Liquid cooling device for packaging and cooling airborne high-heating electronic component

Abstract

A liquid cooling apparatus and system for immersion cooling of electronic devices, particularly including a server and other IT hardware nodes with an array of heat generating devices including microprocessors, RAMs, mainboards, etc. with different operating temperatures. The apparatus and system are suitable for separate liquid cooling of a plurality of heat-generating electronic components, with at least some of the components being spatially isolated from other electronic components for individual cooling by dielectric liquid. Multi-stage isolated heat transfer to the coolant fluid may improve energy efficiency and operational performance of the electronic device.

Description

Technical Field

[0001] The present concept relates to a liquid cooling system for effectively and efficiently cooling heat-generating electronic components, and particularly, but not exclusively, to a liquid cooling system for cooling IT components, servers, computing electronic devices, etc., by directly immersing these components and equipment in a dielectrically cooled liquid coolant. Background Art

[0002] Due to the continuous development of smaller, faster, higher density and higher power capacity electronic devices, cooling of electronic devices, especially IT components, servers, data storage devices and computing electronics with graphics and central processing units (GPUs and CPUs) has become a major technical challenge.

[0003] Computing devices generate heat during operation. With tens of thousands of these devices in a data center, the heat generated can be very high. As the demand for greater processing and data storage continues to expand, the density of server systems continues to increase, and the resulting heat dissipation becomes a significant practical obstacle.

[0004] Conventional fan-based cooling systems require large amounts of electricity. As a result, the power requirements to drive such systems increase significantly as server density increases. Immersion cooling of IT components is a relatively recent development. Operating hot electronic devices are directly immersed in a dielectric (electrically insulating) cooling liquid that is circulated and cooled through the use of a heat exchanger, for example. Cooling of electronic devices improves their performance efficiency, enabling higher processing speeds (e.g., overclocking of CPUs). Heat generated by the circuits is quickly and efficiently removed directly at the heat source by the dielectric liquid. However, there is an overall need to continue to improve the operating efficiency of existing liquid immersion cooling systems, both to improve the cooling efficiency of electronic components and to improve the thermal management and circulation of the cooling liquid to achieve efficient energy reuse. Summary of the invention

[0005] One object of the present disclosure is to provide an apparatus and method for accurate and efficient liquid cooling of electronic equipment. A specific object is to provide an electronic component liquid cooling system to enable IT components and the like to operate at high temperatures. Another specific object is to provide a refrigeration system to maximize the operating temperature of the dielectric liquid, which is due to heat transfer with the electronic components for subsequent energy reuse. Another specific object is to provide a system that allows the dielectric liquid to flow out at a uniform / constant temperature (after heat transfer with the electronic components). This configuration maximizes the efficiency and effectiveness of thermal energy transfer using a suitable heat exchanger or similar device to achieve thermal energy reuse.

[0006] The present system provides a liquid immersion / submersion arrangement in which IT electronic components are spatially separated / isolated based on their operating temperature and effective power consumption. Specifically, the present system is configured to cool the electronic components via direct contact and circulation with a refrigerant liquid to provide a single liquid refrigeration system for cooling each electronic component individually and / or independently of each other as needed based on the operating performance, type, operating temperature, size and / or configuration of the electronic component.

[0007] "Electronic components", "electronic devices", or similar components mentioned in this specification include heat-generating electronic components, such as those installed on larger IT components / equipment, such as servers, motherboards, data storage devices, programmable logic controller boards, etc. Such electronic components include, for example, circuits and / or electronic devices of motherboards or other printed circuit board devices, random access memory (RAM); graphics processing units (GPUs); central processing units (CPUs); chips, sockets; peripheral component interconnect standard (PCI) slots; read-only memory (ROM) components, chips and slots; graphics processing components, ports, slots, chips; bridges; battery components, ports and slots; power plugs, slots and ports, electronic connectors; electronic heat sinks; switches; jumpers; capacitors; transistors; diodes; components related to operating power; current and / or voltage regulators and modules; power converters, etc.

[0008] The present system is configured to deliver coolant liquid to heat generating electronic devices based on typical, normal, average, or maximum operating temperatures of the heat generating electronic devices according to a variety of different possible liquid flow circuit configurations. For example, the present system is compatible with series, parallel, and / or a combination of series and parallel liquid flow configurations based on the spatial positioning of the electronic components according to the typical, normal, average, and / or maximum operating temperatures of the electronic components. Thus, the present system provides an outflow liquid flow at a maximum outflow temperature and a constant / uniform temperature over time. The heated dielectric liquid can then be efficiently and effectively processed for thermal reuse via a heat exchanger or the like, wherein thermal energy is transferred from the dielectric liquid to an auxiliary application or device requiring a temporary or continuous supply of thermal energy.

[0009] The outflow of dielectric liquid heated to maximum and uniform operation (over time) provides an efficient and effective heat source for heat reuse technology. This is achieved by spatially separating / isolating the heat generating devices based on their respective operating temperatures. Specifically, at least one, and in particular a group of first heat generating electronic components can be separated and located in a first area or chamber of the device for initial contact with the dielectric liquid. At least one second element or a group of additional heat generating electronic components (having a higher operating temperature than the first electronic device) can be located in an isolated or separated area (or enclosure) of the system / device for separation and / or subsequent contact with the dielectric liquid. This arrangement allows the dielectric liquid to be retained to directly contact the first heat generating electronic component and then directly contact the second heat generating electronic component, so that the temperature of the dielectric liquid output in the outflow area of ​​the device is the sum of the temperature increases of the liquid that has been in contact with the electronic devices in all spatially isolated areas.

[0010] In one aspect, the system includes a package (or lid) that can be positioned to (at least partially) surround an electronic device (e.g., CPU / GPU). The package can be mounted above the chip (with or without a heat sink) or on top of the chip (e.g., cold plate technology). The coolant is then configured to flow through each package area to capture all heat generated by the electronic device. This arrangement enables the electronic device (CPU / GPU) to operate at its optimal or typical operating temperature, while also allowing the temperature of the outflow flow of cooling liquid to be high and remain uniform over time to improve energy reuse.

[0011] In one aspect, the system provides for isolating submerged heat generating devices according to their operating temperature ranges so that all submerged heat generating devices are in contact with different portions of a cooling fluid within a fluid container at a given time. The fluid within the container is driven to a cooling device where it is cooled in preparation for being driven into the container again, thereby effectively cooling the submerged heat generating devices in series. The fluid can be driven through the system in such a way that it first contacts the isolated heat generating devices having the lowest operating temperature. The partially heated fluid is then driven into contact with the next group of isolated heat generating devices having the second lowest operating temperature, where its temperature can be further increased. This process is repeated until a group of isolated heat generating devices having the highest operating temperature is in contact with the dielectric liquid, which is then driven to a cooling device (i.e., a heat exchanger).

[0012] According to a first aspect of the present concept, there is provided a liquid cooling device for an electronic device, comprising: a housing defining a chamber to at least partially accommodate at least one electronic device having at least one heat-generating electronic component; at least one cover at least partially located within the chamber and positionable above the heat-generating electronic component, the cover being configured with at least one inlet to allow a dielectric cooling liquid to enter an enclosure defined by the cover and to directly contact the heat-generating electronic component, and at least one outlet to allow the liquid to leave the enclosure; a cooling unit connected in fluid communication with at least one of the inlets and at least one of the outlets to receive the liquid from at least one of the outlets and to deliver the liquid to at least one of the inlets.

