Circuit board printing method for monitoring alignment degree between any layers

Abstract

The invention provides a circuit board printing method for monitoring alignment between any layers, which comprises the following steps: S1, designing corresponding Coupons on even layers of different core boards, setting the Coupons through a paint spraying device, and monitoring the alignment condition between any layers of a multi-layer board through X-Ray; s2, the Symbol size is explained as follows: the outer diameter a of the circular ring is 0.8 mm, the inner diameter b of the circular ring is 0.5 mm, and the diameter c of the circular PAD is 0.4 mm; the center distance d of the adjacent Symbols is 1.0 mm; and S3, the Coupon design of different layers is shown in the following figure 4, and after the core plates of different layers are subjected to hot melting superposition, the alignment condition between the two layers can be judged through the overlap ratio of the circular PADs after any two layers are superposed. The invention provides a circuit board printing method for monitoring alignment between any layers, which can monitor the alignment between any layers of a multi-layer board through X-Ray by designing corresponding Coupons in even layers of different core boards, can effectively monitor the alignment between any core boards of the multi-layer board, and provides a new method for quality judgment and improvement of the alignment between the layers. And a basis is provided for optimizing expansion and shrinkage compensation among different core plates.

Description

Technical Field

[0001] The invention relates to the field of circuit board processing, and in particular to a circuit board printing method for monitoring the alignment degree between any layers. Background Art

[0002] In today's rapidly developing technological era, the field of electronic technology is undergoing unprecedented changes. As electronic products continue to develop towards miniaturization and high performance, the technical requirements of printed circuit boards (PCBs), as the core components of electronic products, are also increasing. In PCB manufacturing, high-layer boards are more and more widely used. In recent years, with the rapid advancement of technology, the number of layers of products has continued to increase, and the spacing from holes to copper conductors has become smaller and smaller. This trend has brought many challenges, especially the alignment requirements for high-layer boards have become more and more stringent. High-layer boards play a vital role in electronic devices. They carry various electronic components and realize circuit connection and signal transmission. In order to ensure the reliability of the product, accurate inter-layer alignment is one of the key factors. If the inter-layer alignment deviates, it may cause poor circuit connection, blocked signal transmission, and even affect the entire electronic device. At present, for some high-layer boards with more than 16L layers, the traditional concentric circle coupon method has gradually revealed its limitations in determining the alignment between layers. The traditional concentric circle coupon mainly determines the alignment between layers by measuring the relative positions of the concentric circle patterns on different layers. However, with the increase in the number of layers and the improvement of design requirements, this method can no longer comprehensively and effectively determine whether the alignment between any layers meets the design requirements. On the one hand, the traditional method can only perform limited alignment detection on specific layers and cannot cover all interlayer combinations. For high-layer boards, the alignment between any two layers may affect the quality and performance of the product, and the traditional concentric circle coupon is difficult to meet the monitoring needs for the alignment between any layers. On the other hand, as the spacing from the hole to the copper conductor decreases, the accuracy requirements for alignment are higher.Traditional methods may not be able to accurately detect tiny alignment deviations, and thus fail to discover potential quality problems in a timely manner. In the production process of high-layer boards, the alignment deviation of any layer may be magnified in subsequent manufacturing links, ultimately leading to an increase in product defect rates. In order to meet these challenges and meet the market's increasingly stringent quality requirements for high-layer boards, it is urgent to design a new inter-layer alignment coupon. This new coupon should be able to effectively monitor the alignment between any layers and provide accurate quality feedback for the production process. By real-time monitoring of inter-layer alignment, the production process can be adjusted in a timely manner to improve the yield and reliability of the product. The new inter-layer alignment coupon can Adopt more advanced measurement technology and design concepts. For example, high-precision optical detection equipment can be used in combination with digital image processing technology to achieve accurate measurement of interlayer alignment. At the same time, by optimizing the design structure of Coupon, it can better adapt to the complex structure and tight spacing requirements of high-layer boards. In short, under the background of rapid development of electronic technology, the requirements for interlayer alignment of high-layer boards are constantly increasing. The traditional concentric circle Coupon method can no longer meet the demand. Designing a new interlayer alignment Coupon is of great significance to improving product yield and reliability. This is not only a challenge faced by the PCB manufacturing industry, but also an opportunity to promote technological progress in the industry.

[0003] The currently commonly used concentric circle coupon design can only monitor whether adjacent layers are offset. When the number of layers is large, it is impossible to effectively monitor the alignment between any layers.

