A method and system for controlling the interval temperature of a turntable type high temperature testing mechanism

Abstract

The present application relates to the technical field of chip testing, and discloses a range temperature control method and system of a turntable high temperature testing mechanism, the method comprising: obtaining a first temperature value at a first temperature measuring point in front of a chip testing station; obtaining a second temperature value at a second temperature measuring point behind the chip testing station; judging whether the second temperature value is lower than a set first temperature threshold, if lower, it is an invalid test and an early warning is issued; if not lower, calculating the difference between the first temperature value and the second temperature value as a first temperature difference; if the first temperature difference is greater than the set threshold, it is a valid test; if the first temperature difference is less than or equal to the set threshold, it is an invalid test and an early warning is issued; calculating a first average value of the first temperature difference within a first set time period; if the first average value exceeds the set first average threshold, adjusting the heating temperature of the heating disk according to the positive correlation of the first average value. The present application makes the front and rear temperatures of the chip controllable, and improves the accuracy of chip testing.

Description

Technical Field

[0001] The present application relates to the technical field of chip testing, and in particular to a temperature control method and system for a turntable high-temperature testing mechanism. Background Art

[0002] Chip testing is the last step before the chip is packaged and shipped out for sale. Each chip needs to be tested by a turntable high-temperature test mechanism before it can be packaged and sold. Before the chip is tested at the chip testing station, it needs to pass through a heating plate. The heating plate adjusts the temperature of the chip so that the chip is in a suitable temperature range from the heating plate to the small track when it is tested; from front to back in the small track, as the length of the small track and the number of contact points on the small track increase, the temperature of the chip gradually decreases. The original temperature measurement point is at the station before the test station. The temperature of the chip when it is transferred to the test station will be lower than the temperature tested at the station before the test station, but it is not certain to what extent the temperature will drop and whether it will exceed the required temperature range. Therefore, the accuracy of chip testing needs to be improved. Summary of the invention

[0003] In order to ensure that the temperature is within a set temperature range when at a test position, so as to improve the accuracy of chip testing, the present application provides a range temperature control method and system for a turntable-type high-temperature testing mechanism.

[0004] In a first aspect, the present application provides a method for controlling the interval temperature of a turntable high temperature testing mechanism, which adopts the following technical solution:

[0005] A method for controlling the interval temperature of a turntable high temperature testing mechanism comprises the following steps:

[0006] Acquire a first temperature value of a first temperature measurement point located at a first set distance in front of the chip testing station;

[0007] Acquire a second temperature value of a second temperature measuring point located at a second set distance behind the chip testing station;

[0008] Determine whether the second temperature value is lower than a set first temperature threshold value. If the second temperature value is lower than the set first temperature threshold value, determine that the current test of the chip test station is an invalid test and issue an early warning.

[0009] If the second temperature value is not lower than a set first temperature threshold, calculating the difference between the first temperature value and the second temperature value as a first temperature difference;

[0010] If the first temperature difference is greater than a set threshold, it is determined that the current test of the chip testing station is a valid test;

[0011] If the first temperature difference is less than or equal to the set threshold, the current test of the chip testing station is judged to be an invalid test, and an early warning is issued;

[0012] Calculate a first average value of the first temperature difference within a first set time period; if the first average value exceeds a set first average threshold, adjust the heating temperature of the heating plate according to the first average value; the larger the first average value, the more the heating temperature of the heating plate increases; the smaller the first average value, the less the heating temperature of the heating plate increases.

[0013] By adopting the above technical solution, a second temperature measuring point is added after the chip test station. No matter how many test stations are passed in the middle, as long as the data displayed by the second temperature measuring point at the rear end meets the temperature requirements, it can be judged that the temperature at the chip test station is within the temperature range. Since the temperature of the chip tends to decrease during transportation, by monitoring the lowest temperature value and establishing a temperature range control value, the front and rear temperatures are both in a controllable state, thereby improving the accuracy of chip testing. In addition, in order to more accurately judge the temperature of the chip, or the temperature change trend, the monitoring of the temperature difference and the average value of the temperature difference are also added, so that the heating plate can be adjusted in time to avoid frequent warnings. Therefore, it can not only ensure the accuracy of the test results, but also help to reasonably control the temperature of the chip, reduce the probability of early warnings, and improve the efficiency of chip detection.

[0014] Optionally, if the second temperature value is not lower than a set first temperature threshold, the method further includes:

[0015] Determine whether the second temperature value is higher than a set second temperature threshold, and issue an early warning if the second temperature value is higher than the set second temperature threshold;

[0016] If the second temperature value is not higher than the set second temperature threshold, calculate the second average value of the second temperature value within the second set time period; if the second average value is less than the set second average threshold, adjust the flow of the heat source located at a set distance in front of the chip testing station according to the second average value; the smaller the second average value, the greater the flow of the heat source; the larger the second average value, the smaller the flow of the heat source.

[0017] By adopting the above technical solution, the present invention can not only timely warn when the chip temperature is too low or too high, but also dynamically adjust the flow of the heat source according to the speed and trend of temperature change, thereby achieving more accurate and real-time control of the chip temperature. This further improves the accuracy and reliability of chip testing, reduces test errors caused by temperature fluctuations, and also provides a more stable temperature environment for subsequent processing and packaging of the chip.

