Semiconductor wafer conveying and carrying device based on N-type TOPCon photovoltaic cell

Abstract

The invention discloses a semiconductor wafer conveying and carrying device based on an N-type TOPCon photovoltaic cell, and relates to the field of semiconductors, the semiconductor wafer conveying and carrying device comprises a mounting rack, an image acquisition camera and a central processing unit, a bottom plate is welded and mounted at the bottom of the mounting rack, a plurality of suckers capable of moving and adjusting positions are mounted below the bottom plate, the image acquisition camera is mounted above the bottom plate, and the central processing unit is mounted above the image acquisition camera. The central processing unit is mounted in the mounting rack, calculates the gravity center position of the to-be-carried semiconductor wafer based on the acquired contour image of the to-be-carried semiconductor wafer, and controls the central axis of the mounting rack to move to coincide with the gravity center position of the semiconductor wafer; and combining the outline image and the gravity center position of the to-be-carried semiconductor wafer to obtain the position of the sucking disc for sucking the semiconductor wafer. According to the invention, the maximum adsorption range of the plurality of suckers can be ensured through fine calculation, so that the stability of adsorbing the semiconductor wafer is higher.

Description

Technical Field

[0001] The invention relates to the field of semiconductors, and in particular to a semiconductor wafer feeding and handling device based on an N-type TOPCon photovoltaic cell. Background Art

[0002] It is well known that the cell is the most core component of the photovoltaic module, and its structure directly affects the conversion efficiency of the photovoltaic module. N-type TOPCon photovoltaic cell is a high-efficiency solar cell technology based on the tunneling oxide layer passivation contact of the selective carrier principle. An ultra-thin silicon oxide layer is prepared on the back of the cell, and then a thin doped silicon layer is deposited. The two layers together form a passivation contact structure, which effectively reduces surface recombination and emitter metal contact recombination, increases the open circuit voltage of the solar cell, and thus improves the conversion efficiency of the solar cell. The semiconductor wafer feeding and handling device based on the N-type TOPCon photovoltaic cell is a device for feeding and handling semiconductor wafers of the N-type TOPCon photovoltaic cell in the process of producing the N-type TOPCon photovoltaic cell;

[0003] Due to the thin nature of semiconductor wafers, semiconductor wafers are mostly transported by adsorption, that is, a plurality of suction cups capable of generating negative pressure are installed at the front end of a manipulator, and the suction cups are brought into contact with the surface of the semiconductor wafer, and then the negative pressure of the suction cups is controlled to adsorb the semiconductor wafer, and then the manipulator is used to transport the wafer. However, in existing transport devices, the relative positions of the suction cups are mostly fixed, and the positions are basically adjusted by the control of the manipulator. In this way, when the suction cups adsorb the wafers, their adsorption positions cannot be calculated, adjusted, and controlled. In particular, for some wafers with non-regular polygonal structures, the adsorption position has a greater impact on the wafers. The use of existing suction cups is prone to unstable wafer adsorption and damage to the wafers. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor wafer feeding and handling device based on N-type TOPCon photovoltaic cells, so as to achieve a maximum adsorption range of multiple suction cups, thereby making the adsorption of semiconductor wafers more stable.

[0005] In order to achieve the above technical objectives, the present invention provides a semiconductor wafer feeding and handling device based on N-type TOPCon photovoltaic cells, which includes a mounting frame, a bottom plate is welded and installed at the bottom, a plurality of suction cups capable of moving and adjusting positions are installed below the bottom plate, an assembly mechanism for connecting the mounting frame to a handling device is arranged above the mounting frame, and a driving mechanism for driving the mounting frame to rotate is installed on the assembly mechanism;

[0006] An image acquisition camera, which is installed above the bottom plate and is used to acquire a contour image of the semiconductor wafer to be transported;

[0007] A central processing unit is installed in the mounting frame. The central processing unit calculates the center of gravity of the semiconductor wafer to be transported based on the acquired contour image of the semiconductor wafer to be transported, controls the central axis of the mounting frame to move to coincide with the center of gravity of the semiconductor wafer, and then obtains the position of the suction cup adsorbing the semiconductor wafer in combination with the contour image and the center of gravity of the semiconductor wafer to be transported.