[0013] Preferably, the electronic device has: at least one first heat generating electronic component, which is at least partially contained in the chamber and is used to be immersed in the liquid in the chamber; and at least one second heat generating electronic component, which is at least partially contained in the enclosure and is used to be immersed in the liquid in the enclosure. Optionally, the second heat generating electronic component can reach or include a higher operating temperature than the first heat generating electronic component.

[0014] The first heat generating electronic components mentioned in this specification include relatively low heat generating devices / components (LHGA), such as RAM, motherboard, etc. Similarly, the second heat generating electronic components mentioned in this article include relatively high heat generating components (HHGD), such as microprocessors, CPUs, GPUs, etc. The first and second heat generating electronic components are distinguished in this article by their relative normal, typical, standard and / or maximum operating temperatures. This is the heat energy generated by such a device during use and / or the heat energy as described in detail in the electronic component data sheet, database, etc. Therefore, the low heat generating component / device generally includes a normal, typical, standard and / or maximum operating temperature lower than the high heat generating component / device. In certain specific implementations, the low heat generating component / device can be configured to generate less than 200W of heat under normal or typical operation. In addition, in certain specific implementations, the high heat generating component / device can be configured to generate more than 200W of heat under normal or typical operation. However, these values ​​are for reference only, and those skilled in the art will understand that the 200W value applied to LGHD and HHGD herein may vary depending on the type of electronic component.

[0015] Optionally, the device comprises at least one inlet arranged at the housing so that the liquid can enter the chamber, and / or at least one outlet arranged at the housing so that the liquid can leave the chamber. Optionally, the inlet of the cover is defined at least by the periphery of an opening, through which the cover can be positioned to receive and envelop the heat-generating electronic component at the enclosure. Optionally, the inlet and outlet of the cover are separated from each other and / or located in different areas of the cover. Optionally, the cover comprises an opening so that the cover can receive and envelop the heat-generating electronic component at the enclosure, and a top located opposite the opening. Optionally, the inlet or outlet of the cover may be located at the top of the cover. Optionally, the outlet of the cover is partially defined by the opening. Optionally, the inlet and / or outlet of the cover are partially defined by the periphery of the opening of the cover. Optionally, the inlet and / or outlet of the cover are partially defined by the gap or area between the outer periphery of the electronic component and the area within the periphery of the enclosure in close proximity. Such a gap region may be annular, such that liquid flows into and / or out of the enclosure via the space / gap between the electronic component and the wall or body of the cover.

[0016] Optionally, the device may include an actuator connected to the cover to actuate movement of the cover toward and away from the housing and / or the heat generating electronic component. The actuator may include an electronic actuator, a magnetic actuator, a pneumatic or hydraulic actuator, a combination of these actuators, and optionally an electromagnetic or electromechanical actuator controlled locally or remotely via a control unit.

[0017] Optionally, the cover is adjustably mounted at the device via an actuator, and the actuator is configured to change any one or a combination of the following through actuation: the internal volume of the enclosure; the position of the enclosure relative to the housing and / or the heat-generating electronic component; the spacing distance between the cover and the heat-generating electronic component; the extent to which the cover encloses or contains the heat-generating electronic component within the enclosure. Preferably, the cover is configured to move back and forth relative to the electronic component to adjust the spacing distance between the inner surface of the cover and the outer surface of the electronic component.

[0018] Optionally, the at least one outlet of the chamber is connected in fluid communication with the at least one inlet of the enclosure, so that the liquid is configured to flow through the chamber and then through the enclosure. The at least one outlet of the enclosure is connected in fluid communication with the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with the at least one inlet of the chamber.

[0019] Preferably, the chamber is connected in series with the enclosure fluid. According to the present concept, the device may include one or more chambers and one or more enclosures. Preferably, multiple enclosures can be positioned in series and / or in parallel with each other. Therefore, the liquid can be configured to flow through the chamber according to a first path, then flow through at least one enclosure via a second path in series, and then flow through another enclosure in series with the first enclosure. Each enclosure may include the same or different heat-generating electronic components with the same or different operating temperatures. When the enclosures are connected in parallel, the liquid supply can be divided / diverted into independent streams, flowing into each of the respective enclosures in parallel. The isolated parallel flow streams can then be merged into a single flow stream after flowing through the enclosure (along the fluid flow direction).

[0020] Preferably, the device further comprises a pump connected in fluid communication with the inlet and / or the outlet of the cover to drive the liquid to flow through the enclosure. The device comprises at least one electronically controllable valve arranged in fluid communication with the inlet and / or the outlet of the cover.

[0021] Preferably, the device includes a control unit for controlling the valve and the flow of the liquid into and out of the enclosure via the inlet and outlet. Optionally, the control unit is configured to control the flow of the liquid through the chamber for a first heat energy exchange with the first heat generating electronic element, and then control the flow of the liquid through the enclosure for a second heat energy exchange with the second heat generating electronic element, the second heat energy exchange being a supplement and addition to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the increase in temperature of the liquid that has passed through the chamber and the enclosure. The control unit may include one or more electronic control units, modules or devices, which may include a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, a server, a printed circuit board, a motherboard or other similar devices. The control unit may include a sensor, the sensor including at least one of a flow rate, temperature, proximity, motion, current, voltage, pH and / or a magnet sensor. The control unit may include at least one control valve, which may include a solenoid valve, a diaphragm valve, a multi-way valve controlled by a pilot valve, and combinations thereof. The control unit may be located locally or remotely of the system and device for local and / or remote control of the device. The control unit may operate via a cloud network, wireless or wired communication paths and associated elements.

[0022] Optionally, the device includes at least one weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the housing and / or the cover. Optionally, the device includes a first weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the cover. Optionally, the device may include a second weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the housing. The "weir arrangement" mentioned in the specification includes at least one hole, a partition wall, a flow restriction body, etc., which is configured to at least partially isolate the first volume of liquid from the second volume of liquid, so that the liquid is configured to flow from the first volume to the second volume via a restricted flow path at the weir arrangement. This arrangement includes an overflow or throughflow arrangement. Optionally, the weir arrangement can provide overflow or throughflow under the action of gravity.

[0023] Optionally, the device comprises a plurality of covers, each of the covers having a respective inlet and outlet connected in fluid communication with the cooling unit. Optionally, the covers are arranged or connected in series with each other as part of a liquid flow network including the cooling unit. Optionally, at least some of the covers are connected in parallel with each other as part of a liquid flow network including the cooling unit.

[0024] Optionally, the cooling unit comprises a heat exchanger to remove thermal energy from the liquid. Optionally, the heat exchanger comprises a refrigerant fluid, the refrigerant fluid being configured to circulate within a fluid circuit or network, the fluid circuit or network being isolated from the dielectric liquid, and the dielectric liquid network being configured to flow through the chamber and the enclosure. These exchangers allow the transfer of thermal energy between the dielectric liquid and the refrigerant fluid, and in particular allow the transfer of thermal energy from the dielectric liquid to the refrigerant working fluid. The dielectric cooling liquid may be a type of liquid suitable for immersion cooling of IT components, having suitable electrical insulating properties, providing safe direct contact with live electronic components, and importantly having no liquid electrical conductivity.

[0025] Optionally, the device includes at least one storage container in fluid communication with the chamber to supply and / or receive liquid in the chamber and maintain a predetermined volume of liquid in the chamber. Optionally, the device may include at least one main storage container in fluid communication with at least one of the inlet and outlet of the enclosure / lid to store liquid as part of the fluid flow network. Optionally, the main storage container includes a pressurizing mechanism to change the pressure of the liquid within the fluid flow network. Optionally, the pressurizing mechanism includes at least one electronically controllable valve to control the volume of liquid in the main storage container and / or the fluid flow network.

