Shell, preparation method thereof and electronic equipment

Abstract

The invention provides a shell, a preparation method thereof and electronic equipment. The shell comprises a frame body, a connecting layer and a middle plate body. The frame body surrounds at least part of the middle plate body. The connecting layer is connected between the frame body and the middle plate body. The frame body includes a first corner portion. The first corner portion includes a first metal. The first metal is a shape memory alloy. The middle plate body includes a second metal. The connecting layer comprises a first connecting section located between the first corner and the middle plate body. The first connection segment includes a first metal and a second metal. And on the metallographic structure of the shell, the thickness of the first connecting section is H1, and H1 is larger than or equal to 0.1 micron and smaller than or equal to 30 microns. According to the shell, the shape memory alloy is adopted at the part which is easy to deform, so that the problem of deformation of the shell is effectively solved. And meanwhile, the first corner part and the middle plate main body can be combined through the thicker first connecting section, so that the combination strength between the first corner part and the middle plate main body is improved, and the overall structural stability of the shell is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to a housing and a preparation method thereof, and electronic equipment. Background Art

[0002] During the use of electronic devices, the shell of the electronic device is often deformed due to external forces such as falling or collision (for example, pits are formed on the frame of the shell), which affects the overall aesthetics of the electronic device and the user experience. Currently on the market, high-strength and high-hardness materials are usually used to prepare the frame of the shell to enhance the deformation resistance of the frame. Then, the high-strength and high-hardness frame is welded to the plate to form a shell. However, the deformation problem of the shell cannot be solved well by simply enhancing the strength and hardness of the shell. At the same time, the frame and the plate are connected by a welding process, the bonding strength between the frame and the plate is low, and the overall structural stability of the shell is poor. Summary of the invention

[0003] The embodiments of the present application provide a housing and a method for preparing the housing, as well as an electronic device including the housing, aiming to provide a housing and an electronic device that can solve the deformation problem and have high overall structural stability.

[0004] In a first aspect, a shell is provided. The shell includes a frame body, a connecting layer and a middle plate body. The frame body is arranged around at least a portion of the middle plate body. The connecting layer is connected between the frame body and the middle plate body. The frame body includes a first corner. The first corner includes a first metal. The first metal is a shape memory alloy. The middle plate body includes a second metal. The connecting layer includes a first connecting section located between the first corner and the middle plate body. The first connecting section includes a first metal and a second metal. In the metallographic structure of the shell, the thickness of the first connecting section is H1, wherein 0.1 micron ≤ H1 ≤ 30 microns.

[0005] It is understandable that the shell in this embodiment can include the first metal and the second metal at the same time. Among them, the material of the first corner of the frame body is the first metal. The material of the middle plate body is the second metal. The material of the first connecting section of the connecting layer includes the first metal and the second metal. Among them, the first metal is a shape memory alloy, so that the first corner of the frame body also has the physical properties of the shape memory alloy. In this way, when the first corner of the shell is deformed or pitted due to external force such as falling or collision, the first corner can be restored to its original shape before deformation by specific means according to the different types of shape memory alloys selected. In other words, the shell in this embodiment is conducive to improving the anti-deformation ability of the first corner of the frame body of the shell by using the shape memory alloy (that is, the first metal) at the first corner of the frame body, so that the deformation problem of the first corner of the shell after falling or collision can be effectively solved, which is conducive to improving the overall aesthetics of the shell and improving the user's experience. The middle plate body of the shell can also adopt a non-shape memory alloy (i.e., the second metal) with lower cost than the shape memory alloy. Compared with the use of shape memory alloy for the entire shell, the present embodiment adopts shape memory alloy only in the part of the shell that is prone to deformation (i.e., the first corner of the frame body), so that the shell can solve the deformation problem of the shell while greatly reducing the overall manufacturing cost of the shell.

[0006] In addition, the first corner of the frame body and the middle plate body in the present embodiment are connected together by the first connecting section of the connecting layer, and the thickness of the first connecting section of the connecting layer on the metallographic structure of the shell can be greater than or equal to 0.1 microns. The thickness of the first connecting section of the connecting layer is relatively thick, so that the first corner of the material including the first metal and the middle plate body including the material including the second metal can be better combined through the first connecting section of the connecting layer, which is conducive to improving the bonding strength between the first corner of the shell and the middle plate body, thereby improving the overall structural stability of the shell. In addition, the thickness of the first connecting section of the connecting layer can also be less than or equal to 30 microns, so that the shell can meet the bonding strength requirements between the first metal and the second metal while having a low preparation cost, which is conducive to large-scale production. At the same time, the first metal and the second metal in the shell 100 are two different metals with different physical properties, so that the shell 100 can have a variety of different physical properties while ensuring its overall structural stability to meet different application scenarios.

[0007] In one possible implementation, the density of the second metal is less than or equal to 3.5 grams per cubic centimeter, and / or the thermal conductivity of the second metal is greater than or equal to 50 watts per square meter per second. It is understandable that the second metal can be a metal material with lightweight characteristics and / or high thermal conductivity characteristics. The second metal is applied to the middle plate body so that the middle plate body can also have lightweight characteristics and / or high thermal conductivity characteristics. In this way, the shell can have high thermal conductivity and / or light weight while having high deformation resistance, so that the shell can better meet the requirements of electronic equipment for lightweight and / or high heat dissipation, which is conducive to improving the user experience.

[0008] In a possible implementation, the nickel content in the first metal is between 55.4% and 56.2%, or the nickel content in the first metal is 50%, the manganese content is 28%, and the gallium content is 22%. Alternatively, the second metal is an aluminum alloy, a particle-reinforced aluminum-based composite material, or a particle-reinforced magnesium-based composite material. In this way, the first metal can be a temperature-controlled shape memory alloy induced by temperature, or a magnetically controlled shape memory alloy induced by a magnetic field, so that the first corner of the first metal can be restored to its original shape before deformation by a relatively simple means after deformation, which is conducive to simplifying user operation and improving user experience. The second metal can be a metal material that takes into account both lightweight and high thermal conductivity. The second metal is applied to the middle plate body, so that the middle plate body can have the characteristics of lightweight and high thermal conductivity at the same time. In this way, the shell can have high anti-deformation ability, high thermal conductivity and light weight, so that the shell can better meet the needs of electronic equipment for lightweight and high heat dissipation.

[0009] In a possible implementation, the content of the first metal in the first connecting section decreases in the direction from the first connecting section to the middle plate body, and the content of the second metal increases in the direction from the first connecting section to the middle plate body.

[0010] It can be understood that the content of the first metal in the first connecting section of the connecting layer can be reduced in the direction from the first corner of the frame body to the middle plate body, and the content of the second metal can be increased in the direction from the first corner of the frame body to the middle plate body, that is, the content of the first metal and the content of the second metal in the first connecting section of the connecting layer can show different changing trends in the direction from the first corner of the frame body to the middle plate body. A first connecting section of the connecting layer having different changing trends of their respective component contents (that is, the content of the first metal and the content of the second metal) can be formed between the first corner of the frame body of the shell and the middle plate body, that is, a region having different changing trends of their respective component contents is formed between the first metal and the second metal, and the thickness of the first connecting section of the connecting layer can be greater than or equal to 0.1 microns. In this way, the first connecting section of the connecting layer has a certain thickness, so that the first corner of the frame body made of the first metal and the middle plate body made of the second metal can be better combined through the first connecting section of the connecting layer, which is conducive to improving the bonding strength between the first corner of the shell and the middle plate body, thereby improving the overall structural stability of the shell. Furthermore, the thickness of the first connection section of the connection layer may be less than or equal to 30 micrometers, so that the shell can meet the bonding strength requirements between the first metal and the second metal while having a low manufacturing cost, which is conducive to large-scale production.

[0011] In a possible implementation, in the metallographic structure of the shell, 2 microns ≤ H1 ≤ 30 microns. In this way, the thickness of the first connecting section of the connecting layer can be thicker, that is, the diffusion capacity of the first metal and the second metal is better, which is conducive to improving the bonding strength between the first metal and the second metal, thereby improving the bonding strength between the first corner of the frame body and the middle plate body, which is conducive to improving the overall structural stability of the shell.

[0012] In a possible implementation, a first interface is formed between the first corner and the first connecting section. A second interface is formed between the middle plate body and the first connecting section. The first interface and the second interface are visible in the metallographic structure of the shell. In this way, in the metallographic structure of the shell, interfaces (i.e., the first interface and the second interface) can be formed between the first corner of the frame body and the first connecting section of the connecting layer, and between the middle plate body and the first connecting section of the connecting layer, that is, the first metal and the second metal in the first connecting section of the connecting layer diffuse with each other, and the bonding strength between the first metal and the second metal is good, which is conducive to improving the bonding strength between the first corner of the frame body and the middle plate body, and improving the overall structural stability of the shell.

[0013] In a possible implementation, the content of the first metal in the first connecting segment decreases in the direction from the first interface to the second interface, and the content of the second metal increases in the direction from the first interface to the second interface.

[0014] It can be understood that the content of the first metal in the first connecting section of the connecting layer can be reduced in the direction from the first interface to the second interface, and the content of the second metal can be increased in the direction from the first interface to the second interface. In this way, a first connecting section having different changing trends of their respective component contents (i.e., the content of the first metal and the content of the second metal) can be formed between the first corner of the shell and the middle plate body, that is, a region having different changing trends of their respective component contents is formed between the first metal and the second metal, and the thickness of the first connecting section of the connecting layer can be greater than or equal to 0.1 microns. In this way, the first connecting section of the connecting layer has a certain thickness, so that the first corner made of the first metal and the middle plate body made of the second metal can be better combined through the first connecting section of the connecting layer, which is conducive to improving the bonding strength between the first corner of the shell and the middle plate body, thereby improving the overall structural stability of the shell. In addition, the thickness of the first connecting section of the connecting layer can also be less than or equal to 30 microns, so that the shell can meet the bonding strength requirements between the first metal and the second metal while having a low manufacturing cost, which is conducive to large-scale production.

[0015] In a possible implementation, in the metallographic structure of the shell, the first interface is parallel to the second interface. It can be understood that the first interface is parallel to the second interface, that is, the thickness of each part of the first connecting section of the connecting layer in its extension direction in the direction perpendicular to the first interface can be equal. In this way, the thickness of each part of the first connecting section of the connecting layer is equal, so that the diffusion degree between the first metal and the second metal in each part of the first connecting section of the connecting layer is equivalent, the bonding strength between each part of the first connecting section of the connecting layer and the first corner of the frame body is the same or approximately the same, and the bonding strength between each part of the first connecting section of the connecting layer and the middle plate body is also the same or approximately the same, so that the shell can be effectively prevented from cracking at the place where the bonding strength between the first connecting section of the connecting layer and the first corner of the frame body is weak, or at the place where the bonding strength between the first connecting section of the connecting layer and the middle plate body is weak, which is conducive to improving the overall structural stability of the shell and extending the service life of the shell.

[0016] In a possible implementation, the frame body further includes a second corner, a third corner, a fourth corner, a first side, a second side, a third side, and a fourth side. The first corner, the first side, the second corner, the second side, the third corner, the third side, the fourth corner, and the fourth side are arranged end to end in sequence. The material of the first corner, the second corner, the third corner, and the fourth corner all include the first metal.