[0018] Optionally, if the second temperature value is not lower than a set first temperature threshold, the method further includes:

[0019] Determine whether the second temperature value is higher than a set second temperature threshold, and issue an early warning if the second temperature value is higher than the set second temperature threshold;

[0020] If the second temperature value is not higher than the set second temperature threshold, calculate the second average value of the second temperature value within the second set time period; if the second average value is greater than the set second average threshold, adjust the temperature of the heat source located at a set distance in front of the chip testing station according to the second average value; the smaller the second average value, the higher the temperature of the heat source; the larger the second average value, the lower the temperature of the heat source.

[0021] By adopting the above technical solution, not only can timely warning be given when the chip temperature is too high, but the temperature of the heat source can also be dynamically adjusted according to the speed and trend of temperature change, thereby achieving more accurate and real-time control of the chip temperature. This further improves the accuracy and reliability of chip testing, reduces test errors caused by temperature fluctuations, and also provides a more stable temperature environment for subsequent processing and packaging of the chip.

[0022] Optionally, if the first average value exceeds a set first average threshold, the method further includes:

[0023] The pressure of the heating plate of the turntable high-temperature testing mechanism pressing the chip is adjusted according to the first temperature difference. The larger the first temperature difference, the greater the pressure; the smaller the first temperature difference, the smaller the pressure; the pressure is within the set range.

[0024] By adopting the above technical solution, since the chip is generally a square sheet structure, the connection tightness between the chip and the disc is improved by adjusting the pressure of the heating plate to press the chip, thereby increasing the contact area between the chip and the disc, improving the thermal conductivity, and allowing the chip to reach the temperature required for testing more quickly, thereby improving test efficiency and quality.

[0025] Optionally, if the first average value exceeds a set first average threshold, the method further includes:

[0026] The rotation speed of the heating plate where the crimping chip is located is adjusted according to the first temperature difference; the larger the first temperature difference is, the slower the rotation speed is; the smaller the first temperature difference is, the faster the rotation speed is.

[0027] By adopting the above technical solution, by adjusting the rotation speed of the heating plate, not only the residence time of the chip on the heating plate and the heat exchange efficiency are affected, but also it helps to achieve a more uniform temperature distribution, thereby improving the reliability and efficiency of the test.

[0028] Optionally, the heat source is installed at a set distance in front of the chip testing station through a rotation drive structure;

[0029] If the second temperature value is lower than the set first temperature threshold, the method further includes:

[0030] Calculating a third average value of the second temperature value within a third set time period;

[0031] Obtaining the preset direction of the chip to be tested being transported on the small track of the turntable-type high-temperature testing mechanism;

[0032] Obtaining the blowing direction of the heat source driven by the rotary drive structure;

[0033] Calculating the blowing angle between the preset direction and the blowing direction;

[0034] The rotation angle of the driving structure is adjusted according to the third average value to adjust the size of the blowing angle; the larger the third average value is, the larger the blowing angle is; the smaller the third average value is, the smaller the blowing angle is.

[0035] By adopting the above technical solution, by adjusting the blowing angle of the heat source, not only the heating effect of the heat source on the chip is affected, but also it helps to achieve a more uniform temperature distribution, thereby improving the reliability and efficiency of the test.

[0036] Optionally, if the second temperature value is higher than a set second temperature threshold, or if the first temperature difference is less than or equal to the set threshold, the method further includes:

[0037] Calculate the difference between the second temperature value and the second temperature threshold as a second temperature difference;

[0038] The flow rate of the cooling system located at a set distance in front of the chip testing station is adjusted according to the second temperature difference; the larger the second temperature difference, the larger the flow rate of the cooling system; the smaller the second temperature difference, the smaller the flow rate of the cooling system.

[0039] By adopting the above technical solution and adjusting the flow rate of the cooling system, not only the temperature of the chip is effectively controlled, but also the test failure caused by overcooling is avoided.

[0040] Optionally, the cooling system is installed at a set distance in front of the chip testing station through a rotating drive structure;

[0041] If the second temperature value is higher than a set second temperature threshold, or if the first temperature difference is less than or equal to the set threshold, the method further includes:

[0042] Calculating a fourth average value of the second temperature value within a fourth set time period;

[0043] Obtaining the preset direction of the chip to be tested being transported on the small track of the turntable-type high-temperature testing mechanism;

[0044] Acquire the blowing direction of the cooling system driven by the rotary drive structure;

[0045] Calculating the blowing angle between the preset direction and the blowing direction;

[0046] The rotation angle of the driving structure is adjusted according to the fourth average value to adjust the size of the blowing angle; the larger the fourth average value is, the smaller the blowing angle is; the smaller the fourth average value is, the larger the blowing angle is.

[0047] By adopting the above technical solution, by adjusting the flow rate and blowing angle of the cooling system, not only the temperature of the chip is effectively controlled, but also test failure or chip damage caused by excessive cooling or heating is avoided.

[0048] Optionally, a heat preservation cover is provided on the small track of the turntable-type high-temperature testing mechanism, and the chip to be tested is placed in the heat preservation cover.

