Explicit heat dissipation topological optimization method based on heat conduction path

Abstract

The invention provides an explicit heat dissipation topological optimization method based on a heat conduction path, and the method comprises the steps: firstly calculating a temperature field of a design domain through heat conduction and a finite element theory, obtaining a heat flow line according to the temperature field, and taking the heat flow line as the heat conduction path of a structure; then, establishing a corresponding criterion to attach the MMC assembly to the heat conduction path of the structure; determining parameter information of the MMC component according to the temperature gradient around the component and the volume fraction upper limit of the high-thermal-conductivity solid material, and forming an initial component configuration of MMC topological optimization; and finally, based on the MMC frame, performing heat dissipation topological optimization on the design structure. According to the method, the number of MMC initial components is effectively reduced, the calculation efficiency of an optimization problem is improved, the number of numerical iterations in a topological optimization problem is reduced, and the problem that an initial configuration depends on an optimization result is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structure optimization, and in particular to an explicit heat dissipation topology optimization method based on a heat conduction path. Background Art

[0002] The rapid development of high-end manufacturing has placed increasingly stringent requirements on thermal conductivity structures in the engineering field, especially in the fields of aerospace and electronics. Traditional convection heat dissipation channel structures are often designed based on experience, which increases the weight of the structure and seriously affects the development of lightweight and miniaturization. It is necessary to design the structural distribution of high thermal conductivity materials through topological optimization, so that the structure can arrange materials reasonably and reduce manufacturing costs.

[0003] The mobile deformable component method is an explicit topology optimization method. The initial components of the structure can be rotated, covered, moved and deformed, and the final topology structure is finally generated through iterative optimization methods. Compared with the implicit topology optimization method, this method eliminates the checkerboard and grayscale units, has explicit geometric information, and the optimized configuration is directly integrated with CAD to facilitate subsequent processing of the structure. However, the layout of its initial components will seriously affect the process and results of topology optimization. Sometimes, an unfavorable initial layout will greatly increase the amount of calculation for the optimization solution. Summary of the invention

[0004] The present invention is to solve the problem that the layout of the initial components in the heat dissipation problem of the traditional mobile deformable component method has no physical meaning, which leads to an increase in design variables and the dependence of the initial components on the optimization results, and provides an explicit heat dissipation topology optimization method based on the heat conduction path. First, the temperature field of the design domain is calculated by heat conduction and finite element theory, and the heat flow lines can be obtained according to the temperature field, and then the heat flow lines are regarded as the heat conduction path of the structure; then, the corresponding criteria are established to attach the MMC component to the heat conduction path of the structure; the parameter information of the MMC component is determined based on the temperature gradient around the component and the upper limit of the volume fraction of the high thermal conductivity solid material, and the initial component configuration of the MMC topology optimization is formed; finally, based on the MMC framework, the heat dissipation topology optimization of the design structure is performed. The present invention effectively reduces the number of MMC initial components, improves the calculation efficiency of the optimization problem, reduces the number of numerical iterations in the topology optimization problem, and solves the problem of the dependence of the initial configuration on the optimization result.

[0005] The present invention provides an explicit heat dissipation topology optimization method based on a heat conduction path, comprising the following steps:

[0006] S1. Fill the design domain with high thermal conductivity materials and apply boundary conditions and heat sources to perform finite element analysis to obtain structural temperature field information;

[0007] S2. According to the structural temperature field information, the structural heat flow lines are obtained by the heat flow line extraction method, and the structural heat flow lines are regarded as the structural heat conduction paths;

[0008] The method of heat flow line extraction is as follows: first, the node temperature gradient of the temperature field is obtained according to the structural temperature field information; then, the starting point and end point of the heat flow line under different working conditions are set according to the heat source and boundary conditions of the structure; then, according to the starting point and end point of the heat flow line, the trajectory points are iterated in turn through the linear interpolation algorithm and the fitting curve passing through all the trajectory points is used as the structural heat conduction path; according to the structural heat conduction path, the effective heat conduction path information is obtained through the judgment criteria;

[0009] S3, obtaining heat flow line data according to the heat conduction path of the structure, the heat flow line data including heat flow line node coordinates and node temperature gradient information; attaching the mobile deformable component to the heat conduction path of the structure based on the super ellipse equation and according to the heat flow line data to obtain parameter information of the mobile deformable component, and obtaining the initial component configuration according to the parameter information of the mobile deformable component;

[0010] S4. Based on the initial component configuration, the heat dissipation topology optimization design is performed, and an explicit heat dissipation topology optimization method based on the heat conduction path is completed.