[0017] It can be understood that the shell in this embodiment adopts shape memory alloy at each corner of the frame body (that is, the first corner, the second corner, the third corner and the fourth corner of the frame body), that is, shape memory alloy is adopted at each corner of the frame body of the shell that is more prone to deformation, thereby effectively solving the deformation problem of each corner of the frame body when falling or colliding.

[0018] In one possible implementation, the first side portion includes a third metal. The connection layer also includes a second connection section located between the first side portion and the middle plate body. The second connection section includes a second metal and a third metal. It is understandable that the shell in this embodiment uses a third metal on the first side portion of the frame body, and the third metal is a non-shape memory alloy, and its cost is lower than that of the shape memory alloy. In this way, the shell can solve the deformation problem of each corner of the frame body when falling or colliding, while greatly reducing the manufacturing cost of the frame body of the shell.

[0019] In a possible implementation, the third metal is titanium alloy or stainless steel. In this way, the first side of the shell can be made of non-shape memory alloy metal materials such as titanium alloy or stainless steel, which can effectively reduce the manufacturing cost of the shell on the one hand, and improve the appearance of the first side on the other hand, which is conducive to reducing the overall manufacturing cost of the shell while obtaining a shell with a high appearance.

[0020] In a possible implementation, the frame body includes a first slit and a second slit that are adjacently arranged. The first slit and the second slit are located at different sides of the frame body. The first corner is located between the first slit and the second slit. In this way, the first slit and the second slit can separate the first corner, so that the first corner can be prepared separately using the first metal, which is conducive to simplifying the preparation process of the shell and improving production efficiency.

[0021] In a possible implementation, a portion of the first connecting section and the middle plate body are both prepared from powder by a sintering process.

[0022] It can be understood that, compared with the shell prepared by die casting, spot welding and the like, the first corner of the frame body, the first connecting section of the connecting layer and the middle plate body of the shell in this embodiment can be integrally formed by a sintering process, that is, the shell can be an integrally formed structure. Among them, a part of the first connecting section of the connecting layer can be formed by a sintering process from powder. In this way, the shell is an integrally formed structure, so that the shell has good waterproofness at the connection between the first corner of the frame body, the first connecting section of the connecting layer and the middle plate body, and the overall structural stability of the shell is high.

[0023] Secondly, a part of the first connecting section of the connecting layer in the present embodiment is formed by a sintering process from powder. In this way, on the one hand, the powder can fully contact with other metal materials, thereby increasing the contact area between the powder and other metal materials, which is conducive to improving the bonding strength between different metal materials in the shell formed subsequently, thereby improving the bonding strength between the first connecting section of the connecting layer of the shell and the middle plate body; on the other hand, the forces on the powder and other metal materials in all directions are relatively balanced, so that the first interface between the first connecting section of the connecting layer and the frame body can be a flat or approximately flat surface, and the second interface between the first connecting section of the connecting layer and the middle plate body can also be a flat or approximately flat surface. The first interface can be parallel to the second interface, that is, the thickness of each part of the connecting layer in its extension direction in the direction perpendicular to the first interface can be equal. In this way, the various parts of the first connecting section of the connecting layer are of equal thickness, so that the degree of diffusion between the first metal and the second metal in the various parts of the first connecting section of the connecting layer is equivalent, the bonding strength between the various parts of the first connecting section of the connecting layer and the first corner of the frame body is the same or approximately the same, and the bonding strength between the various parts of the first connecting section of the connecting layer and the middle plate body is also the same or approximately the same, thereby effectively avoiding the shell from cracking at the place where the bonding strength between the first connecting section of the connecting layer and the first corner of the frame body is weak, or at the place where the bonding strength between the first connecting section of the connecting layer and the middle plate body is weak, which is beneficial to improving the overall structural stability of the shell and extending the service life of the shell.

[0024] In a possible implementation, the first connection section is formed by diffusion of the first metal along the direction from the first corner to the middle plate body, and diffusion of the second metal along the direction from the middle plate body to the first corner. In this way, the first metal and the second metal in the first connection section of the connection layer diffuse with each other, and the bonding strength between the first corner of the frame body and the middle plate body is good, which is conducive to improving the bonding strength between the first corner of the frame body and the middle plate body, and improving the overall structural stability of the shell.

[0025] In a possible implementation, the second metal is an aluminum alloy or a particle-reinforced aluminum matrix composite material. A portion of the first connecting section and the middle plate body are both prepared from powder by a sintering process at a temperature in the range of 500° C. to 660° C., a duration in the range of 2 hours to 5 hours, and a pressure greater than or equal to 100 MPa.

[0026] It is understandable that when the second metal is an aluminum alloy or a particle-reinforced aluminum-based composite material, a portion of the first connecting section of the connecting layer and the middle plate body can be prepared from powder by a sintering process. The shell can be obtained by sintering for a long time (for example, the sintering time is in the range of 2 hours to 5 hours) at a high temperature (for example, the temperature is in the range of 500°C to 660°C) and a pressure greater than or equal to 100MPa. In this way, the diffusion ability of the first metal and the second metal is good, which is conducive to improving the bonding strength between the first metal and the second metal, and is conducive to increasing the thickness of the first connecting section of the connecting layer of the formed shell, thereby facilitating the bonding strength between the first corner of the frame body and the middle plate body, and improving the overall structural stability of the shell.

[0027] In the second aspect, an electronic device is provided. The electronic device includes the above-mentioned housing and a screen. The screen is mounted on the housing. It is understood that the housing of the electronic device in this embodiment may include a first metal and a second metal. Among them, the material of the first corner of the housing includes the first metal. The material of the middle plate body of the housing includes the second metal. The material of the connection layer of the housing includes the first metal and the second metal. The first metal is a shape memory alloy, so that the first corner of the frame body also has the physical properties of the shape memory alloy. In this way, when the first corner of the housing is deformed or pitted due to external force such as falling or collision, the first corner can be restored to its original shape before deformation by specific means according to different types of shape memory alloys selected. In other words, the housing in this embodiment is conducive to improving the anti-deformation ability of the first corner of the frame body of the housing by using a shape memory alloy (that is, the first metal) at the first corner of the frame body, thereby effectively solving the deformation problem of the first corner of the housing after falling or collision, which is conducive to improving the overall aesthetics of the housing, improving the appearance of the electronic device, and improving the user's experience. The middle plate body of the shell can also adopt a non-shape memory alloy (i.e., the second metal) with lower cost than the shape memory alloy. Compared with the shape memory alloy used for the entire shell, the present embodiment adopts the shape memory alloy only in the part of the shell that is prone to deformation (i.e., the first corner of the frame body), so that the shell can solve the deformation problem of the shell while greatly reducing the overall manufacturing cost of the shell, thereby greatly reducing the overall manufacturing cost of the electronic device.

[0028] In addition, the first corner of the frame body and the middle plate body in the present embodiment are connected together by the first connecting section of the connecting layer, and the thickness of the first connecting section of the connecting layer on the metallographic structure of the shell can be greater than or equal to 0.1 microns. The thickness of the first connecting section of the connecting layer is relatively thick, so that the first corner of the material including the first metal and the middle plate body of the material including the second metal can be better combined through the first connecting section of the connecting layer, which is conducive to improving the bonding strength between the first corner of the shell and the middle plate body, thereby improving the overall structural stability of the shell. In addition, the thickness of the first connecting section of the connecting layer can also be less than or equal to 30 microns, so that the shell can meet the bonding strength requirements between the first metal and the second metal while having a low preparation cost, which is conducive to large-scale production. At the same time, the first metal and the second metal in the shell are two different metals with different physical properties, so that the shell can have a variety of different physical properties while ensuring its overall structural stability to meet different application scenarios of electronic equipment.

[0029] In a third aspect, a method for preparing a shell is provided. The method comprises: preparing an initial frame body, the initial frame body comprising a first metal; filling a filling space of the initial frame body with metal powder, the metal powder comprising a second metal; forming a sintered part through a sintering process with the initial frame body and the metal powder; and machining the sintered part to form a shell. Part of the initial frame body is used to form the frame body of the shell. Another part of the initial frame body and a part of the metal powder are used to jointly form a connecting layer of the shell. Another part of the metal powder is used to form a middle plate body of the shell.

[0030] It is understandable that in the conventional preparation method, the frame body and the middle plate body of different metal materials are usually connected by welding, stirring friction and other processes to form a shell. However, there is no connection layer in the metallographic structure of the shell, or the width of the connection layer is extremely small, so that the bonding strength between the frame body and the middle frame body of the shell is low, and the overall structural stability of the shell is low. In the preparation method of this embodiment, the initial frame body containing the first metal and the metal powder containing the second metal are formed respectively, and then the metal powder is filled into the inner side of the initial frame body, and a sintered part is formed by a sintering process, and finally the sintered part is machined to form a shell. Among them, the contact surface between the initial frame body and the metal powder is the bonding interface between the first metal and the second metal. During the sintering process, the first metal and the second metal can diffuse components at the bonding interface between the two, thereby enhancing the bonding force between the first metal and the second metal, which is conducive to improving the bonding strength between the frame body and the middle plate body of the shell formed subsequently, thereby improving the overall structural stability of the shell.

[0031] In addition, the first metal in the present embodiment is a shape memory alloy, so that the frame body also has the physical properties of the shape memory alloy. In this way, when the frame body in the shell is deformed or pitted due to external force such as falling or collision, the first corner can be restored to its original shape before deformation by specific means according to the different types of shape memory alloys selected. In other words, the shell in the present embodiment is conducive to improving the anti-deformation ability of the frame body of the shell by using the shape memory alloy (that is, the first metal) in the frame body, so that the deformation problem of the frame body of the shell after falling or collision can be effectively solved, which is conducive to improving the overall aesthetics of the shell and improving the user's experience. The middle plate body of the shell can also use a non-shape memory alloy (that is, the second metal) with a lower cost than the shape memory alloy. Compared with the shape memory alloy used in the entire shell, the present embodiment only uses the shape memory alloy in the part of the shell that is easy to deform (that is, the frame body), so that the shell can solve the deformation problem of the shell while greatly reducing the manufacturing cost of the shell as a whole.

[0032] In a possible implementation, the steps of preparing the initial frame body include: preparing a first initial corner, a second initial corner, a third initial corner and a fourth initial corner, the materials of the first initial corner, the second initial corner, the third initial corner and the fourth initial corner are all the first metal; preparing a first initial edge, a second initial edge, a third initial edge and a fourth initial edge, the materials of the first initial edge, the second initial edge, the third initial edge and the fourth initial edge are all the third metal; arranging the first initial corner, the first initial edge, the second initial corner, the second initial edge, the third initial corner, the third initial edge, the fourth initial corner and the fourth initial edge in sequence head to tail to form the initial frame body.

[0033] It is understandable that in the preparation method of this embodiment, the first initial corner, the second initial corner, the third initial corner and the fourth initial corner including the first metal, and the first initial side, the second initial side, the third initial side and the fourth initial side including the third metal are formed respectively, and they are arranged end to end in sequence to form an initial frame body, and then the initial frame body is sintered together with the metal powder including the second metal, and finally the shell is prepared. At this time, each corner in the frame body of the shell (that is, the first corner, the second corner, the third corner and the fourth corner of the frame body) is made of the first metal, and the first metal is a shape memory alloy, and each side of the frame body (that is, the first side, the second side, the third side and the fourth side of the frame body) is made of the third metal, and the third metal is a non-shape memory alloy. In this way, the shell prepared by the preparation method in this embodiment can use shape memory alloy only in the corners of the frame body that are more easily deformed, and use non-shape memory alloy with lower cost than shape memory alloy in the edges of the frame body that are less likely to deform. This can effectively solve the deformation problem of the corners of the frame body when falling or colliding, while greatly reducing the manufacturing cost of the frame body of the shell.

