Circuit board, manufacturing method thereof and electronic equipment

Abstract

The invention discloses a circuit board and a manufacturing method thereof, and electronic equipment, and the circuit board comprises a first core board, and a first side surface of the first core board is provided with a first groove body which exposes a first circuit layer; the second core board is internally provided with a second circuit layer, the third side face of the second core board is provided with an electric conductor in a protruding mode, one end of the electric conductor is connected with the second circuit layer, and the other end of the electric conductor is embedded in the first groove body so as to be connected with the first circuit layer; the chip is arranged on the fourth side surface of the second core plate and is connected with the second circuit layer; the third side face and the fourth side face are two opposite side faces. By means of the mode, the circuit board can effectively achieve high-density interconnection between the core boards and the chips, the reliability, heat dissipation and lightening and thinning of the circuit board can be improved, and the manufacturing cost of the circuit board is effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board and a manufacturing method thereof, and an electronic device. Background Art

[0002] In complex electronic devices, when multiple functional modules need to be interconnected, corresponding connection points are usually designed on the printed circuit boards corresponding to the functional modules, so that solder paste or gold wires can be used on the connection points to achieve conductive connections with the printed circuit boards corresponding to other functional modules.

[0003] However, due to the significant differences between tin and copper in key indicators such as thermal conductivity and resistivity, using solder paste to achieve conductive connections between conductor copper layers is not conducive to heat dissipation, while gold wires have high requirements for space occupancy and require separate protection, which results in high implementation costs. Summary of the invention

[0004] The present application provides a circuit board and a manufacturing method thereof, and an electronic device to solve the problems in the prior art that the circuit board is not conducive to heat dissipation, has high space requirements, requires separate protection, and has high implementation costs.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a circuit board, wherein the circuit board includes: a first core board, a first side surface of the first core board is provided with a first groove body exposing a first circuit layer; a second core board, a second circuit layer is provided inside, a third side surface of the second core board is protrudingly provided with a conductor, one end of the conductor is connected to the second circuit layer, and the other end of the conductor is embedded in the first groove body to connect to the first circuit layer; a chip is provided on the fourth side surface of the second core board and connected to the second circuit layer; wherein the third side surface and the fourth side surface are two opposite side surfaces.

[0006] Wherein, a first conductive connection layer is further provided between the first circuit layer and the conductor.

[0007] The height of the conductor protruding from the third side surface is greater than the depth of the first slot body, so that the second core plate is spaced apart from the first core plate.

[0008] The fourth side is also provided with a first pad, the chip is provided with a second pad corresponding to the first pad, and the second pad is connected to the first pad, so that the first circuit layer is connected to the chip through the conductor, the second circuit layer, the first pad and the second pad.

[0009] The first side surface is also provided with a second slot body exposing the first circuit layer, the second slot body is spaced apart from the first slot body, a first welding layer is provided in the second slot body, and a first circuit element is provided on the first welding layer.

[0010] Among them, the second side of the first core board is also provided with a third groove body exposing the first circuit layer, the third groove body is filled with a second conductive connection layer, the second conductive connection layer is provided with a second welding layer, and the second welding layer is provided with a second circuit element; wherein the first side and the second side are two opposite sides.

[0011] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a method for manufacturing a circuit board, wherein the method for manufacturing the circuit board includes: providing a first core board, opening a first groove body exposing a first circuit layer on a first side of the first core board; forming a conductor protruding from the second circuit layer on a third side of the second core board; embedding the conductor in the first groove body to connect the first circuit layer; arranging a chip on a fourth side of the second core board and connecting the second circuit layer; wherein the third side and the fourth side are two opposite sides.

[0012] Among them, after the step of forming a conductor protruding on the second circuit layer on the third side of the second core board, before the step of embedding the conductor in the first groove body to connect the first circuit layer, it also includes: filling the first groove body with conductive paste; embedding the conductor in the first groove body to connect the first circuit layer includes: immersing part of the conductor in the conductive paste; curing the conductive paste to obtain a first conductive connection layer, so that the conductor is connected to the first circuit layer through the first conductive connection layer.

