A heating method for PCB design and processing

Abstract

The invention discloses a heating method for PCB design and processing, which belongs to the field of PCB board design and processing, including: determining the heating temperature range and heating size range required for the thermal process zone and each thermal process zone on the PCB board; after obtaining the heating size range of each thermal process zone, selecting a heating device of suitable size, setting the characteristic reference point of each thermal process zone, aligning the heating device with the thermal process zone according to the characteristic reference point, setting the output temperature of the heating device according to the calculated heating temperature range, heating the thermal process zone, and correcting the relative position of the heating device and the thermal process zone; the temperature sensor on the heating device feeds back the real temperature value of the surface of the substrate material when the heating device is heated in real time, adjusting and correcting the output temperature of the heating device until the thermal processing of the substrate material is completed to form a PCB board finished product. The invention ensures uniform and stable heating during the processing of the PCB board by designing a precise heating temperature calculation model, thereby improving the quality and reliability of the PCB board finished product.

Description

Technical Field

[0001] The present invention relates to the field of PCB design and processing, and in particular to a heating method for PCB design and processing. Background Art

[0002] During the PCB production process, specific temperatures are often required for processes such as soldering, drying, welding, and hot-melt sealing. However, traditional heating methods suffer from uneven heating and imprecise temperature control, leading to unstable product quality and even shortening the lifespan of the equipment. Heating different functional areas during the heating process requires precise temperature settings to avoid unstable deformation of the PCB, which can affect the quality of the finished product. Therefore, developing a novel heating method for PCB design and processing is of great significance. Summary of the Invention

[0003] In view of the above-mentioned deficiencies in the prior art, the present invention provides a heating method for PCB design and processing, which distinguishes different functional areas on the PCB board and implements precise heating temperature and heating range.

[0004] In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is:

[0005] A heating method for PCB design and processing is provided, comprising:

[0006] Step S1: Determine the thermal process zones and the required heating temperature range and heating size range of each thermal process zone on the substrate material according to the shape and size parameters of the PCB board design. The thermal process zones include the thermal welding zone, the thermal bending zone, and the thermal sealing zone.

[0007] Step S2: After obtaining the heating size range of each thermal process zone, select a heating device corresponding to the heating size range, set a characteristic reference point for each thermal process zone, align the heating device with the thermal process zone according to the characteristic reference point, set the output temperature of the heating device according to the calculated heating temperature range, heat the thermal process zone, and correct the relative position of the heating device and the thermal process zone in real time;

[0008] Step S3: The temperature sensor on the heating device provides real-time feedback of the actual temperature value of the substrate material surface during heating by the heating device, and adjusts and corrects the output temperature of the heating device until the thermal processing of the substrate material is completed to form a finished PCB board.

[0009] Furthermore, step S1 includes:

[0010] Step S11: Select a substrate material suitable for PCB board processing, and determine the thermal process zone on the substrate material according to the shape and size parameters of the PCB board design. The thermal process zone includes a thermal welding zone, a thermal bending zone, and a thermal sealing zone;

[0011] Step S12: Calculating the heating temperature range and heating size range required for heating the heat welding area, the heat bending area, and the heat sealing area;

[0012] For the heat welding area:

[0013] Obtain the shape and size of the heat-welding area designed on the PCB; if the heat-welding area is circular, determine the center of the heat-welding area O , and dispersion radius R , then the heating size range is centered O is the center and radius R The area where the heat welding area is located; if the heat welding area is square, determine the center of the heat welding area A , and long L He Kuan H , then the heating size range is the center A ,long L He Kuan H within the square range;

[0014] Calculate the heating temperature range of the thermal welding zone;

[0015] According to the different welding depths in the substrate material h Calculate the heat transfer coefficient ;

[0016] ;

[0017] in, k 1 is the thermal conductivity coefficient, is the thermal conductivity of the substrate material, is the thermal expansion coefficient of the substrate material, g is the acceleration due to gravity, t 1 is the ambient temperature of the processing area, T 0 is the ideal temperature for hot welding process in hot welding zone. v is the dynamic viscosity coefficient of air;

[0018] Utilize heat transfer coefficient Calculate the optimal temperature for the heating equipment to heat the heat welding area , get the heating temperature range of the heating equipment to heat the heat welding area , is the error coefficient of the heating equipment;

[0019] For hot bending area:

