Apparatus for connecting a device to a substrate

Abstract

The invention relates to a device for connecting a component (5) to a substrate, comprising a chamber which can be divided into at least two parts. A stamp (11, 111) is provided on the first part (1) and a counter stamp (31) is provided on the second part (3). In the open state of the chamber, the mating stamp (31) can be loaded with the starting material. The first part (1) has a wall with an edge which can be brought into contact with an opposite edge of the wall of the second part (3) in order to close the chamber. In the closed state of the chamber, pressure can be applied to the starting material arranged between the stamp (11) and the counter stamp (31) via the stamp (11, 111). In the unloaded state, the counter stamp (31) is spaced apart from the heating device (33). As a result of the pressure applied by the stamps (11, 111), the counter-stamps are brought into contact with the heating device (33).

Description

Technical Field

[0001] The present invention relates to an apparatus for connecting a device to a substrate. Background Art

[0002] As the electronics industry's demand for developing highly efficient and high-temperature resistant devices, such as chips, continues to increase, sintering a connection layer between the device and the substrate is becoming more and more popular.

[0003] Sintering is known in particular as a method for producing metal or ceramic components. Here, a fine-grained or coarse-grained green body is formed by compacting a powdery starting material, which acquires its final shape during a subsequent temperature treatment to become a solid workpiece.

[0004] Here, sintering according to the present application and in the production and processing of components, such as semiconductor chips, is understood to be a method similar to the following: the component and the substrate are pressed together for a certain time using a predetermined pressure and a predetermined temperature, thereby forming a connection between the two elements. The current state of the art is to use a paste material, such as a silver paste or copper paste or a nanostructured platelet as a connection between the chip and the substrate, and to sinter it by applying pressure and temperature. This sintering is known as a method for connecting components to substrates and has proven to be more advantageous than the soldering methods based on tin or lead used to date.

[0005] For such a sintering process, specific parameters are defined, such as set temperatures, pressures and holding times for effectively fixing the device on the substrate. The parameters can be determined as required from tests. In such a sintering process, an adhesive can also be advantageously used, which is applied between the device and the substrate. Correspondingly, the layer thickness of the adhesive can constitute a further parameter. As such an adhesive, a silver paste can preferably be used.

[0006] Preferably, during the sintering process, no phase change of the adhesive, for example silver paste, occurs, as is the case with soldering methods based on tin and lead. Appropriate use of temperature and pressure causes the particles of the adhesive to diffuse into the surface of the substrate and the component to be fixed. This results in a surface-to-surface connection instead of a phase change connection.

[0007] For effective fixing, a parallel, uniform force distribution on the device surface is required and must be ensured. Therefore, separate force application components are the preferred solution for modern electronics manufacturers, which can ensure a good connection quality. Separate force application means: use a separate tool for each pair of device and substrate. This leads to high tool costs.

[0008] The use of temperature and pressure is necessary in order to achieve an effective connection between the device and the substrate, otherwise the connection quality will be poor or too slow for practical purposes.

[0009] The principle of this method does not lie in the phase change of the connecting agent (e.g. silver paste) as is the case in tin and lead based soldering methods. By the appropriate application of temperature and pressure, the silver component diffuses into the surface of the substrate and the device to be fixed. Thus, the contact becomes a surface-to-surface connection instead of a phase change contact.

[0010] For this type of process the expressions "die attach" or "die packaging" are often also used.

[0011] Document DE 10 2013 101 124 shows an apparatus and a method for sintering a product. The sintered product comprises a component and a substrate. To connect them, the sintered product is inserted into an apparatus having a press table and a press die. By increasing the temperature by means of a heating device, an expansion of the pressure body in the press die is caused, whereby pressure is applied to the sintered product. The component is thus connected to the substrate.

[0012] Document DE 10 2015 120 156 A1 discloses a device for connecting connection partners of power electronic components in a material-bonded manner. Here, a dimensionally stable frame acts on one of the connection partners, while an elastic pad acts on the second connection partner to build up the pressure required for the connection.

[0013] In order to protect the component to be sintered as best as possible, it is desirable to regulate the heat supply to the component as precisely as possible during the sintering method.

[0014] There is a need for an apparatus for connecting a device to a substrate that enables precise control of heat delivery to the component to be sintered. Summary of the invention

[0015] The device for connecting a device to a substrate according to the present invention is provided with a chamber which can be divided into at least two parts. A stamp is provided at the first part. A counter-stamp is provided at the second part. A heating device is provided at the side of the counter-stamp facing away from the first part. The first part can be displaced in the direction of the second part in order to close the chamber. In the open state of the chamber, the counter-stamp can be loaded with initial material, and in the closed state of the chamber, pressure can be applied to the initial material arranged between the stamp and the counter-stamp via the stamp. In the unloaded state, the counter-stamp is spaced apart from the heating device and is configured to be in contact with the heating device due to the pressure applied by the stamp.

[0016] Since the counter-stamp is spaced apart from the heating device as a product support, no direct heat transfer takes place. Therefore, the starting material on the counter-stamp is not exposed to any excessive thermal load before the sintering process begins. Only by applying pressure through the stamp is the distance between the counter-stamp and the heating device overcome and the heat is then transferred directly to the counter-stamp, the starting material and the stamp.

[0017] The heating device can be designed in the form of a heating plate, the surface of which facing the counter-mould is configured to be in flat contact with the surface of the counter-mould facing away from the first component.

[0018] Due to the areal contact of the surfaces of the heating device and the counter-stamp lying against one another, a rapid and uniform heat transfer is possible.

[0019] The counter-stamp can be spaced apart from the heating device by means of a prestressing element, the prestressing of which is overcome due to the pressure applied by the stamp. After the application of pressure has ended, the prestressing is reestablished by the stamp.

[0020] Therefore, even after the sintering process has ended, direct heat transfer is prohibited as soon as the stamp has retracted into the starting position.

[0021] In the unloaded state, the counter stamp can be spaced apart from the heating device by means of a spring.

[0022] In this case, preferably helical springs or leaf springs can be used.

[0023] The counter-stamp can be spaced apart from the heating device in the unloaded state by means of an air cushion. Air can be supplied to the air cushion via an air channel which is at least partially guided through the heating device.

[0024] Instead of or in addition to the spring, an air cushion can serve as a preload element. Furthermore, the effect of the invention can be improved by supplying air. Thus, after the sintering process, faster cooling can be achieved by supplying cold air. Likewise, if necessary, the counter-stamp can also be preheated by means of hot air before the sintering process.

[0025] The apparatus for connecting a device to a substrate according to the present invention is provided with a chamber that can be divided into at least two parts. A stamp is provided at the first part. A mating stamp is provided at the second part. A heating device is provided at the side of the mating stamp that faces away from the first part. The first part can be displaced in the direction of the second part so as to close the chamber. In the state where the chamber is open, the mating stamp can be loaded with initial material, and in the state where the chamber is closed, pressure can be applied to the initial material arranged between the stamp and the mating stamp via the stamp. The axis of the stamp is accommodated in a stamp guide plate arranged at the first part by means of an interference fit, and the pressure body of the stamp has a larger cross-sectional area than the axis of the stamp. A negative pressure device is provided at the side of the stamp guide plate that faces away from the mating stamp.

[0026] The vacuum device makes it possible to suck the stamp back into the starting position by building up a vacuum after the sintering process has ended. Since the pressure body of the stamp has a larger cross-sectional area than the shaft, the pressure body is prevented from being pulled into the stamp guide plate.

[0027] A cylinder plate can be provided on the side of the die guide plate facing away from the counter die, the cylinder plate having a piston that can be reciprocated in a cylinder bore. The piston has a guide rod on the side facing the die, the guide rod being configured to be in contact with the end face of the shaft and exerting pressure on the die when the piston is loaded with pressure.

[0028] Since the guide rod is placed against the end face of the shaft of the die by means of the actuating piston, a spacing is established between the guide rod and the shaft in the starting position or retracted position of the piston and the die. Therefore, heat is transferred from the die to the guide rod and the piston.

[0029] The end face of the shaft of the stamp may be flat, and the tip of the guide rod, which may come into contact with the end face of the shaft, may be rounded.