[0049] By adopting the above technical solution, the temperature around the chip is kept stable during the test process, reducing the impact of the external environment on the test temperature.

[0050] In a second aspect, the present application provides a zone temperature control system of a turntable high temperature testing mechanism, which adopts the following technical solution:

[0051] A zone temperature control system for a turntable type high temperature testing mechanism comprises a processor, wherein the processor executes the steps of the zone temperature control method for a turntable type high temperature testing mechanism as described in any one of the above.

[0052] In summary, the present application includes at least one of the following beneficial technical effects: by real-time monitoring of the temperature values ​​before and after the chip test station, and dynamically adjusting according to temperature changes and preset thresholds, the present application can ensure that the temperature of the chip during the test is always within the set temperature range, thereby improving the accuracy and reliability of the test. The present application not only controls the temperature by adjusting the parameters of the heating plate, heat source and cooling system, but also introduces the flexible adjustment of the blowing angle and the setting and adjustment of the insulation cover, thereby realizing the coordinated work of multiple parameters and further improving the accuracy and stability of temperature control. When the chip temperature is abnormal, the present application can issue an alarm in time to remind the operator to take corresponding measures, thereby avoiding test failure or chip damage due to abnormal temperature, and improving the efficiency and safety of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1The present invention is a step diagram of a method for controlling the interval temperature of a turntable type high temperature testing mechanism.

[0054] Figure 2 It is a structural diagram of a turntable high temperature testing mechanism.

[0055] Figure 3 This is a step diagram of adjusting the temperature of a heat source at a set distance in front of a chip testing station according to a second average value in this embodiment.

[0056] Figure 4 4 is a step diagram for adjusting the rotation angle of the driving motor according to the third average value in this embodiment.

[0057] Figure 5 This is a step diagram of adjusting the flow rate of the cooling system at a set distance in front of the chip testing station according to the second temperature difference in this embodiment.

[0058] Figure 6 4 is a step diagram for adjusting the rotation angle of the driving motor according to the fourth average value in this embodiment.

[0059] Figure numerals: 1. Chip testing station; 2. First temperature measuring point; 3. Second temperature measuring point; 4. Small track; 5. Heating plate; 6. Fan. DETAILED DESCRIPTION

[0060] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings.

[0061] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0062] The present application embodiment discloses a zone temperature control method of a turntable type high temperature testing mechanism, referring to Figure 1 and Figure 2 , including the following steps:

[0063] Obtain a first temperature value of a first temperature measuring point 2 located at a first set distance in front of the chip testing station 1; by providing a temperature sensor at the first temperature measuring point 2 located at a first set distance in front of the chip testing station 1, the temperature of the first temperature measuring point 2 can be obtained in real time to monitor the real-time temperature of the chip after it comes out of the heating plate 5.

[0064] Obtain the second temperature value of the second temperature measuring point 3 at the second set distance behind the chip testing station 1; a temperature sensor is also provided at the second temperature measuring point 3 at the second set distance behind the chip testing station 1 to monitor in real time whether the temperature of the chip is within a controllable range after the chip test. During the transportation of the chip, without additional heating, the temperature of the chip gradually decreases; and during the chip testing process at the chip testing station 1, the temperature of the chip needs to be within a suitable controllable temperature range to ensure the authenticity of the test results. If the chip temperature is too low, it is easy to affect the test results. A temperature sensor is provided at the rear of the test station. If the monitored chip temperature is still within a controllable range at this time, it means that the temperature of the chip is also controllable during the test at the chip testing station 1, and the chip test results will not be affected by the temperature.

[0065] Determine whether the second temperature value is lower than the set first temperature threshold. If the second temperature value is lower than the set first temperature threshold, the current test of chip test station 1 is judged to be an invalid test, and an early warning is issued. For example, the first temperature value is 160°C, the second temperature value is 145°C, and the first temperature threshold is 150°C; this second temperature value 145°C is lower than 150°C, therefore, it is judged that the temperature of the chip at chip test station 1 is too low, and this test is an invalid test, and an early warning is issued to prompt the staff to perform maintenance or take relevant temperature-raising measures.

[0066] If the second temperature value is not lower than the set first temperature threshold, the difference between the first temperature value and the second temperature value is calculated as the first temperature difference value. For example, if the first temperature value is 165°C and the second temperature value is 155°C, the first temperature difference value is 10°C.

[0067] If the first temperature difference is greater than the set threshold, the current test of chip testing station 1 is determined to be a valid test. For example, when the set threshold is 5°C and the first temperature difference is 10°C, the temperature is within the controllable range and the test is a valid test.

[0068] If the first temperature difference is less than or equal to the set threshold, the current test of chip testing station 1 is judged to be an invalid test, and an early warning is issued. For example, if the first temperature value is 165°C and the second temperature value is 164°C, the first temperature difference is 1°C. The first temperature difference of 1°C is less than or equal to the set threshold of 5°C; this indicates that the chip is cooling down slowly at this time, which may be affected by environmental factors, causing the temperature of the chip to be too high, thus affecting the results of the chip test. Among them, for example, the optimal temperature test range of chip testing station 1 is 155°C-160°C; the temperature range in this embodiment is only used as an example to explain the technical solution. In actual applications, the temperature range will be determined according to the test requirements of the actual chip.

