

[0063] In some embodiments, the electrical signal processor 221 includes a clock and data recovery chip (CDR), and the CDR is electrically connected to the optical transmitter 222 and the optical receiver 223 respectively.

[0064] As the data transmission rate increases, electrical signals are prone to distortion during transmission. CDR can be used to "relay" electrical signals and restore them to an undistorted state. For example, CDR can restore the received electrical signal and send the restored electrical signal to the optical transmitter 222.

[0065] The feedthrough 200 provided in the embodiment of the present application may include a CDR. The CDR is used to relay electrical signals, so as to improve the signal quality of the feedthrough 200 performing photoelectric conversion or electro-optical conversion.

[0066] The electrical signal processor 221 may also include devices such as a power management integrated circuit (PMIC), a microcontroller unit (MCU), or a driver and receiver chip (DRV-REV).

[0067] For example, the electrical signal may include a power signal, and the PMIC may be connected to various components of the optical module 220. The PMIC may receive the power signal and provide working power to various components of the optical module 220.

[0068] Exemplarily, the electrical signal may include a low-speed control signal, and the MCU may be connected to each component of the optical module 220. The MCU may receive the low-speed control signal, decode the low-speed control signal, and send it to each component of the optical module 220. The MCU may also encode information (such as configuration information or environmental information, etc.) of each component of the optical module 220 and send it to the device connected to the feedthrough 200 in the form of a low-speed control signal.

[0069] Exemplarily, the electrical signal may include a high-speed data signal. The high-speed data signal may be transmitted to the CDR via the electrical interface 240; the CDR may perform relay processing on the high-speed data signal and then transparently transmit it (passthrough) to the DRV-REV; the DRV-REV may increase the voltage of the high-speed data signal and transmit it to the optical transmitter 222; the optical transmitter 222 may convert the high-speed data signal into an optical signal and transmit the optical signal.

[0070] For example, optical signals often carry only high-speed data information. The optical receiver 223 can receive the optical signal, convert the optical signal into a high-speed data signal, and send the high-speed data signal to the DRV-REV; the DRV-REV can reduce the voltage of the high-speed data signal and send it to the CDR; the CDR relays the high-speed data signal and outputs it to the device connected to the feedthrough 200 through the electrical interface 240.

[0071] Figure 4 2 is a schematic diagram of another feedthrough 200 provided in an embodiment of the present application. Figure 4 The various parts of the feedthrough 200 are shown, Figure 4 Some reference numerals are omitted. Figure 2 In some embodiments, the feedthrough 200 is substantially a cylinder. Figure 4 It can be regarded as a longitudinal cross-section of a cylinder.

[0072] See also Figure 4In some embodiments, the feedthrough 200 further includes: a heat dissipation portion 213 extending from the housing 211 toward the interior of the airtight cavity 210 to the electrical signal processor 221 .

[0073] For example, the heat dissipation portion 213 may be integrally formed with the housing 211, and the heat dissipation portion 213 may contact the electrical signal processor 221. Those skilled in the art may understand that the heat dissipation portion 213 may also extend to the vicinity of the electrical signal processor 221 due to processing errors.

[0074] The electrical signal processor 221 may include multiple chips, which may be distributed in different positions. Therefore, the heat dissipation portion 213 may also be provided in multiple portions, and the multiple heat dissipation portions 213 extend from the housing 211 to the inside of the airtight cavity 210 to the multiple chips respectively.

[0075] The feedthrough 200 provided in the embodiment of the present application may further include a heat dissipation portion 213 , which provides a heat dissipation path for the electrical signal processor 221 in the optical module 220 , thereby preventing components inside the feedthrough 200 from overheating and ensuring the normal operation of the feedthrough 200 .

[0076] See also Figure 4 In some embodiments, a first through hole 214 is disposed on the housing 211 at a position corresponding to the optical interface 230 , and a lens 215 is disposed in the first through hole 214 .

[0077] For example, the lens 215 can be made of a material with good light transmittance, such as glass or plastic. The lens 215 can provide a light path, which can also be understood as providing a transmission path for the optical signal. The optical interface 230 can be optically connected to the optical transmitter 222 and the optical receiver 223 through the lens 215. In some embodiments, the lens 215 can be aligned with the optical transmitter 222 or the optical receiver 223.

