Display panel and display device

By setting the first conductive layer under the semiconductor layer and protecting the multi-layer film, the problem of corrosion of conductive lines in the display panel connection area is solved, and the quality and reliability of the panel are improved.

CN119212456APending Publication Date: 2024-12-27HEFEI VISIONOX TECH CO LTD
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Patent Information

Application Number
CN202411260388.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-09
Publication Date
2024-12-27

AI Technical Summary

Technical Problem

The conductive wires of the existing display panels in the connection area are susceptible to corrosion, resulting in a decrease in mass and an increased risk of damage.

Method used

The first conductive layer is arranged under the semiconductor layer, and is protected by a multi-layer film to reduce the probability of corrosion, and reduce the transmission impedance and heat accumulation through the design of the conductive lines.

Benefits of technology

It effectively reduces the corrosion risk of conductive wires, improves the quality and reliability of the display panel, and reduces the probability of damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a display panel and a display device, the display panel comprises a display area, a bending area located on one side of the display area and a connecting area connecting the display area and the bending area, and the display panel comprises a substrate; the first conducting layer is arranged on one side of the substrate and comprises a first wire located in the connecting area; the semiconductor layer is arranged on one side, deviating from the substrate, of the first conductive layer; the at least one pixel driving circuit is arranged on one side of the substrate and located in the display area, the pixel driving circuit is electrically connected with the first wire, the pixel driving circuit comprises a thin film transistor, and the thin film transistor comprises an active layer formed in the semiconductor layer; the light-emitting layer is arranged on the side, away from the substrate, of the thin film transistor and comprises at least one light-emitting element located in the display area, and the pixel driving circuit is electrically connected with the light-emitting element. According to the display panel provided by the invention, the quality of the display panel can be ensured.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development and popularization of display technology in recent years, display panels have been applied to various electronic devices, such as mobile phones, tablet computers or other portable electronic devices.

[0003] However, the inventors of the present application have discovered that the quality of current display panels needs to be further improved. Summary of the invention

[0004] The present application provides a display panel and a display device, which can ensure the quality of the display panel.

[0005] According to a first aspect of an embodiment of the present application, there is provided a display panel, comprising a display area, a bending area located on one side of the display area, and a connection area connecting the display area and the bending area, wherein the display panel comprises: a substrate; a first conductive layer, arranged on one side of the substrate, comprising a first conductive line located in the connection area; a semiconductor layer, arranged on a side of the first conductive layer away from the substrate; at least one pixel driving circuit, arranged on one side of the substrate and located in the display area, the pixel driving circuit being electrically connected to the first conductive line, and the pixel driving circuit comprising a thin film transistor, the thin film transistor comprising an active layer formed in the semiconductor layer; a light emitting layer, arranged on a side of the thin film transistor away from the substrate, comprising at least one light emitting element located in the display area, the pixel driving circuit being electrically connected to the light emitting element.

[0006] A second aspect of an embodiment of the present application provides a display device, comprising the display panel of any one of the above items.

[0007] The beneficial effect is: the present application takes into account that the first conductive layer usually has no wiring purpose in the connection area and the first conductive layer is located under the semiconductor layer and is protected by multiple film layers. Therefore, compared with the film layer above the semiconductor layer, the probability of the first conductive layer being corroded is small. Therefore, the present application uses the first conductive layer under the semiconductor layer to set the first conductive line located in the connection area, which can reduce the probability of the first conductive line being corroded, thereby ensuring the quality of the display panel and reducing the risk of damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0009] Figure 1 is a schematic top view of an embodiment of a display panel of the present application;

[0010] Figure 2 yes Figure 1 A schematic cross-sectional view of a display panel along a section line AA' in an application scenario;

[0011] Figure 3 yes Figure 1 A schematic cross-sectional view of the display panel along the section line AA' in another application scenario;

[0012] Figure 4 yes Figure 1 A schematic cross-sectional view of a display panel along a section line BB' in an application scenario;

[0013] Figure 5 It is a schematic structural diagram of an embodiment of a display device of the present application. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0015] It should be noted that the terms "first" and "second" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0016] See also Figure 1The display panel 100 includes a display area 10, a bending area 30 located on one side of the display area 10, and a connection area 20 connecting the display area 10 and the bending area 30. The display area 10 is used to display images, and the bending area 30 is used to bend, so as to bend at least part of the non-display part of the display panel 100 to the back side to achieve a narrow frame of the display panel 100. The connection area 20 is located between the display area 10 and the bending area 30.

