Semiconductor processing apparatus and semiconductor processing method

Abstract

The invention discloses semiconductor processing equipment and a semiconductor processing method, and the semiconductor processing equipment comprises a conveying device which is used for conveying a carrying wafer in a translation manner, and the carrying wafer comprises a negative plate and a semiconductor wafer; the edge blank removing device comprises a lifting mechanism and a suction mechanism, the suction mechanism comprises a plurality of suction pieces, the suction pieces are arranged in the circumferential direction of the semiconductor wafer, and the suction pieces are used for sucking edge blanks of the semiconductor wafer; an air drying device; the defective product removing device comprises a magnetic attraction mechanism and a collecting part, the magnetic attraction mechanism is located above the carrying wafer and used for attracting defective chips, the collecting part is located below the magnetic attraction mechanism and the carrying wafer, and after the carrying wafer is moved away, the defective chips fall to the collecting part. According to the semiconductor processing equipment and the semiconductor processing method, the efficiency of removing defective products can be improved, and meanwhile, the edge blank of the semiconductor wafer can be efficiently removed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production equipment, and in particular to a semiconductor processing equipment and a semiconductor processing method. Background Art

[0002] When producing chips, semiconductor wafers are produced first, and then the semiconductor wafers are cut into several rows and columns of chips. Next, the chips are tested and defective ones are marked.

[0003] For defective chips, usually, a person manually takes a straw and sucks out the defective chips by sucking them out.

[0004] However, the existing method of removing defective products is inefficient and labor-intensive, and is also unable to efficiently remove the edge blanks of semiconductor wafers. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a semiconductor processing device that can improve the efficiency of removing defective products and effectively remove the edge blanks of semiconductor wafers.

[0006] The present invention also provides a semiconductor processing method applied to the above semiconductor processing equipment.

[0007] A semiconductor processing device according to the present invention comprises: a conveying device for conveying a carrier wafer in a translational manner, the carrier wafer comprising a base film and a semiconductor wafer, alcohol is arranged on the top of the base film, the semiconductor wafer is placed on the base film, and the defective chips of the semiconductor wafer are marked with magnetic ink; an edge blank rejection device comprises a lifting mechanism and a suction mechanism, the lifting mechanism is used to lift the carrier wafer from the conveying device to the suction mechanism, the suction mechanism comprises a plurality of suction members, the plurality of suction members are arranged along the circumference of the semiconductor wafer, the suction members are used to suck the edge blanks of the semiconductor wafer, and wait for the edge blanks to be rejected. After the absorption is completed, the lifting mechanism is used to put the carrier wafer back to the conveying device; the air-drying device, located downstream of the edge blank rejection device, is used to remove alcohol and static electricity between the semiconductor wafer and the film; the defective product rejection device, located downstream of the air-drying device, includes a magnetic suction mechanism and a collecting piece, the magnetic suction mechanism is located above the carrier wafer, the magnetic suction mechanism is used to absorb defective chips to separate the defective chips from the carrier wafer, the collecting piece is located below the magnetic suction mechanism and the carrier wafer, after the carrier wafer is removed, the suction force of the magnetic suction mechanism weakens or disappears, and the defective chips fall to the collecting piece.

[0008] A semiconductor processing device according to an embodiment of the present invention has at least the following beneficial effects: The present invention can translate and transport the carrier wafer by setting a conveying device, so that the semiconductor wafer can automatically pass through the edge blank removal device, the air drying device and the defective product removal device in sequence, thereby realizing the full process automatic removal of the edge blanks and defective chips of the semiconductor wafer, with a high degree of automation and efficient production.

[0009] The present invention provides an edge blank removal device, which includes a lifting mechanism and a suction mechanism. Therefore, when the carrier wafer moves to the edge blank removal device, the lifting mechanism can lift the carrier wafer so that the semiconductor wafer is close to the suction mechanism, which can facilitate the suction mechanism to remove the edge blank of the semiconductor wafer, thereby simplifying the structure of the suction mechanism.

[0010] The lifting mechanism allows the carrier wafer to be separated from the conveying device, making it convenient to adjust the carrier wafer. For example, the carrier wafer can be rotated so that different positions of the edge blanks of the carrier wafer are close to the suction piece. As a result, all the edge blanks of the semiconductor wafer can be sucked to avoid omissions. At the same time, the number of suction pieces can be reduced, reducing manufacturing costs.

[0011] The present invention can remove alcohol and static electricity by arranging an air drying device, so that the chips of the semiconductor wafer can be easily separated from the bottom film, thereby facilitating the collection of defective chips from the bottom film and improving the efficiency of rejecting defective products, and also facilitating the separation of qualified chips from the bottom film and improving production efficiency.

[0012] The present invention provides a defective product rejection device, so that when the magnetic attraction mechanism is powered on, the magnetic ink mark on the defective chip can be used to absorb the defective chip, so that only qualified chips remain on the carrier wafer, meeting the need for rejecting defective products.

[0013] When the conveying device removes the carrier wafer, the power supply to the magnetic attraction mechanism is cut off or reduced, so that the magnetism of the magnetic attraction mechanism disappears or weakens, and the defective chips fall to the collection piece due to gravity. This is fast and efficient, and there is no need for manual absorption one by one, saving labor.

[0014] The present invention also provides a semiconductor processing method having the above-mentioned beneficial effects.

[0015] According to a semiconductor processing device of the present invention, the diameter of the semiconductor wafer is smaller than the diameter of the base film, and the portion of the base film not blocked by the semiconductor wafer is provided with marking points. According to the marking points, the semiconductor wafer is placed on the base film at a set angle and concentrically.

[0016] The present invention sets identification points so that the semiconductor wafer is placed on the film at a corresponding angle relative to the identification points. Therefore, before the edge blanks of the semiconductor wafer are absorbed, the vertical and horizontal arrangement directions of the chips on the semiconductor wafer can be determined by the identification points, thereby reducing the difficulty of identification and reducing the manufacturing cost. For example, the imaging device for identifying the vertical and horizontal arrangement directions is omitted, and then the position of the edge blank to be removed is determined, so as to more efficiently remove the edge blanks of the semiconductor wafer.

[0017] According to a semiconductor processing equipment of the present invention, the conveying device includes multiple conveying units, the multiple conveying units include a first conveying unit, and the first conveying unit corresponds to the edge blank removal device; the first conveying unit includes two side-by-side conveying belts, two positioning columns and two limit plates; the two limit plates are located on the side away from the two conveying belts, and the two limit plates are used to limit the carrier wafer on the two conveying belts; the space between the two conveying belts allows the lifting mechanism to lift the carrier wafer; the two positioning columns can be located on one side of the lifting mechanism along the conveying direction of the carrier wafer, and the two positioning columns are used to abut the edge blank of the film to locate the center of the carrier wafer and prevent the carrier wafer from moving.

[0018] The present invention sets up a plurality of conveying units, thereby the conveying device can be split into multiple sections. Furthermore, the number of conveying units can be reasonably arranged according to the production capacity matching situation to meet the production needs. At the same time, corresponding adjustments can be made according to the actual conditions of the edge blank rejection device, the air drying device and the defective product rejection device to meet the working needs of each part.

