Photoelectric sensor assembly and preparation method thereof, readout circuit structure and photoelectric structure

Abstract

The invention relates to a photoelectric sensor assembly and a preparation method thereof, a readout circuit structure and a photoelectric structure. The photoelectric sensor assembly comprises a readout circuit structure and at least one photoelectric structure. The readout circuit structure is provided with at least one readout unit, and the readout unit is provided with a first welding bump setting area; each photoelectric structure is correspondingly bonded on one readout unit to form one photoelectric sensor unit, and the photoelectric structure is provided with a second welding salient point setting area opposite to the first welding salient point setting area; in each photoelectric sensor unit, the first welding salient point setting area and the second welding salient point setting area are both provided with a plurality of primer promotion spreading areas and a plurality of non-promotion spreading areas, and the surface tension coefficient of the primer in the primer promotion spreading areas is smaller than that of the primer in the non-promotion spreading areas.

Description

Technical Field

[0001] The present application relates to the field of infrared detection technology, and in particular to a photoelectric sensor component and a preparation method thereof, a readout circuit structure and a photoelectric structure. Background Art

[0002] Microelectronic devices, such as infrared detection devices, need to bond the solder bumps of the infrared photodetector and the readout circuit unit to achieve electrical connection, and fill the gap between the two with primer after bonding. The filling effect of primer directly affects the performance of solder bumps and device resistance to external forces. Summary of the invention

[0003] The present application provides a photoelectric sensor assembly, which includes:

[0004] A readout circuit structure has a first surface and at least one readout unit, wherein the first surface of each readout unit has a first solder bump setting area located in the middle;

[0005] At least one optoelectronic structure, each optoelectronic structure is bonded to a readout unit to form a photoelectric sensor unit with the corresponding readout unit, the optoelectronic structure has a third surface, the third surface has a second solder bump setting area located in the middle and opposite to the first solder bump setting area;

[0006] Among them, in each photoelectric sensor unit, the first welding bump setting area and the second welding bump setting area are both provided with a plurality of base glue promoting spreading areas and a plurality of non-promoting spreading areas; wherein, the surface tension coefficient of the base glue in the base glue promoting spreading area is smaller than the surface tension coefficient of the base glue in the non-promoting spreading area.

[0007] In some embodiments, in each photoelectric sensor unit, the multiple base glue promoting spreading areas of the first welding bump setting area are arranged one by one opposite to the multiple base glue promoting spreading areas of the second welding bump setting area, and the multiple non-promoting spreading areas of the first welding bump setting area are arranged one by one opposite to the multiple non-promoting spreading areas of the second welding bump setting area.

[0008] In some embodiments, the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each welding bump setting area are alternately arranged in the second direction, the first welding bump setting area is provided with a plurality of first welding bumps arranged in a plurality of rows in the second direction, and the second welding bump setting area is provided with a plurality of second welding bumps corresponding to the plurality of the first welding bumps one by one;

[0009] Wherein, at least one row of first welding bumps is located in a primer-promoting spreading area, and at least one row of second welding bumps is located in a primer-promoting spreading area; or,

[0010] At least one row of first solder bumps is located in a non-promoting spreading area, and at least one row of second solder bumps is located in a non-promoting spreading area; or,

[0011] The first welding bump arrangement area is provided with a plurality of first welding bumps arranged in a plurality of rows in a second direction, and the second welding bump arrangement area is provided with a plurality of second welding bumps corresponding to the plurality of the first welding bumps one by one;

[0012] Each row of first solder bumps is located in a primer-promoting spreading area, and each row of second solder bumps is located in a primer-promoting spreading area; or,

[0013] Each row of first solder bumps is located in a non-promoting spreading area, and each row of second solder bumps is located in a non-promoting spreading area.

[0014] In some embodiments, in the second direction, the multiple base glue promoting spreading areas of each welding bump setting area are all located within the corresponding two outermost rows of welding bumps, or at least a portion of the multiple base glue promoting spreading areas of each welding bump setting area are located outside the corresponding two outermost rows of welding bumps.

[0015] In some embodiments, the multiple base glue promoting spreading areas and the multiple non-promoting spreading areas provided in each welding bump setting area are arranged alternately; the multiple base glue promoting spreading areas provided in the first welding bump setting area are arranged evenly spaced, and the multiple non-promoting spreading areas provided in the first welding bump setting area are arranged evenly spaced; the multiple base glue promoting spreading areas provided in the second welding bump setting area are arranged evenly spaced, and the multiple non-promoting spreading areas provided in the second welding bump setting area are arranged evenly spaced.

[0016] In some embodiments, the multiple primer-promoting spreading areas and the multiple non-promoting spreading areas provided in each welding bump setting area are arranged alternately; the primer-promoting spreading material is arranged on the surface of each welding bump setting area to form the multiple primer-promoting spreading areas; the area on the surface of each welding bump setting area that is arranged alternately with the multiple primer-promoting spreading areas is directly used as the multiple non-promoting spreading areas; or,

[0017] A primer promoting spreading material is disposed on the surface of each welding bump setting area to form a plurality of the primer promoting spreading areas, and an area on the surface of each welding bump setting area that is alternately arranged with the plurality of the primer promoting spreading areas is subjected to fluorination treatment or is provided with a non-promoting spreading material layer to form a plurality of the non-promoting spreading areas; or,

[0018] The surface of each welding bump setting area is fluorinated or provided with a non-promoting spreading material layer to form a plurality of the non-promoting spreading areas, and the area on the surface of each welding bump setting area that alternates with the plurality of the non-promoting spreading areas directly serves as the primer promoting spreading area.

[0019] In some embodiments, the primer-promoting spreading area is formed by a primer-promoting spreading material, and the primer-promoting spreading material is a metal, a metal oxide or a nano-heterogeneous structure material;

[0020] When the non-spreading-promoting area is formed by a non-spreading-promoting material layer, the non-spreading-promoting material layer is a fluorinated layer.

[0021] In some embodiments, the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each of the first welding bump setting areas are arranged alternately in the second direction, the first welding bump setting area is provided with a plurality of first welding bumps arranged in a plurality of rows in the second direction, and the second welding bump setting area is provided with a plurality of second welding bumps corresponding one-to-one to the plurality of the first welding bumps;

[0022] In the direction in which the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas are alternately spaced, the width of the non-promoting spreading area in each welding bump arrangement area is a first width W0, and the spacing between two adjacent rows of welding bumps is a first spacing D0, wherein the first width W0 and the first spacing D0 have the following relationship:

[0023] W0=(1 / 8-1 / 5)D0.

[0024] In some embodiments, the first surface of each readout unit has a first peripheral region located outside the first solder bump arrangement region, and the third surface of each optoelectronic structure has a second peripheral region located outside the second solder bump arrangement region and opposite to the first peripheral region;

[0025] In each photoelectric sensor unit, a protruding structure is provided between the photoelectric structure and the corresponding readout unit and is located on opposite sides of the first welding bump setting area and the second welding bump setting area. The protruding structure is provided on at least one of the first peripheral area and the second peripheral area and is in a strip shape; and the strip-shaped protruding structure is adjacent to the bottom glue promoting spreading area located in the inner bump setting area thereof.

[0026] In some embodiments, the first surface has a glue application area located at one end of the first welding bump setting area in the first direction, and each welding bump setting area is provided with a plurality of the base glue promoting spreading areas and a plurality of the non-promoting spreading areas which are alternately arranged in the second direction; the first direction is perpendicular to the second direction.

[0027] The present application further provides a method for preparing a photoelectric sensor assembly, which comprises:

[0028] A readout circuit structure is provided, wherein the readout circuit structure has a first surface and at least one readout unit, and the first surface of each readout unit has a first solder bump setting area located in the middle;

[0029] At least one optoelectronic structure is provided, and each optoelectronic structure is bonded to a readout unit to form an intermediate optoelectronic sensor assembly having a plurality of optoelectronic sensor units, each optoelectronic sensor unit includes an optoelectronic structure and a corresponding readout unit; the optoelectronic structure has a third surface, and the third surface has a second solder bump setting area located in the middle and opposite to the first solder bump setting area;

[0030] Wherein, in each photoelectric sensor unit, the first solder bump setting area and the second solder bump setting area are both provided with a plurality of primer-promoting spreading areas and a plurality of non-promoting spreading areas; wherein the surface tension coefficient of the primer in the primer-promoting spreading area is less than the surface tension coefficient of the primer in the non-promoting spreading area;

[0031] A primer is filled between the readout circuit structure and the optoelectronic structure.

