Capacitor and electronic device

Abstract

The embodiment of the invention provides a capacitor and electronic equipment, relates to the technical field of capacitors, and is used for solving the problem of circuit board burnout caused by short-circuit failure of the capacitor and improving the safety of a circuit. The capacitor comprises a base body, a first electrode, a second electrode, a plurality of first polar plates and a plurality of second polar plates. The first electrode is arranged on the first side of the substrate. The second electrode is arranged on the second side of the substrate. The first side and the second side of the base body are different sides of the base body. The first polar plate is connected with the first electrode. The plurality of second polar plates and the plurality of first polar plates are alternately stacked one by one, and a first insulating layer is arranged between any adjacent first polar plate and second polar plate. The second polar plate comprises a second main body part and a second fusing part, and the second main body part is connected with the second electrode through the second fusing part. And the second fusing part is used for fusing under the condition that the first polar plate and the second polar plate are short-circuited. The capacitor is used for a circuit.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of capacitors, and in particular to a capacitor and an electronic device. Background Art

[0002] Capacitors are devices that hold electric charge. They are one of the electronic components used in large quantities in electronic devices. They are widely used in circuits for DC isolation, AC passing, coupling, filtering, tuning circuits, energy conversion, and control. At present, a large number of capacitors are used in various circuit boards such as motherboards and buckle cards. However, abnormal heating caused by capacitors can cause the circuit boards near the capacitors to burn, resulting in the circuit boards being scrapped beyond repair, or even causing fires. Summary of the invention

[0003] The embodiments of the present application provide a capacitor and an electronic device to solve the problem of circuit board burning caused by abnormal failure of the capacitor and improve the safety of the circuit.

[0004] To achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0005] On the one hand, a capacitor is provided. The capacitor includes a substrate, a first electrode, a second electrode, a plurality of first plates, and a plurality of second plates. The first electrode is arranged on a first side of the substrate. The second electrode is arranged on a second side of the substrate. The first side and the second side of the substrate are different sides of the substrate. The first plate is connected to the first electrode. A plurality of second plates are alternately stacked with a plurality of first plates, and the first insulating layer is arranged between any adjacent first plates and second plates. The second plate includes a second main body and a second fuse, and the second main body is connected to the second electrode through the second fuse. The second fuse is used to fuse when the first plate and the second plate are short-circuited.

[0006] In the capacitor of the embodiment of the present application, when the first electrode plate and the second electrode plate are short-circuited, the second fuse part heats up and melts under the action of the short-circuit current, so that the short-circuit failure of the first electrode plate and the second electrode plate in the capacitor is converted into an open circuit failure, thereby solving the problem of the capacitor and the circuit board in the surrounding area being burned due to continuous heat generated by the failure of the capacitor, improving the maintainability and reliability of the circuit board, and improving the safety of the circuit board.

[0007] In some embodiments, in the same second electrode plate, the resistance of the second fuse is greater than the resistance of the second main body, and the melting point of the second main body is less than or equal to the melting point of the second fuse. In this case, after the first electrode plate and the second electrode plate are short-circuited, the heating efficiency of the second fuse is high, and the second fuse reaches the melting point first and starts to melt and disconnect. Alternatively, the resistance of the second fuse is equal to the resistance of the second main body, and the melting point of the second fuse is less than the melting point of the second main body. In this case, after the first electrode plate and the second electrode plate are short-circuited, the second fuse reaches the melting point first and starts to melt and disconnect.

[0008] In some embodiments, in the same second electrode plate, the second fuse part and the second main body part are made of the same material, and the cross-sectional area of ​​the second fuse part is smaller than the cross-sectional area of ​​the second main body part. At this time, the cross-sectional area of ​​the second fuse part is smaller, and the resistance at each cross-sectional area is larger, so that the heating efficiency of the second fuse part is greater than the heating efficiency of the second main body part, so that after the first electrode plate and the second electrode plate are short-circuited, the second fuse part first reaches the melting point and begins to melt and disconnect. In addition, the material of the second fuse part is the same as that of the second main body part, and the second fuse part and the second main body part can be prepared using the same process, which is conducive to improving production efficiency.

[0009] In some embodiments, in the same second electrode plate, the thickness of the second fuse portion is equal to that of the second main body portion. The thickness is the dimension of the second fuse portion or the second main body portion along the stacking direction of the first electrode plate and the second electrode plate. Moreover, in the same second electrode plate, the width of the second fuse portion is smaller than the width of the second main body portion. In this way, the cross-sectional area of ​​the second fuse portion is smaller than the cross-sectional area of ​​the second main body portion. Moreover, since the thickness of the second fuse portion is equal to that of the second main body portion, the second main body portion and the second fuse portion can be directly formed in the same printing process, which is conducive to improving production efficiency.

[0010] In some embodiments, the second fuse section includes a plurality of subsections arranged at intervals, the plurality of subsections are arranged along the width direction of the second fuse section, and each of the subsections is connected to the second main body section and the second electrode. In this way, during the process, if one subsection is poorly connected to the second main body section and / or the second electrode, the other subsections can still play the role of conducting and fusing, which is beneficial to improving product reliability and production yield.

[0011] In some embodiments, the number of the second fuse parts is one, so that the width of the second fuse part can be set larger, so that the second fuse part has greater strength and stronger shear resistance, which can reduce the risk of failure due to accidental breakage.

[0012] In some embodiments, the second electrode plate also includes a second connecting portion. In the same second electrode plate, the second fuse portion is connected to the second electrode through the second connecting portion, and the width of the second connecting portion is greater than the width of the second fuse portion, so as to increase the connection area between the second electrode and the second electrode and improve the connection reliability and conductivity.

[0013] In some embodiments, along the stacking direction of the first electrode plate and the second electrode plate, the second fuse part is staggered from the orthographic projection of the first electrode plate on a reference plane, and the reference plane is a plane where the surface of the first electrode plate close to the second electrode plate is located. In this way, the risk of the second fuse part being short-circuited with another adjacent first electrode plate after being disconnected can be reduced, and the reliability of the disconnection formed by the second fuse part can be improved.

[0014] In some embodiments, the material of the second fuse portion includes at least one of metal, conductive plastic, conductive rubber, conductive fiber fabric, conductive coating, conductive adhesive, transparent conductive film and carbon black.