[0026] Optionally, the electronic device may include any one or a combination of the following: a computer entity; a server; a motherboard; a printed circuit board including a plurality of electronic components. Optionally, the heat-generating electronic component includes any one or a combination of the following: a motherboard; a random access memory (RAM); a graphics processing unit (GPU); a central processing unit (CPU).

[0027] Optionally, a dielectric cooling liquid is contained within the chamber and is capable of flowing through the enclosure. Optionally, at least a portion of the electronic device and / or at least a portion of the first heat generating electronic component is located within the chamber for direct contact with the liquid within the chamber, and at least a portion of the second heat generating electronic component is located within the enclosure for direct contact with the liquid within the enclosure.

[0028] Optionally, the electronic device and / or the first heat-generating electronic component is at least partially immersed in the liquid in the chamber, and the second heat-generating electronic component is at least partially immersed or completely immersed in the liquid in the enclosure.

[0029] Optionally, the device comprises at least one sensor. Optionally, the at least one sensor may include at least one of a flow rate, temperature, proximity, motion, current, voltage, pH and / or magnet sensor. Optionally, the device further comprises a temperature sensor to determine the temperature or temperature difference of the liquid and / or the heat generating electronic component within the enclosure. Optionally, the electronic device or the first and / or second heat generating electronic component comprises at least one temperature sensor to determine the temperature or temperature difference of the liquid and the first and / or second heat generating electronic component. Optionally, the temperature sensor may be in electronic communication with the control unit. Optionally, the electronic device of the first and / or second heat generating electronic component may comprise a temperature sensor to determine the temperature or temperature difference of the liquid and the first and / or second heat generating electronic component.

[0030] Optionally, the at least one outlet of the enclosure is connected in fluid communication with an inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with the at least one inlet of the chamber. Optionally, the chamber is connected in series in fluid communication with the enclosure. Optionally, the housing comprises a liquid immersion tank, and the cover is smaller in size than the housing and is located within the chamber.

[0031] Optionally, the housing is larger than the cover so that the chamber contains the enclosure. The housing may include a liquid immersion tank or trough, and the cover may include a cover, cover, container, pocket or sub-chamber to respectively accommodate different heat generating electronic components, which are spatially separated relative to the larger housing, thereby allowing separate / isolated liquid flows to contact different (groups of) electronic devices. Optionally, the cover may be exclusively and / or completely contained within the housing.

[0032] Optionally, the device includes a control unit, and the control unit is configured to control the liquid to flow through the chamber for a first heat energy exchange with the first heat-generating electronic component, and then control the liquid to flow through the enclosure for a second heat energy exchange with the second heat energy exchange with the second heat energy exchange, wherein the second heat energy exchange is a supplement and addition to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid that has passed through the chamber and the enclosure.

[0033] According to another aspect of the present concept, a method for cooling a heat-generating electronic component of an electronic device is provided, comprising: at least partially housing an electronic device having at least one heat-generating electronic component, the electronic device being located within a chamber defined by a housing; positioning a cover above the heat-generating electronic component to define an enclosure containing the heat-generating electronic component, the cover being provided with at least one liquid flow inlet and at least one liquid flow outlet; providing a flow of dielectric cooling liquid within the enclosure between the at least one inlet and the at least one outlet, the liquid being in direct contact with the heat-generating electronic component, thereby directly receiving thermal energy from the heat-generating electronic component; and using a cooling device to cool the liquid heated by the heat-generating electronic component, the cooling device forming part of a fluid flow network, the fluid flow network being fluidically connected to the at least one inlet and / or the at least one outlet.

[0034] Optionally, the method comprises providing a flow of liquid through the chamber via at least one liquid flow inlet and at least one liquid flow outlet at the enclosure, the electronic device being at least partially immersed in the liquid within the chamber.

[0035] Optionally, the electronic device includes at least one first heat-generating electronic component and at least one second heat-generating electronic component, wherein the second heat-generating electronic component is capable of reaching or having a higher operating temperature than the first heat-generating electronic component, wherein the second heat-generating electronic component is positioned to be in direct contact with the liquid within the enclosed area defined by the cover, and the first heat-generating electronic component is positioned to be in direct contact with the liquid within the chamber.

[0036] Optionally, the chamber is connected in series in fluid communication with the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

[0037] Optionally, the method may include controlling the flow of the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component and then through the enclosure for a second heat energy exchange with the second heat generating electronic component, the second heat energy exchange being supplemental and additional to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid having passed through the chamber and then through the enclosure.

[0038] Optionally, the liquid is configured to flow from the outlet of the chamber to the inlet of the enclosure via a return flow conduit, and then the liquid is configured to flow from the at least one outlet of the enclosure to a fluid flow network including the cooling unit. Optionally, the flow of liquid within the enclosure is supplied from the liquid within the chamber via the inlet of the cover. Optionally, the flow of liquid within the enclosure is supplied from the fluid flow network via the inlet of the cover.

[0039] Optionally, the method includes providing a serial flow of the liquid through a plurality of enclosures defined by respective covers, each of the covers enclosing a respective heat generating electronic component of the electronic device; wherein the respective heat generating electronic components comprise substantially the same operating temperature or comprise different operating temperatures arranged in a sequence of increasing operating temperatures within the respective covers, such that the liquid is configured to flow through the respective covers, the respective covers contacting the respective heat generating electronic components in series from a relatively low to a high operating temperature.

[0040] Optionally, the method comprises providing parallel flows of the liquid through a plurality of enclosures defined by respective covers, each of the covers enclosing a respective heat generating electronic component disposed at the electronic device.

[0041] According to another aspect of the present concept, there is provided a liquid immersion cooling tank for cooling an electronic device having at least one heat generating electronic component, the tank comprising an apparatus as described and claimed herein; and an electronic device having at least one heat generating electronic component immersed in the dielectric cooling liquid contained within the housing.

[0042] Optionally, the liquid immersion cooling tank comprises a plurality of electronic devices, each of the electronic devices having at least one heat generating electronic component, the devices and the heat generating electronic components being at least partially immersed in the liquid contained within the chamber and respective enclosures.

[0043] Optionally, the liquid immersion cooling tank may include at least one shell defining the chamber to accommodate the electronic device; and a plurality of covers positioned within the chamber to define respective enclosures to at least partially accommodate the respective heat-generating electronic components of the device; wherein the device is immersed in the liquid contained within the chamber, and the heat-generating electronic components are immersed in the liquid contained within the respective enclosures.

[0044] According to another aspect of the present concept, there is provided an electronic device rack for storing electronic devices, each electronic device having a heat generating electronic component, the rack comprising an apparatus as described and claimed herein; and an electronic device having at least one heat generating electronic component and mounted on the rack at least partially via the housing; the heat generating electronic component being at least partially immersed in the dielectric cooling liquid within the enclosure defined by the cover.

[0045] Optionally, the rack includes a plurality of electronic devices, each of which has at least one heat-generating electronic component. Optionally, the rack includes: a plurality of housings defining respective chambers to accommodate the respective electronic devices; and a plurality of covers defining enclosures and respectively located in the chambers to respectively accommodate the at least one heat-generating electronic component; wherein the plurality of electronic devices are immersed in the liquid contained in the respective chambers, and the at least one heat-generating electronic component is immersed in the liquid contained in the respective enclosures.

