Semiconductor module with inductor assembly

Abstract

The invention discloses a semiconductor module with an inductance assembly, and relates to the technical field of semiconductor chips, the semiconductor module comprises a bottom plate, a ceramic copper-clad plate is arranged on the upper portion of the bottom plate, a chip body is arranged on the upper portion of the ceramic copper-clad plate, a busbar plate is detachably connected to the upper portion of the chip body, and a driving plate is arranged between the chip body and the busbar plate. The driving board is located below the busbar board and used for controlling the chip body, and the upper end of the busbar board is detachably connected with a terminal assembly. According to the semiconductor module with the inductor assembly, the influence of instantaneous change on the power line on normal work of the chip is avoided, the inductor generates impedance to alternating current, high-frequency noise on the power line or the signal line can be effectively filtered out, the quality of the semiconductor chip can be improved, and a stable solid-state semiconductor chip interface can be formed; the cycling stability and safety of a semiconductor chip are improved, the volume expansion of an electrode material can be effectively inhibited, and the electrochemical performance can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chips, and in particular to a semiconductor module with an inductor component. Background Art

[0002] Semiconductor chips are an indispensable key component in modern electronic devices. They use the characteristics of semiconductor materials to realize various complex circuit functions. Common semiconductor materials include silicon, germanium and gallium arsenide. Silicon is the most widely used in commercial applications because of its good physical and chemical properties. The manufacturing process of semiconductor chips is very complicated, involving multiple steps such as photolithography, etching, thin film deposition, and doping. These processes need to be carried out with extremely high precision to ensure the performance and reliability of the chip. For example, the Czochralski method is often used in the modern chip manufacturing process to grow high-purity single crystal semiconductor materials.

[0003] Patent No. CN201721017823.0 discloses a low stray inductance substrate and a power semiconductor module thereof, wherein the substrate comprises a plurality of metal claddings and a plurality of power semiconductor chips mounted thereon, wherein a first power semiconductor chip is mounted on the first metal cladding; a second metal cladding is arranged beside the first metal cladding, adjacent to the first metal cladding, and connected to the first power semiconductor chip on the first metal cladding; a third metal cladding is arranged beside the first metal cladding, adjacent to the first metal cladding, and connected to the first power semiconductor chip; a second power semiconductor chip is mounted on the third metal cladding; a fourth metal cladding is arranged beside the first metal cladding, adjacent to the third metal cladding, and connected to the second power semiconductor chip. Compared with the prior art, the power semiconductor module with a low stray inductance substrate provided by the utility model has the advantages of reducing the stray inductance of the power circuit and improving the power density and operation reliability of the power module.

[0004] After searching the above patents, it was found that the semiconductor chips have the following deficiencies when in use: 1. After the semiconductor chip is powered on, the magnetic field becomes larger, causing the current to increase and the peak voltage to increase, resulting in the weakening of the stability of the current and voltage of the semiconductor chip. As a result, the instantaneous changes in the power line will affect the normal operation of the chip and reduce the chip quality; 2. The volume of the semiconductor chip will expand after power is supplied, and the expansion will reduce the electrochemical properties of the semiconductor chip, resulting in the inability of the semiconductor chip to form a stable solid interface, affecting the cycle stability and safety of the semiconductor chip.

[0005] Therefore, a novel semiconductor module with an inductor component is proposed. Summary of the invention

[0006] The object of the present invention is to provide a semiconductor module with an inductor component to solve the problems raised in the above background technology:

[0007] In order to achieve the above object, the present invention provides the following technical solutions:

[0008] A semiconductor module with an inductor assembly comprises a base plate, a ceramic copper-clad plate is arranged on the upper part of the base plate, a chip body is arranged on the upper part of the ceramic copper-clad plate, a busbar plate is detachably connected to the upper part of the chip body, a driving board is arranged between the chip body and the busbar plate, the driving board is located below the busbar plate, and the driving board is used to control the chip body, a terminal assembly is detachably connected to the upper end of the busbar plate, an inductor assembly is arranged above the terminal assembly, a cover plate is detachably connected to the upper part of the inductor assembly, and a plurality of connection holes passing through the upper and lower ends of the cover plate are opened.