[0004] Therefore, it is necessary to provide a circuit board printing method for monitoring the alignment between any layers to solve the above technical problems. Summary of the invention

[0005] The present invention provides a circuit board printing method for monitoring the alignment between any layers, which solves the problem that the currently commonly used concentric circle coupon design can only monitor whether adjacent layers are offset, and when the number of layers is large, the alignment between any layers cannot be effectively monitored.

[0006] In order to solve the above technical problems, the present invention provides a circuit board printing method for monitoring the alignment between any layers, comprising the following steps: S1: by designing corresponding coupons on the even layers of different core boards, the coupons are set by a paint spraying device, and the alignment between any layers of the multilayer board can be monitored by X-Ray, as follows Figure 1 As shown;

[0007] S2: Take the Symbol size as an example: the outer diameter of the ring a: 0.8mm, the inner diameter of the ring b: 0.5mm, the diameter of the circle PAD c: 0.4mm; the center distance between adjacent Symbols d: 1.0mm, such as Figure 2 and Figure 3 As shown;

[0008] S3: Coupon designs for different levels are as follows Figure 4 As shown, the hot-melt stacking of different core panels is shown in the figure below. Figure 4 As shown in the last figure, the alignment between any two layers can be determined by the overlap of the circular PADs after the two layers are superimposed;

[0009] S4: Observe the symmetrical layout of the four corners of the work board, such as Figure 5 shown.

[0010] Preferably, the core panels of different layers can also be stacked by riveting.

[0011] Preferably, in the step S1 of the coupon design for monitoring the alignment between any layers, a paint spraying device is required when setting the coupon, and the paint spraying device comprises: a moving device; a rotating device is slidably mounted on the bottom of the moving device, the moving device comprises a connecting box, a moving slot, a first servo motor and a reciprocating screw, and the rotating device comprises a fixed box, a second servo motor, a rotating box and a threaded block;

[0012] Threaded ring plates, four of which are fixedly mounted on the four sides of the bottom of the rotating device, respectively, and the outer surface of the threaded ring plates is threadedly engaged with a storage device, and the storage device includes a storage cylinder, a feed pipe, a pump body and a threaded groove;

[0013] A discharging device is threadedly engaged with the bottom of the outer surface of the storage device.

[0014] Preferably, the movable groove is opened in the middle of the bottom of the connecting box, the first servo motor is fixedly installed on one side of the outer surface of the connecting box, and the reciprocating screw is fixedly connected to the output shaft of the first servo motor.

[0015] Preferably, the threaded block is threadably engaged with the outer surface of the reciprocating screw, the fixed box is fixedly installed at the bottom of the threaded block, the second servo motor is fixedly installed in the middle of the bottom of the fixed box, and the rotating box is fixedly connected to the bottom end of the output shaft of the second servo motor.

[0016] Preferably, the storage barrel is threadedly engaged with the outer surface of the threaded ring plate, the feed pipe is fixedly mounted on one side of the outer surface of the storage barrel, the thread groove is opened in the middle of the top of the feed pipe, and the pump body is arranged on the surface of the storage barrel.

[0017] Preferably, the threaded ring block is threadably engaged with the bottom of the threaded groove, and the blanking cone barrel is fixedly connected to the bottom of the threaded ring block.

[0018] Preferably, the threaded block and the movable groove are matched.

[0019] A connecting rod is fixedly installed in the middle of the top of the connecting box, and a base is fixedly installed at the bottom end of the connecting rod.

[0020] A control panel is fixedly mounted on the top of the fixing box.

[0021] Compared with the related art, the circuit board printing method for monitoring the alignment between any layers provided by the present invention has the following beneficial effects:

[0022] The present invention provides a circuit board printing method for monitoring the alignment between any layers. By designing corresponding coupons on even layers (or odd layers) of different core boards, the alignment between any layers of a multilayer board can be monitored by X-Ray, and the alignment between any core boards of a high-layer board can be effectively monitored, providing a basis for quality judgment, improving interlayer alignment, optimizing expansion and contraction compensation between different core boards, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic structural diagram of a first embodiment of a circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention;

[0024] Figure 2 A schematic diagram showing an example of Symbol size for a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention;

[0025] Figure 3 A schematic diagram of the arrangement of a circuit board printing method for monitoring the alignment between any layers provided by the present invention;

[0026] Figure 4 Coupon designs of different layers for a circuit board printing method for monitoring the alignment between any layers provided by the present invention;

[0027] Figure 5 The four corners of the working board of the circuit board printing method for monitoring the alignment between any layers provided by the present invention are symmetrically arranged;

[0028] Figure 6 A schematic structural diagram of a second embodiment of a circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention;

[0029] Figure 7 for Figure 6 The schematic diagram of the structure of the mobile device shown;

[0030] Figure 8 for Figure 6 The schematic diagram of the rotating device structure shown;

[0031] Fig. 9 for Figure 6 The schematic diagram of the discharging device structure shown;

[0032] Fig.10 for Figure 6 The schematic diagram of the storage device structure is shown.

