Bonding region manufacturing process control method and device of semiconductor device

Abstract

The embodiment of the invention provides a bonding area manufacturing process control method and device of a semiconductor device. The method comprises the following steps: obtaining design data of a bonding pad; a right angle position in the design data of the Bonding pad is identified; generating a right triangle of an additional design area corresponding to the right angle position; the right triangle with the additional design area is added to the right angle position in the design data of the Bonding pad, and new design data of the Bonding pad are obtained; according to the design data of the new Bonding pad, a manufacturing step of the Bonding pad is carried out; according to the method, factors such as cost and machining time are considered, different factors and the additional design area are fitted, the optimal additional design area is obtained, material loss is reduced, cost is reduced, corrosion time is shortened, machining time is not prolonged, and the operation performance of equipment is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a method and device for controlling a bonding region manufacturing process of a semiconductor device, a computer device and a storage medium. Background Art

[0002] The current manufacturing method of the bonding pad is that the original right-angle corner position will be corroded on three sides during processing, and the corner and the middle position will be corroded more. The corner position of the finished product will become rounded, which is inconsistent with the customer's original right-angle design. At the same time, the width of the middle is too small after the extra corrosion, which affects the subsequent bonding process. Summary of the invention

[0003] In view of the above problems, the present embodiment is proposed to provide a bonding region manufacturing process control device for a semiconductor device, a computer device and a storage medium that overcome the above problems or at least partially solve the above problems.

[0004] In order to solve the above problems, this embodiment discloses a method for controlling a bonding region manufacturing process of a semiconductor device, comprising: Get the design data of Bonding pad; Identifying a right angle position in the design data of the bonding pad; Generate a right triangle of additional design area corresponding to the right angle position; Adding the right-angled triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; The steps of making the bonding pad are performed according to the design data of the new bonding pad.

[0005] Preferably, generating a right triangle of an additional design area corresponding to the right-angle position comprises: Obtain material loss index data, equipment processing data and corrosion time data; Get the initial added area; The initial added area is corrected according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, and a right-angle triangle of the additional design area corresponding to the right-angle position is generated.

[0006] Preferably, the step of manufacturing the bonding pad according to the design data of the new bonding pad includes: Controlling the equipment to perform laser drilling operation to obtain a drilled circuit board; The drilled circuit board is subjected to through-hole thickening by electroplating copper to obtain an electroplated circuit board; After forming a dry film circuit pattern on the electroplated circuit board, a bonding pad copper circuit is etched out to obtain a bonding pad.

[0007] Preferably, the initial added area is corrected according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, including: Generate a characteristic fitting function based on the material loss index data, equipment processing data, corrosion time data, historical initial addition area and historical additional design area; The initial added area is corrected according to the characteristic fitting function to generate an additional designed area corresponding to a right-angle position.

[0008] Preferably, the step of adding the right-angled triangle of the additional design area to the right-angled position in the design data of the bonding pad to obtain new design data of the bonding pad includes: Identifying a right angle position in the design data of the bonding pad; Determine the intersecting right-angle position of the corrosion edge from the right-angle position; The additional design area is added to the intersection right angles of the corrosion edge.

[0009] This embodiment discloses a bonding region manufacturing process control device for a semiconductor device, including: Design data acquisition module, used to obtain the design data of Bonding pad; An identification module, used to identify the right angle position in the design data of the bonding pad; A generating module, used for generating a right triangle of an additional design area corresponding to the right angle position; An adding module, used for adding the right-angled triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; The manufacturing module is used to perform the manufacturing steps of the bonding pad according to the design data of the new bonding pad.

[0010] Preferably, the generating module comprises: The first acquisition submodule is used to acquire material loss index data, equipment processing data and corrosion time data; The second acquisition submodule is used to acquire the initial added area; A generation submodule is used to correct the initial added area according to the material loss index data, equipment processing data and corrosion time data, obtain the additional design area corresponding to the right-angle position, and generate a right-angle triangle of the additional design area corresponding to the right-angle position.

[0011] Preferably, the production module comprises: The first control submodule is used to control the device to perform a laser drilling operation to obtain a drilled circuit board; The second control submodule is used to perform copper plating on the drilled circuit board to thicken the circuit board through the via holes to obtain a plated circuit board; The third etching submodule is used to form a dry film circuit pattern on the electroplated circuit board, and then etch out a bonding pad copper circuit to obtain a bonding pad.