[0030] The structure makes it possible to tilt the stamp in the event that the starting material is possibly not aligned in planar fashion, thereby improving the quality of the sintered product.

[0031] The negative pressure device can be an intermediate control chamber formed between the die guide plate and a cylinder plate arranged at the side of the die guide plate facing away from the counter-die. The intermediate control chamber can be loaded with negative pressure or positive pressure.

[0032] The design as an intermediate control chamber that can be loaded with positive or negative pressure has the advantage that in the event of a jam of the piston or the stamp, the movability can be restored by introducing positive pressure. By building up negative pressure, the stamp is brought back to its starting position or retracted position.

[0033] Since the piston is likewise brought into its retracted position by means of the vacuum from the further vacuum source, there is no risk that the piston will be moved out again due to overpressure.

[0034] Next, other advantageous features and effects of the present invention are described.

[0035] The invention creates an adaptable tool for developing surface mounting technology by bringing together surfaces of different materials by pressure and a specific temperature acting on the upper surface of the component, which pressure and temperature are generated by a form-fitting sealing / locking mechanism of the tool.

[0036] No reaction force needs to be provided by an external system.

[0037] The tool can be designed as a sealed pressure chamber (negative or positive pressure). The connection process can be carried out in a high-pressure gas atmosphere or in a vacuum atmosphere. The chamber is closed by the shape of the chamber itself. One part of the chamber, preferably the lower part of the chamber, can be put into place by a drive mechanism such as a motor or, for example, by a hydraulic or pneumatic mechanism.

[0038] The pressure developed by the tool is compensated by form-fitting mechanical internal elements and / or geometries, so that the force reaction takes a shorter path.

[0039] The substrate may be constructed of direct bonded copper or a similar ceramic substrate.

[0040] For example, the pressure may be predefined to 40 MPa. The connection process may be performed at a temperature setting of, for example, between 20° C. and 330° C. for a defined time of, for example, 70-120 seconds.

[0041] The temperature may be maintained by a heating device in the chamber and may preferably be provided directly at the stamp. Additionally, multiple heating devices may advantageously be used in the system.

[0042] Insulating layers and / or insulating materials may be used in the chamber to thermally insulate sensitive components.

[0043] During the connection process, a protective film, for example made of PTFE material, can additionally be used to protect the semiconductor die, which protective film is preferably applied by means of a roller mechanism.

[0044] The chamber may consist of multiple components and be provided for multiple devices (chips) in the form of multiple planes. Simultaneous processing may also be performed on one plane or on different planes arranged above each other.

[0045] The dimensions of the stamp, in particular the dimensions of its face facing the mating face, can correspond exactly to the dimensions of the component (chip). BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Further advantages of the invention will become apparent from the following description based on the accompanying drawings, which show a currently preferred embodiment.

[0047] Figure 1 The device according to the invention for connecting a component to a substrate is shown in an open state.

[0048] Figure 2a A side view showing the form-fitting mechanism of the device, and Figure 2b Show Figure 2a Cross-sectional view of .

[0049] Figure 3a shows a cross-sectional view of the form-fit mechanism in a closed state of the device under load, and Figure 3b Show according to Figure 3a A cross-sectional view of the device in a closed state with no load.

[0050] Figure 4a Show according to Figure 3a A modification of the invention, wherein the modification is provided with a seal, and Figure 4b Show according to Figure 4b modification.

[0051] Figure 5 An alternative to a form-fit mechanism is shown.

[0052] Figure 6 Shown is a detail of the stamp used to connect the device to the substrate.

[0053] Figure 7a shows a view of the stamp from the underside of the stamp, Figure 7b A side view of a stamp is shown, the axis of which is guided in a stamp guide plate, and Figure 7c Shown is a view from above of the stamp shaft guided in the stamp guide plate.

[0054] Figure 8 A detailed view of the lower part of the device with the device for thermal insulation is shown.

[0055] Fig. 9 An alternative arrangement for thermal isolation is shown.

[0056] Fig.10 A perspective view showing an additively manufactured cylinder plate.

[0057] Fig.11 Show Fig.10 Front view of the cylinder plate.

[0058] Fig.12 Show Fig.10 The edge of the cylinder plate Fig.11 Cross-sectional view along line AA.

[0059] Fig.13 A perspective view showing a modified additively manufactured cylinder plate.

[0060] Fig.14 A perspective view showing another modified additively manufactured cylinder plate.

[0061] Fig.15 A perspective view of a multi-part cylinder plate and a printing plate according to one embodiment of the present invention is shown.

[0062] Fig.16 Show according to Fig.15 Front view of the cylinder plate with the printing plate.

[0063] Fig.17 Show Fig.15 Top view of the cylinder plate.

[0064] Fig.18 Shown corresponding to Fig.16 Top view of the printing template along line AA.

[0065] Fig.19 A perspective view showing a separate cylinder plate, a stamp plate and a counter-stamp according to one embodiment of the present invention.

[0066] Fig. 20 Shown from the front Fig.19 View of the arrangement.

[0067] Fig.21 Shown corresponding to Fig. 20 The line DD in the image is viewed from the printing plate. Fig.19 View of the cylinder plate.

[0068] Fig. 22 Show Fig.19 A cross-sectional view of the arrangement.

[0069] Fig.23 A perspective view showing an alternative embodiment of the arrangement of a separate cylinder plate and an impression plate arranged therebelow.

[0070] Fig.24 Shown from the front Fig.23 View of the arrangement.

[0071] Fig.25 Show Fig.23 Top view of the cylinder plate arrangement.

[0072] Fig.26 Shown corresponding to Fig.24 The line AA Fig.23 Top view of the printing plate with arrangement of .

[0073] Fig. 27A top view showing an alternative embodiment of a split cylinder plate.

[0074] Fig.28 A top view of an alternative embodiment of an imprint plate is shown.

[0075] Fig.29 A plan view of a counter-stamp according to the invention is shown. DETAILED DESCRIPTION

[0076] according to Figures 1 to 29 Embodiments of the invention are described. The drawings are schematic and details of the description may be omitted.

[0077] refer to Figure 1 , the device according to the invention is constituted in the form of a chamber having an upper part 1 (first part) and a lower part 3 (second part). The chamber has essentially the shape of a hollow cube having four side walls, a bottom and a top wall. By isolating the lower part 3 from the upper part 1, the chamber can be opened into two parts, the openings of which point toward each other.

[0078] A press plate 31, also called a product support, is arranged in the lower part 3, and the press plate assumes the function of a counter-stamp. The press plate 31 is used to arrange the starting materials such as substrates, sintering paste and components before the sintering process. A heating plate (heating device) 33 is arranged below the press plate 31. The heating plate 33 is used to dissipate heat to the press plate 31 during the sintering process and to heat the press plate.

[0079] according to Figure 1 , 6 and 7 describe the upper part in more detail. The cylinder plate 19 is arranged at the uppermost position on the upper part 1 of the chamber, i.e. at the position farthest from the opening of the upper part 1. The cylinder plate 19 is additively manufactured and has cylinder bores 118, 118a, 118b, 118c, in which the pistons 117 are accommodated. The cylinder bores 118, 118a, 118b, 118c on the side of the cylinder plate 19 facing away from the respective piston 117 are connected to the pressure supply lines 115, 115', 115a, 115b, 115c. The piston-cylinder arrangement serves as a pneumatic regulating device. Examples of different arrangements of one or more pressure supply lines are given from Figures 13 to 18 and Figure 21 to Figure 23 and described above in conjunction with the cylinder plate 19 according to the invention.

[0080] In order to actuate the piston 117, a pressure-loaded fluid, for example air, is introduced into the cylinder bores 118, 118a, 118b, 118c in the cylinder plate 19 via the pressure supply lines 115, 115', 115a, 115b, 115c, thereby actuating the piston 117. By actuation, the piston 117 is moved in the direction of the lower part 3 of the chamber together with the guide rod 113 arranged at the side of the piston 117 pointing toward the lower part 3. This direction is also referred to below as the "downward direction" or simply "downward" and corresponds to the direction from the upper side of the blade to the lower side of the blade in the figures.