[0034] In a possible implementation, the step of forming a sintered part by sintering the initial frame body and the metal powder includes: forming a first diffusion part of the sintered part by sintering part of the first initial corner, part of the second initial corner, part of the third initial corner, part of the fourth initial corner and part of the metal powder, wherein the material of the first diffusion part includes the first metal and the second metal; forming a second diffusion part of the sintered part by sintering part of the first initial side, part of the second initial side, part of the third initial side, part of the fourth initial side and part of the metal powder, wherein the material of the second diffusion part includes the second metal and the third metal. The first diffusion part and the second diffusion part are used to form a connection layer of the shell together. In this way, the material of the first diffusion part formed by the sintering process includes the first metal and the second metal, and the components of the first metal and the second metal can diffuse mutually, thereby effectively enhancing the bonding strength between the various corners of the frame body formed subsequently and the middle plate body. At the same time, the material of the second diffusion part formed by the sintering process may include the second metal and the third metal, and the components of the second metal and the third metal can diffuse mutually, thereby effectively enhancing the bonding strength between the various edges of the frame body formed subsequently and the middle plate body, which is beneficial to improving the overall structural stability of the shell formed subsequently. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the implementation methods of the present application or the background technology, the drawings required for use in the implementation methods of the present application or the background technology will be described below.

[0036] Figure 1 is a schematic diagram of the structure of an electronic device provided by the present application in some embodiments;

[0037] Figure 2 yes Figure 1 A partially exploded schematic diagram of an electronic device in some embodiments is shown;

[0038] Figure 3 yes Figure 2 A schematic structural diagram of a housing of an electronic device shown;

[0039] Figure 4 yes Figure 3 The cross-sectional structure schematic diagram of an embodiment of the housing cut along AA shown;

[0040] Figure 5 yes Figure 4 A schematic diagram showing the contents of the first metal and the second metal at different positions of the connecting layer of the shell;

[0041] Figure 6 yes Figure 3 A cross-sectional view of the housing shown in other embodiments;

[0042] Figure 7 yes Figure 1 The schematic diagram of a partial cross-sectional structure of an electronic device in one embodiment cut along BB is shown;

[0043] Figure 8 yes Figure 4 The schematic diagram of the cross-sectional structure of the housing shown in another embodiment;

[0044] Fig. 9 yes Figure 4 The schematic diagram of the cross-sectional structure of the housing in another embodiment is shown;

[0045] Fig.10 yes Figure 4 The schematic diagram of the cross-sectional structure of the housing in another embodiment is shown;

[0046] Fig.11 yes Figure 3 The schematic diagram of the process for preparing the shell in some embodiments is shown;

[0047] Figures 12 to 16 yes Fig.11 A schematic diagram of a process of the preparation method shown in one embodiment;

[0048] Fig.17 and Fig.18 yes Fig.11Shown is a schematic diagram of the process of the preparation method in another embodiment. DETAILED DESCRIPTION

[0049] The embodiments of the present application are described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0050] In the description of the implementation methods of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the implementation methods of the present application, such as "upper", "lower", "inner", "outer", etc., are only referenced to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the implementation methods of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the implementation methods of the present application. "Multiple" means at least two.

[0051] In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the features.

[0052] In the implementation manner of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0053] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in another embodiment", etc. appearing in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "include", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0054] Figure 1 It is a schematic diagram of the structure of the electronic device 1000 provided in the present application in some implementations. Figure 2 yes Figure 1 The electronic device 1000 is shown as a partially exploded schematic diagram in some embodiments.

[0055] like Figure 1 and Figure 2 As shown, the electronic device 1000 can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, an augmented reality (AR) glasses, an AR helmet, a virtual reality (VR) glasses or a VR helmet, etc., which have a camera function. The following will be described by taking the electronic device 1000 as a mobile phone as an example. Among them, the electronic device 1000 can be a housing 100, a screen 200 and a back cover 300. The screen 200 and the back cover 300 can be located on both sides of the housing 100 respectively. The screen 200 can be installed on the housing 100, and the housing 100 encloses the internal space of the electronic device 1000. The internal space of the electronic device 1000 can be used to accommodate internal components of the electronic device such as a motherboard, a battery, and a processor. The back cover 300 can be fixedly connected to the housing 100. At this time, the housing 100 can be used as the middle frame of the electronic device 1000. The housing 100 and the back cover 300 may together form the housing of the electronic device 1000. It should be noted that in this application, the direction that is the same as the light emitting direction of the screen 200 is defined as "upward", and the direction that is opposite to the light emitting direction of the screen 200 is defined as "downward". Figure 1 , Figure 2 The following related drawings only schematically illustrate part of the structure of the electronic device 1000, and the actual shape, size, position and structure of each structure are not subject to Figure 1 , Figure 2 In addition, when the electronic device 1000 is a device of some other form, the electronic device 1000 may not include the screen 200 .

[0056] Figure 3 yes Figure 2 The structure diagram of the housing 100 of the electronic device 1000 is shown. Figure 4 yes Figure 3 The shown schematic diagram is a cross-sectional structure diagram of a housing 100 cut along AA in one embodiment.

[0057] like Figure 3 and Figure 4As shown, the housing 100 may include a frame body 10, a connecting layer 20 and a middle plate body 30. The frame body 10 may be arranged around at least a portion of the middle plate body 30. The connecting layer 20 may be connected between the frame body 10 and the middle plate body 30. A first interface 20a may be formed between the connecting layer 20 and the frame body 10. A second interface 20b may be formed between the connecting layer 20 and the middle plate body 30. Exemplarily, on the metallographic structure of the housing 100, an interface (i.e., a first interface 20a) may be seen between the connecting layer 20 and the frame body 10. An interface (i.e., a second interface 20b) may be seen between the connecting layer 20 and the middle plate body 30. Exemplarily, the metallographic structure of the housing 100 may be observed by an optical microscope in an environment magnified 100 times. It should be noted that the metallographic structures of each component below may be observed by an optical microscope in an environment magnified 100 times.

[0058] Exemplarily, the thickness H1 of the connection layer 20 in the direction perpendicular to the first interface 20a (that is, the direction from the frame body 10 toward the middle plate body 30 in this embodiment) can be greater than or equal to 0.1 microns and less than or equal to 30 microns. That is, the distance between the first interface 20a and the second interface 20b can be greater than or equal to 0.1 microns and less than or equal to 30 microns. For example, the thickness H1 of the connection layer 20 in the direction perpendicular to the first interface 20a can be 0.6 microns, 2.3 microns, 5 microns, 8 microns, 10 microns, 22 microns, etc. In some embodiments, the thickness H1 of the connection layer 20 can also be greater than or equal to 2 microns and less than or equal to 30 microns. It should be understood that the thickness of the connection layer 20 referred to below refers to the thickness of the connection layer 20 in the direction perpendicular to the first interface 20a.

[0059] Exemplarily, the first interface 20a may be parallel to the second interface 20b. In this case, the thickness H1 of each portion of the connection layer 20 in its extension direction in a direction perpendicular to the first interface 20a may be the same. The first interface 20a may be completely parallel to the second interface 20b or may be approximately parallel. In this case, the thickness H1 of each portion of the connection layer 20 in its extension direction in a direction perpendicular to the first interface 20a may be equal or approximately equal. The first interface 20a and / or the second interface 20b may be a flat surface or an approximately flat surface with concave and convex portions.

[0060] Exemplarily, the thickness direction of the shell 100 is defined as the first direction. The height of the connecting layer 20 in the first direction may be the same as the height of the frame body 10 in the first direction. The height of the frame body 10 in the first direction may be greater than the height of the middle plate body 30 in the first direction. At this time, the connecting layer 20 and the middle plate body 30 can jointly enclose the inner space 100a of the shell 100, that is, the internal space of the electronic device 1000. Among them, the inner surface of the middle plate body 30 and the inner surface of the connecting layer 20 can jointly constitute the inner surface of the shell 100. The outer surface of the frame body 10 facing away from the inner space 100a can constitute the appearance surface of the shell 100. The frame body 10 and the connecting layer 20 can jointly constitute the frame of the shell 100. The middle plate body 30 can constitute the middle plate of the shell 100. It should be understood that the inner surface in this application refers to the surface of the component facing the inner space 100a of the shell 100. The outer surface refers to the surface of the component facing the outer space of the shell 100.

[0061] Exemplarily, the frame body 10 may be provided with a plurality of gaps arranged at intervals. The plurality of gaps may all penetrate the frame body 10 in the first direction, and penetrate the surface of the frame body 10 facing away from the inner space 100a and the surface of the frame body 10 facing the inner space 100a. The interior of each gap may be filled with a non-shielding medium. For example, the interior of each gap may be filled with plastic by nano injection molding or the like. In this way, the plurality of gaps may be used as antenna gaps of the electronic device 1000, and the radio frequency signal inside the electronic device 1000 may be transmitted to the outside of the electronic device 1000 through the plurality of gaps to realize signal communication. Exemplarily, the plurality of gaps may also extend one-to-one to a plurality of portions of the connection layer 20 arranged opposite to the plurality of gaps, and all penetrate the plurality of portions of the connection layer 20 in the first direction.

[0062] In the present embodiment, the frame body 10 can be rectangular or rounded. The number of the slits can be eight, and the eight slits can be arranged at intervals, and the frame body 10 is divided into the first corner 11, the first side 12, the second corner 13, the second side 14, the third corner 15, the third side 16, the fourth corner 17 and the fourth side 18 arranged end to end. At this time, a plurality of slits can be respectively located between each corner (i.e., the first corner 11, the second corner 13, the third corner 15 and the fourth corner 17) and each side (i.e., the first side 12, the second side 14, the third side 16 and the fourth side 18). For example, a plurality of slits can include a first slit 41 and a second slit 42 that are arranged adjacently. The first slit 41 and the second slit 42 can be located on different sides of the frame body 10. The portion of the frame body 10 between the first slit 41 and the second slit 42 may constitute the first corner portion 11, that is, the first corner portion 11 may be located between the first slit 41 and the second slit 42. At this time, the first slit 41 may be located between the first corner portion 11 and the fourth side portion 18. The second slit 42 may be located between the first corner portion 11 and the first side portion 12.

[0063] The connection layer 20 may include a first connection segment 21, a second connection segment 22, a third connection segment 23, a fourth connection segment 24, a fifth connection segment 25, a sixth connection segment 26, a seventh connection segment 27, and an eighth connection segment 28 connected end to end in sequence. The first connection segment 21, the second connection segment 22, the third connection segment 23, the fourth connection segment 24, the fifth connection segment 25, the sixth connection segment 26, the seventh connection segment 27, and the eighth connection segment 28 of the connection layer 20 may be connected between the first corner 11, the first side 12, the second corner 13, the second side 14, the third corner 15, the third side 16, the fourth corner 17, and the fourth side 18 of the frame body 10 and the middle plate body 30 in a one-to-one correspondence.