[0017] Combined with Figure 2 The display panel 100 includes a substrate 110 , a first conductive layer 120 , a semiconductor layer 311 , a pixel driving circuit 131 and a light emitting layer 140 .

[0018] The substrate 110 plays a supporting role in the display panel 100. It can be a flexible substrate or a rigid substrate. When the substrate 110 is a flexible substrate, its material can be polyimide (PI), or it can also be a multilayer structure in which organic layers and inorganic layers are alternately stacked. For example, the substrate 110 includes an inorganic layer, an organic layer, and an inorganic layer stacked in sequence. At this time, the multilayer structure in which the organic layer and the inorganic layer are alternately stacked can take into account the flexibility and strength of the substrate 110, so that the display panel 100 has a bendable function and can resist fracture and deformation; when the substrate 110 is a rigid substrate, its material can be glass or metal. The present application does not limit the structure of the substrate 110.

[0019] The first conductive layer 120 is disposed on one side of the substrate 110, and includes an electrostatic protection member 121 located in the display area 10 and a first wire 122 located in the connection area 20. Specifically, the first conductive layer 120 is made of conductive material, and the electrostatic protection member 121 is used to protect static electricity to prevent static electricity from damaging the display panel 100.

[0020] The semiconductor layer 311 is disposed on a side of the first conductive layer 120 facing away from the substrate 110 .

[0021] At least one pixel driving circuit 131 is disposed on one side of the substrate 110 and located in the display area 10 . The pixel driving circuit 131 includes a thin film transistor 1311 . The thin film transistor 1311 includes an active layer formed in the semiconductor layer 311 .

[0022] The light-emitting layer 140 is arranged on the side of the thin film transistor 1311 away from the substrate 110, and includes at least one light-emitting element 141 located in the display area 10. The pixel driving circuit 131 is electrically connected to the light-emitting element 141, so as to drive the light-emitting element 141 to emit light. The pixel driving circuit 131 can be, for example, a 7T1C structure. There may be no other film layer between the first conductive layer 120 and the semiconductor layer 311, and there may also be an organic film layer, such as a silicon nitride film layer, a silicon oxide film layer, and the like.

[0023] In this embodiment, the pixel driving circuit 131 is electrically connected to the first wire 122 , so that the signal on the driving element can be transmitted to the pixel driving circuit 131 through the first wire 122 , thereby driving the light emitting element 141 to emit light.

[0024] In the related art, the film layer above the semiconductor layer 311 is usually used to set the wires in the connection area 20. However, due to the existence of boundaries of various film layers and various types of routing in the connection area 20, the connection area 20 is prone to produce greater stress, which can easily cause problems such as line top view and aluminum migration, which can easily cause problems such as film peeling and halo.

[0025] However, in the present application, considering that the first conductive layer 120 usually has no wiring purpose in the connection area 20 and the first conductive layer 120 is located under the semiconductor layer 311, the first conductive layer 120 is protected by multiple film layers. Therefore, compared with the conductive film layer above the semiconductor layer 311, the probability of the first conductive layer 120 being corroded is small. Therefore, the present application uses the first conductive layer 120 under the semiconductor layer 311 to set the first conductive wire 122 located in the connection area 20, which can reduce the probability of the first conductive wire 122 being corroded, thereby ensuring the quality of the display panel 100 and reducing the risk of damage.

[0026] It should be noted that, in other embodiments, the first conductive layer 120 may also only include the first conductive wires 122 located in the connection area 20 , but not include the electrostatic protection member 121 located in the display area 10 .