[0081] Although all pistons are preferably actuated simultaneously by applying a preset pressure to the fluid in the pressure delivery line, a mechanism may alternatively be provided for individually controlling the pistons 117. The pistons 117 are reset by applying negative pressure in the pressure delivery lines 115, 115', 115a, 115b, 115c, whereby the pistons 117 and the guide rods 113 return to their starting positions.

[0082] Each piston 117 can come into contact with the axis 111 of the stamp via a guide rod 113. This is achieved by the rounded end of the guide rod 113 facing away from the piston 117 being guided downwards by the actuating piston 117 toward the flat end face of the axis 111 facing the piston 117.

[0083] Here, especially from Figure 6 As can be seen in the figure, the guide rod 113 is guided through the hole in the upper plate 16 arranged above the die guide plate 15. The upper plate 16 also abuts against the inner wall of the upper part 1, so that the space between the upper plate 16 and the cylinder plate 19 can be loaded with positive or negative pressure, regardless of the pressure in the pressure delivery lines 115, 115', 115a, 115b, 115c. For this purpose, a seal 8 is preferably provided between the inner wall of the upper part 1 and the upper plate 16. The space between the upper plate 16 and the cylinder plate 19 is called the intermediate control space 119.

[0084] The stamp shaft 111 is cylindrical and guided through a hole in the stamp guide plate 15. The diameter of the hole is dimensioned so that it slightly exceeds the diameter of the stamp shaft 111, i.e., there is an interference fit. The clearance size is between 8 and 12 μm. A clearance size of 10 μm is preferred.

[0085] On the side of the shaft 111 facing away from the piston, there is the pressure body 11 of the stamp, which faces toward the pressure plate 31. Figure 1 Seven stamps are shown in FIG. 1 , but the number of stamps is not limited in any way and can be selected arbitrarily. In particular, only a single stamp may be provided, but a greater number of stamps is preferred.

[0086] Each die is made in one piece and consists of a shaft 111 and a pressure body 11. The cylindrical shaft 111 is guided through the die guide plate 15 and can be tilted slightly due to the interference fit. The maximum possible tilting degree can be adjusted by the precise play size between the shaft 111 and the hole through the die guide plate 15.

[0087] The tilting is achieved by the guide rod 113 having a rounded end which can roll on the flat end face of the shaft 111 that faces the piston 117. By virtue of the shaft 111 and thus the stamp 11 being tiltable, an inclined position of the component to be sintered can be compensated. This means that when approaching a component that is not aligned exactly in planar fashion, the stamp can adapt to the tilt of the component by tilting.

[0088] The pressure body 11 of the stamp is designed in a cubic shape. Its surface at the bottom facing away from the piston is called the pressure surface. The size of the pressure surface slightly exceeds the product to be sintered so that the component to be sintered can be reliably and completely covered even if the position deviation of the stamp and thus the pressure body 11 is small, that is, for example, slightly twisted.

[0089] The pressure body 11 of the stamp is accommodated in a recess 141 which is arranged at the lower side of the stamp lower plate 14 which is arranged below the stamp guide plate 15. The thickness of the stamp lower plate 14 and thus of the recess 141 is dimensioned such that the pressure body 11 of the stamp cannot completely move out of the recess during the pressure loading by the piston 117. The total height of the starting material and thus the required travel path of the stamp thus moves in the micrometer range, while the height of the pressure body and also of the recess is several millimeters.

[0090] The distance between the side of the pressure body 11 and the inner wall of the recess 141 is dimensioned to be greater than the distance between the shaft 111 and the inner wall of the hole. For this reason, it is excluded that the pressure body 11 gets stuck in the recess 141 due to the above-described possible tilting of the stamp.

[0091] Since the stamp is only in contact with the guide rod 113 or the piston 117 but is not firmly connected thereto, even though the piston 117 and the guide rod 113 are brought back to their starting position by applying negative pressure to the pressure supply line, the stamp remains in the extended position after the pressure application. Figure 6 The state is schematically shown in FIG.

[0092] In order to release the stamp from the sintered product and return it to its starting position, the intermediate control chamber 119 is charged with negative pressure and the stamp is sucked back into its starting position due to the pressure difference now existing between the area of ​​the pressure body 11 and the intermediate control chamber. However, in this process, small air flows are formed between the shaft 111 and the inner wall of the hole and between the wall of the pressure body 11 and the inner wall of the recess 141.

[0093] However, the small air flow is negligibly small and ends as soon as the upper face of the pressure body 11 around the shaft 111 comes into contact with the die guide plate 15. Since the pressure body 11 of the die rests with its upper face against the underside of the die guide plate 15, the end face of the shaft 111 is prevented from abutting against the guide rod 113 of the retracted piston 117. This has the advantage that a thermal insulation is produced between the hot die and the piston after the sintering process.

[0094] Here, the air sucked out from the intermediate space 151 between the end side of the shaft 111 and the upper plate 16 also contributes to the resetting of the impression, such as from Figure 6 Thus, on the one hand, the air present in the intermediate space 151 has been enhanced by the reset of the guide rod 113 due to the negative pressure built up in the intermediate control chamber 119 .

[0095] Due to this design, it is possible to replace a defective die at any time without great effort, or to completely replace all dies depending on the component to be sintered. To do this, it is only necessary to remove the die downwards and replace it with another die.

[0096] If the piston 117 gets stuck despite the thermal insulation and cannot be retracted simply due to the negative pressure in the pressure supply lines 115, 115', 115a, 115b, 115c, pressure can be applied to the underside of the piston by increasing the pressure in the intermediate control chamber 119, thereby releasing the jam and allowing the piston 117 to be moved back to the starting position.

[0097] It should also be mentioned here that due to the different cross-sections of the piston 117 and the stamp with the pressure surface of the pressure body 11, a minimum ratio of the input pressure applied to the guide rod 113 and the shaft 111 by the piston 117 to the output pressure on the stamp surface must be observed. The input pressure is applied to the circular cross-section of the piston 117.

[0098] In a possible embodiment of a stamp with a square-shaped pressure surface, the side length of the square is "a". In both cases, the piston 117 has a circular cross section with a radius of "a". In this case, in which the cross section of the stamp surface is square, the ratio of the input area to the output area is minimized. That is, the pressure applied to the device becomes maximum, as can be seen from the following equation:

[0099] P=F / A.

[0100] In the equation, "P" stands for pressure, "F" stands for force, and "A" stands for cross-sectional area.

[0101] In the case of a square with side length "a", the ratio of the pressure area to the piston area is approximately 1.273. This corresponds to the ratio of the area of ​​a square with side length "a" to the area of ​​a circle with diameter "a" inscribed in the cube.

[0102] It is therefore necessary to load the piston 117 with a higher pressure than that applied to the starting material. In the above example, the input pressure must be approximately 51 MPa so that the desired output pressure of 40 MPa prevails.

[0103] In the case where the pressure surface is not square, but for example rectangular, the ratio can be determined similarly. For example, the input pressures required for different stamp surfaces can be provided in the form of a table or in the form of a characteristic curve set for different output pressures.

[0104] Especially according to Figure 1 , Figure 8 and Fig. 9 The details of the lower part 3 are described in more detail.

[0105] Cooling plates 37, thermal insulation in the form of insulating plates 35, heating plates 33 and product holders 31 are arranged in order from bottom to top on the lower part 3 of the chamber. The product holders 31 serve as a counter-mold and are used to carry substrates onto which components can be sintered.

[0106] In order to improve the quality of the sintered product, it is necessary to carry out heat transfer to the starting material as much as possible simultaneously with the application of pressure by the stamp. For this purpose, a thermal insulation is provided between the heating plate 33 and the product support 31 arranged above it, such as from Figure 8 Schematically visible in .

[0107] In order to achieve thermal insulation, a prestressing element 32 is provided between the underside of the product support 31 and the bottom wall of the lower part 3, which prestresses the product support 31 upwardly at a distance from the heating plate 33. The prestressing element 32 can be designed in the form of a spring, for example a helical spring, as in Figure 8 It is schematically shown in FIG. 1 , but is not limited thereto.