[0046] BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Specific implementations of the present invention will now be described by way of example only and with reference to the accompanying drawings, in which:

[0048] Figure 1 is a perspective view of an immersion cooling tank for accommodating a plurality of IT hardware nodes, each of which has a microprocessor array, according to a specific implementation of the present concept;

[0049] Figure 2 Another implementation of the present concept is to install in a vertical arrangement Figure 1 A perspective view of the rack of multiple IT hardware nodes in the system;

[0050] Figure 3 is a schematic diagram of a precision isolated cooling device for cooling respective first and second heat generating electronic components mounted on an IT hardware node;

[0051] Figure 4 is a schematic diagram of selected elements of a precision isolation cooling system having a circulating fluid network for circulating a cooling liquid in direct contact with a plurality of heat generating electronic components;

[0052] Figure 5 is a schematic diagram of selected elements of a precision isolation cooling system configured to deliver cooling liquid to a low heat generating device and a plurality of high heat generating devices mounted on an IT hardware node;

[0053] Figure 6 is another schematic diagram of selected elements of a precision isolation cooling system configured to deliver cooling liquid in series to Figure 5 IT hardware nodes and heat-generating equipment;

[0054] Figure 7 is a schematic diagram of a plurality of adjustably mounted covers configured to receive cooling liquid to cool a plurality of heat generating devices of an IT hardware node;

[0055] Figure 8 is a schematic diagram of an enclosure enclosing a high heat generating device, the enclosure having a control valve at an entrance to the enclosure to regulate the flow of cooling liquid;

[0056] Fig. 9 yes Figure 8 A schematic diagram of an enclosure and a heat generating device, wherein the enclosure is moved to a lowered position to reduce the internal volume within the enclosure;

[0057] Fig.10 yes Figure 8 Another schematic diagram of an arrangement in which the enclosure is elevated to increase the interior volume of the enclosure;

[0058] Fig.11 is a perspective view of a tray housing an IT hardware node having a plurality of microprocessors, the tray being provided with an internal dividing weir wall for controlled circulation of a cooling liquid;

[0059] Fig.12a is a cross-sectional side view of a first arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0060] Figure 12b is a cross-sectional side view of a second arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0061] Fig.12c is a cross-sectional side view of a third arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0062] Fig.13 is a schematic diagram of an immersion cooling system according to a specific implementation of the present concepts, the system having IT hardware nodes immersed in cooling liquid contained in an immersion cooling tank and connected to a circulating cooling liquid network and manifold;

[0063] Fig.14is a schematic diagram of a cooling liquid circulation system according to a specific implementation of the present concept, the system being used to separate and circulate cooling liquid at each heat generating device installed at an IT hardware node;

[0064] Fig.15 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0065] Fig.16 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0066] Fig.17 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0067] Fig.18 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0068] Fig.19 It is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, which is used to separately transport and circulate cooling liquid at respective heat generating devices installed at IT hardware nodes. DETAILED DESCRIPTION

[0069] The present compartmentalized cooling fluid system attempts to maximize energy efficiency within a circulating cooling fluid network by isolating / compartmentalizing the delivery of working fluid to a series of onboard heat generating devices (typically microprocessors) having different maximum or typical operating temperatures. Specifically, the present system provides a multi-stage series cooling liquid circulation network, in which a dielectric cooling liquid can be delivered via an initial flow path in direct contact with at least one heat generating device having a relatively low maximum operating temperature, and then flows via a second flow path in direct contact with at least one or more heat generating devices (roughly located at the same location as the low heat generating device), so that thermal energy is transferred from the low heat generating device to the high heat generating device, as a multi-stage heat transfer process occurs in series. This construction maximizes the temperature change of the circulating cooling liquid. The present system can be implemented in an immersion cooling tank or a more conventional IT hardware node rack.

[0070] Reference Figure 1The immersion cooling tank 10 includes an inner cavity 12 for accommodating a plurality of IT hardware nodes 11 (such as servers, etc.), each of which has an array of different heat generating devices (HGDs) in the form of onboard electronic components, which may generally include relatively low heat generating components (e.g., RAM, motherboard, etc.) and relatively high heat generating devices (e.g., microprocessors), which themselves may have different maximum operating temperatures. Figure 2 An alternative arrangement for mounting IT hardware nodes 11 is shown in the form of a support rack 13, wherein the IT hardware nodes 11 are mounted within a generally upright frame 70. A plurality of horizontal rails 71 allow for mounting of respective trays 14, each tray being configured to accommodate at least one IT hardware node 11, so as to provide an array of nodes 11 mounted on the rack 13 vertically relative to each other.

[0071] Reference Figure 3 The system includes a housing 15 defining an inner cavity 28 containing a dielectric cooling liquid 18. The housing 15 is sized to accommodate an IT hardware node, and in particular, electronic devices such as a motherboard 16, which in turn has a plurality of electronic components mounted thereon, specifically, a plurality of low heat generating devices 17 (LHGD) and a plurality of high heat generating devices 19 (HHGD). For ease of illustration, Figure 3A single LHGD 17 and HHGD 19 are shown, along with a single cover 20 for each. However, it will be appreciated that the device includes a plurality of such elements. A plurality of second housings (or covers) 20 are located above and around each respective HHGD 19. A conduit 21 provides fluid communication between the outlet port 23 of the housing 15 and the respective enclosure 27 defined by each cover 20. Each cover 20 includes an opening 37 having a cross-sectional area greater than the size / cross-sectional area of ​​each HHGD 19. Thus, at least a portion of each HHGD 19 can be accommodated or disposed within each enclosure 27, each enclosure 27 being defined by each cover 20 located above and around each HHGD 19. Each opening 37 is correspondingly located in an area surrounding each HHGD 19, in contact or near contact with the motherboard 16. The housing 15 also includes an inlet 22 located at a respective opposite end relative to the outlet 23. Inlet manifold 24 is connected in fluid communication between inlet 22 and heat exchanger 26, which has respective outlet 26a and inlet 26b. Respective return manifolds 25 provide fluid communication between housing outlet 23 and heat exchanger inlet 26b. Thus, the dielectric cooling liquid is configured to circulate through chamber 28 and directly contact LHGD 17 and HHGD 19 (via inlet 22 and outlet 23), heat exchanger 26, and manifolds 25 and 24. Heat exchanger 26 includes an internal heating coil with a respective working fluid or other similar arrangement configured to transfer energy from the dielectric cooling liquid received at inlet 26b so that the temperature of the liquid output at outlet 26a is lower than the temperature of the incoming liquid (through inlet 26b).

[0072] According to the series split immersion cooling of the respective LHGD 17 and HHGD 19, the temperature difference of the liquid at the outlet 23 and the inlet 22 is maximized, thereby maximizing the energy efficiency of the present arrangement. Figure 3 In the arrangement of FIG. 2 , cooling liquid enters chamber 28 via inlet 22, and the liquid then contacts LHGD 17 for a first energy exchange, thereby slightly increasing the temperature of the dielectric liquid. Due to the suction force, the partially warmed liquid is drawn into enclosure 27 via each opening 37. The liquid contained in each cover 20 undergoes a second level of energy exchange with HHGD 19, which operates at a much higher temperature relative to LHGD 17. Therefore, the already warmed liquid is further heated to its maximum operating temperature. The fluid is then output from enclosure 27 (and chamber 28) and delivered to heat exchanger 26 via outlet 23 and return manifold 25. Once cooled in heat exchanger 26, the dielectric liquid is recirculated to inlet 22 via inlet manifold 24, and the cycle is repeated.

