Chip soft solder loading mechanism

Abstract

The invention discloses a chip soft solder loading mechanism, belongs to the technical field of semiconductor chip processing, and discloses a chip soft solder loading mechanism which comprises a first conveying assembly for conveying soft solder raw materials and a second conveying assembly for conveying chips, and a processing assembly is arranged in the center of the first conveying assembly and the center of the second conveying assembly. The processing assembly is arranged in a rotating mode, the raw materials on the first conveying assembly are picked up and then moved to the chips on the second conveying assembly to conduct packaging processing on the chips, and the cleaning assembly is arranged on the processing assembly. Two chips can be packaged at the same time, assembly line operation is formed, the working efficiency is high, the packaging head is cleaned, and it is avoided that the quality of follow-up machining is affected by adhesion and residue of soft solder.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip processing, and in particular to a chip soft solder loading mechanism. Background Art

[0002] The soft solder chip mounter is a packaging device with a high degree of automation, which is mainly used to automatically apply soft solder (such as solder paste, silver glue, etc.) on the surface of electronic components to improve the welding quality and production efficiency of components.

[0003] When packaging chips, a soft solder die mounter is usually required.

[0004] For this purpose, for example, a Chinese patent, application announcement number CN220651960U, discloses a soft solder loading machine for electronic chips, including a support base, and a mounting frame is connected to the upper side of the support base, a plurality of electric drive rollers are installed inside the mounting frame, and a transmission belt is commonly sleeved on the outer sides of the plurality of electric drive rollers, and the soft solder loading machine for electronic chips also includes: a plurality of supporting side rods, all connected to the upper side of the support base. The utility model can automatically and orderly place a plurality of soft solders on a plurality of electronic chips transmitted on the transmission belt by setting a material storage box, an electric telescopic rod, a material pusher, a support plate, a limiting groove, a positioning groove, a telescopic cylinder, a pneumatic suction nozzle, a driving motor, a transmission screw, a sliding block and a bearing seat, and the degree of automation is high, thereby greatly improving the loading efficiency of the soft solder loading machine for electronic chips.

[0005] But it has the following problems:

[0006] (1) Only one chip can be packaged at a time, resulting in low work efficiency.

[0007] (2) Soft solder will remain on the surface of the pneumatic nozzle after long-term use. If it is not cleaned in time, it will cause quality problems in the subsequent chip packaging processing. Summary of the invention

[0008] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide a chip soft solder loading mechanism that can package two chips at the same time, forming a streamlined operation with high work efficiency, and cleaning the packaging head to avoid soft solder adhesion residue affecting the quality of subsequent processing.

[0009] In order to solve the above technical problems, the present invention adopts the following technical solution: The present invention provides a chip soft solder loading mechanism, comprising:

[0010] Conveying component 1, for conveying soft solder raw materials;

[0011] Conveying component 2, conveying the chip;

[0012] The processing component is arranged at the center of the conveying component 1 and the conveying component 2. The processing component is arranged in a rotating manner, picks up the raw materials on the conveying component 1 and then moves them to the chip on the conveying component 2 to package the chip;

[0013] A cleaning component is arranged on the processing component and is located on a path moving from the conveying component 2 to the conveying component 1, and cleans the processing part of the processing component;

[0014] Wherein, the conveying component 1 and the conveying component 2 are arranged vertically, and the conveying component 1 and the conveying component 2 are each arranged in two groups.

[0015] Preferably, each group of the conveying assembly 1 and the conveying assembly 2 comprises a bracket and a conveying belt arranged on the bracket, and the conveying belt is driven by a powered conveying roller to convey the material.

[0016] Preferably, the conveying component 1 further comprises a plurality of carrier plates arranged at equal intervals on the surface of the conveying belt, and the carrier plates are used to place the soft solder to be taken.

[0017] Preferably, the second conveying component further comprises a plurality of chip fixing plates arranged at equal intervals on the surface of the conveying belt, and the chips are mounted on the chip fixing plates.