[0027] In one embodiment, the orthographic projection of the electrostatic protection element 121 on the substrate 110 at least partially overlaps with the orthographic projection of the pixel driving circuit 131 on the substrate 110. In one application scenario, the pixel driving circuit 131 includes a thin film transistor 1311, and the orthographic projection of the electrostatic protection element 121 on the substrate 110 covers the orthographic projection of the thin film transistor 1311 on the substrate 110.

[0028] In one embodiment, the first wire 122 includes at least one of a reset voltage line, a first power line, and a second power line, the reset voltage line is used to transmit a Vref signal (reset signal), the first power line is used to transmit a first power signal, and the second power line is used to transmit a second power signal, wherein the first power signal may be specifically an ELVSS signal, and the second power signal may be specifically an ELVDD signal. Among them, the reset voltage line may be set using only the first conductive layer 120, that is, the first wire 122 only includes the reset voltage line, and the first power line and the second power line are still set using the conductive film layer on the semiconductor layer 311, or the first power line may be set using only the first conductive layer 120, that is, the first wire 122 only includes the first power line, and the reset voltage line and the second power line are still set using the conductive film layer on the semiconductor layer 311, or the reset voltage line, the first power line, and the second power line may be set using the first conductive layer 120 at the same time, and the first wire 122 includes the reset voltage line, the first power line, and the second power line at the same time. Of course, in other embodiments, the first wire 122 may also be other types of wires, which are not limited in this application.

[0029] In one embodiment, in order to reduce the resistance of the first wire 122, avoid heating of the first wire 122, and reduce the adverse effect of heat on stress concentration, the width of the first wire 122 is set to be greater than or equal to 150 microns, for example, the width of the first wire 122 is equal to 150 microns, 160 microns or 170 microns, etc. It should be noted that the present application does not impose any specific restrictions on the width of the first wire 122, and it can be set according to actual needs.

[0030] In one embodiment, the electrostatic protection member 121 is made of the same material as the first conductive line 122. For example, the materials of the protection member 121 and the first conductive line 122 both include molybdenum, or the materials of the protection member 121 and the first conductive line 122 both include a titanium layer, an aluminum layer, and a titanium layer stacked in sequence in a direction away from the substrate 110.

[0031] In another embodiment, the electrostatic shield 121 and the first wire 122 are made of different materials. For example, in one application scenario, the material of the electrostatic shield 121 includes molybdenum, and the first wire 122 includes a titanium layer, an aluminum layer, and a titanium layer stacked in sequence in a direction away from the substrate 110. Compared with the first wire 122 including molybdenum, the first wire 122 including a titanium layer, an aluminum layer, and a titanium layer stacked in sequence in a direction away from the substrate 110 can reduce the transmission impedance of the first wire 122. In other application scenarios, the material of the first wire 122 includes molybdenum, and the electrostatic shield 121 includes a titanium layer, an aluminum layer, and a titanium layer stacked in sequence in a direction away from the substrate 110.

[0032] Continue reading Figure 2The display panel 100 further includes a circuit layer 32 disposed on a side of the semiconductor layer 311 away from the substrate 110 , and the circuit layer 32 is used to set various wires.

[0033] The circuit layer 32 includes a second wire 321, which is located in the display area 10 and electrically connected to the pixel driving circuit 131. The second wire 321 is further electrically connected to the first wire 122. Specifically, the circuit layer 32 is used to lay wires. Compared with the first wire 122 transmitting signals in the display area 10, the signal on the first wire 122 is routed to the second wire 321 in the display area 10, which can reduce the difficulty of wiring and avoid short circuit between the electrostatic protection element 121 and the first wire 122 in the display area 10.

[0034] In order to reduce the transmission impedance, the second wire 321 includes a titanium layer, an aluminum layer and a titanium layer stacked in sequence in a direction away from the substrate 110. Of course, other materials can also be used to prepare the second wire 321, which is not limited here.

[0035] Continue reading Figure 2 The display panel 100 further includes a first insulating layer 312, a second conductive layer 313, a second insulating layer 314, a third conductive layer 315, a third insulating layer 316, a fourth conductive layer 317, and a fourth insulating layer 318 arranged on the side of the circuit layer 32 close to the substrate 110, and the semiconductor layer 311, the first insulating layer 312, the second conductive layer 313, the second insulating layer 314, the third conductive layer 315, the third insulating layer 316, the fourth conductive layer 317, and the fourth insulating layer 318 are stacked in sequence in a direction away from the substrate 100.