[0020] Get the chamfer radius of each thermal bending area based on the shape and size parameters of the PCB board design r The central angle corresponding to the chamfer , calculate the heating size range inside and outside the hot bending zone;

[0021] , ;

[0022] The heating size range inside the hot bending zone is length × width = Within the range, the heating size range outside the heat bending zone is length × width = within the scope of l The length of the bending portion designed on the PCB board, d is the thickness of the substrate material;

[0023] Calculate the heating temperature range for the heating equipment to heat the inner and outer sides of the hot bending zone respectively , T 2 is the optimal temperature for the heating equipment to heat the hot bending zone;

[0024] For heat seal area:

[0025] According to the heat sealing area designed on the PCB board, the size range of the heat sealing area is obtained as the heating size range during the heat sealing process;

[0026] Calculate the heating temperature range for heat sealing processing in the heat sealing area according to the sealing medium used in different heat sealing areas , T 3 is the optimal temperature for the heating equipment to heat the heat sealing area.

[0027] Furthermore, in step S12, the optimal temperature is calculated T Method 2 is:

[0028] ;

[0029] in, is the heat transfer coefficient for heating the hot bending zone, It is the ideal temperature for hot bending processing in the hot bending zone. It is the fluctuation function of the thermal conductivity coefficient of the bending part during the thermal bending process as the bending angle changes.

[0030] Furthermore, in step S12, the optimal temperature is calculated T Method 3 is:

[0031] ;

[0032] in, is the heat transfer coefficient for heating the heat sealing area, The lowest temperature at which the substrate material melts during heat sealing processing in the heat sealing area. The lowest temperature at which the sealing medium melts.D It is the minimum weld depth at which the sealing medium can be fixed on the substrate material.

[0033] Furthermore, the method for correcting the relative position of the heating device and the thermal process zone in real time in step S2 is:

[0034] Step S21: After the characteristic reference point of the thermal process area is set, the heating device is aligned with the center of the characteristic reference point, and the initial thermal process area image before heating by the heating device is captured. After the characteristic reference point is identified on the initial thermal process area image, grayscale processing is performed to obtain the grayscale values ​​of all pixels at the location of the characteristic reference point. , The first feature reference point n The gray value of a pixel, n is the number of pixels at the feature reference point;

[0035] Step S22: Calculate the initial positioning coordinates of the feature reference point based on the pixel coordinates of all pixels on the feature reference point ;

[0036] ;

[0037] in, The first feature reference point i The pixel coordinates of pixels;

[0038] Step S23: using the edge pixels on the feature reference point to form a target selection frame of the feature reference point, and the pixel values ​​of the pixels on the target selection frame are used as positioning features;

[0039] Step S24: While the heating device is heating the thermal process zone, a heating process image of the thermal process zone is captured in real time and grayscaled to form a heating process grayscale image. Grayscale values ​​of pixels in the heating process grayscale image are compared with positioning features on the target selection frame to screen out the target selection frame that has been deformed during the heating process, and locate the deformed feature reference point.

[0040] Step S25: Obtain the pixel coordinates of the pixel points on the deformed target selection box , calculate the center pixel coordinates of the deformed feature reference point ;

[0041] ;

[0042] in, m The number of pixels on the selected box for the deformed target;

[0043] Step S26: Calculate the new positioning coordinates of the feature reference point , the heating equipment reference takes the heating process image from the initial positioning coordinates Move to new positioning coordinates , continue to heat the hot process area;

[0044] .

[0045] The present invention has the following beneficial effects: By designing a precise heating temperature calculation model, the present invention sets appropriate heating temperatures for different processing zones on a PCB board, enabling precise adjustment of heating parameters. This ensures uniform and stable heating during PCB processing, avoiding quality issues caused by uneven and irrational heating. The heating range of the heating equipment can be adjusted promptly based on the varying deformation of the substrate material during the heating process. This highly automated process improves production efficiency and enhances the quality and reliability of the finished PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 Flowchart of the heating method designed for PCB processing. DETAILED DESCRIPTION

[0047] The specific embodiments of the present invention are described below to facilitate understanding of the present invention by those skilled in the art. However, it should be clear that the present invention is not limited to the scope of the specific embodiments. For those skilled in the art, as long as various changes are within the spirit and scope of the present invention as defined and determined by the appended claims, these changes are obvious, and all inventions and creations utilizing the concepts of the present invention are protected.