[0032] In some embodiments, the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each solder bump setting area are alternately arranged in the second direction, the first surface has a glue application area located at one end of the first solder bump setting area in the first direction, and the filling of the primer between the readout circuit structure and the optoelectronic structure includes:

[0033] Applying primer to each of the glue application areas of the middle photoelectric sensor assembly at room temperature;

[0034] Placing the intermediate photoelectric sensor assembly with the primer applied thereto in a vacuum environment, and preliminarily heating it to a first temperature, so that the primer spreads in the spacing space between the readout circuit structure and the photoelectric structure;

[0035] Continue heating to a second temperature to solidify the primer.

[0036] In some embodiments, when the intermediate photoelectric sensor assembly with the primer applied thereto is placed in a vacuum environment and preliminarily heated to a first temperature so that the primer spreads in the spacing space between the readout circuit structure and the photoelectric structure, the method further comprises:

[0037] The end of the middle photoelectric sensor assembly facing away from the glue application area is tilted downward at a preset angle.

[0038] The present application further provides a readout circuit structure, the readout circuit structure having a first surface and comprising at least one readout unit;

[0039] The read-out unit has a first welding bump setting area located in the middle, and the first welding bump setting area is provided with a plurality of base glue promoting spreading areas and a plurality of non-promoting spreading areas; wherein the surface tension coefficient of the base glue in the base glue promoting spreading area is smaller than the surface tension coefficient of the base glue in the non-promoting spreading area.

[0040] In some embodiments, the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each of the first welding bump setting areas are arranged alternately in the second direction, and the first welding bump setting area is provided with a plurality of first welding bumps arranged in a plurality of rows in the second direction;

[0041] At least one row of solder bumps is located in a primer-promoting spreading area; or,

[0042] At least one row of first solder bumps is located in a non-spreading promoting area; or,

[0043] The first solder bump of each row is located in a primer spreading promotion area; or,

[0044] The first solder bump in each row is located in a non-spreading promoting area.

[0045] In some embodiments, in the second direction, the plurality of said base glue promoting spreading areas are all located within the corresponding two outermost rows of first welding bumps, or at least a portion of the plurality of said base glue promoting spreading areas are located outside the corresponding two outermost rows of first welding bumps.

[0046] In some embodiments, the multiple base glue promoting spreading areas and the multiple non-promoting spreading areas provided in each first welding bump setting area are arranged alternately; the multiple base glue promoting spreading areas provided in the first welding bump setting area are arranged evenly spaced, and the multiple non-promoting spreading areas provided in the first welding bump setting area are arranged evenly spaced.

[0047] In some embodiments, the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each first welding bump setting area are arranged alternately; a primer-promoting spreading material is provided on the surface of each first welding bump setting area to form a plurality of primer-promoting spreading areas; an area on the surface of each first welding bump setting area that is arranged alternately with the plurality of primer-promoting spreading areas is directly used as a plurality of non-promoting spreading areas; or,

[0048] A primer promoting spreading material is disposed on the surface of each first welding bump setting area to form a plurality of primer promoting spreading areas, and an area on the surface of each first welding bump setting area that is alternately arranged with the plurality of primer promoting spreading areas is subjected to fluorination treatment or is provided with a non-promoting spreading material layer to form a plurality of non-promoting spreading areas; or,

[0049] The surface of each first welding bump setting area is fluorinated or provided with a non-promoting spreading material layer to form a plurality of said non-promoting spreading areas, and the area alternating with the plurality of said non-promoting spreading areas in the surface of each first welding bump setting area is directly used as the said primer promoting spreading area; wherein,

[0050] The base glue promoting spreading area is formed by a base glue promoting spreading material, and the base glue promoting spreading material is a metal, a metal oxide or a nano heterogeneous structure material;

[0051] When the non-spreading-promoting area is formed by a non-spreading-promoting material layer, the non-spreading-promoting material layer is a fluorinated layer.

[0052] In some embodiments, the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each of the first welding bump setting areas are arranged alternately in the second direction, and the first welding bump setting area is provided with a plurality of first welding bumps arranged in a plurality of rows in the second direction;

[0053] In the direction in which the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas are alternately spaced, the width of the non-promoting spreading area in the first welding bump arrangement area is a first width W0, and the spacing between two adjacent rows of first welding bumps is a first spacing D0, wherein the first width W0 and the first spacing D0 have the following relationship:

[0054] W0=(1 / 8-1 / 5)D0.

[0055] In some embodiments, the front surface of each readout unit has a first peripheral area located outside the first solder bump arrangement area;

[0056] The first peripheral area is provided with a protruding structure located at least on one side of the first welding bump setting area, the protruding structure is strip-shaped, and the strip-shaped protruding structure is adjacent to the bottom glue promoting spreading area located in the first bump setting area inside the strip-shaped protruding structure.

[0057] In some embodiments, the first surface has a glue application area located at one end of the first welding bump setting area in the first direction, and each welding bump setting area is provided with a plurality of the base glue promoting spreading areas and a plurality of the non-promoting spreading areas which are alternately arranged in the second direction; the first direction is perpendicular to the second direction.

[0058] The present application further provides a photoelectric structure, which has a third surface, and the photoelectric structure has a second welding bump setting area located in the middle, and the second welding bump setting area is provided with a plurality of primer-promoting spreading areas and a plurality of non-promoting spreading areas; wherein the surface tension coefficient of the primer in the primer-promoting spreading area is less than the surface tension coefficient of the primer in the non-promoting spreading area.

[0059] In some embodiments, the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each second welding bump setting area are arranged alternately in the second direction, and the second welding bump setting area is provided with a plurality of second welding bumps arranged in multiple rows in the second direction;

[0060] At least one row of solder bumps is located in a primer spreading promotion area; or,

[0061] At least one row of first solder bumps is located in a non-spreading promoting area; or,

[0062] Each row of second solder bumps is located in a primer-promoting spreading area; or,

[0063] Each row of second solder bumps is located in a non-spreading promoting area.

[0064] In some embodiments, in the second direction, the plurality of primer-promoting spreading areas are all located within the corresponding two outermost rows of welding bumps, or at least a portion of the plurality of primer-promoting spreading areas are located outside the corresponding two outermost rows of welding bumps.

[0065] In some embodiments, the multiple base glue promoting spreading areas and the multiple non-promoting spreading areas provided in each second welding bump setting area are arranged alternately; the multiple base glue promoting spreading areas provided in the second welding bump setting area are arranged evenly spaced, and the multiple non-promoting spreading areas provided in the second welding bump setting area are arranged evenly spaced.

[0066] In some embodiments, each second welding bump setting area is provided with a plurality of said primer-promoting spreading areas and a plurality of said non-promoting spreading areas which are arranged alternately; a primer-promoting spreading material is arranged on the surface of the second welding bump setting area to form a plurality of said primer-promoting spreading areas; an area on the surface of the second welding bump setting area which is arranged alternately with the plurality of said primer-promoting spreading areas is directly used as a plurality of said non-promoting spreading areas; or,

[0067] A primer promoting spreading material is disposed on the surface of the second welding bump setting area to form a plurality of the primer promoting spreading areas, and an area on the surface of the second welding bump setting area that is alternately arranged with the plurality of the primer promoting spreading areas is subjected to fluorination treatment or is provided with a non-promoting spreading material layer to form a plurality of the non-promoting spreading areas; or,

[0068] The surface of the second welding bump setting area is subjected to fluorination treatment or provided with a non-promoting spreading material layer to form a plurality of the non-promoting spreading areas, and the area on the surface of the second welding bump setting area alternating with the plurality of the non-promoting spreading areas is directly used as the primer promoting spreading area; wherein,

[0069] The base glue promoting spreading area is formed by a base glue promoting spreading material, and the base glue promoting spreading material is a metal, a metal oxide or a nano heterogeneous structure material;

[0070] When the non-spreading-promoting area is formed by a non-spreading-promoting material layer, the non-spreading-promoting material layer is a fluorinated layer.