[0008] As a further description of the above technical solution: the number of the suction cups is three, and the three suction cups are always located on the circumference of the same circle with a point on the central axis of the mounting frame as the center.

[0009] As a further description of the above technical solution: a collection hole for cooperating with an image collection camera for image collection is opened at the center position above the bottom plate, and the contour image of the semiconductor wafer to be transported collected by the image collection camera has a ratio of 1:1.

[0010] As a further description of the above technical solution: a vacuum pump is installed on the top of the mounting frame, three slide grooves are radially opened on the bottom plate, a slide is slidably installed in each slide groove, three suction cups are arranged in total, which are respectively installed at the bottom of each slide corresponding to each other, the suction cup and the vacuum pump are connected by a hose, a telescopic rod for pushing the slide to move is installed in the slide groove, specifically, the telescopic rod adopts an electric telescopic rod, a hydraulic telescopic rod or a pneumatic telescopic rod, specifically, the cross-section of the slide is a "Z"-shaped structure or an "E"-shaped structure, and the inner wall of the slide groove is provided with a slot structure adapted to the slide.

[0011] As a further description of the above technical solution: the assembly mechanism includes:

[0012] A mounting plate, which is arranged above the mounting frame;

[0013] A turntable is disposed between the mounting plate and the mounting frame, wherein the turntable and the mounting plate are rotatably connected via a rotating shaft, and the turntable and the mounting frame are fixedly connected via a column;

[0014] The connecting arm has a large arm mounting slide mounted on one end by welding, and the other end is detachably connected to the mounting plate by snap-fitting. Specifically, the connecting arm is snap-fitted to the mounting plate and fixed by bolts.

[0015] As a further description of the above technical solution: the driving mechanism includes:

[0016] A gear ring, which is fixedly sleeved on the outside of the rotating disk;

[0017] A motor, which is fixedly mounted on the top of the mounting plate;

[0018] A driving gear set is installed below the mounting plate. The driving gear set is drivingly connected to the output shaft of the motor, and one of the gears of the driving gear set is meshingly connected to the gear ring.

[0019] As a further description of the above technical solution: the method for the central processor to calculate the center of gravity position of the semiconductor wafer to be transported based on the acquired contour image of the semiconductor wafer to be transported is as follows:

[0020] Taking any point in the contour image of the semiconductor wafer to be transported as the coordinate origin and any dimension as the unit distance, a first plane XY rectangular coordinate system is established to obtain the coordinates of each corner point in the contour image of the semiconductor wafer to be transported. The corner point is the intersection of two adjacent sides of the contour image of the semiconductor wafer to be transported, and is set as P1(x1, y1), P2(x2, y2), P3(x3, y3), ... P n (x n ,y n ), the geometric center of gravity coordinates of the contour image of the semiconductor wafer to be transported are calculated as follows:

[0021]

[0022] Where x and y are the X-axis coordinate and Y-axis coordinate of the geometric center of gravity of the contour image of the semiconductor wafer to be transported, respectively. i ,y i are the coordinates of the i-th corner point of the contour image of the semiconductor wafer to be transported, and n is the total number of edges of the contour image of the semiconductor wafer to be transported.

[0023] As a further description of the above technical solution: the method in which the central processor controls the central axis of the mounting frame to move to coincide with the center of gravity of the semiconductor wafer is as follows:

[0024] The coordinates of the center axis of the mounting frame corresponding to the initial plane XY rectangular coordinate system are set to P0 (x0, y0), and the coordinates of the center of gravity of the semiconductor wafer to be transported are set to P (x, y);

[0025] Then the moving path of the mounting bracket is the straight-line distance from point P0(x0,y0) to point P(x,y);

[0026] The mounting frame is controlled to move according to the acquired moving path until the central axis of the mounting frame moves to coincide with the center of gravity of the semiconductor wafer.

