Superconducting tape structure for enhancing superconducting constant current switch resistance and manufacturing method thereof

By setting superconducting pathways and grooves on the superconducting layer of the superconducting tape to form complex current paths, the problem of high cost and slow switching speed caused by increased resistance in existing superconducting constant current switches is solved, achieving the effect of high resistance and fast switching.

CN119207887BActive Publication Date: 2025-11-04SHANGHAI JIAOTONG UNIV
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Patent Information

Application Number
CN202410484787.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2023-11-10
Filing Date
2024-04-22
Publication Date
2025-11-04
Estimated Expiration
2044-04-22

AI Technical Summary

Technical Problem

In the existing technology, increasing the resistance of the superconducting constant current switch results in a large amount of superconducting tape used, high cost, large size of the superconducting constant current switch, slow switching speed, and is not conducive to the thermal stability of the cryogenic cavity.

Method used

Superconducting pathways are set on the superconducting layer of the superconducting tape, and complex current paths are formed by material reduction and grooving to ensure that current can only pass through the superconducting pathways, thus exhibiting a large resistance in the non-superconducting state. Grooves are set between the superconducting layer and the conductive layer for physical isolation, increasing the resistance.

Benefits of technology

This invention enables a superconducting constant current switch to exhibit a large resistance in the non-superconducting state. It features a small structure, fast switching, reduced current shunting, increased resistance value of the superconducting constant current switch, and improved switching speed and thermal stability.

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Abstract

The application provides a superconducting strip structure for improving superconducting constant-current switch resistance and a manufacturing method thereof. The superconducting strip structure comprises a conductive layer, a superconducting layer, a buffer layer and a substrate layer. The substrate layer, the buffer layer and the superconducting layer are sequentially stacked. The surface of the superconducting layer, which is away from the buffer layer, comprises at least two conductive layers which are spaced apart along the direction of the strip. The superconducting layer is provided with a superconducting path for connecting the two conductive layers. The superconducting path is arranged on the superconducting layer between the two conductive layers, so that the current can only flow from one conductive layer to the other conductive layer through the superconducting path. Therefore, the superconducting layer can present a larger resistance in a non-superconducting state, and the whole superconducting constant-current switch can present a larger resistance. The structure is small and the switching is fast. The resistance of the superconducting constant-current switch when it is opened can be further increased by reducing the conduction cross-sectional area of the superconducting path and increasing the path length of the superconducting path.
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Description

Technical Field

[0001] This invention relates to the field of superconducting tape structure design technology, specifically to a superconducting tape structure and fabrication method for improving the resistance of a superconducting constant current switch. Background Technology

[0002] Superconducting constant current switches utilize the critical properties of superconducting tapes to achieve the transition between "on" and "off" states. Superconducting materials have three critical parameters: temperature, current, and magnetic field. Therefore, based on the transition conditions, superconducting constant current switches can be classified into three main types: thermally controlled, current-controlled, and field-triggered.

[0003] like Figure 1 The structure of the second-generation high-temperature superconducting tape includes a conductive layer, a superconducting layer, and a substrate layer. The conductive layer can be single or multilayered, and its material is copper and / or silver. The superconducting layer is preferably made of REBCO. Below the superconducting layer is a buffer layer, which is a dielectric material that is essentially insulating. Below the buffer layer is the substrate layer, which is often made of Hastelloy. Copper and / or silver are wrapped around the outermost layer, including the top, bottom, and sides. After the superconducting layer in the tape transforms into a non-superconducting state, because the resistance of the superconducting layer after losing superconductivity is greater than that of the copper and / or silver layers at the same temperature, a large amount of the current that originally flowed through the superconducting layer will be diverted to the copper and / or silver layers surrounding it.

[0004] like Figure 2 The equivalent circuit shown is difficult to directly excite a superconducting closed-loop coil. Therefore, a superconducting constant current switch is usually used to temporarily "open" the coil circuit to form a similar open circuit (not a completely open circuit, as the resistance of a completely open circuit is infinite; here, "similar open circuit" means that there is still a certain resistance value at both ends of the switch) so that the power supply can excite the superconducting coil.

[0005] Since the superconducting constant current switch is also part of the closed-loop coil, during excitation, the superconducting tape within the switch is not truly open-circuited but rather transitions to a non-superconducting state. The high resistance exhibited by the superconducting constant current switch at this point is relative to the extremely small resistance of the superconductor. Therefore, it is more accurate to consider the superconducting constant current switch as a variable resistor. During charging, the higher the resistance presented by the superconducting constant current switch, the better. This allows more current to flow into the coil during the excitation of the superconducting magnet by the external DC power supply, reducing the current shunting through the section of tape containing the superconducting constant current switch. This helps reduce Joule heating, which is particularly important for superconducting magnets requiring a cryogenic environment.

[0006] In the current method of increasing the resistance of the thermal control type superconducting constant current switch, the superconducting tape in the superconducting constant current switch is lengthened to increase the resistance, which results in a large amount of tape, high cost, large size of the superconducting constant current switch, large heat capacity, and relatively slow switching speed between the resistance state and the non-resistance state of the superconducting switch, which is not conducive to the thermal stability of the low-temperature cavity and needs to be improved. SUMMARY

[0007] In view of the defects in the prior art, the purpose of the present application is to provide a superconducting tape structure and a manufacturing method for increasing the resistance of a superconducting constant current switch.