[0069] In order to make timely adjustments when the temperature is abnormal or before the temperature is expected to be abnormal, the method also includes:

[0070] Calculate a first average value of the first temperature difference within a first set time period; if the first average value exceeds a set first average threshold value, adjust the heating temperature of the heating plate 5 according to the first average value; the larger the first average value, the more the heating temperature of the heating plate 5 increases; the smaller the first average value, the less the heating temperature of the heating plate 5 increases.

[0071] For example, within a period of time, 10 chips are tested, and the first average values ​​of the first temperature differences of the chips are counted 10 times; wherein the first average threshold value is 7°C.

[0072] For example, 10°C; 8°C; 9°C; 7°C; 8°C; 8.5°C; 9°C; 8°C; 9.5°C; 9°C; at this time, the first average value is 8.6°C. At this time, it means that the temperature drops too fast during this period. In order to avoid the temperature of the temperature chip arriving at the chip test station 1 being too low, the temperature of the heating plate 5 needs to be increased, so that the temperature value at the first temperature measuring point 2 can be appropriately increased. Even if the temperature drops a little fast, the chip can still be within the controllable temperature range when it arrives at the chip test station 1.

[0073] For example, the monitoring results in another time period are as follows: 5.5°C; 6°C; 6.5°C; 5.2°C; 6°C; 5.3°C; 5.4°C; 5.1°C; 6.1°C; 5°C; at this time, the first average value is 5.61°C. At this time, it means that the temperature drop rate during this period is within the normal range. As long as the current temperature of the heating plate 5 is maintained, the temperature of the chip can still be within the controllable temperature range when it is transported to the chip testing station 1. Therefore, the heating plate 5 does not need to be adjusted.

[0074] A second temperature measuring point 3 is added after the chip test station 1. No matter how many test stations are passed in the middle, as long as the data displayed by the second temperature measuring point 3 at the rear end meets the temperature requirements, it can be judged that the temperature at the chip test station 1 is within the temperature range. Since the temperature of the chip tends to decrease during transportation, by monitoring the lowest temperature value, a temperature range control value is established so that the front and rear temperatures are in a controllable state, thereby improving the accuracy of chip testing. In addition, in order to more accurately judge the temperature of the chip, or the temperature change trend, the monitoring of the temperature difference and the average value of the temperature difference are also added, so that the heating plate 5 can be adjusted in time to avoid frequent warnings. Therefore, it can not only ensure the accuracy of the test results, but also help to reasonably control the temperature of the chip, reduce the probability of warnings, and improve the efficiency of chip detection.

[0075] In order to further optimize the chip temperature monitoring and control, the method also includes:

[0076] If the second temperature value is not lower than the set first temperature threshold; for example, the second temperature value is 165°C, not lower than 150°C.

[0077] Determine whether the second temperature value is higher than the set second temperature threshold. If the second temperature value is higher than the set second temperature threshold, issue an early warning. For example, the second temperature threshold is 160°C, that is, as mentioned above, the optimal temperature test range of the chip test station 1 is 155°C-160°C. If the chip temperature test at the back end of the test station is 160°C or above 160°C, such as 165°C, it means that when the chip is located at the chip test station 1, the temperature is higher than 160°C, so this test is an invalid test and an early warning is required to remind timely cooling.

[0078] If the second temperature value is not higher than the set second temperature threshold, calculate the second average value of the second temperature value within the second set time period; if the second average value is less than the set second average threshold, adjust the flow of the heat source located at a set distance in front of the chip testing station 1 according to the second average value; the smaller the second average value, the greater the flow of the heat source; the larger the second average value, the smaller the flow of the heat source.

[0079] For example, the second average threshold is 155°C. For example, the second temperature values ​​in a period of time are: 152°C; 153°C; 153.5°C; 152.1°C; 153.1°C; 152.4°C; 151°C; 152.1°C; 151.7°C; 151°C; all are not higher than the second temperature threshold of 160°C; the second average value is 152.19°C. At this time, the data shows that although the temperature is not higher than the second temperature threshold, the overall temperature is relatively low. Therefore, in order to avoid the occurrence of excessively low temperatures and improve the anti-interference of the overall chip temperature, the flow rate of the heat source is adjusted according to the size of the second average value. Among them, the heat source can be a fan 6 with a heating wire, blowing hot air toward the chip. When the second average value is low, increase the air volume of the fan 6; when the second average value is high, reduce the air volume of the fan 6; thereby appropriately increasing the temperature of the chip.

[0080] For example, the second temperature values ​​in a period of time are: 159°C; 158°C; 157.5°C; 158°C; 158.1°C; 158.4°C; 159°C; 159.1°C; 158.7°C; 159°C; all are not higher than the second temperature threshold of 160°C; the second average value is 158.48°C, which is greater than the second average threshold. At this time, the data shows that although the temperature is not higher than the second temperature threshold, the overall temperature is relatively high. Therefore, in order to avoid excessive temperature, no additional heat source is needed for heating.