[0036] The thin film transistor 1311 includes, in addition to the active layer formed in the semiconductor layer 311, a gate formed in the second conductive layer 313, a source formed in the fourth conductive layer 314 and connected to the source region of the active layer, and a drain formed in the fourth conductive layer 314 and connected to the drain region of the active layer. At the same time, the pixel driving circuit 131 also includes a capacitor 1312, which includes a first plate formed in the second conductive layer 313 and a second plate formed in the third conductive layer 315.

[0037] The materials of the first insulating layer 312, the second insulating layer 314, the third insulating layer 316, and the fourth insulating layer 318 include at least one of an inorganic material and an organic material. The inorganic material includes at least one of silicon nitride and silicon oxide. The organic material includes at least one of polyimide (PI), polycarbonate (PC), polyether sulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), or fiberglass reinforced plastic (FRP).

[0038] In one application scenario, the materials of the first insulating layer 312, the second insulating layer 314, and the third insulating layer 316 include inorganic materials, and the material of the fourth insulating layer 318 includes organic materials. In this case, the fourth insulating layer 318 can be used as a planarization layer to play a planarization role. The present application does not limit the materials of the first insulating layer 312, the second insulating layer 314, the third insulating layer 316, and the fourth insulating layer 318, as long as they are insulating.

[0039] In one embodiment, the material of the second conductive layer 313 includes molybdenum, and the third conductive layer 315 and the fourth conductive layer 317 include a titanium layer, an aluminum layer, and a titanium layer stacked in sequence in a direction away from the substrate 110 .

[0040] In one implementation, data lines may be further disposed in the second conductive layer 313 and the third conductive layer 315 .

[0041] Continue reading Figure 2 In one embodiment, the circuit layer 32 further includes a third wire 323 located in the bending area 30, and the third wire 323 is electrically connected to the first wire 122, that is, in the bending area 30, the signal transmitted by the first wire 122 is switched to the third wire 323, so that part of the film layer located below the circuit layer 32 in the bending area 30 can be removed, thereby reducing the thickness of the display panel 100 in the bending area 30 and ensuring that the bending area 30 can bend.

[0042] See also Figure 3 In another embodiment, the display panel 100 further includes a fourth wire 324 located in the connection area 20, wherein the fourth wire 324 is connected in parallel with the first wire 122, that is, double wiring is used for signal transmission at this time, which can reduce the transmission impedance and reduce the heating of the wiring, thereby reducing the adverse effect of heat on stress concentration.

[0043] In one embodiment, the fourth conductor 324 is formed in the circuit layer 32; in another embodiment, the fourth conductor 324 is formed in the fourth conductive layer 317, or, the number of the fourth conductors 324 is two, one is formed in the circuit layer 32, and the other is formed in the fourth conductive layer 317. In this case, three lines are connected in parallel to further reduce the impedance of signal transmission.

[0044] It should be noted that in other areas, such as the display area 10 and the bending area 30, multiple wires may be provided and connected in parallel to transmit signals through multiple lines, thereby reducing transmission impedance and reducing heating of the lines.

[0045] Continue reading Figure 2 and Figure 3The display panel 100 further includes a fifth insulating layer 150 located between the thin film transistor 1311 and the light emitting layer 140, which has a planarization function. The material of the fifth insulating layer 150 includes at least one of an organic material and an inorganic material. In one embodiment, the material of the fifth insulating layer 150 includes an organic material. In one embodiment, in order to reduce the manufacturing cost and improve the manufacturing efficiency, the fourth insulating layer and the fifth insulating layer 150 are made of the same material. Figure 1 as well as Figure 4 The display panel 100 further includes an encapsulation layer 160 , which is located on the side of the light-emitting layer 140 away from the substrate 110 , wherein the orthographic projections of the fifth insulating layer 150 and the light-emitting layer 140 on the substrate 110 are located within the orthographic projection of the encapsulation layer 160 on the substrate 110 .