[0078] The lens 212 may be installed in the first through hole 214. For example, the lens 212 may be installed in the first through hole 214 by gluing, thereby improving the sealing of the airtight cavity 210. The first through hole 214 may also be understood as marking the installation position of the lens 212.

[0079] It should be noted that Figure 4 Only one first through hole 214 and one lens 215 are shown, but those skilled in the art will appreciate that more first through holes 214 and lenses 215 may be provided to connect the optical transmitter 222 and the optical receiver 223 to the optical interface 230 .

[0080] The feedthrough 200 provided in the embodiment of the present application can provide a transmission path for the optical connection between the optical interface 230 and the optical transmitter 222 and the optical receiver 223 by setting the first through hole 214 and the lens 215, so that the feedthrough 200 can input or output optical signals.

[0081] Figure 5 Schematic diagram of another feed-through 200 provided in an embodiment of the present application. Figure 5 The feedthrough 200 shown may be used with Figure 4 and Figure 2 Combined. To describe more clearly Figure 5 The various parts of the feedthrough 200 are shown, Figure 5 Some reference numerals are omitted. Figure 2 In some embodiments, the feedthrough 200 is substantially a cylinder. Figure 5 It can be regarded as a longitudinal cross-section of a cylinder.

[0082] See also Figure 5 In some embodiments, the feed-through 200 further includes: an optical interface base 250, which is fixed to the outside of the shell 211, and the optical interface base 250 is provided with a second through hole 251, and the optical interface 230 is partially provided inside the second through hole 251.

[0083] The optical interface base 250 may be made of rubber or plastic, or may be made of metal. For example, the optical interface base 250 may include multiple layers, and the layer close to the housing 211 may be made of metal, which can improve the heat dissipation capacity of the feedthrough 200 and make the feedthrough 200 firm. The layer away from the housing 211 may be made of rubber or plastic. On the one hand, when the optical cable (also called optical fiber) is inserted into the optical interface 230, the optical cable contacts with a softer material, and the optical cable is not easily damaged; on the other hand, rubber or plastic has a certain elasticity. By setting the aperture of the second through hole 251 to be slightly smaller than the diameter of the optical interface 230, the optical interface 230 can be firmly fixed in the second through hole 251 by interference fit.

[0084] The position of the second through hole 251 corresponds to the optical transmitter 222 or the optical receiver 223 . In the embodiment where the feedthrough 200 includes the lens 215 , the second through hole 251 also corresponds to the lens 215 .

[0085] The present application does not limit the connection method between the optical interface base 250 and the airtight cavity 210. For example, the optical interface base 250 and the airtight cavity 210 may be fastened by screws. For another example, the optical interface base 250 and the airtight cavity 210 may be connected by welding. For another example, the optical interface base 250 and the airtight cavity 210 may be connected by gluing.

[0086] In some embodiments, a blind hole 252 may be provided on the housing 211, and a through-type countersunk hole 253 may be provided on the optical interface base 250. The blind hole 252 and the through-type countersunk hole 253 are arranged opposite to each other, and screws ( Figure 5 (not shown), the screw can be used to fix the optical interface base 250 and the airtight cavity 210. It should be noted that, Figure 5 Only one pair of blind holes 252 and through-type countersunk holes 253 is shown, and the feedthrough 200 may also include more pairs of blind holes 252 and through-type countersunk holes 253 to enable the optical interface base 250 to be more firmly connected to the airtight cavity 210 .

[0087] A housing 254 may also be provided outside the optical interface base 250. The housing 254 may be made of, for example, stainless steel. In some embodiments, the feedthrough 200 is substantially a cylinder, and the housing 254 is a hollow cylinder outside the optical interface base 250. Figure 5 The housing 254 shown is a schematic diagram resulting from a longitudinal cross-section of the cylinder.

[0088] The housing 254 is a hollow cylinder, and a raised or recessed stopper can be provided on the inner side of the housing 254. The optical interface base 250 is a cylinder, and a recessed or raised stopper can be provided on the outer side of the cylinder of the optical interface base 250. In this way, the housing 254 and the optical interface base 250 can be locked by the stopper. The present application does not limit the connection method between the housing 254 and the optical interface base 250, for example, the housing 254 can also be connected by screws, gluing, etc.

[0089] In an embodiment including a housing, a mounting plate may be provided around the housing. In some embodiments, the mounting plate may be integrally injection molded with the housing, or may be integrally processed in other ways. In some embodiments, the thickness of the mounting plate may be less than the thickness of the airtight cavity 210.

