Wafer loading and inspection integrated device and method

Abstract

The present application relates to the technical field of semiconductor, in particular to a wafer loading and detecting integrated device and method, the method steps are as follows: S10, the overhead travelling crane carries the wafer box and reads the box loading platform.S20, wafer box identification confirmation, locking mechanism unlocking;S30, detection frame mechanism rises and opens cover, obtains wafer box and wafer state information;S40, detection frame mechanism descends and closes cover, obtains wafer box and wafer state information after operation is completed;S50, locking mechanism carries out the cover locking action;wafer box is carried;The present application integrates the detection of bearing and wafer pick-and-place result;Shorten the overall processing and manufacturing process, take into account the wafer detection demand in the process of wafer storage, wafer picking, cover opening and cover closing, reduce the waste time and labor cost, reduce the pollution of wafer, bending and storage protrusion in entity, cause greater quality risk in subsequent, the overall efficiency and quality of wafer processing process are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a wafer loading and detection integrated device and method. BACKGROUND

[0002] In the manufacturing process of semiconductors, wafer transportation is crucial to IC manufacturing. In order to ensure the quality of the wafer during transportation between different processes, and to avoid the wafer from being contaminated by dust particles or other contaminants, more and more transportation work uses standard transportation containers, i.e. wafer boxes, for temporary storage;

[0003] In the processing of wafers, it is necessary to transfer and load between multiple devices and apparatuses. The conventional operation mode is to manually carry and open and close the wafer box to adapt to each step in the processing engineering; however, frequent manual operation and turnover steps increase human errors, causing quality risks that cannot be supplied;

[0004] The existing AGV trolley can solve the carrying demand of the wafer box. Its programmable and remotely controllable characteristics can adapt to the carrying and transfer demand in various application scenarios, and improve the efficiency of turnover carrying; however, the opening and closing actions of the wafer box are still mainly operated manually, and therefore a customized opening platform or device that can adapt to the automatic AGV trolley is urgently needed to reduce manual operation and improve the overall automation coverage of wafer processing. SUMMARY

[0005] The present application aims to provide a wafer loading and detection integrated device and method with simple structure, reasonable design and rich function integration.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme.

[0007] A wafer loading and detection method, comprising a box reading table, a detection frame mechanism and a lifting assembly; the box reading table comprises a locking mechanism, the detection frame mechanism, the detection frame mechanism comprising a seat edge part guiding the wafer box, a wind box side plate bearing the seat edge part and a lifting back plate driving the wind box side plate and the seat edge part to move; the wind box side plate is provided with a wafer box state sensor and a wafer protrusion sensor method step as follows:

[0008] S10, the overhead crane carries the wafer box to above the box reading table, and the detection frame mechanism guides the wafer box to be placed on the box reading table.

[0009] S20, the box reading table identifies and confirms the wafer box, and the locking mechanism unlocks the wafer box cover;

[0010] S30, the lifting assembly drives the detection frame mechanism to carry out the wafer box cover to rise and open the cover; at the same time, the wafer box state sensor and the wafer protrusion sensor obtain the wafer box and wafer state information;

[0011] S40, after the operation of the external device is completed; the lifting assembly drives the detection frame mechanism to carry the wafer box cover to descend and close, and the wafer box state sensor and the wafer protrusion sensor acquire the wafer box and wafer state information after the operation is completed again;

[0012] S50, after the detection is completed, the locking mechanism on the box reading platform performs the box cover locking action; the overhead crane carries the wafer box to complete the next working cycle;

[0013] Further, the box reading platform comprises a platform plate body, the platform plate body is provided with at least one induction part for reading the label at the bottom of the wafer box and an adjusting part for fine-tuning the height of the platform plate body; the locking mechanism is installed on the lower end surface of the platform plate body; the specific steps of S20 are as follows:

[0014] S21, the induction part reads, identifies and compares the bottom of the wafer box;

[0015] S22, after the identification is confirmed, the wafer box bottom is unlocked by the locking mechanism;

[0016] Further, the locking mechanism comprises a locking base 332 for installing the locking rod, a locking drive for driving the locking base, and a locking sensor for detecting that the locking base 332 moves to the position.