[0011] The present invention discloses an explicit heat dissipation topology optimization method based on a heat conduction path. As a preferred method, in step S1, the high thermal conductivity material is an isotropic high thermal conductivity material and the thermal conductivity coefficient k p 1; four-node rectangular elements are used to divide the mesh during finite element analysis.

[0012] The method for optimizing the explicit heat dissipation topology based on the heat conduction path described in the present invention is preferably implemented in that step S2 includes the following steps:

[0013] S21. Obtain the node temperature gradient of the temperature field according to the structural temperature field information. The node temperature gradient of the temperature field includes the node temperature corresponding to the node in the design domain. Directional component, Directional component, absolute value of nodal temperature gradient

[0014] S22, setting the starting point and end point of the heat flow line under different working conditions according to the heat source and boundary conditions of the structure;

[0015] S23, according to the starting point and the end point of the heat flow line, iterate the trajectory points in turn by a linear interpolation algorithm and use the fitting curve passing through all the trajectory points as the structural heat conduction path;

[0016] S24. According to the structural heat conduction path, effective heat conduction path information is obtained through judgment criteria.

[0017] The present invention discloses an explicit heat dissipation topology optimization method based on a heat conduction path, as a preferred mode, in step S22, according to the heat source position of the structure, eight nodes around the heat source are obtained as the starting point of the heat flow line; according to different boundary conditions of the structure, the end point of the heat flow line is obtained: when the line constraint is applied, the position information of the local temperature gradient maximum value of the line constraint is obtained as the end point of the heat flow line; when the point constraint is applied, the position information of the point constraint is obtained as the end point of the heat flow line.

[0018] The present invention discloses an explicit heat dissipation topology optimization method based on heat conduction path. As a preferred method, in step S23, the starting point P0 of the structure heat flow line is 8 nodes around the heat source node position, and the temperature gradient direction vector at P0 is and The position information of the node P1 is obtained by extending the step length Δ, and the temperature gradient direction vector at P1 is obtained by performing linear interpolation function interpolation on the four nodes of the four-node rectangular unit where P1 is located.

[0019] The explicit heat dissipation topology optimization method based on heat conduction path described in the present invention is, as a preferred embodiment, in step S22, the temperature gradient direction vector at P1 is:

[0020]

[0021]

[0022]

[0023]

[0024]

[0025]

[0026] Among them, a and b are the widths of the four-node rectangular element, and (T1, T2, T3, T4) are the four nodes of the four-node rectangular element.

[0027] The explicit heat dissipation topology optimization method based on heat conduction path described in the present invention is, as a preferred mode, in step S24, when there are multiple heat flow lines with the same starting point and end point, the effective heat flow line is determined as the structural heat conduction path by a judgment criterion, and the judgment criterion is:

[0028] Calculate the sum of the temperature gradients of all nodes on each heat flow line and determine whether it is the maximum. If so, this heat flow line is a structural heat conduction path; if not, this heat flow line is not a structural heat conduction path;

[0029] One end of the structural heat conduction path is connected to the heat source, and the other end is connected to the end point selected under different working conditions.