[0013] In which, a first core board is provided, and after the step of opening a first groove body exposing a first circuit layer on the first side of the first core board, before the step of protruding a conductor on the second circuit layer on the third side of the second core board, it also includes: opening a second groove body exposing the first circuit layer on the first side of the first core board separated from the first groove body; forming a first welding layer in the second groove body; arranging a first circuit element on the first welding layer; opening a third groove body exposing the first circuit layer on the second side of the first core board; wherein the first side and the second side are opposite sides; filling the third groove body with conductive paste to obtain a second conductive connection layer after curing the conductive paste; forming a second welding layer on the second conductive connection layer; and arranging a second circuit element on the second welding layer.

[0014] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide an electronic device, wherein the electronic device includes a housing and a circuit board connected to each other; wherein the circuit board is a circuit board as described in any one of the above items.

[0015] The beneficial effect of the present application is as follows: different from the prior art, the first side of the first core board in the circuit board provided by the present application is provided with a first groove body exposing the first circuit layer, the second core board is provided with a second circuit layer inside, and the third side of the second core board is provided with a conductor protrudingly, one end of the conductor is connected to the second circuit layer, and the other end of the conductor is embedded in the first groove body to connect to the first circuit layer, and the chip is arranged on the fourth side of the second core board and connected to the second circuit layer, so that the high-density interconnection between the core boards and the chips can be effectively realized by utilizing the mutual cooperation between the protruding conductor and the first groove body, which is conducive to the lightweight of the circuit board and the reduction of the thickness; and the distance between each connection position can also be shortened to facilitate heat dissipation, reduce the influence of resistivity fluctuations, and help improve the reliability of complex circuit boards, and at the same time, it is conducive to lightweighting the system, improving the interconnection efficiency of complex circuit boards, reducing the consumption of high-cost materials such as gold wires, and reducing the overall manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0017] Figure 1 It is a structural schematic diagram of an implementation scheme of a circuit board of the present application;

[0018] Figure 2a It is a schematic flow chart of a first embodiment of a method for manufacturing a circuit board of the present application;

[0019] Figure 2b-2j yes Figure 2a A schematic structural diagram of an embodiment corresponding to S21-S24;

[0020] Figure 3a It is a schematic flow chart of a second embodiment of the method for manufacturing a circuit board of the present application;

[0021] Figure 3b yes Figure 3a A schematic structural diagram of an embodiment corresponding to S63;

[0022] Figure 4 It is a schematic flow chart of a third embodiment of the method for manufacturing a circuit board of the present application;

[0023] Figure 5 It is a schematic structural diagram of an embodiment of an electronic device of the present application. DETAILED DESCRIPTION

[0024] In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0025] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0026] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of an embodiment of a circuit board of the present application. In this embodiment, the circuit board 10 includes: a first core board 11, a second core board 12 and a chip 13.

[0027] It is understandable that the first core board 11 and the second core board 12 can specifically be a single-layer patterned copper clad laminate, that is, a circuit layer, or can include at least two layers of patterned copper clad laminates, and an insulating layer is stacked between each adjacent two layers of copper clad laminates in the at least two layers of copper clad laminates, such as any reasonable insulating material layer such as a semi-cured sheet, an insulating resin or a pure glue-like medium; or, the first core board 11 and the second core board 12 can also specifically include one or more of any other reasonable materials that can be used to manufacture circuit boards, such as copper plates, electroplated copper layers, metal conductive holes, conductive columns, heat sinks, embedded components, thermal conductive adhesives, etc., so as to be able to implement the pre-designed circuit logic through circuit units such as patterned copper clad laminates, metal conductive holes, embedded components, etc., and the present application does not limit this.

[0028] Specifically, a first circuit layer 111 is provided inside the first core board 11 to implement the designed circuit logic using the first circuit layer 111, and at least one specific first groove body (not marked in the figure) is also designed on the first side of the first core board 11, which exposes the first circuit layer 111 for connection with other components.