[0018] Preferably, the processing assembly comprises:

[0019] Processing table;

[0020] Four processing parts, all of which are equally spaced;

[0021] A rotating frame is arranged at the upper end of the processing table, and the rotating frame drives the four processing parts to rotate;

[0022] Wherein, a servo motor capable of driving the rotating frame to rotate is arranged on the processing table, and the rotating frame is flexibly connected to the output end of the servo motor through a fixing component.

[0023] Preferably, the fixing assembly comprises:

[0024] A bearing, wherein the bearing is arranged between the rotating frame and the output shaft of the servo motor;

[0025] The special-shaped connector is fixedly mounted on the output shaft of the servo motor and is coaxially arranged with the output shaft of the servo motor;

[0026] Positioning holes, a plurality of the positioning holes are arranged, and the plurality of positioning holes are evenly arranged on the upper side of the rotating frame around the bearing;

[0027] A fixing fastener is fixedly mounted on the special-shaped connector by means of screws, and the fixing fastener fixes the rotating special-shaped connector and the rotating frame together;

[0028] Wherein, a positioning rod matching the positioning hole is arranged on the fixing fastener, and a groove matching the special-shaped connector is arranged at the bottom center of the fixing fastener.

[0029] Preferably, the processing section comprises a telescopic assembly arranged on a rotating frame, and a processing head capable of collecting soft solder and pressing it onto the chip is arranged at the telescopic end of the telescopic assembly.

[0030] Preferably, the cleaning component comprises:

[0031] Two cleaning boxes, the two cleaning boxes are symmetrically arranged on the processing table and located on both sides of the servo motor;

[0032] A clearance track is arranged on the cleaning box for the processing head to pass through;

[0033] Wherein, cleaning mechanisms are arranged on both sides of the yield track, and a collecting mechanism for recovering waste residue is also arranged in the cleaning box.

[0034] Preferably, the cleaning mechanism comprises a plurality of brush rollers arranged on both sides of the yield track and a driving mechanism for driving all the brush rollers to rotate.

[0035] Preferably, the collection mechanism includes a fan group arranged on the cleaning box and located on either side of the give way track and a collection chamber arranged on the other side of the give way track, the fan group is composed of a plurality of fans, each of the fans is arranged at intervals between the brush rollers, and a collection port connected to the collection chamber is arranged on the side of the give way track opposite to the fan.

[0036] The beneficial effects of the present invention are:

[0037] The present invention arranges two groups of conveying components one and two, and each conveying component one and two are arranged vertically, so that the two groups of conveying components one and two surround a square, and chip processing is performed by a processing component that is arranged at the center of the square and can rotate, four processing heads are arranged on the processing component, the conveying component one conveys soft solder, and the conveying component two conveys chips, and the four processing heads repeatedly take materials and process chips, thereby realizing simultaneous processing of two chips, and the whole process of automatic loading and reciprocating processing is performed, thereby improving processing efficiency.

[0038] The present invention arranges a cleaning component on the path where the processing head moves from the conveying component 2 to the conveying component 1, so as to clean the processing head after processing the chip, keep it clean and prepare to pick up soft solder to process the next chip, thereby improving the quality of chip processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 A schematic diagram of a chip soft solder loading mechanism provided in an embodiment of the present invention Figure 1 .

[0041] Figure 2 A schematic diagram of a chip soft solder loading mechanism provided in an embodiment of the present invention Figure 2 .

[0042] Figure 3 A structural schematic diagram (exploded diagram) of a chip soft solder loading mechanism fixing assembly provided in an embodiment of the present invention.

[0043] Figure 4 for Figure 2 Enlarged view of point A in .

[0044] Figure 5 A schematic structural diagram of a process flow of driver parts in chip electroplating provided by an embodiment of the present invention.