[0015] In some embodiments, the first electrode plate includes a first main body and a first fuse, the first main body is connected to the first electrode through the first fuse, and the first fuse is used to fuse when the first electrode plate is short-circuited with the second electrode plate.

[0016] In this case, when the first electrode plate and the second electrode plate are short-circuited, the first fuse part heats up and melts under the action of the short-circuit current, so that the short-circuit failure of the first electrode plate and the second electrode plate in the capacitor is transformed into an open circuit failure, solving the problem of the capacitor and the circuit board in the surrounding area being burned due to continuous heat caused by the failure of the capacitor, improving the maintainability and reliability of the circuit board, and improving the safety of the circuit board.

[0017] In some embodiments, in the same first electrode plate, the resistance of the first fuse is greater than the resistance of the first main body, and the melting point of the first main body is less than or equal to the melting point of the first fuse. In this case, after the first electrode plate and the second electrode plate are short-circuited, the heating efficiency of the first fuse is high, and the first fuse reaches the melting point first and starts to melt and disconnect. Or, the resistance of the first fuse is equal to the resistance of the first main body, and the melting point of the first fuse is less than the melting point of the first main body. In this case, after the first electrode plate and the second electrode plate are short-circuited, the first fuse reaches the melting point first and starts to melt and disconnect.

[0018] In some embodiments, in the same first electrode plate, the first fuse part and the first main body part are made of the same material, and the cross-sectional area of ​​the first fuse part is smaller than the cross-sectional area of ​​the first main body part. At this time, the cross-sectional area of ​​the first fuse part is smaller, and the resistance at each cross-sectional area is larger, so that the heating efficiency of the first fuse part is greater than the heating efficiency of the first main body part, so that after the first electrode plate and the second electrode plate are short-circuited, the first fuse part first reaches the melting point and begins to melt and disconnect. In addition, the material of the first fuse part is the same as that of the first main body part, and the first fuse part and the first main body part can be prepared using the same process, which is conducive to improving production efficiency.

[0019] In some embodiments, in the same first electrode plate, the first fuse portion has the same thickness as the first main body portion. The thickness is the dimension of the first fuse portion or the first main body portion along the stacking direction of the first electrode plate and the second electrode plate. Moreover, in the same first electrode plate, the width of the first fuse portion is smaller than the width of the first main body portion. In this way, the cross-sectional area of ​​the first fuse portion is smaller than the cross-sectional area of ​​the first main body portion. Furthermore, since the thickness of the first fuse portion is equal to that of the first main body portion, the first main body portion and the first fuse portion can be directly formed in the same printing process, which is conducive to improving production efficiency.

[0020] In some embodiments, the first fuse section includes a plurality of subsections arranged at intervals, the plurality of subsections are arranged along the width direction of the first fuse section, and each of the subsections is connected to the first main body section and the first electrode. In this way, during the process, if one subsection is poorly connected to the first main body section and / or the first electrode, the other subsections can still play the role of conducting and fusing, which is beneficial to improving product reliability and production yield.

[0021] In some embodiments, the number of the first fuse parts is one, so that the width of the first fuse part can be set larger, so that the first fuse part has greater strength and stronger shear resistance, which can reduce the risk of failure due to accidental breakage.

[0022] In some embodiments, the first electrode plate also includes a first connecting portion. In the same first electrode plate, the first fuse portion is connected to the first electrode through the first connecting portion, and the width of the first connecting portion is greater than the width of the first fuse portion, so as to increase the connection area between the first electrode and the first electrode and improve the connection reliability and conductivity.

[0023] In some embodiments, along the stacking direction of the first electrode plate and the second electrode plate, the first fuse part and the orthographic projection of the second electrode plate on the reference plane are staggered, and the reference plane is the plane where the surface of the first electrode plate close to the second electrode plate is located. In this way, the risk of the first fuse part being short-circuited again with another adjacent second electrode plate after being disconnected can be reduced, and the reliability of the disconnection formed by the first fuse part can be improved.

[0024] In some embodiments, the material of the first fuse portion includes at least one of metal, conductive plastic, conductive rubber, conductive fiber fabric, conductive coating, conductive adhesive, transparent conductive film and carbon black.

[0025] In some embodiments, along the stacking direction of the first electrode plate and the second electrode plate, a plurality of the first main body parts and a plurality of the second main body parts are overlapped. A plurality of the first fuse parts are located on a side of a plurality of the second main body parts away from the second fuse parts, and a plurality of the second fuse parts are located on a side of a plurality of the first main body parts away from the first fuse parts, so as to reduce the risk of accidental short circuit between each fuse part and other adjacent electrode plates.

[0026] In some embodiments, the substrate further includes a second insulating layer, and the second insulating layer covers the first electrode plates and the second electrode plates to protect the first electrode plates and the second electrode plates.

[0027] On the other hand, an embodiment of the present application provides a circuit board assembly. The circuit board assembly includes a circuit board and a first capacitor, wherein the first capacitor is disposed on the circuit board, and the first capacitor is a capacitor as described in any of the above embodiments.

[0028] In some embodiments, the circuit board further includes a second capacitor disposed on the circuit board, and the electronic components connected to the two ends of the first capacitor are the same as the electronic components connected to the two ends of the second capacitor. In this way, in practical applications, when the first capacitor fails, the first capacitor is in an open circuit state, and the external circuit will not be damaged. The circuit board can still use the second redundant capacitor, which will not cause circuit abnormalities, improve the reliability of the circuit board, and reduce the return rate of the circuit board.

[0029] In yet another aspect, an embodiment of the present application provides an electronic device, wherein the electronic device comprises a circuit board and a capacitor as described in any of the above embodiments, wherein the capacitor is disposed on the circuit board.

[0030] The above-mentioned circuit board assembly and electronic device have the same structure and beneficial technical effects as the capacitors provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present application, the following is a brief introduction to the drawings required for use in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present application, the actual process of the method, the actual timing of the signal, etc.