[0073] According to various embodiments described herein, the device and system include a control unit, sensors, and electronically controllable fluid flow valves to control and regulate the flow rate of the dielectric liquid flowing through each area of ​​the device and maximize energy efficiency, in particular, maximize the required heat energy exchange with the LHGD 17 and HHGD 19. The control unit may include a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, and / or a motherboard, etc. The sensor may include a flow rate, temperature, proximity, motion, current, voltage, pH, and / or magnetic sensor. The control valve may include a solenoid valve, a diaphragm valve, or other solenoid valve, for example, including direct actuation, pilot valve control, two-way, three-way, four-way valves, and combinations thereof. The system and device may be locally and / or remotely controlled via a cloud network, and may be configured to monitor various operating characteristics of the system and device locally or remotely, including the operating performance of electronic components and / or dielectric cooling fluids.

[0074] Reference Figure 4 , the present device is configured to achieve maximum temperature variation of the dielectric cooling liquid (delivered in direct contact with the plurality of LHGDs 17 and HHGDs 19) in addition to supplying a constant temperature cooling liquid to the heat exchanger. This configuration maximizes the operating performance of the heat exchanger and the present system. Figure 4 In the embodiment of the present invention, the inlet manifold 24 provides fluid communication between the plurality of LHGDs 17 and the plurality of spaced-apart HHGDs 19 (all mounted on the IT hardware node). Each HHGD 19 is at least partially encapsulated by a respective cover 20 ( Figure 3 ). Specifically, the incoming cooling liquid is divided via the inlet conduit 24a so as to provide parallel liquid flow streams to each enclosure 27 housing each HHGD 19. The heated fluid is then output from each respective enclosure 27 via the conduit 21. The flow control valve 29 is electronically communicated with a control unit 33, which is also provided with appropriate sensors (not shown) to monitor at least one operating characteristic at each HHGD 19 and / or region of the enclosure 27, in particular including the flow rate, temperature and / or temperature change of the cooling liquid at each HHGD 19. The flow streams from the conduit 21 are then configured to converge via the outlet conduit 25a to provide a single flow stream to the return manifold 25. A temperature sensor 30 (electronically connected to the control unit 33) is provided at the manifold 25. The pump 31 drives the liquid through the circuit, in particular in direct contact with the LHGD 17 and the HHGD 19, and forward to the heat exchanger 26. Inlet manifold 24 provides return flow from heat exchanger 26 to LHGD 17 for a first stage of thermal energy exchange before flowing to HHGD 19 .

[0075] Reference Figure 5, describes a specific implementation of the flow paths at the LHGD 17 and HHGD 19. The cooling liquid 18 within the shell 15 is conveyed in direct contact with the LHGD 17 for a first stage of heat transfer. The partially heated liquid is then output via an outlet 61 at the shell 15. The partially heated fluid can then be returned to the inlet 22 via a return manifold. The liquid is then separated for further thermal energy exchange with the LHGD 17 while also being transferred to the cover 20 located above and around the respective HHGD 19 via conduits 38. The partially warmed liquid enters the enclosure 27 via respective inlets 34, flows in direct contact with respective HHGDs 19, and then exits the enclosure 27 via respective outlets 35. The dielectric liquid is thereby heated to its maximum operating temperature. The outlet conduits 39 provide fluid communication between each enclosure 27 (defined by the cover 20) and a single combined outlet conduit 21, which in turn is arranged to be in fluid communication with the heat exchanger 26. By Figure 5 In an implementation manner, the dielectric liquid is exclusively delivered to the enclosure 27 via respective conduits 38 .

[0076] Figure 6 Shows Figure 5 In this arrangement, the dielectric liquid 18 within the housing 15 undergoes a first stage of heat transfer with the LHGD 17. The partially warmed liquid is then drawn into each respective enclosure 27 via a respective inlet port 34, which is at least partially immersed in the liquid 18 (within chamber 28) in which the electronic device 16 is immersed. The liquid then undergoes a second stage of thermal energy exchange with the HHGD 19 before being output to the heat exchanger 26. Figure 6 The arrangement is configured to operate in series with respect to a first stage heat energy transfer with an initial LHGD 17 and a subsequent second stage heat energy transfer with the HHGD 19, which is carried out via the isolation / separation of the LHGD 17 from the HHGD 19 via the cover 20 and various cooling liquid flow paths.

[0077] Reference Figure 7 According to one implementation, each cover 20 includes an opening 37 to allow the HHGD 19 to be surrounded and at least partially contained within the inner enclosure 27. The dielectric cooling liquid 18 is pumped via a suction pump 31 ( Figure 4) flows into the enclosure 27 under suction to pass through and circulate in direct contact with the HHGD 19 within the partially separated enclosure 27 for heat energy transfer between the HHGD 19 and the liquid 18. In normal use, each HHGD 19 mounted on the main board 16 has different operating characteristics, particularly including processing requirements and heat energy output. The present system is adapted to adjust the supply of cooling liquid as required and through automatic or semi-automatic response operation, with the aim of delivering the working liquid heated to the maximum operating temperature and at a constant temperature to the heat exchanger. This flow control (as well as temperature regulation of the dielectric liquid 18) is achieved via a control unit 33 and an adjustably mounted cover 20. Specifically, each cover 20 can be mounted relative to the main board 16 so as to be able to move forward and backward (toward and away from) each respective HHGD 19, thereby changing the internal volume of each respective enclosure 27, as shown in reference Figures 8 to 10 Described in detail. Figure 8 , each enclosure 27, and in particular each cover 20, may include a control valve 40, which is electronically controlled via the control unit 33 to regulate the flow of liquid 18 to each enclosure 27 (and each HHGD 19). Typically, when installed on the electronic device 16, each device 19 includes a main processor, a thermal interface material, a heat sink, a second thermal interface material and a heat sink. It is advantageous to minimize such thermal connections, so according to the present apparatus and system, each HHGD 19 may include a microprocessor, a thermal interface material and a series of heat sinks 41 extending upward from the microprocessor / thermal interface material into the enclosure 27. When the microprocessor is operating at its maximum processing rate, and therefore at its maximum operating temperature, the valve 40 can be controlled to a fully open position to maximize the flow of liquid between the inlet conduit 38 and the outlet conduit 35.

[0078] Fig. 9 and 10 The arrangement can represent Figure 8 The invention can be an alternative configuration of the valve control arrangement of the embodiment, or can be a combination of these embodiments, and also includes a corresponding control valve 40 (optionally installed at the inlet conduit 38 and / or the outlet conduit 35) Fig. 9 and 10 ). Fig. 9 and 10 , an electronically controllable actuator 42 is connected to the cover 20, which in turn may be adjustably mounted on the device via another support or specifically via the actuator 42. Thus, each cover 20 is able to reciprocate to and from each HHGD 19. Fig. 9 The cover 20 is in its closest position relative to the HHGD 19. In this position, the dielectric liquid 18 is delivered and forced between the fins 41 to exchange maximum heat energy with the HHGD 19. Fig.10 The cover 20 is raised by the actuator 42 in the position of the fin 41. In this position, the liquid 18 is allowed to flow around the fins 41, but not necessarily between the fins 41, so as to reduce the exchange of heat energy with the HHGD 19 (which may be running at a lower process rate and therefore generating less heat). Each actuator 42 is connected to the control unit 33 (such as Figure 4 17 and HHGD 19) to provide local or remote control of the flow rate through the system and to be in direct contact with the HHGD 19 to directly respond to the operating status of each HHGD 19 (microprocessor), in particular their respective operating temperatures. This arrangement is advantageous for maximizing the thermal energy transferred from the LHGD 17 and HHGD 19 to the liquid 18 and also for regulating the liquid delivered to the heat exchanger 26 to a constant temperature.