[0045] Description of reference numerals:

[0046] 1- conveying component one, 101- loading plate, 2- conveying component two, 201- chip fixing plate, 3- bracket, 4- conveyor belt, 5- processing table, 6- rotating frame, 7- servo motor, 8- bearing, 9- special-shaped connector, 10- positioning hole, 11- fixing fastener, 1101- positioning rod, 1102- groove, 12- telescopic component, 13- processing head, 14- cleaning box, 15- yield track, 16- brush roller, 17- fan unit, 18- collection port. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] Embodiment 1:

[0049] like Figures 1 to 5As shown, the present invention provides a chip soft solder loading mechanism, comprising a conveying component 1 for conveying soft solder raw materials and a conveying component 2 for conveying chips, a processing component is arranged at the center of the conveying component 1 and the conveying component 2, and the processing component is arranged in a rotating manner, and the raw materials on the conveying component 1 are picked up and then moved to the chip on the conveying component 2 to package the chip;

[0050] Among them, the conveying component 1 and the conveying component 2 are arranged vertically and the conveying component 1 and the conveying component 2 are arranged in two groups, so the two conveying components 1 are arranged in parallel, and the two conveying components 2 are arranged in parallel, so as to facilitate the loading of raw materials from the same side or the loading and unloading of chips from the same side, and facilitate the processing operation.

[0051] Specifically, each group of conveying assembly 1 and conveying assembly 2 2 includes a bracket 3 and a conveyor belt 4 arranged on the bracket 3. The conveyor belt 4 is driven by a powered conveying roller to convey materials. The powered conveying roller is a conveying roller driven to rotate by a motor. Each conveyor belt 4 requires at least two conveying rollers to drive the transmission. This is a prior art and will not be described in detail here.

[0052] Among them, the conveying component 1 also includes a number of carrier plates 101 arranged at equal intervals on the surface of the conveyor belt 4, and the conveying component 2 also includes a number of chip fixing plates 201 arranged at equal intervals on the surface of the conveyor belt 4. The carrier plate 101 is used to place the soft solder to be taken, and the chip is installed on the chip fixing plate 201. The processing component rotates for processing, picks up the raw material from the carrier plate 101 on the conveying component 1 and then rotates and moves to the chip fixing plate 201 on the conveying component 22, and places and processes the soft solder on the chip placed on the chip fixing plate 201. Two processing lines can be processed at the same time, thereby improving production efficiency.

[0053] Embodiment 2:

[0054] On the basis of the first embodiment, in order to be able to perform assembly line processing during the rotation process, specifically, the processing assembly includes a processing table 5, a rotating frame 6 arranged on the upper end of the processing table 5, and four processing parts distributed on the rotating frame 6 at equal intervals. The rotating frame 6 drives the four processing parts to rotate. When the corresponding two processing parts of the four processing parts are located above the two conveying components 1, the remaining two processing parts are also located above the conveying component 2;

[0055] Among them, a servo motor 7 capable of driving the rotating frame 6 to rotate is arranged on the processing table 5. The servo motor 7 controls the rotating frame 6 to rotate 90 degrees each time. The rotating frame 6 and the output end of the servo motor 7 are movably connected through a fixed component. The drive of the servo motor 7 and the conveying component 1 and the conveying component 2 2 needs to be regulated to achieve that when the four processing parts rotate, when the two processing parts located on the same straight line are located at the carrier plate 101 to pick up raw materials, the remaining two processing parts are also located at the chip fixing plate 201, and soft solder is placed and processed on the chip placed on the chip fixing plate 201. Specifically, the operation can be programmed and controlled by arranging an editable logic controller.

[0056] Specifically, the fixing assembly includes a bearing 8 arranged between the rotating frame 6 and the output shaft of the servo motor 7, a special-shaped connector 9 fixedly mounted on the output shaft of the servo motor 7, a plurality of positioning holes 10 uniformly arranged on the upper side of the rotating frame 6 around the bearing 8, and a fixing fastener 11 fixedly mounted on the special-shaped connector 9 by screws, the special-shaped connector 9 is coaxially arranged with the output shaft of the servo motor 7, and the fixing fastener 11 fixes the rotating special-shaped connector 9 and the rotating frame 6 together;

[0057] Among them, a positioning rod 1101 matching the positioning hole 10 is arranged on the fixing fastener 11, and a groove 1102 matching the special-shaped connector 9 is arranged at the bottom center of the fixing fastener 11. The groove 1102 is aligned with the special-shaped connector 9, the positioning rod 1101 is aligned with the positioning hole 10, and then the fixing fastener 11 is fixed with screws, so that the rotating frame 6 and the special-shaped connector 9 are fixed together, and the servo motor 7 can drive the rotating frame 6 to rotate when started.