[0032] Figure 1 A schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0033] Figure 2 A schematic diagram of the structure of a main board and functional modules provided in some embodiments of the present application;

[0034] Figure 3 A schematic diagram of the structure of a circuit board assembly provided in some embodiments of the present application;

[0035] Figure 4 A schematic diagram of the structure of a capacitor provided in some embodiments of the present application;

[0036] Figure 5 for Figure 4 A cross-sectional view along the section line AA;

[0037] Figure 6 for Figure 4 Another cross-sectional view along the section line AA;

[0038] Figure 7 for Figure 4 Another cross-sectional view along section line AA;

[0039] Figure 8 for Figure 7 The schematic diagram of the structure of the capacitor after short circuit is shown;

[0040] Fig. 9 for Figure 4 A cross-sectional view along section line BB;

[0041] Fig.10 for Figure 4 Another cross-sectional view along section line BB;

[0042] Fig.11 for Figure 4 Another cross-sectional view along section line BB;

[0043] Fig.12 for Figure 4 Another cross-sectional view along section line BB;

[0044] Fig.13 for Figure 4 Another cross-sectional view along section line BB;

[0045] Fig.14 for Figure 4 Another cross-sectional view along section line BB;

[0046] Fig.15 A flow chart of a method for preparing a capacitor provided in some embodiments of the present application. DETAILED DESCRIPTION

[0047] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present application.

[0048] Unless the context requires otherwise, throughout the specification and claims, the term "including" and its other forms such as the third person singular form "including" and the present participle form "including" are interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "this embodiment", "some embodiments", "example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0049] When describing some embodiments, the word "connection" and its derivative expressions may be used. For example, the term "connection" used when describing some embodiments should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection; it can be a fixed connection or a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this article can be understood according to specific circumstances.

[0050] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0051] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 10°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 10°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two equalities is less than or equal to 10% of either one.

[0052] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0053] Figure 1 This is a schematic diagram of the structure of an electronic device provided in some embodiments of the present application. Figure 1 As shown, the electronic device 1000 may be an electronic device having a communication function, a computing function or other functions.

[0054] For example, see Figure 1 The electronic device 1000 may be a server, a router, a switch, a desktop computer, a portable computer, a wireless terminal, a communication device, a global positioning system, a digital multimedia player, a wearable device, a personal digital assistant (PDA), a virtual reality (VR) device, an augmented reality (AR) device, a mobile phone, or any other suitable electronic device having a circuit board therein.

[0055] The following uses the electronic device 1000 as an example to schematically illustrate some embodiments of the present application, but the implementation of the present application is not limited to this, and any other electronic device can also be considered as long as the same technical concept is applied.

[0056] The server may be a rack server, a whole cabinet server, a blade server or a tower server. Figure 1 In the figure, a rack server is used as an example for illustration. In addition, the server may be an independent physical server, such as a general-purpose server, a graphics processing unit (GPU) server, a data processing unit (DPU) server, an artificial intelligence (AI) server, etc., or a server cluster or distributed file system composed of multiple physical servers, or at least one of cloud servers that provide basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content distribution networks, and big data or artificial intelligence platforms, etc. The embodiments of the present application are not limited thereto.

[0057] Figure 2 This is a schematic diagram of the structure of the main board and functional modules provided in some embodiments of the present application. Figure 1 and Figure 2 As shown, the electronic device 1000 may include a shell 100, a main board 200 and a functional module 300. The shell 100 has a receiving cavity inside, and the main board 200 and the functional module 300 are arranged in the receiving cavity of the shell 100. The shell 100 can limit the installation position of the main board 200 and the functional module 300, and protect the main board 200 and the functional module 300 from external damage.

[0058] See also Figure 2 The mainboard 200 may include a board body 210, a slot 220, a chip 230 and an electronic component 240. The board body 210 is integrated with circuit traces. The slot 220, the chip 230 and the electronic component 240 are arranged on the board body 210, and the slot 220, the chip 230 and the electronic component 240 can be coupled using the circuit traces in the board body 210.

[0059] The chip 230 may include at least one of a central processing unit (CPU), a graphics processor, a memory, a digital signal processing chip (DSP), an input / output (I / O) control chip, and a retimer chip. The electronic components 240 include any one of a capacitor, a resistor, an inductor, a diode, a transistor, and a field effect transistor.

[0060] See also Figure 2 The functional module 300 may include at least one of a network card module, a sound card module, a hard disk module, a memory module, a heat dissipation module, an adapter board module, and a power module. The functional module 300 may be inserted into the slot 220, connected to the chip 230 through the circuit traces in the board 210, or each functional module 300 may be connected through the circuit traces in the board 210 to realize its respective functions.

[0061] Figure 3 A schematic diagram of the structure of a circuit board assembly provided in some embodiments of the present application.

[0062] In some embodiments, see Figure 3 The electronic device 1000 further includes a circuit board assembly 400, which can be Figure 2 Alternatively, the circuit board assembly 400 may be integrated into Figure 2 The printed circuit board assembly (PCBA) in the functional module 300 shown in FIG. 4 is a PCBA integrated in any one of a network card module, a sound card module, a hard disk module and a memory module.

[0063] The circuit board assembly 400 includes a capacitor 10 and a circuit board 20, the circuit board 20 has circuit traces integrated therein, and the capacitor 10 is arranged on the circuit board 20 for direct current isolation, alternating current transmission, coupling, filtering, tuning loop, energy conversion and control, etc. The capacitor 10 may be in the shape of a cylinder, a cuboid, a cube or other suitable three-dimensional shapes, but the embodiments of the present application are not limited thereto. The following takes the shape of the capacitor 10 as a cuboid as an example to schematically illustrate some embodiments of the present application, but the embodiments of the application are not limited thereto.

[0064] Figure 4 A schematic diagram of the structure of a capacitor provided in some embodiments of the present application. Figure 5 for Figure 4 A cross-sectional view along section line AA. Figure 6 for Figure 4 Another cross-sectional view along section line AA. Figure 7 for Figure 4 Another cross-sectional view along section line AA.

[0065] like Figure 4As shown, some embodiments of the present application provide a capacitor 10, including a substrate 110 and two electrodes 120 disposed on both sides of the substrate 110, that is, one of the two electrodes 120 is disposed on the first side of the substrate 110, and the other electrode 120 is disposed on the second side of the substrate 110. The first side and the second side of the substrate 110 are different sides of the substrate 110. The electrode 120 is used to connect to an external circuit. For example, the electrode 120 is used to connect Figure 3 The circuit traces within the circuit board 20 are shown in FIG.