[0048] like Figure 1 As shown, a heating method for PCB design processing includes:

[0049] Step S1: Determine the thermal process zones and the required heating temperature and size ranges for each zone on the substrate material based on the designed shape and size parameters of the PCB board. The thermal process zones include the thermal welding zone, the thermal bending zone, and the thermal sealing zone. With the development of intelligent technology, PCB boards are becoming increasingly functional, their internal and external structures are becoming increasingly complex, and the processing technology is also becoming increasingly complex. During the thermal process, the heating of the thermal process zones must ensure accurate temperature control and a reasonable heating range to ensure high-precision processing.

[0050] Step S1 specifically includes:

[0051] Step S11: Select a substrate material suitable for PCB board processing, and determine the thermal process zones on the substrate material according to the shape and size parameters of the PCB board design. The thermal process zones include the thermal welding zone, the thermal bending zone, and the thermal sealing zone; different thermal process zones in the thermal welding zone, the thermal bending zone, and the thermal sealing zone require different heating temperatures.

[0052] Step S12: Calculating the heating temperature range and heating size range required for heating the heat welding area, the heat bending area, and the heat sealing area;

[0053] For the heat welding area:

[0054] Obtain the shape and size of the heat-welding area designed on the PCB; if the heat-welding area is circular, determine the center of the heat-welding area O , and dispersion radius R , then the heating size range is centered O is the center and radius R The area where the heat welding area is located; if the heat welding area is square, determine the center of the heat welding area A , and long L He Kuan H , then the heating size range is the center A ,long L He Kuan H within the square range;

[0055] Calculate the heating temperature range of the thermal welding zone;

[0056] According to the different welding depths in the substrate material h Calculate the heat transfer coefficient ;

[0057] ;

[0058] in, k 1 is the thermal conductivity coefficient, is the thermal conductivity of the substrate material, is the thermal expansion coefficient of the substrate material, g is the acceleration due to gravity, t 1 is the ambient temperature of the processing area, T 0 is the ideal temperature for hot welding process in hot welding zone. v is the dynamic viscosity coefficient of air;

[0059] Utilize heat transfer coefficient Calculate the optimal temperature for the heating equipment to heat the heat welding area , get the heating temperature range of the heating equipment to heat the heat welding area , is the error coefficient of the heating equipment;

[0060] For hot bending area:

[0061] Get the chamfer radius of each thermal bending area based on the shape and size parameters of the PCB board design r The central angle corresponding to the chamfer , calculate the heating size range inside and outside the hot bending zone;

[0062] , ;

[0063] The heating size range inside the hot bending zone is length × width = Within the range, the heating size range outside the heat bending zone is length × width = within the scope of l The length of the bending portion designed on the PCB board, d is the thickness of the substrate material;

[0064] Calculate the heating temperature range for the heating equipment to heat the inner and outer sides of the hot bending zone respectively , T 2 is the optimal temperature for the heating equipment to heat the hot bending zone;

[0065] Calculating the optimal temperature T Method 2 is:

[0066] ;

[0067] in, is the heat transfer coefficient for heating the hot bending zone, It is the ideal temperature for hot bending processing in the hot bending zone. It is the fluctuation function of the thermal conductivity coefficient of the bending part during the thermal bending process as the bending angle changes.

[0068] During the thermal bending process of the bend portion on the PCB board, as the thermal bending process proceeds, the heat dissipation effect of the chamfered area changes, and the required heating temperature also changes. The present invention establishes an integral equation to represent the change of the thermal conductivity coefficient as the thermal bending process progresses, and then dynamically controls the heating temperature of the thermal bending process. Generally, as the thermal bending angle increases, the heat exchange between the chamfered outer side of the thermal bending part and the air becomes easier, and the required heating temperature becomes higher. The fluctuation function is the central angle A linear equation related to thermal conductivity, central angle The larger the thermal conductivity, the greater the central angle The smaller it is, the smaller the thermal conductivity coefficient is.

[0069] For heat seal area:

[0070] According to the heat sealing area designed on the PCB board, the size range of the heat sealing area is obtained as the heating size range during the heat sealing process;

[0071] Calculate the heating temperature range for heat sealing processing in the heat sealing area according to the sealing medium used in different heat sealing areas , T 3 is the optimal temperature for the heating equipment to heat the heat sealing area.