[0071] In some embodiments, the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each second welding bump setting area are arranged alternately in the second direction, and the second welding bump setting area is provided with a plurality of second welding bumps arranged in multiple rows in the second direction;

[0072] In the direction in which the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas are alternately spaced, the width of the non-promoting spreading area in the second welding bump arrangement area is a first width W0, and the spacing between two adjacent rows of second welding bumps is a first spacing D0, wherein the first width W0 and the first spacing D0 have the following relationship:

[0073] W0=(1 / 8-1 / 5)D0.

[0074] In some embodiments, the third surface of the optoelectronic structure has a second peripheral region located outside the second solder bump placement region;

[0075] The second peripheral area is provided with a protruding structure located at least on one side of the second welding bump setting area, the protruding structure is strip-shaped, and the strip-shaped protruding structure is adjacent to the bottom glue promoting spreading area located in the first bump setting area inside the strip-shaped protruding structure.

[0076] The photoelectric sensor assembly provided in the embodiment of the present application, by setting alternately arranged primer spreading promotion areas and non-promoting spreading areas in the readout circuit structure and the photoelectric structure, when filling the primer, the primer can be spread more evenly in the welding bump setting area toward the end away from the primer, which can effectively avoid the occurrence of bubbles in the primer due to too fast spreading speed in the edge area during primer filling, thereby improving the primer filling effect.

[0077] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0079] Figure 1 A top view of a photoelectric sensor assembly provided in one embodiment of the present application;

[0080] Figure 2 For along Figure 1 The cross-sectional view taken along line AA' is shown;

[0081] Figure 3 For along Figure 1 A cross-sectional view taken along the section line BB' shown;

[0082] Figure 4 A cross-sectional view of an intermediate photoelectric sensor assembly provided by an embodiment of the present application;

[0083] Figure 5 Another cross-sectional view of an intermediate photoelectric sensor assembly provided by one embodiment of the present application;

[0084] Figure 6 A top view of a readout circuit structure provided in one embodiment of the present application;

[0085] Figure 7 A top view of a photoelectric structure provided in one embodiment of the present application;

[0086] Figure 8 A cross-sectional view of another photoelectric sensor assembly provided by an embodiment of the present application;

[0087] Fig. 9 A cross-sectional view of another intermediate photoelectric sensor assembly provided by an embodiment of the present application;

[0088] Fig.10 A top view of another readout circuit structure provided in an embodiment of the present application;

[0089] Fig.11 A cross-sectional view of another photoelectric sensor assembly provided by an embodiment of the present application;

[0090] Fig.12 A top view of another readout circuit structure provided in an embodiment of the present application;

[0091] Fig.13 A top view of another readout circuit structure provided in an embodiment of the present application;

[0092] Fig.14 A cross-sectional view of another photoelectric sensor assembly provided in one embodiment of the present application;

[0093] Fig.15 A cross-sectional view of another photoelectric sensor assembly provided in one embodiment of the present application;

[0094] Fig.16 A top view of another readout circuit structure provided by an embodiment of the present application;

[0095] Fig.17 A method flow chart of a method for preparing a photoelectric sensor assembly provided in one embodiment of the present application;

[0096] Figures 18 to 24 A preparation process diagram of a method for preparing a photoelectric sensor component provided in one embodiment of the present application. DETAILED DESCRIPTION

[0097] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0098] The present application provides a photoelectric sensor assembly, which includes a readout circuit structure and at least one photoelectric structure. The readout circuit structure has a first surface and at least one readout unit, and the first surface of each readout unit has a first solder bump setting area located in the middle; each photoelectric structure is bonded to a readout unit, and forms a photoelectric sensor unit with the corresponding readout unit, and the photoelectric structure has a third surface, and the third surface has a second solder bump setting area located in the middle and opposite to the first solder bump setting area; wherein, in each photoelectric sensor unit, the first solder bump setting area and the second solder bump setting area are both provided with a plurality of primer-promoting spreading areas and a plurality of non-promoting spreading areas; wherein, the surface tension coefficient of the primer in the primer-promoting spreading area is less than the surface tension coefficient of the primer in the non-promoting spreading area. The above-mentioned photoelectric sensor component, by arranging alternately arranged primer spreading promotion areas and non-promoting spreading areas in the readout circuit structure and the photoelectric structure, can spread the primer more evenly in the welding bump setting area toward the end away from the primer when filling the primer, which can effectively avoid the occurrence of bubbles in the primer due to too fast spreading speed in the edge area during primer filling, thereby improving the primer filling effect.

[0099] The following is combined with Figures 1 to 24The photoelectric sensor assembly and its preparation method, readout circuit structure and photoelectric structure provided in the present application are described in detail.

[0100] First, please refer to Figure 1 , and when necessary, combine Figures 2 to 16 As shown, the present application provides a photoelectric sensor assembly 1000 , which includes a photoelectric sensor assembly having a readout circuit structure 1 and at least one photoelectric structure 20 , and a primer 30 filled between the readout circuit structure 1 and the photoelectric structure 20 .

[0101] The readout circuit structure 1 has a first body 11, a first surface S1 and a second surface S2 which are opposite to each other, and at least one readout unit 10. The first surface S1 of each readout unit 10 has a first solder bump arrangement area Q1 in the middle.

[0102] At least one optoelectronic structure 20, each optoelectronic structure 20 is bonded to a readout unit 10, and forms an optoelectronic sensor unit with the corresponding readout unit 10. The optoelectronic structure 20 has a third surface S3 and a fourth surface S4 that are separated from each other, and the third surface S3 has a second solder bump setting area Q3 located in the middle and opposite to the first solder bump setting area Q1.

[0103] In each photoelectric sensor unit, the first solder bump setting area Q1 is provided with a plurality of primer-promoting spreading areas 104 and a plurality of non-promoting spreading areas 105, and the second solder bump setting area Q3 is provided with a plurality of primer-promoting spreading areas 204 and a plurality of non-promoting spreading areas 205. The surface tension coefficient of the primer in the primer-promoting spreading areas 104 and 204 is less than the surface tension coefficient of the primer in the non-promoting spreading areas 105 and 205.

[0104] The plurality of the primer-promoting spreading areas 104 and the plurality of the non-promoting spreading areas 105 may be arranged alternately, and the plurality of the primer-promoting spreading areas 204 and the plurality of the non-promoting spreading areas 205 may be arranged alternately.

[0105] The plurality of primer-promoting spreading areas 104, 204 and the plurality of non-promoting spreading areas 105, 205 all extend along the first direction L. The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each solder bump setting area may be arranged alternately in the second direction W. That is, the plurality of primer-promoting spreading areas 104 and the plurality of non-promoting spreading areas 105 are arranged alternately in the second direction W, and the plurality of primer-promoting spreading areas 204 and the plurality of non-promoting spreading areas 205 are arranged alternately in the second direction W.

[0106] In some embodiments, in each photoelectric sensor unit, the multiple base glue promoting spreading areas 104 of the first welding bump setting area Q1 are arranged opposite to the multiple base glue promoting spreading areas 204 of the second welding bump setting area Q3, and the multiple non-promoting spreading areas 105 of the first welding bump setting area Q1 are arranged opposite to the multiple non-promoting spreading areas 205 of the second welding bump setting area Q3.

[0107] It can be understood that in some other embodiments, the multiple base glue promoting spreading areas 104 of the first welding bump setting area Q1 and the multiple base glue promoting spreading areas 204 of the second welding bump setting area Q3 may not be arranged one by one to face each other, and the multiple non-promoting spreading areas 105 of the first welding bump setting area Q1 and the multiple non-promoting spreading areas 205 of the second welding bump setting area Q3 may not be arranged one by one to face each other.