[0017] Further, the specific steps of S30 are as follows:

[0018] S31, the cover grabbing mechanism grabs and fixes the top of the wafer box cover;

[0019] S32, the lifting assembly drives the lifting back plate to drive the bellow side plate in turn;

[0020] S33, the wafer box and wafer state detection is performed by the wafer box state sensor and the wafer protrusion sensor installed on the inner side wall of the bellow side plate;

[0021] Further, the lifting assembly comprises a lifting drive, a transmission wheel set driven by the lifting drive, and a transmission screw rod connected with the transmission wheel set; the lifting drive and the transmission wheel set are both installed in the mounting cavity built in the bottom frame, the lifting back plate is fixedly connected with the lifting block installed on the transmission screw rod; the lifting back plate and the back plate are slidably connected by the lifting slide rail;

[0022] Further, the seat edge part comprises a seat edge frame for guiding the wafer box cover and a seat edge bottom plate for bearing the seat edge frame; the seat edge frame is a split structure, the seat edge bottom plate is a hollow rectangular frame, and the seat edge frame is symmetrically installed on the upper end surfaces of two opposite edges of the seat edge bottom plate; a group of mapping sensors are arranged below the seat edge bottom plate;

[0023] Further, the seat edge frame is provided with a cavity, and a mounting cavity is formed by the seat edge bottom plate and the cavity. A cover body lock tongue is rotatably installed on the seat edge bottom plate. A lock tongue drive is arranged to drive the rotation of the cover body lock tongue. A lock tongue sensor is arranged to detect whether the cover body lock tongue is in place.

[0024] Further, the moving end of the lock tongue drive is connected with a lock tongue pull rod. The lock tongue pull rod is provided with a lock tongue connecting rod and a lock tongue sensing piece at the end thereof. One end of the lock tongue connecting rod is fixedly connected with the lock tongue pull rod, and the other end thereof is rotatably connected with the cover body lock tongue. When the cover body lock tongue reaches a specified position, the lock tongue sensing piece enters the sensing area of the lock tongue sensor.

[0025] A wafer loading and detecting integrated device comprises a base frame and a back plate, and is used to implement the wafer loading and detecting method. The base frame is provided with a mounting cavity. A wafer box reading and carrying platform and a detecting frame mechanism for detecting the wafer box and the wafer are arranged in the mounting cavity. The detecting frame mechanism is arranged around the wafer box reading and carrying platform and is driven by a lifting assembly to perform lifting operation on the front end surface of the back plate.

[0026] Further, the inner wall of the base frame is provided with a reinforcing side plate and an auxiliary stand.

[0027] Compared with the prior art, the wafer loading and detecting integrated device has the following beneficial effects.

[0028] In the method, the wafer box and the wafer are carried to the wafer box reading and carrying platform by an external overhead crane. The wafer box is carried and temporarily stored. The wafer box is identified and corrected by the wafer box reading and carrying platform. After the wafer box is determined to be correct, the wafer box is unlocked. After the wafer box is unlocked, the lifting assembly drives the detecting frame mechanism to lift and open the box cover. The detecting frame mechanism detects the wafer box and the wafer during the lifting and opening and closing of the box cover.

[0029] The method has the advantages of ingenious overall concept, integrated wafer box carrying, wafer carrying after the wafer box is opened, and detection of wafer taking and placing results. The overall manufacturing process is shortened. The wafer detection requirements during wafer storage, wafer taking, wafer cover opening and wafer cover closing are considered. The time and labor cost wasted in the multiple detection operation processes during wafer manufacturing and processing are reduced. The wafer pollution, wafer bending and wafer storage protrusion are reduced in the physical sense. The quality risk in the subsequent process is reduced. The efficiency and quality of the wafer processing process are improved. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 The figure is a schematic view of the overall invention.

[0031] Figure 2 The figure is a schematic view of the base frame of the invention.

