Rotation water channel heat dissipation structure

Abstract

A rotary water channel heat dissipation structure comprises a heat dissipation main body bottom plate which provides support for all parts; the peripheral baffle is fixed on the bottom plate of the heat dissipation main body and forms a liquid storage space; the heat dissipation unit matrix comprises at least one heat dissipation unit group arranged in the peripheral baffle, at least one column of heat dissipation units are arranged in the heat dissipation unit group, and the interior of each heat dissipation unit is divided into S-shaped flow channels through partition baffles which are arranged in a staggered mode; the number of the buffer areas is two, the buffer areas are distributed on the two opposite side edges of the peripheral baffle, and at least one flow channel opening leading to the buffer areas is formed in the heat dissipation unit set close to the buffer areas. The rotary water channel heat dissipation structure is compact and reasonable in structure and convenient to operate, and through the beneficial effects of remarkably improving the heat dissipation efficiency, optimizing the water flow path, improving the flexibility and adaptability, enhancing the stability and durability and the like, the rotary water channel heat dissipation structure provides an effective solution for the heat dissipation problem of the silicon carbide power device.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation structures, in particular to a rotating water channel heat dissipation structure. Background Art

[0002] In the field of electric vehicles, the application of silicon carbide power devices is becoming more and more extensive, and its market is growing rapidly. With the continuous advancement of technology, the power density of silicon carbide power devices is continuously increasing, while the size is constantly shrinking. Although this trend has brought about performance improvements, it has also caused serious heat dissipation problems. Low heat dissipation efficiency has become a key factor restricting the further development of silicon carbide power devices.

[0003] The traditional water channel heat dissipation structure is unable to cope with the high power density and small volume of silicon carbide power devices. Although increasing the length of the water channel has been proven to effectively improve the heat dissipation capacity, simply extending the water channel cannot meet the growing heat dissipation needs. In addition, the traditional water channel structure often lacks flexibility and cannot be customized and optimized according to the actual application scenario, resulting in unsatisfactory heat dissipation effect.

[0004] More importantly, the prior art water channel structure, such as a serpentine passage cooling system disclosed in Chinese Patent 202080070710.5, comprises a cooling arrangement (24, 24', 24") having a serpentine passage (20) for circulating a fluid coolant. The serpentine passage (20) is arranged between a plurality of walls (6, 8) displaced from each other. In design, the optimization of the water flow path and the full utilization of the heat dissipation area are often neglected. The flow state of the water in the flow channel is not ideal, and there are phenomena such as backflow and eddy currents, which reduce the heat dissipation efficiency. At the same time, the heat dissipation area is limited, and it is impossible to fully exchange heat with the coolant, which further limits the improvement of the heat dissipation performance.

[0005] Therefore, in order to solve the heat dissipation problem of silicon carbide power devices, it is urgent to design a new water channel structure. This structure needs to be able to make full use of the water channel length and heat dissipation area, optimize the water flow path, and improve the heat dissipation efficiency. At the same time, it also needs to have sufficient flexibility to meet the needs of different application scenarios. The present invention is proposed in this context, aiming to solve the technical defects of traditional water channel structures in terms of heat dissipation efficiency, flexibility and water flow path optimization. Summary of the invention

[0006] In view of the shortcomings of the above-mentioned existing production technologies, the applicant provides a rotating water channel heat dissipation structure. The rotating water channel heat dissipation structure of the present invention provides an effective solution to the heat dissipation problem of silicon carbide power devices by significantly improving heat dissipation efficiency, optimizing water flow path, improving flexibility and adaptability, and enhancing stability and durability.

[0007] The technical solution adopted by the present invention is as follows: A rotating water channel heat dissipation structure, comprising: The heat dissipation main body bottom plate provides support for various components; A peripheral baffle, which is fixed to the bottom plate of the heat dissipation body and forms a liquid storage space; A heat dissipation unit matrix, comprising at least one heat dissipation unit group arranged in a peripheral baffle, wherein at least one column of heat dissipation units is arranged in the heat dissipation unit group, and the heat dissipation units are divided into serpentine flow channels by staggered partition baffles; There are two buffer zones distributed on two opposite sides of the peripheral baffle, and at least one flow channel opening leading to the buffer zone is arranged in the heat dissipation unit group close to the buffer zone.