[0033] Numbers in the figure: 1. Moving device, 101. Connecting box, 102. Moving groove, 103. Servo motor, 104. Reciprocating screw, 2. Rotating device, 201. Fixed box, 202. Servo motor, 203. Rotating box, 204. Threaded block, 3. Control panel, 4. Storage device, 41. Storage cylinder, 42. Feed pipe, 43. Pump body, 44. Threaded groove, 5. Discharging device, 51. Unloading cone barrel, 52. Threaded ring block, 6. Connecting rod, 7. Base, 8. Threaded ring plate. DETAILED DESCRIPTION

[0034] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0035] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 A schematic structural diagram of a first embodiment of a circuit board printing method for monitoring the alignment between arbitrary layers provided by the present invention; Figure 2 A schematic diagram showing an example of Symbol size for a circuit board printing method for monitoring alignment between arbitrary layers provided by the present invention; Figure 3 A schematic diagram of the arrangement of a circuit board printing method for monitoring the alignment between any layers provided by the present invention; Figure 4 Coupon designs of different layers for a circuit board printing method for monitoring the alignment between any layers provided by the present invention; Figure 5 The present invention provides a circuit board printing method for monitoring the alignment between any layers, with the four corners of the working board symmetrically arranged. A circuit board printing method for monitoring the alignment between any layers, comprising the following steps: S1: by designing corresponding coupons on the even layers of different core boards, the coupons are set by a spray paint device, and the alignment between any layers of the multilayer board can be monitored by X-Ray, as follows Figure 1 As shown;

[0036] S2: Take the Symbol size as an example: the outer diameter of the ring a: 0.8mm, the inner diameter of the ring b: 0.5mm, the diameter of the circle PAD c: 0.4mm; the center distance between adjacent Symbols d: 1.0mm, such as Figure 2 and Figure 3 As shown;

[0037] S3: Coupon designs for different levels are as follows Figure 4 As shown, the hot-melt stacking of different core panels is shown in the figure below. Figure 4 As shown in the last figure, the alignment between any two layers can be determined by the overlap of the circular PADs after the two layers are superimposed;

[0038] S4: Observe the symmetrical layout of the four corners of the work board, such as Figure 5 shown.

[0039] The core panels of different layers can also be stacked by riveting.

[0040] Symbol size can be changed. As a measurement reference, take the even-numbered layers as an example. Figure 4 The first picture shows the display of the second layer. The even numbers are set to 2, 4, 6, etc. The first even-numbered picture is the second stacked circuit board. A point is sprayed on the board with horizontal and vertical coordinates of 1, 1. The second even-numbered picture is the fourth stacked circuit board. Two points are sprayed on the board with horizontal and vertical coordinates of 2, 2. When the first, second and third circuit boards are stacked, the point in the middle of the connecting hole is intuitively observed, and the distance between the points can be measured to determine whether there is an offset.

[0041] The working principle of a circuit board printing method for monitoring the alignment between any layers provided by the present invention is as follows:

[0042] During operation, firstly, because layer deviation mainly occurs between different core boards, the probability of layer deviation between the same core boards is small. Therefore, in order to reduce the size of the overall coupon and facilitate monitoring, coupon graphics are only designed on the even-numbered layers (or odd-numbered layers, whichever is 1) of different core boards;

[0043] Note 2: Numbers and letters represent corresponding levels; letter A represents 10, B represents 12, C represents 14, D represents 16, E represents 18, F represents 20, and so on.

[0044] like Figure 2 As shown in the figure, the parameters such as the Symbol size are illustrated as follows: the outer diameter of the ring a: 0.8mm, the inner diameter of the ring b: 0.5mm, the diameter of the circle PAD c: 0.4mm; the center distance between adjacent Symbols d: 1.0mm.

[0045] The coupon designs for different levels are as follows Figure 4 As shown, the hot-melt or riveted stacking of core panels of different layers is shown in the last figure above. The alignment between the two layers can be determined by the overlap between the circular PADs or circles after any two layers are stacked.