[0032] Figure 3 Fig. 2 is a schematic view of the lifting assembly part of the present application;

[0033] Figure 4 Fig. 3 is a schematic view of the hidden back plate of the present application;

[0034] Figure 5 Fig. 4 is a schematic view of the structure of the reading box carrier of the present application;

[0035] Figure 6 Fig. 5 is a schematic view of the oblique view of the reading box carrier of the present application;

[0036] Figure 7 Fig. 6 is a schematic view of the structure of the detection frame mechanism of the present application;

[0037] Figure 8 Fig. 7 is a schematic view of the hidden part of the detection frame mechanism of the present application. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application.

[0039] Reference Figures 1-8 As shown in the figure, a wafer loading and detection method includes a reading box carrier 3, a detection frame mechanism 4 and a lifting assembly. The reading box carrier 3 includes a locking mechanism 33, the detection frame mechanism 4 and the lifting assembly. The reading box carrier 3 includes the locking mechanism 33, the detection frame mechanism 4, the detection frame mechanism 4 includes a seat edge part 41 guiding a wafer box, a bellows side plate 42 bearing the seat edge part 41 and a lifting back plate 43 driving the bellows side plate 42 and the seat edge part 41 to move. The wafer box state sensor 47 and the wafer protrusion sensor 48 are arranged on the bellows side plate 42. The method steps are as follows:

[0040] S10, the crown carries the wafer box to above the reading box carrier 3, and the wafer box is placed on the reading box carrier 3 by the detection frame mechanism 4. S20, the reading box carrier 3 identifies and confirms the wafer box, and the locking mechanism 33 unlocks the wafer box cover. S30, the lifting assembly drives the detection frame mechanism 4 to carry out the wafer box cover to rise and open the cover. At the same time, the wafer box state sensor 47 and the wafer protrusion sensor 48 obtain the wafer box and wafer state information. S40, after the external equipment is operated, the lifting assembly drives the detection frame mechanism 4 to carry the wafer box cover to descend and close the cover, and the wafer box state sensor 47 and the wafer protrusion sensor 48 obtain the wafer box and wafer state information again after the operation is completed. S50, after the detection is completed, the locking mechanism 33 on the reading box carrier 3 performs the box cover locking action. The crown carries the wafer box to complete the next working cycle.

[0041] In actual use, the communication control is performed by the industrial host computer 6, the external overhead crane carries the wafer box and the whole wafer to the top of the box reading platform 3, and the wafer box is carried and temporarily stored, the box reading platform 3 identifies and corrects the wafer box, and after the wafer box is determined to be correct, the wafer box is unlocked, and after the unlocking is completed, the lifting assembly drives the detection frame mechanism 4 to lift and open the box cover, and the detection frame mechanism 4 detects the wafer box and the wafer during the lifting and opening of the box and the closing of the box;

[0042] The overall method is ingenious, and the transfer of the wafer box, the carrying of the wafer after the wafer box is opened, and the detection of the wafer taking and placing result are integrated; the overall manufacturing process takes into account the wafer detection requirements during wafer storage, wafer taking, wafer cover opening, and wafer cover closing, reduces the time and labor cost wasted in multiple detection operations in the manufacturing and processing process, and reduces the pollution, bending, and storage protrusion of the wafer in the physical sense, thereby reducing the subsequent greater quality risk, and improving the efficiency and quality of the wafer processing process as a whole.

[0043] In the embodiment, the box reading platform 3 includes a platform plate body 31, the platform plate body 31 is provided with at least one sensing part 311 for reading the label at the bottom of the wafer box and an adjusting part 312 for fine-tuning the height of the platform plate body 31; the locking mechanism 33 is installed at the lower end surface of the platform plate body 31; and the specific steps are as follows:

[0044] S21, the sensing part 311 reads, identifies and compares the bottom of the wafer box;

[0045] S22, after identification and confirmation, the locking mechanism 33 unlocks the bottom of the wafer box;

[0046] In the specific steps, the platform plate body 31 is used to carry the wafer box coming from the overhead crane, the wafer box is pre-installed with an RFID electronic tag, and the sensing part 311 reads the information of the wafer box to obtain and record the batch and related model information of the wafer box;

[0047] In the embodiment, at least one group of antenna installation grooves 313 is arranged below each sensing part 311, and the antenna installation grooves 313 are used to install the reading antenna 34 for reading the electronic tag of the wafer box; multiple groups of antenna installation grooves 313 are arranged, which can ensure that the reading antenna 34 can be adjusted in position as needed to adapt to wafer boxes of different sizes and wafer boxes with different label positions, improve the adaptation ability of the component to wafer boxes of different types and sizes, realize one machine with multiple functions, and reasonably save costs.