[0008] According to the superconducting tape structure for increasing the resistance of a superconducting constant current switch provided by the present application, the superconducting tape structure comprises a conductive layer, a superconducting layer, a buffer layer and a substrate layer, the substrate layer, the buffer layer and the superconducting layer are sequentially stacked, the surface of the superconducting layer away from the buffer layer comprises at least two conductive layers arranged in a spaced manner along the direction of the tape, and a superconducting path is arranged on the superconducting layer to connect the two conductive layers.

[0009] Preferably, the superconducting path extends from one conductive layer to another conductive layer, and the superconducting path comprises a continuous and regular straight line segment, a connected regular arc line segment and / or an irregular shape segment.

[0010] Preferably, the superconducting path is formed by subtractive processing on the superconducting layer, and / or is formed by physical isolation on the superconducting layer, the current is transmitted along the direction of the tape, and the current flows from one conductive layer to another conductive layer along the direction of the superconducting path.

[0011] Preferably, a groove line is arranged on the superconducting layer, the depth of the groove line is greater than or equal to the thickness of the superconducting layer, and the superconducting path is formed by being wholly or partially surrounded by the groove line.

[0012] Preferably, subtractive areas are arranged on both sides of the superconducting layer along the length direction of the tape and / or on both sides of the superconducting layer along the width direction, and the superconducting path is wholly or partially formed by subtractive processing on the superconducting layer.

[0013] Preferably, the conductive layer comprises a silver covering layer and / or a copper stabilizing layer, and the area of the conductive layer is less than or equal to the area of the superconducting layer.

[0014] Preferably, the conductive layer covers the surface of the substrate layer away from the buffer layer.

[0015] According to the manufacturing method of the superconducting tape structure for increasing the resistance of a superconducting constant current switch provided by the present application, the manufacturing method comprises the following steps:

[0016] Step S1, preparing a superconducting tape for standby;

[0017] Step S2, removing the unnecessary conductive layer;

[0018] Step S3, destroying or removing the unnecessary superconducting layer and forming a superconducting path between the two adjacent conductive layers.

[0019] Preferably, the method of subtracting the unnecessary conductive layer or superconducting layer in step S3 includes chemical etching and / or mechanical processing.

[0020] Preferably, when the side of the tape is wrapped with a superconducting layer, the silver covering layer and / or copper stabilizing layer on the side of the superconducting tape is removed at the same time after the silver covering layer and / or copper stabilizing layer on the superconducting layer is removed, and then the superconducting layer that needs to be subtracted is destroyed or removed.

[0021] Preferably, in step S3, a slot line can also be processed on the superconducting layer, and a superconducting path is formed between the two adjacent conductive layers.

[0022] Preferably, in step S3, the unnecessary superconducting layer can also be destroyed or removed, and a slot line is processed on the superconducting layer to form a superconducting path; the method of subtracting the unnecessary conductive layer or superconducting layer includes chemical etching and / or mechanical processing.

[0023] Compared with the prior art, the present application has the following beneficial effects:

[0024] 1. The present application sets a superconducting path on the superconducting layer between the two conductive layers, so that the current can only flow from one conductive layer to another conductive layer through the superconducting path, thereby making the entire superconducting constant current switch present a larger resistance by utilizing the characteristic that the superconducting layer presents a larger resistance in a non-superconducting state, and the structure is small and the switching is fast.

[0025] 2. The present application cuts off the electrical connection of the two sides of the tape, ensures that the current flows mostly on the side of the superconducting layer of the superconducting tape, and when the excitation current flows from the side of the superconducting layer of the superconducting tape, the current will flow through the interval between the two conductive layers on the side of the superconducting layer away from the buffer layer. Since the buffer layer below the superconducting layer is basically insulating, and the superconducting layer presents a larger resistance in a non-superconducting state, the entire superconducting constant current switch presents a larger resistance.

[0026] 3、The application can form a subtractive area by removing the material of the side edge of the superconducting layer, further increase the resistance when the superconducting constant current switch is opened, and further remove the exposed area of the superconducting layer in the width direction of the superconducting tape, further increase the resistance when the superconducting constant current switch is opened by reducing the conduction cross-sectional area of the current path; the superconducting path and the non-superconducting path can be partially separated by setting a slot line on the superconducting layer, the length and width of the superconducting path are set to further increase the resistance when the superconducting constant current switch is opened, and the subtractive and slot line can be combined to make the current pass through the superconducting path from one conductive layer to another adjacent conductive layer, so that the entire superconducting constant current switch has a large resistance; and in the process, physical isolation (similar to a slot line) is easier to form a relatively complex superconducting path compared to subtractive.

[0027] 4、The application increases the path length of the superconducting path to further increase the resistance when the superconducting constant current switch is opened.