[0081] The present invention can not only give a timely warning when the chip temperature is too low or too high, but also dynamically adjust the flow of the heat source according to the speed and trend of temperature change, thereby achieving more accurate and real-time control of the chip temperature. This further improves the accuracy and reliability of chip testing, reduces test errors caused by temperature fluctuations, and also provides a more stable temperature environment for subsequent processing and packaging of the chip.

[0082] Reference Figure 3 In other embodiments, in order to further optimize the chip temperature monitoring and control, the method further includes:

[0083] If the second temperature value is not lower than the set first temperature threshold; for example, the second temperature value is 165°C, not lower than 150°C.

[0084] Determine whether the second temperature value is higher than the set second temperature threshold. If the second temperature value is higher than the set second temperature threshold, issue an early warning. For example, the second temperature threshold is 160°C, that is, as mentioned above, the optimal temperature test range of the chip test station 1 is 155°C-160°C. If the chip temperature test at the back end of the test station is 160°C or above 160°C, such as 165°C, it means that when the chip is located at the chip test station 1, the temperature is higher than 160°C, so this test is an invalid test and an early warning is required to remind timely cooling.

[0085] If the second temperature value is not higher than the set second temperature threshold, calculate the second average value of the second temperature value within the second set time period; if the second average value is greater than the set second average threshold, adjust the temperature of the heat source located at a set distance in front of the chip testing station 1 according to the second average value; the smaller the second average value, the higher the temperature of the heat source; the larger the second average value, the lower the temperature of the heat source.

[0086] For example, the second average threshold is 155°C. For example, the second temperature values ​​in a period of time are: 152°C; 153°C; 153.5°C; 152.1°C; 153.1°C; 152.4°C; 151°C; 152.1°C; 151.7°C; 151°C; all are not higher than the second temperature threshold of 160°C; the second average value is 152.19°C. At this time, the data shows that although the temperature is not higher than the second temperature threshold, the overall temperature is relatively low. Therefore, in order to avoid the occurrence of excessively low temperatures and improve the anti-interference of the overall chip temperature, the flow of the heat source is adjusted according to the size of the second average value. Among them, the heat source can be a fan 6 with a heating wire, blowing hot air toward the chip. When the second average value is low, the temperature of the heating wire is increased; when the second average value is high, the temperature of the heating wire is reduced; thereby appropriately increasing the temperature of the chip.

[0087] In other embodiments, the heating wire and the air volume can be adjusted at the same time, and different weight ratios are set, so as to more flexibly adjust the temperature blown to the chip. The weight of the heating wire determines the proportion of the heat generated by it in the total heat. The greater the weight, the more heat the heating wire generates, and the higher the temperature blown to the chip. Conversely, the smaller the weight, the less heat the heating wire generates. The weight of the air volume determines the influence of the airflow generated by the fan 6 on the total heat transfer. The greater the weight, the stronger the airflow generated by the fan 6, which can take away the heat generated by the heating wire faster and transfer it to the chip. However, too strong airflow may also cause uneven heat distribution or too fast heat dissipation, so it needs to be balanced with the weight of the heating wire. In addition, the size of different proportions can be adjusted according to the temperature value monitored in real time and the change of the temperature value; for example, when the temperature is low, the heating wire is dominant, that is, the adjustment weight of the heat source temperature is higher; when the temperature is high, but within the controllable range, the flow of the heat source is dominant, the wind force is strong, although more hot air is delivered, but it will also take away some heat at the same time, combined with the adjustment of the heating wire temperature, the heat of the air supply can be reasonably controlled. For example, if the temperature rises too quickly, a more effective heating wire is needed to increase the temperature, and the flow rate is increased to increase the temperature as quickly as possible.

[0088] For example, the second temperature values ​​in a period of time are: 159°C; 158°C; 157.5°C; 158°C; 158.1°C; 158.4°C; 159°C; 159.1°C; 158.7°C; 159°C; all are not higher than the second temperature threshold of 160°C; the second average value is 158.48°C, which is greater than the second average threshold. At this time, the data shows that although the temperature is not higher than the second temperature threshold, the overall temperature is relatively high. Therefore, in order to avoid excessive temperature, no additional heat source is needed for heating.

[0089] The above method can not only give a timely warning when the chip temperature is too high, but also dynamically adjust the temperature of the heat source according to the speed and trend of temperature change, thereby achieving more accurate and real-time control of the chip temperature. It further improves the accuracy and reliability of chip testing, reduces the test error caused by temperature fluctuations, and also provides a more stable temperature environment for subsequent processing and packaging of the chip.

[0090] If the first average value exceeds the set first average threshold, it indicates that the chip temperature drops too fast, and the method further includes:

[0091] The pressure of the heating disk 5 of the turntable high-temperature testing mechanism for crimping the chip is adjusted according to the first temperature difference. The larger the first temperature difference, the greater the pressure, so as to slow down the temperature drop or even start heating. The smaller the first temperature difference, the smaller the pressure, so as to avoid overheating or maintain the current temperature state; wherein, the pressure is within the set range to ensure that the chip is not crushed. Among them, the adjustment of the chip pressure is performed by a pneumatic cylinder or an electric push rod with an action end set on the heating disk 5; the chip is crimped onto the heating disk 5 by a pressure device, and as the heating disk 5 rotates, the pressure device (not shown in the figure) also rotates, and when it reaches the small track 4, the chip is released, and the chip enters the small track 4 for testing. Among them, Figure 2 The heating plate 5 in the figure is only an example of one structure. For different chip shapes, the structure of the heating plate 5 is also different. Figure 2 The structure in does not have a pressure device. There are many pressure devices in the prior art, which will not be described here.