[0064] It should be noted that each corner in the present embodiment refers to each corner in the frame body 10. Taking the first corner 11 as an example, the first corner 11 may include an arc segment at one of the corners of the frame body 10. In other embodiments, the first corner 11 may also include an arc segment at one of the corners of the frame body 10, and also include at least a portion of two straight segments connected to both ends of the arc segment or at least a portion of one of the straight segments. In some other embodiments, the number and location of the slits may also be changed according to demand. At this time, the frame body 10 may still include the first corner 11, the first side 12, the second corner 13, the second side 14, the third corner 15, the third side 16, the fourth corner 17, and the fourth side 18 arranged end to end in sequence.

[0065] Figure 5 yes Figure 4The figure shows a schematic diagram of the contents of the first metal and the second metal at different positions of the connection layer 20 of the housing 100. It should be noted that: Figure 5 In the figure, different curves are used to illustrate the approximate variation trend of the content of the first metal and the second metal at different positions of the connecting layer 20. In other embodiments, the curve representing the content of the first metal and / or the curve representing the content of the second metal can also be presented to meet Figure 5 Other styles of changing trends of different curves are shown.

[0066] like Figure 4 and Figure 5 As shown, the material of the frame body 10 may include a first metal. The material of the middle plate body 30 may include a second metal. The material of the connecting layer 20 may include a first metal and a second metal. In this embodiment, the frame body 10 may be made of a first metal. The middle plate body 30 may be made of a second metal. The first metal and the second metal may be two different metal materials. Exemplarily, a portion of the connecting layer 20 and the middle plate body 30 may be prepared from powder by a sintering process. In other embodiments, the frame body 10 may also include a first metal and other metal materials. The middle plate body 30 may also include a second metal and other metal materials.

[0067] Exemplarily, the first metal may be a shape memory alloy. The shape memory alloy may be a temperature-controlled shape memory alloy induced by temperature, such as a nickel-titanium-based alloy (such as nickel-titanium, nickel-titanium-niobium, nickel-titanium-palladium, etc.), a copper-based alloy (such as copper-gold-zinc, copper-aluminum, copper-tin, etc.), an iron-based alloy (such as iron-palladium, iron-manganese-silicon, etc.), etc. In this embodiment, the first metal may be a nickel-titanium shape memory alloy. At this time, the nickel content in the first metal may range from 55.4% to 56.2%, for example, the nickel content in the first metal may be 55.8% or 56%, etc. In other embodiments, the shape memory alloy may also be a magnetically controlled shape memory alloy induced by a magnetic field, such as nickel-manganese-gallium, nickel-iron-gallium, iron-based alloys (such as iron-platinum, iron-nickel-cobalt-titanium, etc.), cobalt-based alloys (such as cobalt-nickel, cobalt-manganese, etc.), etc. Among them, when the first metal is a nickel-manganese-gallium alloy, the nickel content in the first metal may be 50%, the manganese content may be 28%, and the gallium content may be 22%.

[0068] For example, the second metal can be a metal that is both lightweight and highly thermally conductive, such as aluminum alloy, particle-reinforced aluminum-based composite material, particle-reinforced magnesium-based composite material, titanium alloy, stainless steel, amorphous alloy, steel-copper-steel composite material, steel-aluminum-steel composite material, etc. Lightweight means that the density of the metal material can be less than or equal to 3.5 grams per cubic centimeter (g / cm 3 For example, the density of the second metal may be 2.0 g / cm 3 , 2.7g / cm3 、3.1g / cm 3 Etc. High thermal conductivity means that the thermal conductivity of the metal material can be greater than or equal to 50 watts per square meter per second (W / mk). For example, the thermal conductivity of the second metal can be 70W / mk, 85W / mk, 108W / mk, 120W / mk, 128W / mk, etc. Exemplarily, the second metal can be an aluminum alloy, such as a grade 6013 aluminum alloy, in which case the second metal can mainly include aluminum, magnesium and silicon. Among them, the aluminum content in the second metal can be in the range of 94.8% to 97.8%, the magnesium content in the second metal can be in the range of 0.8% to 1.2%, and the silicon content in the second metal can be in the range of 0.6% to 1%. In some embodiments, the second metal can also include trace amounts of copper, manganese, iron or zinc, etc. In other embodiments, the second metal can also only have lightweight properties or only have high thermal conductivity properties. In some other embodiments, the second metal can also be a non-shape memory alloy with other physical properties. For example, the second metal may also be a metal material having high-strength physical properties.

[0069] like Figure 4 and Figure 5 As shown, the housing 100 can be formed by a sintering process. For example, when the second metal is an aluminum alloy or a particle-reinforced aluminum-based composite material, it can be sintered for a long time under a high temperature environment to form the housing 100. Among them, a part of the connecting layer 20 and the middle plate body 30 can be prepared by a sintering process from powder, and the temperature is in the range of 500°C to 660°C, the duration is in the range of 2 hours to 5 hours, and the pressure is greater than or equal to 100MPa. At this time, the housing 100 formed by the sintering process may include a frame body 10 made of a first metal, a middle plate body 30 made of a second metal, and a connecting layer 20 in which components of different metals (i.e., the first metal and the second metal) diffuse with each other. In other words, the connecting layer 20 can be formed by the mutual diffusion of components between the first metal and the second metal. Among them, the mutual diffusion of components between the first metal and the second metal means that the first metal can diffuse components in the direction close to the second metal, and the second metal can diffuse components in the direction close to the first metal. In this embodiment, the connection layer 20 may be formed by diffusion of the first metal along the direction from the frame body 10 to the middle plate body 30, and the second metal may be diffused along the direction from the middle plate body 30 to the frame body 10. This allows the content of the first metal in each part of the connection layer 20 in the direction perpendicular to the first interface 20a to be different. The content of the second metal in each part of the connection layer 20 in the direction perpendicular to the first interface 20a may also be different.

[0070] Exemplarily, the content of the first metal in the portion of the connecting layer 20 located at the first interface 20a is the highest, and the content of the second metal is the lowest. The content of the first metal in the portion of the connecting layer 20 located at the second interface 20b is the lowest, and the content of the second metal is the highest. In the direction perpendicular to the first interface 20a, the content of the first metal in the connecting layer 20 may decrease along the direction from the first interface 20a to the second interface 20b (in the present embodiment, that is, the direction from the frame body 10 to the middle plate body 30). The content of the second metal in the connecting layer 20 may increase along the direction from the first interface 20a to the second interface 20b. In other words, the content of the first metal and the content of the second metal in the connecting layer 20 may both show different variation trends along the direction perpendicular to the first interface 20a. It should be understood that Figure 5 The diagram shows the change in the content of the first metal and the change in the content of the second metal in the direction perpendicular to the first interface 20a of the connection layer 20. The X-axis represents the distance from each part of the connection layer 20 in the direction perpendicular to the first interface 20a to the first interface 20a. X1 represents the distance from the first interface 20a to the second interface 20b of the connection layer 20. The Y-axis represents the content of the metal. It should be noted that Figure 5 The content change of the first metal and the content change of the second metal in the direction perpendicular to the first interface 20a of the connection layer 20 are only schematically shown. In other embodiments, the content change of the first metal and the content change of the second metal in the connection layer 20 in the direction perpendicular to the first interface 20a may also present other similar curve forms, which is not specifically limited in the present application.

[0071] It can be understood that the housing 100 in this embodiment can include the first metal and the second metal at the same time. Among them, the material of the frame body 10 is the first metal. The material of the middle plate body 30 is the second metal. The material of the connecting layer 20 includes the first metal and the second metal. The content of the first metal and the content of the second metal in the connecting layer 20 can both show different changing trends along the direction perpendicular to the first interface 20a. Among them, the content of the first metal in the connecting layer 20 can be reduced along the direction from the frame body 10 to the middle plate body 30, and the content of the second metal can be increased along the direction from the frame body 10 to the middle plate body 30. In this way, a connecting layer 20 having different trends in the content of its respective components (that is, the content of the first metal and the content of the second metal) along the direction perpendicular to the first interface 20a is formed between the frame body 10 and the middle plate body 30 of the housing 100, that is, a region having different trends in the content of its respective components along the direction perpendicular to the first interface 20a is formed between the first metal and the second metal, and the thickness H1 of the connecting layer 20 can be greater than or equal to 0.1 microns. In this way, the connection layer 20 has a certain thickness, so that the frame body 10 made of the first metal and the middle plate body 30 made of the second metal can be better combined through the connection layer 20, which is conducive to improving the bonding strength between the frame body 10 and the middle plate body 30, thereby improving the overall structural stability of the shell 100. In addition, the thickness H1 of the connection layer 20 can also be less than or equal to 30 microns, so that the shell 100 can meet the bonding strength requirements between the first metal and the second metal while having a low manufacturing cost, which is conducive to large-scale production. At the same time, the first metal and the second metal in the shell 100 are two different metals with different physical properties, so that the shell 100 can have a variety of different physical properties while ensuring its overall structural stability to meet different application scenarios.

[0072] Secondly, the first metal in the present embodiment is a shape memory alloy, and the first metal is applied to the frame body 10, so that the frame body 10 also has the physical properties of the shape memory alloy. In this way, when the frame body 10 in the housing 100 is deformed or pitted due to external forces such as falling or collision, the frame body 10 can be restored to its original shape before deformation by specific means according to the different types of shape memory alloys selected. In other words, the housing 100 in the present embodiment is conducive to improving the anti-deformation ability of the frame body 10 of the housing 100 by using the shape memory alloy (that is, the first metal) in the frame body 10, thereby effectively solving the deformation problem of the frame body 10 of the housing 100 after falling or collision, which is conducive to improving the overall aesthetics of the housing 100 and improving the user experience. The middle plate body 30 of the shell 100 can also adopt a non-shape memory alloy (i.e., a second metal) with lower cost than the shape memory alloy. Compared with the shell 100 adopting the shape memory alloy as a whole, the present embodiment adopts the shape memory alloy only in the part of the shell 100 that is prone to deformation (i.e., the frame body 10), so that the shell 100 can solve the deformation problem of the shell 100 while greatly reducing the overall manufacturing cost of the shell 100.

[0073] In addition, compared with the shell prepared by die-casting, spot welding, etc., the frame body 10, the connection layer 20 and the middle plate body 30 of the shell 100 in this embodiment can be integrally formed by a sintering process, that is, the shell 100 can be an integrally formed structure. In this way, the shell 100 is an integrally formed structure, so that the connection between the various parts of the shell 100 (that is, the frame body 10, the connection layer 20 and the middle plate body 30) has good waterproofness, and the overall structural stability of the shell 100 is high. At the same time, when the second metal is an aluminum alloy or a particle-reinforced aluminum-based composite material, the shell 100 can be obtained by long-term sintering (for example, the sintering time is in the range of 2 hours to 5 hours) at a high temperature (for example, the temperature is in the range of 500°C to 660°C) and a pressure greater than or equal to 100 MPa, which is beneficial to improving the diffusion ability between the first metal and the second metal, and improving the bonding strength between the first metal and the second metal, so that the first metal and the second metal can be better combined through high-temperature and long-term sintering, so that the thickness of the formed connecting layer 20 can be greater than or equal to 2 microns. The thicker the connecting layer 20 is, the higher the bonding strength between the frame body 10 and the middle plate body 30, thereby improving the overall structural stability of the shell 100.