[0108] In some embodiments, the intermediate photoelectric sensor assembly 100 formed by bonding the photoelectric structure 20 to the corresponding readout unit 10 may be an intermediate photoelectric sensor assembly, and the corresponding photoelectric sensor assembly 1000 may be formed when the primer 30 is filled in the intermediate photoelectric sensor assembly 100. In the intermediate photoelectric sensor assembly 100, the width direction W1 of the readout circuit structure 1 is consistent with the width direction W2 of the photoelectric structure 20, and the width directions of the two are also consistent with the second direction W of the photoelectric sensor assembly 1000 and the intermediate photoelectric sensor assembly 100. The length direction L1 of the readout circuit structure 1 is consistent with the length direction L2 of the photoelectric structure 20, and the length directions of the two are also consistent with the first direction L of the photoelectric sensor assembly 1000 and the intermediate photoelectric sensor assembly 100. In some other embodiments, W1 and W2 may also be the length directions of the corresponding structures, and L1 and L2 may be the width directions of the corresponding structures, respectively.

[0109] The first solder bump arrangement area Q1 is provided with a plurality of first solder bumps 12 arranged in an array. The plurality of first solder bumps 12 are arranged in a plurality of rows in the second direction W. The second solder bump arrangement area Q3 is provided with a plurality of second solder bumps 22 corresponding to the plurality of first solder bumps 12 one by one.

[0110] In some embodiments, at least one row of first solder bumps 12 is located in one primer-facilitating spreading area 104 , and at least one row of second solder bumps 22 is located in one primer-facilitating spreading area 104 .

[0111] In some other embodiments, at least one row of first solder bumps 12 is located in a non-promoting spreading area 105 , and at least one row of second solder bumps 22 is located in a non-promoting spreading area 205 .

[0112] Compared with the case where the corresponding welding bump is located in the non-promoting spreading area, when the welding bump is located in the primer-promoting spreading area, the formed primer 30 can better wrap the welding bump and has better protection and support effects.

[0113] In some embodiments, each row of first solder bumps 12 is located in a primer promoting spreading area 104, and each row of second solder bumps 22 is located in a primer promoting spreading area 204, such as Figures 11 to 13 shown.

[0114] In some other embodiments, each row of first solder bumps 12 is located in a non-promoting spreading area 105, and each row of second solder bumps 22 is located in a non-promoting spreading area 205, for example Figures 1 to 10 shown.

[0115] In some embodiments, the plurality of primer-promoting spreading areas 104 provided in the first solder bump setting area Q1 are evenly spaced, and the plurality of non-promoting spreading areas 105 provided in the first solder bump setting area Q1 are evenly spaced. That is, the distance between each adjacent two primer-promoting spreading areas 104 is equal. The plurality of primer-promoting spreading areas 204 provided in the second solder bump setting area Q3 are evenly spaced, and the plurality of non-promoting spreading areas 205 provided in the second solder bump setting area Q3 are evenly spaced, which is further conducive to uniform spreading of the primer, that is, the distance between each adjacent two primer-promoting spreading areas 104 is equal.

[0116] In some embodiments, in the direction in which the plurality of primer-promoting spreading areas 104 and the plurality of non-promoting spreading areas 105 are alternately spaced, the plurality of primer-promoting spreading areas 104 of each first solder bump placement area Q1 are all located within the corresponding two outermost rows of solder bumps, or at least a portion of the plurality of primer-promoting spreading areas 104 of each first solder bump placement area Q1 are located outside the corresponding two outermost rows of first solder bumps 12. The arrangement of the plurality of primer-promoting spreading areas 204 and the plurality of non-promoting spreading areas 205 of the second solder bump placement area Q3 is the same.

[0117] The primer-promoting spreading area and the non-promoting spreading area having different surface tensions for the primer can be formed by treating the surface of the area corresponding to at least one of the primer-promoting spreading area and the non-promoting spreading area.

[0118] In some embodiments, the surface of each first solder bump setting area Q1 of the first surface S1 is provided with a primer promoting spreading material 15 to form a plurality of the primer promoting spreading areas 104, and the surface of the area alternately arranged with the plurality of the primer promoting spreading areas 104 is not processed but directly used as a plurality of the non-promoting spreading areas 105, for example Figure 2 shown.

[0119] In other embodiments, the surface of each first welding bump setting area Q1 in the first surface S1 is provided with a primer-promoting spreading material to form a plurality of the primer-promoting spreading areas 104, and the surface of each first welding bump setting area Q1 and the area where the plurality of primer-promoting spreading areas 104 are alternately arranged are fluorinated to form a plurality of the non-promoting spreading areas 105.

[0120] In some other embodiments, the surface of each first welding bump setting area Q1 of the first surface S1 is provided with a primer promoting spreading material 15 to form a plurality of the primer promoting spreading areas 104, and the surface of each first welding bump setting area Q1 is provided with a non-promoting spreading material layer 16 to form a plurality of the non-promoting spreading areas 105, for example Fig.14 The photoelectric sensor assembly 4000 shown in the figure can also be laid on the non-promoting spreading material layer 16 in the promoting spreading area, and the primer promoting spreading material 15 is further arranged on the surface of the non-promoting spreading material layer 16 in the promoting spreading area, so as to form alternating primer promoting spreading areas 104 and non-promoting spreading areas 105.

[0121] In addition, in other embodiments, the surface of each first welding bump setting area Q1 is fluorinated or a non-promoting spreading material layer is set to form a plurality of the non-promoting spreading areas 105, and the surface of the area alternating with the plurality of the non-promoting spreading areas in the surface of each first welding bump setting area Q1 is not treated but directly serves as the base glue promoting spreading area.

[0122] Accordingly, the spreading promotion area 204 and the non-spreading promotion area 205 of the second solder bump arrangement region are arranged in a similar manner.

[0123] For example, in some embodiments, the surface of each second welding bump setting area Q3 of the third surface S3 is set with a primer-promoting spreading material to form a plurality of primer-promoting spreading areas 204, and the areas alternately arranged with the plurality of primer-promoting spreading areas 204 serve as a plurality of non-promoting spreading areas 205.

[0124] In other embodiments, the surface of each second welding bump setting area Q3 in the third surface S3 is provided with a primer-promoting spreading material to form a plurality of the primer-promoting spreading areas 205, and the surface of each second welding bump setting area and the area where the plurality of primer-promoting spreading areas 204 are alternately arranged are fluorinated to form a plurality of the non-promoting spreading areas 205.

[0125] In some other embodiments, the surface of each second welding bump setting area Q3 of the third surface S3 is provided with a primer-promoting spreading material to form a plurality of the primer-promoting spreading areas 204, and the surface of each second welding bump setting area is provided with a non-spreading-promoting material layer 26 to form a plurality of the non-spreading-promoting areas 205.

[0126] In addition, in other embodiments, the surface of each second welding bump setting area Q3 is fluorinated or a non-promoting spreading material layer is set to form a plurality of the non-promoting spreading areas 205, and the area on the surface of each second welding bump setting area Q3 that alternates with the plurality of the non-promoting spreading areas 205 is not treated but directly serves as the base glue promoting spreading area 204.

[0127] It should be noted that, preferably, in the same photoelectric sensor assembly, all spreading-promoting zones are arranged in the same manner, and all non-spreading-promoting zones are arranged in the same manner.

[0128] In some embodiments, the primer-promoting spreading areas 104 and 204 are formed of a primer-promoting spreading material, and the primer-promoting spreading material is a metal, a metal oxide or a nano-heterostructure material.

[0129] In some embodiments, the non-spreading-promoting area 105, 205 is formed by a non-spreading-promoting material layer, and the non-spreading-promoting material layer is a fluorinated layer.

[0130] It should be noted that the surface of the area alternately arranged with the multiple base glue promoting spreading areas 104 is not processed and is directly used as the multiple non-promoting spreading areas 105. It can be understood that the area alternately arranged with the multiple base glue promoting spreading areas 104 in the first surface S1 of the read-out unit 10 is directly used as the non-promoting spreading area 105. For example, if the read-out unit 10 is made of silicon-based material, the material of the non-promoting spreading area 105 is silicon-based material.