[0012] This embodiment further discloses a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the above-mentioned steps of controlling the manufacturing process of the bonding region of the semiconductor device when executing the computer program.

[0013] This embodiment further discloses a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of controlling the manufacturing process of the bonding region of the semiconductor device are implemented.

[0014] This embodiment includes the following advantages: In an embodiment of the present invention, the method for controlling the manufacturing process of the bonding area of ​​the semiconductor device includes: acquiring the design data of the bonding pad; identifying the right-angle position in the design data of the bonding pad; generating a right-angle triangle of an additional design area corresponding to the right-angle position; adding the right-angle triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; performing the steps of making the bonding pad according to the design data of the new bonding pad; taking into account factors such as cost and processing time, fitting different factors with the additional design area to obtain the optimal additional design area, reducing material loss, reducing cost, shortening corrosion time, not extending processing time, and ensuring the operating performance of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solution in this embodiment, the drawings required for use in the description of the embodiment will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a flowchart of the steps of an embodiment of a method for controlling a bonding region manufacturing process of a semiconductor device of this embodiment; Figure 2 is a schematic diagram of a design of a Bonding pad copper circuit in an embodiment of the present invention; Figure 3 It is a design schematic diagram of adding an additional design area to a Bonding pad copper circuit in an embodiment of the present invention; Figure 4 is a schematic diagram of a right-angled triangle corresponding to an additional design area added to the position of the intersecting right-angled sides of the corrosion edge of this embodiment; Figure 5 It is a structural block diagram of an embodiment of a bonding region manufacturing process control device of a semiconductor device of this embodiment; Figure 6 The diagram is a diagram of the internal structure of a computer device according to an embodiment. DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical solutions and beneficial effects solved by this embodiment more clearly understood, this embodiment is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0018] In a core concept of an embodiment of the present invention, an additional design area is added at a right angle position of the bonding area of ​​the bonding pad to form an oblique long triangle side. The oblique long triangle side position is corroded on three sides, and the additional oblique long triangle side part, i.e., the additional design area, is corroded. The finished product after corrosion is just close to a right angle, and the width of the bonding pad is more guaranteed, which is more consistent with the original right angle design of the bonding plate. The bonding pad width is wider, which is conducive to post-processing. For the size of the additional design area, fitting can be performed based on certain factors, such as material loss index data, equipment processing data, and corrosion time data, to balance the relationship between materials, costs, and performance, achieve optimal material loss, shortest corrosion time, reduce costs, shorten processing time, and ensure product performance.

[0019] The bonding area manufacturing process control method of the semiconductor device provided in this embodiment can be applied to an application environment including a terminal and a server. The terminal communicates with the server through a network. The terminal can be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, and portable wearable devices. The server can be implemented as an independent server or a server cluster composed of multiple servers. The terminal is connected to a variety of semiconductor devices, and the embodiment of the present invention does not impose too many restrictions on this.

[0020] Reference Figure 1 , shows a flowchart of a method for controlling a bonding region manufacturing process of a semiconductor device according to the present embodiment, which may specifically include the following steps: Step 101, obtaining the design data of the bonding pad; In the embodiment of the present invention, the Bonding pad refers to a metal area in a printed circuit board used to connect electronic components or wires; in the embodiment of the present invention, the design data of the Bonding pad refers to the direction of the metal line, the length and width of the metal line, the line spacing, the aperture, the minimum distance from the grinding hole to the line, the size and spacing of the pad, the minimum width and font size of the wire, etc. Of course, the design data can also include a design drawing of the Bonding pad, and the embodiment of the present invention does not impose too many restrictions on this.