[0027] As a further description of the above technical solution: the method for the central processor to obtain the position of the suction cup adsorbing the semiconductor wafer by combining the contour image and the center of gravity position of the semiconductor wafer to be transported is as follows:

[0028] Taking the center of gravity of the semiconductor wafer to be transported as the coordinate origin and any dimension as the unit distance, a second plane XY rectangular coordinate system is established to absorb the contour edge coordinates of the semiconductor wafer to be transported;

[0029] Obtain the coordinates of the centers of the three suction cups mapped in the second plane XY rectangular coordinate system, which are K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3);

[0030] Control the synchronous movement of the three suction cups and the rotation of the mounting frame, and at the same time, compare the coordinates K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3) of the three suction cups with the contour edge coordinates of the sucked semiconductor wafer to be transported in real time until the coordinates K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3) of the three suction cups reach the predetermined conditions and then terminate the movement;

[0031] The position corresponding to when the three suction cups stop moving is the best suction position for the semiconductor wafer.

[0032] As a further description of the above technical solution: the predetermined conditions for the three suction cups to stop moving are as follows:

[0033] (I) The coordinates of the three suction cups K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3) are all within the contour coordinate range of the semiconductor wafer;

[0034] (II) Set the closest distances between the coordinate points K1, K2, and K3 of the three suction cups and the contour edge of the semiconductor chip to be a1, a2, and a3 respectively, then any two of a1, a2, and a3 are equal to a, where a is the minimum radius required for the suction cup to adsorb.

[0035] In the above technical scheme, the present invention provides a semiconductor wafer feeding and handling device based on N-type TOPCon photovoltaic cells. The device can obtain the contour image of the semiconductor wafer to be transported by installing an image acquisition camera above the bottom plate, and the central processing unit can calculate the center of gravity position of the semiconductor wafer to be transported based on the acquired contour image of the semiconductor wafer to be transported, and then obtain the positions of the three suction cups adsorbing the semiconductor wafer in combination with the contour image and the center of gravity position of the semiconductor wafer to be transported, thereby ensuring the maximum adsorption range of the three suction cups and making the adsorption of the semiconductor wafer more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0037] Figure 1 The overall structural diagram of a semiconductor wafer feeding and handling device based on N-type TOPCon photovoltaic cells provided by the present invention;

[0038] Figure 2 A bottom-up structural schematic diagram of a semiconductor wafer feeding and handling device based on an N-type TOPCon photovoltaic cell provided by the present invention;

[0039] Figure 3 A schematic structural diagram of another perspective of a semiconductor wafer feeding and handling device based on an N-type TOPCon photovoltaic cell provided by the present invention;

[0040] Figure 4 A partial cross-sectional view of a semiconductor wafer feeding and handling device based on an N-type TOPCon photovoltaic cell provided by the present invention;

[0041] Figure 5 Schematic diagram of the center of gravity analysis of a polygonal wafer in Example 2 of the present invention;

[0042] Figure 6 Schematic diagram of position analysis of a polygonal wafer chuck in Example 3 of the present invention;

[0043] Figure 7 Schematic diagram of the calculation of the centroid coordinates of a triangular wafer in the first right-angle XY coordinate system in Example 4 of the present invention;

[0044] Figure 8 Schematic diagram of calculating the coordinates of the suction cup adsorption position in the second rectangular XY coordinate system based on a triangular wafer in Example 4 of the present invention.