[0058] Specifically, the processing part includes a telescopic component 12 arranged on the rotating frame 6. The telescopic end of the telescopic component 12 is arranged with a processing head 13 that can collect soft solder and press it on the chip. The processing head 13 is a prior art and is a processing execution component for chip processing. The relevant components can be directly purchased and will not be introduced in detail here. The telescopic component 12 selects an electric telescopic rod to control the processing head 13 to move up and down to pick up materials and process.

[0059] Embodiment three:

[0060] On the basis of the second embodiment, in order to clean the surface of the processing component to improve the processing quality, a cleaning component is arranged on the processing component. Specifically, the cleaning component is located on the path moving from the conveying component 2 to the conveying component 1 to clean the processing part of the processing component.

[0061] Specifically, the cleaning assembly includes two cleaning boxes 14, which are symmetrically arranged on the processing table 5 and located on both sides of the servo motor 7. The cleaning boxes 14 are each provided with a clearance track 15 for the processing head 13 to pass through. When the processing head 13 leaves the chip fixing plate 201 and moves to the carrier plate 101, it needs to pass through the cleaning box, so as to clean the processing head and keep it clean so as to pick up the soft solder to process the next chip;

[0062] Among them, cleaning brush mechanisms are arranged on both sides of the yield track 15, and a collection mechanism for recovering waste residues is also arranged in the cleaning box 14. Specifically, the cleaning brush mechanism includes a plurality of brush rollers 16 arranged on both sides of the yield track 15 and a driving mechanism for driving all the brush rollers 16 to rotate.

[0063] Specifically, the collecting mechanism includes a fan group 17 arranged on the cleaning box 14 and located on either side of the give way track 15, and a collecting chamber arranged on the other side of the give way track 15. The fan group 17 is composed of a plurality of fans, each of which is arranged at intervals between the brush rollers 16. A collecting port 18 communicating with the collecting chamber is arranged on the side of the give way track opposite to the fan.

[0064] Working principle:

[0065] When in use, a robot or manpower is used at one end of the two conveying components 1 to place the soft solder on the carrier plate 101, and a robot or manpower is used at one end of the two conveying components 2 to place the chip on the chip fixing plate 201. The conveying components 1 and 2 are used to convey the carrier plate 101 and the chip fixing plate 201 to the bottom of the processing head 13, and then the telescopic component 12 is used to control the processing head 13 to move downward to pick up the soft solder, and then the processing head 13 is controlled to rise, and the servo motor 7 is used to drive the rotating frame 6 to rotate, and the processing head 13 that picks up the soft solder is rotated to the chip fixing plate 2 01, and then the telescopic component 12 is used to control the processing head 13 with soft solder to move downward to process the chip, while the processing head without soft solder is now directly above the carrier plate 101, and the soft solder is picked up under the control of the telescopic component 12, and then the rotating frame 6 continues to rotate under the drive of the servo motor 7, and the processing head 13 that has just left the chip fixing plate 201 moves toward the next carrier plate 101, passing through the cleaning box 14 on the way, and being brushed by the brush rollers 16 on both sides when passing through the yield track 15, and the impurities brushed off are blown into the collection chamber by the fan unit 17 through the collection port 18 for temporary retention.

[0066] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A chip soft solder loading mechanism, characterized in that: include: A conveying component 1 (1), for conveying the soft solder raw material; A conveying component 2 (2) for conveying the chip; A processing assembly is arranged at the center of the conveying assembly 1 (1) and the conveying assembly 2 (2), and the processing assembly is arranged to rotate, pick up the raw material on the conveying assembly 1 (1) and then move it to the chip on the conveying assembly 2 (2) to package the chip; A cleaning component is arranged on the processing component and is located on a path moving from the conveying component 2 (2) to the conveying component 1 (1), and cleans the processing part of the processing component; Wherein, the conveying component 1 and the conveying component 2 are arranged vertically, and the conveying component 1 and the conveying component 2 are each arranged in two groups.