[0030] The present invention discloses an explicit heat dissipation topology optimization method based on a heat conduction path. As a preferred method, in step S3, the parameter information of the mobile deformable component is determined based on the temperature gradient around the component and the upper limit of the volume fraction of the high thermal conductivity solid material to form the initial component configuration of the mobile deformable component method. The parameter information of the mobile deformable component includes: component i half length half length L i 、Component i rotation angle angle α i 、Component i cross-sectional width value

[0031] Step S3 includes the following steps:

[0032] S31, obtaining heat flow line data according to the heat conduction path of the structure, wherein the heat flow line data includes the coordinates of the heat flow line nodes and the temperature gradient information of the nodes;

[0033] S32. According to the node coordinates of the heat flow line, the center point coordinates of component i are obtained:

[0034]

[0035] The heat flow line node coordinates are is the starting point coordinate of the heat flow line component i, the heat flow line node coordinate is the end point coordinate of heat flow line component i, is the coordinate of the center point of component i;

[0036] S33. According to the node coordinates of the heat flow line of component i, the half length of component i is obtained:

[0037]

[0038] S34. According to the node coordinates of the heat flow line of component i and the half length of component i, the sine value of the rotation angle of component i is obtained:

[0039]

[0040] Among them, α i Rotation angle for component i;

[0041] S35, according to the half length of component i and the node temperature gradient information and the constraint volume, the cross-sectional width value of component i is obtained in, is the width of component i’s header, is the width of the tail of component i, Width of the middle part of component i;

[0042] S36, according to the half length L of component i i , component i center point coordinates Component i rotation angle α i 、Component i cross-sectional width value The topological description function of the component is obtained based on the hyperelliptic equation;

[0043] The topological description function is:

[0044]

[0045] in

[0046]

[0047] Among them, i represents the i-th component, is the topological description function of the component, f i (x') is the superelliptic equation of the component, and p is the coefficient;

[0048] S37. Obtain an initial component configuration according to the topological description function.

[0049] The present invention discloses an explicit heat dissipation topology optimization method based on heat conduction path. As a preferred method, in step S35, the initial variable is θ, and the width of each component corresponds to θ, 2θ, and 3θ according to the temperature gradient values ​​of the starting node, the end point, and the center point. The total volume of the design domain occupied by all components is consistent with the constraint volume:

[0050]

[0051] Get the cross-sectional width of component i

[0052] The explicit heat dissipation topology optimization method based on heat conduction path described in the present invention is a preferred method. In step S4, finite element analysis, sensitivity calculation and temperature field are performed, and the component topology configuration is obtained and the design variables are updated using the MMA and GCMMA hybrid optimization algorithm. When the calculation results converge, the explicit heat dissipation topology optimization method based on heat conduction path is completed. When the results do not converge, finite element analysis, sensitivity calculation and temperature field are continued.

[0053] An explicit heat dissipation topology optimization method based on heat conduction path, the steps are as follows:

[0054] (1) Fill the design domain with high thermal conductivity materials, apply boundary conditions and heat sources to perform finite element analysis, and obtain the temperature field information of the structure;

[0055] (2) obtaining heat flow line information of the structure according to the temperature field information calculated by the finite element analysis, and regarding the heat flow line as a heat conduction path of the structure;

[0056] According to the temperature field information of the structure, the heat conduction path information of the structure is obtained by using a preset heat flow line extraction algorithm, including:

[0057] According to the temperature field information of the structure of the high thermal conductivity material, the direction vector of the temperature gradient of the structure is obtained; according to the heat source and boundary conditions of the structure, corresponding criteria are established to set the starting point and end point of the heat flow line under different working conditions; according to the starting point and end point of the heat flow line, the trajectory points are iterated in turn through the linear interpolation algorithm, and the heat conduction path of the structure is obtained by fitting the curve through all the trajectory points; according to the heat conduction path of the structure, the effective heat conduction path information is obtained through the judgment criteria;

[0058] According to the heat source and boundary conditions of the structure, the corresponding judgment criteria are established to set the starting point and end point of the heat flow line under different working conditions, including: according to the heat source position of the structure, the eight nodes around the heat source are obtained as the starting point of the heat flow line; according to the different boundary conditions of the structure, when the line is constrained, the position information of the maximum value of the local temperature gradient constrained by the line is obtained as the end point of the heat flow line; when the point is constrained, the position information of the point constraint is obtained as the end point of the heat flow line;

[0059] (3) obtaining mobile deformable component (MMC component) information based on the heat conduction path information of the structure;