[0074] In addition, a part of the connection layer 20 of the shell 100 in this embodiment is formed by a sintering process from powder. In this way, on the one hand, the powder can fully contact with other metal materials, so that the contact area between the powder and the other metal materials can be increased, which is conducive to improving the bonding strength between different metal materials in the shell 100 formed subsequently, thereby improving the bonding strength between the frame body 10 of the shell 100 and the connection layer 20; on the other hand, the force on the powder and other metal materials in all directions is relatively balanced, so that the first interface 20a between the frame body 10 and the connection layer 20 formed can be a flat or approximately flat surface, and the second interface 20b between the middle plate body 30 and the connection layer 20 can also be a flat or approximately flat surface. The first interface 20a can be parallel to the second interface 20b, that is, the thickness of each part of the connection layer 20 in its extension direction in the direction perpendicular to the first interface 20a can be equal. In this way, the various parts of the connecting layer 20 are of equal thickness, so that the degree of diffusion between the first metal and the second metal in the various parts of the connecting layer 20 of the shell 100 is equivalent, the bonding strength between the various parts of the connecting layer 20 and the frame body 10 is also roughly the same, and the bonding strength between the various parts of the connecting layer 20 and the middle plate body 30 is roughly the same, thereby effectively avoiding the shell 100 from cracking at the place where the bonding strength between the connecting layer 20 and the frame body 10 is weak, or from cracking at the place where the bonding strength between the connecting layer 20 and the middle plate body 30 is weak, which is beneficial to improving the overall structural stability of the shell 100 and extending the service life of the shell 100.

[0075] In addition, the second metal in this embodiment is a metal material that takes into account both lightness and high thermal conductivity. The second metal is applied to the middle plate body 30, so that the middle plate body 30 can have both lightness and high thermal conductivity. In this way, the housing 100 can have high anti-deformation ability, high thermal conductivity and light weight, so that the housing 100 can better meet the requirements of the electronic device 1000 for lightness and high heat dissipation, which is conducive to improving the user experience.

[0076] In other embodiments, please refer again to Figure 3 The first corner 11, the second corner 13, the third corner 15 and the fourth corner 17 of the frame body 10 can all be made of the first metal. The first side 12, the second side 14, the third side 16 and the fourth side 18 of the frame body 10 can all be made of the third metal. The third metal can be a metal material other than a shape memory alloy, such as titanium alloy and stainless steel.

[0077] For example, the first connecting segment 21, the third connecting segment 23, the fifth connecting segment 25, and the seventh connecting segment 27 of the connecting layer 20 may together constitute a first portion of the connecting layer 20. The material of the first portion may include a first metal and a second metal. The second connecting segment 22, the fourth connecting segment 24, the sixth connecting segment 26, and the eighth connecting segment 28 of the connecting layer 20 may together constitute a second portion of the connecting layer 20. The material of the second portion may include a second metal and a third metal.

[0078] For example, in the direction perpendicular to the first interface 20a, the content of the first metal in the first part of the connecting layer 20 may gradually decrease in the direction close to the second interface 20b, and the content of the second metal may gradually increase in the direction close to the second interface 20b. The content of the third metal in the second part of the connecting layer 20 may gradually decrease in the direction close to the second interface 20b, and the content of the second metal may gradually increase in the direction close to the second interface 20b. In other words, the content of the first metal and the content of the second metal in the first part of the connecting layer 20 may both show different changing trends in the direction perpendicular to the first interface 20a. The content of the second metal and the content of the third metal in the second part of the connecting layer 20 may also show different changing trends in the direction perpendicular to the first interface 20a.

[0079] It can be understood that the shell 100 in this embodiment adopts shape memory alloy at each corner of the frame body 10 (that is, the first corner 11, the second corner 13, the third corner 15 and the fourth corner 17 of the frame body 10), and adopts a third metal at each side of the frame body 10 (that is, the first side 12, the second side 14, the third side 16 and the fourth side 18 of the frame body 10), and the third metal is a non-shape memory alloy. In this way, by adopting shape memory alloy at each corner of the frame body 10 of the shell 100 that is more likely to deform, and adopting non-shape memory alloy with lower cost than shape memory alloy at each side of the frame body 10 that is less likely to deform, the manufacturing cost of the frame body 10 of the shell 100 can be greatly reduced while effectively solving the deformation problem of each corner of the frame body 10 when falling or colliding. Secondly, the various edges of the shell 100 can be made of non-shape memory alloy metal materials such as titanium alloy or stainless steel, which can effectively reduce the manufacturing cost of the shell 100 on the one hand, and improve the appearance of each edge on the other hand, which is beneficial to reduce the overall manufacturing cost of the shell 100 while obtaining a shell 100 with a higher appearance.

[0080] In some other embodiments, the frame body 10 may also be made of the first metal only in at least one of the first corner 11, the second corner 13, the third corner 15, and the fourth corner 17, and the remaining parts may be made of the third metal. For example, the frame body 10 may be made of the first metal only in the first corner 11.

[0081] In some other embodiments, the materials of the various edges of the frame body 10 may not be completely the same. The material of a portion of each edge may be the third metal, and the material of another portion may be the fourth metal. This application does not limit the type, quantity, and specific location of the metal material included in the frame body 10.

[0082] In some other embodiments, the middle plate body 30 may also use different metal materials in different parts as needed. For example, the middle plate body 30 may also use a second metal with good heat dissipation ability in the parts close to the heating components of the electronic device 1000 (such as the parts close to the chip, the parts close to the camera module), and use a fifth metal with high strength in the remaining parts. This application does not limit the type, quantity and specific location of the metal material contained in the middle plate body 30.

[0083] Figure 6 yes Figure 3 The housing 100 is shown in cross-sectional view in other embodiments.

[0084] In other embodiments, Figure 6 As shown, the housing 100 may further include an appearance layer 80. The appearance layer 80 may be connected to the outer surface of the frame body 10 that faces away from the inner space 100a. At this time, the outer surface of the appearance layer 80 may be used to form the overall appearance of the housing 100, that is, the appearance of the electronic device 1000. The appearance layer 80 may form the frame of the housing 100 together with the frame body 10 and the connecting layer 20. Exemplarily, the appearance layer 80 may be deposited on the outer surface of the frame body 10 that faces away from the inner space 100a by a physical vapor deposition process, so that it can achieve a decorative effect. In this way, the appearance layer 80 is provided to improve the overall aesthetics of the housing 100 and enhance the user experience. In other embodiments, the film deposited by the physical vapor deposition process may also have a wear-resistant and / or anti-corrosion effect, so that the formed appearance layer 80 may have a variety of special functions to meet the different use requirements of the housing 100.

[0085] In other embodiments, the housing 100 may further include an anti-corrosion layer 90. The anti-corrosion layer 90 may connect the inner surface of the connection layer 20 and the inner surface of the middle plate body 30. Exemplarily, the anti-corrosion layer 90 may form an oxide film on the inner surface of the connection layer 20 and the inner surface of the middle plate body 30 by chemical passivation, anodization, micro-arc oxidation, etc., thereby forming the anti-corrosion layer 90. In this way, by providing the anti-corrosion layer 90, the internal components of the electronic device 1000 can be effectively prevented from being exposed to water or other corrosive liquids, thereby avoiding the problem of the internal components of the electronic device 1000 being corroded by the corrosive liquid and causing the failure of the internal components of the electronic device 1000, which is conducive to extending the service life of the electronic device 1000.

[0086] Figure 7 yes Figure 1 The illustrated diagram is a partial cross-sectional structural diagram of an electronic device 1000 in one embodiment cut along line BB.

[0087] like Figure 7 As shown, the back cover 300 can be fixedly connected to the lower surface of the housing 100 by bonding, welding, etc. At this time, the surface of the back cover 300 exposed relative to the housing 100 can constitute a part of the appearance surface of the electronic device 1000. Exemplarily, the material of the back cover 300 can be different from the material of the frame body 10 of the housing 100. For example, the back cover 300 can be selected from a material with higher strength or higher hardness. It can be understood that the back cover 300 and the housing 100 in this embodiment are split structures, so that the back cover 300 is easy to disassemble. In this way, when the back cover 300 is damaged by collision, the user can only replace or repair the damaged back cover 300 without disassembling the entire housing 100 together, which is conducive to reducing the maintenance cost of the housing 100 and extending the service life of the housing 100. Secondly, the material of the back cover 300 can be used alone. The material with higher strength or higher hardness allows the back cover 300 to have a certain structural strength, thereby protecting the housing 100, which is conducive to extending the overall service life of the housing 100.

[0088] Figure 8 yes Figure 4 The shown schematic diagram is a cross-sectional structure of the housing 100 in another embodiment. Fig. 9 yes Figure 4 The shown schematic diagram is a cross-sectional structure of the housing 100 in yet another embodiment. Fig.10 yes Figure 4 The shown schematic diagram is a cross-sectional structure of a shell in another embodiment.

[0089] In another embodiment, if Figure 8 As shown, the structure of the housing 100 in this embodiment is similar to Figure 4The structure of the shell 100 shown is substantially the same, and the same parts are not repeated. The difference is that the height of the connecting layer 20 in the first direction can also be the same as the height of the middle plate body 30 in the first direction. At this time, the frame body 10, the connecting layer 20 and the middle plate body 30 can jointly enclose the inner space 100a of the shell 100. Among them, the inner surface of the frame body 10, the inner surface of the connecting layer 20 and the inner surface of the middle plate body 30 can jointly constitute the inner surface of the shell 100. The frame body 10 can constitute the frame of the shell 100. The connecting layer 20 and the middle plate body 30 can jointly constitute the middle plate of the shell 100. In other embodiments, the height of the connecting layer 20 in the first direction can also be between the height of the frame body 10 in the first direction and the height of the middle plate body 30 in the first direction.

[0090] In yet another embodiment, Fig. 9 As shown, the structure of the housing 100 in this embodiment is similar to Figure 4 The structure of the shell 100 shown is roughly the same, and the same parts will not be repeated. The difference is that the connecting layer 20 may include a frame portion 201 and a bottom portion 202. The frame portion 201 may be arranged around the bottom portion 202 and connected to the bottom portion 202. The bottom portion 202 may be arranged around the middle plate body 30 and connected to the middle plate body 30. The frame body 10 may be arranged around the frame portion 201 and connected to the frame portion 201. Exemplarily, the height of the frame portion 201 in the first direction may be the same as the height of the frame body 10 in the first direction. The height of the bottom portion 202 in the first direction may be the same as the height of the middle plate body 30 in the first direction. At this time, the frame body 10 and the frame portion 201 of the connecting layer 20 may jointly constitute the frame of the shell 100. The middle plate body 30 and the bottom portion 202 of the connecting layer 20 may jointly constitute the middle plate of the shell 100. It should be understood that Fig. 9 The frame portion 201 and the bottom portion 202 of the connection layer 20 are divided by a dotted line.