[0019] The present invention arranges the first conveying unit so that the first conveying unit includes two conveying belts arranged side by side. Therefore, the two conveying belts can support the object-carrying wafer to meet the conveying requirements.

[0020] The present invention can limit the position of the carrier wafer on the two conveyor belts by arranging two limiting plates, so as to prevent one side of the carrier wafer from being separated from the conveyor belts and causing the carrier wafer to fall, thereby improving the reliability of transportation.

[0021] The present invention sets two positioning posts. Therefore, when the carrier wafer touches the two positioning posts, the carrier wafer is stationary. Since the two positioning posts touch the outer circle of the carrier wafer and the diameter of the outer circle of the carrier wafer remains unchanged, the center of the carrier wafer can be determined by geometric relationship. Furthermore, the center of the carrier wafer can be accurately located at the set position of the lifting mechanism, ensuring that the suction piece is directly opposite to the edge blank of the semiconductor wafer, thereby meeting the need to suction the edge blank of the semiconductor wafer.

[0022] At the same time, since the center of the carrier wafer is accurately located at the set position of the lifting mechanism, it is also convenient to perform rotation adjustment to reduce the deviation during the rotation process. Therefore, there is no need to increase the number of suction pieces or adjust the position of the suction pieces to remove the entire edge blank of the semiconductor wafer to avoid omissions.

[0023] According to a semiconductor processing equipment of the present invention, the edge blank removal device also includes an identifier for identifying identification points, the lifting mechanism includes a lifting frame, the lifting frame is provided with a rotating disk, the rotating disk is used to support the carrier wafer, when the lifting frame lifts the carrier wafer, according to the indication information of the identifier, the edge blank removal device controls the rotation of the rotating disk so that the suction piece sucks different positions of the semiconductor wafer.

[0024] The present invention can determine the vertical and horizontal arrangement information of the chips of the semiconductor wafer by setting an identifier through identifying identification points, so as to control the rotation of the rotating disk, and then complete the absorption of the edge blank of the semiconductor wafer. At the same time, the number of suction parts and the rotation angle of the rotating disk are comprehensively reduced, which has the dual advantages of low equipment manufacturing cost and high absorption efficiency.

[0025] According to a semiconductor processing device of the present invention, the lifting mechanism includes two fixed plates standing side by side, a power component for driving the lifting frame to rise and fall is arranged between the two fixed plates, guide columns and guide holes for accommodating the guide columns are arranged between the fixed plates and the lifting frame, and the guide columns and the guide holes cooperate to form a lifting track.

[0026] The present invention provides two fixing plates, and guide posts and guide holes can be provided at the edge of the lifting frame to guide the lifting of the lifting frame, thereby improving the lifting accuracy and stability and reducing the deflection.

[0027] At the same time, space is reserved between the two fixed plates to facilitate the arrangement of the power that drives the lifting frame to rise and fall. At the same time, the power can be easily located at the geometric center or center of gravity of the lifting frame to achieve stable and smooth lifting, avoid the combined force of power and gravity to generate torque, and reduce jamming and eccentric wear.

[0028] According to a semiconductor processing device of the present invention, the number of suction members is four, and the four suction members are evenly distributed along the circumference of the semiconductor wafer. The suction mechanism includes a mounting frame, and the suction members are arranged on the top of the mounting frame. The mounting frame is provided with an opening that passes through the top and the bottom. The suction members are arranged along the edge blank of the opening, and the suction members absorb the edge blank of the semiconductor wafer after passing through the opening.

[0029] The present invention provides four suction pieces, so that the edge blanks in four directions of the semiconductor chips arranged vertically and horizontally can be sucked, which not only meets the suction needs, but also sets the number of suction pieces within a suitable range, reduces the occupied space, and facilitates the arrangement. At the same time, it is helpful to reduce the rotation range of the rotating disk. For example, the need for suction of a full circle can be completed by rotating the rotating disk 90 degrees.

[0030] According to a semiconductor processing device of the present invention, the suction piece includes a suction nozzle and a three-axis adjustment seat for mounting the suction nozzle, and the three-axis adjustment seat can perform Z-axis displacement adjustment, X-axis displacement adjustment and Y-axis displacement adjustment on the suction nozzle.

[0031] The present invention also realizes multi-directional adjustment of the position of the suction piece by setting a three-axis adjustment seat. It can be reasonably adjusted according to the installation situation of the equipment and the specifications of the semiconductor wafer to meet the use needs, and has good adaptability and wide versatility.

[0032] According to a semiconductor processing equipment of the present invention, the air drying device includes a first air blowing mechanism and a second air blowing mechanism, the first air blowing mechanism and the second air blowing mechanism allow the conveying device to convey the carrier wafer, and the first air blowing mechanism and the second air blowing mechanism can swing up and down to adjust the blowing direction.

[0033] The present invention can relatively dry the carrier wafer by arranging the first blowing mechanism and the second blowing mechanism, reduce the adhesion of the bottom film to the semiconductor wafer, and make it easy to separate the qualified chips and the bad chips of the semiconductor wafer from the bottom film for screening and collection.

[0034] At the same time, by providing the first air blowing mechanism and the second air blowing mechanism, the distance from each chip to the air blowing mechanism can be more balanced, so that each chip can be evenly air-dried, which is beneficial to shorten the air-drying time and improve efficiency.

[0035] A semiconductor processing method according to the present invention is applied to any semiconductor processing equipment, and the processing method comprises: The steps of manufacturing the carrier wafer include testing the chips of the semiconductor wafer, marking the bad chips with magnetic ink, spraying alcohol on the film, and placing the semiconductor wafer marked with magnetic ink on the film; In the step of sucking the edge blank, the carrier wafer is placed at the loading position of the conveying device, the conveying device moves the carrier wafer to the position directly below the sucking mechanism of the edge blank removal device, the lifting mechanism lifts the carrier wafer to the sucking mechanism, the sucking piece sucks the edge blank of the semiconductor wafer, and after the edge blank is sucked, the lifting mechanism puts the carrier wafer back to the conveying device; In the air-drying step, the conveying device moves the carrier wafer to the air-drying device, and the air-drying device blows air to the carrier wafer to remove alcohol and static electricity between the semiconductor wafer and the substrate; In the defective product rejection step, the conveying device conveys the carrier wafer to the bottom of the magnetic suction mechanism, and the magnetic suction mechanism is energized. The magnetic suction mechanism magnetically absorbs the defective chips marked with magnetic ink, so that the defective chips are separated from the carrier wafer. The conveying device continues to convey the carrier wafer to the unloading position, and then the magnetic suction mechanism is powered off or reduced, and the defective chips fall to the collection piece.

[0036] Advantageously, the present invention removes the blank edges of semiconductor wafers by first adsorbing the blank edges of semiconductor wafers, then air-drying, and finally performing magnetic adsorption, thereby eliminating defective chips and leaving qualified chips, thereby achieving full-process automatic sorting of semiconductor wafers, using very little manpower, and achieving high production efficiency.

