System and method for judging cleaning of reflow oven

Abstract

The invention provides a system and a method for judging cleaning of a reflow oven. The system comprises an image acquisition device, a processing unit and a judgment unit. The image acquisition device acquires an image in the reflow oven when the reflow oven is in a closed state and stores the acquired image. An image acquisition device is conveyed through a reflow oven chamber of the reflow oven to acquire an image within the reflow oven. The image in the reflow oven includes an image of a surface of the reflow oven chamber device and / or an image of the guide rail adjustment device. The processing unit processes the stored image to acquire a cleaning condition in the reflow oven. The determination unit determines whether or not the reflow oven needs to be cleaned on the basis of the acquired cleaning condition in the reflow oven. Based on the judgment that the reflow soldering furnace needs to be cleaned, the method can prompt a user to clean the reflow soldering furnace at a proper time, so that the production efficiency of the reflow soldering furnace is improved, and the unnecessary downtime is reduced.

Description

Technical Field

[0001] The present application relates to a reflow soldering furnace, and more particularly to a system and method for judging the cleaning of the reflow soldering furnace. Background Art

[0002] In the process of making printed circuit boards, electronic components are usually mounted on the circuit board using a process called "reflow soldering". In a typical reflow soldering process, solder paste (e.g., tin paste) is deposited on a selected area on the circuit board, and the wires of one or more electronic components are inserted into the deposited solder paste. The circuit board then passes through a reflow soldering furnace, in which the solder paste is reflowed (i.e., heated to a melting or reflow temperature) in a high temperature zone of the furnace chamber of the reflow soldering furnace, and then cooled in a cooling zone of the furnace chamber to electrically and mechanically connect the wires of the electronic components to the circuit board. The term "circuit board" or "printed circuit board (PCB board)" used herein includes substrate assemblies of any type of electronic components, such as wafer substrates. In the reflow soldering furnace, air or a substantially inert gas (e.g., nitrogen) is usually used as a working gas, and different working gases are used for circuit boards with different process requirements. The furnace chamber of the reflow soldering furnace is filled with working gas, and the circuit board is soldered in the working gas when it is conveyed through the furnace chamber by a conveyor. Summary of the invention

[0003] Solder paste includes not only solder, but also flux that makes solder wet and provides good solder joints. Other additives such as solvents and catalysts may also be included. After the solder paste is printed on the circuit board, the circuit board is conveyed on a conveyor through multiple high-temperature zones of the furnace of the reflow soldering furnace. The heat in the high-temperature zone causes the solder paste to melt, and organic compounds including mainly flux containing volatile organic compounds (called "VOC") vaporize to form steam, thereby forming "pollutants". These pollutants are mixed with the working gas in the high-temperature zone to form waste gas. The accumulation of these pollutants in the furnace of the reflow soldering furnace can cause some problems. For example, when the circuit board is conveyed from the high-temperature zone to the cooling zone, the pollutants will also flow to the cooling zone, and they will condense into liquid and / or solid after cooling in the cooling zone and drip onto the circuit board to contaminate the circuit board, so that subsequent cleaning steps must be performed. In addition, condensation may also drip on subsequent circuit boards, which may damage components on the circuit board or make it necessary to perform subsequent cleaning steps on the contaminated circuit board.

[0004] The inventors have found that in the prior art, the reflow oven is cleaned by pre-arranged maintenance, however, the pre-arranged maintenance may be performed too early or too late, thereby causing undesirable downtime and reducing production efficiency.

[0005] In order to solve the above problems, the present application provides a system and method for judging the cleaning of a reflow soldering oven, which obtains an image inside the reflow soldering oven when the reflow soldering oven is in a closed state to judge the cleaning condition inside the reflow soldering oven, and then judges whether the reflow soldering oven needs to be cleaned based on the cleaning condition. The present application can prompt the user to clean and maintain the reflow soldering oven at a reasonable time, thereby improving production efficiency and reducing unnecessary downtime.

[0006] According to a first aspect of the present application, the present application provides a system for judging the cleaning of a reflow soldering furnace. The system includes an image acquisition device, a processing unit, and a judgment unit. The image acquisition device is configured to be able to acquire an image in the reflow soldering furnace when the reflow soldering furnace is in a closed state, and store the acquired image. The processing unit is configured to process the stored image to obtain a cleaning condition in the reflow soldering furnace. The judgment unit is configured to determine whether the reflow soldering furnace needs to be cleaned based on the acquired cleaning condition in the reflow soldering furnace.

[0007] According to a first aspect of the present application, a reflow oven includes a reflow oven chamber, the reflow oven chamber is configured to allow a workpiece to be transported through the reflow oven chamber and processed in the reflow oven chamber, and an image acquisition device is configured to be transported through the reflow oven chamber of the reflow oven to acquire an image within the reflow oven.

[0008] According to a first aspect of the present application, an image acquisition device is configured to be mounted to a conveyor of a reflow oven, so that the mounted image acquisition device can be transported by the conveyor through a reflow oven chamber of the reflow oven.

[0009] According to a first aspect of the present application, a reflow oven comprises a reflow oven chamber device and a reflow oven chamber. The reflow oven chamber device is configured to deliver an airflow to the reflow oven chamber to process a workpiece in the reflow oven chamber. The image within the reflow oven comprises an image of a surface of the reflow oven chamber device of the reflow oven.

[0010] According to a first aspect of the present application, a reflow oven includes a rail adjustment device. The rail adjustment device is configured to be able to adjust the width of a rail for a workpiece. An image inside the reflow oven includes an image of the rail adjustment device.

[0011] According to a first aspect of the present application, an image acquisition device includes a light source, an image acquisition unit, a controller, and a power supply. The light source is configured to illuminate the interior of a reflow oven. The image acquisition unit is configured to capture images within the reflow oven when the light source illuminates the interior of the reflow oven. The controller is configured to control the operation of the image acquisition unit and the light source so that the image acquisition unit captures images within the reflow oven and stores the images captured by the image acquisition unit. The power supply is configured to provide power to the light source, the image acquisition unit, and the controller.

[0012] According to a first aspect of the present application, the image acquisition device further includes a housing and a mounting structure. The housing is configured to accommodate a light source, an image acquisition unit, a controller, and a power supply, and to block the heat of the reflow oven outside the housing. The mounting structure is configured to support the housing and be mountable to a conveyor of the reflow oven so that the image acquisition device can be conveyed through the reflow oven by the conveyor.

[0013] According to a first aspect of the present application, the housing includes a transparent partition, which is disposed above the light source and the image acquisition unit and configured to block heat from the reflow oven from being transferred to the light source and the image acquisition unit.