[0008] Furthermore, the heat dissipation unit matrix includes one or more of structures a and b: a) a heat dissipation unit 1, which includes at least two S-shaped flow channels, and the multiple S-shaped flow channels are connected end to end to form a serpentine flow channel; b) Heat dissipation unit 2', which has only one S-shaped flow channel.

[0009] Furthermore, a water inlet is arranged in one of the buffer zones, and a water outlet is arranged in the other buffer zone.

[0010] Furthermore, when the number of the heat dissipation unit groups is greater than 2, mutually interpenetrating flow channels are provided between two adjacent heat dissipation unit groups.

[0011] Furthermore, the flow channel is provided with connection nodes separating the plurality of heat dissipation units, so that the coolant flows only in heat dissipation units in different rows.

[0012] Furthermore, the thickness of the movable end of the partition baffle is greater than the thickness of the fixed end of the partition baffle.

[0013] Furthermore, the number of the heat dissipation unit groups is one, two, three or four.

[0014] Furthermore, the heat dissipation body bottom plate, peripheral baffles and separation baffles are all made of copper.

[0015] Furthermore, the bottom plate, the peripheral baffle plate and the partition baffle plate are integrally cast. The beneficial effects of the present invention are as follows: The invention has a compact and reasonable structure and is easy to operate. The rotary water channel heat dissipation structure of the invention provides an effective solution to the heat dissipation problem of silicon carbide power devices by significantly improving heat dissipation efficiency, optimizing water flow paths, improving flexibility and adaptability, and enhancing stability and durability. This new water channel structure can not only meet the heat dissipation requirements under high power density and small volume conditions, but also improve the overall performance and service life of electric vehicles, and has broad application prospects and market value.

[0016] At the same time, the present invention also has the following advantages: The present invention effectively increases the water flow path and heat dissipation area by designing a rotating water channel heat dissipation structure. The design of the rotating water channel enables the coolant to fully exchange heat with the bottom plate of the heat dissipation body and the partition baffle during the flow process, thereby taking away more heat. Compared with the traditional water channel structure, the heat dissipation efficiency of the present invention is significantly improved, and can better meet the heat dissipation requirements of silicon carbide power devices under high power density and small volume conditions. This improvement not only helps to extend the service life of the power device, but also improves the overall performance of the electric vehicle. The present invention sets a partition baffle and a buffer zone in the rotating water channel heat dissipation structure, and divides the heat dissipation unit into a serpentine flow channel by staggered arrangement of the partition baffles, thereby increasing the complexity of the water flow path. At the same time, the design of the buffer zone ensures the unidirectional flow of the water flow and avoids the occurrence of the backflow phenomenon. This optimized water flow path allows the coolant to be fully mixed in the flow channel, improves the heat dissipation effect, and also reduces the impact of the water flow impact on the structure, enhancing the stability and service life of the structure. The rotating water channel heat dissipation structure of the present invention has high flexibility in design and can be customized and optimized according to the needs of actual application scenarios. By adjusting the number and number of columns of the heat dissipation unit groups in the heat dissipation unit matrix, and using heat dissipation units of different shapes (such as heat dissipation unit one and heat dissipation unit two), a combination of different heat dissipation effects can be achieved. This flexibility enables the present invention to better adapt to silicon carbide power devices of different power densities and volumes, and meet diverse heat dissipation needs. The rotary waterway heat dissipation structure of the present invention adopts an integrated casting design, and the base plate, peripheral baffles and partition baffles are all made of copper or other high-quality metal materials to ensure the stability and durability of the structure. At the same time, by optimizing the thickness design of the partition baffle, the stability of the partition baffle is enhanced, the passing efficiency of the water flow is delayed, and the heat dissipation effect is further improved. This improvement in stability and durability helps to extend the service life of the heat dissipation structure and reduce maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 It is a structural schematic diagram of the present invention.

[0017] Figure 2 This is a schematic diagram of the heat dissipation structure of the rotating water channel in Example 2 of the present invention.

[0018] Figure 3 This is a schematic diagram of the heat dissipation structure of the rotating water channel in Example 3 of the present invention.

[0019] Figure 4 This is a schematic diagram of the heat dissipation structure of the rotating water channel in Example 4 of the present invention.

[0020] Figure 5 This is a schematic diagram of the heat dissipation structure of the rotating water channel in Example 5 of the present invention.

[0021] Figure 6 This is a schematic diagram of the heat dissipation structure of the rotating water channel in Example 6 of the present invention.