[0131] Similarly, the surface of the area Q1 where each first welding bump is set, which alternates with the plurality of non-spreading-promoting areas, is not processed but directly serves as the base glue spreading-promoting area. This can be understood as the area S1 of the first surface S1 of the read-out unit 10 that alternates with the plurality of non-base glue spreading-promoting areas 105 being directly used as the spreading-promoting area 104. For example, if the read-out unit 10 is made of silicon-based material, the material of the spreading-promoting area 105 is silicon-based material.

[0132] The second solder bump arrangement region Q3 of the optoelectronic structure 20 is directly used as a non-promoting spreading region or a promoting spreading region.

[0133] In some embodiments, the first welding bump setting area Q1 is provided with a plurality of first welding bumps 12 arranged in a plurality of rows in the second direction, and the second welding bump setting area Q3 is provided with a plurality of second welding bumps 22 corresponding one-to-one to the plurality of first welding bumps 12 .

[0134] like Figure 6 and Fig.11As shown, in the direction in which the plurality of primer-promoting spreading areas 104 and the plurality of non-promoting spreading areas 105 are alternately spaced, the width of the non-promoting spreading area 105 in each first welding bump arrangement area Q1 is a first width W0, and the spacing between two adjacent rows of first welding bumps 12 is a first spacing D0, wherein the first width W0 and the first spacing D0 have the following relationship:

[0135] W0=(1 / 8-1 / 5)D0.

[0136] Such an arrangement can greatly improve the filling of the base glue while ensuring the structural strength of the photoelectric sensor assembly.

[0137] Correspondingly, the widths of the second welding bump 22 and the non-promoting spreading area 205 in the optoelectronic structure 20 also satisfy the above relationship.

[0138] In some embodiments, the first surface S1 of each readout unit 10 has a first peripheral area Q2 located outside the first solder bump setting area Q1, and the third surface S3 of each optoelectronic structure 20 has a second peripheral area Q4 located outside the second solder bump setting area Q3 and opposite to the first peripheral area Q2. In each photoelectric sensor unit, a convex structure located on opposite sides of the first solder bump setting area Q1 and the second solder bump setting area Q3 in the first direction L is provided between the optoelectronic structure 20 and the corresponding readout unit 10, and the convex structure is provided on at least one of the first peripheral area Q2 and the second peripheral area Q4 to prevent the readout circuit structure 1 and the optoelectronic structure 20 from being relatively tilted when the two are bonded.

[0139] Please combine Fig.15 and Fig.16 As shown, in some embodiments, the protruding structure includes two groups, and the two groups of protruding structures 13 and 14 are respectively located on opposite sides of the first welding bump setting area Q1 and the second welding bump 22 setting area Q3 in the first direction L (i.e., opposite ends in the second direction). The first peripheral area Q2 of the readout circuit 10 may also be provided with protruding structures located on opposite sides of the first welding bump setting area Q1, such as Fig.15 The second peripheral region Q4 of the optoelectronic structure 20 may also be provided with protruding structures located on opposite sides of the second welding bump setting region Q3, such as Fig.15 The raised structure 14 is shown.

[0140] Fig.15As shown, a group of protruding structures 13 and 14 located on the same side are respectively provided in the first peripheral area Q2 and the second peripheral area Q4. It can be understood that in some other embodiments, the protruding structures located on the same side can also be provided only on one of the first peripheral area Q2 and the second peripheral area Q4. The first peripheral area Q2 of the readout unit 10 can be provided with a protruding structure located on one side of the first welding bump setting area Q1. The second peripheral area Q4 of the optoelectronic structure 20 can also be provided with a protruding structure located on one side of the second welding bump setting area Q3.

[0141] In some embodiments, the protruding structures 13 and 14 are in strip shape, which can further prevent the readout circuit structure 1 and the optoelectronic structure 20 from being tilted relative to each other when they are bonded.

[0142] In some embodiments, the strip-shaped protrusion structure is adjacent to the primer spreading promotion area located in the inner protrusion setting area thereof, so as to prevent the readout circuit structure 1 and the optoelectronic structure 20 from being tilted relative to each other when they are bonded, and at the same time, it can shield the primer inside the strip-shaped protrusion structure, so that the primer can spread inside the strip-shaped protrusion structure, which is conducive to further improving the primer spreading effect. Fig.15 As shown, the strip-shaped protruding structure 13 is adjacent to the base glue promoting spreading area of ​​the first bump arrangement area Q1, and the strip-shaped protruding structure 14 is adjacent to the base glue promoting spreading area of ​​the second bump arrangement area Q3.

[0143] The material of the protrusion structure is one or more of silicon-based materials, compound materials, metals, ceramics, and organic materials.

[0144] In some embodiments, the optoelectronic structure 20 is a photodetector.

[0145] The readout circuit structure 1 is a unit structure having one readout circuit unit 10 or a wafer having a plurality of readout circuit units.

[0146] In some embodiments, an orthographic projection of the optoelectronic structure 20 on the first surface S1 falls within an orthographic projection of a corresponding readout unit on the first surface S1 .

[0147] It should be noted that, in the present application, the first direction L and the direction W are preferably perpendicular to each other. Accordingly, the length direction L1 and the width direction W1 are perpendicular to each other, and the length direction L2 and the width direction W2 are perpendicular to each other. Of course, in some other embodiments, the first direction L and the direction W may also have a non-right angle. Accordingly, the length direction L1 and the width direction W1 have a non-right angle, and the length direction L2 and the width direction W2 have a non-right angle.

[0148] In some embodiments, the cross-sectional radial dimension or width dimension of the first welding bump 12 is less than or equal to 10 μm, such as 10 μm, 9 μm, 8 μm, 5 μm, etc. The cross-sectional dimension and shape of the second welding bump 22 are the same as those of the first welding bump 12 .

[0149] In some embodiments, the distance between adjacent first welding bumps 12 is less than or equal to 20 μm, such as 20 μm, 18 μm, 15 μm, 13 μm, 10 μm, etc.

[0150] In some embodiments, the first surface S1 has a glue application region 1001 located at one end of the first solder bump placement region Q1 in the first direction L.

[0151] Please combine Figure 6 , Fig.10 , Fig.12 and Fig.13 As shown, in some embodiments, the gluing area 1001 extends along the second direction W.

[0152] Preferably, the extension direction of the first gluing area 1001 is perpendicular to the extension direction of the plurality of primer-promoting spreading areas 204 and the plurality of primer-non-promoting spreading areas 205 .

[0153] In some embodiments, the glue application area 1001 is opposite to the first welding bump setting area Q1, that is, the center of the glue application area 1001 in the second direction W is opposite to the center of the first welding bump setting area Q1 in the second direction.

[0154] In some embodiments, the length l1 of the readout unit 10 corresponding to the gluing area 1001 in the length direction L of the gluing area and the length l2 of the gluing area have the following relationship: 1 / 2l1≤l2≤2 / 3l1.

[0155] Optionally, the length l1 of the readout unit 10 corresponding to the glue application area 1001 in the length direction L of the glue application area 1001 may be equal to the spanning length of the first welding bump 12 and the second welding bump of the array in this direction.

[0156] In some embodiments, the first solder bump 12 includes a solder metal layer 121 close to the readout circuit structure body 11 and a solder layer 122 located at the solder metal layer 121 away from the readout circuit structure body 11. The solder metal layer may include a bottom layer close to the readout circuit structure body 11, an intermediate layer located at the bottom layer away from the readout circuit structure body 11, and a top metal layer located at the intermediate layer away from the readout circuit structure body 11. Among them, the bottom layer is a bonding layer, mainly including materials such as Cr and Ti, which can achieve bonding between the intermediate layer and the circuit structure in the readout circuit structure body 11. The intermediate layer is a barrier layer to prevent the top metal from diffusing into the readout circuit structure body 11. The top metal layer mainly includes materials such as Ni and Pt. The solder layer body includes materials such as Au and Ag.