[0045] Description of the drawings: 1. Arm mounting slide; 2. Connecting arm; 3. Mounting plate; 4. Motor; 5. Vacuum pump; 6. Mounting frame; 7. Bottom plate; 8. Slide; 9. Slide; 10. Telescopic rod; 11. Turntable; 12. Column; 13. Driving gear set; 14. Suction cup; 15. Collection hole; 16. Gear ring; 17. Hose; 18. Image acquisition camera; 19. Central processing unit. DETAILED DESCRIPTION

[0046] The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, and use. It should be understood that in all of these figures, the same or similar reference numerals indicate the same or similar parts and features. The various drawings only schematically represent the concepts and principles of the embodiments of the present disclosure, and do not necessarily show the specific dimensions and proportions of the various embodiments of the present disclosure. Specific parts in specific drawings may be exaggerated to illustrate the relevant details or structures of the embodiments of the present disclosure.

[0047] Example 1

[0048] See also Figure 1-4 As shown, this embodiment provides a technical solution: a semiconductor wafer feeding and handling device based on N-type TOPCon photovoltaic cells, including a mounting frame 6, an image acquisition camera 18 and a central processing unit 19, wherein a base plate 7 is welded and installed at the bottom of the mounting frame 6, a plurality of suction cups 14 capable of moving and adjusting positions are installed below the base plate 7, an assembly mechanism for connecting the mounting frame 6 to a handling device is arranged above the mounting frame 6, a driving mechanism for driving the mounting frame 6 to rotate is installed on the assembly mechanism, the image acquisition camera 18 is installed above the base plate 7, and is used to collect a contour image of the semiconductor wafer to be transported, the central processing unit 19 is installed in the mounting frame 6, the central processing unit 19 calculates the center of gravity position of the semiconductor wafer to be transported based on the acquired contour image of the semiconductor wafer to be transported, controls the central axis of the mounting frame 6 to move to coincide with the center of gravity position of the semiconductor wafer, and then obtains the position of the suction cup 14 adsorbing the semiconductor wafer in combination with the contour image and the center of gravity position of the semiconductor wafer to be transported.

[0049] Specifically, three suction cups 14 are provided, and the three suction cups 14 are always on the circumference of the same circle with a point on the central axis of the mounting frame 6 as the center. The triangle has stability, and the three suction cups 14 have higher stability. The suction cups 14 are always on the circumference of the same circle with a point on the central axis of the mounting frame 6 as the center. In this way, it can be ensured that when the suction cups 14 move, the three suction cups 14 always maintain uniform outward expansion, thereby ensuring that the center of gravity of the three suction cups is consistent during adsorption.

[0050] Specifically, a collection hole 15 for cooperating with an image collection camera 18 for image collection is opened at the center position above the bottom plate 7. The contour image of the semiconductor wafer to be transported collected by the image collection camera 18 has a ratio of 1:1, which can facilitate subsequent image processing.

[0051] Specifically, a vacuum pump 5 is installed on the top of the mounting frame 6, and three slide grooves 8 are radially opened on the bottom plate 7, and a slide 9 is slidably installed in each slide groove 8. There are three suction cups 14 in total, which are respectively installed at the bottom of each slide 9 in a one-to-one manner. The suction cup 14 and the vacuum pump 5 are connected by a hose 17, and a telescopic rod 10 for pushing the slide 9 to move is installed in the slide groove 8. Specifically, the telescopic rod 10 adopts an electric telescopic rod, a hydraulic telescopic rod or a pneumatic telescopic rod. Specifically, the cross-section of the slide 9 is a "Z"-shaped structure or an "E"-shaped structure, and a card slot structure adapted to the slide 9 is opened on the inner wall of the slide groove 8. The vacuum pump 5 is used to control the air pressure of the suction cup 14 through the hose 17 to realize the adsorption and relaxation of the wafer. When the telescopic rod 10 moves, the slide 9 can be pushed to move, thereby realizing the position control of the suction cup 14, and the telescopic rods 10 in the three slide grooves 8 adopt synchronous movement to ensure the consistency of the three suction cups 14 when moving.