[0046] Specifically, the encapsulation layer 160 plays a protective role to prevent external water vapor from invading the interior of the display panel 100. In order to improve the protective effect, the encapsulation layer 160 extends beyond the fifth insulating layer 150 and the light-emitting layer 140, that is, the orthographic projection of the encapsulation layer 160 on the substrate 110 not only covers the orthographic projection of the fifth insulating layer 150 and the light-emitting layer 140 on the substrate 110, but also further extends beyond the orthographic projection of the fifth insulating layer 150 and the light-emitting layer 140 on the substrate 110.

[0047] In one embodiment, if Figure 4 As shown, the edges of the encapsulation layer 160 and the fifth insulating layer 150 are both located in the connection region 20. In other embodiments, the edges of the encapsulation layer 160 and the fifth insulating layer 150 may also be located in the bending region 30.

[0048] In one embodiment, the encapsulation layer 160 is a thin film encapsulation layer, which includes a first inorganic layer 161, an organic layer 162, and a second inorganic layer 163 stacked in sequence in a direction away from the substrate 110, that is, compared with the organic layer 162 and the second inorganic layer 163, the first inorganic layer 161 is closer to the substrate 110. The materials of the first inorganic layer 161 and the second inorganic layer 163 can be the same or different, without limitation.

[0049] Continue reading Figure 4 In one embodiment, the first inorganic layer 161 extends outside the fifth insulating layer 150 to reduce the stress pulling of the boundary of the first inorganic layer 161 on the boundary of the fifth insulating layer 150, so that the stress pulling is reduced to a safe range to avoid the problem of metal corrosion. At the same time, the second inorganic layer 163 is also arranged to extend outside the first inorganic layer 161 to further prevent the invasion of external water vapor.

[0050] Continue reading Figure 4In one embodiment, the width W of the first inorganic layer 161 extending outside the fifth insulating layer 150 is greater than a first width threshold, wherein the first width threshold ranges from 60 microns to 80 microns, for example, the first width threshold is 60 microns, 70 microns or 80 microns, and can be set according to actual needs. For example, in an application scenario, when the size of the display area AA is 27.9 cm*18.6 cm, the width W of the first inorganic layer 161 extending outside the fifth insulating layer 150 is greater than or equal to 80 microns.

[0051] The display panel 100 in the present application can be a medium or large-sized display panel, such as can be used in a tablet computer or a desktop computer, or it can be a small-sized display panel, such as can be used in a mobile phone, wearable device, etc. The present application does not limit the size of the display panel.

[0052] Continue reading Figure 2 and Figure 3 , the display panel 100 also includes a pixel defining layer 180, which is located on the side of the fifth insulating layer 150 away from the substrate 110, wherein the pixel defining layer 180 is provided with a pixel opening, and at least part of the light-emitting layer 140 is located in the pixel opening. Specifically, the pixel defining layer 180 is used to define the position of the light-emitting element 140 to avoid the phenomenon of light crosstalk between two adjacent light-emitting elements 140. The pixel defining layer 180 can be formed of an organic material such as polyimide (PI), polyamide, benzocyclobutene (BCB), acrylic resin or phenolic resin, or formed of an inorganic material such as SiNx. The present application does not limit the material of the pixel defining layer 180.

[0053] See also Figure 5 The present application also includes a display device, the display device 400 includes a display panel 410, and the display panel 410 can be the display panel 100 in any of the above-mentioned embodiments. Its specific structure can be found in the above-mentioned related content and will not be repeated here.

[0054] The display device 400 may be any device such as a mobile phone, a computer, a television, etc., and is not limited here.