[0021] Step 102, identifying a right angle position in the design data of the bonding pad; Further, after obtaining the design data of the bonding pad, the right-angle position of the copper circuit of the bonding pad can be identified according to the design data of the bonding pad; Reference Figure 2 , showing a schematic diagram of the design of a bonding pad copper circuit in an embodiment of the present invention; determining the intersection of the end of the length direction and the width direction of the bonding pad, identifying whether the angle formed by the length direction and the width direction is 90 degrees, and if so, obtaining a right angle position; Furthermore, image recognition can be performed based on the design drawing of the bonding pad, and then combined with the direction in the design data of the bonding pad, the length and width of the metal line, the line spacing, the aperture and other data to obtain the right angle position in the bonding pad, and the coordinates of the right angle position on the design drawing can be obtained. For example, the coordinates of the right angle position may include a vertical coordinate and a horizontal coordinate; if the coordinates of the right angle position are (23, 46), the unit is mm, that is, the vertical coordinate of the right angle position is 23, and the horizontal coordinate is 46; Step 103, generating a right triangle of an additional design area corresponding to the right angle position; After obtaining the right angle position, the additional design area corresponding to the right angle position can be further calculated to generate a right triangle of the additional design area corresponding to the right angle position. In one embodiment, the additional design area can refer to the extra corrosion area reserved in the corrosion process to make the right angle of the finished product after corrosion closer to 90 degrees, which is conducive to improving the quality of wire bonding in the subsequent process; specifically, the additional design area can be a preset value related to the length of the metal line; For example, the additional design area can be the area of ​​a right triangle with a right-angled side length of 5% of the length of the copper line and an area of ​​x square millimeters. Of course, those skilled in the art can also set the additional design area and the lengths of the two right-angled sides of the right triangle according to other conditions, such as setting the additional design area and the lengths of the two right-angled sides of the right triangle according to cost or corrosion time. The embodiments of the present invention do not impose excessive restrictions on this.

[0022] In a preferred embodiment of the embodiments of the present invention, the generation of a right triangle of the additional design area corresponding to the right-angle position includes: obtaining material loss index data, equipment processing data and corrosion time data; obtaining an initial added area; correcting the initial added area according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, and generating a right triangle of the additional design area corresponding to the right-angle position.

[0023] In an embodiment of the present invention, the additional design area can be fitted through historical processing data to obtain the optimal additional design area; wherein the historical processing data may include material loss index data, equipment processing data and corrosion time data; wherein the material loss index data refers to the ratio between the weight of the finished material and the total material weight during the Bonding pad processing; the equipment processing data may refer to the operating time of the equipment in all processing procedures; and the corrosion time data refers to the time consumed by the corrosion process per unit material.

[0024] Further applied to the embodiment of the present invention, the initial added area is corrected according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, including: Generate a characteristic fitting function based on the material loss index data, equipment processing data, corrosion time data, historical initial addition area and historical additional design area; The initial added area is corrected according to the characteristic fitting function to generate an additional designed area corresponding to a right-angle position.

[0025] Specifically applied to the embodiment of the present invention, the material loss index data is expressed as ; Equipment processing data is expressed as ; Corrosion time data is expressed as ; then the historical initial added area represents ; The historical additional design area is expressed as ;Then the fitting function of the above relationship can be expressed as: Through the above historical data, the fitting function is iteratively fitted to obtain the characteristic fitting function: ;in, Represents the material loss index data after fitting; It represents the equipment processing data after fitting; represents the corrosion time data after fitting; Add the new initial area Input to the feature fitting function: , and the output additional design area is obtained The above-mentioned fitting method is only an example of an embodiment of the present invention. Other linear regression equations can also be used to fit the above-mentioned data. The embodiment of the present invention does not impose too many restrictions on this.

[0026] In the embodiment of the present invention, factors such as cost and processing time are taken into consideration, and different factors are fitted with the additional design area to obtain the optimal additional design area, reduce material loss, reduce cost, shorten corrosion time, do not extend processing time, and ensure the operating performance of the equipment.

[0027] Step 104, adding the right-angled triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; After obtaining the additional design area, the right triangle corresponding to the additional design area may be added to the right angle position in the design data of the bonding pad to obtain new design data of the bonding pad; Reference Figure 3 , showing a schematic diagram of a design of adding an additional design area to a bonding pad copper circuit in an embodiment of the present invention; 3 represents a right triangle (white elongated part) corresponding to the additional design area, and 2 represents a bonding pad copper circuit; In an embodiment of the present invention, the step of adding the right-angled triangle of the additional design area to the right-angled position in the design data of the Bonding pad to obtain new design data of the Bonding pad includes: identifying the right-angled position in the design data of the Bonding pad; determining the position of the intersecting right-angled side of the corrosion edge from the right-angled position; and adding the additional design area to the position of the intersecting right-angled side of the corrosion edge.