[0046] like Figure 4 As shown, taking the even-numbered layers as an example, Figure 4The first picture shows the display of the second layer. The even numbers are set to 2, 4, 6, etc. The first even-numbered picture is the second stacked circuit board. A point is sprayed on the board with horizontal and vertical coordinates of 1, 1. The second even-numbered picture is the fourth stacked circuit board. Two points are sprayed on the board with horizontal and vertical coordinates of 2, 2. When the first, second and third circuit boards are stacked, the point in the middle of the connecting hole is intuitively observed, and the distance between the points can be measured to determine whether there is an offset.

[0047] Compared with the related art, the circuit board printing method for monitoring the alignment between any layers provided by the present invention has the following beneficial effects:

[0048] The present invention provides a circuit board printing method for monitoring the alignment between any layers. By designing corresponding coupons on even layers (or odd layers) of different core boards, the alignment between any layers of a multilayer board can be monitored by X-Ray, and the alignment between any core boards of a high-layer board can be effectively monitored, providing a basis for quality judgment, improving interlayer alignment, optimizing expansion and contraction compensation between different core boards, etc.

[0049] Second embodiment

[0050] Please refer to Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 Based on the circuit board printing method for monitoring the alignment between any layers provided in the first embodiment of the present application, the second embodiment of the present application proposes another circuit board printing method for monitoring the alignment between any layers. The second embodiment is only a preferred method of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0051] Specifically, the second embodiment of the present application provides a circuit board printing method for monitoring the alignment between any layers. The difference is that, in a circuit board printing method for monitoring the alignment between any layers, in step S1 of the coupon design for monitoring the alignment between any layers, a paint spraying device is required when setting the coupon, and the paint spraying device includes: a moving device 1; a rotating device 2 is slidably installed at the bottom of the moving device 1, and the moving device 1 includes a connecting box 101, a moving slot 102, a first servo motor 103 and a reciprocating screw rod 104, and the rotating device 2 includes a fixed box 201, a second servo motor 202, a rotating box 203 and a threaded block 204;

[0052] Threaded ring plates 8, four of which are fixedly mounted around the bottom of the rotating device 2, respectively, and the outer surface of the threaded ring plates 8 is threadedly engaged with a storage device 4, and the storage device 4 includes a storage cylinder 41, a feed pipe 42, a pump body 43 and a threaded groove 44;

[0053] The discharging device 5 is threadedly engaged with the bottom of the outer surface of the storage device 4 .

[0054] The moving groove 102 is opened in the middle of the bottom of the connection box 101 , the first servo motor 103 is fixedly installed on one side of the outer surface of the connection box 101 , and the reciprocating screw rod 104 is fixedly connected to the output shaft of the first servo motor 103 .

[0055] The threaded block 204 is threadedly engaged with the outer surface of the reciprocating screw 104 , the fixed box 201 is fixedly installed at the bottom of the threaded block 204 , the second servo motor 202 is fixedly installed in the middle of the bottom of the fixed box 201 , and the rotating box 203 is fixedly connected to the bottom end of the output shaft of the second servo motor 202 .

[0056] The storage cylinder 41 is threadedly engaged with the outer surface of the threaded ring plate 8 , the feed pipe 42 is fixedly installed on one side of the outer surface of the storage cylinder 41 , the thread groove 44 is opened in the middle of the top of the feed pipe 42 , and the pump body 43 is arranged on the surface of the storage cylinder 41 .

[0057] The threaded ring block 52 is threadably engaged with the bottom of the threaded groove 44 , and the unloading cone barrel 51 is fixedly connected to the bottom of the threaded ring block 52 .

[0058] The threaded block 204 is matched with the moving groove 102 .

[0059] A connecting rod 6 is fixedly installed in the middle of the top of the connecting box 1 , and a base 7 is fixedly installed at the bottom end of the connecting rod 6 .

[0060] A control panel 3 is fixedly mounted on the top of the fixing box 201 .

[0061] The working principle of a circuit board printing method for monitoring the alignment between any layers provided by the present invention is as follows:

[0062] During operation, the storage cylinder 41 is first rotated to make the thread groove 44 threadably engaged and disengaged from the thread ring plate 8. After the storage cylinder 41 is removed, the unloading cone barrel 51 is rotated, and the thread ring block 52 is removed from the thread groove 44 for cleaning.

[0063] The spraying material is added to the interior of the storage cylinder 41 through the feed pipe 42 , and a mounting cap is threadedly mounted on the surface of the feed pipe 42 .