[0037] According to a semiconductor processing method of the present invention, In the edge blank absorbing step, the conveying device moves the carrier wafer to the right below the absorbing mechanism of the edge blank rejecting device, including two limiting plates limiting the carrier wafer on two conveying belts, the two conveying belts conveying the carrier wafer, two positioning columns abutting the carrier wafer to make the carrier wafer stationary, and the center of the carrier wafer and the center of the rotating disk coincide with each other up and down; In the step of absorbing the edge blank, the suction member absorbs the edge blank of the semiconductor wafer, including rotating the rotating disk so that the identifier recognizes an identification point, then making the rotating disk stop, and the suction member absorbs a local edge blank of the semiconductor wafer, then, the suction member stops absorbing, and then, continues to rotate the rotating disk so that the identifier recognizes another identification point, and then, makes the rotating disk stop again, and the suction member absorbs another local edge blank of the semiconductor wafer.

[0038] The present invention uses a limiting plate, a conveying belt and a positioning column, which not only meets the conveying needs, but also facilitates the connection with the edge blank rejection device so as to position the carrier wafer.

[0039] The present invention sets a rotating disk and an identifier, thereby controlling the rotation of the rotating disk by identifying the marking point, so that different positions of the semiconductor wafer are within the suction range of the suction member, which can reduce the number of suction members and at the same time expand the suction range of the suction mechanism, completely removing the edge blanks of the semiconductor wafer to avoid omissions.

[0040] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 It is a schematic diagram of the structure of a semiconductor wafer; Figure 2A schematic diagram of the structure of a semiconductor processing device according to an embodiment of the present invention; Figure 3 for Figure 2 A schematic structural diagram of the first conveying unit of the conveying device; Figure 4 for Figure 2 Schematic diagram of the structure of the blank removal part of the middle edge; Figure 5 for Figure 4 Structural diagram of the lifting mechanism; Figure 6 for Figure 4 Schematic diagram of the structure of the suction mechanism; Figure 7 for Figure 2 Schematic diagram of the structure of the middle trunk; Figure 8 for Figure 7 A schematic diagram of the structure of the first air-drying mechanism; Fig. 9 for Figure 2 Schematic diagram of the structure of the defective product rejection part; Fig.10 A flowchart of a semiconductor processing method according to an embodiment of the present invention; Fig.11 For application Figure 2 A flowchart of a semiconductor processing method of a semiconductor processing device.

[0043] Reference numerals: 100 - negative film, 110 - semiconductor wafer, 120 - defective chip, 130 - edge blank rejection device, 140 - lifting mechanism, 150 - suction mechanism, 160 - suction member, 170 - edge blank, 180 - air drying device, 190 - defective product rejection device, 200 - magnetic suction mechanism, 210 - collecting member, 220 - marking point, 230 - first conveying unit, 240 - conveyor belt, 250 - positioning column, 260 - limit plate, 2 70 - identifier, 280 - lifting frame, 290 - rotating disk, 300 - fixing plate, 310 - guide column, 320 - mounting frame, 330 - opening, 340 - suction nozzle, 350 - three-axis adjustment seat, 360 - first blower mechanism, 370 - second blower mechanism, 380 - rack, 390 - mounting bracket, 400 - cross arm, 410 - mounting plate, 420 - blower fan, 430 - mounting assembly, 440 - center mounting hole, 450 - arc mounting hole. DETAILED DESCRIPTION

[0044] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0045] In the description of the present invention, it is necessary to understand that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0046] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of first and second, this is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation, connection and connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] A semiconductor processing device and a semiconductor processing method according to an embodiment of the present invention are described below with reference to the accompanying drawings.

[0049] Reference Figure 1 When producing chips, the semiconductor wafer 110 is first cut out and cut into multiple columns and rows vertically and horizontally to form multiple chips. Then, each chip is powered on for testing. For defective products, ink marks are applied to facilitate color distinction. Then, alcohol is used to adhere the semiconductor wafer 110 to a plastic film, and a straw is used to suck out the defective products marked with ink.

[0050] At the same time, since the semiconductor wafer 110 is circular and most chips are square, there are inevitably gaps at the edge of the semiconductor wafer 110. These edge gaps 170 cannot form chips and also need to be removed.

[0051] However, the production efficiency of the semiconductor wafer 110 is very high, and the workload of removing defective products and edge blanks 170 is large, requiring a large number of manpower, resulting in great labor pressure. At the same time, manual removal cannot guarantee the quality of removal.

[0052] In this regard, refer to Figure 1 The present invention aims to provide an embodiment of a semiconductor processing device, which can improve the efficiency of removing defective products and at the same time efficiently remove the edge blank 170 of the semiconductor wafer 110 to achieve efficient chip sorting.

[0053] In this embodiment, the semiconductor processing equipment includes a rack 380, which forms the installation base of each device to facilitate smooth connection of each process and reduce the height difference. At the same time, it is also convenient to carry out unified power supply and unified control, reasonably adjust the production rhythm, and improve production capacity.

[0054] In this embodiment, the semiconductor processing equipment includes a conveying device, an edge blank rejecting device 130 , an air drying device 180 and a defective product rejecting device 190 .

[0055] In some embodiments, rack 380 may be allocated to each device for ease of transportation and deployment.

[0056] Reference Figure 2 The rack 380 is provided with a conveying device, which is used for translating and conveying the carrier wafer, the carrier wafer includes a base film 100 and a semiconductor wafer 110, alcohol is provided on the top of the base film 100, the semiconductor wafer 110 is placed on the base film 100, and the defective chip 120 of the semiconductor wafer 110 is marked with magnetic ink.

[0057] In this embodiment, a conveying device is provided to convey the carrier wafer in a horizontal manner, so that the semiconductor wafer 110 can automatically pass through the edge blank removal device 130, the air drying device 180 and the defective product removal device 190 in sequence. Therefore, the edge blanks 170 and defective chips 120 of the semiconductor wafer 110 can be automatically removed in the entire process, with a high degree of automation and efficient production.

[0058] For the conveying device, the conveying device includes multiple conveying units, and the production capacity can be matched by increasing the number of conveying units. For example, according to the production capacity setting, multiple edge blank rejection devices 130, multiple air-drying devices 180 and multiple defective product rejection devices 190 are set up. Therefore, the number of conveying units is increased accordingly to meet the layout needs.

[0059] In some embodiments, a longer air-drying device 180 may be used. Using a longer air-drying device 180 has a similar effect to increasing the number of air-drying devices 180, which is determined based on actual needs.

[0060] In this embodiment, a plurality of conveying units are provided, so that the conveying device can be divided into multiple sections. Furthermore, the number of conveying units can be reasonably arranged according to the production capacity matching situation to meet the production needs. At the same time, corresponding adjustments can be made according to the actual conditions of the edge blank removal device 130, the air drying device 180 and the defective product removal device 190 to meet the working needs of each part.

[0061] Reference Figure 3 Among the multiple conveying units, the multiple conveying units include a first conveying unit 230 , and the first conveying unit 230 corresponds to the edge blank removing device 130 .

[0062] The first conveying unit 230 includes two parallel conveying belts 240 , two positioning posts 250 and two limiting plates 260 .