[0066] In the case where the capacitor 10 is in the shape of a rectangular parallelepiped, the first direction Z is, for example, the height direction of the capacitor 10, the second direction Y is, for example, the width direction of the capacitor 10, and the third direction X is, for example, the length direction of the capacitor 10. At this time, the two electrodes 120 can be, for example, disposed on both sides of the substrate 110 in the third direction X. Alternatively, one of the two electrodes 120 is disposed on one side of the substrate 110 in the third direction X, and the other is disposed on one side of the substrate 110 in the second direction Y, and the two electrodes 120 are electrically insulated. For ease of description, the two electrodes 120 are referred to as the first electrode 121 and the second electrode 122, respectively.

[0067] For example, Figure 5 , Figure 6 and Figure 7 As shown, the electrode 120 includes a first sublayer 101 , a second sublayer 102 and a third sublayer 103 which are stacked. The first sublayer 101 covers one end of the substrate 110 , the second sublayer 102 covers the first sublayer 101 , and the third sublayer 103 covers the second sublayer 102 .

[0068] The conductivity of the first sublayer 101 can be greater than the conductivity of the second sublayer 102, and greater than the conductivity of the third sublayer 103, so as to improve the conductivity. The material of the third sublayer 103 can be selected as solder, so that the capacitor 10 is connected to the external circuit by welding. In addition, the second sublayer 102 can be used as a barrier layer in the welding process to prevent the welding process from damaging the first sublayer 101, resulting in a decrease in conductivity.

[0069] For example, the material of the first sublayer 101 includes at least one of copper, silver, gold and aluminum. The material of the second sublayer 102 includes at least one of nickel, copper alloy and nickel alloy. The material of the third sublayer 103 may include tin or lead-tin alloy.

[0070] like Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, the capacitor 10 further includes a plurality of plates 130, and the substrate 110 covers the plates 130 to play the role of bearing, insulation and protection. In this article, "plurality" includes two or more.

[0071] The material of the substrate 110 includes an insulating material. According to the different materials of the substrate 110, the capacitor 10 includes an organic dielectric capacitor or an inorganic dielectric capacitor. The organic dielectric capacitor includes a paint film capacitor, a mixed dielectric capacitor, a paper dielectric capacitor, an organic film dielectric capacitor or a paper film composite dielectric capacitor, and the inorganic dielectric capacitor includes a ceramic capacitor, a mica capacitor, a glass film capacitor or a glass glaze capacitor. Exemplarily, the material of the substrate 110 includes any one of ceramic, mica and glass. For example, the material of the substrate 110 includes barium titanate.

[0072] The substrate 110 includes a first insulating layer 111, and the electrode 130 includes a first electrode 131 and a second electrode 132, wherein the first electrode 131 is connected to the first electrode 121, and the second electrode 132 is connected to the second electrode 122. The first electrode 131 and the second electrode 132 are stacked, and the first insulating layer 111 is disposed between the first electrode 131 and the second electrode 132 to insulate the first electrode 131 and the second electrode 132. Here, the first electrode 131 and the second electrode 132 are at least partially opposite to each other to form a capacitor structure that can store charge.

[0073] In addition, the substrate 110 may further include a second insulating layer 112 , which covers the stacked structure formed by all the first electrode plates 131 , the second electrode plates 132 and the first insulating layer 111 to protect the first electrode plates 131 and the second electrode plates 132 .

[0074] In some embodiments, Figure 5 , Figure 6 and Figure 7 As shown, the plurality of electrode plates 130 include a plurality of first electrode plates 131 and a plurality of second electrode plates 132. Along the first direction Z, the first electrode plates 131 and the second electrode plates 132 are alternately stacked one by one. There are a plurality of first insulating layers 111, and a first insulating layer 111 is disposed between any adjacent first electrode plates 131 and second electrode plates 132. The second insulating layer 112 covers a stacking structure formed by the plurality of first electrode plates 131, the plurality of second electrode plates 132, and the plurality of first insulating layers 111. At this time, the first direction Z is the stacking direction of the first electrode plates 131 and the second electrode plates 132.

[0075] In this case, the capacitor 10 can achieve a larger charge storage capacity in a smaller size, which is conducive to reducing the size of the capacitor 10, reducing the occupied area of ​​the capacitor 10, and thus reducing the circuit board 20 (see Figure 2It should be noted that the first direction Z may be, for example, perpendicular to the surface of the first electrode plate 131 facing the second electrode plate 132 .

[0076] The following takes the first electrode plates 131 and the second electrode plates 132 as an example of alternately stacking one by one in the first direction Z to schematically illustrate some embodiments of the present application, but the embodiments of the present application are not limited to this, and any other arrangement methods can also be considered as long as the same technical concept is applied.

[0077] In some embodiments, see Figure 5 and Figure 6 The first electrode plate 131 includes a first main body 1310a and a first fuse 1320a. The first main body 1310a of the first electrode plate 131 is connected to the first electrode 121 through the first fuse 1320a of the first electrode plate 131. The first main body 1310a of the first electrode plate 131 and the second electrode plate 132 are at least partially arranged opposite to each other to form a capacitor structure that can store charge. The first fuse 1320a of the first electrode plate 131 is used to fuse when the first electrode plate 131 and the second electrode plate 132 are short-circuited.

[0078] In this case, when the first electrode plate 131 and the second electrode plate 130 are short-circuited, the first fuse portion 1320a of the first electrode plate 131 heats up and melts under the action of the short-circuit current, so that the short-circuit failure of the first electrode plate 131 and the second electrode plate 132 in the capacitor 10 is transformed into an open circuit failure, thereby solving the problem of the capacitor 10 continuing to generate heat due to failure and causing the capacitor 10 and the circuit board 20 in the vicinity to burn, thereby improving the maintainability and reliability of the circuit board 20, and improving the safety of the circuit board 20.

[0079] Moreover, in the case where the multiple plates 130 include multiple first plates 131 and multiple second plates 132, since the short-circuit failure of the first plates 131 and the second plates 132 in the capacitor 10 is converted into an open circuit failure, the remaining first plates 131 and the second plates 132 can still store charge, and the capacitor 10 can still work with high reliability.