[0028] 5、The application forms a superconducting path between two adjacent conductive layers by laser technology, and isolates the two conductive layers except the part of the superconducting path, which helps to improve the accuracy of making the superconducting path, and helps to improve the convenience of making the high resistance state superconducting constant current switch, and further increases the resistance value of the broken resistance. BRIEF DESCRIPTION OF DRAWINGS

[0029] Other features, objects and advantages of the application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the accompanying drawings:

[0030] Figure 1 The application mainly embodies the structure diagram of the second generation superconducting tape in the background art;

[0031] Figure 2 The application mainly embodies the working principle diagram of the superconducting switch in the background art;

[0032] Figure 3 The application mainly embodies the axial side structure diagram of removing the unnecessary conductive layer of the superconducting layer away from the buffer layer in the first embodiment;

[0033] Figure 4 The application mainly embodies the top view structure diagram of removing the unnecessary conductive layer of the superconducting layer away from the buffer layer in the first embodiment;

[0034] Figure 5 The application mainly embodies the axial side structure diagram of removing the conductive layer of the superconducting tape side and the conductive layer of the superconducting layer away from the buffer surface in the first embodiment;

[0035] Figure 6A top view structural schematic diagram of removing the conductive layer and the part of the conductive layer away from the buffer surface of the superconducting layer on the side of the superconducting tape in the embodiment one of the present application;

[0036] Figure 7 A side structural schematic diagram of removing the material on the side of the coverage area of the superconducting layer in the embodiment one of the present application;

[0037] Figure 8 A top view structural schematic diagram of removing the material on the side of the coverage area of the superconducting layer in the embodiment one of the present application;

[0038] Figure 9 A side structural schematic diagram of removing the subtractive area of the superconducting layer in the embodiment one of the present application;

[0039] Figure 10 A top view structural schematic diagram of removing the subtractive area of the superconducting layer in the embodiment one of the present application;

[0040] Figure 11 A side structural schematic diagram of removing the part of the superconducting layer in the width direction which is not needed in the embodiment one of the present application;

[0041] Figure 12 A top view structural schematic diagram of removing the part of the superconducting layer in the width direction which is not needed in the embodiment one of the present application;

[0042] Figure 13 A side structural schematic diagram of the wrinkle part formed in the exposed area of the superconducting layer in the embodiment of the present application;

[0043] Figure 14 A top view structural schematic diagram of the wrinkle part formed in the exposed area of the superconducting layer in the embodiment of the present application;

[0044] Figure 15 A schematic diagram of forming a straight superconducting path by physically isolating the conductive layer from the superconducting layer by using a slotting line in the embodiment one of the present application;

[0045] Figure 16 A schematic diagram of forming a bending superconducting path by using a slotting line in the embodiment one of the present application;

[0046] Figure 17 A schematic diagram of the depth of the slotting line in the embodiment one of the present application;

[0047] Figure 18 A side structural schematic diagram of the structure of forming a superconducting path by using a slotting line and a subtractive material in the embodiment of the present application;

[0048] Figure 19 A top view structural schematic diagram of the structure of forming a superconducting path by using a slotting line and a subtractive material in the embodiment of the present application;

[0049] Figure 20 The figure shows the relationship between the resistance of the high-resistance state superconducting constant current switch and temperature.

[0050] Figure 21 The figure shows the axial side structure diagram of the application, which mainly embodies the use of the slotting line to isolate the superconducting layer width on both sides.

[0051] Figure 22 The figure shows the top view of the application, which mainly embodies the use of the slotting line to isolate the superconducting layer width on both sides.

[0052] Figure 23 The figure shows the axial side structure diagram of the application, which mainly embodies the use of the slotting line to isolate the superconducting layer width on both sides.

[0053] Figure 24 The figure shows the top view of the application, which mainly embodies the use of the slotting line to isolate the superconducting layer width on both sides.

[0054] Figure 25 The figure shows the axial side structure diagram of the application, which mainly embodies the use of the slotting line to isolate the superconducting layer width on both sides.

[0055] Figure 26 The figure shows the top view of the application, which mainly embodies the use of the slotting line to isolate the superconducting layer width on both sides.

[0056] Figure 27 The figure shows the axial side structure diagram of the application, which mainly embodies the use of the slotting line to isolate the superconducting layer width on both sides.

[0057] Figure 28 The figure shows the top view of the application, which mainly embodies the use of the slotting line to isolate the superconducting layer width on both sides.

[0058] The figure shows: 1, base layer; 2, buffer layer; 3, superconducting layer; 4, silver cover layer; 5, copper stabilizing layer; 6, conductive layer; 7, slotting line; 8, superconducting path. DETAILED DESCRIPTION

[0059] The application will be described in detail below with specific embodiments. The following embodiments will help those skilled in the art to further understand the application, but do not limit the application in any form. It should be noted that for those skilled in the art, without departing from the concept of the application, a number of changes and improvements can be made. These are within the scope of the application.

[0060] It should be noted that the length direction of the application refers to the direction of the strip, and the width direction of the application refers to the width direction of the strip. It should be noted that the dashed line in the application Figures 1-28 represents the slotting line 7.

[0061] Example 1

[0062] As shown in Figure 3 、 Figure 4 、 Figure 5 and Figure 6 , the application provides a superconducting tape structure and manufacturing method for improving superconducting constant current switch resistance, which comprises a conductive layer 6, a superconducting layer 3, a buffer layer 2 and a substrate layer 1. The substrate layer 1, the buffer layer 2 and the superconducting layer 3 are sequentially stacked. The surface of the superconducting layer 3 away from the buffer layer 2 includes at least two conductive layers 6 arranged in intervals along the tape direction. The superconducting layer 3 is provided with a superconducting path 8 for connecting the two conductive layers 6.