[0048] In the embodiment, the adjusting member 312 is an adjusting jackscrew installed in the countersunk groove, and the adjusting jackscrew is used to connect the platform plate body 31 and the platform base 35; the platform base 35 is arc-shaped by splicing three plate bodies; the adjusting member 312 is arranged at four end corners of the end surface of the platform plate body 31, and the horizontal plane of the platform plate body 31 can be finely adjusted in different heights and inclination angles as needed by rotating the adjusting jackscrew at different positions, so as to adapt to other equipment at the front end or the rear end and ensure that the overall processing flow is at the same horizontal plane.

[0049] In the embodiment, the locking mechanism 33 includes a locking base 332 for installing the locking rod 32, a locking drive 331 for driving the locking base 332 to rotate, and a locking sensor 333 for detecting that the locking base 332 rotates to a specified position; the locking drive 331 and the locking sensor 333 are both fixed on the lower end surface of the platform plate body 31, and the locking base 332 is rotatably installed on the lower end surface of the platform plate body 31; the locking drive 331 can be a motor, and the motor drives the locking base 332 to rotate by a predetermined angle through a belt, and the locking base 332 rotates to drive the locking rod 32 to rotate; the locking rod 32 is usually inserted into a corresponding operation hole or operation groove on the wafer box, and rotates to realize the locking and unlocking operations of the cover of the wafer box.

[0050] In the embodiment, the bottom of the locking base 332 is provided with a locking tab 334, and the locking tab 334 is used to trigger the locking sensor 333; when the locking base 332 rotates, the locking tab 334 rotates together, and when the locking tab 334 rotates, it passes through the locking sensor 333, thereby triggering the locking sensor 333 installed at different positions, so as to realize the detection and judgment of different actions, ensure that the locking and unloading actions can be converted into control signals, and facilitate the integration of the assembly into the overall automatic equipment and system.

[0051] In the embodiment, the locking sensor 333 is a groove type photoelectric switch.

[0052] After the wafer box is identified and recorded by the wafer box reading platform 3 and no error is confirmed, the bottom of the wafer box is unlocked; after unlocking, the lifting assembly further drives the detection frame mechanism 4 to perform synchronous lifting detection.

[0053] In the embodiment, the detection frame mechanism 4 includes a seat edge part 41 for guiding the wafer box, a wind box side plate 42 for bearing the seat edge part 41, and a lifting back plate 43 for driving the wind box side plate 42 and the seat edge part 41 to move, wherein the lifting assembly drives the lifting back plate 43 to reciprocate; the wafer box state sensor 47 and the wafer protrusion sensor 48 are installed on the inner side wall of the wind box side plate 42; the inner cavity part of the seat edge part 41 is provided with a cover grabbing mechanism 44.

[0054] Further, the specific steps of S30 are as follows:

[0055] S31, the cover grabbing mechanism 44 grabs and fixes the top of the wafer box cover;

[0056] S32, the lifting assembly drives the lifting back plate 43 to drive the bellow side plate 42;

[0057] S33, the wafer box state sensor 47 and the wafer protrusion sensor 48 installed in the inner side wall of the bellow side plate 42 detect the state of the wafer box and the wafer;

[0058] When the cover is opened and the film is detected, the cover grabbing mechanism 44 locks and grabs the wafer box cover, the lifting assembly drives the lifting back plate 43 to move, and then drives the bellow side plate 42 and the seat edge part 41 to move up and down together. In the lifting process, the wafer box state sensor 47 and the wafer protrusion sensor 48 detect the state of the wafer. The seat edge part 41 includes a seat edge frame 411 for guiding the wafer box cover and a seat edge bottom plate 412 for bearing the seat edge frame 411; the seat edge frame 411 is a split structure, and the seat edge bottom plate 412 is a hollow rectangular frame. The seat edge frame 411 is symmetrically installed on the upper end face of the two opposite edges of the seat edge bottom plate 412. The split seat edge frame 411 reduces the side plates on both sides, further increases the compatibility with various types of overhead cranes, and further simplifies the internal wiring.