[0080] In some embodiments, see Figure 5 and Figure 7 The second electrode plate 132 includes a second main body 1310b and a second fuse 1320b, and the second main body 1310b of the second electrode plate 132 is connected to the second electrode 122 through the second fuse 1320b of the second electrode plate 132. The second main body 1310b of the second electrode plate 132 is at least partially arranged opposite to the first electrode plate 131 to form a capacitor structure that can store charge. The second fuse 1320b of the second electrode plate 132 is used to fuse when the first electrode plate 131 and the second electrode plate 132 are short-circuited.

[0081] In this case, when the first electrode plate 131 and the second electrode plate 130 are short-circuited, the second fuse portion 1320b of the second electrode plate 132 is heated and melted under the action of the short-circuit current, so that the short-circuit failure of the first electrode plate 131 and the second electrode plate 132 in the capacitor 10 is transformed into an open circuit failure, thereby solving the problem of the capacitor 10 continuing to generate heat due to failure and causing the capacitor 10 and the circuit board 20 in the vicinity to burn, thereby improving the maintainability and reliability of the circuit board 20, and improving the safety of the circuit board 20.

[0082] Moreover, in the case where the multiple plates 130 include multiple first plates 131 and multiple second plates 132, since the short-circuit failure of the first plates 131 and the second plates 132 in the capacitor 10 is converted into an open circuit failure, the remaining first plates 131 and the second plates 132 can still store charge, and the capacitor 10 can still work with high reliability.

[0083] Figure 8 for Figure 7 The schematic diagram of the capacitor after short circuit is shown in Figure 1. Figure 8 As shown, the first electrode plate 131 and the second electrode plate 132 on the uppermost side are connected, and the second fuse 1320b is disconnected, which can avoid the problem of continuous heating of the capacitor 10 caused by a short circuit between the connected first electrode plate 131 and the second electrode plate 132, thereby avoiding the problem of burning of the capacitor 10 and the circuit board 20 in the vicinity.

[0084] Combination Figure 3 , Figure 5 and Figure 8 The circuit board assembly 400 includes a first capacitor 11, and the first capacitor 11 is the above-mentioned capacitor 10 including the first fuse part 1320a and / or the second fuse part 1320b. This can solve the problem that the first capacitor 11 fails and continues to generate heat, causing the first capacitor 11 and the circuit board 20 in the vicinity to burn, thereby improving the maintainability and reliability of the circuit board 20 and improving the safety of the circuit board.

[0085] On this basis, the circuit board assembly 400 also includes a second capacitor 12, and the electronic components connected to the two ends of the first capacitor 11 and the electronic components connected to the two ends of the second capacitor 12 are the same, that is, the connection relationship between the first capacitor 11 and the second capacitor 12 is the same, and the two can play the same function, so that the two are redundant devices. The first capacitor 11 may include a first fuse 1320a and / or a second fuse 1320b. In this way, in actual applications, when the first capacitor 11 fails, the first fuse 1320a and / or the second fuse 1320b are blown, so that the inside of the first capacitor 11 is in an open circuit state, and the external circuit will not be damaged. The circuit board 20 can still use the second capacitor 12 that is redundant with the first capacitor 11, which will not cause circuit abnormalities, and can improve the reliability of the circuit board 20 and reduce the return rate of the circuit board 20. It should be noted that electronic components include electronic components and chips.

[0086] In the following, when it is not emphasized that the fuse part 1320 is the first fuse part 1320a of the first electrode 121 or the second fuse part 1320b of the second electrode 122, the fuse part 1320 mentioned below may be the first fuse part 1320a of the first electrode 131 or the second fuse part 1320b of the second electrode 132. Also, when it is not emphasized that the main body 1310 is the first main body 1310a of the first electrode 121 or the second main body 1310b of the second electrode 122, the main body 1310 mentioned below may be the first main body 1310a of the first electrode 131 or the second main body 1310b of the second electrode 132.

[0087] In some embodiments, Figure 5 , Figure 6 and Figure 7 As shown, along the first direction Z, a plurality of first plates 131 and a plurality of second plates 132 are alternately stacked one by one. On this basis, among any adjacent first plates 131 and second plates 132, at least one plate 130 includes a fuse 1320, so that after any two adjacent plates 130 in the capacitor 10 are short-circuited, there is a corresponding fuse 1320 that heats and melts under the action of the short-circuit current, so that the short-circuit failure of any two adjacent plates 130 in the capacitor 10 is converted into an open-circuit failure, thereby improving the maintainability and reliability of the circuit board 20, and improving the safety of the circuit board.

[0088] For example, Figure 5As shown, each first electrode plate 131 includes a first fuse 1320a, and each second electrode plate 132 includes a second fuse 1320b. In this way, after the first electrode plate 131 and the second electrode plate 132 are short-circuited, if either the first fuse 1320a or the second fuse 1320b is blown, the short circuit between the first electrode plate 131 and the second electrode plate 132 can be converted into an open circuit, thereby improving reliability. Figure 6 As shown, each first electrode plate 131 includes a first fuse 1320a, and the second electrode plate 132 does not include a second fuse 1320b. Figure 7 As shown, each second electrode plate 132 includes a second fuse part 1320 b , and the first electrode plate 131 does not include a first fuse part 1320 a .

[0089] The fuse part 1320 is used to fuse when the first electrode plate 131 and the second electrode plate 132 are short-circuited, and can be specifically configured according to the magnitude of the short-circuit current.

[0090] For example, when the short-circuit current of the plate 130 is greater than or equal to 145μA, the rated current allowed to pass through the fuse 1320 should be less than or equal to 145μA, and the rated current is the current value at which the fuse 1320 begins to melt. For example, the capacitance of the capacitor 10 is 10μF, the voltage is 4V, the capacity change rate is ±15%, and along the third direction X, the length of the plate 130 of the capacitor 10 is 2mm, along the second direction Y, the width is 1.2mm, and along the first direction Z, the thickness is 2μm. Based on this, the current density of the fuse 1320 can be 1.45μA / μm 2 , the thickness of the fuse part 1320 is 2 μm along the first direction Z, and the width of the fuse part 1320 is 50 μm along the second direction Y. At this time, the rated current of the fuse part 1320 can be obtained by multiplying the current density, length and width of the fuse part 1320, and the rated current is 145 μA.