[0029] Among them, a second circuit layer 121 is provided inside the second core board 12, so as to realize the design circuit logic by using the second circuit layer 121. The third side of the second core board 12 is also protruding with at least one conductor 122, that is, the conductor 122 is specifically a protruding structure, and one end of each conductor 122 is connected to the second circuit layer 121 inside the second core board 12 to realize the electrical connection between the internal circuit and the outside. And the other end of each conductor 122 is embedded in the first slot body of the first core board 11 to connect the first circuit layer 111 inside the first core board 11, and can also fix the first core board 11.

[0030] The chip 13 is disposed on the fourth side of the second core board 12 to be connected to the second circuit layer 121 of the second core board 12 , so that the chip 13 can be connected to the first circuit layer 111 through the second circuit layer 121 and the conductor 122 .

[0031] The third side surface and the fourth side surface of the second core plate 12 are two opposite side surfaces.

[0032] It is worth mentioning that the second core board 12 can be specifically understood as a transfer board or an intermediate layer, and its function is to carry multiple groups and types of high-density chips 13, and then connect them to the first core board 11, thereby reducing the adverse effects of directly connecting the high-density pin layout of the chip 13 to the first core board 11, which effectively reduces the difficulty of processing the circuit board 10.

[0033] The above solution realizes the electrical connection between boards through the first slot and the conductor 122 structure, while taking into account the integration of the chip 13, showing the design skills of a complex and compact circuit board 10, taking into account both electrical performance and structural stability. This design is conducive to miniaturized, high-performance electronic devices, especially in scenarios requiring high-density integration and complex circuit layout.

[0034] Furthermore, by utilizing the cooperation between the protruding conductor 122 and the first groove body, high-density interconnection between the core boards and the chips 13 is achieved, which is beneficial to the lightweight and thinning of the circuit board 10 and reducing the thickness. It can also shorten the distance between each connection point to facilitate heat dissipation and reduce the impact of resistivity fluctuations, and help improve the reliability of the complex circuit board 10. At the same time, it is beneficial to lightweight the system, improve the interconnection efficiency of the complex circuit board 10, reduce the consumption of high-cost materials such as gold wire, and reduce the overall manufacturing cost.

[0035] Among them, the first core board 11 also includes a first insulating layer (not marked in the figure), and the first circuit layer 111 is specifically formed in the first insulating layer; the second core board 12 also includes a second insulating layer (not marked in the figure), and the second circuit layer 121 is specifically formed in the second insulating layer.

[0036] In one embodiment, the circuit board 10 further includes a first conductive connection layer 141 , which is disposed between the first circuit layer 111 and the conductor 122 , that is, the conductor 122 can be connected to the first circuit layer 111 through the first conductive connection layer 141 .

[0037] Optionally, the first conductive connection layer 141 can specifically be a cured conductive paste, and the conductive paste can specifically be any reasonable conductive paste such as copper paste or silver paste; wherein the copper paste / silver paste is formed by combining metal copper / metal silver with an adhesive, and the metal copper / metal silver particles are dispersed in the adhesive, which can be filled into a specified position by printing or the like, and has filling and heat dissipation capabilities; the binder usually adopts a synthetic resin, which is a high molecular polymer, such as phenolic resin, epoxy resin, etc., and the present application does not limit this.

[0038] In one embodiment, the conductor 122 protrudes above the height of the third side surface of the second core plate 12, that is, the maximum distance between the other end of the conductor 122 facing the first core plate 11 and the third side surface is greater than the depth of the first groove body, so that when the other end of the conductor 122 is embedded in the first groove body, the second core plate 12 and the first core plate 11 can be spaced apart to facilitate heat dissipation by utilizing the gap between the second core plate 12 and the first core plate 11.

[0039] Furthermore, in another embodiment, an insulating filling layer is provided in the gap between the second core board 12 and the first core board 11 to prevent external impurities such as water vapor from entering through the gap between the second core board 12 and the first core board 11 and affecting the electrical stability of the circuit board 10.

[0040] In other embodiments, the height of the conductor 122 protruding from the third side of the second core board 12 can also be equal to the depth of the first groove body, so as to abut the second core board 12 against the first core board 11, thereby preventing external impurities such as water vapor from entering through the gap between the second core board 12 and the first core board 11 and affecting the electrical stability of the circuit board 10. This application does not limit this.