[0063] Since the buffer layer 2 in the second-generation superconducting tape is basically insulating, compared with the prior art, the superconducting tape structure of the application can ensure that most of the current flows through the superconducting layer 3 of the superconducting tape. When the excitation current flows through the superconducting layer 3 of the superconducting tape, the current will flow through the interval between the two conductive layers 6 on the surface of the superconducting layer 3 away from the buffer layer 2. Since the buffer layer 2 below the superconducting layer 3 is basically insulating, and the superconducting layer 3 will present a large resistance in the non-superconducting state, the entire superconducting constant current switch will present a large resistance.

[0064] The superconducting path 8 of the application is conductive below the critical temperature, and is in a high resistance state above the critical temperature. The current is transmitted along the tape direction, and the current flows from one conductive layer 6 to another conductive layer 6 along the direction of the superconducting path 8, which ensures the stability of the switch operation, and the path length of the superconducting path 8 can be set according to actual needs to obtain the required resistance value of the superconducting constant current switch when it is opened.

[0065] Specifically, the conductive layer 6 of the application comprises a silver covering layer 4 and / or a copper stabilizing layer 5. The superconducting tape structure of the application can select the silver covering layer 4 as the conductive layer 6, or select the copper stabilizing layer 5 as the conductive layer 6, or select both the silver covering layer 4 and the copper stabilizing layer 5 to form the conductive layer 6. The application preferably comprises a silver covering layer 4 and a copper stabilizing layer 5.

[0066] Further, the application takes the conductive layer 6 as the silver covering layer 4 and the copper stabilizing layer 5, and the surface of the superconducting layer 3 away from the buffer layer 2 is provided with two conductive layers 6 arranged in intervals along the length direction of the superconducting tape. The silver covering layer 4 covers the surface of the superconducting layer 3 away from the buffer layer 2, and the copper stabilizing layer 5 covers the surface of the silver covering layer 4 away from the superconducting layer 3.

[0067] It should be noted that the superconducting layer 3 of the present application can be located entirely on the side of the buffer layer 2 away from the base layer 1, and can also partially or completely wrap the side of the buffer layer 2 and / or the base layer 1. If the superconducting layer 3 wraps the buffer layer 2 and / or partially or completely wraps the side of the base layer 1, the superconducting layer 3 wrapping the buffer layer 2 and / or the side of the base layer 1 can be removed or destroyed by mechanical or chemical means. The unwanted superconducting layer 3 can also be physically isolated from both the superconducting path 8 and the conductive layer 6.

[0068] As shown in Figure 7 , Figure 8 , Figure 9 and Figure 10 , more specifically, the area of the conductive layer 6 is less than or equal to the area of the superconducting layer 3, the area of the superconducting layer 3 is less than or equal to the area of the buffer layer 2, and the area of the buffer layer 2 is less than or equal to the area of the base layer 1. The area of the superconducting layer 3 can be less than or equal to the area of the buffer layer 2 by subtracting the two side regions in the length direction and / or the two side regions in the width direction of the superconducting layer 3, which further increases the resistance of the superconducting constant current switch when it is opened while ensuring the function of the superconducting constant current switch.

[0069] The superconducting path 8 extends from one conductive layer 6 to another conductive layer 6 and can electrically connect two adjacent conductive layers 6, and the resistance of the superconducting constant current switch when it is opened can be further increased by reducing the conduction cross-sectional area of the superconducting path 8 and increasing the path length of the superconducting path 8. The superconducting path 8 includes continuous regular straight line segments, connected regular arc line segments, and / or irregular shape segments, and in actual production, the superconducting path 8 with a specific shape that meets the actual design requirements can be formed by combining the regular straight line segments, the connected regular arc line segments, and / or the irregular shape segments. Therefore, any improvement to the path and shape of the superconducting path 8 falls within the scope of the present application.

[0070] It should be noted that the subtractive treatment of the superconducting layer 3 can be to remove the superconducting material at the corresponding position, or to destroy the superconducting properties of the superconducting material in the corresponding region. The material in the superconducting layer 3 that loses superconducting properties is no longer considered part of the superconducting layer 3, which further increases the resistance of the superconducting constant current switch when it is opened.

[0071] It should be noted that the present application does not make specific limitations on the number of conductive layers 6 provided on the superconducting layer 3 along the strip material direction and the size of the interval between adjacent two conductive layers 6. Any number of conductive layers 6 can be inserted between the adjacent two conductive layers 6 described in the application, and any improvement to the number of conductive layers 6 and the size of the interval falls within the scope of the present application.