[0108] For example, instead of the schematically indicated helical spring, other types of springs, such as leaf springs, hydraulic or pneumatic pistons or mechanical mechanisms, such as a toothed rack, can also be used as preload elements.

[0109] Due to the prestressing element 32, the product support 31 is in a position spaced apart from the heating plate 33, in which a heat transfer occurs at most in a reduced manner, since there is an air gap as an insulator between the product support 31 and the heating plate 33. As soon as the stamp is actuated and begins to exert pressure on the starting material and the product support carrying it, the prestressing force of the prestressing element 32 is overcome and the product support 31 is brought into contact with the heating plate 33. In this state, a direct heat transfer occurs from the heating plate 33 to the product support 31 and further to the starting material.

[0110] The starting material is thus exposed to pressure and heat simultaneously until the pressure loading by the stamp is terminated by resetting the piston 117. At the same time as the pressure loading is terminated, the product carrier 31 is removed from the heating plate 33 by the prestressing force of the prestressing element 32, so that further heating of the product carrier 31 and the starting material is prevented by the still hot heating plate 33.

[0111] It should be noted that: Figure 8 The view only shows the components that are important for thermal isolation, but the overall structure can be Figure 1 For example, a heat insulating portion, a cooling device, etc. may be provided between the heating plate 33 and the bottom wall of the lower component 3 .

[0112] Fig. 9 An alternative for thermally insulating the product support and the heating plate is schematically shown. According to the alternative, the heating plate is provided with a plurality of through-holes (air channels) pointing from the lower side of the heating plate to the upper side of the heating plate, which are connected to an air supply channel 36 which leads through the bottom wall of the lower part 3 and the heat insulation 35 of the heating plate 33. In order to thermally isolate the product support 31 from the heating plate 33, air or another suitable fluid is conveyed through the air supply channel 36 until a pressure is applied to the stamp by the piston 117. After the air has passed through the plurality of air channels in the heating plate 33, the air forms an air cushion between the heating plate 33 and the product support, which, in addition to the thermal insulation, also ensures additional insulation against radiant heat.

[0113] By interrupting the air supply at the time of the pressure actuation of the piston 117, the air cushion between the heating plate 33 and the product support 31 is eliminated. The product support 31 is immediately heated by the contact with the heating plate. The heat is simultaneously transferred to the starting material which is then under pressure generated by the stamp.

[0114] To carry out the sintering process, the device is closed by joining the upper part 1 and the lower part 3. The process is particularly based on Figures 1 to 5 Give a description.

[0115] The side wall of the upper part 1 has a recess 131 at its edge pointing toward the lower part 3. There are corresponding projections 137a and 137b adjacent to the recess 131. The side wall of the lower part 3 has a corresponding projection 39, which is introduced into the recess 131 between the projections 137a and 137b when the edge of the upper part 1 is in contact with the edge of the lower part 3. In addition, a seal is arranged outside the projection 39 of the lower part 3, which seals the interior of the chamber in a fluid-tight manner relative to the external environment when the chamber is closed.

[0116] In each protrusion 137a, 137b, 39, holes 133a, 133b and 391 are arranged transversely to the opening or closing direction of the chamber, and the cross sections of the holes overlap each other in the state of being in contact (i.e. when the chamber is closed). The holes 133a, 133b and 391 are formed in the form of long holes. This means that the length l1 of the holes 133a, 133b of the upper part and the length l2 of the hole 391 in the lower part 3 exceed the width b of the holes 133a, 133b and 391. The hole 133b located inside is a blind hole.

[0117] In the figures, the proportions of the holes are shown exaggerated. In fact, it is sufficient that the lengths l1 and l2 exceed the width b of the holes 133a, 133b and 391 by approximately 0.5 mm.

[0118] For example, depending on the number of holes, the diameter of the hole can be 5 to 40 mm. The same diameter range applies to one or more pins. In this case, tolerances of up to 2 mm to H7 are possible. If the hole is selected to be larger than the pin, self-centering is advantageously obtained via the upper pressure point (i.e. the point where the pin contacts the hole wall), so that a high-precision fit is not required at all.

[0119] Due to the ratio of the holes 133a, 133b and 391, the cylindrical pin 135 in the abutting state can be easily guided through all holes due to the play created by the shape of the elongated hole. As soon as the piston 117 applies a pressure load to the stamp and via the stamp to the lower part 3 of the chamber, the following occurs: Figure 3a The situation shown.

[0120] Due to the pressure load, a force F acts downward, whereby the lower part 3 of the chamber is displaced downward from the abutting state until no further displacement is possible due to the now blocking pin 135. Thus, the form fit makes it possible to absorb the forces acting on the lower part without having to provide a complex hydraulic table or the like.

[0121] As from Figure 2a As can be seen in FIG. 1 , a plurality of series of holes 133a, 133b and 391 are provided, to which the generated force F is distributed. Thus, the requirements on the material characteristic values ​​of the pin can be reduced.

[0122] After locking the chamber, the stamp is actuated, and the pressure of the stamp acts on the initial material. Therefore, a predetermined pressure acting on the initial material, such as a substrate, a silver paste layer as a connector, and a chip as a device, placed on the product support 31 is generated. According to the present invention, a pressure of 40 to 50 MPa can be achieved.

[0123] In the chamber, temperatures between 20° C. and 330° C. can be reached in the region between the product support 31 and the lower die plate 14 . The joining process can thus be completed in between 70 and 120 seconds. It is advantageous here to arrange the heating plate in such a way that the heat is emitted directly to the product support 31 .

[0124] The required pressure is established by applying gas under high pressure to the pistons 117 in the cylinders of the cylinder plate 19 .

[0125] If desired, a positive or negative pressure may also be established in the chamber by introducing or removing gases therefrom, and / or gases such as nitrogen may be delivered to facilitate the joining process, or reactive gases may be delivered.

[0126] While maintaining the state for a preset time, a sintering process occurs, ie, the connection of the silver molecules to the device and the substrate.

[0127] As soon as the pressure load on the stamp ends, the lower part 3 can be placed against the upper part 1 again, e.g. Figure 3b In this state, the pin 135 can simply be removed from the holes 133a, 133b and 391 again, and the chamber can be opened to remove the finished sintered device.

[0128] exist Figure 4a and 4b A variant is shown in FIG. 3 , in which a seal 311 is additionally arranged inside and outside the projection 39. The seal 311 can: not only be in the state of contact (see Figure 4b ) and in the pressure loading state (see Figure 4a ) both seal the interior of the chamber liquid-tightly.

[0129] Due to the form fit, all pressures that develop during the sintering process are absorbed by the chamber itself. Therefore, no further structural measures are required to absorb or dissipate high pressures.

[0130] from Figure 5An alternative for designing a form fit can be seen schematically in . Here, instead of the above-described design, each side wall of the upper part 1 and the lower part 3 is provided with a flange-like protrusion 431, 433. The protrusions 431, 433 have an inclined surface at their faces pointing away from each other. In order to establish a form fit, a C-clamp 435 is guided via the protrusions. The clamp 435 has a corresponding inclined surface on the inner surface of its legs pointing to the inclined surface of the protrusions, so that a planar contact between the inner surface of the legs of the clamp 435 and the inclined surfaces of the protrusions 431, 433 is possible. In the case of the alternative described here, the pressure is absorbed by the C-clamp 435, which can be easily removed again after the sintering process is completed due to the inclined surface.

[0131] Instead of the above-described cylindrical pin, the form fit can also be achieved, for example, by means of a conical pin and a corresponding conical bore.

[0132] The above-described process can advantageously be automated.

[0133] According to the prior art, the counterforce required due to the pressing process must be applied with the aid of an external structure. There, the mechanism for moving the carrier assembly upwards to hold the substrate ensures the external force required to lock the substrate in place and generate the counterforce required for the process. However, this results in a bulky and very complex machine structure.

[0134] Due to the form fit according to the invention, the invention creates an internal counterforce mechanism. Therefore, no external force source is required to provide the counterforce.