[0009] Preferably, the inductor assembly comprises an inductor plate, the lower end of the inductor plate is detachably connected to the terminal assembly, and the upper end of the inductor plate is detachably connected to two groups of inductor elements via screws.

[0010] By adopting the above technical solution, two rows of inductor components are symmetrically distributed. The inductor components include an inductor plate and an inductor element. When the chip body is used, the stability of the current can be ensured by welding the inductor plate and the inductor element. The inductor element can convert electrical energy into magnetic energy and store it through the principle of electromagnetic induction.

[0011] Preferably, the chip body is located below the busbar plate, and the chip body is connected to the terminal assembly, and the drive board is located above the chip body, and the drive board is connected to the terminal assembly.

[0012] By adopting the above technical solution, magnetic energy can be converted back into electrical energy when the circuit needs it, so that the inductor plays an important role in the semiconductor chip.

[0013] Preferably, the doping ions of the chip body are nitrogen ions, carbon ions or phosphorus ions.

[0014] By adopting the above technical solution, the current and voltage can be stabilized to prevent instantaneous changes on the power line from affecting the normal operation of the chip. The inductor generates impedance to the AC current and can effectively filter out high-frequency noise on the power line or signal line.

[0015] Preferably, the upper surface of the chip body is provided with a surface coating, and the surface coating comprises a lithium titanate coating and a conductive polymer coating.

[0016] By adopting the above technical solution, when the semiconductor chip is used, the lithium titanate coating has a good lithium ion diffusion rate and electronic conductivity, which can effectively inhibit the volume expansion of the electrode material and improve the electrochemical performance.

[0017] Preferably, the busbar plate is provided with two layers, and the two layers of the busbar plates are detachably connected by screws.

[0018] By adopting the above technical solution, the conductive polymer coating enables the semiconductor chip to form a stable solid-state semiconductor chip interface when in use.

[0019] Preferably, the terminal assembly is metallically connected to one side of the inductor plate.

[0020] The adoption of the above technical solution helps to reduce side reactions of semiconductor chips, improve the cycle stability and safety of semiconductor chips, and has strong practicality.

[0021] Preferably, the chip body is located between the bottom plate and the busbar plate.

[0022] By adopting the above technical solution, a stable solid-state semiconductor chip interface can be formed, which helps to reduce side reactions of the semiconductor chip.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. In the present invention, an inductor component is arranged on the chip body, the inductor components are arranged in two rows, the two rows of inductor components are symmetrically distributed, the inductor component includes an inductor plate and an inductor element, and when the chip body is used, the stability of the current can be ensured by welding the inductor plate and the inductor element. The inductor element can convert electrical energy into magnetic energy and store it through the principle of electromagnetic induction, and convert the magnetic energy back into electrical energy when the circuit needs it, so that the inductor plays an important role in the semiconductor chip, which is used to stabilize the current and voltage, and avoid the instantaneous changes on the power line from affecting the normal operation of the chip. In addition, the inductor generates impedance to the alternating current, which can effectively filter out the high-frequency noise on the power line or the signal line, and improve the quality of the semiconductor chip;

[0025] 2. In the present invention, a surface coating is coated on the chip body, and the surface coating includes a lithium titanate coating and a conductive polymer coating. When the semiconductor chip is in use, the lithium titanate coating has a good lithium ion diffusion rate and electronic conductivity, can effectively inhibit the volume expansion of the electrode material and improve the electrochemical performance. The conductive polymer coating enables the semiconductor chip to form a stable solid-state semiconductor chip interface when in use, helps the semiconductor chip reduce side reactions, improves the cycle stability and safety of the semiconductor chip, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic side view of the structure of a semiconductor module with an inductor component according to the present invention;

[0027] Figure 2 It is a schematic diagram of the overall side view structure of a semiconductor module with an inductor component of the present invention;

[0028] Figure 3 The figure is a schematic diagram of the overall front view structure of a semiconductor module with an inductor component according to the present invention.