[0072] As shown in Figure 7 , Figure 8 , Figure 9 , Figure 10 ,Figure 11 and Figure 12 For the sake of understanding, the present application provides a specific embodiment of forming superconducting path 8 by subtractive process as shown in the following:

[0073] Superconducting layer 3 is provided with subtractive area on both sides along the length direction and / or both sides along the width direction, superconducting path 8 is formed by subtractive process on superconducting layer 3. The material on both sides along the length direction of superconducting layer 3 can be removed or destroyed, forming preliminary subtractive area on both sides along the length direction of superconducting layer 3. The material on both sides along the width direction of superconducting layer 3 can also be removed or destroyed. Further, the material on both sides along the width direction of superconducting layer 3 between two adjacent conductive layers 6 is removed or destroyed, so that the width of superconducting layer 3 between two adjacent conductive layers 6 is the same as the width of conductive layer 6, and finally the width of superconducting layer 3 is the same as the width of conductive layer 6. Further, the material on both sides along the width direction of superconducting layer 3 between two adjacent conductive layers 6 is removed or destroyed, so that the width of superconducting layer 3 between two adjacent conductive layers 6 is smaller than the width of conductive layer 6. By reducing the cross-sectional area of superconducting path 8, the resistance of superconducting constant current switch when opened can be further increased. As shown in Figure 13 and Figure 14 Preferably, superconducting path 8 can extend in a first direction from one conductive layer 6 and then extend in a second direction, the first direction and the second direction are not parallel, so that the path length of superconducting path 8 can be increased, and the resistance of superconducting constant current switch when opened can be further increased.

[0074] As shown in Figure 15 , Figure 16 and Figure 17 For the sake of understanding, the present application provides a specific embodiment of forming superconducting path 8 by physical isolation as shown in the following:

[0075] Superconducting layer 3 is provided with groove line 7, the depth of groove line 7 is greater than or equal to the thickness of superconducting layer 3, superconducting path 8 is formed by groove line 7. Groove line 7 can isolate two adjacent conductive layers 6 except the part of superconducting path 8, groove line 7 can be made by laser ablation, which is convenient and precise. Groove line 7 is provided with at least two between two adjacent conductive layers 6, forming superconducting path 8 connecting two adjacent conductive layers 6, groove line 7 is also provided around the circumferential side of two conductive layers 6, groove line 7 provided around the circumferential side of conductive layer 6 intersects with groove line 7 forming superconducting path 8 or extends into superconducting path 8, ensuring that two adjacent conductive layers 6 are only electrically connected through superconducting path 8. Therefore, it is necessary to emphasize that any setting of groove line 7 direction and shape as long as it meets the electrical connection of two adjacent conductive layers 6 and falls within the protection scope of the present application.

[0076] As shown in Figure 18 andFigure 19 As shown, in order to facilitate understanding, the present application provides a specific embodiment of forming superconducting path 8 by subtractive and physical isolation: the material on both sides of superconducting layer 3 in length direction can be removed or destroyed, a preliminary subtractive is formed on both sides of superconducting layer 3 in length direction, the material on both sides of superconducting layer 3 in width direction can also be removed or destroyed, and superconducting path 8 electrically connecting adjacent two conductive layers 6 can be formed by processing groove line 7 on superconducting layer 3, and further processing groove line 7 on superconducting layer 3 ensures that adjacent two conductive layers 6 are only electrically connected through superconducting path 8. In terms of process, physical isolation is easier to form relatively complex superconducting path 8 than subtractive.

[0077] It needs to be further explained that the superconducting tape structure of the present application can be directly processed, or can be made on the basis of the second-generation superconducting tape in the prior art. The superconducting tape structure of the present application can make conductive layer 6 cover the surface of base layer 1 away from buffer layer 2, and only needs to ensure that conductive layer 6 located on the surface of base layer 1 away from buffer layer 2 is not connected with conductive layer 6 located on the surface of superconducting layer 3 away from buffer layer 2. At this time, silver covering layer 4 can be selected as conductive layer 6, copper stabilizing layer 5 can also be selected as conductive layer 6, or silver covering layer 4 and copper stabilizing layer 5 can be selected to form conductive layer 6 together, specifically, silver covering layer 4 covers the surface of base layer 1 away from buffer layer 2, and copper stabilizing layer 5 covers the surface of silver covering layer 4 away from base layer 1. The structure of the superconducting tape without conductive layer 6 covering the surface of base layer 1 away from buffer layer 2 can also be selected.

[0078] As Figure 20 shown, the resistance-temperature relationship curve of high-resistance-state superconducting constant-current switch is shown, and five repeated experiments are performed. The superconducting tape structure of the present application and the conventional second-generation superconducting tape in the prior art are used for testing,

[0079] The test data is shown in Figure 20 The resistance of high-resistance-state superconducting constant-current switch using the superconducting tape structure of the present application in open state (temperature is 110K) is about 976mΩ, and the resistance of superconducting constant-current switch made of the same conventional second-generation superconducting tape in the prior art in open state is only about 1mΩ. Compared with the conventional second-generation superconducting tape in the prior art, the resistance of superconducting constant-current switch made of the superconducting tape of the present application in open state is increased by nearly 1000 times.

[0080] The present application also provides a manufacturing method of superconducting tape structure for improving the resistance of superconducting constant-current switch, and the manufacturing method comprises the following steps:

[0081] Step S1, a superconducting tape is prepared for standby.

[0082] Step S2, removing unnecessary conductive layer 6.

[0083] Step S3, destroying or removing the unnecessary superconducting layer 3 and forming a superconducting path 8 between the two adjacent conductive layers 6.