[0091] It should be noted that the second direction Y is the width direction of the fuse part 1320, and the second direction Y can be, for example, parallel to the surface of the first electrode 131 toward the second electrode 132, and parallel to the direction from the main body 1310 to the fuse part 1320 in the same electrode 130 ( Figure 5 The third direction (X) is perpendicular to the direction.

[0092] For example, when the short-circuit current of the plate 130 is greater than or equal to 290μA, the rated current allowed to pass through the fuse 1320 should be less than or equal to 290μA. For example, the capacitance of the capacitor 10 is 10μF, the voltage is 4V, the capacity change rate is ±15%, and along the third direction X, the length of the plate 130 of the capacitor 10 is 2mm, along the second direction Y, the width is 1.2mm, and along the first direction Z, the thickness is 2μm. Based on this, the current density of the fuse 1320 can be 1.45μA / μm 2 , the thickness of the fuse part 1320 is 2 μm along the first direction Z, and the width of the fuse part 1320 is 100 μm along the second direction Y. At this time, the rated current of the fuse part 1320 can be obtained by multiplying the current density, length and width of the fuse part 1320, and the rated current is 290 μA.

[0093] In some embodiments, see Figure 5 , Figure 6 and Figure 7 , in the same electrode 130 (i.e., in the first electrode 131 or the second electrode 132), the resistance of the fuse part 1320 is greater than the resistance of the main body 1310. In this way, when the melting point of the main body 1310 is equal to the melting point of the fuse part 1320 and the resistance of the fuse part 1320 is greater than the resistance of the main body 1310, after the first electrode 131 and the second electrode 132 are short-circuited, the heating efficiency of the fuse part 1320 is high, and the fuse part 1320 reaches the melting point first and starts to melt and disconnect.

[0094] In some embodiments, see Figure 5 , Figure 6 and Figure 7 In the same electrode 130, the melting point of the fuse part 1320 is lower than the melting point of the main body 1310. In this way, when the resistance of the fuse part 1320 is equal to the resistance of the main body 1310 and the melting point of the fuse part 1320 is lower than the melting point of the main body 1310, after the first electrode 131 and the second electrode 132 are short-circuited, the fuse part 1320 reaches the melting point first and starts to melt and disconnect.

[0095] In some embodiments, see Figure 5 , Figure 6 and Figure 7 In the same electrode 130, the resistance of the fuse part 1320 is greater than the resistance of the main body 1310, and the melting point of the fuse part 1320 is less than or equal to the melting point of the main body 1310. In this way, after the first electrode 131 and the second electrode 132 are short-circuited, the heat generation efficiency of the fuse part 1320 is high, and the melting point is low or consistent, and the fuse part 1320 begins to melt and disconnect first.

[0096] For example, see Figure 5 , Figure 6 and Figure 7 In the same electrode 130, the fuse part 1320 and the main body 1310 are made of the same material, that is, the melting point of the fuse part 1320 is the same as that of the main body 1310. Moreover, the cross-sectional area of ​​the fuse part 1320 is smaller than that of the main body 1310. At this time, according to the resistance formula R=ρL / S, the cross-sectional area of ​​the fuse part 1320 is smaller, and the resistance at each cross-sectional area is larger, so that the heating efficiency of the fuse part 1320 is greater than that of the main body 1310, so that after the first electrode 131 and the second electrode 132 are short-circuited, the fuse part 1320 reaches the melting point first and starts to melt and disconnect. Moreover, the material of the fuse part 1320 is the same as that of the main body 1310, and the fuse part 1320 and the main body 1310 can be prepared by the same process, which can simplify the process flow and improve production efficiency.

[0097] Wherein, R is the resistance, ρ is the resistivity, which is determined by the material, L is the length, and S is the area of ​​the cross section. The cross section is the surface that cuts off the fuse part 1320 and the main body 1310. For example, the cross section is perpendicular to the direction from the main body 1310 to the electrode 120 connected to the main body 1310 ( Figure 5 , Figure 6 and Figure 7 The first direction X in the graph.

[0098] For example, Figure 5 , Figure 6 and Figure 7 As shown, in the same electrode 130, along the first direction Z, the thickness of the fuse part 1320 is equal to that of the main body 1310. Moreover, in the same electrode 130, along the second direction Y, the width of the fuse part 1320 is smaller than the width of the main body 1310, so that the cross-sectional area of ​​the fuse part 1320 is smaller than the cross-sectional area of ​​the main body 1310. Moreover, the main body 1310 and the fuse part 1320 can be directly formed in the same printing process (the process can be referred to below), and the preparation of the fuse part 1320 will not add a new process, which is conducive to improving production efficiency.

[0099] The material of the main body 1310 includes metal and non-metallic conductive materials. Exemplarily, the material of the main body 1310 includes at least one of silver, nickel, copper, aluminum, lead antimony, nickel, conductive plastic, conductive rubber, conductive fiber fabric, conductive coating, conductive adhesive, transparent conductive film and carbon black, and can also be any other conductive material, and the embodiments of the present application are not limited thereto.

[0100] The material of the above-mentioned fuse part 1320 includes metal and non-metallic conductive materials. Exemplarily, the material of the fuse part 1320 includes at least one of silver, nickel, copper, aluminum, lead antimony, nickel, conductive plastic, conductive rubber, conductive fiber fabric, conductive coating, conductive adhesive, transparent conductive film and carbon black, and can also be any other material that can be melted by generating heat when current flows through it, but the embodiments of the present application are not limited thereto.

[0101] In some embodiments, Figure 5 , Figure 6 and Figure 7 As shown, along the first direction Z, the first fuse portion 1320a of the first electrode plate 131 is staggered from the orthographic projection of the second electrode plate 132 on the reference plane. The reference plane is the plane where the surface of the first electrode plate 131 close to the second electrode plate 132 is located. And / or, along the first direction Z, the second fuse portion 1320b of the second electrode plate 132 is staggered from the orthographic projection of the first electrode plate 131 on the reference plane, that is, the second fuse portion 1320b of the second electrode plate 132 does not overlap with the orthographic projection of the first electrode plate 131 on the reference plane, or is arranged at intervals. Arranged in this way, the risk of the fuse portion 1320 being short-circuited again with another adjacent electrode plate 130 after being disconnected can be reduced, thereby improving the reliability of the disconnection formed by the fuse portion 1320.