[0157] The second solder bump 22 includes a solder metal layer 221 close to the optoelectronic structure body 21 and a solder layer 222 located at the solder metal layer 221 away from the optoelectronic structure body 11. The second solder bump 22 may have a similar structure to the first solder bump 12.

[0158] In some embodiments, the primer 30 is located between each set of two facing primer promoting areas.

[0159] The primer 30 may also be located between the solder metal layer 121 and the opposite solder metal layer 221 , and wrap the solder layers 122 and 222 .

[0160] Please refer to Fig.17 As shown, the present application further provides a method for preparing a photoelectric sensor assembly, which includes the following steps S101 and S103:

[0161] In step S101, a readout circuit structure is provided, wherein the readout circuit structure has a first surface and at least one readout unit, and the first surface of each readout unit has a first solder bump setting area located in the middle;

[0162] In step S103, at least one optoelectronic structure is provided, and each optoelectronic structure is bonded to a readout unit to form an intermediate optoelectronic sensor assembly having a plurality of optoelectronic sensor units, each optoelectronic sensor unit including an optoelectronic structure and a corresponding readout unit; the optoelectronic structure has a third surface, and the third surface has a second solder bump setting area located in the middle and opposite to the first solder bump setting area;

[0163] Wherein, in each photoelectric sensor unit, the first solder bump setting area and the second solder bump setting area are both provided with a plurality of primer-promoting spreading areas and a plurality of non-promoting spreading areas, and the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each solder bump setting area are arranged alternately, wherein the surface tension coefficient of the primer in the primer-promoting spreading area is less than the surface tension coefficient of the primer in the non-promoting spreading area;

[0164] In step S105, a primer is filled between the readout circuit structure and the photoelectric structure to form a photoelectric sensor assembly.

[0165] Combine the following Figures 18 to 24 As shown, the preparation method of the photoelectric sensor component is described.

[0166] like Fig.18 In step S101, a readout circuit structure 1 is provided, wherein the readout circuit structure 1 has a first surface S1 and a second surface S2 which are opposite to each other, and has at least one readout unit 10, and the first surface S1 of each readout unit 10 has a first welding bump setting area Q1 located in the middle.

[0167] like Figures 19 to 21 In step S103, at least one optoelectronic structure 20 is provided, and each optoelectronic structure 20 is bonded to a readout unit 10 to form an intermediate optoelectronic sensor assembly 100 having a plurality of sensor units, wherein the optoelectronic structure 20 has a third surface S3 and a fourth surface S4 which are opposite to each other, and the third surface S3 has a second solder bump 22 arrangement area Q3 located in the middle and opposite to the first solder bump arrangement area Q1;

[0168] In each photoelectric sensor unit, the first solder bump setting area Q1 is provided with a plurality of primer-promoting spreading areas 104 and a plurality of non-promoting spreading areas 105. The second solder bump setting area Q3 is provided with a plurality of primer-promoting spreading areas 204 and a plurality of non-promoting spreading areas 205, the plurality of primer-promoting spreading areas 104 and the plurality of non-promoting spreading areas 105 are arranged alternately, and the plurality of primer-promoting spreading areas 204 and the plurality of non-promoting spreading areas 205 are arranged alternately. The surface tension coefficient of the primer in the primer-promoting spreading areas 104 and 204 is less than the surface tension coefficient of the primer in the non-promoting spreading areas 105 and 205.

[0169] In some embodiments, the plurality of base glue promoting spreading areas 104, 204 and the plurality of non-promoting spreading areas 105, 205 all extend along the first direction L, and the plurality of base glue promoting spreading areas 104 and the plurality of non-promoting spreading areas 105 are alternately arranged at intervals in the second direction W, and the plurality of base glue promoting spreading areas 204 and the plurality of non-promoting spreading areas 205 are alternately arranged at intervals in the second direction W.

[0170] In some embodiments, the multiple base glue promoting spreading areas 104 of the first welding bump setting area Q1 are arranged opposite to the multiple base glue promoting spreading areas 204 of the second welding bump setting area Q3, and the multiple non-promoting spreading areas 105 of the first welding bump setting area Q1 are arranged opposite to the multiple non-promoting spreading areas 205 of the second welding bump setting area Q3.

[0171] In some embodiments, in step S103, before each optoelectronic structure 20 is bonded to a readout unit 10, an intermediate optoelectronic sensor assembly, such as the intermediate optoelectronic sensor assembly 100, may be formed first. Accordingly, after each optoelectronic structure 20 is bonded to a readout unit 10, the method includes the following step S105:

[0172] In step S105 , a primer 30 is filled between the readout circuit structure 1 and the optoelectronic structure 20 .

[0173] In some embodiments, the first surface has a glue application region 1001 located at one end of the first solder bump placement region Q1 in the first direction. The glue application region 1001 may extend along the second direction.

[0174] Combination Fig. 22 and Fig.23 As shown, step S105 of filling the primer 30 in the gap between the readout circuit structure 1 and the optoelectronic structure 20 may specifically include the following steps S1051 to S1053:

[0175] In step S1051 , at room temperature, a primer 30 ′ is applied to each of the glue application areas 1001 of the intermediate photosensor assembly 100 .

[0176] In step S1052 , the intermediate photoelectric sensor assembly 100 with the primer 30 ′ applied thereto is placed in a vacuum environment and preliminarily heated to a first temperature so that the primer 30 ′ spreads in the spacing space between the readout circuit structure 1 and the photoelectric structure 20 .

[0177] Specifically, the primer 30 ′ is located between each group of two facing primer promotion areas.

[0178] The primer 30 ′ may also be located between the solder metal layer 121 and the opposite solder metal layer 221 , and wrap the solder layers 122 and 222 .

[0179] In some embodiments, the first temperature is 50 degrees Celsius to 70 degrees Celsius, and the initial addition time may be about 30 minutes. The vacuum environment of step S1052 may be a chamber of a vacuum oven.

[0180] The first temperature is lower than the curing temperature of the primer and lower than the viscosity inflection point temperature of the primer.

[0181] In step S1053, heating is continued to the second temperature so that the primer is cured.

[0182] The second temperature is 100 degrees Celsius to 130 degrees Celsius, and the duration of the second temperature (ie, the curing duration) is approximately 30 minutes. The step S1053 can continue to be performed in the vacuum environment provided by the vacuum oven.

[0183] The second temperature may be a curing temperature of the primer, or may be greater than a curing temperature of the primer.

[0184] This implementation method is beneficial to improving the efficiency of primer filling.

[0185] Of course, in some other embodiments, the primer spreading and primer curing can also be performed at room temperature.

[0186] Please combine Fig. 20 As shown, in some embodiments, in step S1052, when the intermediate photoelectric sensor assembly 100 with the primer applied thereto is placed in a vacuum environment and preliminarily heated to a first temperature so that the primer fills the spacing space between the readout circuit structure 1 and the photoelectric structure 20, the method further includes:

[0187] The end of the middle photoelectric sensor assembly 100 with the primer 30 ′ facing away from the glue application area is tilted downward at a preset angle to help increase the speed of primer laying and improve the primer filling efficiency.

[0188] here Figures 18 to 24 A readout circuit structure and a photoelectric structure are used as an example for explanation. The preparation of other similar photoelectric sensor components can refer to the above-mentioned related steps and be prepared by similar preparation methods.

[0189] It should be noted that when the readout circuit structure 1 of the above-mentioned photoelectric sensor assembly has one readout unit 10, the photoelectric sensor assembly is a photoelectric sensor having one photoelectric sensor unit. When the above-mentioned photoelectric sensor assembly has multiple readout units, the photoelectric sensor assembly is a photoelectric sensor wafer having multiple photoelectric sensor units. The photoelectric sensor wafer can be cut into a photoelectric sensor having one photoelectric sensor unit.

[0190] In the present application, the structural embodiments and method embodiments may complement each other if they do not conflict.

[0191] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The terms "plurality" and "several" refer to two or more than two, unless otherwise clearly defined.