[0092] Since the chip is generally a square sheet structure, the pressure of the heating plate 5 to press the chip is adjusted to improve the connection tightness between the chip and the disc, thereby increasing the contact area between the chip and the disc, improving the thermal conductivity, and allowing the chip to reach the temperature required for the test more quickly, thereby improving the test efficiency and quality.

[0093] In other implementations, if the first average value exceeds the set first average threshold value, it indicates that the chip temperature drops too fast, and the method further includes:

[0094] The rotation speed of the heating plate 5 where the crimping chip is located is adjusted according to the first temperature difference; the larger the first temperature difference, the slower the rotation speed. The smaller the first temperature difference, the faster the rotation speed.

[0095] When the first temperature difference is large, it means that the chip temperature drops too fast. At this time, the rotation speed of the heating plate 5 needs to be slowed down; thereby, the residence time of the chip on the heating plate 5 can be extended, thereby increasing the chance of heat transfer and slowing down the temperature drop.

[0096] When the first temperature difference is small, it means that the chip temperature drops relatively slowly or is within an acceptable range, and the rotation speed of the heating plate 5 can be appropriately increased at this time, thereby improving the test efficiency or testing more chips while keeping the chip temperature stable.

[0097] By adjusting the rotation speed of the heating plate 5, not only the residence time of the chip on the heating plate 5 and the heat exchange efficiency are affected, but also it helps to achieve a more uniform temperature distribution, thereby improving the reliability and efficiency of the test.

[0098] In order to further optimize the effect of the heat source on chip temperature control, the heat source is also installed at a set distance in front of the chip test station 1 through a rotating drive structure. Among them, the rotating drive structure includes a driving motor and a base, and the driving motor is a servo motor; the driving motor can drive the base to rotate a set angle, and the heat source is installed on the base.

[0099] Reference Figure 4 If the second temperature value is lower than the set first temperature threshold, it means that the temperature of the chip at the chip testing station 1 does not meet the requirements and is lower than the normal test temperature. In order to properly heat the chip, the method further includes:

[0100] A third average value of the second temperature value within a third set time period is calculated.

[0101] The preset direction of the chip to be tested on the small track 4 of the turntable high temperature test mechanism is obtained; the preset direction is a constant value preset by the system. For the convenience of calculation, the preset direction is taken as the direction of the initial 0° vector.

[0102] The blowing direction of the heat source driven by the rotating driving structure is obtained; the blowing direction is the direction corresponding to the rotation angle of the base driven by the servo motor relative to the initial 0° direction.

[0103] Calculate the blowing angle between the preset direction and the blowing direction; the blowing angle is the angle between the vector corresponding to the blowing direction and the 0° vector.

[0104] According to the third average value, the rotation angle of the driving motor is adjusted to adjust the size of the blowing angle; the larger the third average value, the larger the blowing angle; the smaller the third average value, the smaller the blowing angle. If the third average value is large, it means that the chip temperature is at a higher temperature, but has not yet reached the temperature that meets the controllable range, so it is necessary to heat up, in order to avoid the temperature provided by the heat source from suddenly rising too high, causing the temperature of the chip to rise sharply and exceed the second temperature threshold; therefore, the blowing angle is made larger, and the hot air is not blown directly at the chip, so that the temperature of the chip can rise slowly without overheating. On the contrary, when the third average value is small, it means that there is still a certain gap from the minimum value of the optimal test temperature range of the chip. Therefore, it is necessary to increase the temperature as soon as possible so that the temperature of the chip can meet the test requirements as soon as possible. At this time, the blowing angle is reduced so that the hot air blows directly at the chip, so that the heat source blows more directly to the chip. Specifically, the size setting of the angle can be obtained by looking up the table.

[0105] In other embodiments, the flow rate, temperature and rotation angle of the heat source can also adjust the temperature rise of the chip at the same time, so that the temperature adjustment of the chip is more flexible. Different weight ratios can also be set to obtain different temperature rise controls. And the adjustment method of different weight ratios of the flow rate and temperature of the above-mentioned source, in other embodiments, the weight ratios of the flow rate, temperature and rotation angle can be set values, or they can be reasonably configured and adjusted according to the temperature value measured in real time, and the rise and fall speed of the temperature value. For example, when the temperature is below the optimal temperature range, the temperature is too high, and the temperature rises faster, the angle becomes larger, deviates from the chip, the temperature of the heating wire is smaller, and the flow rate is also smaller, avoiding the temperature from rising too quickly. On the contrary, when the temperature is below the optimal temperature range, the temperature is too low, and the temperature rises slowly, the angle becomes smaller, facing the chip, the temperature of the heating wire is larger, and the flow rate is also larger, which helps the temperature reach the optimal temperature range as soon as possible.