[0052] Specifically, the assembly mechanism includes a mounting plate 3, a turntable 11 and a connecting arm 2, wherein the mounting plate 3 is arranged above the mounting frame 6, the turntable 11 is arranged between the mounting plate 3 and the mounting frame 6, the turntable 11 and the mounting plate 3 are rotatably connected through a rotating shaft, the turntable 11 and the mounting frame 6 are fixedly connected through a column 12, one end of the connecting arm 2 is welded with a large arm mounting slide 1, and the other end is detachably connected to the mounting plate 3 by clamping. Specifically, the connecting arm 2 and the mounting plate 3 are clamped and fixed by bolts. When the turntable 11 rotates, the mounting frame 6 rotates, thereby driving the bottom plate 7 and the suction cup 14 at the bottom of the mounting frame 6 to rotate synchronously.

[0053] Specifically, the driving mechanism includes a gear ring 16, a motor 4 and a driving gear set 13, wherein the gear ring 16 is fixedly sleeved on the outside of the turntable 11, the motor 4 is fixedly mounted on the top of the mounting plate 3, the driving gear set 13 is mounted below the mounting plate 3, the driving gear set 13 is transmission-connected to the output shaft of the motor 4, and one of the gears of the driving gear set 13 is meshed with the gear ring 16. When the motor 4 rotates, the turntable 11 is driven to rotate through the meshing action of the driving gear set 13 and the gear ring 16, thereby realizing the rotation position control of the suction cup 14.

[0054] In combination with the above technical solution, since the larger the adsorption range of the suction cup 14 (the circle formed by the center of gravity of the three suction cups 14), the more stable the adsorption, the present invention installs an image acquisition camera 18 above the base plate 7, which can obtain the contour image of the semiconductor wafer to be transported, and the central processing unit 19 can calculate the center of gravity position of the semiconductor wafer to be transported based on the acquired contour image of the semiconductor wafer to be transported, and then obtain the position of the three suction cups 14 adsorbing the semiconductor wafer in combination with the contour image and the center of gravity position of the semiconductor wafer to be transported, thereby ensuring the maximized adsorption range of the three suction cups 14 and making the adsorption of the semiconductor wafer more stable.

[0055] Example 2

[0056] See also Figure 5-6 As shown, this embodiment provides a technical solution: the central processor 19 calculates the center of gravity position of the semiconductor wafer to be transported based on the acquired contour image of the semiconductor wafer to be transported as follows:

[0057] Taking any point in the contour image of the semiconductor wafer to be transported as the coordinate origin and any dimension as the unit distance, a first plane XY rectangular coordinate system is established to obtain the coordinates of each corner point in the contour image of the semiconductor wafer to be transported. The corner point is the intersection of two adjacent sides of the contour image of the semiconductor wafer to be transported, and is set as P1(x1,y1), P2(x2,y2), P3(x3,y3), ... P n (x n ,y n ), the geometric center of gravity coordinates of the contour image of the semiconductor wafer to be transported are calculated as follows:

[0058]

[0059] Where x and y are the X-axis coordinate and Y-axis coordinate of the geometric center of gravity of the contour image of the semiconductor wafer to be transported, respectively. i ,y i are the coordinates of the i-th corner point of the contour image of the semiconductor wafer to be transported, and n is the total number of edges of the contour image of the semiconductor wafer to be transported.

[0060] Specifically, the method in which the central processor 19 controls the central axis of the mounting frame 6 to move to coincide with the center of gravity of the semiconductor wafer is as follows:

[0061] The coordinates of the central axis of the mounting frame 6 corresponding to the plane XY rectangular coordinate system are set to P0 (x0, y0), and the coordinates of the center of gravity of the semiconductor wafer to be transported are set to P (x, y);

[0062] Then the moving path of the mounting frame 6 is the straight-line distance from point P0 (x0, y0) to point P (x, y);

[0063] The mounting rack 6 is controlled to move according to the acquired moving path until the central axis of the mounting rack 6 moves to coincide with the center of gravity of the semiconductor wafer.