[0022] Figure 7 This is a table for collecting various parameters of the existing waterway structure in operation in Embodiment 2, Embodiment 5 and Embodiment 6 of the present invention and the background technology.

[0023] in: 1. Heat dissipation main body bottom plate; 2. Peripheral baffle; 3. Partition baffle; 4. Heat dissipation unit 1; 4', heat dissipation unit 2; 5. Buffer zone; 6. Connection node. DETAILED DESCRIPTION

[0024] The specific implementation of the present invention will be described below in conjunction with the accompanying drawings.

[0025] Example 1 The present invention relates to a rotating water channel heat dissipation structure, which is particularly suitable for silicon carbide power devices in electric vehicles, and is intended to improve the heat dissipation capacity and reduce the heating temperature of the chip. The rotating water channel heat dissipation structure of this embodiment mainly includes the following components: Specifically, Figure 1-Figure 6 As shown, the heat dissipation main body bottom plate 1 in this embodiment, as a supporting component of the entire heat dissipation structure, is made of copper, which has good thermal conductivity.

[0026] like Figure 1-Figure 6 As shown, the peripheral baffle 2 in this embodiment is fixed on the bottom plate 1 of the heat dissipation body to form a closed liquid storage space to prevent liquid leakage.

[0027] The partition baffles 3 are staggeredly arranged in the heat dissipation unit to divide the heat dissipation unit into serpentine flow channels, increase the water flow path, and improve the heat dissipation effect. The partition baffles 3 are designed.

[0028] There are two buffer zones 5, which are distributed on opposite sides of the peripheral baffle 2 and are used to buffer and distribute water flow, wherein a water inlet is provided in one buffer zone 5 and a water outlet is provided in the other buffer zone 5. This design ensures the unidirectional flow of water flow, avoids the backflow phenomenon, and improves the heat dissipation efficiency.

[0029] The heat dissipation unit matrix includes at least one heat dissipation unit group arranged in the peripheral baffle 2. In this embodiment, the heat dissipation unit group refers to a combination of multiple heat dissipation units arranged in a horizontal row as shown in the figure, and at least one column of heat dissipation units is arranged in the heat dissipation unit group.

[0030] At the same time, in order to improve the overall stability, the bottom plate 1, the peripheral baffle 2 and the partition baffle 3 are cast as one piece, and are all made of copper. In actual use, they can also be replaced with other metal materials with better heat dissipation effects.

[0031] In this embodiment, the heat dissipation unit matrix includes a heat dissipation unit 1 4, which includes at least two S-shaped flow channels, and the multiple S-shaped flow channels are connected end to end to form a serpentine flow channel.

[0032] The heat dissipation unit matrix includes one or more structures of a and b: a) heat dissipation unit 1 4, which includes at least two S-shaped flow channels, and multiple S-shaped flow channels are connected end to end to form a serpentine flow channel; b) heat dissipation unit 2 4', which has only one S-shaped flow channel.

[0033] When working, the coolant enters the buffer zone 5 from the water inlet, and then flows through the serpentine flow channel of the heat dissipation unit 4. During the flow process, the liquid fully exchanges heat with the heat dissipation body bottom plate 1 and the partition baffle 3 to take away the heat. Finally, the coolant flows out from the water outlet, completing the entire heat dissipation process.

[0034] Example 2 like Figure 1 and Figure 2 As shown, the difference between this embodiment and embodiment 1 is that the heat dissipation unit matrix in this embodiment includes a heat dissipation unit group, and 2 or 3 columns of heat dissipation units are arranged in the heat dissipation unit group. The heat dissipation unit matrix in this embodiment is composed of a structure of heat dissipation units 1 to 4. At the same time, due to the same space, the length of the heat dissipation unit in this embodiment is longer, and as the number of columns increases, the number of S-bends in the heat dissipation unit 1 to 4 decreases successively.

[0035] In this embodiment, the water flow channel of the rotating water channel performs multiple reverse flows along the water flow direction, so that the water flow is fully mixed in the flow channel, thereby improving the heat dissipation effect.

[0036] The rotating water channel heat dissipation structure of this embodiment improves the heat dissipation effect and reduces the heating temperature of the chip by increasing the water flow path and reverse design. At the same time, the design of the buffer zone 5 makes the water flow more stable, reduces the impact of water flow impact on the structure, and improves the stability and service life of the structure.