[0063] The two limiting plates 260 are located on the side away from the two conveyor belts 240, and the two limiting plates 260 are used to limit the carrier wafer on the two conveyor belts 240. The space between the two conveyor belts 240 allows the lifting mechanism 140 of the edge blank removal device 130 to lift the carrier wafer; and the two positioning posts 250 can be located on one side of the lifting mechanism 140 along the conveying direction of the carrier wafer, and the two positioning posts 250 are used to abut against the edge blank 170 of the film 100 to locate the center of the carrier wafer and prevent the carrier wafer from moving.

[0064] In this embodiment, the first conveying unit 230 is provided so that the first conveying unit 230 includes two parallel conveying belts 240 . Therefore, the two conveying belts 240 can support the carrier wafer to meet the conveying requirements.

[0065] In this embodiment, two limiting plates 260 are provided to limit the carrier wafer on the two conveyor belts 240 to prevent one side of the carrier wafer from being separated from the conveyor belts 240 and causing the carrier wafer to fall, thereby improving the reliability of transportation.

[0066] In this embodiment, two positioning posts 250 are provided. Therefore, when the carrier wafer touches the two positioning posts 250, the carrier wafer is stationary. Since the two positioning posts 250 touch the outer circle of the carrier wafer and the diameter of the outer circle of the carrier wafer remains unchanged, the center of the carrier wafer can be determined by the geometric relationship. Therefore, the center of the carrier wafer can be accurately located at the set position of the lifting mechanism 140, ensuring that the suction member 160 is directly opposite to the edge blank 170 of the semiconductor wafer 110, thereby meeting the need to suction the edge blank 170 of the semiconductor wafer 110.

[0067] At the same time, since the center of the carrier wafer is accurately located at the set position of the lifting mechanism 140, it is also convenient to perform rotation adjustment to reduce the deviation during the rotation process. Therefore, there is no need to increase the number of suction members 160 or adjust the position of the suction members 160 to remove the entire edge blank 170 of the semiconductor wafer 110 to avoid omissions.

[0068] In some embodiments, two positioning posts 250, two conveyor belts 240, and two limit plates 260 can be arranged symmetrically on the left and right sides of the conveying direction to improve the stability of conveying and the accuracy of positioning, ensuring that the carrier wafer touches the two positioning posts 250 at the same time and remains stationary, so as to accurately transfer the carrier wafer to the suction mechanism 150 for suctioning the edge blank 170 of the semiconductor wafer 110.

[0069] The two positioning posts 250 can be driven by a cylinder or a motor to achieve lifting, translation or swinging, which can meet the need of blocking the carrier wafer for positioning and can also be retracted without affecting the continued transportation of the carrier wafer.

[0070] In some embodiments, the two positioning posts 250 are used to achieve intermittent conveyance of the carrier wafers between the conveying units to prevent the carrier wafers from touching each other.

[0071] In this embodiment, the two positioning posts 250, the two conveyor belts 240 and the two limit plates 260 are mostly installed on the same bracket to reduce the installation of a complete set of application conveying units. However, this embodiment does not exclude the solution of installing the positioning posts 250 on the lifting mechanism 140 or the adsorption mechanism to meet other purposes, such as realizing power sharing. A short stroke of the lifting mechanism 140 enables the positioning posts 250 to block the carrier wafer or release the blockage, while another short stroke of the lifting mechanism 140 can drive the carrier wafer to rise and fall.

[0072] In some embodiments, the first conveying unit 230 may include a mounting bracket 390 , and the mounting bracket 390 is hollow, so that space may be reserved for arranging the lifting mechanism 140 .

[0073] In some embodiments, other conveying units may also have a mounting bracket 390 to facilitate the arrangement of other components, such as the collecting member 210 .

[0074] In some embodiments, the mounting bracket 390 may include four legs to facilitate mounting of the driving roller and the driven roller that drive the conveyor belt 240 while reducing obstruction.

[0075] In some embodiments, the tops of the two legs may be connected to the limiting plate 260 to simplify installation.

[0076] In some embodiments, a pair of legs can be connected to a cross arm 400, so that the conveyor belt 240 and the limit plate 260 protrude to the outside of the mounting bracket 390, so that different conveying units can be staggered, so that the carrier wafer can be smoothly moved from one conveying unit to another, reducing jamming and avoiding damage to the edges of the carrier wafer.

[0077] In some embodiments, other conveying units may have three or more conveyor belts 240 , and three or more conveyor belts 240 may be arranged side by side, thereby supporting the carrier wafer at multiple points and reducing the risk of bending of the carrier wafer.

[0078] In some embodiments, the conveying unit has a sensor for identifying the carrier wafers, usually a photoelectric sensor, to properly control the movement of the conveyor belt 240 to prevent the carrier wafers from touching each other.

[0079] In some embodiments, each conveying unit may be equipped with a motor, and the motor drives the conveyor belt 240 to move, so that the operation of each conveying unit is relatively independent, thereby reducing the mutual influence of each part.

[0080] In some embodiments, two or more conveying units may share one motor, thereby reducing the number of motors and lowering the manufacturing cost of the equipment.

[0081] Reference Figure 4 As for the edge blank removal device 130, the edge blank removal device 130 includes a lifting mechanism 140 and a suction mechanism 150. The lifting mechanism 140 is used to lift the carrier wafer from the conveying device to the suction mechanism 150. The suction mechanism 150 includes a plurality of suction members 160. The plurality of suction members 160 are arranged along the circumference of the semiconductor wafer 110. The suction members 160 are used to suck the edge blank 170 of the semiconductor wafer 110. After the suction is completed, the lifting mechanism 140 is used to put the carrier wafer back to the conveying device.

[0082] In this embodiment, an edge blank removal device 130 is provided, and the edge blank removal device 130 includes a lifting mechanism 140 and a suction mechanism 150. Therefore, when the carrier wafer moves to the edge blank removal device 130, the lifting mechanism 140 can lift the carrier wafer so that the semiconductor wafer 110 is close to the suction mechanism 150, which can facilitate the suction mechanism 150 to remove the edge blank 170 of the semiconductor wafer 110, thereby simplifying the structure of the suction mechanism 150.

[0083] The lifting mechanism 140 allows the carrier wafer to be separated from the conveying device, making it convenient to adjust the carrier wafer. For example, the carrier wafer can be rotated so that different positions of the edge blanks 170 of the carrier wafer are close to the suction piece 160. Then, all the edge blanks 170 of the semiconductor wafer 110 can be sucked to avoid omissions. At the same time, the number of suction pieces 160 can be reduced to reduce manufacturing costs.

[0084] In some embodiments, the diameter of the semiconductor wafer 110 can be made smaller than the diameter of the base film 100 , and a marking point 220 is provided on the portion of the base film 100 not blocked by the semiconductor wafer 110 . According to the marking point 220 , the semiconductor wafer 110 is placed on the base film 100 at a set angle and concentrically.

[0085] In this embodiment, the marking point 220 is set so that the semiconductor wafer 110 is placed on the film 100 at a corresponding angle relative to the marking point 220. Therefore, before the edge blank 170 of the semiconductor wafer 110 is absorbed, the vertical and horizontal arrangement directions of the chips on the semiconductor wafer 110 can be determined by the marking point 220, thereby reducing the difficulty of identification and reducing the manufacturing cost. For example, the imaging device for identifying the vertical and horizontal arrangement directions is omitted, and then the position of the edge blank 170 to be removed is determined, so as to more efficiently remove the edge blank 170 of the semiconductor wafer 110.