[0060] According to the heat conduction path information, heat flow line data is obtained; the heat flow line data includes heat flow line node coordinates and node temperature gradient information;

[0061] Based on the super ellipse equation, according to the thermal streamline data, the mobile deformable component information is obtained, including: according to the thermal streamline node coordinates, the center point coordinates of the component are obtained; according to the thermal streamline node coordinates, the half length of the component is obtained; according to the thermal streamline node coordinates and the half length of the component, the angle value of the component rotation is obtained; according to the half length of the component and the node temperature gradient information and the constraint volume, the width value of the cross section of the component is obtained; according to the half length of the component, the center point coordinates, the angle value of the rotation and the width value of the cross section, based on the super ellipse equation, the topological description function of the component is obtained; according to the topological description function, the mobile deformable component information is obtained;

[0062] (4) Based on the MMC topology optimization method, the component topology configuration is obtained by using the MMA and GCMMA hybrid optimization algorithm according to the MMC component information.

[0063] The present invention has the following advantages:

[0064] (1) The initial configuration of the component given by this method is based on the structural heat conduction path, which is itself very close to the optimal solution of the heat dissipation topology optimization problem.

[0065] (2) This method effectively reduces the number of numerical iterations in the process of solving the heat dissipation topology optimization problem and solves the problem of the dependence of the heat dissipation topology optimization results on the initial configuration.

[0066] (3) In the heat dissipation topology optimization problem, the initial configuration also has fewer design variables, which can minimize the waste of computing resources and greatly improve the efficiency of solving the heat dissipation topology optimization problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] Figure 1 It is a flow chart of an explicit heat dissipation topology optimization method based on heat conduction path;

[0068] Figure 2 Draw a schematic diagram of the heat flow line process for an explicit heat dissipation topology optimization method based on heat conduction path;

[0069] Figure 3 It is a schematic diagram of a planar 4-node unit of an explicit heat dissipation topology optimization method based on heat conduction path;

[0070] Figure 4 A schematic diagram of component size design for an explicit heat dissipation topology optimization method based on heat conduction path;

[0071] Figure 5 A schematic diagram of component width design for an explicit heat dissipation topology optimization method based on heat conduction path;

[0072] Figure 6 This is a schematic diagram of an explicit heat dissipation topology optimization method based on heat conduction path. The temperature of the four corner points is given as T=0, and a heat source is placed in the center.

[0073] Figure 7 It is an explicit heat dissipation topology optimization method based on heat conduction path. The temperature of the four corner points is given as T=0, and a heat source is placed in the center.

[0074] Figure 8 This is a schematic diagram of the initial component layout of an example of an explicit heat dissipation topology optimization method based on heat conduction path. The temperature of the four corner points is given as T=0, and a heat source is placed in the center.

[0075] Fig. 9 This is an optimization result diagram of an example of an explicit heat dissipation topology optimization method based on heat conduction path. The temperature of the four corner points is given as T=0, and a heat source is placed in the center.

[0076] Fig.10 Initial component layout optimized for conventional cooling MMC topology. DETAILED DESCRIPTION

[0077] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0078] Example 1

[0079] like Figures 1 to 10 As shown in Figure 1, an explicit heat dissipation topology optimization method based on heat conduction path is shown in Figure 1. The specific steps are as follows:

[0080] (1) Fill the design domain with high thermal conductivity materials, apply boundary conditions and heat sources to perform finite element analysis, and obtain the temperature field information of the structure;

[0081] The specific steps to generate the temperature field information of the structure are as follows:

[0082] In engineering design, the actual heat dissipation situation is very complex, and there are many heat transfer modes and boundary conditions. For this simplified model, only the boundary conditions of heat conduction in the steady-state heat transfer process are considered, and there is no radiation and convection heat transfer. The topology optimization solid material uses a high thermal conductivity isotropic material to meet k p =1, the structural design domain is fully filled with high thermal conductivity solid materials, and heat sources and boundary conditions are applied to it. The grid is divided using four-node rectangular units. After finite element analysis, the temperature field information of the topological structure is obtained.