[0072] Calculating the optimal temperature T Method 3 is:

[0073] ;

[0074] in, is the heat transfer coefficient for heating the heat sealing area, The lowest temperature at which the substrate material melts during heat sealing processing in the heat sealing area. The lowest temperature at which the sealing medium melts. D It is the minimum weld depth at which the sealing medium can be fixed on the substrate material.

[0075] Step S2: After obtaining the heating size range of each thermal process zone, select the heating equipment corresponding to the heating size range, set the characteristic reference point of each thermal process zone, align the heating equipment with the thermal process zone according to the characteristic reference point, and set the output temperature of the heating equipment according to the calculated heating temperature range to heat the thermal process zone, and correct the relative position of the heating equipment and the thermal process zone in real time.

[0076] The method for correcting the relative position of the heating device and the thermal process zone in real time in step S2 is:

[0077] Step S21: After the characteristic reference point of the thermal process area is set, the heating device is aligned with the center of the characteristic reference point, and the initial thermal process area image before heating by the heating device is captured. After the characteristic reference point is identified on the initial thermal process area image, grayscale processing is performed to obtain the grayscale values ​​of all pixels at the location of the characteristic reference point. , The first feature reference point n The gray value of a pixel, n is the number of pixels at the feature reference point;

[0078] Step S22: Calculate the initial positioning coordinates of the feature reference point based on the pixel coordinates of all pixels on the feature reference point ;

[0079] ;

[0080] in, The first feature reference point i The pixel coordinates of pixels;

[0081] Step S23: using the edge pixels on the feature reference point to form a target selection frame of the feature reference point, and the pixel values ​​of the pixels on the target selection frame are used as positioning features;

[0082] Step S24: While the heating device is heating the thermal process zone, a heating process image of the thermal process zone is captured in real time and grayscaled to form a heating process grayscale image. Grayscale values ​​of pixels in the heating process grayscale image are compared with positioning features on the target selection frame to screen out the target selection frame that has been deformed during the heating process, and locate the deformed feature reference point.

[0083] Step S25: Obtain the pixel coordinates of the pixel points on the deformed target selection box , calculate the center pixel coordinates of the deformed feature reference point ;

[0084] ;

[0085] in, m The number of pixels on the selected box for the deformed target;

[0086] Step S26: Calculate the new positioning coordinates of the feature reference point , the heating equipment reference takes the heating process image from the initial positioning coordinates Move to new positioning coordinates , continue to heat the hot process area;

[0087] .

[0088] Step S3: The temperature sensor on the heating device provides real-time feedback of the actual temperature value of the substrate material surface during heating by the heating device, and adjusts and corrects the output temperature of the heating device until the thermal processing of the substrate material is completed to form a finished PCB board.

[0089] By designing a precise heating temperature calculation model, this invention sets appropriate heating temperatures for different processing zones on a PCB, enabling precise adjustment of heating parameters. This ensures uniform and stable heating during PCB processing, avoiding quality issues caused by uneven and irrational heating. The heating range of the heating equipment can be adjusted promptly based on the varying deformation of the substrate material during the heating process. This highly automated process improves production efficiency and enhances the quality and reliability of the finished PCB.