[0064] An external power supply controls the first servo motor 103 to rotate and drive the reciprocating screw 104 to rotate. The reciprocating screw 104 rotates the thread to engage the threaded block 204. The threaded block 204 drives the fixed box 201 to slide left and right. The output shaft of the second servo motor 202 is controlled by an external power supply to rotate and drive the rotating box 203 and the storage device 4 to rotate, so as to adjust the spraying position and select the spraying color.

[0065] Compared with the related art, the circuit board printing method for monitoring the alignment between any layers provided by the present invention has the following beneficial effects:

[0066] The present invention provides a circuit board printing method for monitoring the alignment between any layers. The storage cylinder 41 is rotated to make the threaded groove 44 threadably engaged and disengaged from the threaded ring plate 8, and the storage device 4 is disassembled for cleaning. The user can also disassemble the unloading cone barrel 51 from the surface of the storage device 4 to improve the cleaning effect of the storage device 4. At the same time, multiple storage devices 4 can be provided to store multiple colors for spraying, thereby improving the recognition of different marks. The device has a simple structure and strong practicality. The operator can conveniently disassemble the storage device 4 storing paint, which is convenient for the operator to disassemble and clean the storage device 4, thereby keeping the inside of the storage device 4 clean, reducing pigment residue, and maintaining the singleness of color during the next spraying.

[0067] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A circuit board printing method for monitoring the alignment between arbitrary layers, characterized in that: The following steps are involved: S1: By designing corresponding coupons on the even-numbered layers of different core boards, the coupons are set through a spray paint device, and the alignment between any layers of the multilayer board can be monitored by X-Ray, as shown in Figure 1 below; S2: Take the Symbol size as an example: the outer diameter of the ring a: 0.8mm, the inner diameter of the ring b: 0.5mm, the diameter of the circle PAD c: 0.4mm; the center distance between adjacent Symbols d: 1.0mm, as shown in Figures 2 and 3; S3: Coupon designs of different layers are shown in Figure 4 below. The diagram of core panels of different layers after hot-melt stacking is shown in the last figure of Figure 4. The alignment between any two layers can be determined by the overlap of the circular PADs after stacking. S4: Observe the symmetrical layout of the four corners of the work board, as shown in Figure 5.

2. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 1, characterized in that: The core panels of different layers can also be stacked by riveting.

3. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 1, characterized in that: In the step S1 of the coupon design for monitoring the alignment between any layers, a spray paint device is required when setting the coupon, and the spray paint device includes: a moving device; a rotating device is slidably mounted at the bottom of the moving device, the moving device includes a connecting box, a moving slot, a first servo motor and a reciprocating screw, and the rotating device includes a fixed box, a second servo motor, a rotating box and a threaded block; Threaded ring plates, four of which are fixedly mounted on the four sides of the bottom of the rotating device, respectively, and the outer surface of the threaded ring plates is threadedly engaged with a storage device, and the storage device includes a storage cylinder, a feed pipe, a pump body and a threaded groove; A discharging device is threadedly engaged with the bottom of the outer surface of the storage device.

4. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 3, characterized in that: The movable groove is opened in the middle of the bottom of the connection box, the first servo motor is fixedly installed on one side of the outer surface of the connection box, and the reciprocating screw is fixedly connected to the output shaft of the first servo motor.

5. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 3, characterized in that: The threaded block is threadably engaged with the outer surface of the reciprocating screw rod, the fixed box is fixedly installed at the bottom of the threaded block, the second servo motor is fixedly installed in the middle of the bottom of the fixed box, and the rotating box is fixedly connected to the bottom end of the output shaft of the second servo motor.

6. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 3, characterized in that: The storage tube is threadedly engaged with the outer surface of the threaded ring plate, the feed pipe is fixedly installed on one side of the outer surface of the storage tube, the thread groove is opened in the middle of the top of the feed pipe, and the pump body is arranged on the surface of the storage tube.

7. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 3, characterized in that: The threaded ring block is threadably engaged with the bottom of the threaded groove, and the blanking cone barrel is fixedly connected to the bottom of the threaded ring block.

8. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 3, characterized in that: The threaded block is matched with the moving groove.

9. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 3, characterized in that: A connecting rod is fixedly installed in the middle of the top of the connecting box, and a base is fixedly installed at the bottom end of the connecting rod.

10. A circuit board printing method for monitoring the alignment between arbitrary layers according to claim 9, characterized in that: A control panel is fixedly mounted on the top of the fixing box.

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