[0084] It should be noted that the method of removing the unnecessary conductive layer 6 or superconducting layer 3 includes chemical etching and / or mechanical processing. The mechanical processing method includes polishing. The chemical etching method includes: etching the copper stabilizing layer 5 with a ferric chloride ethanol solution prepared by mixing ferric chloride powder and anhydrous ethanol solution at a ratio of 1 g: 10 ml. Etching the silver covering layer 4 with a mixed solution prepared by mixing ammonia water and hydrogen peroxide solution at a volume ratio of 1:2. The concentration of the ammonia water is 25%, and the concentration of the hydrogen peroxide solution is 30%.

[0085] The superconducting layer 3 is etched with an acidic solution. Specifically, when the superconducting layer 3 is etched with an acidic solution, there are three stages according to the time: the first stage is to destroy the superconducting properties of the superconducting material, at which time the superconducting properties of the superconducting material are destroyed. The second stage is to remove the superconducting layer 3 material, at which time the superconducting layer 3 material is removed. The third stage is to remove part of the buffer layer 2 material. It should be noted that the three stages of processing the superconducting layer 3 described above can solve the technical problems of the present application and achieve the purpose of the present application, so the three stages are within the scope of protection of the present application.

[0086] More specifically, based on the second-generation superconducting tape, the silver covering layer 4 and / or the copper stabilizing layer 5 on the superconducting layer 3 can be partially removed. Some superconducting tapes may be wrapped with a superconducting layer 3 on the side during actual production and preparation. To prevent the superconducting surface and the non-superconducting surface from conducting through the superconducting layer 3 wrapped on the side below the superconducting critical temperature, after the silver covering layer 4 and the copper stabilizing layer 5 on the superconducting layer 3 are removed, the silver covering layer 4 and / or the copper stabilizing layer 5 on the side of the superconducting tape are preferably removed at the same time. Then the superconducting layer 3 in the subtractive area of the superconducting tape is destroyed or removed to increase the resistance when the superconducting constant-current switch is opened. Preferably, the superconducting layer 3 in the middle of the superconducting tape can be further destroyed or removed in the width direction to further increase the resistance when the superconducting constant-current switch is opened by reducing the conduction cross-sectional area of the current path. It can also be preferable to further destroy or remove the superconducting layer 3 in the middle of the tape to further increase the resistance when the superconducting constant-current switch is opened by reducing the cross-sectional area while increasing the length of the current path.

[0087] In another possible implementation, for step S3, a laser ablation slot line 7 can also be formed on the superconducting layer 3 to form a superconducting path 8 between the two adjacent conductive layers 6.

[0088] In another possible implementation, for step S3, the unnecessary part of the superconducting layer 3 can also be destroyed or removed, and a laser processing slot line 7 can be formed on the superconducting layer 3 to form a superconducting path 8.

[0089] Preferred Example 1

[0090] Based on embodiment one, the application also provides a manufacturing method of superconducting tape structure for improving superconducting constant current switch resistance, which first prepares a superconducting tape:

[0091] (1) Iron trichloride powder and anhydrous ethanol solution are prepared into an iron trichloride ethanol solution in a proportion of 1g:10ml, which is used to remove the unnecessary copper layer.

[0092] (2) A mixed solution is prepared from ammonia water and hydrogen peroxide solution in a volume fraction ratio of 1:2, and the tape in step (1) is put into the mixed solution to remove the unnecessary silver layer. The concentration of the ammonia water is 25%, and the concentration of the hydrogen peroxide solution is 30%.

[0093] (3) The tape processed in step (2) is put into an acetic acid solution for reaction to destroy / remove the superconducting layer 33 in the superconducting tape subtractive area and the superconducting layer 3 that may be wrapped on the side of the superconducting tape.

[0094] Preferred Example 2

[0095] Based on embodiment one, the application also provides a manufacturing method of superconducting tape structure for improving superconducting constant current switch resistance, which first prepares a superconducting tape:

[0096] (1) Iron trichloride powder and anhydrous ethanol solution are prepared into an iron trichloride ethanol solution in a proportion of 1g:10ml, which is used to remove the unnecessary copper layer.

[0097] (2) A mixed solution is prepared from ammonia water and hydrogen peroxide solution in a volume fraction ratio of 1:2, and the tape in step (1) is put into the mixed solution to remove the unnecessary silver layer. The concentration of the ammonia water is 25%, and the concentration of the hydrogen peroxide solution is 30%.

[0098] (3) The two length direction sides of the tape processed in step (2) are polished by a polishing machine to remove the superconducting layer 3 that may be wrapped on the side of the superconducting tape and cut off the connection between the superconducting layer 3 and the hastelloy layer on the side of the superconducting tape; for the two width direction sides, an acid solution is used to destroy / remove the superconducting layer 3 that may be wrapped on the side of the superconducting tape.

[0099] Preferred Example 3

[0100] Based on embodiment one, the application also provides a manufacturing method of superconducting tape structure for improving superconducting constant current switch resistance, which first prepares a superconducting tape:

[0101] (1) The two lengthwise sides of the tape are polished using a polishing machine to remove the copper layer, silver layer, and superconducting layer 3 on the sides of the superconducting tape.

[0102] (2) Iron trichloride powder and anhydrous ethanol solution are mixed in a ratio of 1 g:10 ml to form an iron trichloride ethanol solution, which is used to remove the unwanted copper layer.