[0192] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0193] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A photoelectric sensor assembly, characterized in that: include: A readout circuit structure has a first surface and at least one readout unit, wherein the first surface of each readout unit has a first solder bump setting area located in the middle; At least one optoelectronic structure, each optoelectronic structure is bonded to a readout unit to form a photoelectric sensor unit with the corresponding readout unit, the optoelectronic structure has a third surface, the third surface has a second solder bump setting area located in the middle and opposite to the first solder bump setting area; Among them, in each photoelectric sensor unit, the first welding bump setting area and the second welding bump setting area are each provided with a plurality of base glue promoting spreading areas and a plurality of non-promoting spreading areas, wherein the surface tension coefficient of the base glue in the base glue promoting spreading area is smaller than the surface tension coefficient of the base glue in the non-promoting spreading area.

2. The photoelectric sensor assembly according to claim 1, characterized in that: In each photoelectric sensor unit, the multiple base glue promoting spreading areas of the first welding bump setting area are arranged one by one opposite to the multiple base glue promoting spreading areas of the second welding bump setting area, and the multiple non-promoting spreading areas of the first welding bump setting area are arranged one by one opposite to the multiple non-promoting spreading areas of the second welding bump setting area.

3. The photoelectric sensor assembly according to claim 1 or 2, characterized in that: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each welding bump setting area are alternately arranged in the second direction, the first welding bump setting area is provided with a plurality of first welding bumps arranged in a plurality of rows in the second direction, and the second welding bump setting area is provided with a plurality of second welding bumps corresponding to the plurality of the first welding bumps one by one; Wherein, at least one row of first welding bumps is located in a primer-promoting spreading area, and at least one row of second welding bumps is located in a primer-promoting spreading area; or, At least one row of first solder bumps is located in a non-promoting spreading area, and at least one row of second solder bumps is located in a non-promoting spreading area; or, Each row of first solder bumps is located in a primer-promoting spreading area, and each row of second solder bumps is located in a primer-promoting spreading area; or, Each row of first solder bumps is located in a non-promoting spreading area, and each row of second solder bumps is located in a non-promoting spreading area.

4. The photoelectric sensor assembly according to claim 3, characterized in that: In the second direction, the multiple base glue promoting spreading areas of each welding bump setting area are all located within the corresponding two outermost rows of welding bumps, or at least a portion of the multiple base glue promoting spreading areas of each welding bump setting area are located outside the corresponding two outermost rows of welding bumps.

5. The photoelectric sensor assembly according to claim 1, characterized in that: The multiple base glue promoting spreading areas and the multiple non-promoting spreading areas provided in each welding bump setting area are arranged alternately; the multiple base glue promoting spreading areas provided in the first welding bump setting area are arranged evenly spaced, and the multiple non-promoting spreading areas provided in the first welding bump setting area are arranged evenly spaced in the second direction; the multiple base glue promoting spreading areas provided in the second welding bump setting area are arranged evenly spaced, and the multiple non-promoting spreading areas provided in the second welding bump setting area are arranged evenly spaced in the second direction.

6. The photoelectric sensor assembly according to claim 1, characterized in that: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each solder bump setting area are arranged alternately; the surface of each solder bump setting area is provided with a primer-promoting spreading material to form a plurality of primer-promoting spreading areas; The areas on the surface of each solder bump setting area that are alternately arranged with the plurality of primer-promoting spreading areas are directly used as the plurality of non-promoting spreading areas; or, A primer promoting spreading material is disposed on the surface of each welding bump setting area to form a plurality of the primer promoting spreading areas, and an area on the surface of each welding bump setting area that is alternately arranged with the plurality of the primer promoting spreading areas is subjected to fluorination treatment or is provided with a non-promoting spreading material layer to form a plurality of the non-promoting spreading areas; or, The surface of each welding bump setting area is fluorinated or provided with a non-promoting spreading material layer to form a plurality of the non-promoting spreading areas, and the area on the surface of each welding bump setting area that alternates with the plurality of the non-promoting spreading areas directly serves as the primer promoting spreading area.

7. The photoelectric sensor assembly according to claim 6, characterized in that: The base glue promoting spreading area is formed by a base glue promoting spreading material, and the base glue promoting spreading material is a metal, a metal oxide or a nano heterogeneous structure material; When the non-spreading-promoting area is formed by a non-spreading-promoting material layer, the non-spreading-promoting material layer is a fluorinated layer.

8. The photoelectric sensor assembly according to claim 1, characterized in that: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each of the first welding bump setting areas are alternately arranged in the second direction, the first welding bump setting area is provided with a plurality of first welding bumps arranged in a plurality of rows in the second direction, and the second welding bump setting area is provided with a plurality of second welding bumps corresponding to the plurality of the first welding bumps one by one; In the direction in which the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas are alternately spaced, the width of the non-promoting spreading area in each welding bump arrangement area is a first width W0, and the spacing between two adjacent rows of welding bumps is a first spacing D0, wherein the first width W0 and the first spacing D0 have the following relationship: W0=(1 / 8-1 / 5)D0.

9. The photoelectric sensor assembly according to claim 1, characterized in that: The first surface of each readout unit has a first peripheral area located outside the first solder bump arrangement area, and the third surface of each optoelectronic structure has a second peripheral area located outside the second solder bump arrangement area and opposite to the first peripheral area; In each photoelectric sensor unit, a protruding structure is provided between the photoelectric structure and the corresponding readout unit and is located on opposite sides of the first welding bump setting area and the second welding bump setting area. The protruding structure is provided on at least one of the first peripheral area and the second peripheral area and is in a strip shape; and the strip-shaped protruding structure is adjacent to the bottom glue promoting spreading area located in the inner bump setting area thereof.

10. The photoelectric sensor assembly according to claim 1, characterized in that The first surface has a glue application area located at one end of the first welding bump setting area in the first direction, and each welding bump setting area is provided with a plurality of base glue promoting spreading areas and a plurality of non-promoting spreading areas which are alternately arranged in the second direction; the first direction is perpendicular to the second direction.

11. A method for preparing a photoelectric sensor assembly, characterized in that: include: A readout circuit structure is provided, wherein the readout circuit structure has a first surface and at least one readout unit, and the first surface of each readout unit has a first solder bump setting area located in the middle; At least one optoelectronic structure is provided, and each optoelectronic structure is bonded to a readout unit to form an intermediate optoelectronic sensor assembly having a plurality of optoelectronic sensor units, each optoelectronic sensor unit includes an optoelectronic structure and a corresponding readout unit; the optoelectronic structure has a third surface, and the third surface has a second solder bump setting area located in the middle and opposite to the first solder bump setting area; Wherein, in each photoelectric sensor unit, the first solder bump setting area and the second solder bump setting area are both provided with a plurality of primer-promoting spreading areas and a plurality of non-promoting spreading areas; wherein the surface tension coefficient of the primer in the primer-promoting spreading area is less than the surface tension coefficient of the primer in the non-promoting spreading area; A primer is filled between the readout circuit structure and the photoelectric structure to form a photoelectric sensor assembly.

12. The method for preparing a photoelectric sensor assembly according to claim 11, characterized in that: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each solder bump setting area are alternately arranged in the second direction, the first surface has a glue application area located at one end of the first solder bump setting area in the first direction, and the filling of the primer between the readout circuit structure and the optoelectronic structure includes: Applying primer to each of the glue application areas of the middle photoelectric sensor assembly at room temperature; Placing the intermediate photoelectric sensor assembly with the primer applied thereto in a vacuum environment, and preliminarily heating it to a first temperature, so that the primer spreads in the spacing space between the readout circuit structure and the photoelectric structure; Continue heating to a second temperature to solidify the primer.

13. The method for preparing a photoelectric sensor assembly according to claim 12, characterized in that: When the intermediate photoelectric sensor assembly with the primer applied thereto is placed in a vacuum environment and preliminarily heated to a first temperature so that the primer spreads in the spacing space between the readout circuit structure and the photoelectric structure, the method further comprises: The end of the middle photoelectric sensor assembly facing away from the glue application area is tilted downward at a preset angle.