[0091] In yet another embodiment, Fig.10 As shown, the structure of the housing 100 in this embodiment is similar to Figure 4The structure of the housing 100 shown is substantially the same, and the same parts are not repeated. The difference is that the electronic device 1000 in this embodiment may not include a back cover. The housing 100 may also include a back cover body 40. The material of the back cover body 40 may be the same as that of the frame body 10. The back cover body 40 may be integrally formed with the frame body 10. At this time, both the frame body 10 and the back cover body 40 may include a first metal. Exemplarily, the back cover body 40 may connect the lower surface of the frame body 10 and the lower surface of the connecting layer 20. The back cover body 40 and the frame body 10 may jointly enclose a first recess 101. At least a portion of the connecting layer 20 and at least a portion of the middle plate body 30 may be located in the first recess 101. The connecting layer 20 may be provided with a second recess 102. The second recess 102 may be connected to the inner space 100a of the housing 100. At least a portion of the middle plate body 30 may be located in the second recess 102 and connected to the connecting layer 20. At this time, the lower surface of the rear cover body 40 can constitute a part of the appearance surface of the electronic device 1000. The housing 100 can directly serve as the outer shell of the electronic device 1000, that is, the outer shell of the electronic device 1000 can be an integrated structure. In this way, the outer shell of the electronic device 1000 is an integrated structure, which is conducive to simplifying the preparation process of the outer shell of the electronic device 1000 and reducing the overall preparation cost of the outer shell. At the same time, the appearance surface consistency of the outer shell of the electronic device 1000 is better, and the overall aesthetics of the outer shell of the electronic device 1000 is better, which is conducive to improving the user experience. It should be understood that Fig.10 The frame body 10 and the rear cover body 40 of the housing 100 are schematically divided by dotted lines. In other embodiments, the material of the rear cover body 40 may be different from that of the frame body 10.

[0092] In some other embodiments, the rear cover body 40 can also be connected to the first side portion 12, the second side portion 14, the third side portion 16 and the fourth side portion 18 of the frame body 10 (see Figure 3 At this time, the materials of the rear cover body 40, the first side portion 12, the second side portion 14, the third side portion 16 and the fourth side portion 18 can all be the third metal.

[0093] The structure and components of the housing 100 are specifically introduced above, and the preparation method of the housing 100 will be specifically introduced below in conjunction with the relevant drawings.

[0094] Fig.11 yes Figure 3 The shown schematic diagram is a flow chart of a method for preparing the housing 100 in some embodiments. Figures 12 to 16 yes Fig.11 The process schematic diagram of the preparation method in one embodiment is shown. Figure 3 The housing 100 shown may be Fig.11 Prepared by the preparation method shown.

[0095] like Fig.11 As shown, the embodiment of the present application further provides a method for preparing the housing 100, wherein the method may include but is not limited to steps S110 to S150 provided below, and each step will be specifically described below in conjunction with the relevant drawings:

[0096] S110: preparing an initial frame body 50.

[0097] For example, Fig.12 As shown, a blank material made of the first metal may be subjected to a forming process such as stamping or cold drawing and bending to form an initial frame body 50. At this time, the material of the initial frame body 50 may be the first metal. Exemplarily, the initial frame body 50 may have a filling space 50a. The filling space 50a may penetrate the initial frame body 50 in the thickness direction of the initial frame body 50. In other embodiments, the filling space 50a may not penetrate the initial frame body 50 in the thickness direction of the initial frame body 50.

[0098] S120 : filling the filling space 50 a of the initial frame body 50 with metal powder 60 .

[0099] For example, Fig.12 and Fig.13 As shown, metal powder 60 is filled into the filling space 50a of the initial frame body 50. At this time, the interface between the initial frame body 50 and the metal powder 60 is the bonding interface 50b between the first metal and the second metal. The metal powder 60 may include the second metal. In this embodiment, the metal powder 60 may be the second metal. It should be understood that Fig.13 The metal powder 60 is indicated by dotted hatching.

[0100] In some embodiments, the metal powder 60 can also be prepared. For example, the second metal blank is subjected to a powdering process to form a uniform metal powder 60. When the second metal is a particle-reinforced aluminum-based composite material, the aluminum-based blank is subjected to powdering to form a powder, and then a particle-reinforced substance (such as graphene, etc.) is added to the powder, and then the powder is subjected to a powdering process to form a uniform metal powder 60.

[0101] S130: The initial frame body 50 and the metal powder 60 are formed into a sintered part 70 through a sintering process.

[0102] For example, Figures 13 to 15As shown, when the initial frame body 50 and the metal powder 60 are sintered by the sintering process, the first metal in the initial frame body 50 and the second metal in the metal powder 60 will diffuse components at the bonding interface 50b of the two. At this time, the first metal can diffuse components in the direction close to the second metal, and the second metal can diffuse components in the direction close to the first metal. The sintered part 70 finally formed may include a first sintered part 71 containing only the first metal, a second sintered part 72 containing both the first metal and the second metal, and a third sintered part 73 containing only the second metal. Among them, the first sintered part 71 can be arranged around the third sintered part 73. The second sintered part 72 can be connected between the first sintered part 71 and the third sintered part 73.

[0103] Exemplarily, a first initial interface 721 may be formed between the second sintered portion 72 and the first sintered portion 71. A second initial interface 722 may be formed between the second sintered portion 72 and the third sintered portion 73. Exemplarily, in the metallographic structure of the sintered part 70, an interface (i.e., the first initial interface 721) may be seen between the first sintered portion 71 and the second sintered portion 72. An interface (i.e., the second initial interface 722) may be seen between the third sintered portion 73 and the second sintered portion 72. Exemplarily, the height of the first initial interface 721 in the thickness direction of the sintered part 70 may be the same as the height of the second initial interface 722 in the thickness direction of the sintered part 70. In some embodiments, the height of the first initial interface 721 in the thickness direction of the sintered part 70 may also be different from the height of the second initial interface 722 in the thickness direction of the sintered part 70. For example, the height of the first initial interface 721 in the thickness direction of the sintered part 70 may also be greater than the height of the second initial interface 722 in the thickness direction of the sintered part 70.

[0104] Exemplarily, the first initial interface 721 may be parallel to the second initial interface 722. The first initial interface 721 may be completely parallel to the second initial interface 722, or may be approximately parallel. At this time, the thickness H2 of each portion of the second sintered portion 72 in its extension direction in a direction perpendicular to the first initial interface 721 may be equal or approximately equal. The first initial interface 721 and / or the second initial interface 722 may be a flat surface, or may be an approximately flat surface with concave and convex portions.

[0105] Exemplarily, the thickness H2 of the second sintered portion 72 in the direction perpendicular to the first initial interface 721 (i.e., the direction in which the first initial interface 721 points to the second initial interface 722 in this embodiment) may be greater than or equal to 0.1 micrometer. For example, the thickness H2 of the second sintered portion 72 in the direction perpendicular to the first initial interface 721 may be 0.6 micrometer, 2.3 micrometer, 5 micrometer, 8 micrometer, 10 micrometer, 22 micrometer, 30 micrometer, etc. In some embodiments, the thickness H2 of the second sintered portion 72 in the direction perpendicular to the first initial interface 721 may be greater than or equal to 2 micrometers.

[0106] Exemplarily, the content of the first metal in the portion of the second sintered portion 72 located at the first initial interface 721 is the highest, and the content of the second metal is the lowest. The content of the first metal in the portion of the second sintered portion 72 located at the second initial interface 722 is the lowest, and the content of the second metal is the highest. In the direction perpendicular to the first initial interface 721, the content of the first metal in the second sintered portion 72 can decrease in the direction close to the second initial interface 722. The content of the second metal in the second sintered portion 72 can increase in the direction close to the second initial interface 722. In other words, the content of the first metal and the content of the second metal in the second sintered portion 72 can both show different changing trends in the direction perpendicular to the first initial interface 721. In this way, mutual diffusion of components can occur between the first metal and the second metal, thereby forming a second sintered portion 72 in which the content of the first metal and the content of the second metal both show different changing trends in the direction perpendicular to the first initial interface 721, which is conducive to enhancing the bonding force between the first metal and the second metal.

[0107] Exemplarily, the sintering process may be hot isostatic pressing. When the second metal is an aluminum alloy or a particle-reinforced aluminum-based composite material, the pressure during hot isostatic pressing may be greater than or equal to 100 MPa, the temperature may be in the range of 500° C. to 660° C., and the duration may be in the range of 2 hours to 5 hours. For example, hot isostatic pressing may be performed for 4 hours at 600° C. At this time, the thickness H2 of the formed second sintered portion 72 in the direction perpendicular to the first initial interface 721 may be greater than or equal to 2 microns.

[0108] In some other embodiments, before the initial frame body 50 and the metal powder 60 are subjected to the sintering process, the initial frame body 50 and the metal powder 60 may be subjected to a cold isostatic pressing process, so that the metal powder 60 may be pre-pressed to form a metal block material, so as to facilitate the subsequent sintering process. Wherein, the pressure during the cold isostatic pressing process may be greater than or equal to 100 MPa, the temperature may be room temperature, and the duration may be between 1 hour and 3 hours. In some other embodiments, after the initial frame body 50 and the metal powder 60 are subjected to the cold isostatic pressing process, the initial frame body 50 and the formed second metal block material may be subjected to vacuum degassing, so as to facilitate the subsequent sintering process.

[0109] S150 : machining the sintered part 70 to form the housing 100 .

[0110] For example, Fig.14 and Fig.15 As shown, the sintered part 70 can be machined to change the shape and / or size of the sintered part 70 to form a housing 100 with a specific shape (see Figure 3 ). The remaining portion of the first sintered portion 71 of the sintered part 70 after mechanical processing can be used to form the frame body 10 of the housing 100. The remaining portion of the second sintered portion 72 of the sintered part 70 after mechanical processing can be used to form the connection layer 20 of the housing 100. The remaining portion of the third sintered portion 73 of the sintered part 70 after mechanical processing can be used to form the middle plate body 30 of the housing 100. The remaining portion of the first initial interface 721 after mechanical processing can be used to form the first interface 20a of the housing 100. The remaining portion of the second initial interface 722 after mechanical processing can be used to form the second interface 20b of the housing 100.

[0111] In other words, a portion of the initial frame body 50 can be used to form the frame body 10 of the shell 100. Another portion of the initial frame body 10 and a portion of the metal powder 60 can be used to jointly form the connection layer 20 of the shell 100. Another portion of the metal powder 60 can be used to form the middle plate body 30 of the shell 100.

[0112] It is understandable that in the traditional preparation method, the frame body and the middle plate body of different metal materials are usually connected by welding, stir friction and other processes to form a shell. However, there is no connecting layer in the metallographic structure of the shell, or the width of the connecting layer is extremely small, so that the bonding strength between the frame body and the middle frame body of the shell is low, and the overall structural stability of the shell is low. In the preparation method of this embodiment, an initial frame body 50 containing a first metal and a metal powder 60 containing a second metal are formed respectively, and then the metal powder 60 is filled into the inner side of the initial frame body 50, and a sintered part 70 is formed by a sintering process, and finally the sintered part 70 is machined to form a shell 100. Among them, the contact surface between the initial frame body 50 and the metal powder 60 is the bonding interface between the first metal and the second metal. During the sintering process, the first metal and the second metal may diffuse their components at the bonding interface 50b therebetween, thereby forming a second sintered portion 72 in which the content of the first metal and the content of the second metal show different changing trends in a direction perpendicular to the first initial interface 721. The thickness H2 of the second sintered portion 72 in a direction perpendicular to the first initial interface 721 may be greater than or equal to 0.1 microns, thereby enhancing the bonding force between the first metal and the second metal, so that the first sintered portion 71 and the third sintered portion 73 of the sintered part 70 formed may be better bonded through the second sintered portion 72, which is beneficial to improving the bonding strength between the frame body 10 and the middle plate body 30 of the shell 100 formed subsequently, thereby improving the overall structural stability of the shell 100.