[0102] For example, Figure 5 As shown, the capacitor 10 includes a plurality of first plates 131 and a plurality of second plates 132, and the first plates 131 and the second plates 132 are alternately arranged along a first direction Z. The first main body portions 1310a of the plurality of first plates 131 and the second main body portions 1310b of the plurality of second plates 132 are overlapped in the first direction.

[0103] Furthermore, the first fuse parts 1320a of the plurality of first plates 131 are located on the first side of the plurality of main bodies 1310 (including the first main body 1310a and the second main body 1310b) that are overlapped in the first direction Z, and the second fuse parts 1320b of the plurality of second plates 132 are located on the second side of the plurality of main bodies 1310 that are overlapped in the first direction Z, so as to reduce the risk of accidental short circuit between each fuse part 1320 and other adjacent plates 130. The first side and the second side of the plurality of main bodies 1310 are the opposite sides of the plurality of main bodies 1310 that are overlapped in the first direction Z.

[0104] Fig. 9 for Figure 4 A cross-sectional view along section line BB. Fig.10 for Figure 4 Another cross-sectional view along section line BB.

[0105] In some embodiments, see Figure 5 , Figure 6and Figure 7 , the fuse part 1320 is directly connected to the first electrode 121 or the second electrode 122 .

[0106] In other embodiments, see Fig. 9 , the first electrode plate 131 further includes a first connection portion 1330a, and the first fuse portion 1320a is connected to the first electrode 121 through the first connection portion 1330a; and along the second direction Y, the width of the first connection portion 1330a is greater than the width of the first fuse portion 1320a, so as to increase the connection area between the first electrode plate 131 and the first electrode 121, and improve the connection reliability and conductivity. Of course, in other embodiments, the width of the first connection portion 1330a can be equal to the width of the first fuse portion 1320a.

[0107] Or, see Fig.10 , the second electrode plate 132 further includes a second connection portion 1330b, and the second fuse portion 1320b is connected to the second electrode 122 through the second connection portion 1330b; and along the second direction Y, the width of the second connection portion 1330b is greater than the width of the second fuse portion 1320b, so as to increase the connection area between the second electrode plate 132 and the second electrode 122, and improve the connection reliability and conductivity. Of course, in other embodiments, the width of the first connection portion 1330a can be equal to the width of the first fuse portion 1320a.

[0108] Below, without separately emphasizing that the connection part 1330 is the first connection part 1330a of the first electrode 121 or the second connection part 1330b of the second electrode 122, the connection part 1330 mentioned below can be the first connection part 1330a of the first electrode plate 131 or the second connection part 1330b of the second electrode plate 132.

[0109] Among them, see Fig. 9 In the same electrode plate 130 , along the second direction Y, the width of the connecting portion 1330 (including the first connecting portion 1330 a and the second connecting portion 1330 b ) may be equal to the width of the main body 1310 . Fig.10 In the same electrode 130 , along the second direction Y, the width of the connection portion 1330 may be greater than the width of the main body 1310 . Of course, in the same electrode 130 , along the second direction Y, the width of the connection portion 1330 may also be less than the width of the main body 1310 .

[0110] The materials of the connection part 1330 and the fuse part 1320 can be the same or different. For example, the connection part 1330 and the fuse part 1320 are made of the same material, and the connection part 1330 and the fuse part 1320 can be prepared in the same process step to simplify the process preparation difficulty and improve production efficiency. Moreover, along the first direction Z, the thickness of the main body 1310, the thickness of the fuse part 1320 and the thickness of the connection part 1330 can be equal, so that the main body 1310, the fuse part 1320 and the connection part 1330 can be directly formed in the same printing process (the process can be referred to below), which is conducive to further improving production efficiency.

[0111] For another example, the materials of the connection part 1330 and the fuse part 1320 are different. The connection part 1330 and the fuse part 1320 can select suitable materials according to their respective needs. For example, the connection part 1330 selects a material with higher conductivity to improve conductivity, and the fuse part 1320 can select a corresponding material according to the fuse current. The material selection range is wide and it is beneficial to improve the conductivity.

[0112] Fig.11 for Figure 4 Another cross-sectional view along section line BB in FIG. Fig.12 for Figure 4 Another cross-sectional view along section line BB in FIG.

[0113] In some embodiments, see Fig.11 and Fig.12 The fuse part 1320 includes a plurality of sub-parts 1321 arranged at intervals, and the plurality of sub-parts 1321 are arranged along the second direction Y (the width direction of the fuse part 1320), and each sub-part 1321 can be connected to the main part 1310 and the electrode 120 respectively, so that in the process, when one sub-part 1321 is poorly connected to the main part 1310 and / or the electrode 120, the other sub-parts 1321 can still function, which is conducive to improving product reliability and production yield. It should be noted that the plurality of sub-parts 1321 included in the fuse part 1320 can also be arranged along the first direction Z.

[0114] For example, Fig.11 As shown, the first fuse portion 1320a of the first electrode plate 131 includes a plurality of sub-portions 1321a arranged at intervals. Fig.12 As shown, the second fuse part 1320b of the second electrode plate 132 includes a plurality of sub-parts 1321b arranged at intervals. Here, along the second direction Y, the width of the fuse part 1320 refers to the sum of the widths of the plurality of sub-parts 1321 in the second direction Y.

[0115] In addition, see Fig.11, along the second direction Y, the widths of the plurality of sub-portions 1321 may be equal, and the spacings between the plurality of sub-portions 1321 may be equal. Of course, along the second direction Y, the widths of the plurality of sub-portions 1321 may not be equal, and the spacings may be set according to actual needs. For example, see Fig.12 Among the multiple sub-portions 1321 arranged along the second direction Y, the widths of the two outermost sub-portions 1321 are greater than the widths of the inner sub-portions 1321, so that the outermost sub-portions 1321 have greater strength and stronger shear resistance, which can reduce the risk of failure due to accidental breakage.