[0083] (2) According to the temperature field information calculated by the finite element analysis, the heat flow line information of the structure is obtained, and the heat flow line is regarded as the heat conduction path of the structure; the specific steps are as follows:

[0084] According to the temperature field information of the structure, the node temperature gradient of the temperature field is calculated, including the corresponding temperature gradient of the node in the design domain. and Directional components and absolute values ​​of nodal temperature gradients:

[0085] The heat flow line can be obtained by designing the temperature gradient information of each point on the structure. The starting point of the heat flow line is set to the 8 nodes around the heat source node position, from which the heat flow line is derived. Figure 2 As shown, the starting point of the heat flow line is P0. According to the temperature gradient direction vector at P0 and The step length Δ is extended along this direction to obtain the position information of the node P1. At the same time, the temperature gradient direction vector at P1 is obtained by interpolation of the four nodes of the unit.

[0086] For the four-node element used, Figure 3As shown in the figure, the temperature gradients of the four nodes (T1, T2, T3, T4) are known. Using the linear interpolation function, the temperature gradient of a point in the unit is expressed as follows:

[0087]

[0088]

[0089]

[0090]

[0091]

[0092]

[0093] Where a, b are the width of the cell.

[0094] Continue to repeat the above steps until the boundary of the design domain is reached. The smooth curve passing through all nodes is the final heat flow line. When the line constraint is set, the position information of the local temperature gradient maximum value of the line constraint is obtained as the end point of the heat flow line. When the point constraint is set, the position information of the point constraint is obtained as the end point of the heat flow line. The effective heat flow line is determined as the heat conduction path of the structure. The judgment criteria are as follows:

[0095] The heat conduction path must be connected to the heat source at one end and the end point selected under different working conditions at the other end. If the heat flow lines have the same starting point and end point, the value with the largest temperature gradient sum is selected as the heat conduction path by determining the size of the temperature gradient sum of all nodes on each heat flow line.

[0096] (3) Obtaining MMC component information based on the heat conduction path information of the structure; the specific steps are as follows:

[0097] According to the node coordinates of the heat flow line, Figure 4 As shown, the coordinates of the center point of component i are obtained, and the formula is as follows:

[0098]

[0099] The heat flow line node coordinates are is the starting point coordinate of the heat flow line of component i, the node coordinate of the heat flow line is the end point coordinate of the heat flow line of component i, is the coordinate of the center point of component i.

[0100] According to the node coordinates of the heat flow line, the half length of component i is obtained. The formula is as follows:

[0101]

[0102] According to the node coordinates of the heat flow line of component i and the half length of component i, the sine value of the rotation angle of component i is obtained. The formula is as follows:

[0103]

[0104] where α i Rotate component i by angle.

[0105] According to the half-length and node temperature gradient information of the component and the constraint volume, the width value of the cross section of the component is obtained. Figure 5 As shown, the cross-sectional parameters of a two-dimensional component are three variables The three variables correspond to the width of the head, tail, and middle of the component. The three parameters are obtained by the half length of the component, the temperature gradient values ​​of the starting node, end point, and center point on the heat flow line, and the constraint volume (V). The method is as follows: Assuming the initial variable θ, the width of each component corresponds to θ, 2θ, and 3θ according to the size of the temperature gradient values ​​of the starting node, end point, and center point. The total volume of the design domain occupied by all components is consistent with the constraint volume. The formula is as follows:

[0106]

[0107] The values ​​of the three widths of the component are obtained.

[0108] According to the half length, center point coordinates, rotation angle value and cross-section width value of the component, based on the super ellipse equation, the topological description function of the component is obtained; the topological description function is as follows:

[0109]

[0110] in

[0111]

[0112] Among them, i represents the i-th component, is the topological description function of the component, f i (x') is the equation of the component's hyperellipse. p is a coefficient.

[0113] According to the topological description function, the mobile deformable component information is obtained. The topological description function TDF of the component, when greater than 0, represents solid material, when less than 0, it is empty material, and when equal to 0, it represents the structural boundary.