[0014] According to a first aspect of the present application, the image acquisition device is an integrated device.

[0015] According to a second aspect of the present application, the present application provides a method for judging the cleaning of a reflow soldering furnace. The method comprises: when the reflow soldering furnace is in a closed state, collecting images in the reflow soldering furnace; storing the collected images; processing the stored images to obtain the cleaning status in the reflow soldering furnace; and judging whether the reflow soldering furnace needs to be cleaned based on the obtained cleaning status in the reflow soldering furnace.

[0016] According to a second aspect of the present application, a reflow oven includes a reflow oven chamber. The reflow oven chamber is configured to allow a workpiece to be transported through the reflow oven chamber and processed in the reflow oven chamber. Capturing an image within the reflow oven includes: transporting an image acquisition device through the reflow oven chamber of the reflow oven so that the image acquisition device captures an image within the reflow oven.

[0017] According to a second aspect of the present application, conveying an image acquisition device through a reflow oven chamber of a reflow oven includes: installing the image acquisition device on a conveying device of the reflow oven, and conveying the installed image acquisition device through the reflow oven chamber of the reflow oven by the conveying device.

[0018] According to a second aspect of the present application, a reflow oven includes a reflow oven chamber device and a reflow oven chamber. The reflow oven chamber device is configured to deliver an airflow to the reflow oven chamber to process a workpiece in the reflow oven chamber. Capturing an image in the reflow oven includes: capturing an image of a surface of the reflow oven chamber device of the reflow oven.

[0019] According to a second aspect of the present application, the reflow oven includes a rail adjusting device. The rail adjusting device is configured to adjust the width of the rail for the workpiece. Capturing an image in the reflow oven includes: capturing an image of the rail adjusting device.

[0020] According to a second aspect of the present application, processing the stored image to obtain the cleaning status in the reflow oven includes: processing the stored image to obtain the color and area size of the contaminants in the reflow oven.

[0021] According to a second aspect of the present application, determining whether the reflow oven needs to be cleaned includes: determining whether the reflow oven needs to be cleaned through artificial intelligence training.

[0022] According to a second aspect of the present application, determining whether the reflow oven needs to be cleaned includes: determining whether the reflow oven needs to be cleaned within a predetermined time and determining whether the reflow oven needs to be cleaned immediately.

[0023] According to a second aspect of the present application, judging whether the reflow oven needs to be cleaned based on the obtained cleaning condition in the reflow oven includes: comparing the obtained cleaning condition in the reflow oven with a reference cleaning condition in the reflow oven to judge whether the reflow oven needs to be cleaned.

[0024] According to a third aspect of the present application, the present application provides a reflow oven, which includes the aforementioned system for judging the cleaning of the reflow oven.

[0025] According to a fourth aspect of the present application, the present application provides a reflow oven for implementing the aforementioned method. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings are not drawn to scale. In the drawings, each identical or nearly identical component represented in different figures is represented by the same reference numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:

[0027] Figure 1A is a three-dimensional diagram of the reflow oven of the present application;

[0028] Figure 1B yes Figure 1A A perspective view of a reflow oven with the housing removed is shown in FIG.

[0029] Figure 1C yes Figure 1B A partial enlarged view of

[0030] Figure 1D yes Figure 1B A perspective view of a reflow oven in an open state is shown in FIG.

[0031] Figure 1E yes Figure 1D A partial enlarged view of

[0032] Figure 1F yes Figure 1B Left view of;

[0033] Figure 1G yes Figure 1F A partial enlarged view of

[0034] Figure 2Ais a block diagram of a system for determining the cleaning of a reflow oven according to an embodiment of the present application;

[0035] Figure 2B is a block diagram of a system for determining cleaning of a reflow oven according to another embodiment of the present application;

[0036] Figure 3 is a flow chart of a method for determining the cleaning of a reflow oven according to the present application;

[0037] Figure 4A yes Figure 1B A perspective view of a reflow oven chamber device in a reflow oven shown in FIG.

[0038] Figure 4B yes Figure 4A A perspective view of a reflow oven chamber assembly as viewed from the bottom is shown;

[0039] Figure 5A yes Figure 1B A perspective view of an image acquisition device on a reflow oven shown in FIG.

[0040] Figure 5B yes Figure 5A A three-dimensional view of the image acquisition device shown with part of the housing removed;

[0041] Figure 5C yes Figure 5A Exploded diagram of

[0042] Fig. 6A is a perspective view of an image acquisition device according to another embodiment;

[0043] Figure 6B yes Fig. 6A Exploded diagram of

[0044] Figure 7 yes Figure 2A-2B A block diagram of a processing device is shown in FIG. DETAILED DESCRIPTION

[0045] Various specific embodiments of the present application will be described below with reference to the accompanying drawings that form a part of this specification. It should be understood that although terms indicating directions, such as "front", "rear", "upper", "lower", "left", "right", etc., are used in this application to describe various example structural parts and elements of the present application, these terms are used here only for the purpose of convenience of description and are determined based on the example orientations shown in the accompanying drawings. Since the embodiments disclosed in the present application can be set in different directions, these terms indicating directions are only for illustration and should not be regarded as limitations.

[0046] Figure 1A is a three-dimensional diagram of the reflow oven 100 of the present application, Figure 1B yes Figure 1A The reflow oven 100 shown in FIG. 1 is a perspective view with the housing 101 removed. Figure 1C yes Figure 1B A partial enlarged view of Figure 1D yes Figure 1B The reflow oven 100 is shown in a perspective view in an open state. Figure 1E yes Figure 1D A partial enlarged view of Figure 1F yes Figure 1B The left view of Figure 1G yes Figure 1F A partial enlarged view is provided to clearly illustrate the various components of the reflow oven 100 and the relationship between the various components thereon.

[0047] like Figure 1A As shown, the reflow oven 100 includes a housing 101, and various components of the reflow oven 100 are arranged in the housing 101. Figure 1B and Figure 1D As shown, the reflow oven 100 includes a reflow oven chamber 104 for subjecting a workpiece (e.g., a circuit board) (not shown) passing therethrough to high temperature treatment and then cooling treatment. The reflow oven chamber 104 spans a plurality of high temperature zones 121 and a plurality of cooling zones 122. The reflow oven 100 also includes a plurality of reflow oven chamber devices 103, which are arranged above and / or below the reflow oven chamber 104. The reflow oven chamber device 103 is configured to deliver airflow to the reflow oven chamber 104 to process the workpiece in the reflow oven chamber 104. The reflow oven chamber device 103 of the high temperature zone 121 delivers hot airflow to the reflow oven chamber 104 to subject the workpiece to high temperature treatment. The reflow oven chamber device 103 of the cooling zone 122 delivers cold airflow or normal temperature airflow (e.g., airflow in the external environment) to the reflow oven chamber 104 to cool the workpiece.