[0059] The wafer box state sensor 47 is any one of photoelectric, magnetic induction or mechanical in-situ sensing sensor. When the wafer box is placed in the specified position, it will change the signal emitted by the sensor, such as shielding light or changing the magnetic field distribution. The sensor receives the changed signal and processes it to determine whether the wafer box is in place. The wafer protrusion sensor 48 includes but is not limited to a laser displacement sensor, a spectral confocal sensor, a photoelectric sensor, etc., which is used to detect unreasonable deviation and convexity of the wafer during placement in the wafer box, so as to avoid damage to the wafer.

[0060] A position-avoiding groove 421 is formed on the inner side end face of the bellow side plate 42. A plurality of equidistant mounting holes 422 are formed in the position-avoiding groove 421. The mounting holes 422 are used to assemble and fix at least one set of first and second supports 471 and 481. The position-avoiding groove 421 can reasonably and effectively accommodate wires, improving the efficiency of installation and wiring and later maintenance and repair.

[0061] In this embodiment, the first and second supports 471 and 481 are used to assemble and fix the wafer box state sensor 47 and the wafer protrusion sensor 48. In this embodiment, the seat edge frame 411 is provided with a code scanning device 45. The code scanning device 45 can scan the identification code on the wafer box cover to obtain the number and identification information of the wafer box.

[0062] Specific steps, seat edge 41 guide and place the auxiliary wafer box placed on the stage plate body 31, need to be opened when the cover is detected, the cover is locked by the cover grabbing mechanism 44, the external lifting assembly drives the lifting back plate 43 at a uniform speed, in the lifting process, the wafer box cover is grabbed by the cover grabbing mechanism 44, and the air bellow side plate 42 also rises and falls together, the wafer box cover is transparent material, the wafer box state sensor 47 and the wafer protrusion sensor 48 also scan and detect the wafer box and the wafer in the wafer box during lifting; the state information of the wafer box and the wafer is obtained as needed, so as to avoid the bending, deviation and protrusion of the wafer during the wafer placing and transporting process.

[0063] In the embodiment, the lifting assembly includes a lifting drive 51, a transmission wheel set 52 driven by the lifting drive 51, and a transmission screw rod 54 connected with the transmission wheel set 52; the lifting drive 51 and the transmission wheel set 52 are both installed in the mounting cavity in the chassis 1, the lifting back plate 43 is fixedly connected with the lifting block 53 installed on the transmission screw rod 54; the lifting back plate 43 and the back plate 2 are slidably connected through a lifting slide rail 55; the lifting slide rail 55 is designed as a double-rail double-tow chain type, which is respectively arranged on the two sides of the back plate 2; the double-tow chain double-rail design ensures that the lifting back plate 43 can stably move up and down, and ensures the stability and safety of the whole operation.

[0064] In the embodiment, the seat edge 41 includes a seat edge frame 411 guiding the wafer box cover and a seat edge bottom plate 412 bearing the seat edge frame 411; the seat edge frame 411 is a split structure, and the seat edge bottom plate 412 is a hollow rectangular frame; the seat edge frame 411 is symmetrically installed on the upper end faces of the two opposite edges of the seat edge bottom plate 412; a group of mapping sensors 46 are arranged below the seat edge bottom plate 412; the split seat edge frame 411 reduces the side plates on both sides, further increases the compatibility with various types of overhead cranes, and further simplifies the internal wiring; the mapping sensor 46 is an optical reflection type sensor, which can detect the wafer surface during lifting and scanning detection, determine whether there are defects, scratches, pollution and other problems, and ensure that the wafer quality meets the production requirements.