[0041] In one embodiment, at least one first solder pad (not shown) is provided on the fourth side of the second core board 12, and the chip 13 is provided with a second solder pad 131 corresponding to each first solder pad, and each second solder pad 131 is connected to a corresponding first solder pad, so that the first circuit layer 111 in the first core board 11 can be connected to the chip 13 in sequence through the conductor 122, the second circuit layer 121, the first solder pad and the second solder pad 131, thereby reducing the adverse effects of the chip 13 being directly connected to the first core board 11 due to the high-density solder pads and pin layout, and effectively reducing the difficulty of processing the circuit board 10.

[0042] In one embodiment, the first side surface of the first core board 11 is further provided with at least one second slot body exposing the first circuit layer 111, the second slot body is separated from the first slot body, and a first welding layer 1121 is specifically provided in the second slot body, and a first circuit element 1131 is further mounted on the first welding layer 1121 to realize the designed circuit logic by utilizing the first circuit element 1131 and the first circuit layer 111.

[0043] Optionally, the first circuit element 1131 may be one or more of a capacitor, a resistor, a switch tube, a power supply device, a magnetic core, and a ferrite, which is not limited in the present application.

[0044] Furthermore, in one embodiment, the second side of the first core board 11 is also provided with at least one third slot exposing the first circuit layer 111, and each of the third slots is also filled with a second conductive connection layer 142, and a second welding layer 1122 is also provided on the second conductive connection layer 142. The second welding layer 1122 can specifically include direct welding points of components or wires to increase the convenience and firmness of assembly.

[0045] A second circuit element 1132 is also mounted on each second welding layer 1122, that is, the second circuit element 1132 is directly fixed on the second welding layer 1122 by welding, so as to realize electrical connection with the lower layer circuit, that is, the second conductive connection layer 142 and the first circuit layer 111, so as to utilize the second circuit element 1132 and the second circuit layer 121 to realize the designed circuit logic, and realize highly integrated circuit construction through welding layer and component installation, which fully reflects the high density and versatility of the circuit board 10 design.

[0046] The first side surface and the second side surface of the first core board 11 are two opposite side surfaces, so that circuit components can be mounted and arranged through the two opposite side surfaces, thereby effectively realizing the construction of a highly integrated circuit.

[0047] Optionally, the second circuit element 1132 may be one or more of a capacitor, a resistor, a switch tube, a power supply device, a magnetic core, and a ferrite, which is not limited in the present application.

[0048] Optionally, the second conductive connection layer 142 may be a cured conductive paste, and the conductive paste may be any reasonable conductive paste such as copper paste or silver paste, which is not limited in the present application.

[0049] Furthermore, in one embodiment, a first solder resist layer 114 is further provided on the first side surface and the second side surface of the first core board 11 , and a second solder resist layer 123 is further provided on the third side surface and the fourth side surface of the second core board 12 .

[0050] This application also provides a method for manufacturing a circuit board, see Figure 2a-2j ,in, Figure 2a It is a schematic diagram of the process of the first embodiment of the manufacturing method of the circuit board of the present application. Figure 2b-2j yes Figure 2a The structural diagram of an embodiment corresponding to S21-S24 in FIG. 1 includes the following steps:

[0051] S21: providing a first core board, and opening a first groove on a first side surface of the first core board to expose a first circuit layer.

[0052] like Figure 2b As shown, a first core board 30 is provided, which can specifically be a single-layer patterned copper-clad laminate, that is, a circuit layer, or can include at least two layers of patterned copper-clad laminates, and an insulating layer is stacked between each adjacent two layers of copper-clad laminates in the at least two layers of copper-clad laminates, such as any reasonable insulating material layer such as a semi-cured sheet, an insulating resin or a pure glue-like medium; or, the first core board 30 and the second core board 40 can specifically also include one or more of any other reasonable materials that can be used to manufacture circuit boards, such as copper plates, electroplated copper layers, metal conductive holes, conductive columns, heat sinks, embedded components, thermal conductive adhesives, etc., so as to be able to implement the pre-designed circuit logic through circuit units such as patterned copper-clad laminates, metal conductive holes, embedded components, etc., and the present application does not limit this.