[0135] In order to prepare for the connection method, a paste is printed onto the substrate and the components (chips) are arranged on the paste, ie the substrate is equipped with chips on the paste. The printed and chip-equipped substrate is then introduced into a chamber.

[0136] Since the tool is adaptable, the position of the stamp corresponds to the corresponding position of the chip on the substrate. The film can advantageously be placed above the chip, for example via a roller attached to the side of the tool. The film can be updated after each connection process. This can be performed by updating the roller with the film or by changing the position of the existing film. The latter can be performed by continuing to pull the film wound on the roller and changing the position of the film. For example, PTFE or similar plastics can be used as film materials, but are not limited to this.

[0137] The joining process is run at a predetermined temperature and a predetermined pressure for a predetermined period of time to effectively sinter the device to the substrate. Before and after the joining process, the device and / or other initial materials (such as substrate and silver paste) can be preheated or cooled by preheating or cooling equipment.

[0138] Below, according to Figures 10 to 29The arrangement of the cylinder plate 19 according to the invention and of the cylinder plate 19 , the stamp plate 15 and the counter-stamp 31 of the device according to the invention for connecting a component to a substrate is described in more detail.

[0139] It should also be noted that for the sake of clarity, not every component is provided with a reference number in the drawings. Fig.10 In the embodiment, only one cylinder bore is provided with reference numeral 118. However, the remaining cylinder bores are similar to the cylinder bores provided with reference numerals except for their position.

[0140] Figures 10 to 14 The cylinder plate 19 in the embodiment is produced by additive manufacturing. For this purpose, a liquid material is applied layer by layer to the working surface. After application, the liquid material solidifies so that further layers can be applied to the existing solidified material layer. The application is carried out in such a way that areas in the finished cylinder plate that are not provided with material are omitted. In this case, these are in particular the cylinder bores 118 and the pressure supply lines 115. For example, from Fig.10 As can be seen in FIG. 1 , a pressure supply line 115 leads from a connection 116 at one side of the cylinder plate 19 to a cylinder bore 118 . Fig.11 Show Fig.10 A front view of the cylinder plate, and Fig.12 Show Fig.10 Cylinder plate edge Fig.11 Cross-sectional view along line AA.

[0141] from Fig.13 and Fig.14 Further design options for the additively manufactured cylinder plate can be seen in the figure.

[0142] exist Fig.13 Different from Figures 10 to 12 The straight line shape of the pressure delivery line 115' is formed in a curved form. As a result, the volume occupied by the pressure delivery line 115' in the cylinder plate 19 is reduced, thereby further improving the strength of the cylinder plate 19.

[0143] exist Fig.14 In the embodiment of the invention, the cylinder bores are divided into three groups of cylinder bores 118a, 118b and 118c. Each of these groups is supplied with pressure medium via its own pressure supply line 115a, 115b or 115c from the connection 116a, 116b, 116c. The pressure supply lines 115a, 115b and 115c are all located in the same plane. Only at the intersection and intersection of two lines, for example line 115a with line 115b, is one pressure supply line guided above the other. Fig.211 and 2. It is shown in the figure that, for example, pressure delivery line 115a is guided above pressure delivery line 115b and pressure delivery line 115c in order to supply cylinder bores 118a, 118a which are remote from the interface, in the figure, at the top and right of the figure. In a similar manner, pressure delivery line 115c is guided above pressure delivery line 115b at the intersection with pressure delivery line 115b.

[0144] Figures 15 to 29 An embodiment of a cylinder plate 19 according to the invention or an arrangement of a cylinder plate 19 , a stamp plate 15 and a counter-stamp 31 in a device for connecting a component to a substrate is shown.

[0145] exist Figures 15 to 29 1 , the cylinder plate 19 , the stamp plate 15 and the counter-stamp 31 are shown, which only have features for compensating for thermal expansion, while other details such as pressure supply lines, cylinders, stamps, etc. are not shown.

[0146] Fig.15 A perspective view of a multi-piece cylinder plate and printing plate according to one embodiment of the present invention is shown. Fig.16 Show according to Fig.15 Front view of the cylinder plate with the printing plate. Fig.17 Show Fig.15 Top view of the cylinder plate.

[0147] The cylinder plate 19 is composed of four parts 19a, 19b, 19c and 19d in a multi-piece manner. Each part 19a, 19b, 19c, 19d has a rectangular shape. All four parts 19a, 19b, 19c, 19d are arranged so that they abut against each other at the docking point A. Here, in the embodiment described, the docking point A corresponds to the midpoint of the cylinder plate 19, which is also the zero point.

[0148] For connection with the upper part of the device for connecting the component to the substrate, pins 20a, 20b, 20c, 20d are provided, which are received in holes 195a, 195b, 195c, 195d provided at the corners of the cylinder plate 19. The holes 195a, 195b, 195c, 195d are configured as elongated holes, the longitudinal axes of which are located on the line connecting the corresponding corner of the cylinder plate 19 or the corresponding corner of the corresponding component 19a, 19b, 19c, 19d with the docking point A. Therefore, the longitudinal axes of the elongated holes intersect in the docking point A, which also corresponds to the zero point in the embodiment. Here, the pins 20a, 20b, 20c, 20d are fastened to the upper part of the device for connecting the component to the substrate and extend into the elongated holes 195a, 195b, 195c, 195d of the cylinder plate 19. For this reason, the cylinder plate 19 can simply be removed in the downward direction when the chamber is open.

[0149] This arrangement results in that, when the cylinder plate 19 is heated, the zero point (docking point A) remains in place, while the outer corners of the cylinder plate 19 or the outer corners of each component 19a, 19b, 19c, 19d can be displaced due to thermal expansion along the axis of the corresponding long hole 195a, 195b, 195c, 195d along the corresponding pins 20a, 20b serving as guides.

[0150] In order to compensate for the thermal expansion of the die plate guide plate 15, the compensating die plate guide plate is also provided with slots 155a, 155a' and 155a", 155b, 155b' and 155b", 155c, 155c' and 155c", 155d, 155d' and 155d", as shown in FIG. Fig.18 In addition, the printing plate 15 is connected to the four parts 19a, 19b, 19c, 19d of the cylinder plate 19 via pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" . This connection is carried out in a similar manner to the connection of the cylinder plate 19 to the upper part. Pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" are thus fixed to the cylinder plate 19 and extend into the elongated holes 155a, 155a' and 155a", 155b, 155b' and 155b", 155c, 155c' and 155c", 155d, 155d' and 155d" of the printing plate 15.

[0151] Therefore, each part 19a, 19b, 19c, 19d is connected to the die guide plate at three of its corners. Only the corner at the abutment point A has no elongated hole.

[0152] Pins 1519a to 1519d" are arranged in long holes 155a, 155a' and 155a" of the die guide plate 15, and the orientation of the long holes is such that the longitudinal axes of the long holes intersect in the die plate zero point B1, B2, B3 or B4. In the cold state, the points B1, B2, B3, B4 correspond to the midpoints of the parts 19a, 19b, 19c, 19d of the cylinder plate 19, respectively. The arrangement of the long holes 155a, 155a' and 155a" and the pins 1519a to 1519d" of the die guide plate 15 achieves outstanding compensation for the different thermal expansions between the cylinder plate 19 (four parts 19a, 19b, 19c, 19d) and the die guide plate 15. Thus, due to the determination of the zero point B1, B2, B3, B4 of the die plate guide plate 15, it is ensured that, despite thermal expansion, the zero point does not shift relative to its corresponding point of the cylinder plate 19 arranged above the die plate 15. As a result, pressure can be applied precisely to the die 11 at any time, regardless of thermal expansion. The die is therefore preferably arranged such that one of the die plate zero points B1, B2, B3 or B4 is located on the center axis of the die 11.

[0153] It is thus ensured at all times that the stamp 11 always acts sufficiently precisely on the component on the base plate, even in the event of thermal expansion of the individual plates 15 , 19 during operation of the system, thereby avoiding defective products.

[0154] In the above-described embodiments, the holes are designed as elongated holes, so that the zero point or the printing plate zero point corresponds to the center point of the plate or of a plate part of a multi-part plate.