[0086] In some embodiments, the number of the marking points 220 can be eight to accommodate the arrangement of the chips, facilitate the alignment of the suction member 160 with the edge blank 170, and improve the accuracy of suction.

[0087] Since the semiconductor wafer 110 is cut into several rows and columns of chips, the edge blanks 170 are mainly distributed in four main areas and sub-areas between two main areas, that is, the edge blanks 170 are distributed in eight areas evenly distributed along the circumference of the semiconductor wafer 110. Therefore, setting eight identification points 220 can quickly identify the area to be removed, narrow the angle of rotation adjustment, and reduce the time of rotation adjustment, so as to quickly start removing the edge blanks 170.

[0088] In some embodiments, the edge blank removal device 130 may further include an identifier 270 for identifying the identification point 220, and the lifting mechanism 140 may include a lifting frame 280, and the lifting frame 280 may be provided with a rotating disk 290, and the rotating disk 290 may be used to support the carrier wafer. When the lifting frame 280 lifts the carrier wafer, the edge blank removal device 130 controls the rotating disk 290 to rotate according to the indication information of the identifier 270, so that the suction member 160 suctions different positions of the semiconductor wafer 110.

[0089] By setting up the identifier 270, this embodiment can determine the vertical and horizontal arrangement information of the chips of the semiconductor wafer 110 by identifying the identification point 220, so as to control the rotation of the rotating disk 290, and then complete the absorption of the edge blank 170 of the semiconductor wafer 110. At the same time, the number of suction parts 160 and the rotation angle of the rotating disk 290 are comprehensively reduced, which has the dual advantages of low equipment manufacturing cost and high absorption efficiency.

[0090] In some embodiments, the identifier 270 can be a light sensing identifier 270, an image identifier 270, etc., which can be selected according to actual needs.

[0091] Due to the view relationship, Figure 1 The appearance of the identifier 270 is not easy to show clearly, so Figure 3 The same type of identifier 270 is also shown in FIG. 1 for ease of understanding, but the functions of the two may be different.

[0092] Reference Figure 5 In some embodiments, the lifting mechanism 140 may include two fixed plates 300 erected side by side, a power component for driving the lifting frame 280 to move up and down is arranged between the two fixed plates 300, a guide column 310 and a guide hole for accommodating the guide column 310 are arranged between the fixed plates 300 and the lifting frame 280, and the guide column 310 and the guide hole cooperate to form a lifting track.

[0093] In this embodiment, two fixing plates 300 are provided to set guide posts 310 and guide holes at the edge blank 170 of the lifting frame 280 so as to guide the lifting of the lifting frame 280, improve the lifting accuracy and stability, and reduce the deflection.

[0094] At the same time, space is reserved between the two fixed plates 300 to facilitate the arrangement of the power that drives the lifting frame 280 to move up and down. At the same time, the power can easily be located at the geometric center or center of gravity of the lifting frame 280, thereby achieving stable and smooth lifting, avoiding the combined force of power and gravity to generate torque, and reducing jamming and eccentric wear.

[0095] At the same time, space is reserved between the two fixing plates 300 to facilitate the arrangement of the power for driving the rotating disk 290 to rotate, and the structure is compact and occupies little space.

[0096] In some embodiments, the lifting frame 280, the fixing plate 300 and the mounting plate 410 may be provided with waist holes to facilitate adjustment of the position of the lifting frame 280 and the position of the motor to meet the needs of position adjustment and tensioning the transmission belt. The mounting plate 410 is used to install the motor that drives the rotating disk 290 to rotate.

[0097] A guide column 310 and a guide hole for accommodating the guide column 310 are arranged between the fixed plate 300 and the lifting frame 280 . It can be understood that one of the fixed plate 300 and the lifting frame 280 is provided with the guide column 310 , and the other of the fixed plate 300 and the lifting frame 280 is provided with the guide hole.

[0098] In this embodiment, the fixing plate 300 is provided with guide holes, and the lifting frame 280 is provided with guide posts 310, so that the space inside the fixing plate 300 can be fully utilized. Meanwhile, the lifting frame 280 is provided with waist holes for installing the guide posts 310 for adjustment.

[0099] Reference Figure 6 In some embodiments, the number of the suction members 160 can be four, and the four suction members 160 are evenly distributed along the circumference of the semiconductor wafer 110. The suction mechanism 150 includes a mounting frame 320, and the suction member 160 is set on the top of the mounting frame 320. The mounting frame 320 is provided with an opening 330 that passes through the top and bottom. The suction member 160 is arranged along the edge blank 170 of the opening 330. After passing through the opening 330, the suction member 160 suctions the edge blank 170 of the semiconductor wafer 110.

[0100] In this embodiment, four suction members 160 are provided, so that the edge blanks 170 in four directions of the semiconductor chips arranged vertically and horizontally can be sucked, which not only meets the suction needs, but also sets the number of suction members 160 within a suitable range, reduces the occupied space, and facilitates the arrangement. At the same time, it is helpful to reduce the rotation range of the rotating disk 290. For example, the need for suction of a full circle can be completed by rotating the rotating disk 290 at most 90 degrees.

[0101] At the same time, there are eight identification points 220. Therefore, when the rotating disk 290 is rotated and the identifier 270 identifies an identification point, the rotating disk 290 is stationary, and the four suction members 160 can complete the suction of four areas. Then, the rotating disk 290 rotates 45 degrees to suction the other four areas. Two rotations can complete the suction of a semiconductor wafer 110, which takes a short time and has a high suction efficiency.

[0102] The suction member 160 is installed on the top of the mounting frame 320 , which reduces the shielding of human hands and is easy to install. At the same time, it is also convenient to adjust the position of the suction member 160 .

[0103] In some embodiments, the suction member 160 may include a suction nozzle 340 and a three-axis adjustment seat 350 for mounting the suction nozzle 340 . The three-axis adjustment seat 350 can adjust the suction nozzle 340 in the Z-axis, X-axis, and Y-axis directions.

[0104] This embodiment also realizes multi-directional adjustment of the position of the suction member 160 by setting a three-axis adjustment seat 350. It can be reasonably adjusted according to the installation conditions of the equipment and the specifications of the semiconductor wafer 110 to meet the needs of use, and has good adaptability and wide versatility.

[0105] For the structure for realizing Z-axis displacement adjustment, X-axis displacement adjustment and Y-axis displacement adjustment, a dovetail groove can be set to realize direction limitation. At the same time, a screw and a screw sleeve can be set. The screw is rotatably installed, and the screw sleeve is fixed on the adjusted component. The screw is rotated, and the screw drives the screw sleeve to move, thereby making the adjusted component slide along the dovetail groove to realize the displacement adjustment of the corresponding axis. The position adjustment is accurate and continuous to meet the use needs.

[0106] In some embodiments, a knob may be connected to one end of the screw rod to facilitate force application.