[0055] The above description is only an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area, a bending area located at one side of the display area, and a connecting area connecting the display area and the bending area. The display panel includes: substrate; A first conductive layer, disposed on one side of the substrate, comprising a first conductive wire located in the connection area; a semiconductor layer, disposed on a side of the first conductive layer away from the substrate; At least one pixel driving circuit is disposed on one side of the substrate and located in the display area, the pixel driving circuit is electrically connected to the first wire, and the pixel driving circuit includes a thin film transistor, and the thin film transistor includes an active layer formed in the semiconductor layer; The light-emitting layer is arranged on the side of the thin film transistor away from the substrate, and includes at least one light-emitting element located in the display area. The pixel driving circuit is electrically connected to the light-emitting element.

2. The display panel according to claim 1, characterized in that: The first conductive line includes at least one of a reset voltage line, a first power line, and a second power line, the reset voltage line is used to transmit a reset signal, the first power line is used to transmit a first power signal, and the second power line is used to transmit a second power signal; Preferably, the width of the first conductive line is greater than or equal to 150 micrometers.

3. The display panel according to claim 1, characterized in that: The first conductive layer further includes an electrostatic protection member located in the display area; Preferably, an orthographic projection of the electrostatic protection element on the substrate at least partially overlaps with an orthographic projection of the pixel driving circuit on the substrate.

4. The display panel according to claim 3, characterized in that: The electrostatic protection element is made of the same material as the first conductive wire; Preferably, the electrostatic protection element and the first conductive wire are both made of molybdenum.

5. The display panel according to claim 1, characterized in that: The display panel further includes a circuit layer disposed on a side of the semiconductor layer away from the substrate, the circuit layer includes a second wire electrically connected to the pixel driving circuit and located in the display area, and the first wire is electrically connected to the second wire; Preferably, the second conductive line comprises a titanium layer, an aluminum layer and a titanium layer which are sequentially stacked in a direction away from the substrate.

6. The display panel according to claim 5, characterized in that: The display panel further includes a first insulating layer, a second conductive layer, a second insulating layer, a third conductive layer, a third insulating layer, a fourth conductive layer, and a fourth insulating layer arranged on a side of the circuit layer close to the substrate, and the semiconductor layer, the first insulating layer, the second conductive layer, the second insulating layer, the third conductive layer, the third insulating layer, the fourth conductive layer, and the fourth insulating layer are stacked in sequence in a direction away from the substrate; Preferably, the thin film transistor further comprises a gate electrode formed in the second conductive layer, a source electrode formed in the fourth conductive layer and connected to the source region of the active layer, and a drain electrode formed in the fourth conductive layer and connected to the drain region of the active layer; The pixel driving circuit further includes a capacitor, wherein the capacitor includes a first electrode plate formed in the second conductive layer and a second electrode plate formed in the third conductive layer; Preferably, the display panel further comprises a fourth wire located in the connection area, wherein the fourth wire is connected in parallel with the first wire; Preferably, the fourth conducting wire is arranged in the fourth conductive layer.

7. The display panel according to claim 5, characterized in that: The circuit layer further includes a third conductive line located in the bending region, and the third conductive line is electrically connected to the first conductive line.

8. The display panel according to claim 5, characterized in that: The display panel further comprises a fourth conductive line located in the connection area, wherein the fourth conductive line is connected in parallel with the first conductive line; Preferably, the fourth conductive line is arranged in the circuit layer.

9. The display panel according to claim 1, characterized in that: The display panel further includes a fifth insulating layer located between the thin film transistor and the light emitting layer, and the display panel further includes: A pixel defining layer, located on a side of the fifth insulating layer away from the substrate, wherein the pixel defining layer is provided with a pixel opening, and at least a portion of the light emitting layer is located in the pixel opening; an encapsulation layer, located on a side of the light-emitting layer away from the substrate, wherein the orthographic projections of the fifth insulating layer and the light-emitting layer on the substrate are located within the orthographic projection of the encapsulation layer on the substrate; Preferably, the encapsulation layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are sequentially stacked in a direction away from the substrate, wherein the first inorganic layer extends beyond the fifth insulating layer, and the second inorganic layer extends beyond the first inorganic layer; Preferably, the width of the first inorganic layer extending outside the fifth insulating layer is greater than a first width threshold, wherein the first width threshold ranges from 60 micrometers to 80 micrometers; Preferably, the material of the fifth insulating layer includes organic material.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 9.