[0090] The feedthrough 200 provided in the embodiment of the present application may further include an optical interface base 250, which can make the optical interface 230 more firmly connected to the outside of the airtight cavity 210, making it less likely to shake, and making it easier for the optical interface 230 to connect to other external components, thereby improving the durability of the feedthrough 200. In addition, the optical interface 230 is partially disposed inside the second through hole 251, that is, the height of the optical interface 230 is higher than the optical interface base 250, making it easier for the feedthrough 200 to connect to other external components.

[0091] See also Figure 5 In some embodiments, the optical interface 230 includes an optical fiber 231 , a ceramic ferrule 232 , and a sleeve 233 which are sequentially arranged from the inside to the outside, wherein the sleeve 233 is partially arranged inside the second through hole 251 .

[0092] The sleeve 233 is partially disposed inside the second through hole 251. In other words, the sleeve 233 is exposed from above the optical interface base 250, which can also be understood as the height of the sleeve 233 is higher than the optical interface base 250, so as to facilitate the connection between the optical interface 230 and other external components.

[0093] Figure 5 The optical interface 230 shown may also be referred to as an optical fiber interface connector. The optical fiber interface connector is installed in the second through hole 251. The sleeve 223 may be made of stainless steel.

[0094] In the embodiment where the feedthrough 200 includes the lens 215 , one end of the ceramic ferrule 232 may be connected to the lens 215 , and the other end may extend into the sleeve 233 .

[0095] The sleeve 233 may be provided with a limiting portion to achieve the connection between the ceramic ferrule 232 and the sleeve 233. The present application does not limit the connection method between the ceramic ferrule 232 and the sleeve 233. For example, the ceramic ferrule 232 may also be connected to the sleeve 233 by welding.

[0096] The optical interface 250 provided in the embodiment of the present application may be in the form of a fiber optic interface connector, which facilitates the insertion of other external components into the optical interface 250 and improves the versatility of the feed-through 200 .

[0097] See also Figure 5 In some embodiments, the feedthrough 200 further includes: an electrical interface base 260 , the electrical interface base 260 is fixed to the outer side of the bottom plate 212 , and the electrical interface base 260 is sintered integrally with the electrical interface 240 .

[0098] The present application does not limit the connection method between the electrical interface base 260 and the bottom plate 212 . For example, the electrical interface base 260 may be connected to the bottom plate 212 by welding.

[0099] The electrical interface base 260 may be made of glass, ceramic, etc. The electrical interface base 260 may be integrally sintered with the electrical interface 240 at high temperature to achieve better sealing.

[0100] The electrical interface 240 may be made of alloy (such as Kovar alloy), copper or other materials, and the alloy or copper is used to facilitate sintering with the electrical interface base 260. In some embodiments, after sintering, the pins of the electrical interface 240 may be electroplated, and the electroplated pins may be welded to the base plate 212.

[0101] In some embodiments, a housing ( Figure 5 The housing is similar to the above description and will not be described in detail here.

[0102] In embodiments including a housing, the housing may be sintered integrally with the electrical interface base 260 and the electrical interface 240 .

[0103] In an embodiment including a housing, a mounting plate may be provided around the housing. In some embodiments, the mounting plate may be integrally injection molded with the housing, or may be integrally processed in other ways. In some embodiments, the thickness of the mounting plate may be less than the thickness of the airtight cavity 210.

[0104] The electrical interface base 260 provided in the embodiment of the present application can be sintered integrally with the electrical interface 240, thereby improving the sealing of the feed-through 200. When the feed-through 200 is connected to the device to be fed-through, the vacuum environment of the device to be fed-through can be protected from being less affected by the outside world, thereby reducing the difficulty of achieving and maintaining a vacuum degree in the device to be fed-through.

[0105] See also Figure 5 In some embodiments, the electrical interface 240 includes a universal connector.

[0106] For example, the universal connector may be soldered to the base plate 212 .

[0107] The electrical interface 240 provided in the embodiment of the present application may include a universal connector, thereby improving the adaptability of the feed-through 200 .

[0108] Figure 6 Schematic diagram of another feed-through 200 provided in an embodiment of the present application. Figure 6 The feedthrough 200 shown may be used with Figure 5 , Figure 4 and Figure 2 Combined. To describe more clearly Figure 6 The various parts of the feedthrough 200 are shown, Figure 6 Some reference numerals are omitted. Figure 2 .