[0053] The first core board 30 has a first circuit layer 32 disposed therein, so as to utilize the first circuit layer 32 to implement the designed circuit logic; the first core board 30 also includes a first insulating layer 31 , and the first circuit layer 32 is specifically formed in the first insulating layer 31 .

[0054] Specifically, the surface holes of the first core board 30 are made, and at least one first groove 301 is opened on the first core board 30 by any reasonable process such as laser depth control / milling, water jet depth control / milling, or chemical copper reduction / etching, until the first circuit layer 32 is exposed from the first groove 301.

[0055] S22: forming a conductor protruding from the second circuit layer on the third side surface of the second core board.

[0056] like Figure 2cAs shown, a second core board 40 is provided, which can specifically be a single-layer patterned copper clad laminate, that is, a circuit layer, or can include at least two layers of patterned copper clad laminates, and an insulating layer is stacked between each adjacent two layers of copper clad laminates in the at least two layers of copper clad laminates, such as any reasonable insulating material layer such as a semi-cured sheet, an insulating resin or a pure glue-like medium; or, the first core board 30 and the second core board 40 can specifically also include one or more of any other reasonable materials that can be used to manufacture circuit boards, such as copper plates, electroplated copper layers, metal conductive holes, conductive columns, heat sinks, embedded components, thermal conductive adhesives, etc., so as to be able to implement the pre-designed circuit logic through circuit units such as patterned copper clad laminates, metal conductive holes, embedded components, etc., and the present application does not limit this.

[0057] Among them, a second circuit layer 42 is provided inside the second core board 40 to utilize the second circuit layer 42 to implement the designed circuit logic, and part of the second circuit layer 42 is exposed from the third side of the second core board 40; the second core board 40 also includes a second insulating layer 41, and the second circuit layer 42 is specifically formed in the second insulating layer 41.

[0058] Specifically, on the second circuit layer 42 on the third side of the second core board 40, any reasonable process such as attaching a photosensitive protective film, exposing, developing, electroplating, etc. is used to form a conductor 43 protruding from the portion of the second circuit layer 42 exposed from the third side.

[0059] S23: embedding a conductor in the first slot to connect the first circuit layer.

[0060] like Figure 2d As shown, the conductor 43 is embedded in the first slot 301 of the first core board 30 so that the conductor 43 is connected to the first circuit layer 32 exposed from the first slot 301 , thereby fixing the second core board 40 on the first core board 30 .

[0061] S24: placing the chip on the fourth side surface of the second core board and connecting it to the second circuit layer.

[0062] Furthermore, if Figure 2d As shown, the chip 50 is disposed on the fourth side of the second core board 40 , and the chip 50 is connected to the second circuit layer 42 of the second core board 40 .

[0063] The third side surface and the fourth side surface of the second core plate 40 are two opposite side surfaces.

[0064] It is worth mentioning that the second core board 40 can be specifically understood as a transfer board or an intermediate layer, and its function is to carry multiple groups and types of high-density chips 50, and then connect them to the first core board 30, thereby reducing the adverse effects of directly connecting the high-density pin layout of the chip 50 to the first core board 30, which effectively reduces the difficulty of processing the circuit board 10.

[0065] Further, in some specific embodiments, such as Figure 2e As shown, the above S21 may specifically include: providing a first core board 30, and sequentially performing surface hole making, drill decontamination, chemical copper deposition, electroplating, photosensitive protective film sticking, exposure, development, and etching on the first core board 30 to open at least one first groove 301 on the first side surface of the first core board 30 to expose the first circuit layer 32.

[0066] It is worth noting that the surface "holes" of the first core board 30, namely the first slots 301, are metallized by electroplating, that is, a "concave" type micro-metallized slot is formed at the holes.