[0079] This device can be realized as Figure 1 Immersion cooling tank or Figure 2 The support frame may include one or more liquid flow weir arrangements. The weir arrangement may be arranged at or toward the inlet of the chamber 28 and / or each enclosure 27, and / or at the respective outlets of the chamber 28 and / or each enclosure 27. Fig.11 The tray construction may be particularly suitable for Figure 2 An embodiment of a rack in which an electronic device 16 can be at least partially accommodated and located within the inner groove 14b, relative to the annular portion surrounding the outer groove 14a. The grooves 14a, 14b are separated by a plurality of dividing weir walls 46c extending upward from the base 43a. The outer groove 14a is also defined by a plurality of outer tray walls 43b extending upward from the base 43a. The height of the wall 43c is preferably slightly smaller than the outer wall 43b, so that when the liquid 18 is delivered to the outer groove 14a via the inlet 22, the liquid is configured to overflow from the outer groove 14a into the inner groove 14b via the weir arrangement (above the dividing wall 43c). The liquid 18 is then allowed to flow out of the tray 14 via the outlet 23.

[0080] Fig.12a , b and c show different configurations of the weir arrangement for controlling the flow of liquid into the inner tank 14b. Fig.12a Shows Fig.11 An arrangement in which liquid 18a in outer tank 14a is transferred to liquid 18b in inner tank 14b via weir arrangement 44. Figure 12b In the embodiment, each partition wall 45 separating the outer tank 14a from the inner tank 14b includes at least one port 45a to allow the liquid 18a to flow directly from the outer tank 14a to the inner tank 14b (liquid 18b), and also allows the liquid 18a to flow through the partition wall 45. Fig.12c4. A siphon effect weir arrangement is shown in FIG. 4. In this embodiment, a siphon flange 46 extends around the upper end of the partition wall 46c so as to define a weir flow path between the respective outer and inner grooves 14a, 14b, thereby providing a flow path based on suction siphoning. Each tray 14 (each tray containing an electronic device 16 with respective devices 17 and 19) can then be detachably stored on the rack 13 via a track 71 that engages with a corresponding slide (not shown) disposed transversely on each respective tray 14.

[0081] Fig.13 Another embodiment of the present cooling device implemented as part of a liquid immersion cooling tank arrangement is shown. Chamber 28 corresponds to tank 10 ( Figure 1 ) of the main chamber 12, which supports a plurality of electronic devices arranged side by side and suspended / immersed in a cooling liquid 18. As shown, the electronic device 16 may have a plurality of groups of HHGDs 19, which may be arranged and distinguished by their respective operating temperatures, particularly their respective maximum operating temperatures. Specifically, the first group 19a is located toward the inlet 48, and the second group 19b is located downstream in the flow direction of the first group 19a, away from the inlet 48. The first group 19a is configured to be in fluid communication with the second group 19b via respective ports 36, and the first group 19a is configured to be in fluid communication with the inlet 48 via ports 34. Each HHGD 19 in the first 19a and the second group 19b is separated from the main chamber 28 via respective covers 20, and each cover may be optionally connected via Figures 8 to 10 The housing 15 is configured for inflow of cooling liquid via the inlet 22, according to Fig.13The arrangement of the inlet 22 is provided with a plenum 47 to evenly distribute / distribute the incoming liquid flow within the chamber 28. The housing 15 is provided with at least one respective weir arrangement 44 located at the upper end of the tank 10. Therefore, the cooling liquid is configured to overflow into at least one temporary storage container 49 as a liquid holding volume 50. The gravity return manifold 25 provides fluid communication with the holding volume 50 and the inlet 48. The device also includes an outlet flow conduit network 52, which provides fluid communication from the HHGD group 19a, 19b to the heat exchanger 26 via an intermediate control valve 51. The heat exchanger 26 may include the pump 31 as an integral element, or the device may include other pumps at different locations within the liquid flow network. The heat exchanger 26 includes an internal heat transfer coil 54 connected to a working fluid network 72, which is configured to receive thermal energy from the dielectric cooling liquid 18. The heated working fluid (within the network 72) can then be delivered (as a heat source) to supplementary or auxiliary elements 53 within a data center or the like, in which the present system can be implemented. In operation, the dielectric liquid is initially introduced into the chamber 28 via the inlet 22 and the plenum 47 so as to flow upward against gravity toward the weir 44 (within the chamber 28). In this path, the liquid 18 flows in direct contact with the LHGD 17, so that the liquid overflowing into the holding volume 50 is at least partially heated / warmed. The warmed liquid is then returned to the inlet 48 via the manifold 25, where it is delivered directly to the first group 19a of HHGDs 19 for a second stage of heat transfer. The flow to each HHGD 19 within the first group 19a occurs in parallel. The flow then continues and flows in series from the first group 19a to the second group 19b. Likewise, the flow at each HHGD 19 within the second group 19b occurs in parallel. Thus, the present system is configured to provide serial delivery of dielectric liquid 18 according to a three-stage heat transfer process, including a first stage of delivery using LHGD 17, a second stage of delivery using a first set of HHGDs 19a, and a third stage of delivery using a second set of HHGDs 19b. The liquid is then supplied to heat exchanger 26 via pump 31 and (via control valve 51) and then recirculated to chamber 28 via return manifold 24.

[0082] The packaging of each HHGD 19 and the corresponding separation relative to the other HHGDs 19 and LHGDs 17 increases the temperature difference of the dielectric liquid initially delivered to the tank 10 (at the inlet 22) relative to the heating liquid delivered to the heat exchanger device 26. In addition, via the control unit 33 ( Figure 4), various sensors 30, control valves 40 and / or actuators 42, the system is adapted to maximize energy efficiency via automatic or semi-automatic dynamic response to the operating state of each HHGD 19, i.e., operating between minimum and maximum operating temperatures based on process rate. Single or various operating characteristics / states (i.e., temperature, power generation, process rate, etc.) of each LHGD and HHGD can be monitored and / or supplied and utilized by the system in real time to control the cooling liquid 18 (e.g., to adjust the liquid flow rate) in various different areas of the loop.

[0083] Figures 14 to 19 A further specific implementation of a circulating cooling liquid network forming part of the present apparatus and system is shown, the circulating cooling liquid network being implemented as an immersion cooling tank 10 ( Figure 1 ) or storage rack 13( Figure 2 ). Figures 14 to 19 The arrangement is configured for further operational control of fluid flow via other reservoirs and / or pressurized tanks at different areas of the system in which the dielectric cooling liquid can be temporarily stored and its temperature and / or pressure regulated as part of its circulation within the network.

[0084] Reference Fig.14 , the cooling liquid network includes an inlet manifold 24, a heat exchanger 26, a second return manifold 58, a gravity return manifold 25, a storage container 56 (containing a stored liquid volume 57), a pump 31, and an immersion tank or rack and tray arrangement (providing fluid communication between the manifolds 24 and 25). According to the specific implementation, a weir arrangement 44 is provided at the inlet end of the chamber 28 to regulate the flow of cooling liquid to the electronic equipment 16. The LHGD 17 is at least partially immersed in the cooling liquid for the first thermal energy transfer. The cooling liquid is then output to the second weir arrangement 44 via the outlet valve 61, which provides fluid communication with the gravity return manifold 25. The liquid is then transferred to the storage container 56 (buffer storage) and then returned to the heat exchanger 26 via the manifold 58, continuing to flow forward to the inlet manifold 24 in the form of cooling liquid. The liquid flowing into the inlet 22 is diverted via the connecting valve 74 and also flows into the respective enclosure 27 and directly contacts the HHGD 19. The combined flow from enclosure 27 then passes through conduit 21 between outlet flow valves 60 which in turn are in fluid communication with gravity return manifold 25 for combined flow with the liquid from valve 61 . Fig.14 The liquid in the circuit can be pressurized or can be realized at atmospheric pressure. The system includes a control unit 33 (not shown) and related sensors (not shown) as described herein to provide a real-time dynamic response liquid cooling system, thereby achieving the advantages described herein.