[0113] Secondly, the sintering process in this embodiment can be sintered for a long time under a high temperature environment to form a sintered part 70 including two different metal materials. For example, when the second metal is an aluminum alloy or a particle-reinforced aluminum-based composite material, it can be sintered for a long time (for example, the sintering time is in the range of 2 hours to 5 hours) under a high temperature (for example, the temperature is in the range of 500°C to 660°C) and a pressure greater than or equal to 100MPa to form the shell 100. Among them, there is also a connecting layer 20 between the frame body 10 and the middle plate body 30 of the formed shell 100. The thickness H1 of the connecting layer 20 can be greater than or equal to 2 microns. In this way, sintering at high temperature for a long time is conducive to improving the diffusion ability of the first metal and the second metal, thereby improving the bonding force between the first metal and the second metal. At the same time, by sintering at high temperature for a long time, the thickness H2 of the second sintered part 72 in the direction perpendicular to the first initial interface 721 can also be increased, thereby increasing the thickness H1 of the connecting layer 20 of the shell 100 formed subsequently. In other words, the shell 100 prepared by the preparation method of this embodiment has a connecting layer 20, and the thickness H1 of the connecting layer 20 can be greater than or equal to 2 microns, so that the frame body 10 and the middle plate body 30 made of different metal materials can be better combined through the connecting layer 20, and the bonding strength between the frame body 10 and the middle plate body 30 is relatively high, which is beneficial to improving the overall structural stability of the shell 100.

[0114] In addition, the first metal in the present embodiment is a shape memory alloy, which is used to form the frame body 10 of the housing 100, so that the frame body 10 also has the physical properties of the shape memory alloy. In this way, when the frame body 10 in the housing 100 is deformed or pitted due to external forces such as falling or collision, the frame body 10 can be restored to its original shape before deformation by specific means according to the different types of shape memory alloys selected. In other words, the housing 100 in the present embodiment uses the shape memory alloy (that is, the first metal) in the frame body 10, which is conducive to improving the anti-deformation ability of the frame body 10 of the housing 100, thereby effectively solving the deformation problem of the frame body 10 of the housing 100 after falling or collision, which is conducive to improving the overall aesthetics of the housing 100 and improving the user experience. At the same time, the middle plate body 30 of the shell 100 adopts a non-shape memory alloy (i.e., the second metal) with lower cost than the shape memory alloy. Compared with the shell 100 that adopts the shape memory alloy as a whole, the present embodiment adopts the shape memory alloy only in the part of the shell 100 that is prone to deformation (i.e., the frame body 10), so that the shell 100 can solve the deformation problem of the shell 100 while greatly reducing the overall manufacturing cost of the shell 100.

[0115] In addition, the sintered part 70 in the present embodiment is prepared by the initial frame body 50 and the metal powder 60 through a sintering process. In this way, when the metal powder 60 is filled in the initial frame body 50, on the one hand, the metal powder 60 and the initial frame body 50 can be fully in contact, so that the contact area between the metal powder 60 and the initial frame body 50 can be increased, and the bonding strength between the first metal and the second metal in the subsequently formed sintered part 70 is effectively improved, so as to improve the bonding strength between the first sintered part 71 and the third sintered part 73 in the formed sintered part 70, thereby facilitating the improvement of the overall structural stability of the finally formed shell 100; on the other hand, the forces on each part at the bonding interface 50b between the initial frame body 50 and the metal powder 60 are uniform, so that the first sintered part 71 and the third sintered part 73 of the sintered part 70 formed by the sintering process ... Both the first initial interface 721 and the second initial interface 722 can be flat or approximately flat surfaces, and the first initial interface 721 can be parallel to the second initial interface 722, so that the bonding strength between each part of the second sintered portion 72 of the sintered component 70 and the first sintered portion 71 is substantially the same, and the bonding strength between each part of the second sintered portion 72 and the third sintered portion 73 is substantially the same, thereby avoiding the sintered component 70 from cracking at a location where the bonding strength between the second sintered portion 72 and the first sintered portion 71 is weak, or from cracking at a location where the bonding strength between the second sintered portion 72 and the third sintered portion 73 is weak, which is beneficial to improving the overall structural stability of the shell 100 formed subsequently.

[0116] In addition, the second metal in this embodiment is a metal material that is both lightweight and highly thermally conductive and is applied to the middle plate body 30, so that the middle plate body 30 can have both lightweight and highly thermally conductive properties. In this way, the housing 100 can have high anti-deformation capability, high thermal conductivity and light weight, so that the housing 100 can better meet the requirements of the electronic device 1000 for lightweight and high heat dissipation, which is conducive to improving the user experience.

[0117] In some embodiments, the thickness H1 of the connection layer 20 may also be in the range of 2 microns to 30 microns. In this way, the connection layer 20 may have a relatively thick thickness, meet the bonding strength requirements between the first metal and the second metal, and have a relatively low manufacturing cost, which is conducive to large-scale production.

[0118] In some embodiments, between step S130 and step S150, step S140 may also be included: performing a solution aging heat treatment on the sintered part 70. The solution aging heat treatment may include three steps: solution treatment, water quenching, and aging. Exemplarily, when the second metal is an aluminum alloy or a particle-reinforced aluminum-based composite material, the temperature for solution treatment of the sintered part 70 may be in the range of 500°C to 550°C, and the duration may be in the range of 15 minutes to 60 minutes. Then, the sintered part 70 after the solution treatment is water quenched, and the water quenching temperature may be room temperature. After the sintered part 70 is cooled to room temperature, it is subjected to aging treatment, and the aging temperature may be in the range of 170°C to 200°C, and the duration may be in the range of 4 hours to 24 hours. For example, the sintered part 70 can be solution treated at a temperature of 520°C for 15 minutes, and then water quenched at room temperature until the temperature of the sintered part 70 is cooled to room temperature, and finally the sintered part 70 is aged at a temperature of 180°C for 8 hours. In some other embodiments, when the second metal is a magnesium alloy or a particle-reinforced magnesium-based composite material, the temperature of the solution treatment of the sintered part 70 can be in the range of 380°C to 420°C, and the duration can be in the range of 0.5 hours to 12 hours. Then, the sintered part 70 after the solution treatment is water quenched, and the water quenching temperature can be room temperature. After the sintered part 70 is cooled to room temperature, it is aged, and the aging temperature can be in the range of 180°C to 220°C, and the duration can be in the range of 1 hour to 8 hours.

[0119] It can be understood that by performing solution aging heat treatment on the formed sintered part 70, the yield strength and hardness of the second metal in the sintered part 70 (that is, the third sintered part 73 in the sintered part 70) can be effectively improved, so that the middle plate body 30 of the shell 100 formed subsequently also has higher yield strength and hardness, which is beneficial to improving the overall structural strength of the shell 100 and extending the service life of the shell 100.

[0120] In some embodiments, in step S130, the surface roughness of the inner surface of the initial frame body 50 can also be increased to increase the contact area between the initial frame body 50 and the metal powder 60, that is, to increase the contact area between the first metal and the second metal. Exemplarily, the surface roughness of the surface can be increased by mechanically grinding the inner surface of the initial frame body 50. In some embodiments, a glue-drawing structure such as a circular hole or a dovetail groove can be formed by mechanically processing the inner surface of the initial frame body 50, or a steel sheet with a glue-drawing structure can be welded on the inner surface of the initial frame body 50, so as to form a physical riveting structure on the inner surface of the initial frame body 50, thereby increasing the contact area between the initial frame body 50 and the metal powder 60.

[0121] It can be understood that by increasing the contact area between the inner surface of the initial frame body 50 and the metal powder 60 (that is, increasing the contact area between the first metal and the second metal), the bonding strength between the first metal and the second metal in the subsequently formed sintered part 70 can be effectively improved, so as to improve the bonding strength between the first sintered part 71 and the third sintered part 73 in the formed sintered part 70, which is beneficial to improving the overall structural stability of the shell 100 finally formed.

[0122] In some embodiments, in step S150, after mechanical processing of the sintered part 70, the sintered part 70 may be subjected to mechanical polishing (e.g., sandblasting, wire drawing, CD grain processing, etc.), PVD coloring, surface anti-corrosion treatment (e.g., chemical passivation, spraying, electrophoresis, anodizing, etc.), laser engraving, and assembly auxiliary materials, etc., to form the housing 100. Among them, the mechanical polishing can make the surface of the housing 100 formed subsequently smoother. The PVD coloring can be used to form an appearance surface on the outside of the sintered part 70 to improve the aesthetics of the housing 100 formed subsequently. The surface anti-corrosion treatment can be used to form an anti-corrosion layer 90 on the inside of the sintered part 70, so that the internal components of the electronic device 1000 can be effectively exposed to water or other corrosive liquids, thereby preventing the internal components of the electronic device 1000 from being corroded by the corrosive liquid and causing the internal components of the electronic device 1000 to fail. Laser engraving can be used to improve the surface energy of the sintered part 70 , thereby enhancing the bonding strength between the surface of the subsequently formed shell 100 and the glue, so as to facilitate fixing other components to the shell 100 .

[0123] In some embodiments, in step S150, Fig.16 As shown, before the sintered part 70 is machined, a plurality of intervally arranged fractures 74 may be formed in the first sintered part 71 of the sintered part 70. The plurality of fractures 74 may penetrate the first sintered part 71 and the second sintered part 72 of the sintered part 70 in the thickness direction of the sintered part 70, and penetrate the outer surface of the first sintered part 71 facing away from the second sintered part 72. Then, a non-shielding medium (such as plastic, etc.) such as plastic is filled in the plurality of fractures 74 by nano injection molding or the like. Finally, the sintered part 70 is machined to form the following. Figure 3 The housing 100 shown. At this time, the multiple fractures 74 of the sintered part 70 can be used to form multiple gaps of the housing 100. In some other embodiments, the multiple fractures 74 of the first sintered portion 71 can also only penetrate at least a portion of the first sintered portion 71 in the thickness direction of the sintered part 70.

[0124] Fig.17 and Fig.18 yes Fig.11Shown is a schematic diagram of the process of the preparation method in another embodiment.

[0125] In another embodiment, if Fig.17 As shown, in step S110, a plurality of first metal blanks may be subjected to stamping or cold drawing and bending and other forming processes to form a first initial corner 51, a second initial corner 52, a third initial corner 53 and a fourth initial corner 54. A plurality of third metal blanks may be subjected to stamping or cold drawing and bending and other forming processes to form a first initial side 55, a second initial side 56, a third initial side 57 and a fourth initial side 58. Then, the first initial corner 51, the first initial side 55, the second initial corner 52, the second initial side 56, the third initial corner 53, the third initial side 57, the fourth initial corner 54 and the fourth initial side 58 are arranged end to end in sequence (for example, spliced ​​end to end in sequence, or welded together) to form an initial frame body 50. At this time, the initial frame body 50 may include both the first metal and the third metal. The first initial corner 51, the first initial side 55, the second initial corner 52, the second initial side 56, the third initial corner 53, the third initial side 57, the fourth initial corner 54 and the fourth initial side 58 may together enclose a filling space 50a of the initial frame body 50. Subsequently, in step S120, metal powder 60 is filled into the filling space 50a of the initial frame body 50.