[0107] Reference Figure 7 As for the air-drying device 180 , the air-drying device 180 is located downstream of the edge blank removal device 130 , that is, after removing the edge blank 170 , the carrier wafer moves to the air-drying device 180 , and the air-drying device 180 is used to remove alcohol and static electricity between the semiconductor wafer 110 and the film 100 .

[0108] This embodiment can remove alcohol and static electricity by setting up an air drying device 180, so that the chips of the semiconductor wafer 110 can be easily separated from the film 100. Furthermore, it is convenient to collect defective chips 120 from the film 100, thereby improving the efficiency of removing defective products, and it is also convenient to separate qualified chips from the film 100, thereby improving production efficiency.

[0109] In some embodiments, the air drying device 180 can also be used to air dry the magnetic ink on the defective chip 120. Therefore, when the defective chip 120 of the semiconductor wafer 110 is marked with ink, the work of absorbing the edge blank 170 can be started without waiting for the ink to dry, thus reducing waiting time.

[0110] In some embodiments, the air-drying device 180 may include a first air-drying mechanism 360 and a second air-drying mechanism 370, between which a conveying device is allowed to convey the carrier wafer, and the first air-drying mechanism 360 and the second air-drying mechanism 370 can swing up and down to adjust the blowing direction.

[0111] By providing the first blowing mechanism 360 and the second blowing mechanism 370, this embodiment can relatively dry the carrier wafer and reduce the adhesion of the bottom film 100 to the semiconductor wafer 110, so that both the qualified chips and the defective chips 120 of the semiconductor wafer 110 can be easily separated from the bottom film 100 for screening and collection.

[0112] At the same time, the first air blowing mechanism 360 and the second air blowing mechanism 370 are provided to make the distance between each chip and the air blowing mechanism more balanced, so that each chip is evenly air-dried, which is beneficial to shorten the air-drying time and improve efficiency.

[0113] Reference Figure 8 For the first blowing mechanism 360 and the second blowing mechanism 370, the blowing mechanism can include a long strip blowing fan 420 and a mounting assembly 430 connecting the two ends of the blowing assembly. The mounting assembly 430 includes a central mounting hole 440 and an arc mounting hole centered on the central mounting hole 440. Therefore, a bolt is installed in the central mounting hole 440, and another screw is installed in the arc mounting hole 450. This not only meets the installation needs, but also allows the blowing fan 420 to rotate around the central mounting hole 440 to meet the need of swinging up and down to adjust the air outlet direction. The structure is simple.

[0114] In some embodiments, the mounting assembly 430 can have a pair of buckles and the blower fan 420 can have a pair of slots, so that the connection position of the mounting assembly 430 and the blower fan 420 can be adjusted along the length direction of the blower fan 420 to install blowers 420 of different lengths, or the installation position of the mounting assembly 430 can be adjusted to meet usage needs.

[0115] Since the present embodiment does not involve improvement of the internal structure of the blower fan 420, the blower fan 420 may be selected according to actual needs.

[0116] Reference Fig. 9 As for the defective product rejection device 190, the defective product rejection device 190 is located downstream of the air-drying device 180. The defective product rejection device 190 includes a magnetic suction mechanism 200 and a collecting member 210. The magnetic suction mechanism 200 is located above the carrier wafer. The magnetic suction mechanism 200 is used to absorb the defective chip 120 to separate the defective chip 120 from the carrier wafer. The collecting member 210 is located below the magnetic suction mechanism 200 and the carrier wafer. After the carrier wafer is removed, the suction force of the magnetic suction mechanism 200 weakens or disappears, and the defective chip 120 falls to the collecting member 210.

[0117] In this embodiment, a defective product rejection device 190 is provided. Therefore, when the magnetic attraction mechanism 200 is powered on, the defective chip 120 can be removed by using the magnetic ink mark on the defective chip 120, so that only qualified chips remain on the carrier wafer, thereby meeting the need for rejecting defective products.

[0118] When the conveying device removes the carrier wafer, the power supply to the magnetic attraction mechanism 200 is cut off or reduced, so that the magnetism of the magnetic attraction mechanism 200 disappears or weakens, and the defective chips 120 fall to the collection member 210 due to gravity, which is fast and efficient, and does not require manual absorption one by one, thus saving labor.

[0119] In this embodiment, according to the need of capacity matching, the number of defective product rejection devices 190 is greater than the number of edge blank rejection devices 130 .

[0120] In some embodiments, the collecting member 210 may be a bucket to collect the defective chips 120 .

[0121] In some embodiments, the collecting member 210 may be connected to a discharge pipe to avoid downtime due to cleaning of the collecting member 210 .

[0122] In some embodiments, the conveying device may have a material unloading position to facilitate the collection of the bottom film 100 and qualified chips.

[0123] Reference Fig.10 The present invention also provides an embodiment of a semiconductor processing method, which can also improve the efficiency of removing defective products, and at the same time, efficiently remove the edge blank 170 of the semiconductor wafer 110 to achieve efficient chip sorting.

[0124] In this embodiment, the processing method mainly includes a wafer manufacturing step S1, an edge blank absorbing step S2, an air drying step S3 and a defective product rejection step S4. For the same carrier wafer, the carrier wafer manufacturing step S1, the edge blank suction step S2, the air drying step S3 and the defective product removal step S4 are performed in sequence. In production, the carrier wafer manufacturing step S1, the edge blank suction step S2, the air drying step S3 and the defective product removal step S4 can be performed simultaneously to achieve continuous processing of the carrier wafer, that is, to achieve continuous production.

[0125] In the carrier wafer manufacturing step S1, first, the chip of the semiconductor wafer 110 is tested, then the defective chip 120 is marked with magnetic ink, then, alcohol is sprayed on the film 100, and then, the semiconductor wafer 110 marked with magnetic ink is placed on the film 100, and the semiconductor wafer 110 and the film 100 together form a carrier wafer.

[0126] Since this embodiment only uses magnetic ink and does not involve the preparation of magnetic ink, it can be selected according to actual needs.

[0127] In the edge blank absorption step S2, first, the carrier wafer is placed at the loading position of the conveying device, and then the conveying device moves the carrier wafer to directly below the absorption mechanism 150 of the edge blank removal device 130, that is, directly above the lifting mechanism 140, and then the lifting mechanism 140 lifts the carrier wafer to the absorption mechanism 150, and then the absorption member 160 absorbs the edge blank 170 of the semiconductor wafer 110. After the absorption of the edge blank 170 is completed, the lifting mechanism 140 puts the carrier wafer back to the conveying device.

[0128] In the air-drying step S3 , the conveying device moves the carrier wafer to the air-drying device 180 , and the air-drying device 180 blows air toward the carrier wafer to remove alcohol and static electricity between the semiconductor wafer 110 and the bottom film 100 .

[0129] In some embodiments, the air-drying step S3 may include blowing dry the magnetic ink on the defective chip 120 to reduce waiting time, making the production process compact and eliminating the need for additional equipment to dry the ink.