[0114] (4) Based on the MMC topology optimization method, according to the MMC component information, the component topology configuration is obtained by using the MMA and GCMMA hybrid optimization algorithm.

[0115] In this application, if Figure 6 As shown in the figure, the structural heat conduction problem is a two-dimensional plane heat conduction problem. The design domain is 2×2, the finite element mesh is discretized to 100×100, a four-node eight-degree-of-freedom unit is used, the temperature of the four corner points is given as T=0, and a heat source is placed in the center. The structural heat dissipation weakness is taken as the minimum objective function, the constraint volume is 0.4, and the high thermal conductivity material k p =1, heat source value P = 1. Figure 7 Shown is the heat conduction path of the structure, such as Figure 8 The initial component layout for topology optimization is shown in Figure 2. Fig. 9 Optimization results for the shown structure.

[0116] Table 1 shows the comparison results of design variables, iteration process and optimization results based on this technical solution and the traditional heat dissipation mobile deformable component method. Fig.10 Shown is the traditional MMC initial component layout.

[0117] Table 1

[0118]

[0119] The MMC topology optimization result based on the heat conduction path is 2.254, which is almost the same as the traditional heat dissipation MMC optimization. The number of design variables of the method of the present invention is significantly smaller than that of the traditional heat dissipation MMC. At the same time, the number of iteration steps and iteration time are greatly reduced, which improves the convergence speed of the optimization iteration.

[0120] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An explicit heat dissipation topology optimization method based on heat conduction path, characterized in that: The following steps are involved: S1. Fill the design domain with high thermal conductivity materials and apply boundary conditions and heat sources to perform finite element analysis to obtain structural temperature field information; S2. According to the structural temperature field information, obtain structural heat flow lines by a heat flow line extraction method, and regard the structural heat flow lines as structural heat conduction paths; The method for extracting heat flow lines is as follows: first, the node temperature gradient of the temperature field is obtained according to the temperature field information of the structure; then, the starting point and the end point of the heat flow line under different working conditions are set according to the heat source and boundary conditions of the structure; then, according to the starting point and the end point of the heat flow line, the trajectory points are iterated in turn by a linear interpolation algorithm and the fitting curve passing through all the trajectory points is used as the heat conduction path of the structure; according to the heat conduction path of the structure, the effective heat conduction path information is obtained by a judgment criterion; S3, obtaining heat flow line data according to the heat conduction path of the structure, wherein the heat flow line data includes heat flow line node coordinates and node temperature gradient information; Based on the superellipse equation and according to the heat streamline data, the movable deformable component is attached to the heat conduction path of the structure to obtain parameter information of the movable deformable component, and the initial component configuration is obtained according to the parameter information of the movable deformable component; S4. Based on the initial component configuration, a heat dissipation topology optimization design is performed, and an explicit heat dissipation topology optimization method based on a heat conduction path is completed.

2. The method for optimizing heat dissipation topology based on heat conduction path according to claim 1, characterized in that: In step S1, the high thermal conductivity material is an isotropic high thermal conductivity material and has a thermal conductivity coefficient k p 1; four-node rectangular elements are used to divide the mesh during finite element analysis.

3. The method for optimizing heat dissipation topology based on heat conduction path according to claim 1, characterized in that: Step S2 includes the following steps: S21, obtaining the node temperature gradient of the temperature field according to the structural temperature field information, wherein the node temperature gradient of the temperature field includes the node temperature gradient corresponding to the node in the design domain Directional component, Directional component, absolute value of nodal temperature gradient S22, setting the starting point and end point of the heat flow line under different working conditions according to the heat source and boundary conditions of the structure; S23, according to the starting point and the end point of the heat flow line, iterate the trajectory points in turn by a linear interpolation algorithm and use the fitting curve passing through all the trajectory points as the structural heat conduction path; S24. According to the structural heat conduction path, effective heat conduction path information is obtained through judgment criteria.