Claims

1. A heating method for PCB design and processing, characterized in that: include: Step S1: determining the thermal process zones and the required heating temperature range and heating size range of each thermal process zone on the substrate material according to the shape and size parameters of the PCB board design, the thermal process zones including the thermal welding zone, the thermal bending zone and the thermal sealing zone; Step S2: After obtaining the heating size range of each thermal process zone, a heating device corresponding to the heating size range is selected, and a characteristic reference point of each thermal process zone is set. The heating device is aligned with the thermal process zone according to the characteristic reference point, and the output temperature of the heating device is set according to the calculated heating temperature range, and the thermal process zone is heated, and the relative position of the heating device and the thermal process zone is corrected in real time; Step S3: The temperature sensor on the heating device feeds back the actual temperature value of the substrate material surface when the heating device is heating in real time, and adjusts and corrects the output temperature of the heating device until the thermal processing of the substrate material is completed to form a finished PCB board; The step S1 comprises: Step S11: selecting a substrate material suitable for PCB board processing, and determining a thermal process zone on the substrate material according to the shape and size parameters of the PCB board design, the thermal process zone including a thermal welding zone, a thermal bending zone and a thermal sealing zone; Step S12: Calculating the heating temperature range and heating size range required for heating the heat welding area, the heat bending area and the heat sealing area; For the heat welding area: Get the shape and size of the heat-welding area designed on the PCB; if the heat-welding area is circular, determine the center of the heat-welding area O , and dispersion radius R , the heating size range is centered O is the center and radius R If the heat-welding area is a square, determine the center of the heat-welding area. A , and long L He Kuan H , then the heating size range is centered A ,long L He Kuan H within the square range; Calculate the heating temperature range of the thermal welding zone; According to the different welding depths of the heat welding zone in the substrate material h Calculate the heat transfer coefficient ; ； in, k 1 is the thermal conductivity coefficient, is the thermal conductivity of the substrate material, is the thermal expansion coefficient of the substrate material, g is the acceleration due to gravity, t 1 is the ambient temperature of the processing area, T 0 is the ideal temperature for hot welding in the hot welding zone. v is the dynamic viscosity coefficient of air; Using heat transfer coefficient Calculate the optimal temperature for the heating equipment to heat the heat welding area , get the heating temperature range of the heating equipment to heat the heat welding area , is the error coefficient of the heating equipment; For hot bending area: Get the chamfer radius of each thermal bending area based on the shape and size parameters of the PCB board design r The center angle corresponding to the chamfer , calculate the heating size range inside and outside the hot bending zone; ， ； The heating size range of the inner side of the hot bending zone is length × width = Within the range, the heating size range outside the heat bending zone is length × width = within the range of l The length of the bending part designed on the PCB board, d is the thickness of the substrate material; Calculate the heating temperature range for the heating equipment to heat the inner and outer sides of the hot bending zone respectively , T 2 is the optimal temperature for the heating equipment to heat the hot bending zone; For heat seal area: According to the heat sealing area designed on the PCB board, the size range of the heat sealing area is obtained as the heating size range during the heat sealing process; Calculate the heating temperature range for heat sealing processing in the heat sealing area according to the sealing medium used in different heat sealing areas , T 3 is the optimal temperature for the heating device to heat the heat sealing area; The optimal temperature is calculated in step S12 T Method 2 is: ； in, is the heat transfer coefficient for heating the thermal bending zone, It is the ideal temperature for hot bending processing in the hot bending area. is the fluctuation function of the thermal conductivity coefficient of the bending part during the thermal bending process as the bending angle changes; The optimal temperature is calculated in step S12 T The method of 3 is: ； in, is the heat transfer coefficient for heating the heat sealing area, It is the lowest temperature at which the substrate material melts during heat sealing process in the heat sealing area. The lowest temperature at which the sealing medium melts. D It is the minimum welding depth at which the sealing medium can be fixed on the substrate material.

2. The heating method for PCB design processing according to claim 1, characterized in that: The method for real-time correction of the relative position between the heating device and the thermal process zone in step S2 is: Step S21: After the characteristic reference point of the thermal process area is set, the heating device is aligned with the center of the characteristic reference point, and the initial thermal process area image before heating by the heating device is captured. After the characteristic reference point is identified on the initial thermal process area image, grayscale processing is performed to obtain the grayscale values ​​of all pixels at the location of the characteristic reference point. , The first feature reference point n The gray value of a pixel, n is the number of pixels at the feature reference point; Step S22: Calculate the initial positioning coordinates of the feature reference point based on the pixel coordinates of all pixels on the feature reference point ; ； in, The first feature reference point i The pixel coordinates of pixels; Step S23: using edge pixels on the feature reference point to form a target selection box of the feature reference point, and using pixel values ​​of pixels on the target selection box as positioning features; Step S24: when the heating device heats the thermal process area, a heating process image of the thermal process area is captured in real time, and grayscale processing is performed to form a heating process grayscale image, and the grayscale values ​​of pixels on the heating process grayscale image are compared with the positioning features on the target selection frame, the target selection frame after deformation of the thermal process area during the heating process is screened out, and the deformed feature reference point is located; Step S25: Obtain the pixel coordinates of the pixel points on the deformed target selection box , calculate the center pixel coordinates of the deformed feature reference point ; ； in, m The number of pixels on the selection box for the deformed target; Step S26: Calculate the new positioning coordinates of the feature reference point , the heating equipment references the heating process image from the initial positioning coordinates Move to new positioning coordinates , continue to heat the hot process area; 。

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