[0126] Then, if Fig.17 and Fig.18 As shown, in step S130, the first sintered part 71 of the sintered part 70 may include a first metal part 711 and a second metal part 712, and the second sintered part 72 of the sintered part 70 may include a first diffusion part 723 and a second diffusion part 724. The material of the first metal part 711 is the first metal. The material of the second metal part 712 is the third metal. In other words, the first metal part 711 may be formed by a part of the first initial corner 51, a part of the second initial corner 52, a part of the third initial corner 53, and a part of the fourth initial corner 54 of the initial frame body 50 through a sintering process. The second metal part 712 may be formed by a part of the first initial side 55, a part of the second initial side 56, a part of the third initial side 57, and a part of the fourth initial side 58 of the initial frame body 50 through a sintering process.

[0127] The material of the first diffusion part 723 may include the first metal and the second metal at the same time. The material of the second diffusion part 724 may include the second metal and the third metal at the same time. In other words, the first diffusion part 723 may be formed by a part of the first initial corner 51, a part of the second initial corner 52, a part of the third initial corner 53, a part of the fourth initial corner 54 and a part of the metal powder 60 through a sintering process. The second diffusion part 724 may be formed by a part of the first initial edge 55, a part of the second initial edge 56, a part of the third initial edge 57, a part of the fourth initial edge 58 and a part of the metal powder 60 through a sintering process. The remaining part of the metal powder 60 may form the third sintered part 73 of the sintered part 70 through a sintering process. At this time, the first diffusion part 723 may be located between the first metal part 711 of the first sintered part 71 and the third sintered part 73 of the sintered part 70. The first metal and the second metal in the first diffusion layer may both present different change trends along the direction perpendicular to the first initial interface 721. The second diffusion portion 724 may be located between the second metal portion 712 of the first sintered portion 71 and the third sintered portion 73 of the sintered part 70. The second metal and the third metal in the second diffusion portion 724 may both present different variation trends along a direction perpendicular to the first initial interface 721. The content of the second metal in the second diffusion portion 724 may increase along a direction close to the third sintered portion 73, and the content of the third metal may decrease along a direction close to the third sintered portion 73. It should be understood that Fig.17 Different shadow lines indicate that different parts of the sintered component 70 are made of different metal materials.

[0128] Finally, after step S150, the following Figure 3 The housing 100 shown in FIG. The first corner 11, the second corner 13, the third corner 15 and the fourth corner 17 of the housing 100 are all made of the first metal. The first side 12, the second side 14, the third side 16 and the fourth side 18 of the housing 100 are all made of the third metal.

[0129] It can be understood that in the preparation method of this embodiment, the first initial corner 51, the second initial corner 52, the third initial corner 53 and the fourth initial corner 54 including the first metal, and the first initial side 55, the second initial side 56, the third initial side 57 and the fourth initial side 58 including the third metal are formed respectively, and they are arranged end to end in sequence to form the initial frame body 50, and then the initial frame body 50 is sintered together with the metal powder 60 including the second metal, and finally the shell 100 is prepared. At this time, each corner in the frame body 10 of the shell 100 (that is, the first corner 11, the second corner 13, the third corner 15 and the fourth corner 17 of the frame body 10) are all made of the first metal, and the first metal is a shape memory alloy, and each side of the frame body 10 (that is, the first side 12, the second side 14, the third side 16 and the fourth side 18 of the frame body 10) are all made of the third metal, and the third metal is a non-shape memory alloy. In this way, the shell 100 prepared by the preparation method in this embodiment can use shape memory alloy only in the corners of the frame body 10 that are more prone to deformation, and use non-shape memory alloy with lower cost than shape memory alloy in the edges of the frame body 10 that are less prone to deformation, so that the deformation problem of the corners of the frame body 10 when falling or colliding can be effectively solved, and the manufacturing cost of the frame body 10 of the shell 100 can be greatly reduced. Secondly, the edges of the shell 100 can be made of non-shape memory alloy metal materials such as titanium alloy or stainless steel, which can effectively reduce the manufacturing cost of the shell 100 on the one hand, and improve the appearance of each edge on the other hand, which is conducive to reducing the overall manufacturing cost of the shell 100 while obtaining a shell 100 with a higher appearance.

[0130] It should be noted that, in the absence of conflict, the features in the embodiments of the present application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of the present application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0131] It should be noted that all the above drawings are illustrative illustrations of the present application and do not represent the actual size of the product. Moreover, the size ratio relationship between the components in the drawings is not intended to limit the actual product of the present application.

[0132] The above are only some implementation methods of the present application, and the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by any person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A housing (100), characterized in that: The housing (100) comprises a frame body (10), a connection layer (20) and a middle plate body (30), wherein the frame body (10) is arranged around at least a portion of the middle plate body (30), and the connection layer (20) is connected between the frame body (10) and the middle plate body (30); The frame body (10) comprises a first corner portion (11), the first corner portion (11) comprises a first metal, the first metal is a shape memory alloy, the middle plate body (30) comprises a second metal, the connection layer (20) comprises a first connection section (21) located between the first corner portion (11) and the middle plate body (30), the first connection section (21) comprises the first metal and the second metal; In the metallographic structure of the shell (100), the thickness of the first connecting section (21) is H1, wherein 0.1 micrometer ≤ H1 ≤ 30 micrometers.

2. The housing (100) according to claim 1, characterized in that: The density of the second metal is less than or equal to 3.5 grams per cubic centimeter, and / or the thermal conductivity of the second metal is greater than or equal to 50 watts per square meter per second.

3. The housing (100) according to claim 1 or 2, characterized in that: The nickel content of the first metal is in the range of 55.4% to 56.2%, or the nickel content of the first metal is 50%, the manganese content is 28%, and the gallium content is 22%; Alternatively, the second metal is an aluminum alloy, a particle-reinforced aluminum-based composite material, or a particle-reinforced magnesium-based composite material.

4. The housing (100) according to any one of claims 1 to 3, characterized in that: The content of the first metal in the first connecting section (21) decreases in the direction from the first corner (11) to the middle plate body (30), and the content of the second metal increases in the direction from the first corner (11) to the middle plate body (30).

5. The housing (100) according to any one of claims 1 to 4, characterized in that: In the metallographic structure of the shell (100), 2 micrometers ≤ H1 ≤ 30 micrometers.

6. The housing (100) according to any one of claims 1 to 5, characterized in that: A first interface (20a) is formed between the first corner portion (11) and the first connecting section (21), and a second interface (20b) is formed between the middle plate body (30) and the first connecting section (21), and the first interface (20a) and the second interface (20b) are visible in the metallographic structure of the shell (100).

7. The housing (100) according to claim 6, characterized in that: The content of the first metal in the first connecting section (21) decreases in the direction from the first interface (20a) to the second interface (20b), and the content of the second metal increases in the direction from the first interface (20a) to the second interface (20b).

8. The housing (100) according to claim 6 or 7, characterized in that: In the metallographic structure of the shell (100), the first interface (20a) is parallel to the second interface (20b).

9. The housing (100) according to any one of claims 1 to 8, characterized in that: The frame body (10) further comprises a second corner portion (13), a third corner portion (15), a fourth corner portion (17), a first side portion (12), a second side portion (14), a third side portion (16) and a fourth side portion (18), wherein the first corner portion (11), the first side portion (12), the second corner portion (13), the second side portion (14), the third corner portion (15), the third side portion (16), the fourth corner portion (17) and the fourth side portion (18) are arranged in sequence head to tail; The materials of the first corner portion (11), the second corner portion (13), the third corner portion (15) and the fourth corner portion (17) all include the first metal.

10. The housing (100) according to claim 9, characterized in that: The first edge portion (12) includes a third metal, the connection layer (20) further includes a second connection section (22) located between the first edge portion (12) and the middle plate body (30), and the second connection section (22) includes the second metal and the third metal.

11. The housing (100) according to claim 10, characterized in that: The third metal is titanium alloy or stainless steel.

12. The housing (100) according to any one of claims 1 to 11, characterized in that: The frame body (10) comprises a first slit (41) and a second slit (42) which are arranged adjacent to each other, the first slit (41) and the second slit (42) being located on different sides of the frame body (10), and the first corner portion (11) being located between the first slit (41) and the second slit (42).

13. The housing (100) according to any one of claims 1 to 12, characterized in that: A portion of the first connecting section (21) and the middle plate body (30) are both prepared from powder by a sintering process.

14. The housing (100) according to claim 13, characterized in that The first connecting section (21) is formed by diffusion of the first metal along the direction from the first corner (11) to the middle plate body (30), and diffusion of the second metal along the direction from the middle plate body (30) to the first corner (11).

15. The housing (100) according to any one of claims 1 to 14, characterized in that: The second metal is an aluminum alloy or a particle-reinforced aluminum-based composite material, and a portion of the first connecting section (21) and the middle plate body (30) are prepared from powder by a sintering process at a temperature in the range of 500°C to 660°C, a duration in the range of 2 hours to 5 hours, and a pressure greater than or equal to 100 MPa.

16. An electronic device, characterized in that: The invention comprises a housing (100) and a screen (200) according to any one of claims 1 to 15, wherein the screen (200) is mounted on the housing (100).

17. A method for preparing a housing (100) according to any one of claims 1 to 15, characterized in that: include: Preparing an initial frame body (50), wherein the initial frame body (50) comprises a first metal; Filling a filling space (50a) of the initial frame body (50) with metal powder (60), wherein the metal powder (60) comprises a second metal; Forming a sintered part (70) by sintering the initial frame body (50) and the metal powder (60); Mechanically processing the sintered part (70) to form a housing (100); Part of the initial frame body (50) is used to form the frame body (10) of the shell (100), another part of the initial frame body (50) and a part of the metal powder (60) are used to jointly form the connecting layer (20) of the shell (100), and another part of the metal powder (60) is used to form the middle plate body (30) of the shell (100).

18. The method according to claim 17, characterized in that The step of preparing the initial frame body (50) includes: preparing a first initial corner portion (51), a second initial corner portion (52), a third initial corner portion (53) and a fourth initial corner portion (54), wherein the materials of the first initial corner portion (51), the second initial corner portion (52), the third initial corner portion (53) and the fourth initial corner portion (54) are all the first metal; preparing a first initial edge portion (55), a second initial edge portion (56), a third initial edge portion (57) and a fourth initial edge portion (58), wherein the materials of the first initial edge portion (55), the second initial edge portion (56), the third initial edge portion (57) and the fourth initial edge portion (58) are all third metals; The first initial corner (51), the first initial side (55), the second initial corner (52), the second initial side (56), the third initial corner (53), the third initial side (57), the fourth initial corner (54) and the fourth initial side (58) are arranged end to end in sequence to form the initial frame body (50).

19. The preparation method according to claim 18, characterized in that: The step of forming a sintered part (70) by sintering the initial frame body (50) and the metal powder (60) through a sintering process comprises: A portion of the first initial corner portion (51), a portion of the second initial corner portion (52), a portion of the third initial corner portion (53), a portion of the fourth initial corner portion (54), and a portion of the metal powder (60) are formed into a first diffusion portion (723) of a sintered part (70) through a sintering process, wherein the material of the first diffusion portion (723) includes the first metal and the second metal; A portion of the first initial edge portion (55), a portion of the second initial edge portion (56), a portion of the third initial edge portion (57), a portion of the fourth initial edge portion (58), and a portion of the metal powder (60) are formed into a second diffusion portion (724) of a sintered part (70) through a sintering process, wherein the material of the second diffusion portion (724) includes the second metal and the third metal; The first diffusion portion (723) and the second diffusion portion (724) are used to jointly form a connection layer (20) of the shell (100).

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