[0067] like Figure 2b As shown, after the above-mentioned etching forms the first groove body 301, the first core board 30 can be further subjected to a surface solder mask ink protective layer to obtain a first solder mask layer 36; and / or, at least one third groove body 303 is opened on the second side of the first core board 30 to expose the first circuit layer 32, and a second conductive connection layer 332 is filled in each of the third groove bodies 303 to form a second welding layer 342 on the second conductive connection layer 332, so as to use the second welding layer 342 to set a second circuit element 352.

[0068] Further, in some specific embodiments, such as Figure 2f , Figure 2g , Figure 2h , Figure 2i as well as Figure 2j As shown, the above S22 may specifically include: providing a first core board 30, and sequentially performing surface hole making, drill decontamination, chemical copper deposition, affixing a first photosensitive protective film 45, exposure, development, and electroplating on the second core board 40, so as to achieve metallization of the surface holes of the second core board 40 and thickening of the conductor layer in the designated area.

[0069] Furthermore, the second core board 40 after electroplating is again subjected to a second photosensitive protective film 46, exposure, development, and electroplating, thereby achieving directional thickening of the "connection position" of the second core board 40, that is, a conductor 43 is formed by protruding on the second circuit layer 42 on the third side of the second core board 40.

[0070] After electroplating again, the photosensitive protective film is removed, fast etching is performed, solder mask ink is printed, and non-connection bit components / chips 50 are welded, so as to use the characteristic process to make a "directional thickened metal boss" with the control point as the connection position, that is, a conductor 43 protruding from the third side of the second core board 40, and solder mask ink is printed on the outer layer to obtain a second solder mask layer 44.

[0071] It is worth noting that the above S22 can be specifically performed before S21, and / or the above S24 can be specifically performed before S23, that is, after the chip 50 is attached to the fourth side of the second core board 40, the conductor 43 is embedded in the first slot 301 to achieve the connection between the first core board 30 and the second core board 40.

[0072] Please refer to the figure Figure 3a-Figure 3b ,in, Figure 3a is a schematic flow chart of a second embodiment of the method for manufacturing a circuit board of the present application, Figure 3b yes Figure 3a The manufacturing method of the circuit board of this embodiment is as follows: Figure 2a A flowchart of a detailed embodiment of a method for manufacturing a circuit board in the present invention is provided, and this embodiment includes the following steps:

[0073] S61: providing a first core board, and opening a first groove on a first side surface of the first core board to expose a first circuit layer.

[0074] S62: Form a conductor protruding from the second circuit layer on the third side surface of the second core board.

[0075] Among them, S61 and S62 are respectively Figure 2a S21 and S22 are the same. Please refer to S21 and S22 and their related text descriptions for details, which will not be repeated here.

[0076] S63: Filling the first slot with conductive paste.

[0077] Specifically, Figure 3b As shown, a certain amount of conductive paste is filled in the first slot 301 of the first core board 30, and the height (h1) of the conductive paste matches the metallization hole position, that is, the depth (S) of the first slot 301 is controlled: S*15%≤h1≤S*80%.

[0078] Optionally, the conductive paste can specifically be any reasonable conductive paste such as copper paste or silver paste; wherein the copper paste / silver paste is formed by combining metal copper / metal silver with an adhesive, and the metal copper / metal silver particles are dispersed in the adhesive, which can be filled into a specified position by printing or the like, and has filling and heat dissipation capabilities; the binder is usually a synthetic resin, which is a high molecular polymer, such as phenolic resin, epoxy resin, etc., and the present application does not limit this.

[0079] S64: Immerse a portion of the conductor in the conductive paste.

[0080] Furthermore, the conductor 43 on the second core board 40 is aligned with the first slot body 301 to be butted at a high temperature, that is, part of the conductor 43 is immersed in the conductive paste.

[0081] S65: curing the conductive paste to obtain a first conductive connection layer, so that the conductor is connected to the first circuit layer through the first conductive connection layer.

[0082] Furthermore, the conductive paste is cured to obtain the first conductive connection layer 331 , so that the conductor 43 is connected to the first circuit layer 32 through the first conductive connection layer 331 , and the connection stability is ensured.

[0083] S66: placing the chip on the fourth side surface of the second core board and connecting it to the second circuit layer.

[0084] Among them, S66 and Figure 2a For details, please refer to S24 and its related text descriptions, which will not be repeated here.