[0116] Fig.13 for Figure 4 Another cross-sectional view along section line BB in FIG. Fig.14 for Figure 4 Another cross-sectional view along section line BB in FIG.

[0117] In some embodiments, see Fig.13 and Fig.14 , the fuse part 1320 is one, forming a larger plate-like structure, so that the fuse part 1320 has greater strength and stronger shear resistance, which can reduce the risk of failure caused by accidental breakage. Fig.13 As shown, the first fuse portion 1320a of the first electrode plate 131 is one. Fig.14 As shown, the second fuse part 1320b of the second electrode plate 132 is one.

[0118] In addition, if Fig.13 As shown, in the same electrode 130, along the second direction Y, the distances between the boundaries of the fuse part 1320 on both sides and the boundaries of the main body 1310 on both sides are equal, that is, the fuse part 1320 is connected to the middle position of the main body 1310. Fig.14 As shown, in the same electrode 130 , along the second direction Y, a boundary of the fuse part 1320 may also coincide with a boundary of the main body 1310 , that is, the fuse part 1320 is connected to the edge of the main body 1310 , but the embodiments of the present application are not limited thereto.

[0119] Fig.15 A flow chart of a method for preparing a capacitor provided in some embodiments of the present application.

[0120] like Fig.15 As shown, the preparation method of the capacitor 10 includes a dispersion process S1, a casting process S2, a printing process S3, a lamination process S4, a pressing process S5, a firing process S6, a chamfering process S7, an end firing process S8, an electroplating process S9 and a testing process S10 performed in sequence.

[0121] In the dispersion process S1, raw materials such as porcelain powder, organic binder, and organic solvent are mixed and proportioned, and ball-milled to form porcelain slurry. In the casting process S2, the porcelain slurry is processed into an insulating dielectric layer by casting, and the insulating dielectric layer can be used to form the first insulating layer 111 and the second insulating layer 112 mentioned above. In the printing process S3, the upper electrode 130 is printed on the insulating dielectric layer by screen printing, and the electrode 130 can be the first electrode 131 or the second electrode 132 of any of the above embodiments.

[0122] In the lamination process S4, the insulating dielectric layers printed with the electrode plates 130 are alternately laminated to form a green block. Here, the multiple insulating dielectric layers are deformed under pressure to form the above-mentioned substrate 110.

[0123] In the pressing and cutting process S5, the stack of green blocks is compacted and cut into capacitor chip green blocks. In the firing process S6, the capacitor chip green blocks need to be debonded to remove most of the organic matter in the capacitor chip green blocks, and then sintered at high temperature to convert the ceramic powder in the capacitor chip green blocks into a dense ceramic body.

[0124] In the chamfering process S7, the ceramic is chamfered as a whole. In the end firing process S8, the ceramic is capped as a whole to form an electrode 120, thereby manufacturing a capacitor 10 with a complete structure. In the testing process, according to quality requirements, through screening, measurement, ultrasonic non-destructive testing, etc., a capacitor 10 that meets the specifications is obtained.

[0125] Based on the above-mentioned method for preparing the capacitor 10 , it can be known that the main body 1310 and the fuse part 1320 can be directly formed in the same printing process, and other process steps do not need to be adjusted or changed, which will not increase the preparation cost.

[0126] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0127] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can think of within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A capacitor, characterized in that: include: A substrate including a first insulating layer; A first electrode is disposed on a first side of the substrate; A second electrode is disposed on a second side of the substrate; the first side and the second side of the substrate are different sides of the substrate; A plurality of first electrode plates connected to the first electrodes; A plurality of second electrode plates are alternately stacked one by one with a plurality of the first electrode plates, and the first insulating layer is arranged between any adjacent first electrode plates and second electrode plates; the second electrode plate includes a second main body and a second fuse part, and the second main body is connected to the second electrode through the second fuse part; the second fuse part is used to fuse when the first electrode plate and the second electrode plate are short-circuited.

2. The capacitor according to claim 1, characterized in that In the same second electrode plate, the resistance of the second fuse part is greater than the resistance of the second main body part, and the melting point of the second fuse part is less than or equal to the melting point of the second main body part; or, the resistance of the second fuse part is equal to the resistance of the second main body part, and the melting point of the second fuse part is less than the melting point of the second main body part.

3. The capacitor according to claim 2, characterized in that In the same second electrode plate, the second fuse portion and the second main body portion are made of the same material, and the cross-sectional area of ​​the second fuse portion is smaller than the cross-sectional area of ​​the second main body portion.

4. The capacitor according to claim 3, characterized in that In the same second electrode plate, the thickness of the second fuse part is equal to that of the second main body; the thickness is the dimension of the second fuse part or the second main body along the stacking direction of the first electrode plate and the second electrode plate; and, in the same second electrode plate, the width of the second fuse part is smaller than the width of the second main body.

5. The capacitor according to any one of claims 1 to 4, characterized in that: The second fuse portion includes a plurality of sub-portions arranged at intervals, the plurality of sub-portions are arranged along a width direction of the second fuse portion, and each of the sub-portions is connected to the second main body portion and the second electrode.

6. The capacitor according to any one of claims 1 to 5, characterized in that: The second electrode plate further includes a second connecting portion. In the same second electrode plate, the second fuse portion is connected to the second electrode through the second connecting portion, and a width of the second connecting portion is greater than a width of the second fuse portion.

7. The capacitor according to any one of claims 1 to 6, characterized in that: Along the stacking direction of the first electrode plate and the second electrode plate, the second fuse portion is offset from the orthographic projection of the first electrode plate on a reference plane, and the reference plane is a plane where a surface of the first electrode plate close to the second electrode plate is located.

8. The capacitor according to any one of claims 1 to 7, characterized in that: The first electrode plate includes a first main body and a first fuse. The first main body is connected to the first electrode through the first fuse. The first fuse is used to fuse when the first electrode plate is short-circuited with the second electrode plate.

9. The capacitor according to any one of claims 1 to 8, characterized in that: The material of the second fuse portion includes at least one of metal, conductive plastic, conductive rubber, conductive fiber fabric, conductive coating, conductive adhesive, transparent conductive film and carbon black.

10. An electronic device, characterized in that: include: Circuit boards; The capacitor according to any one of claims 1 to 9, wherein the capacitor is disposed on the circuit board.

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