[0029] In the figure: 1. Base plate; 2. Chip body; 3. Busbar plate; 4. Terminal assembly; 51. Inductor plate; 52. Inductor element; 6. Cover plate; 7. Connection hole; 8. Ceramic copper clad plate; 9. Driver board. DETAILED DESCRIPTION

[0030] Example 1

[0031] See also Figures 1 to 3 A semiconductor module with an inductor component comprises a base plate 1, a ceramic copper-clad plate 8 is arranged on the upper part of the base plate 1, a chip body 2 is arranged on the upper part of the ceramic copper-clad plate 8, a busbar plate 3 is detachably connected to the upper part of the chip body 2, a driving board 9 is arranged between the chip body 2 and the busbar plate 3, the driving board 9 is located below the busbar plate 3, and the driving board 9 is used to control the chip body 2, a terminal assembly 4 is detachably connected to the upper end of the busbar plate 3, an inductor assembly is arranged above the terminal assembly 4, a cover plate 6 is detachably connected to the upper part of the inductor assembly, a plurality of connection holes 7 penetrating up and down are opened on the upper end of the cover plate 6, the busbar plate 3 is provided with two busbars, one busbar is set as a P-type terminal, and the other busbar is set as a P-type terminal. The busbars are configured as N-type terminals, i.e., one positive and one negative busbars, and the current directions of the two busbars are opposite, which can achieve the effect of reducing inductance. When outside the power supply, the current of busbar No. 1 3 and busbar No. 2 4 flows from the positive pole to the negative pole, while inside the power supply, the current of busbar No. 1 3 and busbar No. 2 4 flows from the negative pole back to the positive pole. The busbar plate 3 completely covers the chip body 2, and the chip body 2 is provided with several. The driving board 9 is used to control and protect each chip body 2. The connecting hole 7 includes a large circular hole and a small circular hole, wherein the diameter of the large circular hole is 6.5 cm, and the diameter of the small circular hole is 4.8 cm, and the length and width of the busbar plate 3 are 76.59±0.25 cm and 34.00±0.25 cm respectively.

[0032] The inductor assembly includes an inductor plate 51, the lower end of the inductor plate 51 is detachably connected to the terminal assembly 4, and the upper end of the inductor plate 51 is detachably connected to two groups of inductor elements 52 by screws. The two rows of inductor assemblies are symmetrically distributed. The inductor assembly includes an inductor plate 51 and an inductor element 52. When the chip body 2 is in use, the stability of the current can be ensured by welding the inductor plate 51 and the inductor element 52.

[0033] The chip body 2 is located below the busbar board 3, and the chip body 2 is connected to the terminal assembly 4. The driving board 9 is located above the chip body 2, and the driving board 9 is connected to the terminal assembly 4. The inductor element 52 can convert electrical energy into magnetic energy and store it through the principle of electromagnetic induction, and convert the magnetic energy back into electrical energy when the circuit needs it, so that the inductor element 52 plays an important role in the semiconductor chip.

[0034] The doping ions of the chip body 2 are nitrogen ions, carbon ions or phosphorus ions, which prevent instantaneous changes on the power line from affecting the normal operation of the chip, and the inductor generates impedance to the alternating current, which can effectively filter out high-frequency noise on the power line or signal line.

[0035] The steps of using the present invention are as follows: the present invention sets an inductor component on the chip body 2, and the inductor components are set in two rows, and the two rows of inductor components are symmetrically distributed. The inductor component includes an inductor plate 51 and an inductor element 52. When the chip body 2 is used, the stability of the current can be ensured by welding the inductor plate 51 and the inductor element 52. The inductor element 52 can convert electrical energy into magnetic energy and store it through the principle of electromagnetic induction, and then convert the magnetic energy into electrical energy when the circuit needs it, so that the inductor element 52 plays an important role in the semiconductor chip, and is used to stabilize the current and voltage, and prevent the instantaneous changes on the power line from affecting the normal operation of the chip. The inductor generates impedance to the alternating current, which can effectively filter out high-frequency noise on the power line or the signal line, and improve the quality of the semiconductor chip.