[0064] Example 3

[0065] See also Figure 6 As shown, this embodiment provides a technical solution: the method in which the central processor 19 obtains the position where the suction cup 14 adsorbs the semiconductor wafer by combining the contour image and the center of gravity position of the semiconductor wafer to be transported is as follows:

[0066] Taking the center of gravity of the semiconductor wafer to be transported as the coordinate origin and any dimension as the unit distance, a second plane XY rectangular coordinate system is established to absorb the contour edge coordinates of the semiconductor wafer to be transported;

[0067] Obtain the coordinates of the centers of the three suction cups 14 mapped in the second plane XY rectangular coordinate system, which are K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3);

[0068] Control the synchronous movement of the three suction cups 14 and the rotation of the mounting frame 6, and at the same time, compare the coordinates K1 (x1, y1), K2 (x2, y2), K3 (x3, y3) of the three suction cups 14 with the contour edge coordinates of the sucked semiconductor wafer to be transported in real time, until the coordinates K1 (x1, y1), K2 (x2, y2), K3 (x3, y3) of the three suction cups 14 reach the predetermined conditions and then terminate the movement;

[0069] The corresponding position after the three suction cups 14 stop moving is the optimal suction position for the semiconductor wafer.

[0070] Specifically, the predetermined conditions for the three suction cups 14 to stop moving are as follows:

[0071] Ⅰ. The coordinates K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3) of the three suction cups 14 are all within the contour coordinate range of the semiconductor wafer;

[0072] II. Set the closest distances between the coordinate points K1, K2, K3 of the three suction cups 14 and the contour edge of the semiconductor wafer to be a1, a2, a3 respectively, then any two of a1, a2, a3 are equal to a, where a is the minimum radius required for the suction cup 14 to adsorb.

[0073] Example 4

[0074] See also Figure 7 , Figure 8 As shown, in combination with Embodiment 2-Embodiment 3, this embodiment provides a specific example:

[0075] For example, the semiconductor wafer to be transported is a right triangle, where the lengths of the three sides of the semiconductor wafer to be transported are 3, 4, and 5 respectively, and the minimum adsorption radius of the suction cup is 0.1. The method for calculating the adsorption coordinates of the three suction cups 14 is as follows:

[0076] The image acquisition camera 18 acquires the contour image of the wafer;

[0077] like Figure 7As shown, one of the corner points of the wafer contour image is taken as the coordinate origin, the hypotenuse of the wafer contour image is taken as the X-axis, and the first plane XY rectangular coordinate system is established. The coordinates of the corner points P1, P2, and P3 of the wafer contour image are P1 (0, 0), P2 (3.20, 2.40), and P3 (5.00, 0.00), respectively:

[0078] Substitute the coordinates of P1, P2, and P3 into the following formula:

[0079]

[0080] Where n=3, the geometric center of gravity coordinates P(x,y) of the wafer contour image are P(2.73,0.80);

[0081] Taking the center of gravity P of the semiconductor wafer to be transported as the coordinate origin and any dimension as the unit distance, establish the second plane XY rectangular coordinate system, and absorb the coordinates of the contour edge of the semiconductor wafer to be transported in the second plane XY rectangular coordinate system, which are M1 (-2.73, -0.80), M2 (0.47, 1.60), and M3 (2.27, -0.80);

[0082] Obtain the coordinate points of the centers of the three suction cups 14 mapped in the second plane XY rectangular coordinate system, which are K1, K2, and K3 respectively;

[0083] Control the synchronous movement of the three suction cups 14 and the rotation of the mounting frame 6, and at the same time, compare the coordinates K1, K2, and K3 of the three suction cups 14 with the contour edge coordinates of the sucked semiconductor wafer to be transported, that is, compare with the surface contour formed by the coordinate points M1 (-2.73, -0.80), M2 (0.47, 1.60), and M3 (2.27, -0.80) in the second plane XY rectangular coordinate system, until the coordinate points K1, K2, and K3 of the three suction cups 14 reach the predetermined conditions and then stop moving;

[0084] The corresponding position after the three suction cups 14 stop moving is the optimal suction position for the semiconductor wafer.