2. A chip soft solder loading mechanism as claimed in claim 1, characterized in that: Each group of the conveying assembly one (1) and the conveying assembly two (2) comprises a support (3) and a conveying belt (4) arranged on the support (3); the conveying belt (4) is driven by a powered conveying roller to convey materials.

3. A chip soft solder loading mechanism as claimed in claim 2, characterized in that: The conveying component 1 (1) further comprises a plurality of carrier plates (101) arranged at equal intervals on the surface of the conveying belt (4), wherein the carrier plates (101) are used to place the soft solder to be taken.

4. A chip soft solder loading mechanism as claimed in claim 2, characterized in that: The conveying component 2 (2) further comprises a plurality of chip fixing plates (201) arranged at equal intervals on the surface of the conveying belt (4), and the chips are mounted on the chip fixing plates (201).

5. A chip soft solder loading mechanism as claimed in claim 1, characterized in that: The processing assembly comprises: Processing table (5); Four processing parts, all of which are equally spaced; A rotating frame (6) is arranged at the upper end of the processing table (5), and the rotating frame (6) drives the four processing parts to rotate; Wherein, a servo motor (7) capable of driving the rotating frame (6) to rotate is arranged on the processing table (5), and the rotating frame (6) and the output end of the servo motor (7) are detachably connected via a fixing assembly.

6. A chip soft solder loading mechanism as claimed in claim 5, characterized in that: The fixing assembly comprises: A bearing (8), wherein the bearing (8) is arranged between the rotating frame (6) and the output shaft of the servo motor (7); A special-shaped connector (9) is fixedly mounted on the output shaft of the servo motor (7) and is coaxially arranged with the output shaft of the servo motor (7); A positioning hole (10), wherein a plurality of the positioning holes (10) are arranged, and the plurality of positioning holes (10) are evenly arranged around the bearing (8) on the upper side of the rotating frame (6); A fixing fastener (11) is fixedly mounted on the special-shaped connector (9) by means of screws, wherein the fixing fastener (11) fixes the rotating special-shaped connector (9) and the rotating frame (6) together; Wherein, a positioning rod (1101) matching the positioning hole (10) is arranged on the fixing fastener (11), and a groove (1102) matching the special-shaped connector (9) is arranged at the bottom center of the fixing fastener (11).

7. A chip soft solder loading mechanism as claimed in claim 6, characterized in that: The processing section comprises a telescopic assembly (12) arranged on a rotating frame (6), and a processing head (13) capable of collecting soft solder and pressing it onto a chip is arranged at the telescopic end of the telescopic assembly (12).

8. A chip soft solder loading mechanism as claimed in claim 7, characterized in that: The cleaning component comprises: Two cleaning boxes (14), the two cleaning boxes (14) are symmetrically arranged on the processing table (5) and located on both sides of the servo motor (7); A clearance track (15) is arranged on the cleaning box (14) for the processing head (13) to pass through; Wherein, cleaning mechanisms are arranged on both sides of the yield track (15), and a collecting mechanism for recovering waste residue is also arranged in the cleaning box (14).

9. A chip soft solder loading mechanism as claimed in claim 8, characterized in that: The brush cleaning mechanism comprises a plurality of brush rollers (16) arranged on both sides of a yield track (15) and a driving mechanism for driving all the brush rollers (16) to rotate.

10. A chip soft solder loading mechanism as claimed in claim 9, characterized in that: The collecting mechanism comprises a fan unit (17) arranged on a cleaning box (14) and located on either side of a yield track (15) and a collecting chamber (15) arranged on the other side of the yield track (15), wherein the fan unit (17) is composed of a plurality of fans, each of which is arranged at intervals between brush rollers (16), and a collecting port (18) communicating with the collecting chamber is arranged on the side of the yield track opposite to the fan.

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