[0130] In the defective product rejection step S4, first, the conveying device conveys the carrier wafer to the bottom of the magnetic suction mechanism 200, then, the magnetic suction mechanism 200 is powered on, and the magnetic suction mechanism 200 magnetically absorbs the defective chip 120 marked with magnetic ink, so that the defective chip 120 is separated from the carrier wafer, and then, the conveying device continues to convey the carrier wafer to the unloading position, and then, the magnetic suction mechanism 200 is powered off or reduced, and the defective chip 120 falls to the collection piece 210.

[0131] This embodiment removes the edge blank 170 of the semiconductor wafer 110 by first adsorbing the edge blank 170 of the semiconductor wafer 110, then air-drying it, and finally performing magnetic adsorption, thereby eliminating the defective chips 120 and leaving the qualified chips, thereby realizing full-process automatic sorting of the semiconductor wafer 110, rarely using manual labor, and having high production efficiency.

[0132] In some embodiments, the transport unit of the transport device may have a positioning post 250, and the positioning post 250 blocks the carrier wafers so that each carrier wafer passes through each device in sequence.

[0133] Reference Fig.11 The present invention also provides an embodiment of a semiconductor processing method, the processing method of this embodiment is applied to Figures 2 to 9 semiconductor processing equipment.

[0134] In this embodiment, the processing method mainly includes a wafer manufacturing step S1, an edge blank absorbing step S2, an air drying step S3 and a defective product rejection step S4. For the same carrier wafer, the carrier wafer manufacturing step S1, the edge blank suction step S2, the air drying step S3 and the defective product removal step S4 are performed in sequence. In production, the carrier wafer manufacturing step S1, the edge blank suction step S2, the air drying step S3 and the defective product removal step S4 can be performed simultaneously to achieve continuous processing of the carrier wafer, that is, to achieve continuous production.

[0135] In the carrier wafer manufacturing step S1, first, the chips of the semiconductor wafer 110 are tested, and then the bad chips 120 are marked with magnetic ink. Next, alcohol is sprayed on the film 100 and marking points 220 are marked. Then, according to the marking points 220, the semiconductor wafer 110 marked with magnetic ink is placed on the film 100 at a set angle, and the semiconductor wafer 110 and the film 100 together form a carrier wafer.

[0136] In the edge blank absorption step S2, first, the carrier wafer is placed at the loading position of the conveying device, and then the conveying device moves the carrier wafer to directly below the absorption mechanism 150 of the edge blank removal device 130, that is, directly above the lifting mechanism 140. Specifically, two limiting plates 260 limit the carrier wafer on two conveyor belts 240, and the two conveyor belts 240 convey the carrier wafer. Two positioning columns 250 abut the carrier wafer to make the carrier wafer stationary, and the center of the carrier wafer coincides with the center of the rotating disk 290.

[0137] Next, the lifting mechanism 140 lifts the carrier wafer to the suction mechanism 150 .

[0138] Then, the suction member 160 sucks the edge blank 170 of the semiconductor wafer 110. Specifically, the rotating disk 290 is rotated so that the identifier 270 recognizes an identification point 220. Then, the rotating disk 290 is stopped and the suction member 160 sucks a local edge blank 170 of the semiconductor wafer 110. Next, the suction member 160 stops sucking and then continues to rotate the rotating disk 290 so that the identifier 270 recognizes another identification point 220. Then, the rotating disk 290 is stopped again and the suction member 160 sucks another local edge blank 170 of the semiconductor wafer 110.

[0139] After the edge blank 170 is sucked, the lifting mechanism 140 puts the carrier wafer back to the conveying device.

[0140] This embodiment uses the limiting plate 260, the conveyor belt 240 and the positioning column 250, which not only meets the conveying needs, but also facilitates the connection with the edge blank removal device 130 to position the carrier wafer.

[0141] This embodiment uses a rotating disk 290 and an identifier 270, and thus controls the rotation of the rotating disk 290 by identifying the identification point 220, so that different positions of the semiconductor wafer 110 are within the suction range of the suction member 160, which can reduce the number of suction members 160. At the same time, the suction range of the suction mechanism 150 is expanded, and the edge blank 170 of the semiconductor wafer 110 is completely sucked out to avoid omissions.

[0142] In the air-drying step S3 , the conveying device moves the carrier wafer to the air-drying device 180 , and the air-drying device 180 blows air toward the carrier wafer to remove alcohol and static electricity between the semiconductor wafer 110 and the bottom film 100 .

[0143] In the defective product rejection step S4, first, the conveying device conveys the carrier wafer to the bottom of the magnetic suction mechanism 200, then, the magnetic suction mechanism 200 is powered on, and the magnetic suction mechanism 200 magnetically absorbs the defective chip 120 marked with magnetic ink, so that the defective chip 120 is separated from the carrier wafer, and then, the conveying device continues to convey the carrier wafer to the unloading position, and then, the magnetic suction mechanism 200 is powered off or reduced, and the defective chip 120 falls to the collection piece 210.

[0144] In the description of this specification, the description with reference to the terms "one embodiment, some embodiments, illustrative embodiments, examples, specific examples or some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0145] The terms "first, second, third, fourth", etc. (if any) in the specification and claims of this application and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that shown or described herein.

[0146] It should also be noted that in the description of this specification, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0147] In addition, the terms "comprises" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may also include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0148] Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0149] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor processing device, characterized in that: include: A conveying device, used for conveying a carrier wafer in a translational manner, the carrier wafer comprising a base film (100) and a semiconductor wafer (110), alcohol being provided on the top of the base film (100), the semiconductor wafer (110) being placed on the base film (100), and a defective chip (120) of the semiconductor wafer (110) being marked with magnetic ink; An edge blank removal device (130) comprises a lifting mechanism (140) and a suction mechanism (150), wherein the lifting mechanism (140) is used to lift the carrier wafer from the conveying device to the suction mechanism (150), and the suction mechanism (150) comprises a plurality of suction members (160), wherein the plurality of suction members (160) are arranged along the circumference of the semiconductor wafer (110), and the suction members (160) are used to suction the edge blank (170) of the semiconductor wafer (110), and after suction is completed, the lifting mechanism (140) is used to put the carrier wafer back into the conveying device; An air drying device (180), located downstream of the edge blank removal device (130), used to remove alcohol and static electricity between the semiconductor wafer (110) and the base film (100); The defective product rejection device (190) is located downstream of the air drying device (180), and comprises a magnetic suction mechanism (200) and a collecting member (210). The magnetic suction mechanism (200) is located above the carrier wafer and is used to suck the defective chip (120) so as to separate the defective chip (120) from the carrier wafer. The collecting member (210) is located below the magnetic suction mechanism (200) and the carrier wafer. After the carrier wafer is removed, the suction force of the magnetic suction mechanism (200) is weakened or disappears, and the defective chip (120) falls to the collecting member (210).

2. A semiconductor processing device according to claim 1, characterized in that: The diameter of the semiconductor wafer (110) is smaller than the diameter of the base film (100); a portion of the base film (100) not blocked by the semiconductor wafer (110) is provided with an identification point (220); and according to the identification point (220), the semiconductor wafer (110) is placed concentrically on the base film (100) at a set angle.