[0106] By adjusting the blowing angle of the heat source, it not only affects the heating effect of the heat source on the chip, but also helps to achieve a more uniform temperature distribution, thereby improving the reliability and efficiency of the test.

[0107] Reference Figure 5 Since the heat source for heating is increased, in order to avoid excessive temperature, a cooling system is also required to prevent the temperature of the chip from being too high. Therefore, the method also includes:

[0108] If the second temperature value is higher than the set second temperature threshold, or if the first temperature difference is less than or equal to the set threshold, it means that the temperature of the chip in the chip testing station 1 exceeds the optimal temperature range and is too high.

[0109] The difference between the second temperature value and the second temperature threshold is calculated as the second temperature difference; for example, the second temperature threshold is 160° C. If at this time, the second temperature value is 170° C., the second temperature difference is 10° C.

[0110] The flow rate of the cooling system at a set distance in front of the chip testing station 1 is adjusted according to the second temperature difference; the larger the second temperature difference, the larger the flow rate of the cooling system; the smaller the second temperature difference, the smaller the flow rate of the cooling system. The cooling system is a fan 6, and the heat source is a fan 6 with a heating wire. In actual use, when the heating wire is not heated, the heat source can be used as a cooling system. Specifically, the flow rate setting, that is, the speed of the fan 6, can be obtained by looking up a table.

[0111] The larger the second temperature difference is, the greater the degree to which the chip temperature is higher than the set threshold, so it is necessary to increase the flow rate of the cooling system to accelerate heat dissipation. The smaller the second temperature difference is, the chip temperature is slightly higher than the set threshold or close to the set threshold. At this time, the flow rate of the cooling system can be appropriately reduced to avoid overcooling.

[0112] By adjusting the flow rate of the cooling system, not only the temperature of the chip is effectively controlled, but also test failures caused by overcooling are avoided.

[0113] Reference Figure 6 Similarly, the cooling system is also installed at a set distance in front of the chip testing station 1 through the same rotation drive structure.

[0114] If the second temperature value is higher than the set second temperature threshold, or if the first temperature difference is less than or equal to the set threshold, it means that the temperature of the chip in the chip testing station 1 exceeds the optimal temperature range and is too high.

[0115] Other ways to cool down include:

[0116] Calculating a fourth average value of the second temperature value within a fourth set time period;

[0117] The preset direction of the chip to be tested on the small track 4 of the turntable high temperature test mechanism is obtained; the preset direction is a constant value preset by the system. For the convenience of calculation, the preset direction is taken as the direction of the initial 0° vector.

[0118] The blowing direction of the cooling system driven by the rotating driving structure is obtained; the blowing direction is the direction corresponding to the rotation angle of the base driven by the servo motor relative to the initial 0° direction.

[0119] Calculate the blowing angle between the preset direction and the blowing direction; the blowing angle is the angle between the vector corresponding to the blowing direction and the 0° vector.

[0120] The rotation angle of the driving motor is adjusted according to the fourth average value to adjust the size of the blowing angle; the larger the fourth average value is, the smaller the blowing angle is; the smaller the fourth average value is, the larger the blowing angle is.

[0121] If the fourth average value is larger, that is, the temperature is higher, the blowing angle is reduced, such as from 45° to 30°, so that the blowing of the cooling system acts more directly on the chip and improves the cooling efficiency. Specifically, the size setting of the angle can be obtained by looking up a table.

[0122] If the fourth average value is smaller, that is, the temperature is lower, the blowing angle is increased, such as from 15° to 45°, because the chip temperature is close to the target range and does not require excessive cooling. Specifically, the angle setting can be obtained by looking up a table.

[0123] By adjusting the flow rate and blowing angle of the cooling system, not only the temperature of the chip is effectively controlled, but also test failure or chip damage caused by excessive cooling or heating is avoided.

[0124] The small track 4 of the turntable high temperature test mechanism is provided with a heat preservation cover, which is arranged above the conveying of the chip, wherein the heat source and the cooling system are also located inside the heat preservation cover. The heat preservation cover can be made of high temperature resistant plastic material.

[0125] During the test, the temperature around the chip is kept stable to reduce the impact of the external environment on the test temperature.

[0126] An embodiment of the present application further discloses a zone temperature control system of a turntable-type high-temperature testing mechanism, comprising a processor, wherein the processor executes the steps of the zone temperature control method of the turntable-type high-temperature testing mechanism as described in any one of the above items.

[0127] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A method for controlling the interval temperature of a turntable high temperature testing mechanism, characterized in that: The steps include: Acquiring a first temperature value of a first temperature measurement point (2) located at a first set distance in front of a chip testing station (1); Acquiring a second temperature value of a second temperature measurement point (3) located at a second set distance behind the chip testing station (1); Determining whether the second temperature value is lower than a set first temperature threshold value, and if the second temperature value is lower than the set first temperature threshold value, determining that the current test of the chip testing station (1) is an invalid test, and issuing an early warning; If the second temperature value is not lower than a set first temperature threshold, calculating the difference between the first temperature value and the second temperature value as a first temperature difference; If the first temperature difference is greater than a set threshold, it is determined that the current test of the chip testing station (1) is a valid test; If the first temperature difference is less than or equal to the set threshold, the current test of the chip testing station (1) is judged to be an invalid test and an early warning is issued; A first average value of the first temperature difference within a first set time period is calculated; if the first average value exceeds a set first average threshold value, the heating temperature of the heating plate (5) is adjusted according to the first average value; the larger the first average value, the more the heating temperature of the heating plate (5) increases; the smaller the first average value, the less the heating temperature of the heating plate (5) increases.