[0048] like Figure 1B-1GAs shown, the reflow oven 100 further includes a guide rail 111, a guide rail adjustment device 110 and a conveying device 102. The guide rail 111 is fixedly mounted to the oven frame 113 of the reflow oven 100 and runs through the reflow oven chamber 104. The guide rail adjustment device 110 is disposed in the reflow oven chamber 104. The guide rail adjustment device 110 spans a pair of parallel guide rails 111 and is mounted on the pair of guide rails 111. The guide rail adjustment device 110 is configured to adjust the width of the pair of guide rails 111 to which it is mounted so that the guide rails 111 can adapt to the conveying of workpieces of different sizes. Several guide rail adjustment devices 110 are disposed in the reflow oven chamber 104. Each guide rail adjustment device 110 is located between the high temperature zones 121, between the cooling zones 122, or between the high temperature zone 121 and the cooling zone 122. In this embodiment, the reflow oven 100 has a double track, which is composed of two pairs of guide rails 111. The structure of each track in the double track is the same. In another embodiment, the reflow oven 100 has a single track. In other embodiments, the reflow oven 100 has other suitable numbers of tracks.

[0049] The conveyor 102 is mounted to the guide rail 111 and can move along the guide rail 111. The conveyor 102 is configured to convey a workpiece through the reflow oven chamber 104 of the reflow oven 100 so that the workpiece can be processed. The image acquisition device 105 can be mounted to the conveyor 102 of the reflow oven 100. The mounted image acquisition device 105 can be conveyed by the conveyor 102 through the reflow oven chamber 104 of the reflow oven 100 to acquire images in the reflow oven 100. The image acquisition device 105 is an integrated device. Figure 1E As shown, the upper box shows an enlarged view of the conveyor 102 and the guide rail 111. The conveyor 102 includes a conveyor belt 114, a gear 115 and a plurality of pin assemblies 112. The pin assembly 112 includes a plurality of pins 116. The conveyor belt 114 is meshed with the gear 115 and is partially disposed in the guide rail 111. The pin assembly 112 is fixed to the conveyor belt 114. The gear 115 is driven to rotate by a conveyor drive mechanism (not shown) to drive the conveyor belt 114 to move along the guide rail 111, thereby driving the pin assembly 112 to move along the guide rail 111. In other embodiments, the conveyor 102 includes other suitable structures.

[0050] In one embodiment, Figure 1E-1GAs shown, the mounting structure 506 of the image acquisition device 105 is mounted to the pins 116 of the conveyor 102, so that the image acquisition device 105 can be conveyed by the conveyor 102 through the reflow oven chamber 104 of the reflow oven 100. The mounting structure 506 is placed on a plurality of pins 116 of the conveyor 102. When the conveyor 102 moves along the guide rail 111, the pins 116 can be driven to move, and then the pins 116 drive the image acquisition device 105 to move through the mounting structure 506. In other embodiments, the image acquisition device 105 is mounted to the conveyor 102 by other suitable means, so as to be conveyed by the conveyor 102 through the reflow oven 100. Figure 1B-1G Only one image acquisition device 105 on one of the dual tracks is shown. In operation, the conveyor 102 on each of the dual tracks is provided with an image acquisition device 105, which is conveyed along the track through the reflow oven 100 to acquire images within the reflow oven 100.

[0051] like Figure 1B and Figure 1F As shown, the image acquisition device 105 is configured to be able to acquire images inside the reflow soldering oven 100 when the reflow soldering oven 100 is in a closed state, and store the acquired images. When the reflow soldering oven 100 is in a closed state, the image acquisition device 105 is conveyed by the conveying device 102 through the reflow soldering oven chamber 104 of the reflow soldering oven 100, thereby acquiring images inside the reflow soldering oven 100. In one embodiment, when the reflow soldering oven 100 is in a closed state, the reflow soldering oven 100 is in a non-production state of normal operation, at which time the workpiece does not pass through the reflow soldering oven 100, and the image acquisition device 105 is conveyed through the reflow soldering oven chamber 104 of the reflow soldering oven 100 to acquire images inside the reflow soldering oven 100. In another embodiment, when the reflow soldering oven 100 is in a closed state, the reflow soldering oven 100 is in a normal operation period, and at this time, the workpiece passes through the reflow soldering oven 100 to be processed, and the image acquisition device 105 is also transmitted through the reflow soldering oven chamber 104 of the reflow soldering oven 100 to acquire images inside the reflow soldering oven 100. The images inside the reflow soldering oven 100 acquired by the image acquisition device 105 include images of the surface of the reflow soldering oven chamber device 103, images of the guide rail adjustment device 110, etc. In one embodiment, the image of the surface of the reflow soldering oven chamber device 103 is the bottom surface 411 (see FIG. 4 ) of the upper reflow soldering oven chamber device 103. Figure 1D-1G The image acquisition device 105 is configured to move through the reflow oven 100 toward the upper reflow oven chamber device 103 to acquire an image of the bottom surface 411 of the upper reflow oven chamber device 103 and / or an image of the guide rail adjustment device 110.

[0052] The image acquisition device 105 includes two image acquisition units 502 (see Figure 5B-5C), so that the image acquisition device 105 can acquire images of internal components in the entire width direction when it is transmitted through the reflow oven 100. Figure 1G As shown, the dashed line shows the image acquisition field of view 122 of the image acquisition unit 502 in the width direction of the reflow oven 100 . Figure 1C The image acquisition field of view 121 of the image acquisition unit 502 in the length direction and the image acquisition field of view 122 in the width direction of the reflow oven 100 are shown. In other embodiments, the image acquisition device 105 includes other suitable numbers of image acquisition units 502 to acquire images in the reflow oven 100. The image acquisition device 105 is configured to be mounted on the conveyor 102 and passed through the reflow oven 100 by the conveyor 102 without changing other structures of the reflow oven 100. Figure 1G As shown, the height of the image acquisition device 105 is set to be smaller than the height of the reflow oven chamber 104. When the image acquisition device 105 is installed on the conveying device 102, it is located approximately in the middle or lower position of the reflow oven chamber 104, so that the image acquisition device 105 can be smoothly conveyed through the reflow oven chamber 104 and can acquire images of components in the reflow oven 100.