3. A semiconductor processing device according to claim 2, characterized in that: The conveying device comprises a plurality of conveying units, the plurality of conveying units comprising a first conveying unit (230), the first conveying unit (230) corresponding to the edge blank rejection device (130); The first conveying unit (230) comprises two parallel conveying belts (240), two positioning columns (250) and two limiting plates (260); The two limiting plates (260) are located on a side away from the two conveyor belts (240), and the two limiting plates (260) are used to limit the object-carrying wafer on the two conveyor belts (240); The space between the two conveyor belts (240) allows the lifting mechanism (140) to lift the carrier wafer; The two positioning posts (250) can be located on one side of the lifting mechanism (140) along the conveying direction of the carrier wafer, and the two positioning posts (250) are used to abut against the edge blank (170) of the bottom film (100) to locate the center of the carrier wafer and prevent the carrier wafer from moving.

4. A semiconductor processing device according to claim 2, characterized in that: The edge blank removal device (130) further includes an identifier (270) for identifying the identification point (220); the lifting mechanism (140) includes a lifting frame (280); the lifting frame (280) is provided with a rotating disk (290); the rotating disk (290) is used to support the carrier wafer; when the lifting frame (280) lifts the carrier wafer, the edge blank removal device (130) controls the rotating disk (290) to rotate according to the indication information of the identifier (270), so that the suction member (160) suctions different positions of the semiconductor wafer (110).

5. A semiconductor processing device according to claim 4, characterized in that: The lifting mechanism (140) comprises two fixed plates (300) standing side by side, a power component for driving the lifting frame (280) to move up and down is arranged between the two fixed plates (300), a guide column (310) and a guide hole for accommodating the guide column (310) are arranged between the fixed plates (300) and the lifting frame (280), and the guide column (310) and the guide hole cooperate to form a lifting track.

6. The semiconductor processing equipment according to claim 1, characterized in that: The number of the suction members (160) is four, and the four suction members (160) are evenly distributed along the circumference of the semiconductor wafer (110). The suction mechanism (150) includes a mounting frame (320), the suction member (160) is arranged on the top of the mounting frame (320), and the mounting frame (320) is provided with an opening (330) that passes through from top to bottom. The suction member (160) is arranged along the edge blank (170) of the opening (330), and the suction member (160) passes through the opening (330) and then suctions the edge blank (170) of the semiconductor wafer (110).

7. The semiconductor processing equipment according to claim 1, characterized in that: The suction member (160) comprises a suction nozzle (340) and a three-axis adjustment seat (350) for mounting the suction nozzle (340); the three-axis adjustment seat (350) is capable of performing Z-axis displacement adjustment, X-axis displacement adjustment and Y-axis displacement adjustment on the suction nozzle (340).

8. The semiconductor processing equipment according to claim 1, characterized in that: The air-drying device (180) comprises a first air-drying mechanism (360) and a second air-drying mechanism (370), wherein the conveying device is allowed to convey the carrier wafer between the first air-drying mechanism (360) and the second air-drying mechanism (370), and the first air-drying mechanism (360) and the second air-drying mechanism (370) can swing up and down to adjust the blowing direction.

9. A semiconductor processing method, characterized in that: A semiconductor processing device according to any one of claims 1 to 8, wherein the processing method comprises: The carrier wafer manufacturing step includes testing the chips of the semiconductor wafer (110), marking the defective chips (120) with magnetic ink, spraying alcohol on the base film (100), and placing the semiconductor wafer (110) marked with the magnetic ink on the base film (100); The step of sucking up the edge blank is to place the carrier wafer at the loading position of the conveying device, the conveying device moves the carrier wafer to the position directly below the sucking mechanism (150) of the edge blank removal device (130), the lifting mechanism (140) lifts the carrier wafer to the sucking mechanism (150), the sucking member (160) sucks up the edge blank (170) of the semiconductor wafer (110), and after the sucking up of the edge blank (170) is completed, the lifting mechanism (140) puts the carrier wafer back into the conveying device; an air-drying step, wherein the conveying device moves the carrier wafer to the air-drying device (180), and the air-drying device (180) blows air toward the carrier wafer to remove alcohol and static electricity between the semiconductor wafer (110) and the bottom film (100); In the defective product rejection step, the conveying device conveys the carrier wafer to the bottom of the magnetic attraction mechanism (200), and the magnetic attraction mechanism (200) is powered on, so that the magnetic attraction mechanism (200) magnetically attracts the defective chip (120) marked with magnetic ink, so that the defective chip (120) is separated from the carrier wafer, and the conveying device continues to convey the carrier wafer to the unloading position, and then the magnetic attraction mechanism (200) is powered off or reduced, and the defective chip (120) falls to the collecting member (210).

10. A semiconductor processing method according to claim 9, characterized in that: The diameter of the semiconductor wafer (110) is smaller than the diameter of the bottom film (100); a portion of the bottom film (100) not blocked by the semiconductor wafer (110) is provided with a marking point (220); and according to the marking point (220), the semiconductor wafer (110) is placed concentrically on the bottom film (100) at a set angle; The conveying device comprises a plurality of conveying units, wherein the plurality of conveying units comprises a first conveying unit (230), wherein the first conveying unit (230) corresponds to the edge blank removal device (130); the first conveying unit (230) comprises two parallel conveying belts (240), two positioning columns (250) and two limiting plates (260); the two limiting plates (260) are located on a side away from the two conveying belts (240), and the two limiting plates (260) are used to limit the carrier wafer on the two conveying belts (240); the space between the two conveying belts (240) allows the lifting mechanism (140) to lift the carrier wafer; the two positioning columns (250) can be located on a side of the lifting mechanism (140) along the conveying direction of the carrier wafer, and the two positioning columns (250) are used to abut against the edge blank (170) of the film (100) to locate the center of the carrier wafer and prevent the carrier wafer from moving; The edge blank removal device (130) further comprises an identifier (270) for identifying the identification point (220); the lifting mechanism (140) comprises a lifting frame (280); the lifting frame (280) is provided with a rotating disk (290); the rotating disk (290) is used to support the carrier wafer; when the lifting frame (280) lifts the carrier wafer, the edge blank removal device (130) controls the rotating disk (290) to rotate according to the indication information of the identifier (270), so that the suction member (160) suctions different positions of the semiconductor wafer (110); In the edge blank absorption step, the conveying device moves the carrier wafer to directly below the absorption mechanism (150) of the edge blank removal device (130), including: two limiting plates (260) limiting the carrier wafer on the two conveyor belts (240), the two conveyor belts (240) conveying the carrier wafer, two positioning columns (250) abutting against the carrier wafer to make the carrier wafer stationary, and the center of the carrier wafer and the center of the rotating disk (290) are vertically overlapped; In the step of absorbing the edge blank, the suction member (160) absorbs the edge blank (170) of the semiconductor wafer (110), including rotating the rotating disk (290) so that the identifier (270) recognizes one of the identification points (220), then making the rotating disk (290) stationary, and the suction member (160) absorbs a local edge blank (170) of the semiconductor wafer (110), then the suction member (160) stops absorbing, and then continues to rotate the rotating disk (290) so that the identifier (270) recognizes another identification point (220), and then makes the rotating disk (290) stationary again, and the suction member (160) absorbs another local edge blank (170) of the semiconductor wafer (110).

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