14. A readout circuit structure, characterized in that: The readout circuit structure has a first surface and includes at least one readout unit; The read-out unit has a first welding bump setting area located in the middle, and the first welding bump setting area is provided with a plurality of base glue promoting spreading areas and a plurality of non-promoting spreading areas; wherein the surface tension coefficient of the base glue in the base glue promoting spreading area is smaller than the surface tension coefficient of the base glue in the non-promoting spreading area.

15. The readout circuit structure according to claim 14, characterized in that: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each of the first solder bump setting areas are alternately arranged in the second direction, and the first solder bump setting area is provided with a plurality of first solder bumps arranged in a plurality of rows in the second direction; At least one row of first solder bumps is located in a primer spreading promotion area; or, At least one row of first solder bumps is located in a non-promoting spreading area or, The first solder bump of each row is located in a primer spreading promotion area; or, The first solder bump in each row is located in a non-spreading promoting area.

16. The readout circuit structure according to claim 15, characterized in that: The multiple base glue promoting spreading areas and the multiple non-promoting spreading areas provided in each of the first welding bump setting areas are alternately arranged in the second direction. In the second direction, the multiple base glue promoting spreading areas are all located within the corresponding two outermost rows of first welding bumps, or at least a part of the multiple base glue promoting spreading areas are located outside the corresponding two outermost rows of first welding bumps.

17. The readout circuit structure according to claim 14, characterized in that: The multiple base glue promoting spreading areas and the multiple non-promoting spreading areas provided in each first welding bump setting area are arranged alternately; the multiple base glue promoting spreading areas provided in the first welding bump setting area are arranged evenly spaced, and the multiple non-promoting spreading areas provided in the first welding bump setting area are arranged evenly spaced.

18. The readout circuit structure according to claim 14, characterized in that: The multiple primer-promoting spreading areas and the multiple non-promoting spreading areas provided in each first welding bump setting area are arranged alternately; the surface of each first welding bump setting area is provided with primer-promoting spreading material to form the multiple primer-promoting spreading areas; the area on the surface of each first welding bump setting area that is arranged alternately with the multiple primer-promoting spreading areas is directly used as the multiple non-promoting spreading areas; or, A primer promoting spreading material is disposed on the surface of each first welding bump setting area to form a plurality of primer promoting spreading areas, and an area on the surface of each first welding bump setting area that is alternately arranged with the plurality of primer promoting spreading areas is subjected to fluorination treatment or is disposed with a non-promoting spreading material layer to form a plurality of non-promoting spreading areas; or, The surface of each first welding bump setting area is fluorinated or provided with a non-promoting spreading material layer to form a plurality of said non-promoting spreading areas, and the area alternating with the plurality of said non-promoting spreading areas in the surface of each first welding bump setting area is directly used as the said primer promoting spreading area; wherein, The base glue promoting spreading area is formed by a base glue promoting spreading material, and the base glue promoting spreading material is a metal, a metal oxide or a nano heterogeneous structure material; When the non-spreading-promoting area is formed by a non-spreading-promoting material layer, the non-spreading-promoting material layer is a fluorinated layer.

19. The readout circuit structure according to claim 14, characterized in that: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each of the first solder bump setting areas are alternately arranged in the second direction, and the first solder bump setting area is provided with a plurality of first solder bumps arranged in a plurality of rows in the second direction; In the direction in which the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas are alternately spaced, the width of the non-promoting spreading area in the first welding bump arrangement area is a first width W0, and the spacing between two adjacent rows of first welding bumps is a first spacing D0, wherein the first width W0 and the first spacing D0 have the following relationship: W0=(1 / 8-1 / 5)D0.

20. The readout circuit structure according to claim 14, characterized in that: The front surface of each readout unit has a first peripheral area located outside the first solder bump arrangement area; The first peripheral area is provided with a protruding structure located at least on one side of the first welding bump setting area, the protruding structure is strip-shaped, and the strip-shaped protruding structure is adjacent to the bottom glue promoting spreading area located in the first bump setting area inside the strip-shaped protruding structure.

21. The readout circuit according to claim 14, wherein: The first surface has a glue application area located at one end of the first welding bump setting area in the first direction, and each welding bump setting area is provided with a plurality of base glue promoting spreading areas and a plurality of non-promoting spreading areas which are alternately arranged in the second direction; the first direction is perpendicular to the second direction.

22. A photoelectric structure, characterized in that: The optoelectronic structure has a third surface, and the optoelectronic structure has a second welding bump setting area located in the middle, and the second welding bump setting area is provided with a plurality of primer-promoting spreading areas and a plurality of non-promoting spreading areas; wherein the surface tension coefficient of the primer in the primer-promoting spreading area is smaller than the surface tension coefficient of the primer in the non-promoting spreading area.

23. The optoelectronic structure of claim 22, wherein: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each second solder bump setting area are alternately arranged in the second direction, and the second solder bump setting area is provided with a plurality of second solder bumps arranged in a plurality of rows in the second direction; At least one row of second solder bumps is located in a primer spreading promotion area; or, At least one row of second solder bumps is located in a non-promoting spreading area; Each row of second solder bumps is located in a primer-promoting spreading area; or, Each row of second solder bumps is located in a non-spreading promoting area.

24. The optoelectronic structure of claim 23, wherein: In the second direction, the plurality of primer-promoting spreading areas are all located within the corresponding two outermost rows of welding bumps, or at least a portion of the plurality of primer-promoting spreading areas are located outside the corresponding two outermost rows of welding bumps.

25. The optoelectronic structure of claim 22, wherein: The multiple base glue promoting spreading areas and the multiple non-promoting spreading areas provided in each second welding bump setting area are arranged alternately; the multiple base glue promoting spreading areas provided in the second welding bump setting area are arranged evenly at intervals, and the multiple non-promoting spreading areas provided in the second welding bump setting area are arranged evenly at intervals.

26. The optoelectronic structure of claim 22, wherein: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each second welding bump setting area are arranged alternately; the surface of the second welding bump setting area is provided with primer-promoting spreading material to form the plurality of primer-promoting spreading areas; the area on the surface of the second welding bump setting area that is arranged alternately with the plurality of primer-promoting spreading areas is directly used as the plurality of non-promoting spreading areas; or, A primer promoting spreading material is disposed on the surface of the second welding bump setting area to form a plurality of the primer promoting spreading areas, and an area on the surface of the second welding bump setting area that is alternately arranged with the plurality of the primer promoting spreading areas is subjected to fluorination treatment or is provided with a non-promoting spreading material layer to form a plurality of the non-promoting spreading areas; or, The surface of the second welding bump setting area is subjected to fluorination treatment or provided with a non-promoting spreading material layer to form a plurality of the non-promoting spreading areas, and the area on the surface of the second welding bump setting area alternating with the plurality of the non-promoting spreading areas is directly used as the primer promoting spreading area; wherein, The base glue promoting spreading area is formed by a base glue promoting spreading material, and the base glue promoting spreading material is a metal, a metal oxide or a nano heterogeneous structure material; When the non-spreading-promoting area is formed by a non-spreading-promoting material layer, the non-spreading-promoting material layer is a fluorinated layer.

27. The optoelectronic structure of claim 22, wherein: The plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas provided in each second solder bump setting area are alternately arranged in the second direction, and the second solder bump setting area is provided with a plurality of second solder bumps arranged in a plurality of rows in the second direction; In the direction in which the plurality of primer-promoting spreading areas and the plurality of non-promoting spreading areas are alternately spaced, the width of the non-promoting spreading area in the second welding bump arrangement area is a first width W0, and the spacing between two adjacent rows of second welding bumps is a first spacing D0, wherein the first width W0 and the first spacing D0 have the following relationship: W0=(1 / 8-1 / 5)D0.

28. The optoelectronic structure of claim 22, wherein: The third surface of the optoelectronic structure has a second peripheral area located outside the second solder bump arrangement area; The second peripheral area is provided with a protruding structure located at least on one side of the second welding bump setting area, the protruding structure is strip-shaped, and the strip-shaped protruding structure is adjacent to the bottom glue promoting spreading area located in the first bump setting area inside the strip-shaped protruding structure.

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