[0053] like Figure 2A-2B As shown, the image (e.g., image data) stored by the image acquisition device 105 can be output to the processing unit 107 of the processing device 106, and the processing unit 107 can process the stored image to obtain the cleaning condition in the reflow soldering furnace 100, and output the cleaning condition in the reflow soldering furnace 100 to the judgment unit 108 of the processing device 106. The judgment unit 108 can judge whether the reflow soldering furnace 100 needs to be cleaned based on the cleaning condition in the reflow soldering furnace 100. In addition, when it is judged that the reflow soldering furnace 100 needs to be cleaned, the judgment unit 108 can output a control signal to the indication device 109, so that the indication device 109 sends an indication to the user that the reflow soldering furnace 100 needs to be cleaned, for example, an indication that the reflow soldering furnace 100 needs to be cleaned within a predetermined time, or an indication that the reflow soldering furnace 100 needs to be cleaned immediately. The present application collects an image in the reflow soldering oven 100 when the reflow soldering oven 100 is in a closed state, and processes the image to determine whether the reflow soldering oven 100 needs to be cleaned, thereby instructing the user to clean the reflow soldering oven 100 at an appropriate time. Therefore, the present application can improve the production efficiency of the reflow soldering oven 100 and reduce unnecessary downtime of the reflow soldering oven 100.

[0054] When the circuit board passes through the high temperature zone of the reflow soldering furnace, the heat in the high temperature zone causes the solder paste on the circuit board to melt. At this time, the organic compounds mainly including the solder flux contain volatile organic compounds (called "VOC") and vaporize to form steam, thereby forming "pollutants". When the circuit board is transferred from the high temperature zone to the cooling zone, the pollutants will also flow to the cooling zone. After cooling in the cooling zone, the pollutants will condense into liquid and / or solid and drip onto the circuit board, thereby polluting the circuit board. The pollutants will condense on the bottom surface 411 of the upper reflow soldering furnace chamber device 103 and the surface of the guide rail adjustment device 110 in the cooling zone. When the pollutants condensed on the surfaces of the upper reflow soldering furnace chamber device 103 and the guide rail adjustment device 110 accumulate to a certain amount, they will drip onto the circuit board below, thereby polluting the circuit board. The present application obtains the cleaning status in the reflow soldering furnace 100 based on the image of the surface of the reflow soldering furnace chamber device 103 and / or the image of the guide rail adjustment device 110, and then determines whether the reflow soldering furnace 100 needs to be cleaned. In other embodiments, the contaminants condense to other structures in the reflow soldering oven 100 in the cooling zone. The present application also obtains images of other structures in the reflow soldering oven 100 to determine whether the reflow soldering oven 100 needs to be cleaned. Therefore, the present application can clean the reflow soldering oven 100 at an appropriate time to prevent contaminants (for example, contaminants accumulated on the upper reflow soldering oven chamber device 103 and the guide rail adjustment device 110) from dripping onto the circuit board to contaminate the circuit board, thereby improving the productivity of the reflow soldering oven 100 and reducing unnecessary downtime. In addition, the contaminants accumulated on the guide rail adjustment device 110 may also cause the guide rail adjustment device 110 to fail to work, for example, the width of the guide rail 111 cannot be adjusted, which in turn causes the reflow soldering oven 100 to need to be shut down to maintain the guide rail adjustment device 110, for example, to repair or replace the guide rail adjustment device 110. Therefore, by acquiring an image of the guide rail adjustment device 110 and determining whether the reflow oven 100 needs to be cleaned based on the image, the present application can also clean the guide rail adjustment device 110 at an appropriate time to ensure its normal operation, thereby reducing unnecessary downtime of the reflow oven 100.

[0055] Figure 2A is a block diagram of a system 200 for determining the cleaning of a reflow oven 100 according to an embodiment of the present application. Figure 2B 2 is a block diagram of a system 200 for determining the cleaning of a reflow oven 100 according to another embodiment of the present application.

[0056] like Figure 2A As shown, in one embodiment, a system 200 for judging the cleaning of a reflow oven 100 includes an image acquisition device 105 and a processing device 106 , and the processing device 106 includes a processing unit 107 and a judging unit 108 .

[0057] The image acquisition device 105 is configured to be able to acquire images in the reflow soldering oven 100 when the reflow soldering oven 100 is in a closed state, and store the acquired images. The image acquisition device 105 is connected to the processing device 106 via the connection line 201, and outputs the stored acquired images to the processing device 106 via the connection line 201 (e.g., a data line). In the processing device 106, the processing unit 107 is configured to process the stored images to obtain the cleaning condition in the reflow soldering oven 100, and the judgment unit 108 is configured to judge whether the reflow soldering oven 100 needs to be cleaned based on the acquired cleaning condition in the reflow soldering oven 100. Judging whether the reflow soldering oven 100 needs to be cleaned includes judging whether the reflow soldering oven 100 needs to be cleaned within a predetermined time or judging that the reflow soldering oven 100 needs to be cleaned immediately. In one embodiment, the predetermined time includes one week or three days. In other embodiments, the predetermined time includes other suitable times. In operation, when the reflow oven 100 is in a closed state, the image acquisition device 105 is transmitted through the reflow oven 100 to acquire and store images in the reflow oven 100, and the processing device 106 determines whether the reflow oven 100 needs to be cleaned within a predetermined time based on the images. If it is determined that the reflow oven 100 needs to be cleaned within the predetermined time, then after a period of time within the predetermined time, the image acquisition device 105 is transmitted through the reflow oven 100 again to acquire and store images in the reflow oven 100, and then the processing device 106 determines whether the reflow oven 100 needs to be cleaned immediately based on the images. If it is determined that the reflow oven 100 needs to be cleaned immediately, the user is prompted to clean the reflow oven 100.

[0058] The judgment unit 108 is configured to judge whether the reflow soldering oven 100 needs to be cleaned based on the acquired cleaning condition in the reflow soldering oven 100 through artificial intelligence training. In one embodiment, in the actual operation of the reflow soldering oven 100 by the user, a plurality of images in the reflow soldering oven 100 are collected when the reflow soldering oven 100 needs to be cleaned, and these images are used as reference images for indicating the need to clean the reflow soldering oven 100. These image data are trained through artificial intelligence so that the judgment unit 108 can judge whether the reflow soldering oven 100 needs to be cleaned based on the images in the reflow soldering oven 100 acquired by the image acquisition device 105 (for example, based on the cleaning condition in the reflow soldering oven 100).