[0109] See also Figure 6 In some embodiments, the optical interface 230 includes an optical cable 234 extending toward the outside of the housing 211 .

[0110] In the embodiment including the ceramic ferrule 232 and the sleeve 233, one end of the optical cable 234 can extend into the sleeve 233 and dock with the ceramic ferrule 232. The optical cable 234 can be connected to the sleeve 233, for example, the optical cable 234 can be connected to the sleeve 233 by welding. The other end of the optical cable 234 can be in the form of a plug or other forms of optical port interface types.

[0111] The optical interface 230 provided in the embodiment of the present application includes an optical cable 234 , which can be inserted into other interfaces, thereby improving the adaptability of the feed-through 200 .

[0112] See also Figure 6 In some embodiments, the electrical interface 240 includes an electrical cable 241 extending toward the outside of the base plate 212 .

[0113] One end of the cable 241 can be connected to the integrally sintered electrical interface to form a new electrical interface 240. For example, the cable 241 can be connected to the integrally sintered electrical interface by welding. The other end of the cable 241 can be in the form of a plug or other electrical interface types.

[0114] The electrical interface 240 provided in the embodiment of the present application includes an electrical cable 241 , which can be inserted into other interfaces, thereby improving the adaptability of the feed-through 200 .

[0115] An embodiment of the present application further provides an electronic device, comprising a feedthrough 200 and any one of the aforementioned embodiments of the feedthrough 200 .

[0116] For example, the electronic device may also include an electron microscope device, a medical device, or a feedthrough device. Since the feedthrough 200 adopts an airtight cavity design, the difficulty of achieving and maintaining a vacuum degree in the device to be fed through can be reduced.

[0117] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A feed-through, characterized in that: include: An airtight cavity enclosed and sealed by the shell and the bottom plate; An optical module, the optical module is arranged on one side of the bottom plate inside the airtight cavity, the optical module comprises an electrical signal processor, an optical transmitter and an optical receiver, and the optical module is used to convert an optical signal into an electrical signal and / or convert an electrical signal into an optical signal; An optical interface, the optical interface being disposed on one side of the housing outside the airtight cavity, the optical interface being optically connected to the optical transmitter and the optical receiver; An electrical interface is provided on one side of the bottom plate outside the airtight cavity, and the electrical interface is electrically connected to the electrical signal processor through the bottom plate.

2. The feedthrough according to claim 1, characterized in that Also includes: The heat dissipation portion extends from the housing toward the interior of the airtight cavity to the electrical signal processor.

3. The feedthrough according to claim 1 or 2, characterized in that: A first through hole is arranged on the housing at a position corresponding to the optical interface, and a lens is arranged in the first through hole.

4. The feed-through according to any one of claims 1 to 3, characterized in that: The electrical signal processor comprises a clock data recovery chip CDR, and the CDR is electrically connected to the optical transmitter and the optical receiver respectively.

5. The feed-through according to any one of claims 1 to 4, characterized in that: The bottom plate is manufactured by a sintering process.

6. The feedthrough according to any one of claims 1 to 5, characterized in that: The bottom plate is connected to the shell by gluing.

7. The feed-through according to any one of claims 1 to 6, characterized in that: Also includes: An optical interface base is fixed on the outside of the shell, the optical interface base is provided with a second through hole, and the optical interface part is arranged inside the second through hole.

8. The feedthrough according to claim 7, characterized in that The optical interface comprises an optical fiber, a ceramic ferrule and a sleeve which are sequentially arranged from the inside to the outside, wherein the sleeve is partially arranged inside the second through hole.

9. The feed-through according to any one of claims 1 to 7, characterized in that: The optical interface includes an optical cable extending toward the outside of the housing.

10. The feedthrough according to any one of claims 1 to 9, characterized in that: Also includes: An electrical interface base is fixed on the outer side of the bottom plate, and the electrical interface base is sintered integrally with the electrical interface.

11. The feed-through according to any one of claims 1 to 9, characterized in that: The electrical interface includes a universal connector.

12. The feedthrough according to any one of claims 1 to 10, characterized in that The electrical interface includes an electrical cable extending outward from the base plate.

13. An electronic device, characterized in that: The electronic device comprises a feed-through as claimed in any one of claims 1 to 12.

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