[0028] Specifically, firstly, the right-angle position in the design data of the Bonding pad is identified. Specifically, the right-angle position can be identified by image recognition, or by identifying whether the angle formed by the length direction and the width direction is 90 degrees at the intersection of the ends of the length direction and the width direction. Then, the position of the intersecting right-angled side of the corrosion edge is obtained according to the right-angled position; and the right-angled triangle corresponding to the additional design area is added to the position of the intersecting right-angled side of the corrosion edge.

[0029] The right-angled triangle corresponding to the additional design area is added to the intersection of the right-angled sides of the corrosion edge, such as Figure 4 As shown in the schematic diagram, a coincident origin 7 and a coincident side 8 are set in the right triangle corresponding to the additional design area. The right triangle corresponding to the additional design area is added to the position of the intersecting right-angled side of the corrosion edge by coinciding the coincident origin 7 with the right-angle point 5 of the corrosion edge and connecting the coincident side 8 with the intersecting right-angled side 6 of the corrosion edge.

[0030] Step 105 , performing a step of manufacturing a bonding pad according to the design data of the new bonding pad.

[0031] Furthermore, the manufacturing steps of the bonding pad are performed according to the design data of the new bonding pad modified in advance to add a right-angle triangle, so as to offset the over-corrosion in the processing process, so that the finished product after corrosion is close to a right angle, and the bonding pad width is wider, which is more consistent with the original right-angle design of the bonding pad; Specifically, the steps of making a bonding pad according to the design data of the new bonding pad include: controlling a device to perform a laser drilling operation to obtain a drilled circuit board; performing copper plating on the drilled circuit board to thicken the circuit board to obtain a plated circuit board; after forming a dry film circuit pattern on the plated circuit board, etching out a bonding pad copper circuit to obtain a bonding pad; other manufacturing processes and manufacturing steps may also be used, and the embodiments of the present invention do not impose excessive restrictions on this.

[0032] Add an additional oblique long triangle side at the right angle position, change the right angle side into an oblique triangle design, and then prepare the board before the process. The control equipment performs mechanical or laser drilling. The control equipment removes the glue residue on the board in the hole. The control equipment thickens the via hole with electroplated copper. The control equipment makes the dry film circuit pattern. The control equipment etches the Bonding pad copper circuit. The control equipment peels off the dry film and then performs the drying operation.

[0033] In an embodiment of the present invention, the method for controlling the manufacturing process of the bonding area of ​​the semiconductor device includes: acquiring the design data of the bonding pad; identifying the right-angle position in the design data of the bonding pad; generating a right-angle triangle of an additional design area corresponding to the right-angle position; adding the right-angle triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; performing the steps of making the bonding pad according to the design data of the new bonding pad; taking into account factors such as cost and processing time, fitting different factors with the additional design area to obtain the optimal additional design area, reducing material loss, reducing cost, shortening corrosion time, not extending processing time, and ensuring the operating performance of the equipment.

[0034] It should be noted that, for the method embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that this embodiment is not limited by the order of the actions described, because according to this embodiment, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by this embodiment.

[0035] Reference Figure 5 , shows a structural block diagram of an embodiment of a bonding region manufacturing process control device of a semiconductor device of this embodiment, which may specifically include the following modules: Design data acquisition module 301, used to acquire design data of Bonding pad; An identification module 302 is used to identify a right angle position in the design data of the bonding pad; A generating module 303, used for generating a right triangle of an additional design area corresponding to the right angle position; An adding module 304 is used to add the right-angled triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; The manufacturing module 305 is used to perform the manufacturing steps of the bonding pad according to the design data of the new bonding pad.

[0036] Preferably, the generating module comprises: The first acquisition submodule is used to acquire material loss index data, equipment processing data and corrosion time data; The second acquisition submodule is used to acquire the initial added area; A generation submodule is used to correct the initial added area according to the material loss index data, equipment processing data and corrosion time data, obtain the additional design area corresponding to the right-angle position, and generate a right-angle triangle of the additional design area corresponding to the right-angle position.

[0037] Preferably, the production module comprises: The first control submodule is used to control the device to perform a laser drilling operation to obtain a drilled circuit board; The second control submodule is used to perform copper plating on the drilled circuit board to thicken the circuit board through the via holes to obtain a plated circuit board; The third etching submodule is used to form a dry film circuit pattern on the electroplated circuit board, and then etch out a bonding pad copper circuit to obtain a bonding pad.