[0155] Fig.19 A three-dimensional arrangement of a separate cylinder plate, a stamp plate and a counter-stamp according to one embodiment of the present invention is shown. Fig. 20 Shown from the front Fig.19 View of the arrangement. Fig.21 Shown corresponding to Fig. 20 The line DD in the image is viewed from the printing plate. Fig.19 View of the cylinder plate. Fig. 22 Show Fig.19 A cross-sectional view of the arrangement.

[0156] Fig.19 The view corresponds to Fig.15 The product carrier is shown in the top view from Fig.29 visible.

[0157] As from Fig.19 As can be seen in FIG. 1 , the multi-piece cylinder plate 19, the stamp plate 15 and the product carrier 31 are arranged in a top-to-bottom order. As described above, the cylinder plate 19 is attached to the upper part 1 of the device for connecting the device to the substrate via pins 20a, 20b, 20c and 20d (see, for example, FIG. 1 ). Figure 1) place.

[0158] Pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" are fixed to the cylinder plate 19, as has been described in accordance with Fig.18 Describe and from Fig.21 It can be seen that Fig.21 A bottom view of the cylinder plate 19 is shown. The downwardly projecting ends of the pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" are received in the elongated holes 155a, 155a', 155a", 155b, 155b', 155b", 155c, 155c', 155c", 155d', 155d" of the platen 15 and serve to guide the platen during thermal expansion.

[0159] The stamp plate 15 is provided with pins 3115a, 3115b, 3115c and 3115d on its underside, the downwardly projecting ends of which in turn extend into the elongated holes 315a, 315b, 315c and 315d of the product carrier (counter-stamp 31) when the chamber is closed, so as to guide the expansion of the pins in the event of thermal expansion. The elongated holes 315a, 315b, 315c and 315d are also arranged so that the longitudinal axes of the pins intersect in the counter-stamp zero point C. This ensures that the counter-stamp zero point C remains in place despite thermal expansion, and Fig.29 The product P indicated by a rectangle in the figure is displaced together with the heat during the process in accordance with the thermal expansion.

[0160] However, due to the defined stamp plate zero points B, B1 , B2 , B3 , B4 it is ensured that the positions reached by the product in the context of thermal expansion are sufficiently covered by the stamp 11 in order to be acted upon by the predefined pressure.

[0161] Although the invention has been described above in terms of presently preferred embodiments, it should be noted that alternatives are possible with regard to the orientation of the holes and pins.

[0162] For example, the zero point defined by the long hole and the cylindrical pin can be freely selected. Although the zero point is located at the center of the cylinder plate according to the embodiment, the zero point can also be defined at other positions if necessary.

[0163] This can be achieved simply by changing the orientation of the slots so that their longitudinal axes intersect at another point. In some applications, it can therefore make sense to set the zero point of the tool at a specific point on the component to be pressed. In this case, the longitudinal axis of the slot does not lie on the line connecting the corner and the center point of the cylinder plate.

[0164] In this embodiment, the pins and the holes as slotted holes are arranged in the corners of the cylinder plate. However, it would make sense to also arrange the pins and holes at other locations in the edge region of the cylinder plate, for example in the middle of each side of the cylinder plate, or also to arrange a plurality of holes on each side of the steel plate.

[0165] In the following description, according to Figure 23 to Figure 28 An alternative arrangement of the holes is shown. Although the holes are also designed as elongated holes, the zero point of the cylinder plate 19 and / or the printing plate 15 can be defined at any position on the plate or plate part that deviates from the center point. This is achieved by rotating the elongated holes and / or changing the position of the elongated holes so that their longitudinal axes intersect at the position of the set zero point.

[0166] according to Fig.25 , the elongated holes 195a, 195b, 195c, 195d are displaced along the edge from the corner of the cylinder plate 19. However, the elongated holes are oriented as before so that their longitudinal axes intersect in the zero point A, which corresponds to the center point of the cylinder plate 19 and the abutment point of the four part plates 19a, 19b, 19c, 19d.

[0167] but, Fig.26 The long holes 155a, 155a', 155a", 155b, 155b', 155b", 155c, 155c', 155c", 115d, 155d', 155d" in the printing plate shown in the figure are rotated so that their longitudinal axes intersect at the printing plate zero point B1, B2, B3, B4, and the printing plate zero point does not coincide with the midpoint of the virtual part plate of the printing plate 15. Pins 1519a, 1519a', 1519a", 1519b, 1519b', 1519b", 1519c, 1519c', 1519c", 1519d, 1519d', 1519d" are fixed at corresponding positions on the lower side of the cylinder plate 19.

[0168] from Fig. 27 and Fig.28 A further alternative embodiment of the cylinder plate 19 and the printing plate 15 can be seen in FIG. 1 , in which the zero point also does not coincide with the center point of the plate or of a part of the plate.

[0169] It should also be pointed out that other suitable guide elements may be used instead of the described pins. A mating spring is mentioned as an example of this.

[0170] In addition to the inventions claimed in the claims, the present disclosure also relates to further embodiments of the device for connecting a component to a substrate as defined in the following subject matter.

[0171] I. Apparatus for connecting a device to a substrate with a form fit

[0172] Subject I.1. Apparatus for connecting a device to a substrate, having

[0173] A chamber that can be divided into at least two parts, wherein

[0174] A stamp (11, 111) is provided at the first component (1), and

[0175] A counter-imprint (31) is provided on the second component (3), wherein

[0176] The first component (1) has a wall with an edge which can come into contact with an opposite edge of a wall of the second component (3) in order to close the chamber, wherein

[0177] In the open state of the chamber, the counter-stamp (31) can be loaded with initial material, and

[0178] In the closed state of the chamber, pressure can be applied to the starting material arranged between the stamp (11, 111) and the counter-stamp (31) via the stamp (11), wherein

[0179] In the closed state, the first component (1) and the second component (3) can be locked by means of a form fit, so that opening the chamber by separating the first component (1) from the second component (3) is prohibited.

[0180] Subject I.2. An apparatus according to subject I.1, wherein

[0181] Each edge has a recess (131) and / or a projection (137; 39) with a hole (133a, 113b; 391), which can be abutted against a projection (39; 137) and / or a recess (131) of an opposite edge, wherein the cross section of the hole (133a, 133b) of the projection (137a, 137b) of the wall of the first component (1) at least partially overlaps the cross section of the hole (391) of the projection (39) of the wall of the second component (3) in the abutted state, and

[0182] The positive fit can be established by means of a pin (135) which is guided through two holes (133a, 133b; 391).

[0183] Subject I.3. An apparatus according to subject I.2, wherein

[0184] At least one of the holes (133a, 133b; 391) has a cross-section having a length (l1; l2) greater than the width (b), wherein the length (l1, l2) of the cross-section extends in the opening direction of the chamber.

[0185] Subject I.4. An apparatus according to subject I.3, wherein

[0186] In the abutting state, the center axis of the hole (133a, 133b) of the projection (137a, 137b) of the wall of the first component (1) is different from the center axis of the hole (391) of the projection (39) of the wall of the second component (3).

[0187] Subject I.5. An apparatus according to any one of Subjects I.2 to I.4, wherein

[0188] When the chamber is in the closed state, while the stamp (11) applies pressure to the counter-stamp (31) via the initial material, the pin (135) is clamped between the inner wall section of the hole (391) in the protrusion (39) of the second component (3) pointing toward the first component (1) and the inner wall section of the hole (133a, 133b) in the protrusion (137a, 137b) of the first component pointing toward the second component (3), and the pin (135) can be introduced into the hole (133a, 133b; 391) and removed in a freely movable manner when no pressure is applied.

[0189] Subject I.6. An apparatus according to any of Subjects I.1 to I.5, wherein

[0190] At least the edge of the first component (1) or the edge of the second component (3) has a seal (311), which is capable of: establishing an airtight state of the chamber when the chamber is closed, regardless of the pressure applied by the stamp (11) to the counter stamp (31) via the initial material.