[0065] In this embodiment, the seat edge frame 411 is internally provided with a cavity, and a mounting cavity is formed with the seat edge bottom plate 412. The mounting cavity is internally provided with a cover grabbing mechanism 44. The cover grabbing mechanism 44 comprises a cover lock tongue 446 rotatably mounted on the seat edge bottom plate 412, a lock tongue driving 441 driving the cover lock tongue 446 to rotate, and a lock tongue sensor 442 detecting whether the cover lock tongue 446 is in place. The moving end of the lock tongue driving 441 is connected with a lock tongue pull rod 443. The end of the lock tongue pull rod 443 is provided with a lock tongue connecting rod 444 and a lock tongue sensing sheet 445. One end of the lock tongue connecting rod 444 is fixedly connected with the lock tongue pull rod 443, and the other end is rotatably connected with the cover lock tongue 446. When the cover lock tongue 446 reaches a specified position, the lock tongue sensing sheet 445 enters the sensing area of the lock tongue sensor 442. The lock tongue driving 441 is a pneumatic cylinder or an electric cylinder, and the lock tongue sensor 442 is an optical sensor. When the lock tongue driving 441 pulls the lock tongue pull rod 443, the lock tongue connecting rod 444 is driven to pull and rotate the cover lock tongue 446, so as to realize the rotation of the cover lock tongue 446 and the grabbing and locking of the wafer box cover. At the same time, the lock tongue pull rod 443 drives the lock tongue sensing sheet 445 to move, and the lock tongue sensing sheet 445 further triggers the lock tongue sensor 442. The lock tongue sensor 442 can obtain the opening and closing state of the wafer cover, so as to ensure the accuracy and accuracy of the subsequent automatic action integration.

[0066] A wafer loading and detection integrated device comprises a base frame 1 and a back plate 2, which are used to implement the wafer loading and detection method. The base frame 1 is internally provided with a mounting cavity, and the mounting cavity is provided with a box reading table 3 bearing and identifying a wafer box and a detection frame mechanism 4 detecting the wafer box and a wafer. The detection frame mechanism 4 is arranged outside the box reading table 3 and is driven by a lifting assembly to perform lifting action on the front end surface of the back plate 2.

[0067] During loading and detection, the box reading table 3 bears and fixes the wafer box, and the detection frame mechanism 4 is driven by the lifting assembly to perform wafer box opening and detection operation.

[0068] An industrial control host 6 is mounted on the outer wall of the base frame 1. The industrial control host 6 comprises an E84Port, an SMIFPort and a Host interface. The E84Port has communication capability with an automatic material handling system AMHS and a machine loading port LP. The SMIFPort is mainly used for opening and closing operation of a SMIF PODStandard Mechanical Interface Pod and scanning wafer distribution state in the process. The Host has communication capability with a PC end, facilitating equipment upgrading and maintenance and further improving expansion capability.

[0069] In the embodiment, the inner wall of the bottom frame 1 is provided with the reinforcing side plate 11 and the auxiliary column 12; the reinforcing side plate 11 and the auxiliary column 12 added to the inner wall of the bottom frame 1 can effectively ensure the structural strength of the bottom frame 1, and avoid quality accidents caused by the deformation of the bottom frame 1, the placement of the wafer box and the subsequent operation.

[0070] The specific embodiments described herein are merely illustrative of the spirit of the present application. Those skilled in the art of the present application can make various modifications or supplements to the described specific embodiments or replace them with similar ways, but will not deviate from the scope defined by the spirit of the present application.

Claims

1. A wafer loading and inspection method, characterized by, Including reading box carrier (3), detection frame mechanism (4) and lifting assembly;The reading box carrier (3) includes locking mechanism (33), the detection frame mechanism (4), the detection frame mechanism (4) includes guiding wafer box seat edge part (41), the air bellow side plate (42) of bearing seat edge part (41) and drive air bellow side plate (42) and seat edge part (41) movement lifting backboard (43);The seat edge part (41) includes guiding wafer box cover seat edge frame (411) and is used for bearing seat edge frame (411) seat edge bottom plate (412);A group of mapping sensors (46) are arranged below the seat edge bottom plate (412);Air bellow side plate (42) is provided with wafer box state sensor (47) and wafer protruding sensor (48);The seat edge frame (411) is built-in cavity, and forms mounting cavity with seat edge bottom plate (412), and the mounting cavity is mounted with cover locking mechanism (44);The cover locking mechanism (44) includes the cover lock bolt (446) rotatably installed in the seat edge bottom plate (412), the lock bolt drive (441) for driving the cover lock bolt (446) to rotate, the lock bolt sensor (442) for detecting whether the cover lock bolt (446) is in place;Method steps are as follows: S10, the crane carries wafer box to the upper of reading box carrier (3), and the wafer box is placed on reading box carrier (3) by detection frame mechanism (4); S20, reading box carrier (3) identifies and confirms wafer box, and locking mechanism (33) unlocks wafer box cover; S30, lifting assembly drives detection frame mechanism (4) to carry wafer box cover and carries out ascending uncovering action;At the same time, wafer box state sensor (47) and wafer protruding sensor (48) obtain wafer box and wafer state information; Mapping sensor (46) can detect wafer surface; S40, after external equipment operation is completed; Lifting assembly drives detection frame mechanism (4) to carry wafer box cover and descend to close, and wafer box state sensor (47) and wafer protruding sensor (48) obtain wafer box and wafer state information again after operation is completed; S50, after detection is completed, locking mechanism (33) on reading box carrier (3) carries out box cover locking action;Wait for the crane to carry wafer box to complete the next working cycle.