[0037] Example 3 like Figure 3As shown, based on Example 1, this embodiment improves the heat dissipation unit matrix and increases the number of heat dissipation unit groups. The heat dissipation unit matrix in this embodiment includes two heat dissipation unit groups, and three columns of heat dissipation units are arranged in each heat dissipation unit group. The heat dissipation unit matrix in this embodiment is also composed of a heat dissipation unit 4 structure. At the same time, due to the same space, the length of the heat dissipation unit in this embodiment is shorter, and as the number of columns increases, the number of S-bends in the heat dissipation unit 4 decreases successively.

[0038] In this embodiment, mutually intercommunication flow channels are opened between two adjacent heat dissipation unit groups. This design allows the coolant to flow not only within the heat dissipation unit groups in the same row, but also between the heat dissipation unit groups in different rows, thereby increasing the flexibility of the water flow and improving the heat dissipation effect.

[0039] During operation, the coolant enters the buffer zone 5 from the water inlet, and then flows through the serpentine flow channels of each heat dissipation unit group in turn. During the flow process, the liquid fully exchanges heat with the heat dissipation body bottom plate 1 and the partition baffle 3. Since there are through flow channels between adjacent heat dissipation unit groups, the coolant can flow freely in the heat dissipation unit groups in different rows, achieving uniform distribution and rapid heat dissipation. Finally, the coolant flows out from the water outlet, completing the entire heat dissipation process.

[0040] Example 4 like Figure 4 As shown, in this embodiment, based on the embodiment 3, a mutually interpenetrating flow channel is provided between two adjacent heat dissipation unit groups, and a connection node 6 is provided on the interpenetrating flow channel to separate the multiple heat dissipation units. In this embodiment 5, the design of the connection node 6 enables the coolant to flow only in heat dissipation units in different rows, thereby avoiding interference between heat dissipation units in the same row and improving the uniformity of heat dissipation.

[0041] In this embodiment, connection nodes 6 are set at certain positions of the rotating water channel, so that the coolant must bypass the connection nodes 6 to continue to flow during the flow process. This makes the coolant flow more orderly, avoids interference between the heat dissipation units in the same row, and further improves the heat dissipation effect. This design increases the turbulence of the water flow and the heat dissipation area, thereby improving the heat dissipation effect.

[0042] The shape and position of the connection node 6 are determined according to the simulated heat dissipation effect. In this embodiment, the connection node 6 is rectangular and is arranged at the corner of the rotating waterway or in an area with a slow water flow to maximize the heat dissipation effect.

[0043] The heat dissipation structure of the rotating water channel of this embodiment further improves the heat dissipation effect by adding a connection node 6 to realize a design mode of forced flow. The setting of the baffle increases the turbulence degree and heat dissipation area of ​​the water flow, so that the heat can be dissipated faster. At the same time, this design also enhances the stability and service life of the structure.

[0044] Example 5 like Figure 5 As shown, the heat dissipation unit matrix in this embodiment includes 4 heat dissipation unit groups, and multiple columns of heat dissipation units are arranged in the heat dissipation unit groups. The heat dissipation unit matrix in this embodiment is composed of a heat dissipation unit 2 4' structure. At the same time, in this embodiment, the thickness of the movable end of the partition baffle 3 (that is, the end of the partition baffle 3 that is not connected) is greater than the thickness of the fixed end of the partition baffle 3 (that is, the end of the partition baffle 3 connected to other structures). This design enhances the stability of the partition baffle 3, while delaying the passing efficiency of the water flow and improving the heat dissipation effect.

[0045] At the same time, the different designs of the number of rotations and the number of water inlets in each row of the rotating water channel in this embodiment make the heat dissipation more flexible and efficient.

[0046] During operation, the coolant enters the buffer zone 5 from the water inlet, and flows through the S-shaped flow channels of each rotating waterway in turn according to the heat dissipation unit matrix composed of multiple heat dissipation units 2 4'. During the flow process, the liquid fully exchanges heat with the heat dissipation body bottom plate 1 and the partition baffle 3. The coolant constantly changes direction during the flow process, increasing the contact time with the heat dissipation surface and the heat dissipation area. Finally, the coolant flows out from the water outlet, completing the entire heat dissipation process.