[0085] Fig.15 yes Fig.14 A simplified embodiment of the arrangement of generally includes substantially the same elements and functions, including manifolds 24, 55, 58; storage container 56; pump 31 and heat exchanger 26. Fig.15 In the embodiment of the present invention, the electronic device 16 is contained in a chamber 28 having an inlet 22 and an outlet 23, which are in direct fluid communication with respective manifolds 24, 55. The series flow on the LHGD 17 and HHGD 19 is as described in reference Figure 3 As described in the implementation method. Fig.16 Shown as Fig.15 Another embodiment of a variation of the embodiment of is realized by replacing the storage container 56 with a pressurized container 59 and providing an inlet weir arrangement 44 at the inlet 22 of the housing 15 . Fig.17 5, wherein a storage vessel 56 is also connected downstream of a return manifold 55, which in turn is connected to an outlet valve 61 of chamber 28 via an outlet weir arrangement 44. Outlet valve 61 is configured to receive warmed liquid partially heated by LHGD 17. Outlet valve 60 is configured to receive fully heated liquid from HHGD 19 for subsequent delivery to manifold 58 and transfer to heat exchanger 26. As shown, partially warmed liquid (from outlet valve 61) is transferred to each closed HHGD 19 via manifold 55, storage vessel 56 and pump 31 according to multiple stages of serial heat energy exchange (relative to primary heating by LHGD 17).

[0086] Fig.18 Shown with Fig.17 Another embodiment of a similar arrangement of a cooling liquid network is shown in FIG. 6 . A first stage heating outlet valve 61 is connected to a first return manifold 55a, which in turn is connected to a feed storage container 56. A second return manifold 55b is connected to a second stage outlet valve 60, the output of which is connected to a pump 31 for transfer to a manifold 58 and subsequently to a heat exchanger 26 for delivery to an inlet manifold 24. The storage container 56 is also connected upstream to the pump 31 so that the outlet cooling liquid flows from the valves 61, 60 are combined to flow into the return manifold 58 for heat transfer at the heat exchanger 26. Fig.19 Shows Fig.16 A further embodiment and variation of the arrangement has a weir arrangement 44 at the inlet 22 and further comprises a second weir arrangement 44 at the outlet 23 for forward delivery to a return manifold 25 which is arranged in fluid communication with a storage container 56. Fig.19 The embodiment also includes a pump 31, a manifold 58, a heat exchanger 26 and an inlet manifold 24, as shown in FIG. Fig.16 and are connected in fluid flow communication.

Claims

1. A liquid cooling device for electronic equipment, comprising: a housing defining a chamber to at least partially house at least one electronic device having at least one heat-generating electronic component; at least one cover at least partially located within the chamber and positionable over the heat generating electronic component, the cover configured with at least one inlet to allow a dielectric cooling liquid to enter an enclosure defined by the cover and come into direct contact with the heat generating electronic component, and at least one outlet to allow the liquid to exit the enclosure; A cooling unit is connected in fluid communication with at least one of the inlets and at least one of the outlets to receive the liquid from at least one of the outlets and to deliver the liquid to at least one of the inlets.

2. The device according to claim 1, comprising an electronic device having: at least one first heat generating electronic component at least partially contained within the chamber for immersion in the liquid within the chamber; and At least one second heat generating electronic component is at least partially contained within the enclosure for immersion in the liquid within the enclosure.

3. The device according to claim 2, wherein: The second heat generating electronic component is capable of reaching or including a higher operating temperature than the first heat generating electronic component.

4. A device according to any one of the preceding claims, comprising at least one inlet arranged at the housing to enable the liquid to enter the chamber, and / or at least one outlet arranged at the housing to enable the liquid to leave the chamber.

5. A device according to any one of the preceding claims, wherein: The access to the cover is defined by at least a perimeter of an opening through which the cover is positionable to receive and enclose a heat generating electronic component at the enclosure.

6. A device according to any one of the preceding claims, wherein: The inlet and outlet of the cover are separate from each other and / or are located in different areas of the cover.

7. The device according to any one of claims 1 to 4, wherein: The cover includes an opening to enable the cover to receive and wrap the heat-generating electronic component at the enclosure, and a top located opposite the opening.

8. The device according to claim 7, wherein: The inlet of the cover is located at the top of the cover.

9. The device according to claim 7 or 8, wherein: The outlet of the cover is defined in part by the opening.

10. An apparatus according to any preceding claim, further comprising an actuator connected to the cover to actuate movement of the cover towards and away from the housing and / or the heat generating electronic component.

11. The device according to any one of claims 1 to 9, wherein: The cover is adjustably mounted at the device via an actuator, the actuator being configured to change any one or a combination of the following upon actuation: the internal volume of the enclosed area; the position of the enclosure relative to the housing and / or the heat generating electronic component; · the spacing distance between the cover and the heat generating electronic component; • The extent to which the cover encapsulates or contains the heat generating electronic component within the enclosure.

12. The device according to any one of the preceding claims, wherein: The at least one outlet of the chamber is connected in fluid communication with the at least one inlet of the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

13. The device according to claim 12, wherein: The at least one outlet of the enclosure is connected in fluid communication with the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with the at least one inlet of the chamber.

14. The device according to claim 13, wherein: The chamber is connected in series in fluid communication with the enclosure.

15. Apparatus according to any preceding claim, further comprising a pump connected in fluid communication with the inlet and / or the outlet of the cover to drive the liquid through the enclosure.

16. Apparatus according to any preceding claim, comprising at least one electronically controllable valve arranged in fluid communication with the inlet and / or the outlet of the cover.

17. The apparatus of claim 16, further comprising a control unit for controlling the valve and the flow of the liquid into and out of the enclosure via the inlet and outlet.

18. The device according to claim 17, wherein: The control unit is configured to control the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component, and then control the liquid to flow through the enclosure for a second heat energy exchange with the second heat generating electronic component, wherein the second heat energy exchange is a supplement and addition to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid that has passed through the chamber and the enclosure.

19. Apparatus according to any preceding claim, further comprising a first weir arrangement provided in fluid communication with the inlet and / or the outlet of the cover.

20. Apparatus according to any preceding claim when dependent on claim 4, further comprising a second weir arrangement provided in fluid communication with the inlet and / or the outlet of the housing.

21. Apparatus according to any preceding claim, comprising a plurality of covers, each cover having a respective inlet and outlet connected in fluid communication with the cooling unit.

22. The device according to claim 21, wherein At least some of the covers are connected in series with each other as part of a liquid flow network including the cooling unit.

23. The device according to claim 21 or 22, wherein: At least some of the covers are connected in parallel with each other as part of a liquid flow network including the cooling unit.

24. A device according to any one of the preceding claims, wherein: The cooling unit includes a heat exchanger to remove thermal energy from the liquid.

25. The device according to any of the preceding claims, comprising at least one storage container connected in fluid communication with the chamber to supply and / or receive the liquid at the chamber and to maintain a predetermined volume of liquid at the chamber.