[0059] In one embodiment, the judgment unit 108 is configured to compare the obtained cleaning condition in the reflow soldering furnace 100 with the reference cleaning condition in the reflow soldering furnace 100 to determine whether the reflow soldering furnace 100 needs to be cleaned. The reference cleaning condition includes the cleaning condition of the reference image. When the obtained cleaning condition in the reflow soldering furnace 100 matches the reference cleaning condition in the reflow soldering furnace 100, it is determined that the reflow soldering furnace 100 needs to be cleaned. The cleaning condition in the reflow soldering furnace 100 includes the color and area size of the contaminants in the reflow soldering furnace 100, for example, the color and area size of the contaminants on the surface of the reflow soldering furnace chamber device 103 and / or the guide rail adjustment device 110. In one embodiment, the color of the contaminant includes black, yellow, and light yellow. The darker the color, the more serious the contamination. The degree of contamination represented by black, yellow, and light yellow decreases in sequence. The degree of contamination in the reflow soldering furnace 100 can also be determined based on the size of the contaminant area. The larger the contaminant area, the more serious the contamination. In the judgment, the color of the contaminant takes precedence over the area size of the contaminant. In one embodiment, when the color of the contaminant is black and the area of ​​the black contaminant reaches an area threshold, it is generally determined that the contamination is serious and it is necessary to clean the reflow soldering oven 100. Determining the need to clean the reflow soldering oven 100 includes determining that the reflow soldering oven 100 needs to be cleaned within a predetermined time and determining that the reflow soldering oven 100 needs to be cleaned immediately.

[0060] In another embodiment, the system 200 further includes an indication device 109, which is connected to the processing device 106 via a connection line 202. When it is determined that the reflow soldering furnace 100 needs to be cleaned, the processing device 106 outputs a control signal for cleaning the reflow soldering furnace 100 to the indication device 109 via the connection line 202, and the indication device 109 indicates, for example, to a user, that the reflow soldering furnace 100 needs to be cleaned according to the control signal. Indicating that the reflow soldering furnace 100 needs to be cleaned includes indicating that the reflow soldering furnace 100 needs to be cleaned within a predetermined time and indicating that the reflow soldering furnace 100 needs to be cleaned immediately. In one embodiment, the indication device 109 includes a display device and / or an alarm device. In other embodiments, the indication device 109 includes other suitable devices or structures.

[0061] In one embodiment, the processing device 106 is a controller of the reflow oven 100. In another embodiment, the processing device 106 is different from the controller of the reflow oven 100. In one embodiment, the indicating device 109 is a display, indicator light or alarm light of the reflow oven 100. In another embodiment, the indicating device 109 is different from the display, indicator light and alarm light of the reflow oven 100. In other embodiments, the system 200 includes other suitable devices or structures to determine the cleaning of the reflow oven 100.

[0062] like Figure 2B As shown, the reflow oven 100 includes a system 200 . Figure 2B System 200 and Figure 2A The structure of the system 200 is the same.

[0063] Figure 3 It is a flow chart of a method 300 for determining the cleaning of the reflow oven 100 of the present application.

[0064] like Figure 3 As shown, at step 302, the method 300 for determining the cleaning of the reflow oven 100 begins to be executed. Then, the process proceeds from step 302 to step 304.

[0065] At step 304, when the reflow oven 100 is in a closed state, an image inside the reflow oven 100 is captured. In one embodiment, capturing the image inside the reflow oven 100 includes: transferring the image capture device 105 through the reflow oven chamber 104 of the reflow oven 100, so that the image capture device 105 captures the image inside the reflow oven 100. Transferring the image capture device 105 through the reflow oven chamber 104 of the reflow oven 100 includes: installing the image capture device 105 to the conveying device 102 of the reflow oven 100, and transferring the mounted image capture device 105 through the reflow oven chamber 104 of the reflow oven 100 through the conveying device 102. In one embodiment, when the reflow soldering oven 100 is in a closed state, the reflow soldering oven 100 is in a normal operation non-production state, and the workpiece does not pass through the reflow soldering oven 100, the image acquisition device 105 is conveyed through the reflow soldering oven chamber 104 of the reflow soldering oven 100 to collect images in the reflow soldering oven 100. In another embodiment, when the reflow soldering oven 100 is in a closed state, the reflow soldering oven 100 is in a normal operation state, and the workpiece passes through the reflow soldering oven 100 to be processed, the image acquisition device 105 is also conveyed through the reflow soldering oven chamber 104 of the reflow soldering oven 100 to collect images in the reflow soldering oven 100. Collecting images in the reflow soldering oven 100 includes: collecting images of the surface of the reflow soldering oven chamber device 103 of the reflow soldering oven 100 and / or collecting images of the guide rail adjustment device 110. The image of the surface of the reflow soldering oven chamber device 103 includes an image of the bottom surface 411 of the upper reflow soldering oven chamber device 103. Then go from step 304 to step 306 .

[0066] At step 306 , the acquired image is stored. Then, the process proceeds from step 306 to step 308 .

[0067] At step 308, the stored image is processed to obtain the cleanliness of the reflow oven 100. In one embodiment, processing the stored image to obtain the cleanliness of the reflow oven 100 includes: processing the stored image to obtain the color and area size of the contaminants in the reflow oven 100. Then, the process proceeds from step 308 to step 310.

[0068] At step 310, it is determined whether the reflow soldering furnace 100 needs to be cleaned based on the clean condition in the reflow soldering furnace 100 obtained. In one embodiment, determining whether the reflow soldering furnace 100 needs to be cleaned includes: determining whether the reflow soldering furnace 100 needs to be cleaned through artificial intelligence training. In one embodiment, in the actual operation of the reflow soldering furnace 100 by the user, multiple images in the reflow soldering furnace 100 are collected when the reflow soldering furnace 100 needs to be cleaned, and these images are used as reference images for indicating that the reflow soldering furnace 100 needs to be cleaned. These image data are trained through artificial intelligence so that the judgment unit 108 can determine whether the reflow soldering furnace 100 needs to be cleaned based on the images in the reflow soldering furnace 100 collected by the image acquisition device 105 (for example, based on the clean condition in the reflow soldering furnace 100). Determining whether the reflow soldering furnace 100 needs to be cleaned includes: determining that the reflow soldering furnace 100 needs to be cleaned within a predetermined time, and determining that the reflow soldering furnace 100 needs to be cleaned immediately.