[0047] Example 6 like Figure 6 As shown, this embodiment combines the advantages of the previous embodiments, and this embodiment combines the solutions of embodiment 3 and embodiment 5; The heat dissipation unit matrix includes three heat dissipation unit groups, and at least three columns of heat dissipation units are arranged in the heat dissipation unit group.

[0048] At the same time, the heat dissipation unit matrix in this embodiment includes the combined use of the heat dissipation unit 1 4 and the heat dissipation unit 2 4 ′, which makes the heat dissipation more flexible and efficient.

[0049] By adopting the serial arrangement of the heat dissipation units 4', the rotary water channel adopts a serial arrangement design of multiple rows, and each row is separated by a gap 4. This design increases the path length and heat dissipation area of ​​the water flow.

[0050] This embodiment combines the advantages of the previous embodiments and comprehensively optimizes the heat dissipation structure of the rotary water channel. By adopting an optimized heat dissipation unit matrix, higher heat dissipation efficiency and lower temperature rise are achieved. At the same time, the use of advanced precision casting technology and high-quality aluminum alloy materials ensures the performance and reliability of the heat dissipation structure.

[0051] In summary, the various rotating water channel heat dissipation structures of the present invention have many beneficial effects such as significantly improving heat dissipation efficiency, optimizing water flow paths, improving flexibility and adaptability, and enhancing stability and durability. Figure 7 As shown, the heat dissipation structures of each embodiment are applied to the heat dissipation of the chip. Compared with the prior art mentioned in the background technology, the maximum temperature of the chip in each embodiment is reduced, and the water outlet temperature and temperature difference are also reduced. In Example 2, the maximum temperature of the chip is the lowest, indicating that it can provide a better heat dissipation effect; It provides an effective solution to the heat dissipation problem of silicon carbide power devices. This new water channel structure can not only meet the heat dissipation requirements under high power density and small volume conditions, but also improve the overall performance and service life of electric vehicles, and has broad application prospects and market value.

[0052] The above description is an explanation of the present invention, not a limitation of the present invention. The scope of the present invention is defined in the claims. Any form of modification may be made within the scope of protection of the present invention.

Claims

1. A rotating water channel heat dissipation structure, characterized in that: include: The heat dissipation body bottom plate (1) provides support for various components; A peripheral baffle (2) fixed on the heat dissipation body bottom plate (1) and forming a liquid storage space; A heat dissipation unit matrix, comprising at least one heat dissipation unit group arranged in a peripheral baffle (2), wherein at least one row of heat dissipation units is arranged in the heat dissipation unit group, and the heat dissipation units are divided into serpentine flow channels by staggered partition baffles (3); There are two buffer zones (5) distributed on two opposite sides of the peripheral baffle (2), and at least one flow channel opening leading to the buffer zone (5) is provided in the heat dissipation unit group close to the buffer zone (5).

2. A rotating water channel heat dissipation structure according to claim 1, characterized in that: The heat dissipation unit matrix includes one or more structures of a and b: a) heat dissipation unit one (4), which includes at least two S-shaped flow channels, and multiple S-shaped flow channels are connected end to end to form a serpentine flow channel; b) heat dissipation unit two (4)', which has only one S-shaped flow channel.

3. A rotating water channel heat dissipation structure according to claim 1, characterized in that: A water inlet is provided in one of the buffer zones (5), and a water outlet is provided in the other buffer zone (5).

4. A rotating water channel heat dissipation structure according to claim 1, characterized in that: When the number of the heat dissipation unit groups is greater than 2, mutually interpenetrating flow channels are provided between two adjacent heat dissipation unit groups.

5. A rotating water channel heat dissipation structure as claimed in claim 4, characterized in that: The flow channel is provided with connection nodes (6) for separating the plurality of heat dissipation units, thereby achieving that the coolant flows only in heat dissipation units in different rows.

6. A rotating water channel heat dissipation structure according to claim 1, characterized in that: The thickness of the movable end of the partition baffle (3) is greater than the thickness of the fixed end.

7. A rotating water channel heat dissipation structure according to claim 1, characterized in that: The number of the heat dissipation unit groups is one, two, three or four.

8. The rotating water channel heat dissipation structure according to claim 1, characterized in that: The heat dissipation body bottom plate (1), the peripheral baffle plate (2) and the partition baffle plate (3) are all made of copper.

9. The rotating water channel heat dissipation structure according to claim 1, characterized in that: The bottom plate (1), the peripheral baffle plate (2) and the partition baffle plate (3) are integrally cast.

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