26. The device according to any one of the preceding claims, comprising at least one primary storage container connected in fluid communication with at least one of the inlet and the outlet of the cover to store the liquid as part of a fluid flow network.

27. The device according to claim 26, wherein: The primary storage container includes a pressurizing mechanism to change the pressure of the liquid within the fluid flow network.

28. The device according to claim 27, wherein The pressurizing mechanism includes at least one electronically controllable valve to control the volume of liquid within the primary storage container and / or the fluid flow network.

29. The device according to any one of the preceding claims, wherein: The electronic device includes any one or a combination of the following: Computer entity; ·server; Motherboard; A printed circuit board including multiple electronic components.

30. The device according to any one of the preceding claims, wherein: The heat generating electronic component includes any one or a combination of the following: Motherboard; Random access memory (RAM); Graphics processing unit (GPU); Central Processing Unit (CPU).

31. Apparatus according to any preceding claim, comprising a dielectric cooling liquid contained within the chamber and capable of flowing through the enclosure.

32. Apparatus according to claim 31, when dependent on claim 2, wherein: At least a portion of the electronic device and / or at least a portion of the first heat-generating electronic component is located in the chamber for direct contact with the liquid in the chamber, and at least a portion of the second heat-generating electronic component is located in the enclosure for direct contact with the liquid in the enclosure.

33. The device according to claim 32, wherein: The electronic device and / or the first heat generating electronic component is at least partially immersed in the liquid within the chamber, and the second heat generating electronic component is at least partially immersed or completely immersed in the liquid within the enclosure.

34. The apparatus of any one of claims 31 to 33, further comprising a temperature sensor to determine the temperature or temperature difference of the liquid and / or the heat generating electronic component within the enclosure.

35. Apparatus according to any one of claims 31 to 33, when dependent on claim 2, wherein: The electronic device and / or the first and / or second heat generating electronic component comprises a temperature sensor to determine the temperature or the temperature difference between the liquid and the first and / or second heat generating electronic component.

36. Apparatus according to any preceding claim, when dependent on claim 4, wherein: The at least one outlet of the enclosure is connected in fluid communication with the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with the at least one inlet of the chamber.

37. The device according to claim 4, wherein: The chamber is connected in series in fluid communication with the enclosure.

38. Apparatus according to any preceding claim, when dependent on claim 17, wherein: The control unit is configured to control the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component, and then control the liquid to flow through the enclosure for a second heat energy exchange with the second heat generating electronic component, wherein the second heat energy exchange is a supplement and addition to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid that has passed through the chamber and the enclosure.

39. The device according to any one of the preceding claims, wherein: The housing includes a liquid immersion tank, and the cover is smaller in size than the housing and is located within the chamber.

40. A method for cooling a heat-generating electronic component of an electronic device, comprising: at least partially housing an electronic device having at least one heat generating electronic component, the electronic device being located within a chamber defined by the housing; positioning a cover over the heat generating electronic component to define an enclosure containing the heat generating electronic component, the cover being provided with at least one liquid flow inlet and at least one liquid flow outlet; providing a flow of dielectric cooling liquid within the enclosure between the at least one inlet and the at least one outlet, the liquid being in direct contact with the heat generating electronic component to directly receive thermal energy from the heat generating electronic component; and The liquid heated by the heat generating electronic component is cooled using a cooling device, the cooling device forming part of a fluid flow network connected in fluid communication with the at least one inlet and / or the at least one outlet.

41. The method of claim 40, comprising providing a flow of liquid through the chamber via at least one liquid flow inlet and at least one liquid flow outlet at the enclosure, the electronic device being at least partially immersed in the liquid within the chamber.

42. The method according to claim 40 or 41, wherein: The electronic device includes at least one first heat-generating electronic component and at least one second heat-generating electronic component, wherein the second heat-generating electronic component is capable of reaching or having a higher operating temperature than the first heat-generating electronic component, wherein the second heat-generating electronic component is positioned to be in direct contact with the liquid within the enclosed area defined by the cover, and the first heat-generating electronic component is positioned to be in direct contact with the liquid within the chamber.

43. A method according to any one of claims 40 to 42, wherein: The chamber is connected in series in fluid communication with the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

44. The method of claim 43, comprising controlling the flow of the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component and then through the enclosure for a second heat energy exchange with the second heat generating electronic component, the second heat energy exchange being supplemental and additional to the first heat energy exchange, such that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid having passed through the chamber and then through the enclosure.

45. The method according to any one of claims 40 to 44, wherein: The liquid is configured to flow from the outlet of the chamber to the inlet of the enclosure via a return flow conduit, and then the liquid is configured to flow from the at least one outlet of the enclosure to a fluid flow network including the cooling unit.

46. ​​The method according to any one of claims 40 to 45, wherein: The flow of liquid within the enclosure is supplied from the liquid within the chamber via the inlet of the cover.

47. The method according to any one of claims 40 to 46, wherein: The liquid flow within the enclosure is supplied from the fluid flow network via the inlet of the cover.

48. A method according to any one of claims 40 to 47, comprising: providing a serial flow of the liquid through a plurality of enclosures defined by respective covers, each of the covers enclosing a respective heat generating electronic component disposed at the electronic device; Wherein, the respective heat-generating electronic components comprise substantially the same operating temperature or comprise different operating temperatures arranged in a sequence of increasing operating temperatures within respective covers, such that the liquid is configured to flow through the respective covers, and the respective covers are in contact with the respective heat-generating electronic components in series from relatively low to high operating temperatures.

49. A method according to any one of claims 40 to 47, comprising providing parallel flows of the liquid, the liquid flowing through a plurality of enclosures defined by respective covers, each of the covers enclosing a respective heat generating electronic component provided at the electronic device.

50. A liquid immersion cooling tank for cooling an electronic device having at least one heat generating electronic component, the tank comprising an apparatus as claimed in any one of claims 1 to 38; and An electronic device has at least one heat-generating electronic component immersed in the dielectric cooling liquid contained within the housing.

51. The liquid immersion cooling tank of claim 50, comprising a plurality of electronic devices, each of said electronic devices having at least one heat generating electronic component, said devices and said heat generating electronic components being respectively at least partially immersed in said liquid contained within said chamber and respective enclosures.

52. The liquid immersion cooling tank of claim 51 , comprising: at least one housing defining said chamber to house said electronic device; and a plurality of covers positioned within the chamber and defining respective enclosures to at least partially contain the respective heat generating electronic components of the device; wherein the device is immersed in the liquid contained within the chamber and the heat generating electronic components are immersed in the liquid contained within the respective enclosures.

53. An electronic equipment rack for storing electronic equipment, each of the electronic equipment having a heat generating electronic component, the rack comprising an apparatus as claimed in any one of claims 1 to 38; and an electronic device having at least one heat generating electronic component and mounted on the rack at least in part via the housing; The heat generating electronic component is at least partially immersed in the dielectric cooling liquid within the enclosure defined by the cover.

54. The electronic equipment rack of claim 53, comprising a plurality of electronic equipment, each of the electronic equipment having at least one heat generating electronic component.

55. The electronic equipment rack of claim 54, comprising: a plurality of housings defining said respective chambers to house said respective electronic devices; and a plurality of covers defining an enclosed area and being respectively located in the chamber to respectively accommodate the at least one heat-generating electronic component; wherein the plurality of electronic devices are immersed in the liquid contained within the respective chambers, and the at least one heat-generating electronic component is immersed in the liquid contained within the respective enclosures.

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