[0038] Preferably, the generating submodule comprises: A generating unit, used for generating a characteristic fitting function according to the material loss index data, equipment processing data, corrosion time data, historical initial addition area and historical additional design area; The correction unit is used to correct the initial added area according to the characteristic fitting function to generate an additional design area corresponding to the right-angle position.

[0039] Preferably, the adding module comprises: An identification submodule, used to identify the right angle position in the design data of the bonding pad; A determination submodule, used to determine the intersecting right-angle side position of the corrosion edge from the right-angle position; The adding submodule is used to add the additional design area to the intersecting right-angle side position of the corrosion edge.

[0040] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0041] The specific definition of the bonding area manufacturing process control device of the semiconductor device can be found in the definition of the bonding area manufacturing process control method of the semiconductor device mentioned above, which will not be repeated here. Each module in the above-mentioned bonding area manufacturing process control device of the semiconductor device can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0042] The bonding region manufacturing process control device of the semiconductor device provided above can be used to execute the bonding region manufacturing process control method of the semiconductor device provided in any of the above embodiments, and has corresponding functions and beneficial effects.

[0043] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Figure 6 As shown. The computer device includes a processor, a memory, a network interface, a display screen and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for simulating daylighting is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device housing, or an external keyboard, touchpad or mouse, etc.

[0044] Those skilled in the art will understand that Figure 6 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0045] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented: Get the design data of Bonding pad; Identifying a right angle position in the design data of the bonding pad; Generate a right triangle of additional design area corresponding to the right angle position; Adding the right-angled triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; The steps of making the bonding pad are performed according to the design data of the new bonding pad.

[0046] Preferably, generating a right triangle of an additional design area corresponding to the right-angle position comprises: Obtain material loss index data, equipment processing data and corrosion time data; Get the initial added area; The initial added area is corrected according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, and a right-angle triangle of the additional design area corresponding to the right-angle position is generated.

[0047] Preferably, the step of manufacturing the bonding pad according to the design data of the new bonding pad includes: Controlling the equipment to perform laser drilling operation to obtain a drilled circuit board; The drilled circuit board is subjected to through-hole thickening by electroplating copper to obtain an electroplated circuit board; After forming a dry film circuit pattern on the electroplated circuit board, a bonding pad copper circuit is etched out to obtain a bonding pad.

[0048] Preferably, the initial added area is corrected according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, including: Generate a characteristic fitting function based on the material loss index data, equipment processing data, corrosion time data, historical initial addition area and historical additional design area; The initial added area is corrected according to the characteristic fitting function to generate an additional designed area corresponding to a right-angle position.

[0049] Preferably, the step of adding the right-angled triangle of the additional design area to the right-angled position in the design data of the bonding pad to obtain new design data of the bonding pad includes: Identifying a right angle position in the design data of the bonding pad; Determine the intersecting right-angle position of the corrosion edge from the right-angle position; The additional design area is added to the intersection right angles of the corrosion edge.

[0050] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: Get the design data of Bonding pad; Identifying a right angle position in the design data of the bonding pad; Generate a right triangle of additional design area corresponding to the right angle position; Adding the right-angled triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; The steps of making the bonding pad are performed according to the design data of the new bonding pad.

[0051] Preferably, generating a right triangle of an additional design area corresponding to the right-angle position comprises: Obtain material loss index data, equipment processing data and corrosion time data; Get the initial added area; The initial added area is corrected according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, and a right-angle triangle of the additional design area corresponding to the right-angle position is generated.

[0052] Preferably, the step of manufacturing the bonding pad according to the design data of the new bonding pad includes: Controlling the equipment to perform laser drilling operation to obtain a drilled circuit board; The drilled circuit board is subjected to through-hole thickening by electroplating copper to obtain an electroplated circuit board; After forming a dry film circuit pattern on the electroplated circuit board, a bonding pad copper circuit is etched out to obtain a bonding pad.

[0053] Preferably, the initial added area is corrected according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, including: Generate a characteristic fitting function based on the material loss index data, equipment processing data, corrosion time data, historical initial addition area and historical additional design area; The initial added area is corrected according to the characteristic fitting function to generate an additional designed area corresponding to a right-angle position.

[0054] Preferably, the step of adding the right-angled triangle of the additional design area to the right-angled position in the design data of the bonding pad to obtain new design data of the bonding pad includes: Identifying a right angle position in the design data of the bonding pad; Determine the intersecting right-angle position of the corrosion edge from the right-angle position; The additional design area is added to the intersection right angles of the corrosion edge.