[0085] Please refer to the figure Figure 4 , Figure 4 1 is a flow chart of a third embodiment of the method for manufacturing a circuit board of the present application. The method for manufacturing a circuit board of this embodiment is Figure 2a A flowchart of a detailed embodiment of a method for manufacturing a circuit board in the present invention is provided, and this embodiment includes the following steps:

[0086] S71: providing a first core board, and opening a first groove on a first side surface of the first core board to expose a first circuit layer.

[0087] Among them, S71 is respectively Figure 2a For details, please refer to S21 and its related text descriptions, which will not be repeated here.

[0088] S72: Opening a second slot body on the first side surface of the first core board, separated from the first slot body, to expose the first circuit layer.

[0089] Specifically, the surface holes of the first core board 30 are made by using any reasonable process such as laser depth control / milling, water jet depth control / milling, or chemical copper reduction / etching to open at least one second groove body 302 on the first side surface of the first core board 30 to expose the first circuit layer 32 separated by the first groove body 301.

[0090] S73: forming a first welding layer in the second tank body.

[0091] A first welding layer 341 is formed in each second groove 302 .

[0092] S74: Dispose a first circuit element on the first welding layer.

[0093] A first circuit element 351 is mounted on each first soldering layer 341 , so as to realize the designed circuit logic by using the first circuit element 351 and the first circuit layer 32 .

[0094] Optionally, the first circuit element 351 may be one or more of a capacitor, a resistor, a switch tube, a power supply device, a magnetic core, and a ferrite, which is not limited in the present application.

[0095] S75: Opening a third groove on the second side surface of the first core board to expose the first circuit layer.

[0096] Specifically, the surface holes of the first core board 30 are made, and at least one third groove 303 exposing the first circuit layer 32 is opened on the second side of the first core board 30 by any reasonable process flow such as laser depth control / milling, water jet depth control / milling, or chemical copper reduction / etching.

[0097] S76: filling the third groove with conductive paste, and curing the conductive paste to obtain a second conductive connection layer.

[0098] Each third groove 303 is filled with conductive paste, and the second conductive connection layer 332 is obtained after the conductive paste is cured.

[0099] S77: forming a second welding layer on the second conductive connection layer.

[0100] A second soldering layer 342 is formed on each second conductive connection layer 332 .

[0101] S78: Arrange a second circuit element on the second welding layer.

[0102] A second circuit element 352 is mounted on each second soldering layer 342 , so as to implement the designed circuit logic by using the second circuit element 352 and the second circuit layer 42 .

[0103] Optionally, the second circuit element 352 may be one or more of a capacitor, a resistor, a switch tube, a power supply device, a magnetic core, and a ferrite, which is not limited in the present application.

[0104] S79: Form a conductor protruding from the second circuit layer on the third side surface of the second core board.

[0105] S710: embedding a conductor in the first slot to connect the first circuit layer.

[0106] S711: Place the chip on the fourth side surface of the second core board and connect it to the second circuit layer.

[0107] Among them, S79, S710 and S711 are respectively Figure 2a S22, S23 and S24 are the same, please refer to S22, S23 and S24 and their related text descriptions for details, which will not be repeated here.

[0108] This application also provides an electronic device, see Figure 5 , Figure 5 1 is a schematic diagram of the structure of an electronic device of the present application. In this embodiment, the electronic device 80 includes a housing 81 and a circuit board 82 connected to each other.

[0109] It should be noted that the circuit board 82 described in this embodiment is the circuit board 10 as described in any of the above items. Figure 1 And the related text content will not be repeated here.