4. The method for optimizing the explicit heat dissipation topology based on the heat conduction path according to claim 3, characterized in that: In step S22, the eight nodes around the heat source are obtained as the starting points of the heat flow line according to the heat source position of the structure; the end point of the heat flow line is obtained according to the different boundary conditions of the structure: when the line constraint is used, the position information of the local temperature gradient maximum value of the line constraint is obtained as the end point of the heat flow line; when the point constraint is used, the position information of the point constraint is obtained as the end point of the heat flow line.

5. The method for optimizing the explicit heat dissipation topology based on the heat conduction path according to claim 3, characterized in that: In step S23, the starting point P0 of the structural heat flow line is the eight nodes around the heat source node position, and the temperature gradient direction vector at P0 is and The position information of the node P1 is obtained by extending the step length Δ, and the temperature gradient direction vector at P1 is obtained by performing linear interpolation function interpolation on the four nodes of the four-node rectangular unit where P1 is located.

6. The method for optimizing the explicit heat dissipation topology based on the heat conduction path according to claim 5, characterized in that: In step S22, the temperature gradient direction vector at P1 is: Among them, a and b are the widths of the four-node rectangular element, and (T1, T2, T3, T4) are the four nodes of the four-node rectangular element.

7. The method for optimizing the explicit heat dissipation topology based on the heat conduction path according to claim 3, characterized in that: In step S24, when there are multiple heat flow lines with the same starting point and end point, the effective heat flow line is determined as the structural heat conduction path by a judgment criterion, and the judgment criterion is: Calculate the sum of the temperature gradients of all nodes on each heat flow line and determine whether it is the maximum. If so, this heat flow line is the heat conduction path of the structure; if not, this heat flow line is not the heat conduction path of the structure; One end of the structural heat conduction path is connected to a heat source, and the other end is connected to a terminal point selected under different working conditions.

8. The method for optimizing the explicit heat dissipation topology based on the heat conduction path according to claim 1, characterized in that: In step S3, the parameter information of the movable deformable component is determined based on the temperature gradient around the component and the upper limit of the volume fraction of the high thermal conductivity solid material to form the initial component configuration of the movable deformable component. The parameter information of the movable deformable component includes: the half length L of component i i 、Component i rotation angle angle α i 、Component i cross-sectional width value Step S3 includes the following steps: S31, obtaining heat flow line data according to the heat conduction path of the structure, wherein the heat flow line data includes heat flow line node coordinates and node temperature gradient information; S32. According to the heat flow line node coordinates, the center point coordinates of component i are obtained: The heat flow line node coordinates are is the starting point coordinate of the heat flow line of component i, the node coordinate of the heat flow line is the end point coordinate of the heat flow line of component i, is the coordinate of the center point of component i; S33. According to the node coordinates of the heat flow line of component i, the half length of component i is obtained: S34, obtaining the sine value of the rotation angle of component i according to the node coordinates of the heat flow line of component i and the half length of component i; Among them, α i Rotation angle for component i; S35, according to the half length of component i and the node temperature gradient information and the constraint volume, obtain the cross-sectional width value of component i in, is the width of component i’s header, is the width of the tail of component i, Width of the middle part of component i; S36, according to the half length L of component i i , component i center point coordinates Component i rotation angle α i 、Component i cross-sectional width value The topological description function of the component is obtained based on the hyperelliptic equation; The topological description function is: in Among them, i represents the i-th component, is the topological description function of the component, f i (x') is the superelliptic equation of the component, and p is the coefficient; S37. Obtaining the initial component configuration according to the topological description function.

9. The method for optimizing the explicit heat dissipation topology based on the heat conduction path according to claim 8, characterized in that: In step S35, the initial variable is θ, and the width of each component corresponds to θ, 2θ, and 3θ according to the temperature gradient values ​​of the starting node, the end point, and the center point. The total volume of the design domain occupied by all components is consistent with the constraint volume: Get the cross-sectional width of component i 10. The method for optimizing the explicit heat dissipation topology based on the heat conduction path according to claim 1, characterized in that: In step S4, the component topology configuration is obtained using the MMA and GCMMA hybrid optimization algorithm.

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