[0103] (3) The tape in step (1) is placed in a mixed solution of ammonia water and hydrogen peroxide solution in a volume ratio of 1:2 to remove the unwanted silver layer. The concentration of the ammonia water is 25%, and the concentration of the hydrogen peroxide solution is 30%.

[0104] Preferred Example 4

[0105] As shown in Figure 15 and Figure 16 Based on Example One, the present application provides a superconducting tape structure for a superconducting constant current switch, in which a groove line 7 is formed on the superconducting layer 3 to form a superconducting path 8 that connects two conductive layers 6 arranged in adjacent intervals, and the groove line 7 isolates the portions of the two conductive layers 6 that are removed by the superconducting path 8. The present embodiment provides a feasible technical solution.

[0106] In a top view of the superconducting tape, the two conductive layers 6 in an island state are connected by the groove line 7 to form a superconducting path 8 that extends from one conductive layer 6 to the other conductive layer 6.

[0107] The present embodiment provides a feasible extension scheme of the superconducting path 8, in which one end of the superconducting path 8 extends directly from one conductive layer 6 to the other conductive layer 6 along the length direction of the superconducting tape.

[0108] The present embodiment provides another feasible extension scheme of the superconducting path 8, in which one end of the superconducting path 8 extends a certain length along the length direction of the superconducting tape from one conductive layer 6, then extends a certain length along the width direction of the superconducting tape after a turn, and then extends a certain length along the length direction of the superconducting tape after another turn until it extends to the other conductive layer 6. It should be noted that the number of turns and the turning angle of the extension of the superconducting path 8 can be designed according to actual conditions.

[0109] The groove line 7 is also arranged on the peripheral side of the two conductive layers 6 to isolate the portions of the two conductive layers 6 that are removed by the superconducting path 8. Specifically, the groove line 7 forms a rectangular frame in a top view of the superconducting tape, which surrounds the two conductive layers 6. The groove line 7 on the two sides perpendicular to the extension direction of the superconducting path 8 extends a groove line 7 on each side, and the two groove lines 7 on the two sides of the superconducting path 8 are connected to form a rectangular frame that surrounds the two conductive layers 6.

[0110] One of the scribe lines 7 extending from the upper side of the superconducting path 8 is connected with the edge line of the rectangular frame on the upper side, and one of the scribe lines 7 extending from the lower side of the superconducting path 8 is connected with the edge line of the rectangular frame on the lower side, so as to realize the isolation of the two conductive layers 6 except the superconducting path 8.

[0111] It should be noted that the two scribe lines 7 extending from the superconducting path 8 can also extend into the superconducting path 8, so as to meet the requirements that the superconducting path 8 is conductive when the temperature is lower than the critical temperature, and the superconducting path 8 is in a high resistance state when the temperature is higher than the critical temperature.

[0112] Preferred Example 5

[0113] As shown in Figure 18 , Figure 19 , Figure 21 , Figure 22 , Figure 23 , Figure 24 , Figure 25 , Figure 26 , Figure 27 and Figure 28 , based on example one, the application provides a superconducting tape structure for a superconducting constant current switch, which can be first subjected to subtractive machining on both sides of the superconducting layer 3 in the length direction by chemical or physical means, and then scribe lines 7 are formed on both sides of the superconducting layer 3 in the width direction by laser processing.

[0114] It should be noted that the technical solution of the present application forms the superconducting path 8 by subtractive machining and then laser processing scribe lines 7, and ensures that the current can only be transmitted between the two conductive layers 6 through the superconducting path 8.

[0115] As shown in Figure 18 and 19 , part of the superconducting layer 3 material is reserved on both sides of the width of the two conductive layers 6, and one scribe line 7 parallel to the length direction of the tape is arranged on both sides of the width of the two conductive layers 6 for physical isolation, so that the current can only be transmitted between the two conductive layers 6 through the superconducting path 8.

[0116] As shown in Figure 21 and Figure 22 , one scribe line 7 parallel to the length direction of the tape is arranged on both sides of the width of the two conductive layers 6 for physical isolation, so as to ensure that the current flows in the superconducting layer 3 on which the conductive layer 6 is located.

[0117] As shown in Figure 23 and Figure 24As shown, the superconducting layers 3 on both sides of the width direction of the two conductive layers 6 are partially subtracted to ensure that the remaining superconducting layer 3 material on both sides of the width direction of the conductive layers 6 is a whole with the superconducting layer 3 material located between the two conductive layers 6. A groove line 7 parallel to the strip length direction is set on both sides of the width of the two conductive layers 6 for physical isolation. Current can only be transmitted between the two conductive layers 6 through the superconducting path 8.

[0118] like Figure 25 and Figure 26 As shown, in Figure 23 and Figure 24 Based on this, laser is used to process grooves 7 on the superconducting layer 3, which increases the path length and reduces the path width of the superconducting pathway 8 connecting the two conductive layers 6. Compared with subtractive processing, laser processing of grooves 7 makes it easier to form relatively complex superconducting pathways 8. The conductive layer 6 may include a silver capping layer 4 and / or a copper stabilizing layer 5.