[0110] Different from the prior art, the circuit board provided in the present application has a first side surface of the first core board provided with a first groove body exposing the first circuit layer, a second circuit layer is provided inside the second core board, and a conductor is protruding from the third side surface of the second core board, one end of the conductor is connected to the second circuit layer, and the other end of the conductor is embedded in the first groove body to connect to the first circuit layer, and the chip is arranged on the fourth side surface of the second core board and connected to the second circuit layer, so that high-density interconnection between each core board and the chip can be effectively achieved by utilizing the mutual cooperation between the protruding conductor and the first groove body, which is conducive to the lightweight of the circuit board and reducing the thickness; and it can also shorten the distance between each connection position, which is conducive to heat dissipation, and reduces the influence of resistivity fluctuations, and helps to improve the reliability of complex circuit boards. At the same time, it is conducive to lightweighting the system, improving the interconnection efficiency of complex circuit boards, reducing the consumption of high-cost materials such as gold wires, and reducing the overall manufacturing cost.

[0111] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board, characterized in that: The circuit board comprises: A first core board, wherein a first side surface of the first core board is provided with a first slot body exposing a first circuit layer; A second core board, wherein a second circuit layer is provided inside, a third side surface of the second core board is protruding with a conductor, one end of the conductor is connected to the second circuit layer, and the other end of the conductor is embedded in the first slot to connect to the first circuit layer; The chip is arranged on the fourth side surface of the second core board and connected to the second circuit layer; wherein the third side surface and the fourth side surface are two opposite side surfaces.

2. The circuit board according to claim 1, characterized in that: A first conductive connection layer is further provided between the first circuit layer and the conductor.

3. The circuit board according to claim 1, characterized in that: The height of the conductor protruding from the third side surface is greater than the depth of the first slot body, so that the second core plate is spaced apart from the first core plate.

4. The circuit board according to claim 1, characterized in that: The fourth side is also provided with a first pad, the chip is provided with a second pad corresponding to the first pad, and the second pad is connected to the first pad, so that the first circuit layer is connected to the chip through the conductor, the second circuit layer, the first pad and the second pad.

5. The circuit board according to claim 4, characterized in that: The first side surface is further provided with a second slot body exposing the first circuit layer, the second slot body is spaced apart from the first slot body, a first welding layer is provided in the second slot body, and a first circuit element is provided on the first welding layer.

6. The circuit board according to claim 5, characterized in that: The second side of the first core board is also provided with a third groove body exposing the first circuit layer, the third groove body is filled with a second conductive connection layer, the second conductive connection layer is provided with a second welding layer, and the second welding layer is provided with a second circuit element; wherein the first side and the second side are opposite sides.

7. A method for manufacturing a circuit board, characterized in that: The method for manufacturing the circuit board comprises: Providing a first core board, and opening a first slot body exposing a first circuit layer on a first side surface of the first core board; A conductor is formed by protruding on the second circuit layer on the third side surface of the second core board; Embedding the conductor in the first slot to connect the first circuit layer; The chip is arranged on the fourth side surface of the second core board and connected to the second circuit layer; wherein the third side surface and the fourth side surface are two opposite side surfaces.

8. The method for manufacturing a circuit board according to claim 7, characterized in that: After the step of forming a conductor protruding from the second circuit layer on the third side of the second core board and before the step of embedding the conductor in the first slot to connect the first circuit layer, the method further includes: Filling the first tank with conductive paste; The step of embedding the conductor in the first slot to connect the first circuit layer includes: immersing a portion of the conductor into the conductive paste; The conductive paste is cured to obtain a first conductive connection layer, so that the conductor is connected to the first circuit layer through the first conductive connection layer.

9. The method for manufacturing a circuit board according to claim 7, characterized in that: After the step of providing a first core board, opening a first slot to expose the first circuit layer on the first side of the first core board, and before the step of protruding a conductor on the second circuit layer on the third side of the second core board, the method further includes: A second slot body is formed on the first side surface of the first core board, separated from the first slot body, to expose the first circuit layer; forming a first welding layer in the second tank body; Disposing a first circuit element on the first welding layer; A third slot is formed on the second side surface of the first core board to expose the first circuit layer; wherein the first side surface and the second side surface are opposite side surfaces; Filling the third groove with conductive paste to obtain a second conductive connection layer after curing the conductive paste; forming a second welding layer on the second conductive connection layer; A second circuit element is disposed on the second welding layer.

10. An electronic device, characterized in that: The electronic device comprises a housing and a circuit board connected to each other; Wherein, the circuit board is the circuit board as described in any one of claims 1-6.

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