[0069] In one embodiment, judging whether the reflow soldering furnace 100 needs to be cleaned based on the clean condition in the reflow soldering furnace 100 obtained includes: comparing the clean condition in the reflow soldering furnace 100 obtained with the reference clean condition in the reflow soldering furnace 100 to judge whether the reflow soldering furnace 100 needs to be cleaned. The reference clean condition includes the clean condition of the reference image. When the clean condition in the reflow soldering furnace 100 obtained matches the reference clean condition in the reflow soldering furnace 100, it is judged that the reflow soldering furnace 100 needs to be cleaned. The clean condition in the reflow soldering furnace 100 includes the color and area size of the contaminants in the reflow soldering furnace 100, for example, the color and area size of the contaminants on the surface of the reflow soldering furnace chamber device 103 and / or the guide rail adjustment device 110. In one embodiment, the color of the contaminants includes black, yellow, and light yellow. The darker the color, the more serious the contamination. The degree of contamination represented by black, yellow, and light yellow decreases in sequence. The degree of contamination in the reflow soldering furnace 100 can also be determined based on the size of the contaminant area. The larger the contaminant area, the more serious the contamination. In the judgment, the color of the pollutant takes precedence over the area size of the pollutant. In one embodiment, when the color of the pollutant is black and the area of ​​the black pollutant reaches an area threshold, it is roughly judged that the pollution is serious and the reflow soldering furnace 100 needs to be cleaned. Judging that the reflow soldering furnace 100 needs to be cleaned includes judging that the reflow soldering furnace 100 needs to be cleaned within a predetermined time and judging that the reflow soldering furnace 100 needs to be cleaned immediately. In other embodiments, other suitable methods are used to judge whether the reflow soldering furnace 100 needs to be cleaned. Then, step 310 is transferred to step 312 to end the execution of the method 300 for judging the cleaning of the reflow soldering furnace 100.

[0070] In another embodiment, the method 300 further includes indicating to the user that the reflow oven 100 needs to be cleaned, for example, indicating that the reflow oven 100 needs to be cleaned within a predetermined time or indicating that the reflow oven 100 needs to be cleaned immediately.

[0071] Figure 4A yes Figure 1B 1 is a perspective view of a reflow oven chamber device 103 in a reflow oven 100, Figure 4B yes Figure 4A The reflow oven chamber assembly 103 is shown in a perspective view from the bottom.

[0072] like Figures 4A-4B As shown, the reflow oven chamber device 103 includes a housing 402, and the housing 402 includes a top and four side portions. An airflow source (not shown) is disposed in the housing 402 and is configured to output an airflow. The reflow oven chamber device 103 also includes a bottom plate 401 located at the bottom. A through hole 412 is disposed on the bottom plate 401, and the bottom plate 401 includes a bottom surface 411. The bottom surface 411 of the bottom plate 401 is disposed toward the reflow oven chamber 104. The reflow oven chamber device 103 is configured so that the airflow source conveys the airflow through the through hole 412 on the bottom plate 401 to reach the reflow oven chamber 104. Figures 4A-4B The illustrated reflow oven chamber device 103 is an upper reflow oven chamber device 103, which is disposed above the reflow oven chamber 104. The upper reflow oven chamber device 103 delivers airflow through the through holes 412 on the bottom plate 401 to reach the reflow oven chamber 104 below.

[0073] When the steam pollutants generated in the high temperature zone flow to the cooling zone, the pollutants will condense in the cooling zone on the surface of the reflow oven chamber device 103. For the upper reflow oven chamber device 103, the pollutants will condense on its bottom surface 411. When the pollutants accumulated on the bottom surface 411 reach a certain amount, the pollutants will separate from the bottom surface 411 and drip downward to the circuit board below, thereby contaminating the circuit board.

[0074] Figure 5A yes Figure 1B A perspective view of an image acquisition device 105 on a reflow oven 100 is shown in FIG. Figure 5B yes Figure 5A The image acquisition device 105 is shown in a three-dimensional view with part of the housing removed. Figure 5C yes Figure 5A Exploded diagram.

[0075] like Figures 5A-5CAs shown, the image acquisition device 105 includes a housing 505 and a mounting structure 506. The housing 505 is configured to accommodate internal components of the image acquisition device 105, which include a light source 501, an image acquisition unit 502, a controller 503, and a power supply 504. When the image acquisition device 105 is conveyed through the reflow oven 100, the housing 505 can block the heat of the reflow oven 100 outside the housing 505. In one embodiment, the housing 505 is made of a heat-insulating material, such as ceramic fiber. The mounting structure 506 is configured to support the housing 505. The mounting structure 506 is a rigid structure. The mounting structure 506 can be mounted to the conveyor 102 of the reflow oven 100 so that the image acquisition device 105 can be conveyed by the conveyor 102 through the reflow oven chamber 104 of the reflow oven 100.

[0076] The top of the housing 505 has an opening 509. A transparent partition 507 and a heat insulating plate 508 are disposed in the opening 509. The transparent partition 507 is disposed above the light source 501 and the image acquisition unit 502, and is configured to block the heat of the reflow oven 100 from being transferred to the light source 501 and the image acquisition unit 502. The transparent partition 507 allows the light emitted by the light source 501 to pass through the transparent partition 507 to illuminate the internal components of the reflow oven 100, and allows the image acquisition unit 502 to capture an image of the illuminated internal components of the reflow oven 100. When the transparent partition 507 is removed, the light source 501 and the image acquisition unit 502 can be installed into or removed from the housing 505 through the opening 509. The heat insulating plate 508 is disposed above the controller 503 and the power supply 504, and is configured to block the heat of the reflow oven 100 from being transferred to the controller 503 and the power supply 504. When the heat insulating plate 508 is removed, the controller 503 and the power supply 504 can be installed into or removed from the housing 505 through the opening 509. The heat insulating plate 508 is made of a heat-insulating material.

[0077] like Figure 5BAs shown, the image acquisition device 105 includes a light source 501, an image acquisition unit 502, a controller 503 and a power supply 504, which are arranged in a housing 505. The light source 501 is configured to illuminate the interior of the reflow soldering oven 100. In one embodiment, the light source 501 illuminates the reflow soldering oven chamber device 103 and / or the guide rail adjustment device 110. In one embodiment, the light source 501 is a flash lamp, such as an LED lamp. The image acquisition unit 502 is configured to capture an image inside the reflow soldering oven 100 when the light source 501 illuminates the interior of the reflow soldering oven 100. The light source 501 provides illumination for the image acquisition unit 502 so that the image acquisition unit 502 can capture a clear image inside the reflow soldering oven 100. The controller 503 is configured to control the operation of the image acquisition unit 502 and the light source 501 so that the image acquisition unit 502 captures an image inside the reflow soldering oven 100 and stores the image captured by the image acquisition unit 502. The controller 503 is connected to the image acquisition unit 502 and the light source 501 through a connecting line (not shown). The controller 503 includes a control circuit and a storage circuit. The control circuit is used to control the operation of the image acquisition unit 502 and the light source 501, and the storage circuit is used to store the image data acquired by the image acquisition unit 502. In one embodiment, the controller 503 controls the image acquisition unit 502 and the light source 501 to be turned on synchronously. In another embodiment, the controller 503 controls the light source 501 to be turned on all the time during the process of the image acquisition unit 502 being transported through the reflow oven 100. The controller 503 includes an interface, such as a USB interface, which is connected to the processing device 106. The controller 503 outputs the stored image data to the processing device 106 through the interface (see Figure 2A-2B ) for processing by the processing device 106 to determine whether it is necessary to clean the reflow oven 100. The power supply 504 is configured to provide power to the light source 501, the image acquisition unit 502 and the controller 503. In one embodiment, the power supply 504 is a battery.