2. The method of claim 1, wherein The reading box carrier (3) includes carrier plate body (31), and the carrier plate body (31) is provided with at least one sensing part (311) for reading wafer box bottom label and adjusting member (312) for fine-tuning the height of carrier plate body (31);The locking mechanism (33) is installed at the lower end surface of carrier plate body (31);S20 specific steps are as follows: S21, sensing part (311) reads and identifies the bottom of wafer box; S22, after identification confirmation, wafer box bottom is unlocked by locking mechanism (33).

3. The method of claim 2, wherein The locking mechanism (33) includes locking base (332) for installing locking rod (32), locking drive (331) for driving locking base (332), and locking sensor (333) for detecting that locking base (332) moves in place.

4. The method of claim 1, wherein The specific steps of S30 are as follows: S31, the cover mechanism (44) of the wafer box top is grabbed and fixed; S32, the lifting assembly drives the lifting backboard (43) to drive the bellow side plate (42); S33, the wafer box and wafer state detection are carried out by the wafer box state sensor (47) and wafer protrusion sensor (48) installed in the inner wall of the bellow side plate (42).

5. The method of claim 1, wherein The lifting assembly comprises a lifting drive (51), a transmission wheel set (52) driven by the lifting drive (51), and a transmission screw rod (54) connected with the transmission wheel set (52); the lifting drive (51) and the transmission wheel set (52) are both installed in the mounting cavity in the chassis (1); the lifting backboard (43) is fixedly connected with the lifting block (53) of the transmission screw rod (54); the lifting backboard (43) and the backboard (2) are slidably connected by the lifting slide rail (55).

6. The method of claim 1, wherein The seat rim frame (411) is a split structure, the seat rim bottom plate (412) is a hollow rectangular frame, and the seat rim frame (411) is symmetrically installed on the upper end faces of two opposite edges of the seat rim bottom plate (412).

7. The method of claim 1, wherein The moving end of the lock tongue drive (441) is connected with a lock tongue pull rod (443), the end of the lock tongue pull rod (443) is provided with a lock tongue connecting rod (444) and a lock tongue induction sheet (445); one end of the lock tongue connecting rod (444) is fixedly connected with the lock tongue pull rod (443), and the other end is rotatably connected with a cover body lock tongue (446); when the cover body lock tongue (446) reaches a specified position, the lock tongue induction sheet (445) enters the induction area of the lock tongue inductor (442).

8. A wafer loading and inspection integrated device comprising a base frame (1) and a back plate (2), characterized in that, For implementing the wafer loading and detection method in any one of claims 1-7, the chassis (1) is provided with a mounting cavity, a wafer box reading platform (3) for bearing and identifying the wafer box and a detection frame mechanism (4) for detecting the wafer box and wafer are arranged in the mounting cavity; the detection frame mechanism (4) is arranged on the periphery of the wafer box reading platform (3), and the detection frame mechanism (4) is driven by the lifting assembly to perform lifting operation on the front end face of the backboard (2).

9. The wafer loading and inspection integrated device of claim 8, wherein, The inner wall of the chassis (1) is provided with a reinforcing side plate (11) and an auxiliary stand column (12).

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