[0119] like Figure 27 and 28 As shown, the superconducting layer 3 material on both sides of the width of the two conductive layers 6 can be completely reduced, and the superconducting layer 3 material between the two conductive layers 6 can be partially reduced. Then, by setting a groove line 7 parallel to the length direction of the strip on both sides of the width of the superconducting layer 3, physical isolation is achieved, so that the current can only be transmitted between the two conductive layers 6 through the superconducting path 8.

[0120] It should be noted that this application does not specifically limit the shape of the superconducting passage 8 formed by subtractive processing and laser grooving 7. Any improvement to the shape of the superconducting passage 8 falls within the protection scope of this application.

[0121] Variant Example 1

[0122] Based on Embodiment 1, the present invention provides a superconducting tape structure for a superconducting constant current switch. The surface of the substrate layer 1 facing away from the buffer layer 2 may or may not have a conductive layer 6.

[0123] The conductive layer 6 can be a copper stabilizing layer 5. The conductive layer 6 located on the side of the substrate 1 away from the buffer layer 2 can be a copper stabilizing layer 5 covering the side of the substrate 1 away from the buffer layer 2.

[0124] The conductive layer 6 can also be a silver capping layer 4. The conductive layer 6 located on the side of the base layer 1 away from the buffer layer 2 can be a silver capping layer 4 covering the side of the base layer 1 away from the buffer layer 2.

[0125] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like refer to the orientation or positional relationship shown in the drawings, and are only intended to facilitate the description of the present application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0126] The specific embodiments of the present application are described above. It should be understood that the present application is not limited to the above specific embodiments, and various changes or modifications can be made by those skilled in the art within the scope of the claims, which do not affect the essential content of the present application. The embodiments of the present application and the features in the embodiments can be arbitrarily combined with each other without conflict, provided that they do not conflict.

Claims

1. A superconducting tape structure for boosting the superconducting constant current switching resistance, characterized by, The superconducting layer (3) is provided with a superconducting path (8) for connecting the two conductive layers (6). The superconducting path (8) is formed by subtractive processing of the superconducting layer (3) and / or physical isolation of the superconducting layer (3), and the current is transmitted along the tape, and the current flows from one of the conductive layers (6) to the other conductive layer (6) along the superconducting path (8). The superconducting path (8) extends from one conductive layer (6) to the other conductive layer (6). The superconducting path (8) includes continuous straight line segments, connected regular arc line segments, and / or irregular shape segments.

2. The superconducting tape structure of claim 1, wherein the superconducting constant current switch resistor is raised. The superconducting layer (3) is provided with a groove line (7), and the depth of the groove line (7) is greater than or equal to the thickness of the superconducting layer (3). The superconducting path (8) is formed by the groove line (7) surrounding all or part of it.

3. The superconducting tape structure for improving the resistance of a superconducting constant current switch as described in claim 1, characterized in that, The superconducting layer (3) is provided with a subtractive area on both sides along the length direction and / or on both sides along the width direction of the tape. The superconducting path (8) is formed by subtractive processing of the superconducting layer (3).

4. The superconducting tape structure for improving the resistance of a superconducting constant current switch as described in claim 1, characterized in that, The conductive layer (6) includes a silver cover layer (4) and / or a copper stabilizing layer (5). The area of the conductive layer (6) is less than or equal to the area of the superconducting layer (3).

5. The superconducting tape structure of claim 1, wherein the superconducting constant current switch resistor is a lift superconducting constant current switch resistor. The conductive layer (6) covers the surface of the substrate layer (1) away from the buffer layer (2). The method for manufacturing the superconducting tape structure for improving the resistance of the superconducting constant current switch according to any one of claims 1-6 comprises the following steps:

6. The superconducting tape structure of claim 1, wherein the superconducting constant current switch resistor is a lift superconducting constant current switch resistor. Step S1, prepare a superconducting tape for standby; 7. A method of fabricating a superconducting tape structure for enhancing the superconducting persistent switch resistance, the method comprising: Step S2, remove the unnecessary conductive layer (6); Step S3, damage or remove the unnecessary superconducting layer (3) and form a superconducting path (8) between the adjacent two conductive layers (6). The method for subtracting the unnecessary conductive layer (6) or superconducting layer (3) in step S3 includes chemical corrosion and / or mechanical processing. When the side surface of the tape is wrapped with the superconducting layer (3), after removing the silver cover layer (4) and / or copper stabilizing layer (5) on the superconducting layer (3), the silver cover layer (4) and / or copper stabilizing layer (5) on the side surface of the superconducting tape is also removed, and then the superconducting layer (3) that needs to be subtracted is damaged or removed.

8. The method of claim 7, wherein the superconducting tape structure is a high- tc superconducting tape structure. In step S3, a groove line (7) can also be processed on the superconducting layer (3) to form a superconducting path (8) between the adjacent two conductive layers (6).

9. The method of making a superconducting tape structure for enhancing the resistance of a superconducting constant current switch of claim 8, wherein, In step S3, the unnecessary superconducting layer (3) can also be damaged or removed, and a groove line (7) can be processed on the superconducting layer (3) to form a superconducting path (8).

10. The method of claim 7, wherein the superconducting tape structure is a high- tc superconducting tape structure. ​ 11. The method of making a superconducting tape structure for enhancing the resistance of a superconducting constant current switch of claim 7, wherein, ​

Citation Information

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