[0078] like Figure 5B-5C As shown, the image acquisition device 105 includes two image acquisition units 502, so that the image acquisition device 105 can acquire images of internal components in the entire width direction of the reflow oven 100 when the image acquisition device 105 is transmitted through the reflow oven 100. In other embodiments, the image acquisition device 105 includes other suitable number of image acquisition units 502 to acquire images inside the reflow oven 100.

[0079] like Figure 5CAs shown, the mounting structure 506 includes a main body 510 and a flange 511. The main body 510 is an open shell having an opening 512 at the top. The main body 510 has a front side 513, a rear side 514, a left side 515, a right side 516, and a bottom 517. The top edge of the left side 515 and the top edge of the right side 516 are both connected to the flange 511. The flange 511 is configured to be mounted to the conveying device 102, for example, placed on the pin assembly 112 of the conveying device 102 (see Figure 1E-1G ), so that the image acquisition device 105 is mounted on the conveying device 102 and is conveyed by the conveying device 102 through the reflow oven 100. In other embodiments, the mounting structure 506 includes other suitable structures to enable the image acquisition device 105 to be mounted on the conveying device 102. In one embodiment, the mounting structure 506 is formed integrally. In other embodiments, the mounting structure 506 is formed in other suitable ways.

[0080] In other embodiments, the image acquisition device 105 includes other suitable structures and / or devices to be transmitted through the reflow oven 100 to acquire images inside the reflow oven 100 .

[0081] Fig. 6A is a stereoscopic diagram of an image acquisition device 600 according to another embodiment. Figure 6B yes Fig. 6A Exploded diagram.

[0082] like Figure 6A-6B As shown, the image acquisition device 600 includes an image acquisition device 105 and a mounting structure 601. In this embodiment, the image acquisition device 600 includes two image acquisition devices 105. In other embodiments, the image acquisition device 600 includes other suitable numbers of image acquisition devices 105. The image acquisition device 600 is applicable to a single-track reflow oven 100 (not shown). The width of the single-track reflow oven 100 is relatively wide, so several image acquisition devices 105 arranged in parallel are required to obtain images of the entire width of the interior of the reflow oven 100. The image acquisition device 600 is also applicable to capturing images of the interior of reflow ovens 100 of other suitable structures. In the aforementioned embodiment, as Figure 1B-1G As shown, the reflow oven 100 has two tracks, and an image acquisition device 105 is arranged on each track.

[0083] Figure 6A-6B The image acquisition device 105 and Figures 5A-5CThe mounting structure 601 can be mounted to the conveyor 102 of the reflow oven 100 so that the image acquisition device 600 can be transported through the reflow oven 100 by the conveyor 102. In one embodiment, the mounting structure 601 is placed on the pin assembly 112 of the conveyor 102. When the conveyor 102 is transported, the pin assembly 112 moves to drive the mounting structure 601 to move, thereby driving the image acquisition device 600 to move.

[0084] The mounting structure 601 is also configured to support the image acquisition device 105. Figure 6A-6B As shown, the mounting structure 601 includes a main body 602 and a stopper 604. The main body 602 includes an opening 603, which is configured to accommodate the image acquisition device 105. The image acquisition device 105 can pass through the opening 603 until the flange 511 of the image acquisition device 105 is blocked by the main body 602. The flange 511 of the image acquisition device 105 is placed on the non-opening portion of the main body 602, so that the main body 602 can support the image acquisition device 105. The size of the opening 603 is substantially the same as the size of the image acquisition device 105, so that the image acquisition device 105 is substantially fixed in the opening 603 in the horizontal direction of the reflow oven 100. The stopper 604 is connected to the front side edge and the rear side edge of the main body 602, and extends downward from the front side edge and the rear side edge. The length of the stopper 604 is less than the length of the main body 602, so that the left and right sides of the main body 602 are respectively left with protrusions 605 extending in the width direction. The protrusion 605 is configured to be mounted to the conveyor 102 of the reflow oven 100, for example, disposed on the pin assembly 112 of the conveyor 102. The stopper 604 and the protrusion 605 are configured to enable the mounting structure 601 to be easily mounted to the conveyor 102.

[0085] In other embodiments, the mounting structure 601 includes other suitable structures.

[0086] Figure 7 yes Figure 2A-2B A block diagram of the processing device 106 is shown in FIG. Figure 7As shown, the control device 106 includes a bus 701, a processor 702, a memory 703, an input interface 704, and an output interface 705. The processor 702, the memory 703, the input interface 704, and the output interface 705 are connected to the bus 701. The processor 702 can read a program (or instruction) from the memory 703, and execute the program (or instruction) to perform data processing and / or control functions of various components of the reflow oven 100. The processor 702 can also write data or a program (or instruction) into the memory 703. The memory 703 can store programs (instructions) or data. By executing the instructions in the memory 703, the processor 702 can control the memory 703, the input interface 704, and the output interface 705.

[0087] The input interface 704 is configured to receive image data from the image acquisition device 105 through the connection line 201. The input interface 704 is also configured to convert the received image data into a signal recognizable by the processor 702, and output the signal to the processor 702. The processor 702 is configured to process (e.g., calculate, judge) the received signal to output a control signal indicating that the reflow oven 100 needs to be cleaned.

[0088] The output interface 705 is configured to receive a control signal from the processor 702, convert the control signal into an output signal suitable for the indicating device 109, and send the output signal to the indicating device 109 through the connecting line 202, so that the indicating device 109 generates an indication that the reflow oven 100 needs to be cleaned, for example, including an indication that the reflow oven 100 needs to be cleaned within a predetermined time, and an indication that the reflow oven 100 needs to be cleaned immediately.

[0089] Although the present disclosure has been described in conjunction with the examples of the embodiments summarized above, various alternatives, modifications, changes, improvements and / or substantially equivalent solutions, whether known or currently or foreseeable in the near future, may be apparent to those of ordinary skill in the art. In addition, the technical effects and / or technical problems described in this specification are exemplary rather than restrictive; so the disclosure in this specification may be used to solve other technical problems and have other technical effects and / or may solve other technical problems. Therefore, the examples of the embodiments of the present disclosure as stated above are intended to be illustrative rather than restrictive. Various changes may be made without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is intended to include all known or earlier developed alternatives, modifications, changes, improvements and / or substantially equivalent solutions.