[0191] Subject I.7. An apparatus according to subject I.1, wherein

[0192] The first component (1) has a flange-shaped first protrusion (431) at the edge pointing to the outside of the chamber, and

[0193] The second component (3) has a flange-shaped second protrusion (433) at the edge pointing to the outside of the chamber, wherein

[0194] A positive fit can be established by bringing the surface of the first protrusion (431) pointing toward the second protrusion (433) into contact with the surface of the second protrusion (433) pointing toward the first protrusion (431) and attaching the clamp (435) via two flange-like protrusions (431, 433).

[0195] Subject I.8. An apparatus according to subject I.7, wherein

[0196] The surface of the first projection (431) facing away from the second projection (433) and / or the surface of the second projection (433) facing away from the first projection (431) is formed in an inclined manner.

[0197] Subject I.9. An apparatus according to subject I.8, wherein

[0198] Each inner surface of the clamp (435) that is to come into contact with the inclined surface of the first and / or second protrusion (431; 433) has a corresponding inclined surface.

[0199] Subject I.10. An apparatus according to subject I.7, I.8 or I.9, wherein

[0200] The clamp (435) is rotatably connected at one end thereof to the wall of the first component (1) or the wall of the second component (3), and a positive fit can be established and cancelled by rotating the clamp about the connection point.

[0201] II. An apparatus for connecting a device to a substrate with an additively manufactured cylinder plate

[0202] Subject II.1. Cylinder plate (19) of an apparatus for connecting a device to a substrate, the apparatus having a chamber which can be divided into at least two parts, wherein the cylinder plate (19) is arranged at a first part (1) of the chamber, and

[0203] In the cylinder plate (19) are formed:

[0204] a cylinder bore (118; 118a, 118b, 118c) for accommodating a reciprocating piston (117) which, when loaded with a gaseous pressure medium to transmit pressure, can come into contact with the stamp (11, 111) in order to press the stamp against a counter-stamp (31) arranged on the second component (3), and

[0205] a pressure delivery line (115; 115a, 115b, 115c) via which pressure medium can be delivered to the cylinder bore (118; 118a, 118b, 118c) in order to actuate the piston (117),

[0206] It is characterized in that

[0207] The cylinder plate (19) is produced by means of additive manufacturing.

[0208] Subject II.2 A cylinder plate according to Subject II.1, wherein

[0209] A plurality of cylinder bores (118) and reciprocating pistons (117) accommodated therein are provided in the cylinder plate (19), and each cylinder bore can be supplied with pressure medium via a pressure delivery line (115; 115a, 115b, 115c) formed in the cylinder plate.

[0210] Subject II.3. A cylinder plate according to subject II.1 or II.2, wherein

[0211] A plurality of cylinder bores (118a, 118b, 118c) are provided in the cylinder plate (19), and the cylinder bores (118a, 118b, 118c) are combined into groups, and

[0212] A group of cylinder bores (118a, 118b, 118c) can be supplied with pressure medium via its own pressure supply line (115a, 115b, 115c) formed in the cylinder plate (19).

[0213] Theme II.4. A cylinder plate according to any one of the themes II.1 to II.3, wherein a plurality of pressure supply lines (115a, 115b, 115c) are provided in a single plane of the cylinder plate (19), and

[0214] By having the second pressure delivery line (115a; 115c; 115a) bypass the first pressure delivery line (115b; 115c) via the second plane of the cylinder plate (19), tangency or intersection of two different pressure delivery lines (115a:115b, 115a:115c, 115c:115b) is avoided.

[0215] Subject II.5. A cylinder plate according to any one of subjects II.1 to II.4, wherein

[0216] At least one section of the pressure delivery line (115; 115a, 115b, 115c) is designed in a manner that deviates from a straight line shape.

[0217] Subject II.6. A cylinder plate according to any one of subjects II.1 to II.5, wherein

[0218] The pressure delivery line (115) has a cross section that is circular in shape or a cross section that is different from a circular shape.

[0219] Subject II.7. A cylinder plate according to any one of subjects II.1 to II.6, wherein

[0220] The pressure delivery line (115) has a diameter between 0.1 mm and 1 mm.

[0221] Subject II.8. A cylinder plate according to any one of subjects II.1 to II.7, wherein

[0222] The cylinder plate (19) is made of aluminum or an aluminum alloy.

[0223] Subject II.9. A cylinder plate according to any one of subjects II.1 to II.8, wherein

[0224] The cylinder plate comprises a plurality of parts (19a, 19b, 19c, 19d).

[0225] Subject II.10. A cylinder plate according to any one of subjects II.1 to II.9, wherein

[0226] The cylinder plate (19; 19a, 19b, 19c, 19d) has holes (195a, 195b, 195c, 195d) in the corner region for being supported via pins (20a, 20b, 20c, 20d) on an upper part (1) of a device for connecting a component to a substrate.

[0227] Subject II.11. A cylinder plate according to subject II.10, wherein

[0228] The holes (195a, 195b, 195c, 195d) are designed as elongated holes, the longitudinal axes of which have an intersection point which defines a zero point.

[0229] Topic II.12. A cylinder plate according to Topic II.11, wherein each longitudinal axis is located on a line connecting the corresponding corner of the cylinder plate (19; 19a, 19b, 19c, 19d) with the midpoint (A) of the cylinder plate (19) or the docking point (A) of multiple parts of the cylinder plate (19a, 19b, 19c, 19d).

[0230] Topic II.13. An apparatus for connecting a device to a substrate, having

[0231] A chamber which can be divided into at least two parts, wherein

[0232] A stamp (11, 111) is provided at the first component (1), and

[0233] A counter-imprint (31) is provided on the second component (3), wherein

[0234] The first component (1) can be brought into contact with the second component (3) to close the chamber, wherein

[0235] In the open state of the chamber, the counter-impression (31) can be loaded with initial material, and

[0236] In the closed state of the chamber, pressure can be applied via the stamp (11) to the starting material arranged between the stamp (11, 111) and the counter-stamp (31), wherein

[0237] A cylinder plate according to any one of the topics II.1 to II.12 is provided at the first component, and the pressure of the gaseous pressure medium in the pressure delivery line (115; 115a, 115b, 115c) is transmitted to the stamp (11, 111) by means of a piston (117).

[0238] Subject II.14. A method for producing a cylinder plate (19) having a cylinder bore (118), wherein the cylinder bore (118) is connected to a connection (193) via a pressure supply line (115), wherein

[0239] The cylinder plate (19) is additively manufactured by applying layer by layer of a material that solidifies after application onto the production surface.

[0240] In this case, the cylinder bore (118) and the pressure supply line (115) are omitted when applying the material.

[0241] Topic II.15. A method according to Topic II.14, wherein the pressure delivery pipeline (115, 115a, 115b, 115c) is located in a unique plane of the cylinder plate, and a tangency or intersection of two different pressure delivery pipelines (115a:115b; 115a:115c; 115c:115b) is made by bypassing the pressure delivery pipeline (115b; 115c) through a second plane by another pressure delivery pipeline (115a; 115a, 115c).

[0242] III. Cylinder plate for a device for connecting a device to a substrate and such a device, and in particular a cylinder plate for compensating for thermal expansion

[0243] Subject III.1. A cylinder plate (19) of an apparatus for connecting a device to a substrate, the apparatus having a chamber which can be divided into at least two parts, wherein the cylinder plate (19) is arranged at a first part (1) of the chamber, and

[0244] In the cylinder plate (19) are formed:

[0245] a cylinder bore (118; 118a, 118b, 118c) for receiving a reciprocating piston (117) which, when loaded with a gaseous pressure medium, can abut against the stamp (11, 111) to transmit pressure in order to press the stamp against a counter-stamp (31) arranged on the second component (3), and

[0246] a pressure delivery line (115; 115a, 115b, 115c) via which pressure medium can be delivered to the cylinder bore (118; 118a, 118b, 118c) in order to actuate the piston (117),

[0247] It is characterized in that

[0248] The cylinder plate (19) has holes (195a, 195b, 195c) at its edge, which are designed to receive guide elements, preferably pins (20a, 20b, 20c, 20d) with play, by means of which the cylinder plate can be connected to the first part (1) of the chamber.