[0055] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0056] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0057] Those skilled in the art will appreciate that the embodiments of the present embodiment may be provided as methods, devices, or computer program products. Therefore, the present embodiment may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present embodiment may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0058] The present embodiment is described with reference to the flowchart and / or block diagram of the apparatus, terminal device (system), and computer program product according to the present embodiment. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0059] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction method, which is implemented in the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0060] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0061] Although the preferred embodiment of the present embodiment has been described, other changes and modifications may be made to these embodiments once those skilled in the art have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiment and all changes and modifications falling within the scope of the present embodiment.

[0062] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, device, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, device, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the existence of other identical elements in the process, device, article or terminal device including the elements.

[0063] The above is a detailed introduction to a method for controlling the manufacturing process of a bonding area of ​​a semiconductor device, a device for controlling the manufacturing process of a bonding area of ​​a semiconductor device, a computer device and a storage medium provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for a person skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for controlling a bonding region manufacturing process of a semiconductor device, characterized in that: include: Get the design data of Bonding pad; Identifying a right angle position in the design data of the bonding pad; Generate a right triangle of additional design area corresponding to the right angle position; Adding the right-angled triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; The steps of making the bonding pad are performed according to the design data of the new bonding pad.

2. The method according to claim 1, characterized in that The step of generating a right triangle having an additional design area corresponding to the right angle position comprises: Obtain material loss index data, equipment processing data and corrosion time data; Get the initial added area; The initial added area is corrected according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position, and a right-angle triangle of the additional design area corresponding to the right-angle position is generated.

3. The method according to claim 1, characterized in that The step of manufacturing the bonding pad according to the design data of the new bonding pad includes: Controlling the equipment to perform laser drilling operation to obtain a drilled circuit board; The drilled circuit board is subjected to through-hole thickening by electroplating copper to obtain an electroplated circuit board; After forming a dry film circuit pattern on the electroplated circuit board, a bonding pad copper circuit is etched out to obtain a bonding pad.

4. The method according to claim 2, characterized in that: The method of correcting the initial added area according to the material loss index data, equipment processing data and corrosion time data to obtain the additional design area corresponding to the right-angle position includes: Generate a characteristic fitting function based on the material loss index data, equipment processing data, corrosion time data, historical initial addition area and historical additional design area; The initial added area is corrected according to the characteristic fitting function to generate an additional designed area corresponding to a right-angle position.

5. The method according to claim 2, characterized in that: The step of adding the right-angled triangle of the additional design area to the right-angled position in the design data of the bonding pad to obtain new design data of the bonding pad includes: Identifying a right angle position in the design data of the bonding pad; Determine the intersecting right-angle position of the corrosion edge from the right-angle position; The additional design area is added to the intersection right angles of the corrosion edge.

6. A bonding region manufacturing process control device for a semiconductor device, characterized in that: include: Design data acquisition module, used to obtain the design data of Bonding pad; An identification module, used to identify the right angle position in the design data of the bonding pad; A generating module, used for generating a right triangle of an additional design area corresponding to the right angle position; An adding module, used for adding the right-angled triangle of the additional design area to the right-angle position in the design data of the bonding pad to obtain new design data of the bonding pad; The manufacturing module is used to perform the manufacturing steps of the bonding pad according to the design data of the new bonding pad.

7. The device according to claim 6, characterized in that The generation module comprises: The first acquisition submodule is used to acquire material loss index data, equipment processing data and corrosion time data; The second acquisition submodule is used to acquire the initial added area; A generation submodule is used to correct the initial added area according to the material loss index data, equipment processing data and corrosion time data, obtain the additional design area corresponding to the right-angle position, and generate a right-angle triangle of the additional design area corresponding to the right-angle position.

8. The device according to claim 6, characterized in that The production module includes: The first control submodule is used to control the device to perform a laser drilling operation to obtain a drilled circuit board; The second control submodule is used to perform copper plating on the drilled circuit board to thicken the circuit board through the via holes to obtain a plated circuit board; The third etching submodule is used to form a dry film circuit pattern on the electroplated circuit board, and then etch out a bonding pad copper circuit to obtain a bonding pad.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the bonding region manufacturing process control method of a semiconductor device according to any one of claims 1 to 5 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the bonding region manufacturing process control method of a semiconductor device according to any one of claims 1 to 5 are implemented.

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