Claims

1. A system (200) for judging the cleaning of a reflow oven (100), characterized in that: The system (200) comprises: An image acquisition device (105) configured to acquire an image inside the reflow oven (100) when the reflow oven (100) is in a closed state, and store the acquired image; a processing unit (107) configured to process the stored image to obtain a cleaning condition in the reflow oven (100); and A judgment unit (108) is configured to judge whether the reflow oven (100) needs to be cleaned based on the acquired cleaning condition in the reflow oven (100).

2. The system (200) of claim 1, wherein the reflow oven (100) comprises a reflow oven chamber (104), wherein the reflow oven chamber (104) is configured to enable a workpiece to be transported through the reflow oven chamber (104) and processed in the reflow oven chamber (104), wherein: The image acquisition device (105) is configured to be transported through the reflow oven chamber (104) of the reflow oven (100) to acquire images within the reflow oven (100).

3. The system (200) according to claim 2, characterized in that The image acquisition device (105) is configured to be mounted on a conveying device (102) of the reflow oven (100), so that the mounted image acquisition device (105) can be transported by the conveying device (102) through the reflow oven chamber (104) of the reflow oven (100).

4. The system (200) according to claim 1, wherein the reflow oven (100) comprises a reflow oven chamber device (103) and a reflow oven chamber (104), wherein the reflow oven chamber device (103) is configured to deliver airflow to the reflow oven chamber (104) to process workpieces in the reflow oven chamber (104), characterized in that: The image inside the reflow oven (100) includes an image of the surface of a reflow oven chamber device (103) of the reflow oven (100).

5. The system (200) according to claim 1, wherein the reflow oven (100) comprises a guide rail adjustment device (110), wherein the guide rail adjustment device (110) is configured to be able to adjust the width of a guide rail (111) for a workpiece, wherein: The image inside the reflow oven (100) includes an image of the guide rail adjustment device (110).

6. The system (200) according to claim 1, characterized in that The image acquisition device (105) comprises: A light source (501) configured to illuminate the interior of the reflow oven (100); An image acquisition unit (502) configured to acquire an image inside the reflow oven (100) when the light source (501) irradiates the interior of the reflow oven (100); a controller (503) configured to control the operations of the image acquisition unit (502) and the light source (501) so that the image acquisition unit (502) acquires an image in the reflow oven (100), and stores the image acquired by the image acquisition unit (502); and A power supply (504) is configured to provide power to the light source (501), the image acquisition unit (502) and the controller (503).

7. The system (200) according to claim 6, characterized in that The image acquisition device (105) further comprises: a housing (505) configured to accommodate the light source (501), the image acquisition unit (502), the controller (503) and the power supply (504), and to block the heat of the reflow oven (100) outside the housing (505); and A mounting structure (506) is configured to support the housing (505) and can be mounted to a conveying device (102) of the reflow oven (100) so that the image acquisition device (105) can be conveyed by the conveying device (102) through the reflow oven (100).

8. The system (200) according to claim 7, characterized in that The housing (505) comprises: A transparent partition (507) is disposed above the light source (501) and the image acquisition unit (502) and is configured to prevent heat from the reflow oven (100) from being transferred to the light source (501) and the image acquisition unit (502).

9. The system (200) according to claim 1, characterized in that The image acquisition device (105) is an integrated device.

10. A method (300) for judging the cleaning of a reflow oven (100), characterized in that: The method (300) comprises: When the reflow oven (100) is in a closed state, collecting an image inside the reflow oven (100); storing the acquired images; Processing the stored image to obtain the cleaning status in the reflow oven (100); and Whether the reflow oven (100) needs to be cleaned is determined based on the acquired cleaning condition in the reflow oven (100).

11. The method (300) of claim 10, wherein the reflow oven (100) comprises a reflow oven chamber (104), wherein the reflow oven chamber (104) is configured to enable a workpiece to be transported through the reflow oven chamber (104) and processed in the reflow oven chamber (104), wherein: Collecting the image in the reflow oven (100) comprises: The image acquisition device (105) is transported through the reflow oven chamber (104) of the reflow oven (100) so that the image acquisition device (105) acquires an image within the reflow oven (100).

12. The method (300) according to claim 11, characterized in that: Transporting the image acquisition device (105) through the reflow oven chamber (104) of the reflow oven (100) comprises: The image acquisition device (105) is installed on the conveying device (102) of the reflow oven (100), and the installed image acquisition device (105) is conveyed through the reflow oven chamber (104) of the reflow oven (100) by the conveying device (102).

13. The method (300) according to claim 10, wherein the reflow oven (100) comprises a reflow oven chamber device (103) and a reflow oven chamber (104), wherein the reflow oven chamber device (103) is configured to deliver airflow to the reflow oven chamber (104) to process workpieces in the reflow oven chamber (104), characterized in that: Collecting the image in the reflow oven (100) comprises: An image of the surface of the reflow oven chamber device (103) of the reflow oven (100) is collected.

14. The method (300) according to claim 10, wherein the reflow oven (100) comprises a guide rail adjustment device (110), wherein the guide rail adjustment device (110) is configured to be able to adjust the width of a guide rail (111) for a workpiece, wherein: Collecting the image in the reflow oven (100) comprises: An image of the guide rail adjustment device (110) is collected.

15. The method (300) according to claim 10, characterized in that: Processing the stored image to obtain the cleaning status in the reflow oven (100) comprises: The stored image is processed to obtain the color and area size of the contaminants in the reflow oven (100).

16. The method (300) according to claim 10, characterized in that: Determining whether the reflow oven (100) needs to be cleaned includes: Whether the reflow oven (100) needs to be cleaned is determined through artificial intelligence training.

17. The method (300) according to claim 10, characterized in that: Determining whether the reflow oven (100) needs to be cleaned includes: Determining whether the reflow oven (100) needs to be cleaned within a predetermined time; and It is determined that the reflow oven (100) needs to be cleaned immediately.

18. The method (300) according to claim 10, characterized in that: Judging whether the reflow soldering furnace (100) needs to be cleaned based on the obtained cleaning condition in the reflow soldering furnace (100) comprises: The acquired cleaning condition in the reflow oven (100) is compared with a reference cleaning condition in the reflow oven (100) to determine whether the reflow oven (100) needs to be cleaned.

19. A reflow oven (100), characterized in that: The reflow oven (100) comprises: A system (200) for judging the cleaning of a reflow oven (100) as described in claims 1-9.

20. A reflow oven (100) for implementing the method (300) of claims 10-18.

Images