[0249] Subject III.2. A cylinder plate according to subject III.1, wherein

[0250] The cylinder plate is composed of a plurality of parts (19a, 19b, 19c, 19d), wherein each part (19a, 19b, 19c, 19d) has at least one hole (195a, 195b, 195c, 195d).

[0251] Subject III.3. A cylinder plate according to subject III.1 or III.2, wherein

[0252] The holes (195a, 195b, 195c, 195d) are formed at least in the corner regions of the cylinder plate (19; 19a, 19b, 19c, 19d).

[0253] Subject III.4. A cylinder plate according to any one of subjects III.1 to III.3, wherein

[0254] The holes (195a, 195b, 195c, 195d) are designed as elongated holes, the longitudinal axes of which have an intersection point which defines a zero point (A).

[0255] Topic III.5. A cylinder plate according to Topic III.4, wherein each longitudinal axis lies on a line connecting the corresponding corner of the cylinder plate (19; 19a, 19b, 19c, 19d) and a zero point (A) corresponding to the midpoint of the cylinder plate (19, 19a, 19b, 19c, 19d).

[0256] Topic III.6. A cylinder plate according to Topic III.4, wherein the cylinder plate is composed of multiple components (19a, 19b, 19c, 19d), and the zero point (A) corresponds to the docking point of the multiple components (19a, 19b, 19c, 19d).

[0257] Topic III.7. A cylinder plate according to Topic III.4, wherein the cylinder plate is composed of multiple components (19a, 19b, 19c, 19d), and the zero point (A) is spaced apart from the docking points of the multiple components.

[0258] Theme III.8. A cylinder plate according to any one of themes III.4 to III.7. The cylinder plate is composed of a plurality of parts (19a, 19b, 19c, 19d), which are formed in the form of rectangles having the same length and the same width.

[0259] Subject III.9. An apparatus for connecting a device to a substrate, having

[0260] A chamber which can be divided into at least two parts, wherein

[0261] A stamp (11, 111) is provided at the first component (1), and

[0262] A counter-imprint (31) is provided on the second component (3), wherein

[0263] The first component (1) can be brought into contact with the second component (3) to close the chamber, wherein

[0264] In the open state of the chamber, the counter-impression (31) can be loaded with initial material, and

[0265] In the closed state of the chamber, pressure can be applied via the stamp (11) to the starting material arranged between the stamp (11, 111) and the counter-stamp (31), wherein

[0266] A cylinder plate according to any one of the topics III.1 to III.8 is provided at the first component, said cylinder plate being attached at the first component (1) by means of pins (20a, 20b, 20c, 20d).

[0267] Subject III.10. An apparatus according to subject III.9, wherein

[0268] The stamp (11, 111) is guided in a stamp plate (15) which has holes (155a, 155b, 155c, 155d) in its edge region in which pins (1519a, 1519b, 1519c, 1519d) are accommodated for attaching the stamp plate (15) to a cylinder plate (19) with play.

[0269] Subject III.11. An apparatus according to subject III.10, wherein

[0270] The holes (155a, 155b, 155c, 155d) are designed as elongated holes, the center axes of which intersect in the zero point of the printing plate.

[0271] Subject III.12. An apparatus according to subject III.11, wherein

[0272] The cylinder plate (19) is divided into a plurality of parts (19a, 19b, 19c, 19d), and the printing plate (15) is virtually divided according to the parts (19a, 19b, 19c, 19d) of the cylinder plate, wherein each virtual part of the printing plate (15) has a plurality of holes (155a, 155a', 155a", 155b, 155b', 155b", 155c, 155c', 155c", 155d, 155d', 155d") in its edge area.

[0273] Subject III.13. An apparatus according to subject III.12, wherein

[0274] A plurality of holes (155a, 155a', 155a", 155b, 155b', 155b", 155c, 155c', 155c", 155d, 155d', 155d") are configured as elongated holes, and the center axes of the elongated holes of each virtual component intersect at the printing plate zero point (B1, B2, B3, B4).

[0275] Subject III.14. An apparatus according to any one of Subjects III.9 to III.13, wherein

[0276] The counter-stamp (31) has holes (315a, 315b, 315c, 315d) in its edge region, in which pins (3115a, 3115b, 3115c, 3115d) are accommodated with play and serve to guide the counter-stamp (31) on the stamp plate (15).

[0277] Theme III.15. A device according to theme III.14, wherein the holes (315a, 315b, 315c, 315d) of the counter-stamp are designed as elongated holes, the center axes of which intersect in the counter-stamp zero point (C).

Claims

1. A device for connecting a device to a substrate, the device having A chamber that can be divided into at least two parts, wherein A stamp (11, 111) is provided at the first component (1), and A counter-stamp (31) is provided at the second component (3), and A heating device (33) is provided on the side of the counter-stamp (31) facing away from the first component (1), wherein The first part (1) is displaceable in the direction of the second part (3) in order to close the chamber, wherein In the open state of the chamber, the counter-impression (31) can be loaded with initial material, and In the closed state of the chamber, pressure can be applied to the starting material arranged between the stamp (11, 111) and the counter-stamp (31) via the stamp (11, 111), wherein In an unloaded state, the counter-stamp (31) is spaced apart from the heating device (33) and is arranged in contact with the heating device (33) due to the pressure exerted by the stamp (11, 111).

2. The device according to claim 1, wherein The heating device (33) is designed in the form of a heating plate, whose surface facing the counter-mold (31) is arranged in flat contact with the surface of the counter-mold facing away from the first component (1).

3. The device according to claim 1 or 2, wherein The counter-stamp (31) is spaced apart from the heating device by means of a prestressing element, the prestressing of which is overcome due to the pressure applied by the stamp (11, 111) and the prestressing is reestablished by the stamp (11, 111) after the application of pressure has ended.

4. The device according to any one of claims 1 to 3, wherein In the unloaded state, the counter-die (31) is spaced apart from the heating device (33) by means of a spring (32).

5. The device according to any one of claims 1 to 4, wherein The counter-stamp (31) is spaced apart from the heating device (33) in the unloaded state by means of an air cushion, wherein air is supplied to the air cushion via air channels (34, 36) which are at least partially guided through the heating device.

6. An apparatus for connecting a device to a substrate, comprising: A chamber that can be divided into at least two parts, wherein A stamp (11, 111) is provided at the first component (1), and A matching stamp (31) is provided on the second component (3). in The first part (1) is displaceable in the direction of the second part (3) in order to close the chamber, wherein In the open state of the chamber, the counter-impression (31) can be loaded with initial material, and In the closed state of the chamber, pressure can be applied to the starting material arranged between the stamp (11, 111) and the counter-stamp (31) via the stamp (11, 111), wherein The shaft (111) of the die (11, 111) is received in a die guide plate (15) provided at the first component (1) by means of an interference fit, and The pressure body (11) of the stamp (11, 111) has a larger cross-sectional area than the axis (11) of the stamp (11, 111), wherein A negative pressure device (119) is provided at a side of the stamp guide plate (15) facing away from the counter-stamp (31).

7. The device according to claim 6, wherein: A cylinder plate (19) is provided on the side of the die guide plate (15) facing away from the mating die (31), the cylinder plate having a piston (117) capable of reciprocating in a cylinder bore, the piston having a guide rod (113) on the side pointing toward the die (11, 111), the guide rod being configured to abut against the end face of the shaft (111) and apply pressure to the die (11, 111) when pressure is applied to the piston (117).

8. The device according to claim 7, wherein The end surface of the shaft (111) of the stamp (11, 111) is flat, and The tip of the guide rod (113) which comes into contact with the end face of the shaft (111) is rounded.

9. An apparatus according to any one of claims 6 to 8, wherein the negative pressure device (119) is an intermediate control chamber formed between the mold guide plate (15) and a cylinder plate (19) arranged on the side of the mold guide plate (15) facing away from the matching mold (31), and the intermediate control chamber is capable of being loaded with negative pressure or positive pressure.

10. Apparatus according to any one of claims 7 to 9, wherein in the retracted position of the piston (117) and the stamp (11, 111), there is a spacing between the tip of the guide rod (113) and the end face of the shaft (111) of the stamp (11, 111).

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