[0036] Example 2

[0037] See also Figures 1 to 3 A semiconductor module with an inductor component includes a base plate 1, a ceramic copper-clad plate 8 is arranged on the upper part of the base plate 1, a chip body 2 is arranged on the upper part of the ceramic copper-clad plate 8, a busbar plate 3 is detachably connected to the upper part of the chip body 2, a driving board 9 is arranged between the chip body 2 and the busbar plate 3, the driving board 9 is located below the busbar plate 3, and the driving board 9 is used to control the chip body 2, a terminal assembly 4 is detachably connected to the upper end of the busbar plate 3, an inductor component is arranged above the terminal assembly 4, a cover plate 6 is detachably connected to the upper part of the inductor component, and a plurality of connecting holes 7 penetrating up and down are opened on the upper end of the cover plate 6.

[0038] The upper surface of the chip body 2 is provided with a surface coating, which includes a lithium titanate coating and a conductive polymer coating. When the semiconductor chip is used, the lithium titanate coating has a good lithium ion diffusion rate and electronic conductivity, and can effectively inhibit the volume expansion of the electrode material and improve the electrochemical performance.

[0039] The busbar plate 3 is configured to have two layers, and the two layers of the busbar plates 3 are detachably connected by screws. The conductive polymer coating enables the semiconductor chip to form a stable solid-state semiconductor chip interface when in use.

[0040] The terminal assembly 4 is metallically connected to one side of the inductor plate 51 .

[0041] The chip body 2 is located between a base plate and a busbar plate 3, which helps the semiconductor chip reduce side reactions and improve the cycle stability and safety of the semiconductor chip.

[0042] The use steps of the present invention are as follows: The present invention, by coating a surface coating on the chip body 2, the surface coating includes a lithium titanate coating and a conductive polymer coating, wherein when the semiconductor chip is in use, the lithium titanate coating has a good lithium ion diffusion rate and electronic conductivity, can effectively inhibit the volume expansion of the electrode material and improve the electrochemical performance, and the conductive polymer coating enables the semiconductor chip to form a stable solid-state semiconductor chip interface when in use, helps the semiconductor chip to reduce side reactions, improves the cycle stability and safety of the semiconductor chip, and has strong practicality.

[0043] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor module with an inductor component, comprising a base plate (1), characterized in that: A ceramic copper-clad plate (8) is arranged on the upper part of the base plate (1), a chip body (2) is arranged on the upper part of the ceramic copper-clad plate (8), a busbar plate (3) is detachably connected to the upper part of the chip body (2), a drive board (9) is arranged between the chip body (2) and the busbar plate (3), the drive board (9) is located below the busbar plate (3), and the drive board (9) is used to control the chip body (2), a terminal assembly (4) is detachably connected to the upper end of the busbar plate (3), an inductor assembly is arranged above the terminal assembly (4), a cover plate (6) is detachably connected to the upper part of the inductor assembly, and a plurality of connection holes (7) passing through the cover plate (6) are opened at the upper end.

2. A semiconductor module with an inductor component according to claim 1, characterized in that: The inductor assembly comprises an inductor plate (51), the lower end of the inductor plate (51) is detachably connected to the terminal assembly (4), and the upper end of the inductor plate (51) is detachably connected to two groups of inductor elements (52) via screws.

3. A semiconductor module with an inductor component according to claim 1, characterized in that: The chip body (2) is located below the busbar plate (3), and the chip body (2) is connected to the terminal assembly (4); the drive board (9) is located above the chip body (2), and the drive board (9) is connected to the terminal assembly (4).

4. A semiconductor module with an inductor component according to claim 1, characterized in that: The doping ions of the chip body (2) are nitrogen ions, carbon ions or phosphorus ions.

5. The semiconductor module with an inductor component according to claim 1, characterized in that: The upper surface of the chip body (2) is provided with a surface coating, which comprises a lithium titanate coating and a conductive polymer coating.

6. A semiconductor module with an inductor component according to claim 1, characterized in that: The busbar plate (3) is arranged in two layers, and the two layers of the busbar plate (3) are detachably connected by screws.

7. The semiconductor module with an inductor component according to claim 1, characterized in that: The terminal assembly (4) is metallically connected to one side of the inductor plate (51).

8. The semiconductor module with an inductor component according to claim 1, characterized in that: The chip body (2) is located between the base plate (1) and the busbar plate (3).

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