[0085] Specifically, the predetermined conditions for the three suction cups 14 to stop moving are as follows:

[0086] Ⅰ. The coordinate points K1, K2, and K3 corresponding to the three suction cups 14 are all located within the contour coordinate range of the semiconductor wafer, that is, within the surface contour formed by the coordinate points M1 (-2.73, -0.80), M2 (0.47, 1.60), and M3 (2.27, -0.80) in the second plane XY rectangular coordinate system;

[0087] II. The closest distances between the coordinate points K1, K2, K3 corresponding to the three suction cups 14 and the contour edge of the semiconductor wafer are a1, a2, a3 respectively, and any two of a1, a2, a3 are equal to 0.1.

[0088] After constraint calculation, the coordinate points of the three suction cups 14 are obtained as K1 (1.10, 0.50), K2 (0.99, -0.70), and K3 (0.11, 1.21).

[0089] It should be noted that the values ​​in the above coordinate calculation are taken to two decimal places. Through the above method, the optimal adsorption position of the semiconductor wafer to be transported in the shape of a right triangle with three sides of 3, 4, and 5 respectively when the minimum adsorption radius of the suction cup is 0.1 can be calculated, which improves the stability of wafer transport and adsorption.

[0090] The exemplary implementation scheme of the present disclosure is described in detail above with reference to the preferred embodiments. However, it can be understood by those skilled in the art that, without departing from the concept of the present disclosure, various modifications and variations can be made to the above-mentioned specific embodiments, and various technical features and structures proposed in the present disclosure can be combined in various ways without exceeding the protection scope of the present disclosure, which is determined by the attached claims.

Claims

1. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells, characterized in that: It includes: A mounting frame (6) is welded to the bottom of which a bottom plate (7) is mounted, a plurality of suction cups (14) capable of moving and adjusting positions are mounted below the bottom plate (7), an assembly mechanism for connecting the mounting frame (6) to a handling device is arranged above the mounting frame (6), and a driving mechanism for driving the mounting frame (6) to rotate is mounted on the assembly mechanism; An image acquisition camera (18), which is installed above the base plate (7) and is used to acquire a contour image of the semiconductor wafer to be transported; A central processing unit (19) is installed in the mounting frame (6). The central processing unit (19) calculates the center of gravity position of the semiconductor wafer to be transported based on the acquired contour image of the semiconductor wafer to be transported, controls the central axis of the mounting frame (6) to move to coincide with the center of gravity position of the semiconductor wafer, and then obtains the position of the suction cup (14) adsorbing the semiconductor wafer in combination with the contour image and the center of gravity position of the semiconductor wafer to be transported.

2. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 1, characterized in that: The suction cups (14) are arranged in three numbers, and the three suction cups (14) are always located on the circumference of the same circle with a point on the central axis of the mounting frame (6) as the center.

3. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 1, characterized in that: A collection hole (15) for cooperating with an image collection camera (18) for image collection is provided at a central position above the bottom plate (7). The ratio of the contour image of the semiconductor wafer to be transported collected by the image collection camera (18) is 1:

1.

4. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 1, characterized in that: A vacuum pump (5) is installed on the top of the mounting frame (6), and three slide grooves (8) are radially opened on the bottom plate (7). A slide table (9) is slidably mounted in each slide groove (8). A total of three suction cups (14) are provided, which are respectively installed at the bottom of each slide table (9) in a one-to-one correspondence. The suction cups (14) are connected to the vacuum pump (5) through a hose (17), and a telescopic rod (10) for pushing the slide table (9) to move is installed in the slide groove (8).

5. The semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 1, characterized in that: The assembly mechanism comprises: A mounting plate (3) disposed above the mounting frame (6); A turntable (11) is arranged between the mounting plate (3) and the mounting frame (6); the turntable (11) and the mounting plate (3) are rotatably connected via a rotating shaft, and the turntable (11) and the mounting frame (6) are fixedly connected via a column (12); The connecting arm (2) has a large arm mounting slide (1) welded to one end thereof and the other end thereof is detachably connected to the mounting plate (3) by snap-fitting. Specifically, the connecting arm (2) and the mounting plate (3) are snap-fitted and fixed by bolts.

6. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 5, characterized in that: The driving mechanism comprises: A gear ring (16) fixedly sleeved on the outside of the rotating disk (11); A motor (4) fixedly mounted on the top of the mounting plate (3); A driving gear set (13) is installed below the mounting plate (3); the driving gear set (13) is drivingly connected to the output shaft of the motor (4); and one of the gears of the driving gear set (13) is meshingly connected to the gear ring (16).

7. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 1, characterized in that: The method in which the central processor (19) calculates the center of gravity position of the semiconductor wafer to be transported based on the acquired contour image of the semiconductor wafer to be transported is as follows: Taking any point in the contour image of the semiconductor wafer to be transported as the coordinate origin and any dimension as the unit distance, a first plane XY rectangular coordinate system is established to obtain the coordinates of each corner point in the contour image of the semiconductor wafer to be transported, which are set as P1(x1,y1), P2(x2,y2), P3(x3,y3), ... P n (x n ,y n ), the geometric center of gravity coordinates of the contour image of the semiconductor wafer to be transported are calculated as follows: Where x and y are the X-axis coordinate and Y-axis coordinate of the geometric center of gravity of the contour image of the semiconductor wafer to be transported, respectively. i ,y i are the coordinates of the i-th corner point of the contour image of the semiconductor wafer to be transported, and n is the total number of edges of the contour image of the semiconductor wafer to be transported.

8. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 7, characterized in that: The method in which the central processor (19) controls the central axis of the mounting frame (6) to move to coincide with the center of gravity of the semiconductor wafer is as follows: The coordinates of the central axis of the mounting frame (6) corresponding to the plane XY rectangular coordinate system are set to P0 (x0, y0), and the coordinates of the center of gravity of the semiconductor wafer to be transported are set to P (x, y); Then the moving path of the mounting frame (6) is the straight-line distance from point P0 (x0, y0) to point P (x, y); The mounting frame (6) is controlled to move according to the acquired moving path until the central axis of the mounting frame (6) moves to coincide with the center of gravity of the semiconductor wafer.

9. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 8, characterized in that: The method in which the central processor (19) obtains the position of the semiconductor wafer adsorbed by the suction cup (14) in combination with the contour image and the center of gravity position of the semiconductor wafer to be transported is as follows: Taking the center of gravity of the semiconductor wafer to be transported as the coordinate origin and any dimension as the unit distance, a second plane XY rectangular coordinate system is established to absorb the contour edge coordinates of the semiconductor wafer to be transported; Obtain the coordinates of the centers of the three suction cups (14) mapped in the second plane XY rectangular coordinate system, which are K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3); Controlling the synchronous movement of the three suction cups (14) and the rotation of the mounting frame (6), and simultaneously comparing the coordinates K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3) of the three suction cups (14) with the contour edge coordinates of the sucked semiconductor wafer to be transported in real time, until the coordinates K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3) of the three suction cups (14) reach predetermined conditions and then terminating the movement; The corresponding position after the three suction cups (14) stop moving is the best suction position for the semiconductor wafer.

10. A semiconductor wafer conveying and handling device based on N-type TOPCon photovoltaic cells according to claim 9, characterized in that: The predetermined conditions for the three suction cups (14) to stop moving are as follows: (I), the coordinate points K1 (x1, y1), K2 (x2, y2), and K3 (x3, y3) of the three suction cups (14) are all located within the contour coordinate range of the semiconductor wafer; (II) The closest distances between the coordinate points K1, K2, K3 of the three suction cups (14) and the contour edge of the semiconductor wafer are set to be a1, a2, a3 respectively, then any two of a1, a2, a3 are equal to a, where a is the minimum radius required for the suction cup (14) to adsorb.

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