2. The interval temperature control method of the turntable type high temperature testing mechanism according to claim 1 is characterized in that: If the second temperature value is not lower than the set first temperature threshold, the method further includes: Determine whether the second temperature value is higher than a set second temperature threshold, and issue an early warning if the second temperature value is higher than the set second temperature threshold; If the second temperature value is not higher than a set second temperature threshold, a second average value of the second temperature value within a second set time period is calculated; if the second average value is less than a set second average threshold, the flow of a heat source located at a set distance in front of the chip testing station (1) is adjusted according to the second average value; the smaller the second average value, the greater the flow of the heat source; the larger the second average value, the smaller the flow of the heat source.

3. The interval temperature control method of the turntable type high temperature testing mechanism according to claim 1, characterized in that: If the second temperature value is not lower than the set first temperature threshold, the method further includes: Determine whether the second temperature value is higher than a set second temperature threshold, and issue an early warning if the second temperature value is higher than the set second temperature threshold; If the second temperature value is not higher than a set second temperature threshold, a second average value of the second temperature value within a second set time period is calculated; if the second average value is greater than a set second average threshold, the temperature of a heat source located at a set distance in front of the chip testing station (1) is adjusted according to the second average value; the smaller the second average value, the higher the temperature of the heat source; the larger the second average value, the lower the temperature of the heat source.

4. The interval temperature control method of the turntable type high temperature testing mechanism according to claim 1, characterized in that: If the first average value exceeds a set first average threshold, the method further includes: The pressure of the heating plate (5) in the turntable high temperature testing mechanism for pressing the chip is adjusted according to the first temperature difference. The greater the first temperature difference, the greater the pressure; the smaller the first temperature difference, the smaller the pressure; the pressure is within a set range.

5. The interval temperature control method of the turntable type high temperature testing mechanism according to claim 1, characterized in that: If the first average value exceeds a set first average threshold, the method further includes: The rotation speed of the heating plate (5) where the crimping chip is located is adjusted according to the first temperature difference; the larger the first temperature difference, the slower the rotation speed; the smaller the first temperature difference, the faster the rotation speed.

6. The interval temperature control method of the turntable type high temperature testing mechanism according to claim 3, characterized in that: The heat source is installed at a set distance in front of the chip testing station (1) through a rotating drive structure; If the second temperature value is lower than the set first temperature threshold, the method further includes: Calculating a third average value of the second temperature value within a third set time period; Obtaining a preset direction in which the chip to be tested is transported on a small track (4) of a turntable-type high-temperature testing mechanism; Obtaining the blowing direction of the heat source driven by the rotary drive structure; Calculating the blowing angle between the preset direction and the blowing direction; The rotation angle of the driving structure is adjusted according to the third average value to adjust the size of the blowing angle; the larger the third average value is, the larger the blowing angle is; the smaller the third average value is, the smaller the blowing angle is.

7. The interval temperature control method of the turntable type high temperature testing mechanism according to claim 6, characterized in that: If the second temperature value is higher than a set second temperature threshold, or if the first temperature difference is less than or equal to the set threshold, the method further includes: Calculate the difference between the second temperature value and the second temperature threshold as a second temperature difference; The flow rate of a cooling system located at a set distance in front of the chip testing station (1) is adjusted according to the second temperature difference; the larger the second temperature difference, the larger the flow rate of the cooling system; the smaller the second temperature difference, the smaller the flow rate of the cooling system.

8. The interval temperature control method of the turntable type high temperature testing mechanism according to claim 7, characterized in that: The cooling system is installed at a set distance in front of the chip testing station (1) through a rotating drive structure; If the second temperature value is higher than a set second temperature threshold, or if the first temperature difference is less than or equal to the set threshold, the method further includes: Calculating a fourth average value of the second temperature value within a fourth set time period; Obtaining a preset direction in which the chip to be tested is transported on a small track (4) of a turntable-type high-temperature testing mechanism; Acquire the blowing direction of the cooling system driven by the rotary drive structure; Calculating the blowing angle between the preset direction and the blowing direction; The rotation angle of the driving structure is adjusted according to the fourth average value to adjust the size of the blowing angle; the larger the fourth average value is, the smaller the blowing angle is; the smaller the fourth average value is, the larger the blowing angle is.

9. The interval temperature control method of the turntable type high temperature testing mechanism according to claim 1, characterized in that: A heat preservation cover is arranged on the small track (4) of the turntable-type high-temperature testing mechanism, and the chip to be tested is placed in the heat preservation cover.

10. A zone temperature control system for a turntable high temperature testing mechanism, characterized in that: It includes a processor, in which the steps of the interval temperature control method of the turntable type high temperature testing mechanism as described in any one of claims 1-8 are executed.

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